JP2016111189A - Method of manufacturing printed wiring board and metal film with metal foil for use therein - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent harmful effect of fine powder scattering from a support plate, when sticking a metal film with a carrier metal foil to the support plate used at the time of manufacturing a printed wiring board.SOLUTION: In a metal laminate that is stuck to the surface of a support plate 18a for use in manufacturing of a printed wiring board, a carrier metal foil 18a is stuck to the first surface 10a of a metal film 10 having a second surface 10b to which a protective film 20 is bonded. This metal laminate is stuck to the support plate, and the protective film is peeled before a conductor layer is patterned.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method for manufacturing a printed wiring board in which one surface is exposed to a resin insulating layer and a wiring layer is embedded. More specifically, the present invention relates to a printed wiring board manufacturing method capable of improving the reliability of a printed wiring board in which a wiring layer is embedded, and a metal film with a metal foil attached to a support plate used therefor.

  In recent years, electronic components such as ICs have become highly functional and highly integrated, and the number of electrode pads has become extremely large. On the other hand, as electronic devices become lighter, thinner, and smaller, electronic components such as ICs are required to be further miniaturized. For this reason, there is a demand for a reduction in height to reduce the thickness of the multilayer wiring board. Further, as the density is increased, the width of the wiring layer is reduced, and the adhesion with the resin insulating layer is also reduced. For this reason, it is considered that the wiring layer is embedded in the resin insulating layer to make it low in height and the contact area with the resin insulating layer is increased to ensure adhesion. It is also considered that the wiring layer is formed only on one surface of the resin insulating layer and only the conductor post connected to the wiring layer on the one surface side is exposed on the other surface side.

  On the other hand, Patent Document 1 discloses that a wiring layer is embedded in a resin insulating layer by a transfer method.

Japanese Patent Laid-Open No. 10-173316

  As a method of embedding the wiring layer in the resin insulating layer, a method in which a metal film with a carrier metal foil is pasted on a support plate, and after the wiring pattern is formed on the metal film, the whole is covered with the resin insulating layer can be considered. . However, when a metal film with a carrier metal foil is attached to the support plate, fine powder may be scattered from the support plate and adhere to the surface of the metal film. If fine powder such as an insulator adheres to the surface of the metal film, a part of the wiring pattern may be lost or short-circuited when a wiring layer is formed on the surface by electroplating.

  The object of the present invention is to form a subsequent wiring pattern even when fine powder is scattered from the support plate when a metal film with a carrier metal foil is attached to the support plate used in the production of a printed wiring board. An object of the present invention is to provide a method of manufacturing a printed wiring board that prevents inconvenience.

  It is another object of the present invention to provide a metal film with a carrier metal foil that does not hinder the formation of such a wiring pattern.

  The method for manufacturing a printed wiring board according to the present invention includes preparing a support plate and attaching a protective film to a second surface opposite to the first surface of the metal film having a carrier metal foil bonded to the first surface. Preparing a metal film with carrier metal foil, sticking the carrier metal foil side of the metal film with carrier metal foil to the support plate, peeling the protective film, and Forming a pattern of a conductor layer on the surface of the metal film exposed by peeling.

  The metal film with a carrier metal foil of the present invention is a carrier that is affixed to the surface of a support plate used to manufacture a printed wiring board, and is affixed to the first surface of the metal film and the metal film. A carrier metal foil to be applied; and a protective film attached to a second surface opposite to the first surface of the metal film.

Sectional drawing with which the metal film with carrier metal foil of this invention was affixed on the support plate. Cross-sectional explanatory drawing of each process of the manufacturing method of the printed wiring board of one Embodiment of this invention. Cross-sectional explanatory drawing of each process of the manufacturing method of the printed wiring board of one Embodiment of this invention. Cross-sectional explanatory drawing of each process of the manufacturing method of the printed wiring board of one Embodiment of this invention. Cross-sectional explanatory drawing of each process of the manufacturing method of the printed wiring board of one Embodiment of this invention. Cross-sectional explanatory drawing of each process of the manufacturing method of the printed wiring board of one Embodiment of this invention. FIG. 2E is a cross-sectional explanatory view of each step of a method for manufacturing a printed wiring board in which a conductor post and a resin insulating layer are further formed on the printed wiring board of FIG. 2E. FIG. 2E is a cross-sectional explanatory view of each step of a method for manufacturing a printed wiring board in which a conductor post and a resin insulating layer are further formed on the printed wiring board of FIG. 2E. FIG. 2E is a cross-sectional explanatory view of each step of a method for manufacturing a printed wiring board in which a conductor post and a resin insulating layer are further formed on the printed wiring board of FIG. 2E. FIG. 2E is a cross-sectional explanatory view of each step of a method for manufacturing a printed wiring board in which a conductor post and a resin insulating layer are further formed on the printed wiring board of FIG. 2E. FIG. 2E is a cross-sectional explanatory view of each step of a method for manufacturing a printed wiring board in which a conductor post and a resin insulating layer are further formed on the printed wiring board of FIG. 2E. FIG. 2E is a cross-sectional explanatory view of each step of a method for manufacturing a printed wiring board in which a conductor post and a resin insulating layer are further formed on the printed wiring board of FIG. 2E. FIG. 2E is a cross-sectional explanatory view of each step of a method for manufacturing a printed wiring board in which a conductor post and a resin insulating layer are further formed on the printed wiring board of FIG. 2E. The figure which shows a mode that a foreign material adheres to the metal film surface when sticking a metal film with metal foil on a support plate. The figure which formed the plating resist film in the state of FIG. 4A, and formed the electroplating film. The figure which removed the plating resist film of FIG. 4B.

  A method for producing a printed wiring board according to an embodiment of the present invention and a metal film with a carrier metal foil attached to a support plate used therefor will be described with reference to the drawings. As shown in FIG. 1, a cross-sectional explanatory view of the state in which the metal film 10 with the carrier metal foil 18 b of the present embodiment is attached to the support plate 18 a, the metal film 10 with the carrier metal foil 18 b of the present embodiment is The carrier metal foil 18b is attached to the first surface 10a of the metal film 10, and is attached to the surface of the support plate 18a used to manufacture the printed wiring board. A protective film 20 is attached to the second surface 10b on the opposite side.

  And in the manufacturing method of the printed wiring board of other embodiment of this invention, the carrier metal foil 18b side adhere | attached on such a metal film 10 is affixed on the support plate 18a. And after the protective film 20 peels, the pattern of the conductor layer 12 is formed in the exposed surface of the metal film 10 exposed by peeling of the protective film 20. Thereafter, the resin insulating layer 11 covering the exposed surface of the conductor layer 12 is formed, and a pattern of the conductor layer may be further formed on the surface of the resin insulating layer 11 opposite to the conductor layer 12 side. Alternatively, the wiring layer pattern may not be formed on the surface of the resin insulating layer, and only the end 15a of the conductor post 15 connected to the conductor layer 12 may be exposed. Furthermore, a resin insulating layer and a conductor layer may be further laminated on these conductor layers 12 to form a multilayer printed wiring board. The support plate 18a and the carrier metal foil 18b described above are then peeled off and discarded. Further, the metal film 10 is also removed by etching. In the specific example described in detail below, the first and second patterns 12a and 12b of the conductor layer 12 are formed on the first surface 11a side of the resin insulating layer 11, and the surface opposite to the first surface 11a of the resin insulating layer 11 is formed. A method of manufacturing the printed wiring board 1 having a single-sided conductor layer in which only the end 15a of the conductor post 15 connected to the conductor layer 12 is exposed on the second surface 11b side will be described.

  The metal film 10 is used for adhesion to the carrier 18 and serves as a base for forming the conductor layer 12 and the like, and usually does not remain on the final printed wiring board. Therefore, a thickness of about several μm is sufficient. However, it is also possible to use a part of the pattern together with the conductor layer 12 by patterning. In that case, the metal film 10 having a thickness corresponding to the application is used. Various materials such as copper and nickel can be used for the metal film 10 in accordance with applications.

  The carrier metal foil 18b attached to the first surface 10a of the metal film 10 is an intermediary metal for fixing the metal film 10 to the carrier 18 so that the metal film 10 can be separated from the carrier 18 later. As the foil, a copper foil of usually 10 to 20 μm, for example, about 18 μm is used. However, it is not limited to copper, and other metal foils such as nickel may be used. Since it is desirable that there is not much difference in thermal expansion between the carrier metal foil 18b and the metal film 10, the material of the carrier metal foil 18b is preferably combined with the material of the metal film 10. However, this is not a limitation. Since the metal film 10 and the carrier metal foil 18b are later separated from each other, the metal film 10 and the carrier metal foil 18b may be adhered to each other by an easily separable adhesive such as a thermoplastic resin. Since the adhesive is bonded with such an adhesive, the metal film 10 and the carrier metal foil 18b are easily separated by being peeled off by raising the temperature in a subsequent process. Alternatively, for example, the metal film 10 and the carrier metal foil 18b may be firmly attached with a normal adhesive only around the periphery. This is because the metal film 10 and the carrier metal foil 18b are easily separated by cutting and removing the periphery. Note that a release layer may be appropriately provided on the surface of the carrier 18 on which the metal film 10 is provided.

  As the protective film 20, for example, a commercially available polymer film such as polyethylene terephthalate (PET) resin, which is a thermoplastic polyester, can be used. Such a PET film has a thickness of about several μm and can be attached to a flat surface without using an adhesive. This PET film can be given strength and heat resistance by being crystallized by stretching (biaxial stretching) in the xy biaxial direction after film formation of the PET resin and orienting the molecules. Therefore, even when the metal film 10 with the carrier metal foil 18b is attached to the support plate 18a by hot pressing in a state where the protective film 20 is attached to the metal film 10, the adhesion force is lost and the metal film 10 is peeled off. No. In short, any film may be used as long as it is attached to the metal film 10 at the time of work and can be easily peeled off when peeled thereafter. By doing so, the protective film 20 can be removed together without scattering the foreign matter adhering to the surface.

  The support plate 18a may be a conductive substrate such as a metal plate or an insulating substrate. However, since the carrier 18 is finally discarded, it is preferable that the carrier 18 is inexpensive. For example, a prepreg used as a material for the resin insulating layer is often used. Even in this case, if a prepreg containing a core material such as glass fiber is used, it is conveniently used because it is relatively less likely to warp. However, when such a core-containing prepreg is used, the carrier metal foil 18b side of the support plate 18a and the metal film 10 with the carrier metal foil 18b is pressed against the support plate 18a by heat press and heated. When being done, foreign substances such as glass fibers in the prepreg are likely to scatter and adhere.

  The situation is shown in FIGS. That is, as shown in FIG. 4A, the foreign substances 80a and 80b generated when the support plate 18a and the metal foil with carrier 18b are bonded by hot pressing adhere to the surface of the metal film 10. There are large and small foreign substances 80a and 80b, but the type of adhesion of the foreign substances 80a and 80b is not fixed. Thereafter, as shown in FIG. 4B, a plating resist mask 81 is formed, and there are foreign matter 80a taken into the plating resist mask 81 by the patterning and foreign matter 80b not taken in. If there is a foreign substance 80b outside the plating resist mask 81, the position is originally a place where an electroplating film is formed, and these foreign substances 80a and 80b are often insulators. There may be a place where an electroplating film is not formed. As a result, as shown in FIG. 4C, when the plating resist mask 81 is removed, a pattern P may not be formed at a place where a wiring pattern should be originally formed. Since the resist film is patterned when the plating resist mask 81 is formed, there is no problem if the foreign matter is removed during the patterning, but when a part of the foreign matter is held in the resist film. Even if the plating resist mask 81 is patterned, the foreign matter 80b may remain as it is. Further, if there is a foreign matter 80 a taken in the plating resist mask 81, a gap may be generated between the plating resist mask 81 and the metal film 10. Then, the plating solution may enter the gap. As a result, a plating film is formed where the wiring pattern should not be originally formed, and the surrounding wiring patterns may be short-circuited via the plating film.

  However, in this embodiment, as shown in FIG. 1, the metal film 10 with the carrier metal foil 18b is attached to the support plate 18a with the protective film 20 attached to the surface of the metal film 10. Even if the foreign matter scatters and adheres to the surface during pasting, it adheres to the surface of the protective film 20. Therefore, when the resist mask is formed for electroplating, the protective film 20 is peeled and removed, whereby an electroplated film can be formed on the surface of the clean metal film 10 to which no foreign matter adheres. The conductor layer can be formed without causing the pattern of the conductor layer 12 to be lost. According to the present embodiment, even when a prepreg containing a core material is not used for the support plate 18, it is possible to solve the problem due to the adhesion of foreign matters that may adhere due to some problem.

  Next, a method for manufacturing a printed wiring board in which a pattern of a conductor layer is formed on one surface side of a resin insulation layer using the metal film 10 with the carrier metal foil 18b will be described with reference to FIGS. The

  First, as shown in FIG. 2A, a support plate 18a is prepared. As the support plate 18a, various materials can be used as described above. In the present embodiment, for example, a core material such as glass fiber is impregnated with a mixture of a resin composition and an inorganic filler. A prepreg having a thickness of about 200 μm is used.

  On the other hand, as shown in FIG. 2B, a metal laminate 100 is prepared in which a carrier metal foil is attached to the first surface 10a of the metal film 10 and a protective film 20 is attached to the second surface 10b of the metal film 10. The The metal film 10 only needs to have a thickness of about 2 to 5 μm, but when used as a post on a conductor layer, the thickness can be about 5 to several tens of μm depending on the application. . As described above, copper is generally used as described above, but nickel may be used as long as other materials can be formed into a thin foil shape.

  The carrier metal foil 18b mediates between the support plate 18a and the metal film 10, and a metal foil having a thickness of about 10 to 20 μm, specifically about 18 μm is used. That is, while the printed wiring board is manufactured by fixing the metal film 10 to the support plate 18a, the metal film 10 needs to be finally separated from the support plate 18a. Is used to enable peeling. Accordingly, the material and thickness of the carrier metal foil 18b are not so limited, but the thickness is as described above, and the material is copper, nickel or the like. It is preferable to match the material of the metal film 10.

  As described above, the metal film 10 and the carrier metal foil 18b are bonded so as to be peeled off in a later process. That is, for example, by bonding with a thermoplastic resin, separation is possible by raising the temperature and peeling off. On the other hand, since the carrier metal foil 18b and the support plate 18a are bonded by, for example, pressing while heating, the support plate 18a made of, for example, a prepreg is in a soft state and is also in close contact with the carrier metal foil 18b. The Therefore, it cannot be peeled later. That is, the carrier 18 is composed of the support plate 18a and the carrier metal foil 18b. From this point of view, the support plate 18a and the carrier metal foil 18b can be first bonded by hot pressing to form the carrier 18, and then the metal film 10 can be attached. However, the carrier metal foil 18b and the metal film 10 can be attached. In many cases, a professional manufacturer performs the adhesion to the metal layer 100, and thus the metal laminate 100 is generally formed in this way. Therefore, it is necessary to provide the protective film 20 on the surface of the metal film 10.

  The protective film 20 may be any film that can withstand the heating and pressurization during the bonding between the carrier metal foil 18b and the support plate 18a and can be easily peeled later. That is, the holding force between the protective film 20 and the metal film 10 is formed to be weaker than the adhesive force between the carrier metal foil 18 b and the metal film 10. In that sense, a PET film is used as described above.

  Next, as shown in FIG. 2C, the carrier metal foil 18 b side of the metal laminate 100 made of the metal film 10 with the carrier metal foil 18 b with the protective film 20 attached is opposed to the support plate 18 a. It is stuck by a hot press. That is, the carrier metal foil 18b side of the metal laminate 100 is placed on one side of the support plate 18a so as to face each other, and by applying pressure and heating, the support plate 18a made of, for example, a prepreg becomes soft, and the carrier metal foil Adhering closely to 18b. Thereafter, it is completely fixed by being fully cured. At this time, the size of the metal laminate 100 is often smaller than that of the support 18a, and if the size of the metal laminate is smaller than the support 18a, the surface of the support 18a is exposed, so that extra fine powder is scattered. It's easy to do.

  In the example shown in FIG. 2C, the metal laminate 100 is attached to both surfaces of the support plate 18a. As described above, since the carrier 18 is removed and discarded in a later step as described above, both sides are used in order to make effective use as much as possible. Therefore, the metal laminated body 100 is affixed on both surfaces of the support plate 18a, and the same printed wiring board 1 is produced on both surfaces. Of course, different printed wiring boards on both sides may be manufactured, or only one side may be manufactured. In this embodiment, since the same thing is formed on both surfaces, the figure formed on both surfaces is shown in the drawing, but some of the reference numerals (the lower side of the drawing) are also omitted, and the description is also omitted. Has been.

  Next, as shown in FIG. 2D, the protective film 20 is peeled off. Since the protective film 20 is only attached to the surface of the metal film 10 as described above, the protective film 20 can be easily peeled off by peeling off from the end. This state is the same as a state where a conventional metal film with a carrier metal foil is attached to the support plate 18a. However, in this embodiment, since the protective film 20 has just been removed, the protective film 20 can be produced even if fine powder such as foreign matter is generated when the metal laminate 100 and the support plate 18a are bonded. When the protective film 20 is peeled off, the entire foreign matter is removed when the protective film 20 is peeled off, so that a very clean surface is exposed.

  Thereafter, as shown in FIG. 2E, by forming an electroplating film or the like, the conductor layer 12 having the first and second patterns 12a and 12b is formed. As described above, the electroplating film is formed with a plating resist film (not shown), patterned and removed only at portions where the first and second patterns 12a and 12b are formed, and the metal film 10 is exposed. It may be formed by an additive method in which an electroplating film is formed, or after a conductive film is formed on the entire surface by an electroplating film or vacuum deposition, the first and second layers are patterned by a well-known photolithography technique. The pattern 12a, 12b may be formed by a subtract method. Regardless of which method is used, the surface of the metal film 10 is a clean surface on which no foreign matter is attached, and therefore the possibility of occurrence of defects such as missing wiring patterns or short circuits can be eliminated. In addition, although this conductor layer 12 can be preferably formed in the thickness of 10-30 micrometers, it is not limited to this.

  Subsequent processes are performed in accordance with the structure of the printed wiring board. As an example, the conductor layer 12 is formed on the first surface 11a side of the resin insulating layer 11, and the resin insulating layer 11 A manufacturing process of a printed wiring board having a single-sided conductor layer in which only the end 15a of the conductor post 15 connected to the conductor layer 12 is exposed without forming a wiring conductor layer on the second surface 11b side will be described.

  Conductor posts 15 are formed on the first pattern 12a of the conductor layer 12 shown in FIG. 1E. Specifically, first, as shown in FIG. 3A, the exposed surface of the conductor layer 12 on the side opposite to the metal film 10 except the portion where the conductor post 15 (see FIG. 3B) is formed and the conductor. A plating resist film 85 is formed on the metal film 10 exposed without being covered with the layer 12. The plating resist film 85 is formed to a thickness of at least about 50 to 150 μm. Subsequently, for example, a conductor post 15 by electroplating is formed on the first pattern 12a on which the plating resist film 85 is not formed, using the metal film 10 as a power feeding layer for electroplating.

  Thereafter, as shown in FIG. 3B, the plating resist film 85 is removed. As a result, a conductor post 15 is formed on the first pattern 12a of the conductor layer 12 by electroplating. The conductor post 15 is preferably made of the same material as that of the conductor layer 12, and is preferably made of copper. The conductor post 15 can be preferably formed to a thickness (height) of 30 to 150 μm, but is not limited thereto.

  After the conductor post 15 is formed, preferably, the conductor post 15 and the side surfaces of the wiring patterns 12a and 12b of the conductor layer 12 and the exposed surfaces thereof are roughened in order to improve the adhesion to the resin insulating layer 11 described later. Processing is performed. The method of roughening treatment is not particularly limited, and examples thereof include soft etching treatment, blackening (oxidation) and reduction treatment. Each surface to be roughened is preferably processed to a surface roughness of 0.1 to 1 μm in arithmetic mean roughness. Further, when a roughening process is performed, an annealing process for growing an electroplated copper crystal may be performed between the removal of the plating resist film 85 and the roughening process in order to stabilize the roughening.

  Next, a resin insulating layer 11 (see FIG. 3D) that covers the conductor layer 12 and the conductor post 15 is formed. Specifically, first, as shown in FIG. 3C, a sheet-like or film-like insulating material 11f is laminated on the conductor post 15, and is pressurized and heated toward the support plate 18a. The insulating material 11f is softened by heating and flows into the space between the first pattern 12a and the second pattern 12b of the conductor layer 12, between the second patterns 12b, and the side surface 15c of the conductor post 15, and solidifies in a semi-cured state. To do. Thereafter, by further heating, the insulating material 11f is completely cured, and as shown in FIG. 3D, the side surface of the first pattern 12a, the side surface 15c of the conductor post 15, the conductor layer 12, and the conductor layer 12 are formed. A resin insulating layer 11 is buried on the metal film 10 that is not present. Thus, the method of forming the resin insulating layer 11 by laminating sheet-like or film-like insulating materials is preferable in that the resin insulating layer 11 can be formed by a general wiring board manufacturing facility. After the resin insulating layer 11 is formed, buffing is preferably performed to remove burrs generated when the resin insulating layer 11 is formed.

  The resin insulating layer 11 may be formed by pouring a molding resin without using such a film-like insulating material 11f. In this case, the resin insulating layer 11 is formed by pouring the fluid resin into the gaps and increasing the temperature to cure.

The resin insulating layer 11 is an insulating layer having a first surface 11a on the conductor layer 12 side and a second surface 11b on the opposite side of the first surface 11a. The resin insulation layer 11 may be formed by impregnating a resin composition containing a filler into a core material (not shown) such as glass fiber, or may be formed only by a resin composition not containing a core material. Further, it may be a single layer or may be formed from a plurality of insulating layers. If the resin insulating layer 11 is formed of a plurality of insulating layers, for example, the coefficient of thermal expansion, flexibility, and thickness can be easily adjusted. Examples of the resin include epoxy. Examples of the filler mixed with the resin include silica (SiO ₂ ), alumina (Al ₂ O ₃ ), and titanium oxide (Ti ₂ O ₃ ). Examples of the thickness of the resin insulating layer 11 include 25 to 100 μm. On the first surface 11a, one surface of the first and second patterns 12a, 12b of the conductor layer 12 is exposed.

  Next, as shown in FIG. 3E, buffing or chemical mechanical polishing (CMP) is performed until the second surface 11b of the resin insulating layer 11 is substantially flush with the tip 15a of the conductor post 15. Polishing) or the like.

  Thereafter, as shown in FIG. 3F, the support plate 18a, the carrier metal foil 18b, and the metal film 10 are separated. Specifically, first, the temperature is increased, and the thermoplastic adhesive (not shown) that joins the carrier metal foil 18b and the metal film 10 is softened to the support plate 18a and the carrier metal foil 18b. By applying a force in a direction along the interface with the metal film 10, the carrier metal foil 18b and the metal film 10 are separated. Alternatively, as described above, in the case where both are bonded by an adhesive or ultrasonic connection in a blank portion near the outer periphery, the carrier 18 and the metal film 10 are on the inner peripheral side from the bonding portion, and the resin insulating layer 11 or the like. Then, the carrier metal foil 18b and the metal film 10 may be separated by cutting together and cutting off a joint portion by an adhesive or the like. In FIG. 3F, only the in-process product of the printed wiring board shown on the lower surface side of the support plate 18a in FIG. 3E is shown.

  Subsequently, as shown in FIG. 3G, the metal film 10 is removed by, for example, etching or the like. In this etching, the conductor layer 12 and the conductor post 15 are often made of the same material as that of the metal film 10, so that not only the metal film 10 but also the wiring pattern (first pattern 12a, second pattern) of the conductor layer 12 is used. The exposed surfaces of 12b and the conductor posts 15 can also be partially etched, because if the metal film 10 is not completely removed, the wiring patterns 12a and 12b are short-circuited, so that etching is performed in an overetching manner. As a result, the surfaces of the wiring patterns 12a and 12b are recessed from the first surface 11a of the resin insulating layer 11. Further, the tip 15a of the conductor post 15 is also recessed from the second surface of the resin insulating layer 11. The amount of recess in the end 15a of the conductor post 15 is also etched while the metal film 10 is etched, so that the amount of recess in the conductor layer 12 is It is large. However, since thin as several μm thickness of the metal film 10 itself, dented conductive posts are not so large.

  The conductor layer 12 has a pattern embedded in the first surface 11a of the resin insulating layer 11 in this way. The buried conductor layer 12 is substantially flush with the first surface 11a of the resin insulating layer 11, or is slightly recessed as described above, and only one surface of the conductor layer 12 is exposed. For this reason, the width of the wiring patterns 12a and 12b is particularly narrow as the density and fine pitch are increased, and the adhesiveness may be lowered due to the use of the resin containing the core material as the resin insulating layer 11 is thinned. Even if there is, the conductive layer 12 is embedded in the resin insulating layer 11 in this way, which contributes to improvement in the adhesion between the conductive layer 12 and the resin insulating layer 11. Moreover, it contributes to the thinning of the printed wiring board 1.

  After the removal of the metal film 10, a surface protection film (not shown) is preferably formed on the exposed surface of the conductor layer 12 and the end portion 15 a of the conductor post 15. The surface protective film may be formed by forming a plurality of or a single metal film such as Ni / Au, Ni / Pd / Au, or Sn by a plating method. Further, the OSP may be formed by immersion in a liquid protective material or spraying of the protective material. The surface protective film may be formed on both the exposed surfaces of the patterns 12a and 12b of the conductor layer 12 and the end 15a of the conductor post 15, or may be formed on only one of them. Further, a surface protective film made of a different material may be formed between the conductor layer 12 and the end portion 15 a of the conductor post 15.

  Further, in addition to the formation of the surface protective film, or without the surface protective film being formed, a bonding material layer made of a bonding material for bonding the conductor post 15 to an external motherboard or the like on the end portion 15a of the conductor post 15. (Not shown) may be formed. Solder is preferably used as the material of the bonding material layer, and may be formed by applying paste-like solder or placing a solder ball and once cured after being melted or by using a plating method. However, the material and forming method of the bonding material layer are not particularly limited, and other materials and methods can be used.

  By passing through the above process, the printed wiring board 1 of the single side | surface conductor layer of this embodiment shown by FIG. 3G is completed. A semiconductor element (not shown) may be connected to the completed printed wiring board 1 on the second pattern 12b. Further, the end 15a of the conductor post 15 may be connected to a mother board or the like such as an electronic device in which the printed wiring board 1 is used, or connected to another printed wiring board (not shown). It may be a part.

  In the printed wiring board 1 shown in FIG. 3G, the conductor layer 12 is formed on the first surface 11a side of the single resin insulating layer 11, and the conductor posts 15 connected to the conductor layer 12 are formed on the second surface 11b side. Although the structure is simple in which only the end 15a is exposed, a multilayer printed wiring board can be obtained by further laminating a resin insulating layer and a conductor layer on one or both sides of the printed wiring board 1.

DESCRIPTION OF SYMBOLS 1 Printed wiring board 10 Metal film 11 Resin insulating layer 11a 1st surface 11b 2nd surface 11f Resin material (prepreg)
12 1st conductor layer 12a 1st pattern 12b 2nd pattern 15 Conductor post 15a End part 18 Carrier 18a Support plate 18b Carrier metal foil 20 Protective film

Claims (10)

A method of manufacturing a printed wiring board,
Preparing a support plate;
Preparing a metal film with a carrier metal foil having a protective film attached to a second surface opposite to the first surface of the metal film having a carrier metal foil bonded to the first surface;
Affixing the carrier metal foil side of the metal film with the carrier metal foil to the support plate;
Peeling the protective film;
Forming a pattern of a conductor layer on the surface of the metal film exposed by peeling off the protective film. It is a manufacturing method of the printed wiring board according to claim 1,
After forming the pattern of the conductor layer, forming a conductor post on the pattern of the conductor layer;
Forming a resin insulating layer covering the exposed surface of the conductor layer and the periphery of the conductor post;
Separating the metal foil and the metal film adhered to the support plate;
Removing the metal film;
It has further. 3. The method for manufacturing a printed wiring board according to claim 2, further comprising performing a roughening process on the exposed surface of the conductor layer and the conductor post after the formation of the conductor post. It is a manufacturing method of the printed wiring board according to claim 2 or 3,
A plating resist film having an opening at a predetermined position is formed on the metal film and the conductor layer, and a copper plating layer is formed by electroplating in the opening of the plating resist film, thereby forming the conductor post. Form. 5. The method of manufacturing a printed wiring board according to claim 4, further comprising performing an annealing process between the removal of the plating resist film and the roughening process. It is a manufacturing method of the printed wiring board of any one of Claims 2-5, Comprising: Between the formation of the said resin insulation layer, and isolation | separation of the said support plate and the said metal film, The said conductor post | mailbox And buffing or CMP polishing the resin insulating layer on the end surface of the substrate. It is a manufacturing method of the printed wiring board of any one of Claims 2-6, Comprising: Furthermore, it has forming a surface protective film in the end surface of the said conductor post, and / or the exposed surface of the said conductor layer. ing. It is a manufacturing method of the printed wiring board of any one of Claims 2-7, Comprising: Furthermore, it has supplying solder to the end surface of the said conductor post. A metal film with a carrier metal foil attached to the surface of a support plate used to produce a printed wiring board,
A metal film,
A carrier metal foil attached to the first surface of the metal film;
A protective film attached to the second surface opposite to the first surface of the metal film. A metal film with a carrier metal foil according to claim 9,
The adhesive force between the carrier metal foil and the protective film is weaker than the adhesive force between the metal film and the carrier metal foil.

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