JP2016081884A - LED bulb - Google Patents

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JP2016081884A
JP2016081884A JP2014215592A JP2014215592A JP2016081884A JP 2016081884 A JP2016081884 A JP 2016081884A JP 2014215592 A JP2014215592 A JP 2014215592A JP 2014215592 A JP2014215592 A JP 2014215592A JP 2016081884 A JP2016081884 A JP 2016081884A
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led
case
conductor
power supply
conductive
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JP6451930B2 (en
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晴彦 岩▲さき▼
Haruhiko Iwasaki
晴彦 岩▲さき▼
征貴 百々
Masataka Momo
征貴 百々
介伸 西村
Sukenobu Nishimura
介伸 西村
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Ushio Denki KK
Ushio Inc
Shinsei Electronics Co Ltd
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Ushio Denki KK
Ushio Inc
Shinsei Electronics Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide an LED bulb capable of improving cooling efficiency and suppressing occurrence of noise failure to peripheral equipment.SOLUTION: An LED bulb includes: an LED element that emits light; an electric conductive LED case that has a communication part communicating an inside and an outside, and houses the LED element thereinside; a power source part that has an electric circuit supplying electricity to the LED element, and is arranged so as to separate from the LED case; a support part that supports the LED case and the power source part respectively; and an electrical connection mechanism that has an electric conductivity larger than an electric conductivity of the support part, and electrically connects the ground of the electric circuit and the LED case.SELECTED DRAWING: Figure 5

Description

本発明は、発光するＬＥＤ素子を備えるＬＥＤ電球に関する。   The present invention relates to an LED bulb including an LED element that emits light.

従来、ＬＥＤ電球として、発光するＬＥＤ素子と、内部と外部とを連通する連通部を有し、内部にＬＥＤ素子を収容するＬＥＤケースとを備えるＬＥＤ電球が、知られている（例えば、特許文献１）。斯かるＬＥＤ電球は、ＬＥＤ素子から発生した熱を、連通部を通過して外部へ放出できるため、冷却効率を向上させている。   2. Description of the Related Art Conventionally, as an LED bulb, an LED bulb including an LED element that emits light and an LED case that has a communication portion that communicates the inside and the outside and accommodates the LED element inside is known (for example, Patent Documents). 1). Such an LED bulb can improve the cooling efficiency because the heat generated from the LED element can be emitted to the outside through the communicating portion.

ところで、ＬＥＤ電球は、ＬＥＤ素子に電気を供給する電気回路のグランドから、ノイズを放出する。特許文献１に係るＬＥＤ電球においては、ノイズが、ＬＥＤケースの連通部を通過してそのままの強さで外部に放出されるため、周辺機器に対してノイズ障害を生じさせる場合がある。   By the way, the LED bulb emits noise from the ground of an electric circuit that supplies electricity to the LED element. In the LED light bulb according to Patent Literature 1, noise passes through the communicating portion of the LED case and is emitted to the outside with the same strength, which may cause noise disturbance to peripheral devices.

特表２０１３−５３３５８３号公報Special table 2013-533583 gazette

よって、本発明は、斯かる事情に鑑み、冷却効率を向上しつつ、周辺機器に対してノイズ障害の発生を抑制できるＬＥＤ電球を提供することを課題とする。   Therefore, in view of such circumstances, it is an object of the present invention to provide an LED bulb that can improve the cooling efficiency and suppress the occurrence of noise disturbances with respect to peripheral devices.

本発明に係るＬＥＤ電球は、発光するＬＥＤ素子と、内部と外部とを連通する連通部を有し、内部に前記ＬＥＤ素子を収容する導電性のＬＥＤケースと、前記ＬＥＤ素子に電気を供給する電気回路を有し、前記ＬＥＤケースと離間して配置される電源部と、前記ＬＥＤケースと前記電源部とをそれぞれ支持する支持部と、前記支持部の電気伝導率よりも大きい電気伝導率を有し、前記電気回路のグランドと前記ＬＥＤケースとを電気接続する電気接続機構と、を備える。   The LED bulb according to the present invention has a light emitting LED element, a communication part that communicates the inside and the outside, a conductive LED case that houses the LED element inside, and supplies electricity to the LED element. An electric circuit having a power supply unit disposed apart from the LED case; a support unit for supporting the LED case and the power supply unit; and an electric conductivity greater than an electric conductivity of the support unit. And an electrical connection mechanism for electrically connecting the ground of the electrical circuit and the LED case.

また、ＬＥＤ電球においては、前記支持部は、前記ＬＥＤケースから前記電源部に熱伝導することを抑制すべく、前記ＬＥＤケースの熱伝導率よりも小さい熱伝導率を有する、という構成でもよい。   In the LED bulb, the support portion may have a thermal conductivity smaller than the thermal conductivity of the LED case so as to suppress heat conduction from the LED case to the power source portion.

また、ＬＥＤ電球においては、前記ＬＥＤ素子が搭載されるＬＥＤ基板部と、前記電源部から長尺に延びる剛性の導電体と、を備え、前記ＬＥＤ基板部は、前記ＬＥＤケースに接する導電部を備え、前記導電体は、前記電気回路のグランドと前記導電部とを電気接続し、前記導電部及び前記導電体は、電気接続機構を構成する、という構成でもよい。   Further, the LED bulb includes an LED substrate portion on which the LED element is mounted, and a rigid conductor extending in a long length from the power supply portion, and the LED substrate portion includes a conductive portion in contact with the LED case. The conductor may electrically connect a ground of the electric circuit and the conductive portion, and the conductive portion and the conductor may constitute an electrical connection mechanism.

また、ＬＥＤ電球においては、前記ＬＥＤ基板部は、貫通孔部を備え、前記導電体は、前記貫通孔部に挿入され、且つ前記導電部に接合される、という構成でもよい。   In the LED bulb, the LED substrate portion may include a through-hole portion, and the conductor may be inserted into the through-hole portion and joined to the conductive portion.

以上の如く、本発明に係るＬＥＤ電球は、冷却効率を向上しつつ、周辺機器に対してノイズ障害の発生を抑制できる、という優れた効果を奏する。   As described above, the LED bulb according to the present invention has an excellent effect that it is possible to suppress the occurrence of noise disturbance with respect to peripheral devices while improving the cooling efficiency.

一実施形態に係るＬＥＤ電球の全体斜視図である。1 is an overall perspective view of an LED bulb according to an embodiment. 同実施形態に係るＬＥＤ電球の全体正面図である。It is a whole front view of the LED bulb which concerns on the embodiment. 同実施形態に係るＬＥＤ電球のカバーを外した状態の全体斜視図である。It is a whole perspective view of the state which removed the cover of the LED bulb concerning the embodiment. 同実施形態に係るＬＥＤ電球の全体分解斜視図である。It is a whole disassembled perspective view of the LED bulb which concerns on the same embodiment. 同実施形態に係るＬＥＤ電球の全体断面図である。It is a whole sectional view of the LED bulb concerning the embodiment. 図５のVI領域の拡大図である。FIG. 6 is an enlarged view of a VI region in FIG. 5.

以下、ＬＥＤ電球における一実施形態について、図１〜図６を参酌して説明する。なお、各図において、図面の寸法比と実際の寸法比とは、必ずしも一致していない。   Hereinafter, an embodiment of the LED bulb will be described with reference to FIGS. In each figure, the dimensional ratio in the drawing does not necessarily match the actual dimensional ratio.

図１〜図３に示すように、本実施形態に係るＬＥＤ電球１は、発光する複数（本実施形態においては４つ）のＬＥＤ素子２と、ＬＥＤ素子２が搭載されるＬＥＤ基板部３と、先端側に開口部４１を有し、ＬＥＤ素子２を内部に収容するＬＥＤケース４とを備えている。また、ＬＥＤ電球１は、ＬＥＤケース４の開口部４１を覆うカバー５と、ＬＥＤケース４とカバー５とを接続する接続体６とを備えている。   As shown in FIGS. 1 to 3, the LED bulb 1 according to the present embodiment includes a plurality of (four in the present embodiment) LED elements 2 that emit light, and an LED substrate unit 3 on which the LED elements 2 are mounted. And an LED case 4 having an opening 41 on the tip side and housing the LED element 2 therein. The LED bulb 1 also includes a cover 5 that covers the opening 41 of the LED case 4 and a connection body 6 that connects the LED case 4 and the cover 5.

ＬＥＤ電球１は、ＬＥＤ素子２に電気を供給する電気回路を有する電源部７と、ＬＥＤケース４と電源部７とをそれぞれ支持する支持部８とを備えている。また、ＬＥＤ電球１は、電源部７を収容する電源ケース９と、外部から電気が供給されるための端子部１０と備えている。そして、ＬＥＤ電球１は、電源部７から長尺に延びる導電性の導電体１１を備えている。   The LED bulb 1 includes a power supply unit 7 having an electric circuit that supplies electricity to the LED element 2, and a support unit 8 that supports the LED case 4 and the power supply unit 7. The LED bulb 1 also includes a power supply case 9 that houses the power supply unit 7 and a terminal unit 10 for supplying electricity from the outside. The LED bulb 1 includes a conductive conductor 11 that extends from the power supply unit 7 in a long length.

ＬＥＤケース４は、開口部４１側に向けて拡径する円筒状に形成されている。具体的には、ＬＥＤケース４は、円環状に形成されるベース部４２（図４〜図６参照）と、ベース部４２から突出する複数のフィン４３とを備えている。そして、ＬＥＤケース４は、フィン４３，４３間に、内部と外部とを連通する連通部４４を複数備えている。   The LED case 4 is formed in a cylindrical shape whose diameter increases toward the opening 41 side. Specifically, the LED case 4 includes a base portion 42 (see FIGS. 4 to 6) formed in an annular shape and a plurality of fins 43 protruding from the base portion 42. The LED case 4 includes a plurality of communication portions 44 that communicate between the inside and the outside between the fins 43.

ＬＥＤケース４は、ＬＥＤ素子２から発生した熱を外部に放出すべく、大きい熱伝導率を有している。そして、ＬＥＤケース４は、フィン４３及び連通部４４により、ＬＥＤ素子２から発生した熱を外部に向けて放出する。即ち、ＬＥＤケース４は、冷却（ヒートシンク）の機能を有している。また、ＬＥＤケース４は、導電性を有している。本実施形態においては、ＬＥＤケース４は、金属（例えば、アルミニウム等）で形成されている。   The LED case 4 has a large thermal conductivity so as to release the heat generated from the LED element 2 to the outside. And LED case 4 discharge | releases the heat | fever generate | occur | produced from LED element 2 toward the exterior by the fin 43 and the communication part 44. FIG. That is, the LED case 4 has a cooling (heat sink) function. Moreover, the LED case 4 has conductivity. In the present embodiment, the LED case 4 is formed of a metal (for example, aluminum).

カバー５は、ＬＥＤケース４の開口部４１を覆う平板状のカバー部５１と、ＬＥＤ素子２の光が入射されるレンズ５２（図５参照）とを備えている。そして、カバー５は、透光性を有して形成されている。本実施形態においては、カバー５は、ポリカーボネートやアクリル樹脂等の透光性樹脂で形成されている。   The cover 5 includes a flat cover portion 51 that covers the opening 41 of the LED case 4, and a lens 52 (see FIG. 5) on which the light from the LED element 2 is incident. The cover 5 is formed with translucency. In the present embodiment, the cover 5 is formed of a translucent resin such as polycarbonate or acrylic resin.

接続体６は、先端部がカバー５に固定され且つ基端部がＬＥＤケース４に固定される接続部６１を複数（本実施形態においては、３つ）備えている。該接続部６１は、長尺に形成されていると共に、弾性を有している。また、接続体６は、透光性を有して形成されている。本実施形態においては、接続体６は、ポリカーボネートやアクリル樹脂等の透光性樹脂で形成されている。   The connection body 6 includes a plurality (three in the present embodiment) of connection portions 61 having a distal end portion fixed to the cover 5 and a proximal end portion fixed to the LED case 4. The connecting portion 61 is formed long and has elasticity. Moreover, the connection body 6 is formed with translucency. In the present embodiment, the connection body 6 is formed of a translucent resin such as polycarbonate or acrylic resin.

図４に示すように、電源部７は、電気回路を構成する電源素子（例えば、電解コンデンサ、コイル等）７１と、電源素子７１が搭載される電源基板７２とを備えている。本実施形態において、支持部８及び電源ケース９は、一体的に形成されている。また、ＬＥＤ基板部３は、導電体１１が挿入するための貫通孔部３１を備えている。   As shown in FIG. 4, the power supply unit 7 includes a power supply element (for example, an electrolytic capacitor, a coil, etc.) 71 constituting an electric circuit, and a power supply substrate 72 on which the power supply element 71 is mounted. In this embodiment, the support part 8 and the power supply case 9 are integrally formed. Moreover, the LED board part 3 is provided with the through-hole part 31 for the conductor 11 to insert.

第１の固定材１２は、カバー５の開口に挿入され、接続部６１の先端部の開口と螺合する。また、第２の固定材１３は、接続部６１の基端部の開口、ＬＥＤ基板部３の開口、ＬＥＤケース４の開口、及び電源部７の凹部にそれぞれ挿入され、支持部８の開口と螺合する。これにより、各構成は、お互いに固定されている。本実施形態においては、各固定材１２，１３は、雄ねじ材としている。   The first fixing member 12 is inserted into the opening of the cover 5 and screwed into the opening at the distal end portion of the connecting portion 61. The second fixing member 13 is inserted into the opening of the base end of the connecting portion 61, the opening of the LED substrate portion 3, the opening of the LED case 4, and the recess of the power supply portion 7, and the opening of the support portion 8. Screw together. Thereby, each structure is mutually fixed. In the present embodiment, the fixing members 12 and 13 are male screw materials.

図５に示すように、支持部８は、円筒状に形成されている。そして、支持部８は、外周部及び軸方向端部で、ＬＥＤケース４を支持すると共に、内周部で電源部７を支持している。これにより、電源部７は、支持部８を介在させて、ＬＥＤケース４と離間して配置されている。   As shown in FIG. 5, the support portion 8 is formed in a cylindrical shape. And the support part 8 is supporting the LED case 4 by the outer peripheral part and an axial direction edge part, and is supporting the power supply part 7 by the inner peripheral part. Thereby, the power supply part 7 is arrange | positioned apart from the LED case 4 with the support part 8 interposed.

支持部８は、ＬＥＤケース４から電源部７に熱伝導することを抑制すべく、ＬＥＤケース４の熱伝導率よりも小さい熱伝導率を有している。具体的には、支持部８は、断熱性を有している。また、支持部８は、小さい電気伝導率を有している。具体的には、支持部８は、電気絶縁性を有している。本実施形態において、支持部８は、樹脂（例えば、プラスチック）で形成されているが、セラミックで形成されていてもよい。   The support portion 8 has a thermal conductivity smaller than the thermal conductivity of the LED case 4 so as to suppress heat conduction from the LED case 4 to the power source portion 7. Specifically, the support part 8 has heat insulation. Moreover, the support part 8 has a small electrical conductivity. Specifically, the support part 8 has electrical insulation. In the present embodiment, the support portion 8 is formed of resin (for example, plastic), but may be formed of ceramic.

導電体１１は、電源部７からＬＥＤ基板部３まで延びる棒状に形成されており、剛性を有している。そして、導電体１１の先端部は、ＬＥＤ基板部３から突出している。また、導電体１１の基端部は、電源部７の電気回路のグランドと電気接続されている。本実施形態において、導電体１１は、金属（例えば、アルミニウム）で形成されている。   The conductor 11 is formed in a rod shape extending from the power supply unit 7 to the LED substrate unit 3 and has rigidity. And the front-end | tip part of the conductor 11 protrudes from the LED board part 3. FIG. Further, the base end portion of the conductor 11 is electrically connected to the ground of the electric circuit of the power supply unit 7. In the present embodiment, the conductor 11 is made of metal (for example, aluminum).

図６に示すように、ＬＥＤ基板部３は、導電性を有する導電部３２と、導電部３２上に設けられる回路部３３とを備えている。そして、リード線（図示していない）が電源部７と回路部３３とを電気接続することにより、電源部７からＬＥＤ素子２に電気が供給されている。   As shown in FIG. 6, the LED substrate portion 3 includes a conductive portion 32 having conductivity and a circuit portion 33 provided on the conductive portion 32. The lead wire (not shown) electrically connects the power supply unit 7 and the circuit unit 33, whereby electricity is supplied from the power supply unit 7 to the LED element 2.

導電部３２は、ＬＥＤ基板部３とＬＥＤケース４とが固定されることにより、ＬＥＤケース４のベース部４２に接している。本実施形態においては、導電部３２は、金属（例えば、アルミニウム）で形成されている。また、回路部３３は、図示していないが、ＬＥＤ素子２に電気を供給するための銅箔と、銅箔間の短絡を防止するためのレジストと、銅箔と導電部３２とを電気絶縁するための絶縁層とを備えている。   The conductive portion 32 is in contact with the base portion 42 of the LED case 4 by fixing the LED substrate portion 3 and the LED case 4. In the present embodiment, the conductive portion 32 is made of metal (for example, aluminum). Although not shown, the circuit unit 33 electrically insulates the copper foil for supplying electricity to the LED element 2, a resist for preventing a short circuit between the copper foils, and the copper foil and the conductive unit 32. And an insulating layer.

導電体１１の先端部は、ＬＥＤ基板部３の貫通孔部３１に挿入されている。そして、導電体１１は、接合材１４により、導電部３２に接合されている。本実施形態においては、接合材１４は、ハンダであり、導電体１１と導電部３２とは、ハンダ接合されている。これにより、導電体１１は、導電部３２と電気接続している。   The leading end portion of the conductor 11 is inserted into the through hole portion 31 of the LED substrate portion 3. The conductor 11 is bonded to the conductive portion 32 by the bonding material 14. In the present embodiment, the bonding material 14 is solder, and the conductor 11 and the conductive portion 32 are solder-bonded. As a result, the conductor 11 is electrically connected to the conductive portion 32.

したがって、電源部７の電気回路のグランドとＬＥＤケース４とは、導電体１１及び導電部３２から構成される電気接続機構１５により、電気接続されている。これにより、電源部７の電気回路のグランドから発生するノイズは、ＬＥＤケース４の連通部４４から直接に外部に放出されることなく、導電体１１及び導電部３２を経由して、ＬＥＤケース４で拡散されて外部に放出される。なお、電気接続機構１５は、支持部８の電気伝導率よりも大きい電気伝導率を有している。   Therefore, the ground of the electric circuit of the power supply unit 7 and the LED case 4 are electrically connected by the electric connection mechanism 15 including the conductor 11 and the conductive unit 32. Thereby, the noise generated from the ground of the electric circuit of the power supply unit 7 is not directly emitted from the communication unit 44 of the LED case 4 to the outside, but via the conductor 11 and the conductive unit 32, and the LED case 4. It is diffused and released to the outside. The electrical connection mechanism 15 has an electrical conductivity larger than that of the support portion 8.

以上より、本実施形態に係るＬＥＤ電球１は、発光するＬＥＤ素子２と、内部と外部とを連通する連通部４４を有し、内部に前記ＬＥＤ素子２を収容する導電性のＬＥＤケース４と、前記ＬＥＤ素子２に電気を供給する電気回路を有し、前記ＬＥＤケース４と離間して配置される電源部７と、前記ＬＥＤケース４と前記電源部７とをそれぞれ支持する支持部８と、前記支持部８の電気伝導率よりも大きい電気伝導率を有し、前記電気回路のグランドと前記ＬＥＤケース４とを電気接続する電気接続機構１５と、を備える。   As described above, the LED bulb 1 according to the present embodiment includes the LED element 2 that emits light, the communication portion 44 that communicates the inside and the outside, and the conductive LED case 4 that houses the LED element 2 inside. A power supply unit 7 that has an electric circuit for supplying electricity to the LED element 2 and is spaced apart from the LED case 4, and a support unit 8 that supports the LED case 4 and the power supply unit 7, respectively. And an electric connection mechanism 15 having an electric conductivity larger than that of the support portion 8 and electrically connecting the ground of the electric circuit and the LED case 4.

斯かる構成によれば、ＬＥＤ素子２から発生した熱を、連通部４４を通過して外部へ放出できるため、冷却効率を向上させている。また、支持部８の電気伝導率よりも大きい電気伝導率を有する電気接続機構１５は、電気回路のグランドとＬＥＤケース４とを電気接続している。これにより、電気回路のグランドから発生するノイズは、電気接続機構１５を経由して、導電性のＬＥＤケース４で拡散され、弱い強度で外部に放出される。したがって、周辺機器に対してノイズ障害の発生を抑制することができる。   According to such a configuration, since the heat generated from the LED element 2 can be discharged to the outside through the communication portion 44, the cooling efficiency is improved. In addition, the electrical connection mechanism 15 having an electrical conductivity larger than the electrical conductivity of the support portion 8 electrically connects the ground of the electrical circuit and the LED case 4. Thereby, the noise generated from the ground of the electric circuit is diffused by the conductive LED case 4 via the electric connection mechanism 15 and released to the outside with a weak intensity. Therefore, it is possible to suppress the occurrence of noise disturbance with respect to the peripheral device.

また、本実施形態に係るＬＥＤ電球１においては、前記支持部８は、前記ＬＥＤケース４から前記電源部７に熱伝導することを抑制すべく、前記ＬＥＤケース４の熱伝導率よりも小さい熱伝導率を有する。   Further, in the LED bulb 1 according to the present embodiment, the support portion 8 has a heat smaller than the thermal conductivity of the LED case 4 in order to suppress heat conduction from the LED case 4 to the power source portion 7. Has conductivity.

斯かる構成によれば、支持部８の熱伝導率が、ＬＥＤケース４の熱伝導率よりも小さいため、支持部８を経由して、ＬＥＤケース４から電源部７に熱伝導することを抑制することができる。これにより、ＬＥＤ素子２から発生してＬＥＤケース４に伝導された熱が、電源部７に熱伝導することを抑制することができるため、電源部７の温度が上昇することを抑制することができる。   According to such a configuration, since the thermal conductivity of the support portion 8 is smaller than the thermal conductivity of the LED case 4, it is possible to suppress heat conduction from the LED case 4 to the power source portion 7 via the support portion 8. can do. Thereby, since it can suppress that the heat | fever which generate | occur | produced from the LED element 2 and was conducted by LED case 4 is conducted to the power supply part 7, it can suppress that the temperature of the power supply part 7 rises. it can.

また、本実施形態に係るＬＥＤ電球１は、前記ＬＥＤ素子２が搭載されるＬＥＤ基板部３と、前記電源部７から長尺に延びる剛性の導電体１１と、を備え、前記ＬＥＤ基板部３は、前記ＬＥＤケース４に接する導電部３２を備え、前記導電体１１は、前記電気回路のグランドと前記導電部３２とを電気接続し、前記導電部３２及び前記導電体１１は、電気接続機構１５を構成する。   In addition, the LED bulb 1 according to the present embodiment includes an LED substrate unit 3 on which the LED element 2 is mounted, and a rigid conductor 11 that extends from the power source unit 7, and the LED substrate unit 3. Includes a conductive portion 32 in contact with the LED case 4, the conductor 11 electrically connects the ground of the electric circuit and the conductive portion 32, and the conductive portion 32 and the conductor 11 are electrically connected to each other. 15 is configured.

斯かる構成によれば、ＬＥＤ素子２が搭載されるＬＥＤ基板部３は、ＬＥＤケース４に接する導電部３２を備えている。そして、電源部７から長尺に延びる剛性の導電体１１が、電気回路のグランドと導電部３２とを電気接続するため、導電部３２及び導電体１１が、電気接続機構１５を構成する。これにより、導電部３２及び導電体１１は、電気回路のグランドとＬＥＤケース４とを電気接続している。   According to such a configuration, the LED board portion 3 on which the LED element 2 is mounted includes the conductive portion 32 in contact with the LED case 4. The rigid conductor 11 that extends from the power supply unit 7 electrically connects the ground of the electric circuit and the conductive unit 32, so that the conductive unit 32 and the conductive unit 11 constitute the electrical connection mechanism 15. Thereby, the conductive part 32 and the conductor 11 electrically connect the ground of the electric circuit and the LED case 4.

また、本実施形態に係るＬＥＤ電球１においては、前記ＬＥＤ基板部３は、貫通孔部３１を備え、前記導電体１１は、前記貫通孔部３１に挿入され、且つ前記導電部３２に接合される。   In the LED bulb 1 according to the present embodiment, the LED board portion 3 includes a through-hole portion 31, and the conductor 11 is inserted into the through-hole portion 31 and joined to the conductive portion 32. The

斯かる構成によれば、導電体１１は、ＬＥＤ基板部３の貫通孔部３１に挿入されている。そして、導電体１１が導電部３２に接合されているため、導電体１１と導電部３２とが電気接続されている。これにより、例えば、導電体１１と導電部３２との電気接続の作業を容易にすることができる。   According to such a configuration, the conductor 11 is inserted into the through hole portion 31 of the LED substrate portion 3. Since the conductor 11 is bonded to the conductive portion 32, the conductor 11 and the conductive portion 32 are electrically connected. Thereby, for example, the electrical connection work between the conductor 11 and the conductive portion 32 can be facilitated.

なお、ＬＥＤ電球は、上記した実施形態の構成に限定されるものではなく、また、上記した作用効果に限定されるものではない。また、ＬＥＤ電球は、本発明の要旨を逸脱しない範囲内において種々変更を加え得ることは勿論である。例えば、下記する各種の変更例に係る構成や方法等を任意に選択して、上記した実施形態に係る構成や方法等に採用してもよいことは勿論である。   Note that the LED bulb is not limited to the configuration of the above-described embodiment, and is not limited to the above-described effects. In addition, the LED bulb can be variously modified without departing from the gist of the present invention. For example, it is needless to say that configurations, methods, and the like according to various modifications described below may be arbitrarily selected and employed in the configurations, methods, and the like according to the above-described embodiments.

上記実施形態に係るＬＥＤ電球１においては、導電体１１は、剛性を有して、棒状に形成されている、という構成である。しかしながら、ＬＥＤ電球は、斯かる構成に限られない。例えば、ＬＥＤ電球においては、導電体１１は、リード線である、という構成でもよい。   In the LED bulb 1 according to the above embodiment, the conductor 11 has a configuration in which it has rigidity and is formed in a rod shape. However, the LED bulb is not limited to such a configuration. For example, in an LED bulb, the conductor 11 may be a lead wire.

また、上記実施形態に係るＬＥＤ電球１においては、電気接続機構１５は、ＬＥＤ基板部３の導電部３２と導電体１１とで構成されている、という構成である。しかしながら、ＬＥＤ電球は、斯かる構成に限られない。例えば、ＬＥＤ電球においては、電気接続機構１５は、電源部７の電気回路のグランドとＬＥＤケース４とを接続するリード線である、という構成でもよい。   Moreover, in the LED bulb 1 according to the embodiment, the electrical connection mechanism 15 is configured by the conductive portion 32 and the conductor 11 of the LED substrate portion 3. However, the LED bulb is not limited to such a configuration. For example, in an LED bulb, the electrical connection mechanism 15 may be a lead wire that connects the ground of the electrical circuit of the power supply unit 7 and the LED case 4.

また、上記実施形態に係るＬＥＤ電球１においては、導電体１１と導電部３２とは、ハンダ接合されている、という構成である。しかしながら、ＬＥＤ電球１は、斯かる構成に限られない。例えば、ＬＥＤ電球１においては、導電体１１と導電部３２とは、溶接接合されている、という構成でもよく、また、導電体１１は、接合材１４を介することなく、導電部３２に押圧することで接合されている、という構成でもよい。   Moreover, in the LED light bulb 1 according to the above-described embodiment, the conductor 11 and the conductive portion 32 are configured to be soldered. However, the LED bulb 1 is not limited to such a configuration. For example, the LED bulb 1 may be configured such that the conductor 11 and the conductive portion 32 are welded and joined, and the conductor 11 presses against the conductive portion 32 without using the bonding material 14. It is also possible to adopt a configuration in which they are joined together.

１…ＬＥＤ電球、２…ＬＥＤ素子、３…ＬＥＤ基板部、４…ＬＥＤケース、５…カバー、６…接続体、７…電源部、８…支持部、９…電源ケース、１０…端子部、１１…導電体、１２…第１の固定材、１３…第２の固定材、１４…接合材、１５…電気接続機構、３１…貫通孔部、３２…導電部、３３…回路部、４１…開口部、４２…ベース部、４３…フィン、４４…連通部、５１…カバー部、５２…レンズ、６１…接続部、７１…電源素子、７２…電源基板   DESCRIPTION OF SYMBOLS 1 ... LED light bulb, 2 ... LED element, 3 ... LED board part, 4 ... LED case, 5 ... Cover, 6 ... Connection body, 7 ... Power supply part, 8 ... Support part, 9 ... Power supply case, 10 ... Terminal part, DESCRIPTION OF SYMBOLS 11 ... Conductor, 12 ... 1st fixing material, 13 ... 2nd fixing material, 14 ... Bonding material, 15 ... Electrical connection mechanism, 31 ... Through-hole part, 32 ... Conductive part, 33 ... Circuit part, 41 ... Opening part 42 ... Base part 43 ... Fin 44 ... Communication part 51 ... Cover part 52 ... Lens 61 ... Connection part 71 ... Power supply element 72 ... Power supply board

Claims (4)

発光するＬＥＤ素子と、
内部と外部とを連通する連通部を有し、内部に前記ＬＥＤ素子を収容する導電性のＬＥＤケースと、
前記ＬＥＤ素子に電気を供給する電気回路を有し、前記ＬＥＤケースと離間して配置される電源部と、
前記ＬＥＤケースと前記電源部とをそれぞれ支持する支持部と、
前記支持部の電気伝導率よりも大きい電気伝導率を有し、前記電気回路のグランドと前記ＬＥＤケースとを電気接続する電気接続機構と、を備えるＬＥＤ電球。 A light emitting LED element;
A conductive LED case having a communication part for communicating the inside and the outside, and housing the LED element inside;
An electric circuit for supplying electricity to the LED element, and a power supply unit disposed apart from the LED case;
A support part for supporting the LED case and the power supply part,
An LED bulb having an electrical conductivity greater than the electrical conductivity of the support portion, and an electrical connection mechanism for electrically connecting a ground of the electrical circuit and the LED case. 前記支持部は、前記ＬＥＤケースから前記電源部に熱伝導することを抑制すべく、前記ＬＥＤケースの熱伝導率よりも小さい熱伝導率を有する請求項１に記載のＬＥＤ電球。   The LED bulb according to claim 1, wherein the support part has a thermal conductivity smaller than a thermal conductivity of the LED case so as to suppress heat conduction from the LED case to the power source part. 前記ＬＥＤ素子が搭載されるＬＥＤ基板部と、
前記電源部から長尺に延びる剛性の導電体と、を備え、
前記ＬＥＤ基板部は、前記ＬＥＤケースに接する導電部を備え、
前記導電体は、前記電気回路のグランドと前記導電部とを電気接続し、
前記導電部及び前記導電体は、電気接続機構を構成する請求項１又は２に記載のＬＥＤ電球。 An LED substrate portion on which the LED element is mounted;
A rigid conductor extending long from the power supply unit,
The LED substrate part includes a conductive part in contact with the LED case,
The conductor electrically connects the ground of the electric circuit and the conductive portion,
The LED bulb according to claim 1, wherein the conductive portion and the conductor constitute an electrical connection mechanism. 前記ＬＥＤ基板部は、貫通孔部を備え、
前記導電体は、前記貫通孔部に挿入され、且つ前記導電部に接合される請求項３に記載のＬＥＤ電球。
The LED substrate portion includes a through hole portion,
The LED bulb according to claim 3, wherein the conductor is inserted into the through-hole portion and joined to the conductive portion.
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3143732U (en) * 2008-01-28 2008-07-31 能▲是▼精密工業股▲分▼有限公司 Light emitting diode lamp
JP2013069530A (en) * 2011-09-22 2013-04-18 Toyoda Gosei Co Ltd Led lighting device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3143732U (en) * 2008-01-28 2008-07-31 能▲是▼精密工業股▲分▼有限公司 Light emitting diode lamp
JP2013069530A (en) * 2011-09-22 2013-04-18 Toyoda Gosei Co Ltd Led lighting device

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