JP2016127398A - Piezoelectric vibrator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a compact piezoelectric vibrator capable of ensuring the mounting strength of a piezoelectric vibration piece.SOLUTION: A piezoelectric vibrator 1 includes a piezoelectric vibration piece 3 and a package 2 in which a pair of support arm portions 33, 34 are mounted via a joint member 8, the piezoelectric vibration piece 3 including: a pair of vibration arm portions 31, 32 extending along a first direction L1 and disposed side by side in a second direction L2 orthogonal to the first direction L1; a base 35 connecting base ends 31b, 32b of the pair of vibration arm portions 31, 32 to each other; and the pair of support arm portions 33, 34 located at the outer side of the pair of vibration arm portions 31, 32 in the second direction L2 and extended from the base 35. The joint member 8 is formed in an oblong shape in plan view, and is provided such that the longitudinal directions Q1, Q2 of the joint member 8 and the extension direction P of the support arm portions 33, 34 intersect with each other in plan view.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a piezoelectric vibrator.

  For example, a piezoelectric vibrator using a crystal or the like is used in an electronic device such as a mobile phone or a portable information terminal device as a device used for a time source, a timing source such as a control signal, a reference signal source, or the like. As this type of piezoelectric vibrator, a piezoelectric vibrator in which a piezoelectric vibrating piece is hermetically sealed in a package in which a cavity is formed is known.

As the piezoelectric vibrating piece, a so-called side arm type piezoelectric vibrating piece having a pair of supporting arm portions extending in the same direction as the vibrating arm portion outside the pair of vibrating arm portions arranged side by side is known. For example, a piezoelectric vibrating piece described in Patent Document 1 has a base portion having a predetermined length formed of a piezoelectric material and a plurality of vibrating arms extending from one end side of the base portion (corresponding to “vibrating arm portion” in the claims). And a support arm that extends in the width direction from the other end side that is a predetermined distance away from the one end side of the base and extends in the same direction as the vibrating arm on the outside of the vibrating arm. Equivalent to "arm part").
By the way, in recent years, with the miniaturization of electronic devices, demands for miniaturization of piezoelectric vibrators are increasing.

JP 2006-311088 A

  However, in the small piezoelectric vibrator, the piezoelectric vibrating piece is also small, and the formation region of the bonding material disposed on the base substrate is also narrowed. For this reason, in the mounting process, the amount of displacement of the support arm portion with respect to the bonding material formation region becomes relatively large, and the support arm portion may not be disposed at a desired position with respect to the bonding material. As a result, a sufficient contact area between the bonding material and the support arm portion cannot be ensured, and a desired mounting strength cannot be obtained. Therefore, the piezoelectric vibrating piece may be displaced or peeled off in the package. In order to secure mounting strength, it is conceivable to provide a wide bonding material forming area. However, it is difficult to increase the bonding material forming area because the package is also downsized as the piezoelectric vibrator becomes smaller. It is. Therefore, when miniaturizing the piezoelectric vibrator, there is a problem in securing mounting strength.

  Therefore, the present invention provides a small piezoelectric vibrator capable of ensuring the mounting strength of a piezoelectric vibrating piece.

The piezoelectric vibrator of the present invention includes a pair of vibrating arm portions that extend along the first direction and are arranged in a second direction orthogonal to the first direction, and base ends of the pair of vibrating arm portions. And a pair of support arm portions that are located outwardly in the second direction of the pair of vibration arm portions and extend from the base portion, and the support arm portion comprises: A package mounted via a bonding material, and the bonding material is formed to have either an oval shape or a rectangular shape in plan view, and the longitudinal direction of the bonding material and the It is provided so that the extending direction of a support arm part may cross | intersect by planar view.
According to the present invention, since the bonding material is formed in an oval shape or a rectangular shape in plan view, the support arm portion is used as the bonding material compared to the case where the bonding material is formed in a circular shape in plan view. Can be easily contacted. Further, in the plan view, the extending direction of the support arm portion intersects the longitudinal direction of the bonding material that contacts the support arm portion. For this reason, when the piezoelectric vibrating piece is mounted on the package, even if the position of the piezoelectric vibrating piece with respect to the package is shifted in the second direction in a plan view, the support arm portion of the piezoelectric vibrating piece is ensured with a predetermined contact area. Can be brought into contact with the bonding material. Thereby, even if the amount of relative displacement of the support arm portion with respect to the bonding material increases, the support arm portion can be joined to the package, and a desired mounting strength can be ensured. Therefore, a small piezoelectric vibrator capable of securing the mounting strength of the piezoelectric vibrating piece can be obtained.

In the piezoelectric vibrator described above, it is desirable that the support arm portion has an inclined portion inclined with respect to the first direction in a plan view, and the inclined portion and the bonding material are in contact with each other.
According to the present invention, since the inclined portion of the support arm portion is inclined with respect to the first direction, even when the longitudinal direction of the bonding material is set along the first direction, the extension of the support arm portion is performed. The outgoing direction and the longitudinal direction of the bonding material can be crossed. Therefore, a small piezoelectric vibrator capable of securing the mounting strength of the piezoelectric vibrating piece can be obtained.

In the piezoelectric vibrator described above, it is desirable that the longitudinal direction of the bonding material and the first direction intersect each other in plan view.
According to the present invention, since the longitudinal direction of the bonding material and the first direction intersect, the extension direction of the support arm portion and the bonding are formed even when the support arm portion is formed along the first direction. The longitudinal direction of the material can be crossed. Therefore, the mounting strength of the piezoelectric vibrating piece can be ensured with respect to the piezoelectric vibrator including the small piezoelectric vibrating piece in which the support arm portion is formed in parallel with the vibrating arm portion.

In the above-described piezoelectric vibrator, it is preferable that an intersection angle between the longitudinal direction of the bonding material and the first direction is 30 ° or less in a plan view.
According to the present invention, since the crossing angle of the bonding material in the longitudinal direction with respect to the first direction is set to 30 ° or less, it is possible to suppress an increase in the dimension of the bonding material in the second direction. Can be prevented.

In the piezoelectric vibrator, in the formation region of the bonding material, the amount of protrusion of the bonding material inside the support arm portion is smaller than the amount of protrusion of the bonding material outside the support arm portion. Is desirable.
According to the present invention, since the protruding amount of the bonding material inside the support arm portion is smaller than the protruding amount of the bonding material outside the support arm portion, the vibrating arm portion provided inside the support arm portion, Contact with the bonding material can be suppressed. Therefore, even when the piezoelectric vibrator and the piezoelectric vibrating piece are downsized, it is possible to prevent the bonding material from adhering to the vibrating arm portion and to ensure good vibration characteristics.

  According to the present invention, since the bonding material is formed in an oval shape or a rectangular shape in plan view, the support arm portion is used as the bonding material compared to the case where the bonding material is formed in a circular shape in plan view. Can be easily contacted. Further, in the plan view, the extending direction of the support arm portion intersects the longitudinal direction of the bonding material that contacts the support arm portion. For this reason, when the piezoelectric vibrating piece is mounted on the package, even if the position of the piezoelectric vibrating piece with respect to the package is shifted in the second direction in a plan view, the support arm portion of the piezoelectric vibrating piece is ensured with a predetermined contact area. Can be brought into contact with the bonding material. Thereby, even if the amount of relative displacement of the support arm portion with respect to the bonding material increases, the support arm portion can be joined to the package, and a desired mounting strength can be ensured. Therefore, a small piezoelectric vibrator capable of securing the mounting strength of the piezoelectric vibrating piece can be obtained.

1 is an external perspective view of a piezoelectric vibrator according to a first embodiment. 1 is an exploded perspective view of a piezoelectric vibrator according to a first embodiment. It is an internal block diagram of the piezoelectric vibrator which concerns on 1st Embodiment. It is an internal block diagram of the package which concerns on 2nd Embodiment. FIG. 5 is a cross-sectional view taken along line VV in FIG. 4 when a piezoelectric vibrating piece is mounted on the package shown in FIG. 4.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[First Embodiment]
FIG. 1 is an external perspective view of the piezoelectric vibrator according to the first embodiment. FIG. 2 is an exploded perspective view of the piezoelectric vibrator according to the first embodiment. FIG. 3 is an internal configuration diagram of the piezoelectric vibrator according to the first embodiment.
As shown in FIGS. 1 to 3, the piezoelectric vibrator 1 according to the present embodiment includes a package 2 having a cavity C hermetically sealed therein, and a piezoelectric vibrating piece 3 accommodated in the cavity C. It is a ceramic package type surface-mount type resonator.

The package 2 is formed in a substantially rectangular parallelepiped shape. The package 2 includes a package body 5 and a sealing plate 6 that is bonded to the package body 5 and that forms a cavity C between the package body 5 and the package body 5.
The package main body 5 includes a first base substrate 10 and a second base substrate 11 which are joined in a state of being overlapped with each other, and a seal ring 12 which is joined on the second base substrate 11.

  At the four corners of the first base substrate 10 and the second base substrate 11, cutout portions 15 having a ¼ arc shape in plan view are formed over the entire thickness direction of both the base substrates 10 and 11. The first base substrate 10 and the second base substrate 11 are formed, for example, by stacking and joining two wafer-like ceramic substrates, and then forming a plurality of through-holes penetrating both ceramic substrates in a matrix form. It is produced by cutting both ceramic substrates into a lattice shape with reference to the holes. At this time, the through hole is divided into four parts, thereby forming the cutout part 15.

  Although the first base substrate 10 and the second base substrate 11 are made of ceramics, specific ceramic materials include, for example, HTCC (High Temperature Co-Fired Ceramic) made of alumina, or LTCC (made of glass ceramics). Low Temperature Co-Fired Ceramic) and the like.

The upper surface of the first base substrate 10 corresponds to the bottom surface of the cavity C.
The second base substrate 11 is superimposed on the first base substrate 10 and is bonded to the first base substrate 10 by sintering or the like. That is, the second base substrate 11 is integrated with the first base substrate 10.

  The second base substrate 11 has a penetrating part 11a. The through portion 11a is formed in a rectangular shape in plan view with rounded corners. The inner side surface of the penetrating portion 11a constitutes a part of the side wall of the cavity C. Mounting portions 14A and 14B projecting inward are provided on the inner side surfaces of the penetrating portion 11a on both sides in the short direction. The mounting portions 14A and 14B are formed at substantially the center in the longitudinal direction of the penetrating portion 11a.

  The seal ring 12 is a conductive frame-like member that is slightly smaller than the outer shape of the first base substrate 10 and the second base substrate 11, and is bonded to the upper surface of the second base substrate 11. Specifically, the seal ring 12 is bonded onto the second base substrate 11 by baking with a brazing material such as silver brazing or a solder material, or is formed on the second base substrate 11 (for example, electrolytic plating or electroless). In addition to plating, bonding is performed by welding or the like to a metal bonding layer formed by vapor deposition or sputtering.

Examples of the material of the seal ring 12 include a nickel-based alloy, and specifically, it may be selected from Kovar, Elinvar, Invar, 42-alloy, and the like. In particular, as the material of the seal ring 12, it is preferable to select a material having a thermal expansion coefficient close to that of the first base substrate 10 and the second base substrate 11 made of ceramics. For example, when alumina having a thermal expansion coefficient of 6.8 × 10 ⁻⁶ / ° C. is used as the first base substrate 10 and the second base substrate 11, the seal ring 12 has a thermal expansion coefficient of 5.2 × 10 ⁻ It is preferable to use ⁶ / ° C. Kovar or a 42-alloy having a thermal expansion coefficient of 4.5 to 6.5 × 10 ⁻⁶ / ° C.

  The sealing plate 6 is a conductive substrate stacked on the seal ring 12, and is hermetically bonded to the package body 5 by bonding to the seal ring 12. A space defined by the sealing plate 6, the seal ring 12, the penetrating portion 11 a of the second base substrate 11, and the upper surface of the first base substrate 10 functions as a hermetically sealed cavity C.

  Examples of the welding method of the sealing plate 6 include seam welding by bringing a roller electrode into contact, laser welding, ultrasonic welding, and the like. Moreover, in order to make the welding of the sealing plate 6 and the seal ring 12 more reliable, a bonding layer such as nickel or gold that is familiar to each other is provided at least on the lower surface of the sealing plate 6 and the upper surface of the seal ring 12. It is preferable to form.

  Meanwhile, a pair of electrode pads 20A and 20B that are connection electrodes to the piezoelectric vibrating piece 3 are formed on the upper surfaces of the mounting portions 14A and 14B of the second base substrate 11. A pair of external electrodes 21 </ b> A and 21 </ b> B are formed on the lower surface of the first base substrate 10 at intervals in the longitudinal direction of the package 2. The electrode pads 20A and 20B and the external electrodes 21A and 21B are, for example, a single-layer film made of a single metal formed by vapor deposition or sputtering, or a stacked film in which different metals are stacked. Each is conducting.

  The piezoelectric vibrating reed 3 is mounted on the mounting portions 14A and 14B via the conductive bonding material 8 (bonding materials 8A and 8B). A metallized layer (not shown) is formed on the surfaces of the electrode pads 20A and 20B, and the piezoelectric vibrating reed 3 is mounted by interposing bonding materials 8A and 8B between the metallized layer and the piezoelectric vibrating reed 3. Also good. In this case, the clearance between the piezoelectric vibrating piece 3 and the bottom surface of the package 2 can be further ensured by the height of the metallized layer, and the contact between the piezoelectric vibrating piece 3 and the bottom surface of the package 2 can be more reliably avoided. Is possible. The piezoelectric vibrating piece 3 is a vibrating piece formed from a piezoelectric material such as quartz, lithium tantalate, or lithium niobate, and vibrates when a predetermined voltage is applied. In the following description, quartz will be described as an example of the piezoelectric material.

  As shown in FIG. 3, the piezoelectric vibrating reed 3 extends along the first direction L1 and is arranged side by side in a second direction L2 orthogonal to the first direction L1, and a pair of vibrating arm portions 31 and 32, A pair of base members 35 connecting the base ends 31b and 32b of the pair of vibrating arm portions 31 and 32, and a pair of vibrating arm portions 31 and 32 that are located outward in the second direction L2 and extend from the base portion 35. This is a so-called side arm type vibration piece including support arm portions 33 and 34. Note that the piezoelectric vibrating reed 3 is arranged so that the first direction L1 and the longitudinal direction of the package 2 coincide with each other and the second direction L2 coincides with the short direction of the package 2 in plan view. Further, the third direction L3 orthogonal to the first direction L1 and the second direction L2 coincides with the thickness direction of the first base substrate 10 of the package 2 and the thickness direction of the piezoelectric vibrating piece 3 (see FIG. 4).

  The pair of vibrating arm portions 31 and 32 are arranged to be parallel to each other, and vibrate with the base ends 31b and 32b as fixed ends and the tips 31a and 32a as free ends. The pair of vibrating arm portions 31 and 32 is, for example, a so-called hammer head type in which the widths of the distal ends 31a and 32a are larger than the base ends 31b and 32b. The weight of 32a and the moment of inertia during vibration are increased. As a result, the vibrating arm portions 31 and 32 can easily vibrate, the length of the vibrating arm portions 31 and 32 can be shortened, and the size can be reduced. In the present embodiment, the hammer head type vibrating arm portions 31 and 32 are described as an example. However, the vibrating arm portions 31 and 32 are not limited to the hammer head type.

  A groove portion 37 is formed in the pair of vibrating arm portions 31 and 32. The groove portion 37 is recessed in the thickness direction (third direction L3) of the vibrating arm portions 31 and 32 on both main surfaces of the pair of vibrating arm portions 31 and 32, and extends along the first direction L1. . The groove portion 37 is formed between the base ends 31b and 32b of the vibrating arm portions 31 and 32 and the portions where the widths on the distal ends 31a and 32a are enlarged.

  On the surface of the pair of vibrating arm portions 31 and 32, two systems of excitation electrodes (not shown) for vibrating the vibrating arm portions 31 and 32 in the second direction L2 are provided. Each excitation electrode is patterned in a state of being electrically insulated from each other, and is arranged so that the pair of vibrating arm portions 31 and 32 can vibrate at a predetermined frequency.

  The base portion 35 extends in the second direction L2 to the outside of the pair of vibrating arm portions 31 and 32. To the base portion 35, base ends 31b and 32b of the pair of vibrating arm portions 31 and 32 are integrally connected and fixed. Further, the pair of support arm portions 33 and 34 are respectively connected to both ends of the base portion 35 in the second direction L2. The pair of support arm portions 33 and 34 extend from the base portion 35 along the first direction L1, and the extension direction P of the pair of support arm portions 33 and 34 coincides with the first direction L1.

Mount electrodes 53 and 54 are provided on one main surface (hereinafter referred to as “mount surface”) of the support arm portions 33 and 34 as mount portions when the piezoelectric vibrating reed 3 is mounted on the package 2, respectively. ing. The first mount electrode 53 is disposed, for example, from the vicinity of the center of the first support arm portion 33 toward the tip. The second mount electrode 54 is disposed, for example, from the vicinity of the center of the second support arm portion 34 toward the tip.
The mount electrodes 53 and 54 and the two excitation electrodes are electrically connected to each other by a routing electrode (not shown). The routing electrode is formed in a path from the support arm portions 33 and 34 to the pair of vibrating arm portions 31 and 32 via the base portion 35.

  The piezoelectric vibrating reed 3 configured as described above is a hermetically sealed package 2 in which the pair of support arm portions 33 and 34 are bonded to the mounting portions 14A and 14B via the bonding materials 8A and 8B. In the cavity C. The mount electrodes 53 and 54 provided on the support arm portions 33 and 34 are respectively connected to the electrode pads 20A and 20B provided on the mounting portions 14A and 14B (if a metallized layer is formed on the electrode pads 20A and 20B) It is electrically and mechanically bonded to the metallized layer via bonding materials 8A and 8B, respectively. Thereby, the piezoelectric vibrating piece 3 is supported by the support arm portions 33 and 34.

The bonding material 8 has conductivity, has fluidity at an early stage of bonding, and solidifies at a later stage of bonding to exhibit bonding strength. In addition, it has the property of spreading out in a form that approximately follows the shape of the metallized layer. As the bonding material 8, for example, a conductive adhesive such as silver paste, a metal bump, or the like is suitable. On the mounting portions 14A and 14B, the electrode pads 20A and 20B or the metallization layer covering the electrode pads 20A and 20B are formed in an oval shape in a plan view. On the mounting portions 14A and 14B, they are formed in an oval shape in plan view. The longitudinal directions Q1 and Q2 in the plan view shape of the bonding materials 8A and 8B are formed so as to be inclined inward with respect to the first direction L1, and intersect the extending direction P of the support arm portions 33 and 34. Yes.
Note that the shape of the bonding materials 8A and 8B in plan view is not limited to an oval shape, and may be formed to be long along a direction inclined with respect to the first direction L1, for example, a rectangular shape. May be. In any case, it may be formed in a direction inclined with respect to the extending direction P of the support arm portions 33 and 34.

  The bonding materials 8A and 8B have a protruding amount on the inner side of the support arm portions 33 and 34 at the bonding portion between the support arm portions 33 and 34 and the mounting portions 14A and 14B (formation region of the bonding materials 8A and 8B). It is set to be smaller than the protruding amount on the outside of the arm portions 33 and 34. Here, “the amount of protrusion” refers to the volume of the bonding material protruding from the edge of the support arm portions 33 and 34 along the width direction of each of the support arm portions 33 and 34.

  When the bonding material 8 is made of a conductive adhesive, the bonding material 8 is applied by a dispenser nozzle supported by the moving head of the coating apparatus. At this time, the bonding material 8 is formed on the mounting portions 14A and 14B while moving the moving head in a predetermined direction, so that the predetermined direction is the longitudinal direction.

  When a predetermined voltage is applied to the external electrodes 21A and 21B (see FIG. 1), current flows through the two excitation electrodes and an electric field is generated between the two excitation electrodes. The pair of vibrating arm portions 31 and 32 vibrate at a predetermined resonance frequency, for example, in a direction (second direction L2) approaching and separating from each other by an inverse piezoelectric effect caused by an electric field generated between the two excitation electrodes. The vibrations of the pair of vibrating arm portions 31 and 32 are used as a time source, a control signal timing source, a reference signal source, and the like.

As described above, the piezoelectric vibrator 1 according to the present embodiment includes a pair of vibrating arm portions 31 and 32 that extend along the first direction L1 and are arranged side by side in the second direction L2 orthogonal to the first direction L1. A pair of bases 35 that connect the base ends 31b and 32b of the pair of vibrating arm portions 31 and 32 and a pair that is located outward in the second direction L2 of the pair of vibrating arm portions 31 and 32 and extends from the base portion 35. The piezoelectric vibrating reed 3 having the support arm portions 33 and 34 and the package 2 on which the support arm portions 33 and 34 are mounted via the bonding materials 8A and 8B are provided. The joining materials 8A and 8B are formed in an oval shape in plan view, and the longitudinal directions Q1 and Q2 of the joining materials 8A and 8B and the extending direction P of the support arm portions 33 and 34 intersect in plan view. Is provided.
According to this configuration, since the bonding materials 8A and 8B are formed in an oval shape in plan view, the support arm portions 33 and 34 are compared with the case where the bonding material is formed in a circular shape in plan view. It can be easily brought into contact with the bonding materials 8A and 8B.
Further, in the plan view, the extending direction P of the support arm portions 33 and 34 intersects with the longitudinal directions Q1 and Q2 of the bonding materials 8A and 8B. For this reason, when the piezoelectric vibrating reed 3 is mounted on the package 2, the support arm maintains a predetermined contact area even if the position of the piezoelectric vibrating reed 3 with respect to the package 2 is shifted in the second direction L 2 in plan view. The bonding materials 8A and 8B can be brought into contact with the portions 33 and 34. Thereby, even if the relative positional shift amount of the support arm portions 33 and 34 with respect to the bonding materials 8A and 8B increases, the support arm portions 33 and 34 can be bonded to the package 2, and a desired mounting strength can be ensured. . Therefore, a small piezoelectric vibrator 1 that can ensure the mounting strength of the piezoelectric vibrating piece 3 is obtained.

  Further, in the region where the bonding material 8 is formed, the protruding amount of the bonding material 8 inside the support arm portions 33 and 34 is smaller than the protruding amount of the bonding material 8 outside the support arm portions 33 and 34. For this reason, the contact between the vibrating arm portions 31 and 32 provided inside the support arm portions 33 and 34 and the bonding material 8 can be suppressed. Therefore, even when the piezoelectric vibrator 1 and the piezoelectric vibrating piece 3 are downsized, the bonding material 8 can be prevented from adhering to the vibrating arm portions 31 and 32, and good vibration characteristics can be secured.

[Modification of First Embodiment]
As shown in FIG. 2, in the first embodiment, the mounting portions 14 </ b> A and 14 </ b> B are formed on the second base substrate 11. However, the configuration of the package 2 in the present invention is not limited to this, and the mounting portions 14A and 14B are formed on the surface of the first base substrate 10 without providing the mounting portions 14A and 14B on the second base substrate 11. May be. According to this, the second base substrate 11 becomes unnecessary, and accordingly, the height dimension of the piezoelectric vibrator can be lowered.

[Second Embodiment]
FIG. 4 is an internal configuration diagram of the piezoelectric vibrator according to the second embodiment. 5 is a cross-sectional view taken along the line VV in FIG. 4 when a piezoelectric vibrating piece is mounted on the package shown in FIG.
In the first embodiment shown in FIG. 3, the bonding material is such that the extending direction P of the pair of support arm portions 33 and 34 and the longitudinal directions Q1 and Q2 in the planar view shape of the bonding materials 8A and 8B intersect each other. The longitudinal directions Q1 and Q2 of 8A and 8B were inclined with respect to the first direction L1. On the other hand, in the second embodiment shown in FIG. 4, the bonding material 108 is formed so that the longitudinal direction Q of the bonding material 108 is along the first direction L1, and the piezoelectric vibrating piece 103 (see FIG. 5) is formed. A feature is that the extending direction of the inclined portions of the support arm portions 133 and 134 intersects the longitudinal direction Q of the bonding material 108.

According to this, similarly to the first embodiment, the longitudinal direction Q of the bonding material 108 and the extending direction of the inclined portions of the support arm portions 133 and 134 intersect with each other, so that the piezoelectric vibrating piece 103 is mounted on the package 2. In this case, even if the position of the piezoelectric vibrating piece 103 with respect to the package 2 is shifted in the second direction L2 in plan view, the bonding material 108 is applied to the inclined portions of the support arm portions 133 and 134 in a state where a predetermined contact area is secured. Can be contacted. Thereby, even if the relative positional deviation amount of the support arm portions 133 and 134 with respect to the bonding material 108 increases, the support arm portions 133 and 134 can be bonded to the package 2 and a desired mounting strength can be ensured. Therefore, the small piezoelectric vibrator 101 that can ensure the mounting strength of the piezoelectric vibrating piece 103 is obtained. It is preferable that the crossing angle between the longitudinal direction Q of the bonding material 108 and the extending direction of the inclined portions of the support arm portions 133 and 134 is 30 ° or less. In the case of 30 ° or more, the width of the piezoelectric vibrator 1 becomes large, and it is difficult to satisfy the demand for downsizing.
The inclination direction of the inclined portions of the support arm portions 133 and 134 may be inclined to the vibrating arm portion side, or may be inclined to the opposite side, that is, the direction away from the vibrating arm portions 31 and 32.

The present invention is not limited to the above-described embodiment described with reference to the drawings, and various modifications can be considered within the technical scope thereof.
For example, in the above-described embodiment, the ceramic package type surface-mount type vibrator has been described as the piezoelectric vibrator using the piezoelectric vibrating piece. However, the piezoelectric vibrating piece includes a base substrate and a lid substrate formed of a glass material. It is also possible to apply to a glass package type piezoelectric vibrator that is bonded by anodic bonding.

  In addition, it is possible to appropriately replace the components in the above-described embodiments with known components without departing from the spirit of the present invention.

  DESCRIPTION OF SYMBOLS 1,101 ... Piezoelectric vibrator 3,103 ... Piezoelectric vibration piece 8,108 ... Bonding material 31, 32 ... Vibration arm part 31b, 32b ... Base end of vibration arm part 33, 34, 133, 134 ... Support arm part 35 ... Base L1 ... 1st direction L2 ... 2nd direction P ... Extension direction of support arm part Q, Q1, Q2 ... Longitudinal direction of joining material

Claims (5)

A pair of vibrating arms extending along the first direction and arranged side by side in a second direction orthogonal to the first direction;
A base for connecting the base ends of the pair of vibrating arms; and
A pair of support arm portions that are located outward in the second direction of the pair of vibrating arm portions and extend from the base portion;
A piezoelectric vibrating piece with
A package in which the support arm is mounted via a bonding material;
With
The bonding material is formed to have either an oval shape or a rectangular shape in plan view, and the longitudinal direction of the bonding material and the extending direction of the support arm portion intersect in plan view. Is provided as
A piezoelectric vibrator characterized by that. The support arm portion has an inclined portion inclined with respect to the first direction in a plan view,
The inclined portion and the bonding material are in contact with each other;
The piezoelectric vibrator according to claim 1. In plan view, the longitudinal direction of the bonding material and the first direction intersect,
The piezoelectric vibrator according to claim 1 or 2. In a plan view, an intersection angle between the longitudinal direction of the bonding material and the first direction is 30 ° or less.
The piezoelectric vibrator according to claim 1, wherein the piezoelectric vibrator is provided. In the formation region of the bonding material, the amount of protrusion of the bonding material inside the support arm portion is smaller than the amount of protrusion of the bonding material outside the support arm portion.
The piezoelectric vibrator according to any one of claims 1 to 4, wherein the piezoelectric vibrator is provided.

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