JP2016117937A - Heating type vaporization device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To stabilize a large flow rate output of a material gas while maintaining compactness in a continuous type vaporization device 100.SOLUTION: The vaporization device includes: a vaporization tank 11 having a vaporization chamber 11a and deriving the material gas generated by a liquid material that is vaporized by being introduced into the vaporization chamber 11a; a heater 121 for heating the vaporization tank 11 to promote vaporization of the liquid material inside the vaporization chamber 11a; and multiple heat conductors 5 protruding from an internal wall surface of the vaporization chamber 11a.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a heating type vaporizer for gasifying a liquid semiconductor material.

  Some semiconductor materials are liquid at room temperature, such as those not containing CFCs. In the semiconductor manufacturing system, when such a liquid semiconductor material is used, a heating type vaporizer that heats and gasifies the material may be used.

Typical vaporizers in this application include a storage type that stores a sufficient amount of material required for a given process in a vaporization tank and vaporizes it to output a material gas. A continuous introduction type in which a liquid material is vaporized while continuously or intermittently introduced into a tank and output as a material gas can be mentioned.
In the storage type, it is only necessary to store a sufficient amount of liquid material in the vaporization tank, so that a complicated flow path structure and valve control for introducing the liquid material are not required. Even if the heating temperature of the tank is controlled, not so fast response is required. Therefore, the storage-type vaporizer has the merit that a stable and large flow rate output of the material gas is easy. On the other hand, there is a demerit that the vaporization tank tends to be large and it is difficult to make it compact.

On the other hand, the continuous introduction type has a demerit that although it is possible to reduce the size of the vaporizing tank, it is difficult to output a material gas stably and with a large flow rate. Because it is necessary to introduce new liquid materials one after another by the amount that is vaporized and output in the vaporization tank, and it is necessary to control the introduction amount of the liquid material to the vaporization tank. This is because the change of the liquid material in the vaporizing tank becomes more severe as the flow rate becomes larger, so that the temperature control is also required to be quick.
In particular, the problem of rapid response of temperature control can occur not only in the storage type.

JP 2004-157719 A

  The present invention has been made in view of the above problems, and is intended to enable a stable and large flow rate output of a material gas while maintaining compactness in a vaporizer used in a semiconductor manufacturing apparatus or the like. It is a thing.

  That is, the vaporizing tank according to the present invention has a vaporizing chamber heated by a heater, and the liquid material introduced into the vaporizing chamber is heated to derive the vaporized material gas. A plurality of heat conductors protruding from the inner wall surface are provided.

  If this is the case, the heat from the heater is efficiently transferred to the liquid material by multiple thermal conductors. Therefore, the liquid material is introduced into the compact vaporization chamber one after another, and the replacement speed of the liquid material is increased to increase the flow rate. Even when the temperature is reduced, the liquid material can be quickly heated and maintained at the vaporization promoting temperature so as to cancel the temperature drop caused thereby, and the compactness and the large flow rate, which are the problems of the present invention, can be achieved at the same time. .

  In order to facilitate the manufacture, the main body has a block shape in which a bottomed hole that opens in a predetermined surface is formed, and a lid that closes the opening of the bottomed hole. Preferably, the vaporization chamber is formed by an inner surface and a back surface of the lid, and the heat conductor projects from the inner surface of the bottomed hole or the back surface of the lid.

  In order to shorten the manufacturing process so that the heat conductor is formed at the same time while forming the bottomed hole, the body is formed by drilling a plurality of portions on one surface of a predetermined block material. A hole is preferably formed, and the remaining wall portion formed between the holes is configured to function as the heat conductor.

  In order to more efficiently transfer the heat from the heater to the liquid material, it is desirable that the wall forming the vaporizing chamber is configured so that a heater for heating the liquid material can be embedded.

  The vaporizer according to the present invention includes a vaporization chamber, a vaporization tank for deriving a material gas generated by vaporization of the liquid material introduced into the vaporization chamber, and heating the vaporization tank. A heater for promoting the vaporization of the liquid material in the vaporization chamber and a plurality of heat conductors protruding from the inner wall surface of the vaporization chamber are provided.

  Further, the vaporizer according to the present invention includes the vaporizer, a liquid level sensor that detects a liquid level of the liquid material stored in the vaporization chamber, and a liquid material introduction channel that communicates with the vaporization chamber. And a control mechanism for controlling the flow rate adjusting valve so that the liquid level detected by the liquid level sensor is within a predetermined target range.

  In order to stably supply a large flow rate of material gas in a compact vaporization chamber, not only temperature control, but also the introduction of a liquid material that matches the amount derived as material gas, as described above, to the vaporization chamber. Is desirable.

  In order to realize this inexpensively without imposing a burden on the control system, the first lower space into which the liquid material is first introduced and the liquid material overflowing from the first lower space are provided in the lower space of the vaporization chamber. It is preferable to provide a partition wall that partitions into the second lower space to be introduced, and to set the liquid surface height at which the liquid material overflows into the second lower space within the predetermined target range or above it. It is.

  This is because the liquid material that first flows into the first lower space overflows from the partition wall into the second lower space, and the liquid level is kept almost constant for a while, and the liquid level is Since the liquid level is set within or above the target liquid level height range, the liquid level can be controlled by the control mechanism by using this time, and the response of the control mechanism is forcibly increased. This is because the liquid material amount (particularly the liquid level) in the vaporization chamber can be maintained at an appropriate value.

  According to the present invention configured as described above, the heat from the heater is efficiently transferred to the liquid material by the plurality of heat conductors. Therefore, the liquid material having a large flow rate is introduced continuously or intermittently into the compact vaporization chamber. However, the liquid material can be quickly heated and maintained at the vaporization promoting temperature so as to cancel the temperature drop caused thereby. Therefore, in the continuous introduction type vaporizer or the like, the material gas can be stably output at a large flow rate while maintaining compactness.

The schematic diagram which shows the whole structure of the vaporization apparatus in one Embodiment of this invention. The perspective view which shows the vaporization tank in the same embodiment. The top view which shows the main body of the vaporization tank in the embodiment. The right view which shows the main body of the vaporization tank in the embodiment. AA line sectional view in FIG. BB sectional drawing in FIG. The perspective view which shows the preheating tank in the same embodiment. The front view which shows arrangement | positioning structures, such as a vaporizer, a preheater, and a flow control valve, in the vaporization apparatus of the embodiment.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

(1) Outline of Vaporization Apparatus 100 According to the Present Embodiment The vaporization apparatus 100 according to the present embodiment is incorporated into, for example, a semiconductor manufacturing system and supplies a material gas having a predetermined flow rate to the process chamber. As shown, the vaporizer 1 that vaporizes the introduced liquid material and outputs the material gas, the preheater 2 that preheats the liquid material and introduces it into the vaporizer 1, and the preheater 2 An introduction amount control mechanism 3 that controls the flow rate of the liquid material introduced into the vaporizer 1 and a mass flow controller 7 that is connected to the output port of the vaporizer 1 and controls the mass flow rate of the material gas are provided. .
Next, each part of the vaporizer 100 will be described.

(2) Configuration of Vaporizer 1 As shown in FIG. 1, the vaporizer 1 has a vaporization tank 11 having a vaporization chamber 11a therein and a liquid material temperature in the vaporization chamber 11a. And a vaporization chamber temperature control mechanism 12 for controlling the vaporization chamber so as to maintain a predetermined vaporization acceleration temperature.

  As shown in FIGS. 2 to 5, the vaporizing tank 11 is provided with the vaporizing chamber 11 a inside a metal body having a long block shape (more specifically, a rectangular parallelepiped shape) and orthogonal to the longitudinal direction thereof. One end face is opened with an introduction port 11b for introducing a liquid material into the vaporizing chamber 11a and an outlet port 11c for extracting a material gas from the vaporizing chamber 11a. The vaporizing tank 11 is arranged in such a manner that the longitudinal direction is horizontal and the outlet port 11c is positioned above the introduction port 11b, and is introduced from the introduction port 11b into the space below the vaporization chamber 11a. The liquid material thus stored is stored, and the upper space is filled with the material gas vaporized from the liquid material and output from the outlet port 11c.

  As shown in FIG. 1, the vaporization chamber temperature control mechanism 12 includes a heater 121 attached to the vaporization tank 11, a temperature sensor 123 that directly or indirectly measures the temperature of the vaporization chamber liquid material, and the temperature sensor. The heater control circuit 122 for controlling the heater 121 is provided so that the temperature measured by the temperature 123 is the vaporization acceleration temperature. The heater 121 has a rod-like shape, and is inserted into a heater hole 11d that opens in the other end surface of the vaporizing tank 11 and extends in the longitudinal direction, as shown in FIG.

(3) Configuration of Preheater 2 As shown in FIG. 1 and FIG. 7, the preheater 2 has a preheating tank 21 having a preheating chamber 21a therein, and promotes the vaporization of the liquid material temperature in the preheating chamber 21a. A preheating chamber temperature control mechanism 22 that controls to maintain a predetermined preheating temperature lower than the temperature is provided. As described above, the preheated liquid material is led to the vaporizer 1.

  Like the vaporization tank 11, the preheating tank 21 is provided with the preheating chamber 21a inside a metal body having a long block shape (more specifically, a rectangular parallelepiped shape), and on one end surface orthogonal to the longitudinal direction thereof. An introduction port 21b for introducing a liquid material into the preheating chamber 21a and an outlet port 21c for extracting the preheated liquid material from the preheating chamber 21a are opened.

  As shown in FIG. 7, the preheating tank 21 is arranged such that the longitudinal direction is the horizontal direction and the outlet port 21c is located above the introduction port 21b. The preheating chamber 21a has a plurality (four in this case) of extending flow passages 21d to 21g extending along the longitudinal direction, and ends thereof so that the extending flow passages 21d to 21g are connected in series. It is comprised from the connection flow paths 21h-21j which connect. The starting end of the extending flow path 21d positioned at the most upstream is the introduction port 21b, and the end of the extending flow path 21g positioned at the most downstream is the leading-out port 21c. These extending flow paths 21d to 21g are arranged such that the upstream one is positioned above the downstream one. This is because even if the liquid material is vaporized in the preheating chamber 21a and becomes a material gas, the material gas does not naturally move toward the outlet port 21c and remain in the preheating chamber 21a. It is.

  As shown in FIG. 1, the preheating chamber temperature control mechanism 22 includes a second heater 221 attached to the preheating chamber 21a, a temperature sensor 223 that directly or indirectly measures the temperature of the liquid material in the preheating chamber, A second heater control circuit 222 for controlling the second heater 221 is provided so that the temperature measured by the temperature sensor 223 is the preheating temperature. The second heater 221 is rod-shaped and is inserted into a second heater hole 21k that opens in the center of the other end face of the preheating tank 21 and extends in the longitudinal direction, as shown in FIG. is there. The extending flow paths 21d to 21g are arranged so as to surround the second heater hole 21k as viewed from the end face. This is to transmit the heat generated by the second heater 221 to the liquid material in the preheating chamber 21a very efficiently. Further, in this embodiment, the most downstream extending flow path 21g and the most upstream extending flow path 21d are arranged so as to face each other with the second heater hole 21k interposed therebetween. This is possible because the liquid material in the most downstream extending flow path 21g having the highest temperature is affected by the liquid material in the most upstream extending flow path 21d having the lowest temperature and the temperature is lowered. This is to prevent it.

(4) Configuration of Introduction Amount Control Mechanism 3 As shown in FIG. 1, the introduction amount control mechanism 3 includes a flow rate adjustment valve 31 provided on a connection flow path between a preheating tank 21 and a vaporization tank 11, and the vaporization. A liquid level sensor 32 as liquid material detection means for detecting the amount of liquid material stored in the chamber 11a, and the flow rate adjusting valve 31 so that the amount of liquid material detected by the liquid level sensor 32 falls within a predetermined target range. And a valve control circuit 33 for controlling the flow rate of the liquid material introduced into the vaporizing tank 11 by driving the.

  The flow regulating valve 31 has a cylindrical shape including a laminated piezo element (not shown) and a valve main body driven by the laminated piezo element, and is ON only taking a binary value of full open / full close. / OFF open / close valve type. In this embodiment, as shown in FIG. 8, the flow rate adjusting valve 31, the vaporizing tank 11, and the preheating tank 21 are placed in a posture in which the longitudinal direction is horizontal, and then the plate-like block body 4 that stands up. It is mounted side by side on one side. The plate-like block body 4 communicates the internal flow path, that is, the first flow path 4 a for supplying the liquid material to the introduction port 21 b of the preheating tank 21, the outlet port 21 c of the preheating tank 21, and the flow rate adjustment valve 31. The second flow path 4b to be made, the third flow path 4c for connecting the flow rate adjusting valve 31 and the introduction port 11b of the vaporizing tank 11 and the fourth flow path for outputting the vaporized material gas from the outlet port 11c of the vaporizing tank 11 It should also be called a manifold block in which 4d is formed. In this way, the plate-like block body 4 in which the internal flow paths 4a to 4d are formed is erected, and the pre-heating tank 21, the flow rate adjusting valve 31 and the vaporizing tank 11 which are respectively placed in a horizontal posture are lowered on the plate-like block body 4. Therefore, it is designed to be compact as a structure attached in this order.

  The liquid level sensor 32 is, for example, a float type sensor that detects the liquid level of the liquid material stored in the vaporizing chamber 11a. Here, as shown in FIG. It is attached by being inserted downward from the wall surface.

  More specifically, the valve control circuit 33 receives an output from the liquid level sensor 32, and the liquid level detected by the liquid level sensor 32 exceeds a predetermined target liquid level height range. In other words, when the flow rate adjustment valve 31 is closed and falls below the target liquid level height range, the flow rate adjustment valve 31 is operated intermittently to open the flow rate adjustment valve 31. In addition, the target liquid level height range may have a width | variety or one point.

  By the way, the valve control circuit 33 is physically provided as an integrated electric circuit together with the heater control circuit 122 and the second heater control circuit 222 as shown in FIG. The electric circuit includes, for example, a digital electronic circuit including a CPU, a memory, a communication port, and the like, and an analog electronic circuit including an ADC, a DAC, an amplifier, a buffer, and the like, and a predetermined program stored in the memory Accordingly, the peripheral circuit operates to perform the functions as the valve control circuit 33, the heater control circuit 122, the second heater control circuit 222, etc. described above.

(4) Configuration of Mass Flow Controller 7 Although not shown in detail, the mass flow controller 7 is, for example, a differential pressure type connected to the outlet port 11c of the vaporizer 1, and has a differential pressure before and after a fluid resistance element (not shown). The mass flow rate of the material gas output from the vaporizer 1 is controlled by controlling the flow rate adjusting valve provided inside so as to be the target value, that is, the target mass flow rate.

(5) Characteristic Configuration of the Vaporizer 100 In this embodiment, the vaporization tank 11 has the following characteristic structure.

  The first feature point is that, as shown in FIGS. 2, 3, and 5, a plurality of heat conductors 5 that integrally project from the inner wall surface (here, the bottom surface) are provided in the space below the vaporization chamber 11a. In the point.

  The vaporizing tank 11 in this embodiment includes a block-shaped main body 111 having a bottomed hole 11h that opens on a predetermined surface (the upper surface in this case) along the longitudinal direction, and an opening of the bottomed hole 11h. The lid 112 is formed in a plate shape that forms the vaporization chamber 11a by being closed.

  The first lower space 11e and the upper space of the bottomed hole 11h are formed, for example, by drilling a plurality of upper surfaces of a metal block material in a vertical and horizontal matrix shape with a drill. Here, the perforations 11g all have the same diameter, and the perforation pitch is slightly larger than the perforation diameter. As a result, when a drill is drilled, an uncut portion remains between the holes 11g. In this embodiment, a portion of the uncut portion is cut to extend in the short side direction as viewed from above and along the longitudinal direction. A plurality of remaining wall portions 5 arranged at equal intervals are formed.

  These remaining wall portions 5 serve as the heat conductor 5 described above. The upper end height of the heat conductor 5 as the remaining wall portion is made lower than the opening surface of the bottomed hole 11h so that the heat conductor 5 does not reach the space above the vaporizing chamber 11a. It is. This ensures the gas flowability in the upper space. In addition, each heat conductor 5 is configured to be separated from the inner side surface of the bottomed hole 11h so that the liquid material can be stored in the entire first lower space 11e without any delay.

  In this embodiment, the number of the perforations 11g arranged in the short direction is three, and the depth of the central perforation 11g is shallower than the depth of the perforations 11g at both ends. This is because the heater hole 11d into which the heater 121 described above is inserted is formed in the lower region of the central hole 11g.

  On the other hand, the partition wall 6 extends in the short direction and is configured such that each end thereof is continuous with the inner surface of the bottomed hole 11h when viewed from above, and the upper end height of the partition wall 6 is the introduction amount control mechanism 3. Is set to be close to or above the upper limit of the target liquid level height range.

  Note that the upper end height of the remaining wall portion 5 is set to be the same as or slightly lower than the upper end height of the partition wall 6. The introduction port 11b is set at a position lower than the upper end height of the partition wall 6, and the derivation port 11c is higher than the upper end height of the partition wall 6 and the target liquid level height range. It is set at a position higher than the upper limit.

(5) Description of Operation of Vaporizer 100 Next, the operation of the vaporizer 100 configured as described above will be described.
After being introduced into the preheating tank 21 and preheated, the liquid material introduced into the vaporizing tank 11 and stored therein is heated and vaporized to become a material gas. This material gas is continuously output from the outlet port 11c of the vaporizing tank 11 while the flow rate is controlled by the mass flow controller downstream thereof.

  On the other hand, the liquid material in the vaporization chamber 11a gradually decreases due to the output of the material gas, and its liquid level height decreases, but when the liquid level sensor falls below the target liquid level height range, The introduction amount control mechanism 3 detects and opens the flow rate adjustment valve 31. Then, the liquid material flows into the vaporizing chamber 11a and the liquid level rises. When the liquid level exceeds the predetermined target range (contains within the predetermined target range), the introduction amount control mechanism 3 detects this. The flow rate adjustment valve 31 is closed.

  As described above, the material gas is continuously output from the vaporizing chamber 11a while the liquid material is intermittently introduced into the vaporizing chamber 11a. In addition, during this time, the temperature of the liquid material in the vaporizing chamber 11a is controlled by the vaporizing chamber temperature control mechanism 12 to maintain a predetermined vaporization promoting temperature at which vaporization is promoted.

(6) Effects of the vaporizer 100 However, according to the liquid material continuous introduction type vaporizer 100 according to the present embodiment, as described above, the heat conductor 5 that protrudes integrally from the inner wall into the vaporization chamber 11a. Are provided so that the heat from the heater 121 can be efficiently transferred to the liquid material, so that even if a large amount of liquid material is introduced into the compact vaporization chamber 11a one after another and the replacement speed of the liquid material is increased, The liquid material can be quickly heated and maintained at the vaporization promoting temperature so as to cancel out the temperature drop due to, and stable output of the material gas at a large flow rate is possible. In particular, in the present embodiment, the heat conductor 5 uses a remaining wall portion due to perforation, and its cross-sectional shape is an irregular shape with irregularities, so the surface area is very large and extremely efficient heat conduction. If possible.

  In addition, the fact that the heater 121 is embedded in the metal wall forming the vaporization tank 11 (inserted into the heater hole 11d) also allows the heat from the heater 121 to be efficiently transmitted. The effect will be promoted. In addition, the point that the preheater 2 is provided before the vaporizer 1 can also contribute to stable output at a large flow rate of the material gas. This is because the temperature fluctuation when the liquid material flows into the vaporizing chamber 11a is reduced, and the temperature of the liquid material in the vaporizing chamber 11a can be easily maintained.

  On the other hand, in order to stably output a large flow rate of material gas while reducing the size of the vaporization chamber, it is necessary to introduce a large flow rate of liquid material into the vaporization chamber. Necessary. That is, since the liquid level height fluctuation speed of the liquid material in the vaporization chamber becomes large, simply not increasing the response speed of the introduction amount control mechanism including the liquid level sensor, the control circuit, the flow rate adjusting valve, etc. The introduction amount control mechanism cannot catch up with the fluctuation speed of the liquid level, and there may be a problem that the liquid material that is not vaporized overflows from the outlet port. In particular, since the rising speed of the liquid level is considerably increased, the control speed response to this is particularly important.

  On the other hand, according to the present vaporizer 100, the liquid material that first flowed into the first lower space 11e of the vaporization chamber 11a overflows from the partition wall 6 and flows into the first lower space 11f. In addition to keeping the liquid level constant during this time, the vicinity of this liquid level is set at a position slightly higher than the upper limit of the target liquid level height range. The liquid material amount (particularly the liquid surface height) in the vaporization chamber 11a is appropriately set by using the time during which the liquid surface height is kept substantially constant without forcibly increasing the response of the amount control mechanism 3. The value can be controlled sufficiently.

  Therefore, it is not necessary to use an expensive liquid level sensor 32 with good response speed and sensing performance, and an inexpensive on / off on / off valve can be used for the flow rate adjustment valve 31. The expected performance can be achieved.

  Further, every time the liquid material is filled, the liquid material overflows in the second lower space 11f. When the overflowed liquid material remains and accumulates as it is, the second lower space 11f eventually becomes the liquid material. Will be satisfied. If this state appears once, then the liquid material cannot flow from the first lower space 11e over the partition wall 6 into the second lower space 11f, and the second It is conceivable that the aforementioned function of gaining control time of the flow rate adjusting valve 31 cannot be achieved by keeping the liquid level constant by overflowing into the lower space 11f.

  However, since the liquid material is vaporized, the liquid material is refilled, reaches the upper end of the partition wall 6, and again overflows into the second lower space 11f. Since the liquid material overflowing into the gas is almost evaporated, the above-mentioned problem does not occur. In other words, the liquid material that has been refilled, gets over the partition wall 6 and overflows the second lower space 11f again, and the liquid material that overflows the second lower space 11f in the previous cycle does not vaporize. Thus, it is necessary to set the introduction amount of the liquid material, the liquid area of the second lower space 11f, and the like.

(6) Modifications The present invention is not limited to the above embodiment.
For example, the heat conductor may protrude from an arbitrary part of the vaporization chamber wall. Similarly to the above-described embodiment, considering the ease of manufacture, for example, the heat conductor may be integrally protruded from the back surface of the lid.

  In the above embodiment, the remaining wall portion by the perforations 11g is the heat conductor 5, but the shape of the heat conductor is not limited to this. In addition, the manufacturing method of the heat conductor may be etching, die, special processing (laser processing, electric discharge processing), forging, casting or the like in addition to the cutting processing. Furthermore, in the above embodiment, the drilling diameter was the same, but the drilling diameter was varied, drilled with a thin warp drill, and drilled with a shallower depth drill in sequence, with the depth being shallower, and so on You may form the step-shaped heat conductor which becomes thin.

The heater may be of a type that covers the surroundings without being embedded in the vaporizing tank.
The flow rate adjusting valve is not limited to an ON / OFF opening / closing valve, but may be of a type whose opening degree changes continuously.

  In addition, for example, an extended portion extending further upward from the upper end of the partition wall may be provided. In that case, a hole may be formed in the extended portion so that the liquid material overflows from the first lower space to the second lower space at the same height as in the above embodiment.

  In addition, although the float type sensor is used as the liquid level sensor in the above embodiment, a heat capacity type (for example, a resistor through which a constant current is passed becomes a sensor body, and the resistor generates heat at a temperature higher than that of the surrounding environment, for example. When the resistor is in a gas and when it is immersed in a liquid, the temperature of the resistor changes due to the difference in specific heat between the two, and the resulting change in resistance value determines the liquid level height. Various types such as an ultrasonic type, a capacitance type, a pressure type, and a vibration type can be used.

Further, a second liquid level sensor is provided to detect that the liquid level in the vaporization chamber has approached the vicinity of the outlet port beyond the target liquid level height range and the upper end height of the partition wall. Then, when the liquid level detected by the second liquid level sensor approaches to the vicinity of the outlet port, the emergency stop mechanism that closes the flow rate adjustment valve that introduces the liquid material into the vaporization chamber and notifies that the emergency stop has occurred. May be provided. By configuring in this way, it is possible to reliably prevent the overflow of the liquid material that does not evaporate even in an unexpected situation (for example, failure of the liquid level sensor).
In addition, it goes without saying that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention.

DESCRIPTION OF SYMBOLS 100 ... Vaporizer 1 ... Vaporizer 11 ... Vaporizing tank 111 ... Main body 112 ... Cover body 121 ... Heater 11a ... Vaporization chamber 11e ... First lower space 11g ... perforation 11f ... second lower space 11h ... bottomed hole 3 ... control mechanism (introduction amount control mechanism)
31 ... Flow rate adjusting valve 32 ... Liquid level sensor 5 ... Thermal conductor

Claims (7)

A vaporizing tank that has a vaporizing chamber heated by a heater, and derives a material gas vaporized by heating the liquid material introduced into the vaporizing chamber;
A vaporizing tank comprising a plurality of heat conductors protruding from an inner wall surface of the vaporizing chamber. A main body having a block shape in which a bottomed hole that opens in a predetermined surface is formed; and a lid that closes the opening of the bottomed hole; and the inner surface of the bottomed hole and the back surface of the lid Configured to form a vaporization chamber,
2. The vaporizing tank according to claim 1, wherein the heat conductor protrudes from an inner surface of the bottomed hole or a rear surface of the lid. The main body is formed with the bottomed hole by drilling a plurality of places on one surface of a predetermined block material,
The vaporization tank according to claim 2, wherein a remaining wall portion formed between the perforations functions as the heat conductor.   2. The vaporizing tank according to claim 1, wherein the wall forming the vaporizing chamber is configured to embed a heater for heating the liquid material. A vaporizing tank for deriving a material gas generated by vaporizing the liquid material introduced into the vaporizing chamber, and having a vaporizing chamber;
A heater that heats the vaporizing tank and promotes vaporization of the liquid material in the vaporizing chamber;
A vaporizer comprising a plurality of heat conductors protruding from an inner wall surface of the vaporization chamber. A vaporizer according to claim 5;
A liquid level sensor for detecting a liquid level height of the liquid material stored in the vaporization chamber;
A flow rate adjusting valve provided on a liquid material introduction channel communicating with the vaporization chamber;
A vaporizing apparatus comprising: a control mechanism for controlling the flow rate adjusting valve so that a liquid level detected by the liquid level sensor falls within a predetermined target range. A partition wall that partitions the lower space of the vaporization chamber into a first lower space into which liquid material is first introduced and a second lower space into which liquid material overflowing from the first lower space is introduced;
The vaporization apparatus according to claim 6, wherein a liquid surface height at which a liquid material overflows into the second lower space is set within or above the predetermined target range.