JP2016123999A5 - - Google Patents

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Publication number
JP2016123999A5
JP2016123999A5 JP2014265959A JP2014265959A JP2016123999A5 JP 2016123999 A5 JP2016123999 A5 JP 2016123999A5 JP 2014265959 A JP2014265959 A JP 2014265959A JP 2014265959 A JP2014265959 A JP 2014265959A JP 2016123999 A5 JP2016123999 A5 JP 2016123999A5
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JP
Japan
Prior art keywords
solvent
ether
heating method
rapid heating
glycol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014265959A
Other languages
English (en)
Japanese (ja)
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JP2016123999A (ja
JP6160608B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2014265959A external-priority patent/JP6160608B2/ja
Priority to JP2014265959A priority Critical patent/JP6160608B2/ja
Priority to EP15873026.7A priority patent/EP3238872A4/en
Priority to CN201580071189.6A priority patent/CN107107277B/zh
Priority to US15/539,301 priority patent/US20170355042A1/en
Priority to PCT/JP2015/085730 priority patent/WO2016104458A1/ja
Priority to KR1020177020529A priority patent/KR20170097764A/ko
Priority to TW104143517A priority patent/TWI661890B/zh
Publication of JP2016123999A publication Critical patent/JP2016123999A/ja
Publication of JP2016123999A5 publication Critical patent/JP2016123999A5/ja
Priority to PH12017501161A priority patent/PH12017501161B1/en
Publication of JP6160608B2 publication Critical patent/JP6160608B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014265959A 2014-12-26 2014-12-26 急加熱工法用フラックス及び急加熱工法用ソルダペースト Active JP6160608B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2014265959A JP6160608B2 (ja) 2014-12-26 2014-12-26 急加熱工法用フラックス及び急加熱工法用ソルダペースト
EP15873026.7A EP3238872A4 (en) 2014-12-26 2015-12-21 Flux for fast-heating method, and solder paste for fast-heating method
CN201580071189.6A CN107107277B (zh) 2014-12-26 2015-12-21 急加热方法用助焊剂及急加热方法用焊膏
US15/539,301 US20170355042A1 (en) 2014-12-26 2015-12-21 Flux for Rapid Heating Method and Solder Paste for Rapid Heating Method
PCT/JP2015/085730 WO2016104458A1 (ja) 2014-12-26 2015-12-21 急加熱工法用フラックス及び急加熱工法用ソルダペースト
KR1020177020529A KR20170097764A (ko) 2014-12-26 2015-12-21 급가열 공법용 플럭스 및 급가열 공법용 솔더 페이스트
TW104143517A TWI661890B (zh) 2014-12-26 2015-12-24 急加熱工法用助焊劑及急加熱工法用軟焊膏
PH12017501161A PH12017501161B1 (en) 2014-12-26 2017-06-20 Flux for fast-heating method, and solder paste for fast-heating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014265959A JP6160608B2 (ja) 2014-12-26 2014-12-26 急加熱工法用フラックス及び急加熱工法用ソルダペースト

Publications (3)

Publication Number Publication Date
JP2016123999A JP2016123999A (ja) 2016-07-11
JP2016123999A5 true JP2016123999A5 (https=) 2017-06-01
JP6160608B2 JP6160608B2 (ja) 2017-07-12

Family

ID=56150476

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014265959A Active JP6160608B2 (ja) 2014-12-26 2014-12-26 急加熱工法用フラックス及び急加熱工法用ソルダペースト

Country Status (8)

Country Link
US (1) US20170355042A1 (https=)
EP (1) EP3238872A4 (https=)
JP (1) JP6160608B2 (https=)
KR (1) KR20170097764A (https=)
CN (1) CN107107277B (https=)
PH (1) PH12017501161B1 (https=)
TW (1) TWI661890B (https=)
WO (1) WO2016104458A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6895213B2 (ja) * 2017-03-27 2021-06-30 株式会社タムラ製作所 はんだ組成物および電子基板の製造方法
CN107442970A (zh) * 2017-08-10 2017-12-08 东北大学 低温焊膏用免清洗助焊剂及其制备方法
JP6338007B1 (ja) * 2017-11-02 2018-06-06 千住金属工業株式会社 フラックス及びソルダペースト
JP7111957B2 (ja) 2018-06-14 2022-08-03 日亜化学工業株式会社 半導体装置及びその製造方法
CN108655606B (zh) * 2018-08-02 2021-03-02 烟台艾邦电子材料有限公司 一种低熔点smt焊锡膏的配方及其制备方法
WO2021043708A1 (en) * 2019-09-06 2021-03-11 Henkel Ag & Co. Kgaa Solder alloy and solder paste containing said alloy
JP6993594B2 (ja) * 2020-03-27 2022-02-04 千住金属工業株式会社 フラックス及びソルダペースト
CN116981541B (zh) * 2021-03-12 2024-11-19 千住金属工业株式会社 助焊剂和电子设备的制造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01148488A (ja) * 1987-12-02 1989-06-09 Senju Metal Ind Co Ltd クリームはんだ
JPH084953B2 (ja) * 1991-04-17 1996-01-24 ユーホーケミカル株式会社 フラックス又ははんだペースト用腐食防止剤
JPH07290277A (ja) * 1994-04-25 1995-11-07 Nippon Genma:Kk フラックス
JPH08332592A (ja) * 1995-06-05 1996-12-17 Nippon Genma:Kk はんだボールの少ないクリームはんだ
US6217671B1 (en) * 1999-12-14 2001-04-17 International Business Machines Corporation Composition for increasing activity of a no-clean flux
JP3423930B2 (ja) * 1999-12-27 2003-07-07 富士通株式会社 バンプ形成方法、電子部品、および半田ペースト
US7767032B2 (en) * 2006-06-30 2010-08-03 W.C. Heraeus Holding GmbH No-clean low-residue solder paste for semiconductor device applications
JP6088204B2 (ja) * 2012-10-29 2017-03-01 株式会社タムラ製作所 はんだ組成物

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