JP2016086021A - Defect correction device and defect correction method for substrate and defect correction part structure for substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To appropriately correct the disconnected portion of an electrode pattern formed on a substrate by using paste-like conductive materials.SOLUTION: A defect correction device 100 includes: a squeegee probe 10; a Z stage 120; an XY stage 110; and a control device 200. The squeegee probe 10 shapes paste 4 applied to a disconnected portion 3. The control device 200 controls a Z stage 120 such that a distance D between the squeegee probe 10 and electrode patterns 21 and 22 becomes a predetermined value Dth, and controls the XY stage 110 to scan the squeegee probe 10 in a state that the distance D is held to be the predetermined value Dth. The predetermined value Dth is determined in accordance with a contraction amount by the burning of the paste 4.SELECTED DRAWING: Figure 8

Description

  The present invention relates to a defect correction apparatus and defect correction method for a substrate, and a defect correction portion structure for a substrate, and more specifically, a broken portion of an electrode pattern formed on a substrate is corrected using a paste-like conductive material. The present invention relates to a defect correcting apparatus and a defect correcting method for a substrate, and a defect correcting portion structure of the substrate formed by using the defect correcting method.

  In recent years, high value-added printed circuit boards have been put into practical use. Specific examples of such a printed circuit board include a high-density multilayer board including a plurality of wiring layers in which electrode patterns are formed at a high density, and a component-embedded board in which resistors, inductors, capacitors, etc. are arranged in an inner layer. Can be mentioned. In the production of these printed circuit boards, it is particularly required to improve the yield and reduce the cost. Therefore, when an electrode pattern disconnection (open defect) is found in the inspection process, there is an increasing demand for a technique for correcting the disconnection portion instead of simply discarding the substrate as a defective product.

  For example, Japanese Patent No. 2983879 (Patent Document 1) discloses a method for correcting a substrate in which a paste is applied by bringing a needle to which the paste is attached into contact with a corrected portion (see, for example, FIG. 3 of Patent Document 1).

  Further, for example, Japanese Patent No. 3705688 (Patent Document 2) discloses a method for correcting a defective portion generated in a rib formed on a substrate. This correction method includes a step of applying a paste to the defective portion and a step of shaping the paste so that the thickness of the applied paste is substantially equal to the height of the rib by scanning the shaping member.

Japanese Patent No. 2983879 Japanese Patent No. 3705688

  In the multilayer substrate, when the disconnection portion is corrected using the correction method disclosed in Patent Document 1, the thickness of the correction portion (the thickness after baking of the paste applied to the disconnection portion) may be larger than an appropriate value. In this case, there is a possibility that a sufficient distance cannot be ensured between the corrected portion and the electrode pattern disposed in the upper layer of the portion, and electrical noise is likely to occur. However, Patent Document 1 does not particularly take into consideration the thickness of the corrected portion.

  On the other hand, Patent Document 2 discloses that the paste is shaped so that the thickness of the applied paste is substantially equal to the height of the rib, but this shaping is performed based on the height of the paste immediately after application. Therefore, if the paste shrinks due to baking after shaping, the thickness of the corrected portion may be smaller than the appropriate value. In this case, since the resistance at the correction location becomes relatively large, the heat loss increases, and there is a high possibility that the disconnection will occur again at the correction location in the future.

  The present invention has been made to solve the above-described problems, and an object thereof is to appropriately correct a broken portion of an electrode pattern formed on a substrate.

  A defect correction apparatus for a substrate according to an aspect of the present invention corrects a disconnected portion of an electrode pattern formed on a substrate using a paste that develops conductivity by firing. The defect correction apparatus for a substrate includes a shaping member, an adjustment mechanism, a scanning mechanism, and a control device that controls the adjustment mechanism and the scanning mechanism. The shaping member is provided for shaping the paste applied to the disconnected portion. The adjustment mechanism adjusts the distance between the shaping member and the electrode pattern. The scanning mechanism scans the shaping member with respect to the applied paste. The control device controls the adjusting mechanism so that the distance becomes a predetermined value, and scans the shaping member by the shaping mechanism in a state where the distance is held at the predetermined value. The predetermined value is determined according to the amount of shrinkage caused by baking the paste.

  Preferably, the predetermined value is a difference between the thickness of the paste after scanning and before firing and the thickness of the electrode pattern. The thickness of the paste after scanning and before firing is determined such that when the paste shrinks due to firing, the thickness of the paste after shrinkage is substantially the same as the thickness of the electrode pattern.

  Preferably, the shaping member includes a needle-like member. The needle-like member has a cylindrical base end and a wedge-shaped front end provided at the tip of the base end.

  Preferably, the defect correction apparatus for a substrate further includes a detection unit that detects that the shaping member has contacted the electrode pattern under the control of the adjustment mechanism. The control device adjusts the distance based on the detection result by the detection unit.

  A defect correction method for a substrate according to another aspect of the present invention corrects a broken portion of an electrode pattern formed on the substrate. A defect correction method for a substrate includes a step of applying a paste that develops conductivity by firing to a disconnected portion, a step of adjusting a distance between the shaping member and the electrode pattern to be a predetermined value, and the above distance. A step of scanning the shaping member with respect to the paste applied to the broken portion and a step of firing the paste-like conductive material shaped by the scanning in a state where the predetermined value is maintained. The predetermined value is determined according to the amount of shrinkage caused by baking the paste.

  Preferably, the predetermined value is a difference between a thickness of the paste after execution of the scanning step and before execution of the baking step, and a thickness of the electrode pattern. The thickness of the paste after execution of the scanning step and before execution of the firing step is such that when the paste applied to the disconnected portion is shrunk by the firing step, the thickness of the paste after the shrinkage is an electrode. It is determined to be substantially the same as the thickness of the pattern.

  Preferably, the substrate defect correcting method further includes a step of drying the applied paste prior to the scanning step.

  Preferably, in the applying step, the paste is applied so that the paste overlaps at least a part of the electrode pattern.

  In the defect correcting portion structure for a substrate according to still another aspect of the present invention, the paste fired using the defect correcting method for the substrate is formed so as to overlap with at least a part of the electrode pattern.

  According to the present invention, the broken portion of the electrode pattern formed on the substrate can be appropriately corrected using the paste-like conductive material.

It is a top view of the board | substrate for demonstrating an example of the board | substrate with which the defect correction method concerning this Embodiment is applied. It is sectional drawing of the board | substrate along the II-II line of FIG. It is a figure which shows the whole structure of the defect correction apparatus which concerns on this Embodiment. It is a figure for demonstrating a mode that a disconnection part is corrected using the squeegee needle | hook attached to the correction unit shown in FIG. It is an enlarged view of the squeegee needle shown in FIG. It is an enlarged view of the squeegee needle shown in FIG. It is an enlarged view of the squeegee needle shown in FIG. 3 is a flowchart for explaining a defect correction method for a substrate in the first embodiment. It is a figure which represents typically each process of the defect correction method shown in FIG. 6 is a flowchart for explaining a defect correction method for a substrate in the second embodiment. It is a figure which represents typically each process of the defect correction method shown in FIG. It is a figure which shows the board | substrate used for evaluation of the reduction effect of resistance. FIG. 13 is a cross-sectional view of the substrate along the line XIII-XIII shown in FIG. 12. It is a figure which shows the evaluation result of the reduction effect of resistance.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals and description thereof will not be repeated.

[Configuration common to each embodiment]
<Substrate to be corrected>
FIG. 1 is a plan view of a substrate for explaining an example of the substrate to which the defect correcting method according to the present embodiment is applied. FIG. 2 is a cross-sectional view of the substrate along the line II-II in FIG.

  Referring to FIGS. 1 and 2, substrate 1 is, for example, a printed circuit board, and electrode patterns are formed with high density so that many electronic components can be mounted. In the example shown in FIGS. 1 and 2, electrode patterns 21 and 22 and electrode patterns 23 and 24 adjacent to the electrode patterns 21 and 22 are shown as part of the electrode pattern.

  The electrode patterns 21 and 22 are originally designed as one electrode pattern, but are disconnected at the disconnected portion 3. The disconnection occurs along the direction in which the electrode patterns 21 and 22 extend. In FIG. 1, both sides of the broken portion 3 in the outline of the broken portion 3 are indicated by broken lines.

  1 and 2, the electrode pattern 21 and the electrode pattern 22 are completely disconnected at the disconnection portion 3, but the disconnection mode is not limited to this. For example, a thin pattern (a pattern having a width smaller than the width of the electrode patterns 21 and 22) electrically connected to the electrode patterns 21 and 22 may exist in the disconnected portion 3.

<Configuration of defect correction device>
FIG. 3 is a diagram showing an overall configuration of the defect correction apparatus according to the present embodiment. With reference to FIG. 3, the defect correction apparatus 100 includes an XY stage 110, a vacuum chuck table 120, a Z stage 130, a correction unit 140, a laser light source 150, an imaging apparatus 160, and a control apparatus 200. . The X direction and the Y direction represent the horizontal direction. The Z direction represents the vertical direction, and the direction of gravity is downward in the Z direction.

  The XY stage 110 (scanning mechanism) is configured to be able to move in the horizontal direction under the control of the control device 200. The vacuum chuck table 120 is provided on the XY stage 110, and fixes the workpiece W (for example, the substrate 1 shown in FIGS. 1 and 2) to be corrected on the XY stage 110.

  The Z stage 130 (adjustment mechanism) is configured to be able to move in the vertical direction based on the control of the control device 200. The Z stage 130 is provided with a correction unit 140, a laser light source 150, and an imaging device 160.

  The correction unit 140 is configured so that needles of various shapes and sizes can be attached. More specifically, the correction unit 140 includes an application needle (not shown) for applying a paste for correcting a broken portion, and a squeegee needle 10 (a shaping member) for shaping the applied paste. Can be attached. The paste develops conductivity by firing. The shape of the squeegee needle 10 employed in the present embodiment will be described in detail later with reference to FIGS. The control device 200 adjusts the distance between the needle (coating needle or squeegee needle 10) and the workpiece W by moving the Z stage 130 in the vertical direction, and moves the XY stage 110 in the horizontal direction. Scan the needle against W.

The laser light source 150 emits laser light for baking or drying the applied paste. The type of the laser light source 150 is not particularly limited. For example, a CO ₂ laser or a semiconductor laser can be used for the laser light source 150. The control device 200 adjusts the irradiation position of the laser light by moving the XY stage 110 and the Z stage 130.

  The imaging device 160 images the workpiece W and outputs the captured image data to the control device 200. As one embodiment, a CCD (Charge Coupled Device) camera can be used for the photographing device 160. The control device 200 controls the movement direction and movement amount of the XY stage 110 and the Z stage 130 based on the image data from the imaging device 160.

  As described above, the control device 200 controls the XY stage 110, the Z stage 130, the laser light source 150, and the photographing device 160. The control device 200 is realized by a microcomputer or a personal computer, for example.

  Note that the configurations of the XY stage 110 and the Z stage 130 are limited to the above configurations as long as the correction unit 140 and the laser light source 150 can be moved relative to the workpiece W (for example, the substrate 1). It is not a thing.

  FIG. 4 is a diagram for explaining how the broken portion 3 is corrected using the squeegee needle 10 attached to the correction unit 140 shown in FIG. 3 and 4, the squeegee needle 10 shapes the paste 4 applied to the disconnected portion 3 by scanning in the horizontal direction along the upper surfaces of the electrode patterns 21 and 22.

  The squeegee needle 10 is provided with a strain gauge 15 (detection unit). The strain gauge 15 detects the strain of the squeegee needle 10 and outputs the detection result to the control device 200. The control device 200 can detect that the squeegee needle 10 is in contact with the upper surfaces of the electrode patterns 21 and 22 based on the distortion of the squeegee needle 10.

  5 to 7 are enlarged views of the squeegee needle 10 shown in FIG. With reference to FIGS. 5 to 7, the squeegee needle 10 includes a cylindrical base end portion 11 and a wedge-shaped front end portion 12 provided at the front end of the base end portion 11. The wedge shape is formed by a plane 121 and a plane 122 that are inclined with respect to the central axis L of the cylindrical base end portion 11, for example. By shaping the paste 4 using the straight part 123 where the planes 121 and 122 intersect, the surface of the shaped paste 4 can be satisfactorily flattened (see FIG. 4).

[Embodiment 1]
FIG. 8 is a flowchart for explaining the defect correcting method for substrate 1 in the first embodiment. FIG. 9 is a diagram schematically showing each step of the defect correcting method shown in FIG.

  8 and 9, in step (hereinafter abbreviated as S) 10, control device 200 applies paste 4 to disconnection portion 3 between electrode patterns 21 and 22 (see FIG. 9A). . The method for applying the paste 4 is not particularly limited. For example, even when the paste 4 is applied to the tip of an application needle (not shown), the dispenser (not shown) applies the paste by pushing it out of the nozzle. May be used.

  In S <b> 20, the control device 200 controls the Z stage 130 to move the squeegee needle 10 downward in the vertical direction and bring the tip 12 of the squeegee needle 10 into contact with the upper surface of one of the electrode pattern 21 and the electrode pattern 22. . In the example shown in FIG. 4 and FIG. 9B, the case where the tip 12 of the squeegee needle 10 is brought into contact with the upper surface of the electrode pattern 22 is shown. The control device 200 can determine that the tip 12 has contacted the upper surface of the electrode pattern 22 when the detection value of the strain gauge 15 exceeds a predetermined determination value.

  In S30, the control device 200 controls the Z stage 130 to move the squeegee needle 10 upward in the vertical direction with reference to the height of the upper surface of the electrode pattern 22 (see FIG. 9C). This amount of movement, in other words, the distance D between the tip 12 of the squeegee needle 10 and the electrode patterns 21 and 22 is determined according to the amount of shrinkage due to baking of the paste 4.

  More specifically, even after firing, the thickness DA of the paste 4 is substantially equal to the thickness DB of the electrode patterns 21 and 22 (so that the difference between them is about several μm), or the thickness DA of the paste 4 The distance D is set to a predetermined value Dth in consideration of the shrinkage amount of the paste 4 due to the firing so that the thickness DB becomes slightly larger than the thickness DB of the electrode patterns 21 and 22 (for example, about 10 μm) (FIG. 9). (See (d) and (f)). In other words, the predetermined value Dth is the difference between the thickness of the paste 4 after scanning and before firing and the thickness of the electrode patterns 21 and 22, and the thickness 4 of the paste after scanning and before firing is the firing of the paste 4 It is determined according to the amount of contraction due to. Preferably, the thickness of the paste 4 after scanning and before firing is such that when the paste 4 shrinks due to firing, the thickness DA of the paste 4 after shrinkage is substantially equal to the thickness DB of the electrode patterns 21 and 22. It is determined to be the same. Here, “substantially the same” may include, for example, an error of about several μm to 10 μm.

  The predetermined value Dth is, for example, the characteristics (material, metal content, metal particle size, solvent, viscosity, etc.) of the paste 4, firing conditions (temperature profile, firing atmosphere, etc.), and the shape (length, width) of the disconnected portion 3. , Thickness, etc.) can be determined experimentally.

  The amount of movement of the squeegee needle 10 until the distance D between the tip 12 of the squeegee needle 10 and the electrode pattern 21 (or electrode pattern 22) reaches a predetermined value Dth is the tip 12 of the squeegee needle 10 and the electrode. It is preferable to set in consideration of a criterion for determining whether or not the upper surface of the pattern 21 is in contact. As an example, when determining that the contact is made even if the detection value of the strain gauge 15 slightly changes from 0, the control device 200 sets the movement amount to a certain value ΔZ1. On the other hand, when the contact value is determined when the detected value exceeds a determination value that is somewhat larger than 0, the control device 200 sets the movement amount to another value ΔZ2 (ΔZ2> ΔZ1).

  In S40, the control device 200 scans the paste 4 applied to the disconnected portion 3 in the horizontal direction in a state where the distance D is maintained at the predetermined value Dth (see FIG. 9D and FIG. 9E). ). As a result, the paste 4 is shaped so that the thickness of the portion of the paste 4 above the upper surfaces of the electrode patterns 21 and 22 has a predetermined value Dth.

  In S50, the control device 200 irradiates the paste 4 with laser light under the control of the laser light source 150 to fire the paste 4 (see FIG. 9F). However, the baking method of the paste 4 is not limited to this, For example, you may use an electric furnace.

  Thus, according to Embodiment 1, the distance between the squeegee needle and the upper surface of the electrode pattern when scanning the squeegee needle is set in consideration of the shrinkage amount of the paste due to baking. As a result, the disconnected portion can be corrected so that the thickness of the corrected portion (the thickness of the paste after firing) is substantially equal to or slightly larger than the thickness of the normal portion of the electrode pattern.

  Therefore, when the defect correction method according to the first embodiment is applied to the laminated substrate, it is possible to prevent the distance between the electrode patterns between the laminated wiring layers from becoming smaller than an appropriate value. As a result, generation of electrical noise can be suppressed.

[Embodiment 2]
When the viscosity of the paste is relatively low, even if the paste is shaped by scanning with a squeegee needle, the shaped paste may not be able to maintain its shape until the firing process is started. In the second embodiment, a configuration for adjusting the viscosity of the paste to a viscosity suitable for the scanning process and the baking process (S40 and S50 shown in FIG. 9) will be described. The configuration of the defect correction apparatus according to the second embodiment is the same as the configuration of defect correction apparatus 100 described with reference to FIGS.

  FIG. 10 is a flowchart for explaining a defect correcting method for substrate 1 in the second embodiment. FIG. 11 is a diagram schematically showing each step of the defect correction method shown in FIG. The flowchart shown in FIG. 10 differs from the flowchart of the first embodiment shown in FIG. 8 in that it further includes the processes of S12 and S14. The other processes in the flowchart shown in FIG. 10 are the same as the corresponding processes in the flowchart shown in FIG. 8, and thus detailed description will not be repeated.

  Referring to FIGS. 10 and 11, in S12, control device 200 determines whether or not the viscosity of paste 4 is equal to or lower than a reference value. The user of the control device 200 can input, for example, the specification value of the viscosity of the paste 4 or the value measured by the viscometer into the control device 200 using the input device (not shown) as the viscosity of the paste 4. Control device 200 compares the input value with a predetermined reference value to determine whether paste 4 has a low viscosity.

  When the viscosity of paste 4 is higher than the reference value (NO in S12), control device 200 skips S14 and advances the process to S20, assuming that paste 4 has sufficient viscosity suitable for the scanning process and the firing process. . On the other hand, when the viscosity of paste 4 is equal to or lower than the reference value (YES in S12), control device 200 advances the process to S14, assuming that the viscosity of paste 4 is lower than the appropriate value.

  In S <b> 14, the control device 200 irradiates the paste 4 with laser light under the control of the laser light source 150 to dry the paste 4 (see FIG. 11B). Thereby, the viscosity of the paste 4 is adjusted so as to be a viscosity suitable for scanning and baking. The intensity and irradiation time of the laser beam can be experimentally determined according to the shape (length, width, thickness, etc.) of the applied paste 4 and the characteristics of the paste 4. Thereafter, the control device 200 advances the process to S20. Since the processing after S20 is equivalent to the corresponding processing in Embodiment 1 (see FIG. 8), detailed description will not be repeated.

  Thus, according to Embodiment 2, when the paste has a low viscosity, the paste is dried prior to shaping with the squeegee. Thereby, the viscosity of the paste can be increased so that the viscosity is suitable for shaping with a squeegee, and the shape of the shaped paste can be maintained until the firing step is started. Therefore, it becomes possible to use a paste having a lower viscosity, so that the selection range of the paste can be expanded.

<Reducing effect of resistance>
According to the correction method according to the present embodiment, since the thickness of the corrected portion after firing is prevented from becoming smaller than an appropriate value, the corrected portion has a resistance comparable to that of a normal portion of the electrode pattern. The resistance can be reduced. Hereinafter, the results of evaluating the resistance reduction effect using the electrode pattern (test pattern) will be described.

  FIG. 12 is a diagram illustrating a substrate used for evaluating the resistance reduction effect. 13 is a cross-sectional view of the substrate along the line XIII-XIII shown in FIG. Referring to FIGS. 12 and 13, the width and thickness of electrode patterns 21 and 22 were 50 μm and 30 μm, respectively. The length of the disconnected portion 3 between the electrode patterns 21 and 22 was 100 μm. Although not shown, each of the electrode patterns 21 and 22 formed on the substrate 1 has a length of 10 mm.

  The disconnected portion 3 was corrected using the paste 4. As the paste 4, a paste containing metal particles and having a shrinkability in which the volume is reduced by heating was used. A squeegee condition was changed when applying the paste 4, and a comparative example and six types of samples were prepared. In each sample, as parameters, the thickness D1 of the portion of the paste 4 overlapping the upper surface of the electrode pattern 21, the height H of the central portion of the paste 4 with respect to the upper surfaces of the electrode patterns 21 and 22 in the disconnected portion 3, and the paste 4 Among them, the thickness D2 of the overlapping portion with the upper surface of the electrode pattern 22, the length L1 of the overlapping portion between the electrode pattern 21 and the paste 4, and the length L2 of the overlapping portion between the electrode pattern 22 and the paste 4 were used. . With respect to the substrate 1 after correction, the resistance between the electrode pattern 21 and the electrode pattern 22 was measured.

  FIG. 14 is a diagram illustrating an evaluation result of a resistance reduction effect. In FIG. 14, the resistance ratio indicates the resistance value of the sample (= electrode pattern resistance value of the sample / resistance value of the electrode pattern of the comparative example) based on the comparative example in which no disconnection occurs.

  Referring to FIG. 14, the resistance values of Samples 5 and 6 were very large, which were 200 times or more and 23 times the resistance value of the comparative example, respectively. This is thought to be because the lengths L1 and L2 of the overlapping portions of the samples 4 and 5 are smaller than the appropriate value (the lower limit value of the appropriate range). Similarly, the resistance value of Sample 2 was very large, which was 9.2 times that of the comparative example. This is considered because the thicknesses D1 and D2 of the overlapping portions of the sample 2 are smaller than the appropriate values.

  On the other hand, the resistance values of Samples 3 and 4 could be reduced to 1.6 times the resistance value of the comparative example. This is presumably because the lengths L1 and L2 and the thicknesses D1 and D2 of the overlapping portions of the samples 3 and 4 are within appropriate ranges.

  Thus, from the evaluation results of Samples 5 and 6, it can be seen that an overlapping portion of a certain length is necessary to suppress the resistance of the corrected portion from becoming a very large value. And from the evaluation result of sample 2, by adjusting the thickness of the overlapping portion to be within an appropriate range, the resistance of the corrected portion is a normal electrode pattern (an electrode pattern in which no disconnection occurs as in the comparative example) It can be seen that the resistance can be reduced to the same level as the resistance. As a result, it is possible to reduce the possibility of disconnection occurring again due to an increase in heat loss at the corrected location. That is, the reliability of the substrate after correction can be improved.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  DESCRIPTION OF SYMBOLS 1 Substrate, 3 Disconnection location, 4 Paste, 10 Squeegee needle, 11 Base end, 12 Tip, 15 Strain gauge, 21-24 Electrode pattern, 100 Defect correction device, 110 XY stage, 120 Vacuum chuck table, 130 Z stage , 140 correction unit, 150 laser light source, 160 photographing device, 200 control device, W work.

Claims (9)

A defect correction apparatus for a substrate, wherein the broken portion of the electrode pattern formed on the substrate is corrected using a paste that develops conductivity by firing,
A shaping member for shaping the paste applied to the disconnected portion;
An adjustment mechanism for adjusting the distance between the shaping member and the electrode pattern;
A scanning mechanism for scanning the shaping member with respect to the applied paste;
A controller for controlling the adjustment mechanism and the scanning mechanism,
The control device controls the adjustment mechanism so that the distance becomes a predetermined value, and in the state where the distance is held at the predetermined value, scans the shaping member by the scanning mechanism,
The predetermined value is determined according to the amount of shrinkage caused by firing of the paste. The predetermined value is a difference between the thickness of the paste after scanning and before firing, and the thickness of the electrode pattern,
The thickness of the paste after scanning and before firing is determined such that when the paste shrinks due to firing, the thickness of the paste after shrinkage is substantially the same as the thickness of the electrode pattern. 2. The defect correction apparatus for a substrate according to 1. The shaping member includes a needle-shaped member,
The needle-shaped member is
A cylindrical base end;
The defect correction apparatus for a substrate according to claim 1, further comprising a wedge-shaped distal end portion provided at a distal end of the base end portion. A detection unit for detecting that the shaping member is in contact with the electrode pattern under the control of the adjustment mechanism;
The said control apparatus is a defect correction apparatus of the board | substrate of any one of Claims 1-3 which adjusts the said distance based on the detection result by the said detection part. A defect correction method for a substrate, which corrects a broken portion of an electrode pattern formed on the substrate,
Applying a paste that develops conductivity by firing to the disconnected portion; and
Adjusting the distance between the shaping member and the electrode pattern to be a predetermined value;
Scanning the shaping member with respect to the paste applied to the broken portion in a state where the distance is held at the predetermined value;
Firing the paste shaped by the scanning,
The predetermined value is determined in accordance with a shrinkage amount due to baking of the paste. The predetermined value is a difference between a thickness of the paste after execution of the scanning step and before execution of the baking step, and a thickness of the electrode pattern,
The thickness of the paste after execution of the scanning step and before execution of the firing step is such that when the paste is shrunk by the firing step, the thickness of the paste after the shrinkage is that of the electrode pattern. 6. The defect correction method for a substrate according to claim 5, wherein the defect correction method is determined so as to be substantially the same as the thickness.   The defect correction method for a substrate according to claim 5, further comprising a step of drying the applied paste prior to the scanning step.   The substrate defect correction method according to claim 5, wherein in the applying step, the paste is applied so that the paste overlaps at least a part of the electrode pattern.   The defect correction part structure of a board | substrate with which the said paste baked using the defect correction method of the board | substrate of any one of Claims 5-7 overlaps with at least one part of the said electrode pattern.

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