JP2016127100A - Detachable vibration generating device and semiconductor manufacturing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve such a problem that reaction products are clogged in a mesh incorporated in a vacuum pump of a semiconductor manufacturing device, resulting in need for a periodic cleaning operation of the mesh, and the semiconductor manufacturing device is in a non-operating state during the time of a cleaning operation, so that a decrease in production efficiency is caused when the frequency of a cleaning operation is increased.SOLUTION: A detachable vibration generating device 1 detachable to piping 41 includes a vibration generation part 3 and an attachment structure 5 for transferring vibrations in the vibration generation part 3 and for attaching the vibration generation part 3 to the piping. By mounting the detachable vibration generating device to the piping 41 of a semiconductor manufacturing device 21, the occurrence of clogging of reaction products into the mesh can be reduced.SELECTED DRAWING: Figure 1

Description

The present invention relates to a vibration generator attached to a vacuum pump pipe in a semiconductor manufacturing apparatus and a semiconductor manufacturing apparatus to which the vibration generator is attached.

Conventionally, vacuum pumps that make up CVD (Chemical Vapor Deposition) equipment have been fitted with a mesh-like filter for capturing reaction products on the suction side. Things do not pass. Since this mesh may be clogged with a product, it is indispensable to periodically perform a mesh (filter) cleaning operation. In this case, in addition to removing, cleaning, and attaching the mesh, the leak check of the device was indispensable as a series of operations. Therefore, if the frequency of the mesh cleaning operation increased, the non-operating time of the device was increased. . Further, at that time, since a worker has to perform a work for a lot of time, it is not possible to devote time to other work.

Regarding the problem of this reaction product adhesion, for example, in a normal pressure CVD apparatus as seen in Patent Document 1, a piping cleaning mechanism in which an ultrasonic vibrator is disposed on the outer wall surface of an exhaust pipe connected to the exhaust duct is provided. There was something to prepare. In addition, there is a processing apparatus in which a cleaning unit is provided in a trap that captures a reaction product provided in an exhaust path as found in Patent Document 2.

JP-A-5-263248 (FIG. 2) Japanese Patent Laid-Open No. 2-025573 (FIG. 4)

In the configuration of Patent Document 1, which is a conventional technique, the reaction product attached to the outer wall surface of the exhaust pipe can be peeled off, but the peeled product is captured (collected) by a filter depending on its size. Therefore, the frequency of the mesh cleaning operation has not been reduced. Further, in the configuration of Patent Document 2, the reaction product captured by the mesh is separated by vibration, and depending on the structure of the apparatus, it is necessary to periodically remove the separated reaction product from the apparatus. It has not necessarily led to a reduction in downtime of the equipment.

Moreover, the vibration generation part of patent document 1 and patent document 2 becomes a structure incorporated in the apparatus, and in the case of the maintenance of the structure containing a vibration generation part, all had a non-operation time of the apparatus. .

In addition, the configuration is built in the processing apparatus in advance, and the frequency and size of the vibration generating unit, the mounting position, etc. cannot be easily changed and adjusted, and the versatility is poor. For this reason, it may be difficult to perform wide cleaning according to reaction products that change depending on various film forming conditions.

The present invention has been made to solve the above-described problems, and easily suppresses clogging of a mesh in a vacuum pump of a semiconductor manufacturing apparatus by using a vibration generator that can be freely attached to and detached from a pipe. It is.

The detachable vibration generator according to the present invention comprises a vibration generator and a mounting structure for transmitting the vibration in the vibration generator and attaching the vibration generator to the pipe, so that the pipe can be freely attached to and detached from the pipe. It is a thing.

This invention reduces the clogging of the reaction products in the semiconductor manufacturing equipment by applying vibration to the piping, and enables the vibration source to be freely attached to and detached from the piping. It was assumed that optimization of the system could be easily performed.

It is a perspective view of the removable vibration generator in Embodiment 1 of this invention. They are the perspective view (a) of the aspect which opened the attachment port of the detachable vibration generator in Embodiment 1 of this invention, and the perspective view (b) of the aspect with which it attached to piping. It is the schematic which shows the aspect which attached the detachable vibration generator to the piping couple | bonded with the vacuum pump in the CVD apparatus which concerns on Embodiment 2 of this invention.

(Embodiment 1)
FIG. 1 shows a detachable vibration generator 1 according to Embodiment 1 for carrying out the present invention.

A detachable vibration generator 1 in FIG. 1 is provided in a mounting structure 5 for transmitting vibration generated by the vibration generating unit 3 and the vibration generating unit 3 and for attaching the vibration generating unit to a pipe. The fixing structure 7 is configured to prevent the mounting structure 5 from falling off the pipe.

The vibration generating unit 3 only needs to function as a vibration source by applying an electrical signal. For example, a well-known small vibrator or ultrasonic vibrator can be used. Among them, the use of the vibration frequency and amplitude (vibration intensity) that can be varied and adjusted by an electric signal can increase the versatility of the detachable vibration generator 1.

The attachment structure 5 has, for example, a cylindrical shape, and has an attachment port 13 that is opened when the pipe is attached to one side of the side surface portion, and the vibration generating portion 3 is provided on the outer peripheral portion of the side surface. . And since it is desirable for this attachment structure 5 to be transmitted to the attachment structure whole surface, without a vibration being attenuate | damped largely, use of stainless steel etc. is preferable, for example. In this case, for example, the stainless steel may be covered with a cover using a fluororesin sheet or the like as an exterior material, and generation of particles can be suppressed.

In addition, although it was set as the cylindrical form, it is good also as an aspect which makes it flat form before mounting | wearing to piping, and winds this around piping.

Further, the attachment structure 5 may be formed of a resin or the like, and in this case, the attachment structure 5 includes an installation part that can be accommodated or mounted for fixing the vibration generating part 3. Then, for example, a concave portion capable of accommodating the vibration generating portion 3 is provided as a structural portion on the outer peripheral surface of the side surface of the mounting structure 5, the vibration generating portion 3 is accommodated and fixed in the concave portion, and the concave portion is closed with resin or the like if necessary It may be.

Alternatively, when the attachment structure 5 is formed by a resin molding method, the attachment structure 5 may be integrally formed so as to incorporate the vibration generating portion 3. In addition, the position of the installation portion in the mounting structure 5, that is, the region where the vibration generating unit 3 is provided is preferably a portion facing the mounting opening 13 in order to transmit vibration evenly, but is not limited thereto. It is not a thing.

The fixing portion 5 includes a belt portion 9 whose end is fixed with a screw or the like on one side of the mounting structure 13 with the mounting port 13 interposed therebetween, and a buckle portion 11 fixed to the other side of the mounting port. The fixing part 5 composed of the belt part 9 and the buckle part 11 is excellent in durability against vibration by adopting, for example, a glass cloth material covered with an exterior material such as a fluororesin coat as the belt part 9. Particle generation can also be suppressed. The belt portion 9 in this example (FIG. 1) has two of these configurations.

The belt part and the buckle part are fixed to the attachment structure, respectively. However, the present invention is not limited to this. For example, the belt part and the buckle part are provided with a buckle part at the other end of the belt part. It is good also as what can be clamped and fixed. At that time, a guide may be provided in the mounting structure, and the belt portion may be passed through the guide.

FIG. 2 (a) shows an aspect in which the attachment opening is opened when attaching / detaching to / from the pipe of the detachable vibration generator 1 of Embodiment 1, and FIG. 2 (b) shows the detachable vibration generator. The mode at the time of attaching 1 to piping is shown.

Here, with reference to FIG. 1 and FIG. 2, the method of mounting | wearing the piping 41 with the detachable vibration generator 1 is demonstrated easily.

First, the detachable vibration generator 1 (see FIG. 1) is prepared, and the belt portion 9 that is the fixing portion 5 is removed from the buckle portion 11. Then, as shown in FIG. 2 (a), the pipe 41 is mounted on the pipe 41 so that the pipe 41 can be inserted into the cylindrical mounting structure 5 by widening the mounting port 13 of the detachable vibration generator 1. After the mounting, the belt portion 9 in the fixing portion 5 is fastened to the buckle portion 11 so that the detachable vibration generator 1 does not fall off, so that the mounting as shown in FIG.

Next, mounting of the detachable vibration generator 1 according to Embodiment 1 of the present invention on a CVD apparatus which is a semiconductor manufacturing apparatus will be described with reference to FIG.

FIG. 3 shows the structure of the reaction furnace 23 and its exhaust system in the CVD apparatus 21. Therefore, the illustration and description of the reaction gas introduction system, the wafer transfer system, and the control unit for controlling the entire apparatus are omitted.

A CVD apparatus 21 in FIG. 3 includes a reaction furnace 23, a quartz board 25 in which a plurality of semiconductor wafers are arranged (installed) in the reaction furnace 23 at regular intervals, and the reaction furnace 23 inside the reaction furnace 23. A film is formed on the wafer surface in the reaction furnace 23 by selecting various gases introduced into the reaction furnace 23 and adjusting the conditions (temperature, pressure, etc.). .

Further, the CVD apparatus 21 has a configuration of an exhaust system that is coupled to the reaction furnace 23 and exhausts a gas containing a reaction product generated in the reaction furnace 23 to the outside of the CVD apparatus 21. The exhaust system includes, in order from the reaction furnace 23 side, a gas cooler 29 that cools the high-temperature gas exhausted from the reaction furnace 23 to a constant temperature, a pressure gauge 31 that measures the pressure of the gas exhausted from the gas cooler 29, The valve 33 is configured to adjust the pressure of the gas passing through the pipe according to the measurement value of the pressure gauge 31, and the vacuum pump 35 is connected to the valve 33 and exhausts the gas to the outside of the CVD apparatus 21.

In the reaction furnace 23, the gas cooler 29, the valve 33, the vacuum pump 35, and the like, a pipe 41 is used to connect each other and allow gas to flow (flow).

As the vacuum pump 35, a combination of a booster pump 37 for making a high vacuum and a rotary pump 39 that operates from atmospheric pressure for roughing is combined by a pipe 41 is used. As for the connection relationship of the vacuum pump 35 by the piping 41, the intake (IN) side of the booster pump 37 and the valve 33, the exhaust (OUT) side, the intake (IN) side of the rotary pump 39, and the exhaust (OUT) of the rotary pump 39 The side and the exhaust duct outside the CVD apparatus are coupled to each other.

Further, mesh (filters) 37 a and 39 a are built in the respective intake (IN) sides of the booster pump 37 and the rotary pump 39.

The detachable vibration generator 1 is mounted on the suction (IN) side of the vacuum pump 35. In FIG. 3, the detachable vibration generator 1 is mounted on the intake (IN) side pipes of the booster pump 37 and the rotary pump 39 at positions close to the meshes 37 a and 39 a. In general, piping near a vacuum pump in a semiconductor manufacturing apparatus vibrates with the operation of the vacuum pump, but its amplitude is large, so there is no effect to reduce clogging of the mesh, so it is added to the piping by a vibration generator. In many cases, the vibration is preferably a slight vibration having a smaller amplitude than the vibration derived from the pump.

Each of the detachable vibration generators 1 is electrically connected to a vibration device power supply / control device section 43 by a power supply / control signal wiring 45. The operating state of the detachable signal generator 1 can be controlled by the vibration device power supply / control device unit 43. For example, the operating state of the device that generates the reaction product (predetermined time, etc.) The detachable signal generator 1 can be operated so as to apply vibration to the pipe.

As described above, by first making the vibration generating device attachable / detachable to / from the piping, for example, it becomes easy to change the mounting position and vibration conditions of the removable vibration generating device according to the characteristics of the reaction product. This makes it possible to operate the semiconductor device efficiently.

Moreover, it is easy to attach a vibration generator to each of the rotary pump and the booster pump, and a great effect can be obtained in reducing the adhesion of the reaction product to the mesh.

In addition, since it is easy to attach a plurality of vibration generators to one pipe, a synergistic effect in a plurality of combinations can be expected.

Furthermore, since the detachable vibration generator 1 can be freely attached to and detached from the pipe, its mounting position and the characteristics of the vibration generator to be mounted can be easily changed, so that various combinations are possible so that the mesh is not clogged. It is possible to find the optimum vibration conditions, and in that case, the mesh can be made unnecessary, so that the non-operation time of the device accompanying the cleaning work of the mesh is eliminated, and a significant improvement in production efficiency can be expected. Become.

DESCRIPTION OF SYMBOLS 1 Detachable vibration generator, 3 Vibration generating part, 5 Mounting structure, 7 Fixing part,
9 belt part, 11 buckle part, 13 attachment port, 21 CVD apparatus,
23 reactor, 25 quartz board, 27 heater, 29 gas cooler,
31 Pressure gauge, 33 valve, 35 vacuum pump, 37 booster pump,
39 Rotary pump, 37a, 39a Mesh (filter), 41 Piping,
43 Power supply / control unit for vibration device, 45 Power supply / signal wiring

Claims (6)

A detachable vibration comprising a vibration generating part and an attachment structure for transmitting the vibration in the vibration generating part and attaching the vibration generating part to a pipe, and can be freely attached to and detached from the pipe. Generator. The detachable vibration generator according to claim 1, wherein the attachment structure has a cylindrical shape and has a mounting opening on a side surface thereof. The detachable vibration generator according to claim 1, further comprising a fixing portion provided in the mounting structure. It is a semiconductor manufacturing apparatus provided with the reaction furnace, the vacuum pump, and the piping which couple | bonds between the said reaction furnace and the said vacuum pump, Comprising: The detachable vibration in any one of Claims 1-3 in the said piping A semiconductor manufacturing apparatus equipped with a generator. A semiconductor manufacturing apparatus comprising a reaction furnace, a vacuum pump, and a pipe connecting between the reaction furnace and the vacuum pump, the vacuum pump comprising a booster pump and a rotary pump, and between these two pumps A semiconductor manufacturing apparatus, further comprising a pipe to be coupled, wherein the detachable vibration generator according to any one of claims 1 to 3 is attached to at least one of the pipes. The semiconductor manufacturing apparatus according to claim 4, wherein the semiconductor manufacturing apparatus is a CVD apparatus.

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