JP2016134452A - Mounting structure of electronic component and mounting method thereof, and optical communication module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To more stably mount an electronic component on a substrate by an adhesive member.SOLUTION: A surface emitting laser 21 is fixed on each through hole 20c of a first face 20a by an adhesive BD supplied to a first face 20a side via each through hole 20c from a second face 20b side. Thus, the supply amount of the adhesive BD supplied to the first face 20a can be easily controlled to a minute amount of minimum requirements, so that the surface emitting laser 21 can be mounted stably on a substrate 20 by the adhesive BD.SELECTED DRAWING: Figure 4

Description

  The present invention relates to an electronic component mounting structure in which an electronic component is mounted on a substrate with an adhesive member.

  Conventionally, in order to mount an electronic component such as an integrated circuit on a substrate, a predetermined amount of an adhesive member (solder, silver epoxy adhesive, etc.) is provided on the substrate, thereby fixing the electronic component to the substrate. Things have been done. For example, in Patent Document 1, in order to electrically connect an output terminal land on a circuit board and an input terminal land on a flexible wiring board, solder provided between them is heated from the opposite side of the flexible board. And melted. Thereby, the output terminal land and the input terminal land are electrically connected. The surplus solder provided between the circuit board and the flexible wiring board flows into a through hole formed in the output terminal land.

Japanese Patent Laying-Open No. 2003-086913 (FIG. 15)

  However, in the technique described in Patent Document 1 described above, when the amount of solder provided between the circuit board and the flexible wiring board varies and increases, the excess amount of solder is increased. There is a risk that it cannot be absorbed by the through hole. Therefore, the problem that the melted solder drips from the back surface of the circuit board may occur. Therefore, it may be possible to temporarily close the back side of the through-hole, but in this case, the excess solder between the circuit board and the flexible wiring board loses its place, so the output terminal land and the input For example, the terminal lands may be connected to each other at an inclination, which may cause a problem that stable electrical connection becomes difficult.

  An object of the present invention is to provide a mounting structure of an electronic component, a mounting method thereof, and an optical communication module that can stably mount the electronic component on a substrate with an adhesive member.

  The electronic component mounting structure according to the present invention is an electronic component mounting structure in which the electronic component is mounted on a substrate by an adhesive member, and the substrate includes a first surface on which the electronic component is fixed, and the first surface. A second surface provided on the opposite side of the surface, and a through hole provided between the first surface and the second surface, and the electronic component includes the through hole from the second surface side. The adhesive member supplied to the first surface side is fixed on the through hole of the first surface.

  In another aspect of the present invention, the through-hole formed in the substrate is provided within a projection range of the electronic component along the extending direction of the through-hole, and the adhesive member attaches the electronic component to the first It does not protrude from the projection range of the electronic component under a state of being fixed to one surface.

  In another aspect of the invention, the electronic component is provided with at least two through holes corresponding thereto.

  In another aspect of the invention, the first surface has a recess that communicates with the first surface side of the through hole and extends in the extending direction of the first surface.

  The electronic component mounting method according to the present invention is an electronic component mounting method for mounting an electronic component on a substrate with an adhesive member, the substrate including a first surface on which the electronic component is fixed, and the first surface. And a through hole provided between the first surface and the second surface, and the first surface from the second surface side through the through hole. An adhesive member supplying step for supplying the adhesive member to the side; and an electronic component fixing for fixing the electronic component to the first surface by the adhesive member with the electronic component facing the first surface side of the through hole A process.

  The optical communication module according to the present invention is an optical communication module including a substrate on which an electronic component that transmits and receives an optical signal is mounted by an adhesive member, and the substrate includes a first surface on which the electronic component is fixed, A second surface provided on the opposite side of the first surface; and a through hole provided between the first surface and the second surface, wherein the electronic component is The adhesive member supplied to the first surface side through the through hole is fixed on the through hole on the first surface.

  According to the present invention, the electronic component is fixed on the through hole on the first surface by the adhesive member supplied from the second surface side to the first surface side through the through hole. This makes it easy to control the supply amount of the adhesive member to the minimum necessary amount, so that the electronic component can be stably mounted on the substrate by the adhesive member.

1 is a perspective view of an optical transceiver to which the present invention is applied. It is a perspective view which shows the board | substrate in the housing | casing of the optical transceiver of FIG. It is the elements on larger scale which show the surface emitting laser mounted in the board | substrate of FIG. FIG. 4 is a cross-sectional view across a through hole as viewed from the direction of arrow A in FIG. 3. It is a perspective view which shows an adhesive member supply apparatus. (A), (b) is explanatory drawing explaining the mounting procedure to the board | substrate of a surface emitting laser. It is a perspective view of the comparative example which shows the case where a surface emitting laser is inclined and mounted on the board | substrate. It is explanatory drawing explaining the mounting procedure to the board | substrate of the surface emitting laser which concerns on Embodiment 2. FIG. (A), (b) is explanatory drawing explaining the relationship between the surface emitting laser which concerns on Embodiment 3 and Embodiment 4, and a through hole.

  Hereinafter, Embodiment 1 of the present invention will be described in detail with reference to the drawings.

  1 is a perspective view of an optical transceiver to which the present invention is applied, FIG. 2 is a perspective view showing a substrate in the housing of the optical transceiver of FIG. 1, and FIG. 3 is a surface emitting laser mounted on the substrate of FIG. 4 is a partially enlarged view showing FIG. 4, FIG. 4 is a cross-sectional view crossing the through-hole viewed from the direction of arrow A in FIG. 3, and FIG. 5 is a perspective view showing the adhesive member supplying device.

  As shown in FIG. 1, an optical transceiver 10 as an optical communication module takes the form of a so-called AOC (Active Optical Cable) in which an optical fiber cable CA is integrated. On the other end side of the optical fiber cable CA to which the optical transceiver 10 is connected to one end side, another optical transceiver (not shown) having the same shape as the optical transceiver 10 is integrally provided. Thereby, between a pair of information processing devices (not shown), for example, it is possible to cope with an increase in data transfer rate of 25 Gbps.

  As shown in FIG. 1, the optical transceiver 10 includes a housing 13 including an upper case 11 and a lower case 12, and the housing 13 is formed in a substantially rectangular parallelepiped shape. One end of the optical fiber cable CA is connected to one end in the longitudinal direction of the casing 13, and a card edge 14 is provided at the other end in the longitudinal direction of the casing 13. In addition, a pull tab 15 that is pulled by a user is integrally provided at one end in the longitudinal direction of the housing 13, and the pull tab 15 is formed of a plastic material having flexibility. On the side opposite to the housing 13 side of the pull tab 15, a ring portion 15 a into which a finger or the like can be inserted is integrally provided, so that the user is inserted into a slot (not shown) of the information processing apparatus. The optical transceiver 10 can be easily removed.

  Here, the optical transceiver 10 converts an electrical signal input from the information processing apparatus to which the optical transceiver 10 is connected into an optical signal, and outputs the optical signal to the optical fiber cable CA. On the other hand, in another optical transceiver on the other end side of the optical fiber cable CA, the optical signal input from the optical fiber cable CA is converted into an electrical signal and output to another information processing apparatus. And inside the housing | casing 13, the board | substrate 20 with which the photoelectric conversion part which consists of several electronic components for implement | achieving the above photoelectric conversion was mounted is accommodated.

  As shown in FIG. 2, the substrate 20 is a rigid substrate formed in a substantially rectangular shape in plan view, and a card edge 14 is integrally provided at one end in the longitudinal direction (front side in the figure) of the substrate 20. ing. A driver for driving a surface emitting laser (VCSEL) 21 as a light emitting element, a photodiode (PD) 22 as a light receiving element, and a surface emitting laser 21 is provided on a first surface (mounting surface) 20 a which is one surface of the substrate 20. A transimpedance amplifier (TIA) 24 that outputs a signal from the element 23 and the photodiode 22 as a voltage signal is fixed. These surface emitting laser 21, photodiode 22, driver element 23, and transimpedance amplifier 24 constitute a photoelectric conversion unit mounted on the substrate 20. Among these electronic components, the surface emitting laser 21 and the photodiode 22 constitute an electronic component that transmits and receives optical signals.

  The surface emitting laser 21 and the driver element 23 are electrically connected to each other by a gold wire GW by wire bonding. The photodiode 22 and the transimpedance amplifier 24 are also electrically connected to each other by a gold wire GW by wire bonding. The driver element 23 and the transimpedance amplifier 24 are electrically connected to a printed wiring (not shown) printed on the first surface 20a of the substrate 20 by a gold wire GW by wire bonding. In addition to the above-described four electronic components (photoelectric conversion units), a plurality of other electronic components 25 such as resistor chips are electrically connected to the printed wiring printed on the first surface 20a. .

  A lens component 26 is disposed above the first surface 20 a and in a portion facing the surface emitting laser 21 and the photodiode 22. The lens component 26 is formed in a substantially rectangular parallelepiped shape from a transparent resin material or glass material, and a reflection surface (not shown) for bending an optical signal passing through the lens component 26 by 90 degrees is provided inside the lens component 26. It has been. Here, the lens component 26 is supported on the first surface 20a by a support member (not shown).

  The lens component 26 includes a first lens surface 26a and a second lens surface 26b provided perpendicular to the first lens surface 26a. The first lens surface 26 a is disposed to face the front surface of the surface emitting laser 21 and the photodiode 22. On the other hand, the second lens surface 26b is disposed so as to face the front side of the optical fiber array 28 in which the ends of the plurality of optical fibers 27 are collected in a horizontal row. Here, the optical fiber array 28 is also supported on the first surface 20a by a support member (not shown).

  Then, the optical signal emitted from the surface emitting laser 21 reaches the first lens surface 26a of the lens component 26 (see the broken line arrow in the figure), and is bent 90 degrees by the reflection surface of the lens component 26. Thereafter, the bent optical signal reaches the optical fiber array 28 from the second lens surface 26b of the lens component 26, and is located on the other end side of the optical fiber cable CA (see FIG. 1) via the optical fiber 27. Is input to the optical transceiver.

  On the other hand, the optical signal from the optical fiber 27 reaches the second lens surface 26b of the lens component 26 from the optical fiber array 28 and is bent 90 degrees by the reflection surface of the lens component 26. Thereafter, the bent optical signal reaches the photodiode 22 from the first lens surface 26a of the lens component 26 (see the broken line arrow in the figure).

  Next, a mounting structure for mounting the surface emitting laser 21 and the photodiode 22 as electronic components on the substrate 20 will be described in detail with reference to the drawings.

  The surface emitting laser 21 and the photodiode 22 are all four-channel optical elements (light emitting elements / light receiving elements) set to substantially the same dimensions, and the mounting structures are also substantially the same. Therefore, only the mounting structure will be described in detail below as a representative of the surface emitting laser 21.

  As shown in FIG. 3, the length L of the surface emitting laser 21 is set to about 1.0 mm, the width W of the surface emitting laser 21 is set to about 0.4 mm, and the height H of the surface emitting laser 21 is It is set to about 0.2mm. The length L of the surface emitting laser 21 varies depending on the number of channels. For example, the length dimension L is about 3.0 mm for a 12-channel specification and about 4.0 mm for a 16-channel specification. However, the width dimension W and the height dimension H of the surface emitting laser 21 are not changed regardless of the number of channels.

  As shown in FIGS. 3 and 4, the first surface 20a to which the surface emitting laser 21 as an electronic component is fixed, and the first surface 20a opposite to the first surface 20a and the other surface of the substrate 20 are the first surface 20a. Two through holes 20c corresponding to one surface emitting laser 21 are provided between the two surfaces (non-mounting surface) 20b. The diameter dimension D of these through holes 20c is set to about 0.2 mm. Each through hole 20c is formed by performing copper plating on the substrate 20 after drilling. Thereby, as shown in FIG. 4, the copper film CU is formed on the first surface 20a and the second surface 20b including each through hole 20c. Here, although not shown in detail, the copper film CU on the first surface 20a and the second surface 20b forms a printed wiring (not shown) corresponding to the specifications of the substrate 20 by an etching process or the like.

  Since each through hole 20c is formed by drilling, a relatively large vibration is applied to the substrate 20 during drilling. Therefore, if the through holes 20c are too close, there is a possibility that the substrate 20 may have a defect such as a crack. Therefore, in the present embodiment, the distance S between the centers of the through holes 20c is set to about 0.5 mm in consideration of such properties of the substrate 20. However, when a flexible substrate or the like having a thinner substrate thickness is employed, a through hole can be formed by laser processing. In this case, the distance between the centers of the through holes can be further shortened.

  In the present embodiment, the through hole used for electrically connecting a plurality of electronic components is used for fixing the surface emitting laser 21 to the substrate 20 with an adhesive (adhesive member) BD. More specifically, the surface emitting laser 21 is placed on each through hole 20c on the first surface 20a by the adhesive BD supplied from the second surface 20b side to the first surface 20a side through each through hole 20c. It is fixed. Here, the adhesive BD is a silver epoxy adhesive, and can be stored at room temperature. For example, the adhesive BD has a property of curing over a period of 20 minutes to 30 minutes in a high temperature environment of 90 ° C. to 180 ° C. Have.

  The adhesive BD is supplied by an adhesive member supply device (dispenser) 30 as shown in FIG. The adhesive member supply device 30 includes a main body portion 31, a nozzle member 32, and a supply tube 33 that supplies the adhesive BD from the main body portion 31 to the nozzle member 32. The main body 31 is provided with an operation panel 31a, and the operation panel 31a is provided with a power switch 31b, a supply amount adjustment dial 31c, and a supply amount display portion 31d. The nozzle member 32 is provided with a needle 32a for discharging the adhesive BD and an operation switch 32b.

  Thereby, when the operator operates the operation switch 32b, a predetermined amount of the adhesive BD is discharged from the needle 32a.

  As shown in FIG. 3, the surface emitting laser 21 completely blocks the first surface 20a side of each through hole 20c. That is, a through hole 20c having a diameter of about 0.2 mm (diameter dimension D) is formed within an area of about 1.0 mm (length dimension L) × about 0.4 mm (width dimension W) (within the projection range of the surface emitting laser 21). Two are arranged. Specifically, the through holes 20 c are arranged side by side in the longitudinal direction of the surface emitting laser 21. Also, as shown in FIG. 4, the amount of adhesive BD supplied to the first surface 20a side is around the surface emitting laser 21 in a state where the surface emitting laser 21 is fixed to the first surface 20a. The supply amount is set so as not to protrude. The supply amount of the adhesive BD is adjusted by the supply amount adjustment dial 31 c of the adhesive member supply device 30.

  As described above, in the present embodiment, the adhesive BD does not protrude from the projection range of the surface emitting laser 21 along the extending direction of the through hole 20c. The adhesive BD does not interfere with components such as the photodiode 22 and the transimpedance amplifier 24. Thereby, the fall of the mounting precision with respect to the board | substrate 20 of another electronic component is suppressed.

  Further, since the supply amount of the adhesive BD is set so as not to protrude around the surface emitting laser 21, the surface emitting laser 21 is reliably mounted in parallel without being inclined with respect to the first surface 20a. Moreover, the fall of the positional accuracy of the surface emitting laser 21 with respect to the board | substrate 20 resulting from the thermal contraction of adhesive agent BD is also suppressed.

  In particular, the surface-emitting laser 21 and the photodiode 22 that transmit and receive optical signals need to be opposed to the lens component 26 (see FIG. 2) with high precision and horizontally. For example, when the surface-emitting laser 21 is provided to be inclined with respect to the lens component 26, the optical axis of the surface-emitting laser 21 and the axis of a lens (not shown) provided on the lens component 26 are greatly shifted. The transmission quality of the optical signal will deteriorate. Therefore, it is desirable that the amount of the adhesive BD interposed between the surface emitting laser 21 and the first surface 20a is an amount that can secure the fixing strength and is as small as possible.

  Next, a mounting method for mounting the surface emitting laser 21 on the substrate 20 will be described in detail with reference to the drawings.

  FIGS. 6A and 6B are explanatory views for explaining the mounting procedure of the surface emitting laser on the substrate, and FIG. 7 is a perspective view of a comparative example showing the case where the surface emitting laser is mounted on the substrate in an inclined manner. Each is shown.

[Adhesive member supply process]
First, the adhesive member supply device 30 shown in FIG. 5 is operated by an operator to adjust the supply amount of the adhesive BD necessary for mounting the surface emitting laser 21. Next, as shown by a solid line arrow (1) in FIG. 6A, the tip portion of the needle 32a in the nozzle member 32 faces the second surface 20b side of each through hole 20c. Then, the operator operates the operation switch 32b (see FIG. 5) of the nozzle member 32. Then, the adhesive BD is discharged from the tip portion of the needle 32a, and the adhesive BD is supplied into the through holes 20c from the second surface 20b side of the through holes 20c (broken arrows in the figure). At this time, in order to prevent the adhesive BD from leaking between the needle 32a and the second surface 20b, it is desirable to press the needle 32a perpendicularly to the second surface 20b to bring them into close contact.

  Thereafter, a predetermined amount of the adhesive BD is discharged from the adhesive member supply device 30, and the adhesive BD is supplied from the second surface 20b side to the first surface 20a through the through holes 20c. When a predetermined amount of the adhesive BD is discharged, the adhesive member supply device 30 is automatically stopped, and an adhesive BD protruding in a hemispherical shape is provided on the first surface 20a side of each through hole 20c.

[Electronic component fixing process]
Next, using the hemispherical adhesive BD protruding on the first surface 20a as a mark, the mounting surface (lower surface) 21a of the surface emitting laser 21 is indicated by a solid line arrow (2) in the figure as shown by the solid line arrow (2). Let us face you. At this time, the two hemispherical adhesives BD are arranged in the longitudinal direction of the surface emitting laser 21, and the first surface 20a side of each through hole 20c is completely closed. Here, the two hemispherical adhesives BD protruding on the first surface 20a are extremely small and correspond exactly to the respective through holes 20c. In the present embodiment, using these two adhesives BD as marks, the arrangement position accuracy (mounting accuracy) of the surface emitting laser 21 with respect to the first surface 20a is increased.

  Note that the surface emitting laser 21 can be automatically arranged on the first surface 20a by an electronic component placement robot (not shown). In this case, an imaging camera (not shown) that detects the adhesive BD supplied to the first surface 20a is attached to the electronic component placement robot, and the electronic component placement robot is driven according to the detection result from the imaging camera. Just do it. As a result, the mounting accuracy of the surface emitting laser 21 with respect to the first surface 20a can be further increased.

  Next, as indicated by a solid line arrow (3) in FIG. 6B, the surface emitting laser 21 is pressed vertically toward the substrate 20 (first surface 20a). Thereby, mounting | wearing to the 1st surface 20a of the surface emitting laser 21 is completed under the state which ensured the parallelism of the surface emitting laser 21 and the 1st surface 20a. At this time, the surplus of the adhesive BD supplied on the first surface 20a is returned from the first surface 20a side to the second surface 20b side through each through hole 20c, as indicated by the broken line arrows in the figure. . Further, due to variations in the discharge accuracy of the adhesive member supply device 30, even when the discharge amount of the adhesive BD increases and protrudes around the surface emitting laser 21, the surface emitting laser 21 is placed on the substrate 20 (first surface 20a). When it is pressed, the excess adhesive BD is returned from the first surface 20a side to the second surface 20b side through each through hole 20c. Thereby, the amount of the adhesive BD that protrudes around the surface emitting laser 21 is reduced, and the interference of the adhesive BD with other electronic components and the gold wire GW of the surface emitting laser 21 is reduced. . Further, since the supply amount of the adhesive BD from the adhesive member supply device 30 is very small in the first place, the adhesive BD returned to the second surface 20b side is attached to the second surface 20b and hangs downward. There is nothing.

  Thereafter, the substrate 20 on which the surface emitting laser 21 is mounted is exposed to a high temperature environment of 90 ° C. to 180 ° C., and then the adhesive BD is cured over a period of 20 minutes to 30 minutes. Thereby, fixation to the 1st surface 20a of the surface emitting laser 21 is completed. Here, the surface emitting laser 21 is fixed by two adhesives BD corresponding to the respective through holes 20c. Therefore, the fixing strength of the surface emitting laser 21 with respect to the rotation direction (the direction of the dashed line arrow) around the axis C in FIG.

  As shown in the comparative example of FIG. 7, temporarily, the adhesive BD having the same supply amount as described above is dropped onto a predetermined portion on the first surface 20a side, thereby fixing the surface emitting laser 21 to the first surface 20a. Then, the supply amount of the adhesive BD between the surface emitting laser 21 and the first surface 20a becomes excessive. Then, the surface emitting laser 21 may be inclined with respect to the first surface 20a, and the optical axis may be shifted by α °, for example. In contrast, in the present embodiment, the adhesive BD is supplied from the second surface 20b side to the first surface 20a side through each through hole 20c (see FIGS. 3, 4, and 6). Excess adhesive BD is accumulated inside each through hole 20c and on the second surface 20b side. Therefore, the minimum necessary adhesive BD can be easily and accurately supplied to the first surface 20a side, and the optical axis of the surface emitting laser 21 can be prevented from being shifted in advance.

  As described in detail above, in the present embodiment, the surface emitting laser 21 is applied to the first surface 20a by the adhesive BD supplied from the second surface 20b side to the first surface 20a side through each through hole 20c. Fixed. As a result, the supply amount of the adhesive BD supplied to the first surface 20a can be easily controlled to the minimum necessary amount, and the surface emitting laser 21 can be stably mounted on the substrate 20 by the adhesive BD. it can.

  In the present embodiment, the supply amount of the adhesive BD supplied to the first surface 20a side is from the periphery of the surface emitting laser 21 in a state where the surface emitting laser 21 is mounted on the first surface 20a. The supply amount did not protrude. As a result, the adhesive BD does not interfere with other electronic components arranged adjacent to the surface emitting laser 21, and as a result, a reduction in mounting accuracy with respect to the substrate 20 can be suppressed also in other electronic components.

  Further, in the present embodiment, two through holes 20 c are provided for one surface emitting laser 21. Thereby, the fixing strength in the rotation direction around the axis C of the surface emitting laser 21 can be made sufficient, and the durability of the optical transceiver 10 can be improved.

  Next, Embodiment 2 of the present invention will be described in detail with reference to the drawings. Note that portions having the same functions as those of the first embodiment described above are denoted by the same reference numerals, and detailed description thereof is omitted.

  FIG. 8 is an explanatory diagram for explaining the mounting procedure of the surface emitting laser according to the second embodiment on the substrate.

  In the second embodiment, as shown in FIG. 8, the through hole 20c provided on the substrate 20 and corresponding to the surface emitting laser 21 is one, and the first surface 20a side of the through hole 20c The difference is that a recess 40 extending in the extending direction of the first surface 20a is provided.

  The recess 40 extends along the longitudinal direction of the surface emitting laser 21 and is formed in a substantially rectangular shape. One end in the longitudinal direction of the recess 40 is in communication with the first surface 20a side of the through hole 20c, whereby the adhesive BD supplied from the second surface 20b side to the first surface 20a side through the through hole 20c is , And also supplied to the inside of the recess 40.

  In order to mount the surface emitting laser 21 on the first surface 20a, the surface emitting laser 21 is made to face the first surface 20a as indicated by a broken line arrow (4) in the figure. More specifically, the longitudinal direction of the surface emitting laser 21 and the extending direction of the recess 40 are made to coincide with each other, and the through hole 20c and the recess 40 are completely closed. Then, the surplus of the adhesive BD supplied on the first surface 20a reaches every corner inside the recess 40 as indicated by a broken line arrow (5) in the figure. Thereby, the adhesion area of surface emitting laser 21 and adhesive BD can be made into a sufficiently large area. Therefore, the fixing strength of the surface emitting laser 21 with respect to the rotation direction (the direction of the one-dot chain line arrow) about the axis C in FIG. 8 can be sufficient.

  Also in the second embodiment configured as described above, the same operational effects as those of the first embodiment can be obtained. In addition to this, in the second embodiment, it is only necessary to provide one through hole 20c for one surface emitting laser 21, so that drilling of the substrate 20 can be simplified. Therefore, it is possible to significantly reduce the damage of the substrate 20 and improve the yield.

  Next, Embodiments 3 and 4 of the present invention will be described in detail with reference to the drawings. Note that portions having the same functions as those of the first embodiment described above are denoted by the same reference numerals, and detailed description thereof is omitted.

  FIGS. 9A and 9B are explanatory views for explaining the relationship between the surface emitting laser and the through holes according to the third and fourth embodiments. 9A and 9B are plan views seen from the direction of arrow B in FIG.

  In the third embodiment, as shown in FIG. 9A, three through holes 20 c are provided for one surface emitting laser 21, and each through hole 20 c is a longitudinal portion of the surface emitting laser 21. Three are arranged in a horizontal line at regular intervals (about 0.5 mm) along the direction. The through-hole 20c in the central portion along the longitudinal direction of the surface emitting laser 21 is within the projection range of the surface emitting laser 21 and is completely closed, but is on both sides in the longitudinal direction of the surface emitting laser 21. Half of the through hole 20c is exposed to the outside. This is based on the relationship between the center-to-center distance S (about 0.5 mm) of each through-hole 20c and the length dimension L (about 1.0 mm) of the 4-channel surface emitting laser 21.

  Also in the third embodiment configured as described above, it is possible to achieve substantially the same operational effects as in the first embodiment. In addition to this, in the third embodiment, the surface emitting laser 21 can be fixed at three locations, so that the fixing strength of the surface emitting laser 21 in the rotation direction around the axis C can be further increased. However, since the adhesive BD protrudes from the through holes 20c on both sides in the longitudinal direction of the surface emitting laser 21 around the surface emitting laser 21, the surface emitting laser 21 and other electronic components are sufficiently separated (specifications). It is desirable to employ in an optical transceiver provided with a substrate of the above.

  In the fourth embodiment, as shown in FIG. 9B, three through holes 20 c are provided for one surface emitting laser 21, and each through hole 20 c has a surface emitting laser 21. Three are provided at intervals of about 0.5 mm, shifted in the longitudinal direction and the lateral direction. In the present embodiment, half of all the through holes 20c are exposed to the outside.

  In the fourth embodiment configured as described above, it is possible to achieve substantially the same operational effects as in the third embodiment. In the fourth embodiment, it is desirable to employ the optical transceiver including a substrate (design) having a design (specification) in which the surface emitting laser 21 and other electronic components are sufficiently separated from each other.

  It goes without saying that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention. For example, in each of the above embodiments, as the adhesive member of the present invention, the one using the silver epoxy adhesive BD is shown. However, the present invention is not limited to this, and an adhesive having a solder or other composition is used. It can also be adopted.

  Moreover, in the said Embodiment 2, as shown in FIG. 8, what provided the recessed part 40 formed in the substantially rectangular shape was shown, However This invention is not limited to this, Other shapes, such as a circle and a triangle, are shown. A concave portion having a shape may be provided. Furthermore, you may provide the recessed part extended radially around the through-hole 20c. In the first embodiment (see FIG. 4), a recess that communicates with both of the through holes 20c may be formed between the through holes 20c.

10 Optical transceiver (optical communication module)
DESCRIPTION OF SYMBOLS 11 Upper case 12 Lower case 13 Case 14 Card edge 15 Pull tab 15a Ring part 20 Board | substrate 20a 1st surface 20b 2nd surface 20c Through-hole 21 Surface emitting laser (electronic component)
22 Photodiode (electronic component)
23 Driver element (electronic component)
24 Transimpedance amplifier (electronic parts)
Reference Signs List 25 Electronic component 26 Lens component 26a First lens surface 26b Second lens surface 27 Optical fiber 28 Optical fiber array 30 Adhesive member supply device 31 Main body 31a Operation panel 31b Power switch 31c Supply amount adjustment dial 31d Supply amount display unit 32 Nozzle member 32a Needle 32b Operation switch 33 Supply tube 40 Recess BD Adhesive (adhesive member)
CA optical fiber cable CU copper film GW gold wire

Claims (6)

An electronic component mounting structure in which the electronic component is mounted on a substrate by an adhesive member,
The substrate is
A first surface to which the electronic component is fixed;
A second surface provided on the opposite side of the first surface;
A through hole provided between the first surface and the second surface,
The electronic component is
The adhesive member supplied from the second surface side to the first surface side through the through hole is fixed on the through hole of the first surface.
Electronic component mounting structure. The electronic component mounting structure according to claim 1,
The through hole formed in the substrate is provided within a projection range of the electronic component along the extending direction of the through hole,
The adhesive member does not protrude from the projection range of the electronic component under a state where the electronic component is fixed to the first surface.
Electronic component mounting structure. A mounting structure for an electronic component according to claim 1 or 2,
The electronic component is provided with at least two through holes correspondingly.
Electronic component mounting structure. The electronic component mounting structure according to any one of claims 1 to 3,
The first surface has a recess communicating with the first surface side of the through hole and extending in the extending direction of the first surface.
Electronic component mounting structure. An electronic component mounting method for mounting an electronic component on a substrate with an adhesive member,
The substrate is
A first surface to which the electronic component is fixed;
A second surface provided on the opposite side of the first surface;
A through hole provided between the first surface and the second surface,
An adhesive member supplying step of supplying the adhesive member from the second surface side to the first surface side through the through hole;
An electronic component fixing step of fixing the electronic component to the first surface with the adhesive member with the electronic component facing the first surface side of the through-hole.
Electronic component mounting method. An optical communication module including a substrate on which an electronic component that transmits and receives an optical signal is mounted by an adhesive member,
The substrate is
A first surface to which the electronic component is fixed;
A second surface provided on the opposite side of the first surface;
A through hole provided between the first surface and the second surface,
The electronic component is
The adhesive member supplied from the second surface side to the first surface side through the through hole is fixed on the through hole of the first surface.
Optical communication module.

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