JP2016092030A - Liquid processing device and liquid processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid processing device capable of detecting information about the remaining quantity of process liquid, and a liquid processing method.SOLUTION: An application unit U1 comprises: a supply tube 50 which is inserted into a container 40 for storing a process liquid R for substrate processing and forms a duct for supplying the process liquid R; and an optical sensor D1 which is provided between an outer peripheral surface 50b and an inner peripheral surface 50a of the supply tube 50 and detects information about a height H of a liquid level Ra of the process liquid R within the container 40. The liquid processing method includes: supplying the process liquid R using the supply tube 50; detecting the information about the height H of the liquid level Ra of the process liquid R using the optical sensor D1 that is provided between the outer peripheral surface 50b and the inner peripheral surface 50a of the supply tube 50; and reporting a state of the remaining process liquid R on the basis of the information about the height H of the liquid level Ra of the process liquid R.SELECTED DRAWING: Figure 4

Description

  The present disclosure relates to a liquid processing apparatus and a liquid processing method.

  There is known a coating apparatus that includes a container that stores a coating liquid, a conduit that delivers the coating liquid from the inside of the container, and a nozzle that discharges the coating liquid, and that coats the substrate with the coating liquid. In the apparatus described in Patent Document 1 below, bubbles mixed in the coating liquid in the pipeline are detected by a sensor provided outside the pipeline.

Japanese Patent Laid-Open No. 4-190873

  In the apparatus described in Patent Document 1, it is presumed that the amount of processing liquid remaining in the container has decreased by detecting bubbles flowing together with the processing liquid. However, in the apparatus described in Patent Document 1, since only bubbles detected in the processing liquid are detected outside the container, the remaining amount of the processing liquid in the container is grasped, and the replenishing processing liquid is used. It was difficult to prepare in advance.

  Therefore, an object of the present disclosure is to provide a liquid processing apparatus and a liquid processing method capable of detecting information on the remaining amount of the processing liquid.

  A liquid processing apparatus according to the present disclosure includes a supply pipe that is inserted into a container for storing a processing liquid for substrate processing and forms a pipe for supplying a processing liquid, and an outer peripheral surface and an inner peripheral surface of the supply pipe. And a first sensor that detects information related to the height of the liquid level of the processing liquid in the container.

  According to this liquid processing apparatus, information regarding the height of the liquid level of the processing liquid is detected by the first sensor as information regarding the remaining amount of the processing liquid. Thereby, the information regarding the remaining amount of the processing liquid can be detected.

  The first sensor is incorporated in the supply pipe. If the container is provided with the first sensor, it is necessary to change the first sensor to the container every time the container is replaced. On the other hand, since the first sensor is incorporated in the supply pipe, it is possible to prevent the workability of the work of replacing the container from being deteriorated. Further, the configuration can be simplified as compared with the case where the first sensor and the supply pipe are separately inserted into the container.

  Furthermore, since the first sensor is provided between the outer peripheral surface and the inner peripheral surface of the supply pipe, the first sensor is isolated from the processing liquid. Therefore, mixing of foreign substances from the first sensor into the processing liquid is suppressed.

  The first sensor may detect information related to the height of the liquid level of the processing liquid outside the outer peripheral surface. The liquid level of the processing liquid is formed outside the outer peripheral surface of the supply pipe. For this reason, the information regarding the remaining amount of the processing liquid can be detected with high accuracy by configuring the first sensor so as to detect the information regarding the height of the processing liquid level outside the outer peripheral surface.

  The first sensor may detect the presence or absence of the processing liquid as information regarding the height of the liquid level of the processing liquid. In this case, the configuration of the first sensor can be simplified by simplifying the detection target. Even when the detection target by the first sensor is only the presence or absence of the processing liquid, for example, information about the height is obtained, such as information on whether it is on the upper side or the lower side compared to the first sensor.

  You may provide the some 1st sensor arrange | positioned along the longitudinal direction of a supply pipe | tube. A plurality of information relating to the height of the liquid level of the processing liquid outside the outer peripheral surface is detected by the plurality of first sensors. For this reason, the height of the liquid level can be determined with higher accuracy.

  The liquid processing apparatus may further include a second sensor that is provided between the outer peripheral surface and the inner peripheral surface and detects the presence or absence of the processing liquid inside the inner peripheral surface. In this case, it is possible to detect whether or not the remaining amount of the processing liquid is an amount capable of continuing supply based on the presence or absence of the processing liquid inside the inner peripheral surface.

  The supply pipe may include an inner pipe that forms an inner peripheral surface, and an outer pipe that surrounds the inner pipe with a gap and forms an outer peripheral surface, and the first sensor is disposed between the outer pipe and the inner pipe. It may be provided. In this case, the first sensor can be easily arranged using the gap between the inner tube and the outer tube.

  The first sensor is an optical sensor that uses an optical signal, and the supply tube may have a higher optical signal permeability than the container. In this case, since the detection sensitivity by the first sensor is increased, information regarding the remaining amount of the processing liquid can be detected with higher accuracy. In addition, when the processing liquid is photosensitive, it may be necessary to improve the light shielding property of the container in order to prevent the processing liquid from being denatured. In such a case, this configuration is particularly effective.

  An adjustment mechanism capable of adjusting the insertion length of the supply pipe with respect to the container is further provided, and the first sensor may be provided in a portion of the supply pipe that moves along with the adjustment of the insertion length. In this case, since the position of the first sensor is adjusted as the insertion length of the supply pipe is changed according to the depth of the container, the first according to the depth of the container is not involved without complicated operations. The sensor position can be adjusted reliably. For this reason, the information regarding the remaining amount of the processing liquid can be detected with higher accuracy.

  A liquid processing method according to the present disclosure includes supplying a processing liquid using a supply pipe that is inserted into a container for storing a processing liquid for substrate processing and forms a pipeline for supplying the processing liquid. Detecting information on the height of the liquid surface of the processing liquid using a first sensor provided between the outer peripheral surface and the inner peripheral surface; Informing the remaining state.

  According to this liquid processing method, the information regarding the height of the liquid level can be detected as the information regarding the remaining amount of the processing liquid by the first sensor provided in the supply pipe for supplying the processing liquid. Furthermore, since the remaining state can be notified based on the detected information on the height of the liquid level, for example, the operator can grasp the remaining state of the processing liquid.

  In addition, the liquid processing method according to the present disclosure may calculate information regarding the remaining period of the processing liquid based on information regarding the height of the liquid level of the processing liquid, and may include information regarding the remaining period of the processing liquid as a remaining state. You may notify. In this case, for example, the operator can grasp the remaining period of the processing liquid and prompt the preparation of the replenishing processing liquid.

  According to the present disclosure, it is possible to provide a liquid processing apparatus and a liquid processing method capable of detecting information on the remaining amount of processing liquid.

It is a perspective view showing a schematic structure of a substrate processing system concerning this indication. It is sectional drawing which follows the II-II line | wire in FIG. It is sectional drawing which follows the III-III line | wire in FIG. It is a schematic diagram which shows schematic structure of a coating unit. It is sectional drawing of a supply pipe | tube and an adjustment mechanism. It is a figure for demonstrating the principle of an optical sensor. It is a flowchart which shows the execution procedure of a liquid processing method. It is a figure which shows the example of a display of the remaining state of a process liquid. It is a schematic diagram which shows the other example of arrangement | positioning of a sensor.

  Hereinafter, embodiments will be described in detail with reference to the drawings. In the description, the same elements or elements having the same functions are denoted by the same reference numerals, and redundant description is omitted.

[Substrate processing system]
First, an outline of the substrate processing system 1 according to the present embodiment will be described with reference to FIGS. 1, 2, and 3. As shown in FIG. 1, the substrate processing system 1 includes a coating / developing device 2 and an exposure device 3. The exposure apparatus 3 performs an exposure process for a resist film (photosensitive film). Specifically, the exposure target portion of the resist film is irradiated with energy rays by a method such as immersion exposure.

  The coating / developing apparatus 2 performs a process of forming a resist film on the surface of the wafer W (substrate) before the exposure process by the exposure apparatus 3, and performs a development process of the resist film after the exposure process.

  The coating / developing apparatus 2 includes a carrier block 4, a processing block 5, and an interface block 6. The carrier block 4, the processing block 5, and the interface block 6 are arranged in the horizontal direction.

  The carrier block 4 includes a carrier station 12 and a carry-in / carry-out unit 13. The loading / unloading unit 13 is interposed between the carrier station 12 and the processing block 5. The carrier station 12 supports a plurality of carriers 11. The carrier 11 contains a plurality of circular wafers W, for example, in a sealed state, and has an opening / closing door for taking in and out the wafers W on the side surface 11a side. The carrier 11 is detachably installed on the carrier station 12 so that the side surface 11a faces the loading / unloading unit 13 side.

  The carry-in / carry-out unit 13 has a plurality of opening / closing doors 13 a corresponding to the plurality of carriers 11 on the carrier station 12. By opening the open / close door and the open / close door 13a on the side surface 11a at the same time, the inside of the carrier 11 and the inside of the carry-in / out unit 13 are communicated. The carry-in / carry-out unit 13 incorporates a delivery arm A1 (see FIGS. 2 and 3). The delivery arm A <b> 1 takes out the wafer W from the carrier 11 and delivers it to the processing block 5, receives the wafer W from the processing block 5, and returns it into the carrier 11.

  The processing block 5 has a plurality of processing modules 14, 15, 16, and 17. The processing modules 14, 15, 16, and 17 incorporate a plurality of coating units U1, a plurality of heat treatment units U2, and a transfer arm A3 that transfers the wafer W to these units. The processing module 17 further includes a direct transfer arm A6 that transfers the wafer W without passing through the coating unit U1 and the heat treatment unit U2. The coating unit U1 applies the processing liquid R to the surface of the wafer W.

  The processing module 14 is a BCT module that forms a lower layer film on the surface of the wafer W by the coating unit U1 and the heat treatment unit U2. The coating unit U1 of the processing module 14 applies a liquid for forming a lower layer film onto the wafer W. The heat treatment unit U2 of the processing module 14 performs various heat treatments associated with the formation of the lower layer film.

  The processing module 15 is a COT module that forms a resist film on a lower layer film by the coating unit U1 and the heat treatment unit U2. The coating unit U1 of the processing module 15 applies a resist film forming liquid on the lower layer film. The heat treatment unit U2 of the processing module 15 performs various heat treatments accompanying the formation of the resist film.

  The processing module 16 is a TCT module that forms an upper layer film on the resist film by the coating unit U1 and the heat treatment unit U2. The coating unit U1 of the processing module 16 applies a liquid for forming an upper layer film on the resist film. The heat treatment unit U2 of the processing module 16 performs various heat treatments accompanying the formation of the upper layer film.

  The processing module 17 is a DEV module that develops the resist film after exposure by the coating unit U1 and the heat treatment unit U2. The developing unit applies a developing solution onto the exposed surface of the wafer W, and then rinses the developing solution with a rinsing solution to develop the resist film. The heat treatment unit performs various heat treatments associated with the development processing. Specific examples of the heat treatment include heat treatment before development processing (PEB: Post Exposure Bake), heat treatment after development processing (PB: Post Bake), and the like.

  In the processing block 5, a shelf unit U10 is provided on the carrier block 4 side, and a shelf unit U11 is provided on the interface block 6 side (see FIGS. 2 and 3). The shelf unit U10 is provided so as to extend from the floor surface to the processing module 16, and is partitioned into a plurality of cells arranged in the vertical direction. An elevating arm A7 is provided in the vicinity of the shelf unit U10. The raising / lowering arm A7 raises / lowers the wafer W between the cells of the shelf unit U10. The shelf unit U11 is provided so as to extend from the floor surface to the upper part of the processing module 17, and is partitioned into a plurality of cells arranged in the vertical direction.

  The interface block 6 incorporates a delivery arm A8 and is connected to the exposure apparatus 3. The delivery arm A8 delivers the wafer W arranged on the shelf unit U11 to the exposure apparatus 3, receives the wafer W from the exposure apparatus 3, and returns it to the shelf unit U11.

  The substrate processing system 1 performs the coating / developing process according to the following procedure. First, the transfer arm A1 transports the wafer W in the carrier 11 to the shelf unit U10. The lift arm A7 places the wafer W in the cell for the processing module 14, and the transfer arm A3 transfers the wafer W to each unit in the processing module 14. The coating unit U1 and the heat treatment unit U2 of the processing module 14 form a lower layer film on the surface of the wafer W transferred by the transfer arm A3. When the formation of the lower layer film is completed, the transfer arm A3 returns the wafer W to the shelf unit U10.

  Next, the lift arm A7 places the wafer W returned to the shelf unit U10 in the cell for the processing module 15, and the transfer arm A3 transfers it to each unit in the processing module 15. The coating unit U1 and the heat treatment unit U2 of the processing module 15 form a resist film on the lower layer film of the wafer W transferred by the transfer arm A3. When the formation of the resist film is completed, the transfer arm A3 returns the wafer W to the shelf unit U10.

  Next, the wafer W returned to the shelf unit U <b> 10 is placed in the cell for the processing module 16 by the elevating arm A <b> 7 and the transfer arm A <b> 3 is transferred to each unit in the processing module 16. The coating unit U1 and the heat treatment unit U2 of the processing module 16 form an upper layer film on the resist film of the wafer W transferred by the transfer arm A3. When the formation of the upper layer film is completed, the transfer arm A3 returns the wafer W to the shelf unit U10.

  Next, the lift arm A7 arranges the wafer W returned to the shelf unit U10 in the cell for the processing module 17, and the transfer arm A6 directly transfers it to the shelf unit U11. The wafer W is delivered and the arm A8 sends it to the exposure apparatus 3. When the exposure process in the exposure apparatus 3 is completed, the transfer arm A8 receives the wafer W from the exposure apparatus 3 and returns it to the shelf unit U11.

  Next, the transfer arm A3 of the processing module 17 transfers the wafer W returned to the shelf unit U11 to each unit in the processing module 17. The coating unit U1 and the heat treatment unit U2 of the processing module 17 perform development processing of the resist film of the wafer W transferred by the transfer arm A3 and heat treatment associated therewith. When the development of the resist film is completed, the transfer arm A3 transfers the wafer W to the shelf unit U10.

  Next, the wafer W transferred to the shelf unit U <b> 10 is placed in the delivery cell by the lift arm A <b> 7, and the delivery arm A <b> 1 returns into the carrier 11. Thus, the coating / developing process is completed.

[Coating unit]
(overall structure)
Next, the configuration of the coating unit U1 will be described in detail as an example of the liquid processing apparatus. As shown in FIG. 4, the coating unit U <b> 1 includes a rotation holding unit 20, a cup 25, a supply unit 30, and a control unit 100.

  The rotation holding unit 20 includes a holding unit 21, a rotation driving unit 22, and an elevating unit 23, and holds and rotates the wafer W. The holding unit 21 sucks and holds the central portion of the wafer W held horizontally, for example, from below. The rotation drive unit 22 rotates the holding unit 21 around a vertical axis by a power source such as a motor. The elevating part 23 raises and lowers the holding part 21.

  A cup 25 is disposed below the holding portion 21. The cup 25 is open upward. The cup 25 stores the wafer W held by the holding unit 21 and stores the processing liquid spun off from the wafer W. The bottom 25a of the cup 25 is provided with a drainage port 25b, and a drainage duct (not shown) is connected to the drainage port 25b.

  The supply unit 30 includes a nozzle 32, a container 40, a cap 42, a supply pipe 50, an adjustment mechanism 60, and a compressor 70.

  The nozzle 32 is disposed above the holding unit 21. The nozzle 32 discharges the processing liquid R onto the wafer W held by the holding unit 21.

  The container 40 contains the processing liquid R to be discharged from the nozzle 32. The container 40 has an opening 40a on the upper side. In the case where the processing liquid R has photosensitivity such as a resist liquid, the container 40 may be made of a light-shielding material. A valve V <b> 1 is provided in a path 34 from the container 40 to the nozzle 32. The valve 34 can open and close the path 34.

  The cap 42 is detachably attached to the upper part of the container 40 and closes the opening 40 a of the container 40.

  The supply pipe 50 is inserted into the container 40 through the through hole 42 a of the cap 42. The supply pipe 50 forms a part of the path 34. The adjustment mechanism 60 is provided outside the cap 42. The adjusting mechanism 60 adjusts the insertion length of the supply pipe 50 inserted into the container 40.

  The compressor 70 communicates with the upper space in the container 40 through the pressurizing pipe 72. The compressor 70 pressurizes the inside of the container 40 in order to push out the processing liquid R. A valve V <b> 2 is provided in the path from the compressor 70 to the pressurizing pipe 72. The pressurizing pipe 72 in the above path can be opened and closed by the valve V2.

  With the above configuration, when the inside of the container 40 is pressurized, the processing liquid R flows into the nozzle 32 through the supply pipe 50, and the processing liquid R is discharged onto the surface Wa of the wafer W.

(Details of supply pipe and adjustment mechanism)
As shown in FIG. 5, the supply pipe 50 includes an inner pipe 52, an outer pipe 54, and a sealing portion 56. The inner pipe 52 forms the inner peripheral surface 50 a of the supply pipe 50. The outer pipe 54 forms the outer peripheral surface 50 b of the supply pipe 50 and surrounds the inner pipe 52 with a gap 58. The outer tube 54 and the inner tube 52 are provided so as to be coaxial with each other. Thus, the supply pipe 50 has a double pipe structure. The sealing portion 56 seals between the tip of the inner tube 52 and the tip of the outer tube 54 over the entire circumference. Thereby, the gap 58 is isolated from the processing liquid R. Of the supply pipe 50, at least the inner pipe 52 and the outer pipe 54 may be made of a material having a higher optical signal permeability than the container 40.

  In the gap 58, a plurality of optical sensors D1 (first sensors) and optical sensors D2 (second sensors) are provided. That is, the optical sensor D1 and the optical sensor D2 are provided between the inner peripheral surface 50a and the outer peripheral surface 50b. The plurality of optical sensors D <b> 1 are arranged along the longitudinal direction of the supply pipe 50. Each of the plurality of optical sensors D1 detects the presence or absence of the processing liquid R outside the outer peripheral surface 50b.

  As an example, as shown in FIG. 6, the optical sensor D1 includes a light source Ls that emits light L and a light receiving unit Lr that detects the reflected light. The optical sensor D1 is disposed to face the outer tube 54 side. That is, the optical sensor D1 is disposed such that the light source Ls emits light L toward the outer tube 54, and the light receiving unit Lr detects reflected light from the outer tube 54. Accordingly, it is possible to detect the presence or absence of the processing liquid R outside the outer peripheral surface 50b at substantially the same height as the optical sensor D1. For example, as shown in FIG. 6A, when there is no processing liquid R, the light L is reflected by the outer peripheral surface 50b and received by the light receiving unit Lr. Further, as shown in FIG. 6B, when the processing liquid R is present, the light L is not reflected by the outer peripheral surface 50b and is not received by the light receiving unit Lr.

  According to such an optical sensor D1, it is possible to detect whether the liquid surface Ra is above or below the substantially same height as the optical sensor D1 as information on the height H of the liquid surface Ra. . And the information regarding the height H of the liquid surface Ra is detected with higher resolution by arranging the plurality of optical sensors D1.

  The optical sensor D2 is provided between the outer peripheral surface 50b and the inner peripheral surface 50a, and detects the presence or absence of the processing liquid R inside the inner peripheral surface 50a. Specifically, the optical sensor D2 is configured in the same manner as the optical sensor D1, and is arranged to face the inner tube 52 side.

  The optical sensor D1 and the optical sensor D2 are fixed to, for example, a rod-shaped member B inserted into the gap 58, and are positioned thereby. As described above, since the gap 58 is isolated from the processing liquid R by the inner tube 52, the outer pipe 54, and the sealing portion 56, the optical sensor D1 and the optical sensor D2 are also isolated from the processing liquid R.

  The adjustment mechanism 60 is provided on the top of the cap 42. The adjustment mechanism 60 has a fixed part 62 and a movable part 64.

  The fixing portion 62 protrudes in a cylindrical shape from around the through hole 42 a formed in the cap 42. A male screw part 62 a is formed on the outer peripheral surface of the fixed part 62. The movable portion 64 includes an outer cylinder portion 65 that surrounds the fixed portion 62 and a lid portion 66 that closes the upper portion thereof. A female screw portion 65 a corresponding to the male screw portion 62 a is formed on the inner peripheral surface of the outer cylinder portion 65. For this reason, the movable part 64 can be moved up and down with respect to the fixed part 62 by rotating the movable part 64 with respect to the fixed part 62. The lid 66 is formed with an opening 66a into which the supply pipe 50 is inserted. A pair of flange portions 67 sandwiching the lid portion 66 are formed on the outer periphery of the upper portion of the supply pipe 50. Thereby, the supply pipe 50 moves up and down as the movable portion 64 moves up and down, and the insertion length of the supply pipe 50 into the container 40 is changed. As the supply pipe 50 moves up and down, the optical sensor D1 and the optical sensor D2 also move up and down. That is, the optical sensor D <b> 1 and the optical sensor D <b> 2 are provided in a portion that moves with adjustment of the insertion length in the supply pipe 50.

(Control part)
Returning to FIG. 4, the control unit 100 will be described. The control unit 100 includes a main body unit 100A and a display unit 100B. The main body 100A includes a conveyance control unit 110, a coating control unit 120, a first detection unit 130, a second detection unit 140, and a display control unit as components for executing processing using the coating unit U1. 150.

  The transfer control unit 110 controls the rotation holding unit 20 and the transfer arm A3 so as to load and unload the wafer W into the coating unit U1.

  The application control unit 120 controls the compressor 70, the valve V1, and the valve V2 so that the processing liquid R is discharged from the nozzle 32 onto the processing target wafer W, and the processing liquid R discharged from the nozzle 32 is processed. The rotation holding unit 20 is controlled so as to rotate the wafer W to be processed at a rotation speed for spreading on the wafer W.

  The first detection unit 130 detects information related to the height H of the liquid surface Ra of the processing liquid R in the container 40 based on the output from the optical sensor D1.

  The second detection unit 140 detects the presence or absence of the processing liquid R inside the inner peripheral surface 50a based on the output from the optical sensor D2.

  The display control unit 150 controls the display unit 100 </ b> B so as to notify the remaining state of the processing liquid R based on the detection results of the first detection unit 130 and the second detection unit 140.

  The main body 100A is constituted by one or a plurality of control computers, for example. In this case, each element of the main body 100A is configured by executing a program in cooperation with a processor and a memory of a control computer. This program may be recorded on a computer-readable recording medium. Examples of the computer-readable recording medium include a hard disk, a compact disk, a flash memory, a flexible disk, and a memory card.

  Note that the hardware configuring each element of the main body 100A is not necessarily limited to the processor and the memory. For example, each element of the main body 100A may be configured by an electric circuit specialized for its function, or may be configured by an ASIC (Application Specific Integrated Circuit) in which the electric circuit is integrated. Moreover, each component mentioned above is only what divided | segmented the function of the control part 100 into the some block for convenience, and the hardware of the control part 100 does not need to be divided | segmented for every these elements.

[Liquid treatment method]
Next, as an example of the liquid treatment method, a procedure for applying the treatment liquid R by the application unit U1 will be described.

  As shown in FIG. 7, first, the control unit 100 executes step S01. In step S01, the transfer control unit 110 controls the rotation holding unit 20 and the transfer arm A3 so as to load the wafer W into the coating unit U1. Specifically, the transfer control unit 110 controls the elevating unit 23 to raise the holding unit 21 to the outside of the cup 25, and controls the transfer arm A <b> 3 to place the wafer W on the holding unit 21. The holding unit 21 is controlled to suck the placed wafer W, and the elevating unit 23 is controlled to lower the wafer W into the cup 25.

  Next, the control part 100 performs step S02. In step S02, the application control unit 120 controls the compressor 70, the valve V1, and the valve V2 so that the processing liquid R is discharged from the nozzle 32 onto the wafer W to be processed, and the processing liquid R discharged from the nozzle 32 is discharged. The coating control unit 120 controls the rotation holding unit 20 so as to rotate the processing target wafer W at a rotation speed for spreading on the processing target wafer W.

  Next, the control part 100 performs step S03. In step S03, the conveyance control unit 110 controls the rotation holding unit 20 and the conveyance arm A3 so that the wafer W is unloaded from the coating unit U1. Specifically, the transfer control unit 110 controls the elevating unit 23 to raise the wafer W to the outside of the cup 25, controls the holding unit 21 to release the adsorption of the wafer W, and holds the wafer W in the holding unit. The transport arm A <b> 3 is controlled so as to be received from the top 21 and carried out, and the elevating unit 23 is controlled so as to lower the holding unit 21 into the cup 25.

  Next, the control part 100 performs step S04. In step S04, the first detection unit 130 detects information related to the height H of the liquid surface Ra of the processing liquid R in the container based on the output from the optical sensor D1.

  Next, the control part 100 performs step S05. In Step S05, the second detection unit 140 detects the presence or absence of the processing liquid R inside the inner peripheral surface 50a of the supply pipe 50 based on the output from the optical sensor D2.

  Next, the control part 100 performs step S06. In step S06, the display control unit 150 determines whether or not the height H of the liquid level Ra is larger than the threshold based on the detection result in step S04. The threshold can be set as appropriate.

  If it is determined in step S06 that the height H of the liquid surface Ra is larger than the threshold value, the control unit 100 ends the process.

  If it is determined in step S06 that the height H of the liquid surface Ra is the same as or smaller than the threshold value, the control unit 100 executes step S07. In step S07, the display control unit 150 determines whether or not the inside of the supply pipe 50 is filled with the processing liquid R based on the detection result of the second detection unit 140. For example, when it is detected in step S05 that the processing liquid R is present inside the inner peripheral surface 50a, the display control unit 150 determines that the inside of the supply pipe 50 is filled with the processing liquid R.

  If it determines with the inside of the pipe | tube of the supply pipe | tube 50 being filled with the process liquid R in step S07, the control part 100 will perform step S08. In step S08, the display control unit 150 controls the display unit 100B so as to notify the remaining state of the processing liquid R in the container 40 based on the detection result of the first detection unit 130. For example, the display control unit 150 may control the display unit 100B so as to calculate information related to the remaining period of the processing liquid R as the remaining state and notify this.

  Specifically, the display control unit 150 controls the display unit 100B so as to display a symbol indicating the remaining state of the processing liquid R, for example. (A)-(e) of FIG. 8 is an example of the pattern which shows the remaining state of the process liquid R. FIG.

  If it is determined in step S07 that the inside of the supply pipe 50 is not filled with the processing liquid R, the control unit 100 executes step S09. In step S09, the display control unit 150 controls the display unit 100B so as to notify that the container 40 is empty. Here, the inside of the container 40 being empty means that the remaining amount has decreased to a state where the supply of the processing liquid R cannot be continued without mixing gas.

  As described above, the coating unit U1 is inserted into the container 40 for containing the processing liquid R for substrate processing, and the outer periphery of the supply pipe 50 that forms a pipeline for supplying the processing liquid R. An optical sensor D1 that is provided between the surface 50b and the inner peripheral surface 50a and detects information related to the height H of the liquid surface Ra of the processing liquid R in the container 40.

  According to this coating unit U1, information regarding the height H of the liquid surface Ra of the processing liquid R is detected by the optical sensor D1 as information regarding the remaining amount of the processing liquid R. Thereby, the information regarding the remaining amount of the processing liquid R can be detected.

  The optical sensor D1 is incorporated in the supply pipe 50. If the container 40 is provided with a sensor, it is necessary to replace the optical sensor D1 with the container 40 every time the container 40 is replaced. On the other hand, since the optical sensor D1 is incorporated in the supply pipe 50, it is possible to prevent the workability of the work for replacing the container 40 from being lowered. Further, the configuration can be simplified as compared with the case where the optical sensor D1 and the supply pipe 50 are separately inserted into the container 40.

  Since the optical sensor D1 is provided between the outer peripheral surface 50b and the inner peripheral surface 50a of the supply pipe 50, the optical sensor D1 is isolated from the processing liquid R. Therefore, mixing of foreign matter from the optical sensor D1 into the processing liquid R is suppressed.

  The optical sensor D1 detects information related to the height H of the liquid surface Ra of the processing liquid R outside the outer peripheral surface 50b. The height H of the liquid surface Ra of the processing liquid R is formed outside the outer peripheral surface 50 b of the supply pipe 50. For this reason, by configuring the optical sensor D1 to detect information on the height H of the liquid surface Ra of the processing liquid R outside the outer peripheral surface 50b, information on the remaining amount of the processing liquid R is detected with high accuracy. can do. However, this configuration is not essential. For example, even when viewing the inside of the inner peripheral surface 50a, the liquid surface Ra is at a height at which the supply of the processing liquid R can be continued based on whether or not gas is mixed in the supply pipe 50. Whether or not can be detected.

  The optical sensor D1 detects the presence or absence of the processing liquid R as information regarding the height H of the liquid surface Ra of the processing liquid R. For this reason, the configuration of the optical sensor D1 can be simplified by simplifying the detection target. However, this configuration is not essential. Even when the detection target by the optical sensor D1 is only the presence or absence of the processing liquid R, for example, information on the height H is obtained, such as information on whether the sensor is on the upper side or the lower side compared to the sensor. . The optical sensor D1 may be replaced with a sensor that detects the value of the height H according to the liquid pressure of the processing liquid R or the like.

  The coating unit U1 includes a plurality of optical sensors D1 arranged along the longitudinal direction of the supply pipe 50. A plurality of information about the height H of the liquid surface Ra of the processing liquid R outside the outer peripheral surface 50b is detected by the plurality of optical sensors D1. For this reason, the height H of the liquid surface Ra can be determined with higher accuracy. However, if the number of optical sensors D1 is one or more, information on the height H can be obtained, and therefore a configuration in which a plurality of optical sensors D1 are arranged is not essential.

  The coating unit U1 is further provided with an optical sensor D2 that is provided between the outer peripheral surface 50b and the inner peripheral surface 50a and detects the presence or absence of the processing liquid R inside the inner peripheral surface 50a. For this reason, based on the presence or absence of the processing liquid R inside the inner peripheral surface 50a, it is possible to detect whether or not the remaining amount of the processing liquid R is an amount capable of continuing supply. However, such a configuration is not essential.

  The supply pipe 50 includes an inner pipe 52 that forms an inner peripheral surface 50 a, and an outer pipe 54 that surrounds the inner pipe 52 with a gap 58 and forms an outer peripheral surface 50 b, and the optical sensor D 1 It is provided between the inner pipe 52. For this reason, the optical sensor D1 can be easily arranged using the gap 58 between the inner tube 52 and the outer tube 54. However, such a configuration is not essential. For example, as shown in FIG. 9A, even if the pore P along the axial direction of the supply pipe 50 is formed in the wall portion of the single pipe, the optical sensor D1 is arranged in the pore P. Good. Further, as shown in FIG. 9B, a plurality of pores P arranged in the circumferential direction may be formed, and the optical sensor D1 may be disposed in each of the plurality of pores P. By changing the depth of each pore P, the optical sensor D1 can be positioned in the axial direction. Furthermore, the optical sensor D1 may be embedded in the wall portion of the single tube.

  When the optical sensor D <b> 1 is used as the first sensor, the supply pipe 50 may have a higher optical signal permeability than the container 40. In this case, since the detection sensitivity of the optical sensor is increased, information regarding the remaining amount of the processing liquid R can be detected with higher accuracy. Further, when the processing liquid R is photosensitive, the light shielding properties of the container 40 may have to be improved in order to prevent the processing liquid R from being denatured. In such a case, the above configuration is particularly effective.

  The sensor is not limited to the optical sensor D1 or the optical sensor D2. For example, the height H of the liquid level Ra may be detected by a capacitance sensor. The pressure in the processing liquid R may be estimated by a sensor that detects the distortion of the supply pipe 50, and the height H of the liquid surface Ra may be detected based on the pressure. The height H of the liquid surface Ra may be detected by ultrasonic waves.

  The coating unit U1 further includes an adjusting mechanism 60 capable of adjusting the insertion length of the supply pipe 50 with respect to the container 40, and the optical sensor D1 is provided in a portion of the supply pipe 50 that moves as the insertion length is adjusted. It is. For this reason, since the position of the optical sensor D1 is also adjusted as the insertion length of the supply pipe 50 is changed according to the depth of the container 40, the depth of the container 40 can be reduced without complicated operations. The position adjustment of the corresponding optical sensor D1 can be reliably performed. For this reason, the information regarding the remaining amount of the processing liquid R can be detected with higher accuracy. The mechanism of the adjusting mechanism 60 is not limited to the one described above.

  In the liquid processing method according to the present embodiment, the processing liquid R is supplied using a supply pipe 50 that is inserted into a container 40 for containing the processing liquid R for substrate processing and forms a conduit for supplying the processing liquid R. That is, detecting information about the height H of the liquid surface Ra of the processing liquid R using the optical sensor D1 provided between the outer peripheral surface 50b and the inner peripheral surface 50a of the supply pipe 50, Informing the remaining state of the processing liquid R based on information on the height H of the liquid surface Ra.

  According to this liquid processing method, information relating to the height H of the liquid surface Ra can be detected as information relating to the remaining amount of the processing liquid R by the optical sensor D1 provided in the supply pipe 50 for supplying the processing liquid. Furthermore, since the remaining state can be notified based on the detected information on the height H of the liquid level Ra, for example, the operator can grasp the remaining state of the processing liquid R.

  The liquid processing method may calculate information related to the remaining period of the processing liquid R based on information related to the height H of the liquid surface Ra of the processing liquid R, and report information related to the remaining period of the processing liquid R as the remaining state. May be. In this case, for example, the operator can grasp the remaining period of the processing liquid R and prompt the preparation of a replenishing coating liquid.

  Although the embodiment has been described above, the present invention is not necessarily limited to the above-described embodiment, and various modifications can be made without departing from the scope of the invention.

  For example, an apparatus to which the present disclosure can be applied is not limited to a semiconductor manufacturing apparatus. For example, the wafer W may be a semiconductor substrate, a glass substrate, a mask substrate, an FPD (Flat Panel Display) substrate, or other various substrates.

  DESCRIPTION OF SYMBOLS 40 ... Container, 50 ... Supply pipe, 50a ... Inner peripheral surface, 50b ... Outer peripheral surface, D1 ... Optical sensor, R ... Processing liquid, Ra ... Liquid surface, U1 ... Coating unit.

Claims (10)

A supply pipe that is inserted into a container for containing a processing liquid for substrate processing and forms a pipeline for supplying the processing liquid;
A liquid processing apparatus comprising: a first sensor that is provided between an outer peripheral surface and an inner peripheral surface of the supply pipe and detects information related to a height of a liquid level of the processing liquid in the container.   The liquid processing apparatus according to claim 1, wherein the first sensor detects information related to a height of a liquid level of the processing liquid outside the outer peripheral surface.   The liquid processing apparatus according to claim 1, wherein the first sensor detects the presence or absence of the processing liquid as information relating to a height of a liquid level of the processing liquid.   The liquid processing apparatus as described in any one of Claims 1-3 provided with several said 1st sensors arrange | positioned along the longitudinal direction of the said supply pipe | tube.   5. The apparatus according to claim 1, further comprising a second sensor that is provided between the outer peripheral surface and the inner peripheral surface and detects the presence or absence of the processing liquid inside the inner peripheral surface. Liquid processing equipment. The supply pipe has an inner pipe that forms the inner peripheral surface, an outer pipe that surrounds the inner pipe with a gap and forms the outer peripheral surface,
The liquid processing apparatus according to claim 1, wherein the first sensor is provided between the outer tube and the inner tube. The first sensor is an optical sensor using an optical signal,
The liquid processing apparatus according to any one of claims 1 to 6, wherein the supply pipe has higher transparency of the optical signal than the container. An adjustment mechanism capable of adjusting an insertion length of the supply pipe with respect to the container;
The first sensor is provided in a portion that moves with adjustment of the insertion length in the supply pipe.
The liquid processing apparatus as described in any one of Claims 1-7. Supplying the processing liquid using a supply pipe inserted into a container for storing a processing liquid for substrate processing and forming a pipe for supplying the processing liquid;
Detecting information related to the height of the liquid surface of the processing liquid using a first sensor provided between an outer peripheral surface and an inner peripheral surface of the supply pipe;
Informing the remaining state of the processing liquid based on information on the height of the liquid level of the processing liquid.   The liquid according to claim 9, wherein information on a remaining period of the processing liquid is calculated based on information on a height of the liquid level of the processing liquid, and information on the remaining period of the processing liquid is notified as the remaining state. Processing method.

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