JP2016075422A - Heat radiation device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat radiation device having a heat medium circulation route smoothly lubricating an internal heat medium, easily reducing costs, and having a simple and robust structure having a low leakage risk of a heat medium.SOLUTION: A heat radiation device 1 includes: a peripheral wall 5; a heat radiation body part 9 that has a plurality of heat medium circulation spaces 8 arranged in the peripheral wall 5 and extending from the side of one end part 6 of the peripheral wall 5 to the side of the other end part 7 of the peripheral wall 5; and a pair of blockage parts 12, 13 that is provided integrally with the respective end parts 6, 7 of the heat radiation body part 9, having a heat medium communication space 11 connecting the heat medium circulation spaces 8 to each other, and blocking the respective end parts of the heat medium circulation spaces 8.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a heat dissipation device.

  2. Description of the Related Art A heat radiating device that radiates heat from a heating element that generates heat during operation, such as an electronic device or an electronic component, is known.

  A conventional heat dissipation device includes a heat dissipation member, a top cover fixed to the heat dissipation member, a bottom cover fixed to the heat dissipation member, and a pipe member inserted into the top cover.

  The heat dissipation member includes a peripheral wall and a chamber in the peripheral wall. The chamber is divided into a plurality of channels.

  The tube has an annular wall, a through hole in the annular wall, and a closing portion provided in the annular wall and closing the through hole. The tube material passes through the chamber, and the through hole is closed by the closing portion.

Utility Model Registration No. 3176281

  A conventional heat radiating device is prepared by preparing a heat radiating member, a top cover, a bottom cover, and a pipe as separate parts, and assembling them.

  By the way, the top cover and the bottom cover have a recess into which the heat dissipation member is fitted. This recess serves as a gap that is fluidly connected to the chamber in the heat radiating member in a state where the heat radiating member is fitted to the top cover and the bottom cover, and exchanges the heat medium between a plurality of channels included in the chamber. Circulate and distribute.

  As described above, in the conventional heat radiating device that exchanges, circulates, and circulates the heat medium between the plurality of channels by the recesses of the top cover and the bottom cover, it is necessary to separately prepare and assemble the heat radiating member, the top cover, and the bottom cover. there were. This hinders the reduction in the number of parts of the conventional heat dissipation device, causes an increase in parts cost and assembly cost, reduces cost competitiveness, and increases the risk of heat medium leakage from the joint between parts. Become.

  Therefore, the present invention proposes a heat dissipation device having a simple and robust structure that is easy to reduce costs and has a low risk of leakage of the heat medium, while having a heat medium flow path that smoothly lubricates the internal heat medium.

  In order to solve the above-described problems, a heat dissipation device according to the present invention includes a peripheral wall and a plurality of heat medium flow spaces disposed in the peripheral wall and extending from one end side of the peripheral wall to the other end side of the peripheral wall. A heat dissipating body part, and a heat medium connecting space that is integrally provided at each end of the heat dissipating body part and interconnects the plurality of heat medium circulation spaces. A pair of closing portions that close the end portions.

  According to the present invention, it is possible to provide a heat dissipation device having a simple and robust structure that is easy to reduce costs and has a low risk of leakage of the heat medium, while having a heat medium flow path that smoothly lubricates the internal heat medium.

The perspective view which shows the thermal radiation apparatus which concerns on embodiment of this invention. The plane sectional view showing the heat dissipation device concerning the embodiment of the present invention. The top view which shows the board | plate material processed by the thermal radiation apparatus which concerns on embodiment of this invention. The perspective view which shows the board | plate material processed by the thermal radiation apparatus which concerns on embodiment of this invention. The longitudinal cross-sectional view which shows the board | plate material processed by the thermal radiation apparatus which concerns on embodiment of this invention. The plane sectional view showing the board processed into the heat dissipation device concerning the embodiment of the present invention. The cross-sectional view which shows the other example of the board | plate material processed by the thermal radiation apparatus which concerns on embodiment of this invention. The longitudinal cross-sectional view which shows the board | plate material processed by the thermal radiation apparatus which concerns on embodiment of this invention.

  Hereinafter, embodiments of a heat dissipation device according to the present invention will be described with reference to FIGS. 1 to 8.

  FIG. 1 is a perspective view showing a heat dissipation device according to an embodiment of the present invention.

  FIG. 2 is a plan sectional view showing the heat dissipation device according to the embodiment of the present invention.

  As shown in FIG. 1, the heat radiating device 1 according to the present embodiment includes a peripheral wall 5 and a plurality of the heat dissipating devices 1 that are disposed in the peripheral wall 5 and extend from one end 6 side of the peripheral wall 5 to the other end 7 side of the peripheral wall 5. A heat dissipating body part 9 having a heat medium circulation space 8 and a heat medium communication space 11 integrally provided at each end 6 and 7 of the heat dissipating body part 9 and connecting the plurality of heat medium circulation spaces 8 to each other. And a pair of closed portions 12 and 13 for closing the respective end portions of the plurality of heat medium flow spaces 8.

  Further, the heat radiating device 1 has a heat medium introduction path 15 connected to at least one of the heat medium circulation spaces 8 and protrudes from one end of the heat radiating main body 9, here one end 6. The heat dissipating main body portion 9 is provided with an integral heat medium introducing portion 16.

  The heat dissipating main body 9 extends in a plate shape, and more specifically in a quadrangular plate shape. The heat radiating main body 9 includes a plurality of partition walls 17 that divide the heat medium flow space 8 inside the peripheral wall 5. The heat medium circulation space 8 is surrounded by the partition wall 17 and the peripheral wall 5 arranged between the adjacent partition walls 17 or on the outermost side.

  The plurality of heat medium flow spaces 8 are arranged in the width direction of the heat radiating main body 9.

  The other of the pair of blocking parts 12, 13, here the blocking part 13, extends in the width direction of the heat radiating main body 9 and reaches from the one side of the heat radiating main body 9 to the other side.

  The pair of blocking portions 12 and 13 extend linearly on opposite sides of the heat radiating main body portion 9.

  The heat medium introducing portion 16 is provided at one end portion of the heat radiating main body portion 9, here, at a part of the one end portion 6. On the other hand, one of the pair of blocking parts 12, 13, here the blocking part 12, is provided at one end of the heat radiating body 9, here the remaining part of the one end 6.

  The heat medium introduction part 16 projects continuously toward one side of the heat radiating main body part 9 toward the extending direction of the heat medium circulation space 8.

  The heat medium introduction path 15 is a passage through which the heat medium is introduced into the heat medium circulation space 8 and the heat medium communication space 11. After introducing the heat medium into the heat medium flow space 8 and the heat medium communication space 11, the heat medium introduction path 15 is blocked with a metal such as solder, an adhesive, or the like.

  The heat medium in the heat medium distribution space 8 and the heat medium communication space 11 travels through the plurality of heat medium distribution spaces 8 through the heat medium communication space 11, and heat applied to the heat dissipation device 1 is lower than that in the heat dissipation device 1. The heat dissipation performance of the heat dissipating device 1 is enhanced by carrying it to the part.

  By the way, the heat radiating device 1, more specifically, the heat radiating main body portion 9, the pair of closing portions 12 and 13, and the heat medium introducing portion 16 are made of a metal having high thermal conductivity, for example, an alloy containing copper, aluminum, or stainless steel. It is an integrally molded product.

  Therefore, a method for manufacturing the heat dissipation device 1 will be described. 3 to 8 are views showing a manufacturing process of the heat dissipation device according to the embodiment of the present invention.

  FIG. 3 is a plan view showing a plate material processed by the heat dissipation device according to the embodiment of the present invention.

  As shown in FIG. 3, the plate material 21 processed in the heat dissipation device 1 according to the present embodiment has a linear space 22 that becomes the heat medium flow space 8 therein. The plate material 21 is obtained by subjecting the material to a known processing method such as extrusion molding or cutting.

  The plate member 21 has opposite sides having the open end of the space 22. One side of the opposite side is a side part 25 that becomes the closed part 12 and the heat medium introduction part 16, and the other side of the opposite side is a side part 26 that becomes the closed part 13. The peripheral wall of the plate material 21 becomes the peripheral wall 5 of the heat dissipation device 1. The partition that divides the space 22 becomes the partition 17 of the heat dissipation device 1.

  FIG. 4 is a perspective view showing a plate material processed by the heat dissipation device according to the embodiment of the present invention.

  As shown in FIG. 4, the plate material 31 processed in the heat dissipation device 1 according to the present embodiment is obtained by processing the plate material 21. The plate material 31 has a portion 32 that becomes the heat medium introducing portion 16 and a portion 33 that becomes the closing portion 12. The portion 32 that becomes the heat medium introduction portion 16 and the portion 33 that becomes the blocking portion 12 are obtained by applying a known processing method such as cutting to the side portion 25 of the plate material 21. The portion 33 that becomes the closed portion 12 extends uniformly and linearly from the base portion of the portion 32 that becomes the heat medium introducing portion 16 to the other side portion of the plate material 31. The side portion 26 that becomes the closing portion 13 extends uniformly and linearly from one side of the plate material 31 to the other side.

  FIG. 5 is a longitudinal sectional view showing a plate material processed in the heat dissipation device according to the embodiment of the present invention.

  FIG. 6 is a cross-sectional plan view showing a plate material processed by the heat dissipation device according to the embodiment of the present invention.

  FIG. 7 is a cross-sectional plan view illustrating another example of the plate material processed in the heat dissipation device according to the embodiment of the present invention.

  As shown in FIGS. 5 to 7, the plate material 41 processed in the heat dissipation device 1 according to the present embodiment is obtained by processing the plate material 31. The plate 41 has notches that become the heat medium communication space 11, that is, slits 42 and 43, in the portion 33 that becomes the closed portion 12 and the side portion 26 that becomes the closed portion 13. The slits 42 and 43 are obtained by applying a known processing method such as cutting to the portion 33 and the side portion 26 of the plate material 31.

  The slits 42 and 43 may reach the side portion of the peripheral wall 5 of the plate member 41 (FIG. 6), or may be formed only in the partition wall 17 except for the side portion of the peripheral wall 5.

  More specifically, the slit 42 on the side of the portion 33 may reach the peripheral wall 5 on the other side of the plate member 41 from the base portion of the heat medium introducing portion 16 (FIG. 6), or on the heat medium introducing portion 16. It reaches the partition wall 17 closest to the peripheral wall 5 on the other side portion side of the plate 41 from the root portion, and may not reach the peripheral wall 5 (FIG. 7).

  The slit 43 on the side 26 side may reach the peripheral wall 5 on the other side of the plate 41 from the peripheral wall 5 on the one side of the plate 41 (FIG. 6). The partition wall 17 closest to the peripheral wall 5 on the side portion side of the plate 41 reaches the partition wall 17 closest to the peripheral wall 5 on the other side portion of the plate member 41, and may not reach the peripheral wall 5 (FIG. 7).

  The slits 42 and 43 may have a groove width Wa smaller than the height h of the partition wall 17 of the plate material 41, or may have a groove width Wb substantially the same as the height h of the partition wall 17 of the plate material 41. Alternatively, it may be a groove width Wc that is larger than the height h of the partition wall 17 of the plate 41 and cuts out a part of the peripheral wall 5.

  FIG. 8 is a longitudinal sectional view showing a plate material processed in the heat dissipation device according to the embodiment of the present invention.

  As shown in FIG. 8, the portion 33 and the side portion 26 of the plate material 41 according to the present embodiment are crushed and crimped by plastic working such as caulking or pressing to form a pair of closed portions 12 and 13. At this time, the portion 33 and the side portion 26 of the plate material 41 are crushed and crimped only on the tip side, leaving the bottom (back) of the slits 42 and 43. The bottoms (back) of the slits 42 and 43 that remain without being crushed become the heat medium communication space 11. At this time, the heat medium introduction part 16 is maintained in the previous shape without being plastically processed.

  The pair of closing portions 12 and 13 are joined to the crimping portions by welding or brazing. In addition, when the slits 42 and 43 reach the peripheral wall 5 (FIG. 6), the hole that opens in the peripheral wall 5, that is, the hole that opens on the extension line of the heat medium communication space 11, is closed by welding or brazing.

  Then, the heat radiation device 1 is completed by filling the inside of the plate 41 on which the pair of closing portions 12 and 13 are processed with a heat medium and closing the heat medium introduction path 15. The heat medium filled in the heat radiating device 1 is a gas or liquid that flows in the heat medium circulation space 8 and the heat medium communication space 11, or circulates by changing the phase between the gas phase and the liquid phase. It is a heat medium.

  The heat dissipation device 1 according to the present embodiment is provided in a heating element (not shown) that generates heat during operation like an electronic device or an electronic component, and the heat medium in the heat medium circulation space 8 and the heat medium communication space 11. The heat of the heating element is quickly radiated by the flow of heat and heat conduction of the peripheral wall 5 and the partition wall 17.

  Further, the heat dissipation device 1 according to the present embodiment has a structure that can be integrally molded without processing and assembling a plurality of members such as a heat dissipation member, a top cover, and a bottom cover in a conventional heat dissipation device. The risk of leakage of the heat medium in the heat medium distribution space 8 and the heat medium communication space 11 can be reduced by reducing the number of points, and hence by reducing the joints between the parts.

  Furthermore, the heat dissipation device 1 according to the present embodiment has a structure that can be integrally molded without processing and assembling a plurality of members such as a heat dissipation member, a top cover, and a bottom cover in a conventional heat dissipation device. Costs can be reduced by reducing the number of points and assembly man-hours.

  Furthermore, since the heat radiating device 1 according to the present embodiment has the heat medium introducing portion 16 integrated with the heat radiating main body portion 9, the number of parts is reduced, and the joint between the parts is further reduced, and the heat medium circulation space 8 and the heat medium are reduced. The risk of leakage of the heat medium in the communication space 11 can be reduced.

  Moreover, since the heat radiating device 1 according to the present embodiment includes the heat medium introducing portion 16 integrated with the heat radiating main body portion 9, the cost can be reduced by reducing the number of parts and the number of assembly steps.

  Further, in the heat dissipation device 1 according to the present embodiment, the heat medium introduction portion 16 is provided in a part of the end portion 6 of the heat dissipation main body portion 9 and the closing portion 12 is provided in the remaining portion of the end portion 6 of the heat dissipation main body portion 9. In addition, the processability of the closed portion 12 can be facilitated to reduce the number of processing points, and consequently the risk of leakage of the heat medium in the heat medium flow space 8 and the heat medium communication space 11 can be reduced.

  Furthermore, in the heat radiating device 1 according to the present embodiment, the heat medium introducing portion 16 is provided in a part of the end portion 6 of the heat radiating main body portion 9, and the closing portion 12 is provided in the remaining portion of the end portion 6 of the heat radiating main body portion 9. Thus, the workability of the closing portion 12 can be facilitated to reduce the number of processing points, and the cost can be reduced through reduction in the number of processing steps.

  Further, in the heat dissipation device 1 according to the present embodiment, a plurality of heat medium flow spaces 8 are arranged in a plate-shaped heat dissipation main body 9, and the closing portion 13 is extended from one side of the heat dissipation main body 9 to the other side. As a result, the workability of the closed portion 13 can be facilitated to reduce the number of parts to be processed, and consequently the risk of leakage of the heat medium in the heat medium flow space 8 and the heat medium communication space 11 can be reduced.

  Furthermore, in the heat dissipation device 1 according to the present embodiment, a plurality of heat medium flow spaces 8 are arranged in a plate-shaped heat dissipation main body 9, and the closing portion 13 extends from one side of the heat dissipation main body 9 to the other side. As a result, the workability of the blocking portion 13 can be facilitated to reduce the number of processing points, and the cost can be reduced through reduction in the number of processing steps.

  Furthermore, the heat dissipation device 1 according to the present embodiment facilitates the workability of the closing portions 12 and 13 by extending each of the pair of closing portions 12 and 13 linearly to the opposite sides of the heat radiating main body portion 9. As a result, the number of processing points can be reduced, and consequently the risk of leakage of the heat medium in the heat medium flow space 8 and the heat medium communication space 11 can be reduced.

  Moreover, the heat radiating device 1 according to the present embodiment facilitates the workability of the closed portions 12 and 13 by extending each of the pair of closed portions 12 and 13 linearly to the opposite sides of the heat radiating main body portion 9. Cost reduction can be achieved through reduction of processing man-hours.

  Therefore, according to the heat radiating device 1 according to the present embodiment, a simple and robust structure that has a heat medium flow path that smoothly lubricates the internal heat medium, is easy to reduce costs, and has a low risk of heat medium leakage. Can have.

  Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

DESCRIPTION OF SYMBOLS 1 Heat radiation apparatus 5 Perimeter wall 6 One edge part 7 The other edge part 8 Heat-medium distribution space 9 Heat-radiation main-body part 11 Heat-medium communication space 12, 13 Closure part 15 Heat-medium introduction path 16 Heat-medium introduction part 17 Partition 21 Plate material 22 Space 25, 26 Side 31 Plate member 32, 33 Part 41 Plate member 42, 43 Slit

In order to solve the above-described problems, a heat dissipation device according to the present invention includes a peripheral wall and a plurality of heat medium flow spaces disposed in the peripheral wall and extending from one end side of the peripheral wall to the other end side of the peripheral wall. A heat dissipating body part, and a heat medium connecting space that is integrally provided at each end of the heat dissipating body part and interconnects the plurality of heat medium circulation spaces. A pair of closing portions that close the end portions , and the heat dissipating main body portion and the pair of closing portions are integrally formed .

Said heat dissipation device of the present invention for solving the problems, the peripheral wall, and a plurality of heating medium flow space from one end side extending to the other end side of the peripheral wall of the peripheral wall is disposed in the peripheral wall The heat dissipating main body having a plurality of partitioning walls , and the heat dissipating main body integrally provided at each end of the heat dissipating main body, and having a heat medium communication space that interconnects the plurality of heat medium circulation spaces, Heat that protrudes from one end of the heat radiating main body having a pair of closed portions that block the respective ends of the medium circulation space and a heat medium introduction path that is connected to at least one of the heat medium circulation spaces A medium introducing portion, the heat dissipating main body portion expands in a rectangular plate shape, the plurality of heat medium flow spaces are arranged in a width direction of the heat dissipating main body portion, and the heat medium introducing portion is the heat dissipating main body. Provided at a part of one of the end portions Projecting continuously on one side of the heat dissipating body part, each of the pair of closing parts extends linearly to each of the opposite sides of the heat dissipating body part, and one of the pair of closing parts is Provided in the remaining part of one end of the heat dissipation main body, the other of the pair of closing portions extends in the width direction of the heat dissipation main body and extends from one side of the heat dissipation main body to the other side. The heat dissipating body part, the pair of closed parts, and the heat medium introducing part are integrally formed from a plate material having a linear space that becomes the heat medium flow space, and each of the pair of closed parts is Re it is, of the plate, and processing the slit to the side having the open end of the line-shaped space, Ru obtained by plastically deforming only the distal end side while leaving the bottom of the slit to become the heat medium communication space.

Therefore, the present invention proposes a heat dissipation device having a simple and robust structure that is easy to reduce costs and has a low risk of leakage of the heat medium, while having a heat medium flow path for smoothly circulating the internal heat medium.

The present invention has been invented in order to achieve the problems and objects in the prior art as described above .
A heat dissipating main body having a peripheral wall, and a plurality of partition walls that are arranged in the peripheral wall and that define a plurality of heat medium flow spaces extending from one end side of the peripheral wall to the other end side of the peripheral wall;
A pair of heat-dissipating main body portions that are integrally provided at each end portion and have a heat-medium communication space that connects the plurality of heat-medium circulation spaces to each other to block the end portions of the plurality of heat-medium circulation spaces. An obstruction,
A heat medium introduction part that has a heat medium introduction path connected to at least one of the heat medium circulation spaces and protrudes from one end of the heat dissipation main body part, and
The heat dissipating main body extends into a square plate,
The plurality of heat medium flow spaces are arranged in the width direction of the heat dissipation main body,
The heat medium introducing portion is provided at a part of one end portion of the heat radiating main body portion and continuously protrudes from one side portion of the heat radiating main body portion,
Each of the pair of blocking portions extends linearly to each of the opposite sides of the heat dissipation main body portion,
One of the pair of blocking portions is provided in the remaining portion of one end of the heat dissipation main body,
The other of the pair of closed portions extends in the width direction of the heat radiating main body and reaches the other side from one side of the heat radiating main body,
The heat dissipating body part, the pair of closed parts, and the heat medium introduction part are integrally formed from a plate material having a linear space that becomes the heat medium flow space,
Along the side having the opening end of the linear space of the plate material, the opening end side of the plurality of partition walls and the side portion on the opening end side of the peripheral wall, or
By notching the opening end side of the plurality of partition walls excluding the side portion on the opening end side of the peripheral wall,
A slit formed so as to communicate along a side having an open end of the linear space of the plate material;
The pair of closed portions formed by crushing and crimping only the front end portion on the open end side of the side having the open end of the linear space of the plate material; and
Thereby, the heat medium communication space formed so that all of the plurality of heat medium distribution spaces are directly connected to each other in a straight line,
It is characterized by providing.

According to the present invention, it is possible to provide a heat dissipation device having a simple and robust structure that is easy to reduce costs and has a low risk of leakage of the heat medium, while having a heat medium flow path that smoothly circulates the internal heat medium.

Therefore, according to the heat radiating device 1 according to the present embodiment, a simple and robust structure that has a heat medium circulation path that smoothly circulates the internal heat medium, is easy to reduce costs, and has a low risk of heat medium leakage. Can have.

Claims (5)

A heat radiating main body having a peripheral wall, and a plurality of heat medium flow spaces disposed in the peripheral wall and extending from one end side of the peripheral wall to the other end side of the peripheral wall;
A pair of heat-dissipating main body portions that are integrally provided at each end portion and have a heat-medium communication space that connects the plurality of heat-medium circulation spaces to each other to block the end portions of the plurality of heat-medium circulation spaces. A heat dissipating device. 2. A heat medium introduction portion integrated with the heat radiation main body portion, having a heat medium introduction path connected to at least one of the heat medium circulation spaces and protruding from one end of the heat radiation main body portion. The heat radiating device described in 1. The heat medium introducing portion is provided at a part of one end portion of the heat radiating main body portion, and one of the pair of blocking portions is provided at a remaining portion of one end portion of the heat radiating main body portion. The heat radiating device according to claim 2. The heat dissipating main body extends in a plate shape,
The plurality of heat medium flow spaces are arranged in the width direction of the heat radiating main body,
The heat medium introducing portion continuously protrudes on one side of the heat radiating main body,
The other of said pair of obstruction | occlusion parts is the heat radiating device of Claim 3 extended in the width direction of the said thermal radiation main-body part, and has reached the other side part from the one side part of the said thermal radiation main-body part. The heat dissipating main body extends into a rectangular plate,
5. The heat dissipation device according to claim 1, wherein each of the pair of blocking portions extends linearly to each of opposite sides of the heat dissipation main body.

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