JP2016073140A - Load integrated power supply device and led integrated power source illumination device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a configuration capable of reducing device cost and improving production efficiency by eliminating the need of mounting a connector pin for inspecting an output current to be supplied from a power supply circuit to a load and wiring processing with the inspection in a substrate of a load integrated power supply device.SOLUTION: A load integrated power supply device (1) includes: a power supply circuit (10) which generates an output current; a load (20); output wiring (31 and 32) for supplying the output current from the power supply circuit to the load; and a substrate (40) on which the power supply circuit, the load and the output wiring are mounted. On the substrate, a predetermined wiring portion (31a) that is a portion of the output wiring is mounted substantially in parallel with a predetermined edge portion (41a) of an edge (41) of the substrate and in a range surrounded by the output wiring, the power supply circuit and the load, a through-hole (45) is provided at a position holding the predetermined wiring portion between the position and the predetermined edge portion.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a load-integrated power supply device and an LED-integrated power illumination device, and more specifically, to a load-integrated power supply device and an LED-integrated power illumination device in which a power circuit and its load are mounted on the same substrate.

  Patent Document 1 discloses a light source display device including a power supply circuit, an LED fed from the power supply circuit, and an LED substrate on which the power supply circuit and the LED are mounted. A power supply circuit is mounted on the base portion of the LED substrate, and LEDs are arranged on an LED arrangement portion extending from the base portion. As a whole, an apparatus including a substrate on which the power supply circuit and the LED are integrated is configured.

  By the way, in general, in a lighting device or the like, output inspection is performed during a manufacturing process. In this output inspection, an output current or the like supplied from the power supply circuit to the light source is measured. With reference to FIG. 9, the output current test | inspection in the conventional LED integrated power supply illuminating device 3 is demonstrated. On the substrate B, the power supply circuit 10, the LED 20, and an output wiring L through which an output current supplied from the power supply circuit 10 to the LED 20 flows are mounted. For measurement of the output current, one of the output wirings L on the substrate B is mounted. Connector pins P1 and P2 are erected on the part. In the output current test, the wiring between the connector pins P1 and P2 is opened, and an ammeter is connected between the connector pins P1 and P2 to measure the output current. After completion of the output current inspection, the ammeter is removed and the connection between the connector pins P1 and P2 is processed. Such an output current inspection is considered to be necessary in the apparatus of Patent Document 1 as well.

JP 2014-112564 A

  However, according to the LED-integrated power source lighting apparatus provided with the connector pins as described above, the number of parts increases due to the connector pins, which increases the cost of the apparatus. Furthermore, due to the configuration in which the output wiring and the measuring instrument are connected in series, a wiring process for connecting the output wiring that has been opened at the time of the inspection after the inspection is necessary, and the production efficiency of the apparatus is lowered.

  Therefore, the present invention eliminates the need for wiring of the connector pins for mounting and inspection of the output current supplied from the power supply circuit to the load on the substrate of the load integrated power supply device such as the LED integrated power supply lighting device. It is an object of the present invention to provide a configuration capable of reducing the cost of the apparatus and improving the production efficiency.

  A load-integrated power supply apparatus according to a first embodiment of the present invention includes a power supply circuit that generates an output current, a load, an output wiring for supplying the output current from the power supply circuit to the load, a power supply circuit, the load, and the output wiring. And a predetermined wiring portion in a region surrounded by the output wiring, the power supply circuit, and the load. A through hole is provided at a position where the portion is sandwiched between the predetermined edge portion.

  According to the load-integrated power supply device described above, the through hole is provided at a position where the predetermined wiring portion is sandwiched between the predetermined edge portion on the substrate on which the power supply circuit, the load, and the output wiring are mounted. Accordingly, it is possible to measure the output current flowing through the output wiring by allowing the core portion of the current clamp or current probe to pass through the through hole and clamping the predetermined wiring portion to the core portion. Therefore, the wiring processing associated with the mounting and inspection of the connector pin for the output current inspection on the substrate is not required, and the cost of the apparatus can be reduced and the production efficiency can be improved.

  Here, it is preferable that the through hole is a substantially rectangular shape arranged orthogonal to the predetermined wiring portion. Since the components and wiring on the board are usually arranged orthogonally and the tip of the core part of the current clamp or current probe is generally rectangular, space efficiency on the board is improved by the rectangular through hole. .

  Moreover, it is preferable that the separation distance of a through-hole and a predetermined edge part is less than 24 mm. As described above, the separation distance, that is, the width of the substrate portion including the predetermined wiring portion is smaller than a measurable conductor diameter of a general current clamp, and thus a configuration suitable for an output current inspection using a general current clamp. Is realized.

  Moreover, it is preferable that the separation distance of a through-hole and a predetermined edge part is less than 20 mm. Thus, the separation distance, that is, the width of the substrate portion including the predetermined wiring portion is smaller than the measurable conductor diameter of a general current clamp and a relatively large current probe. A configuration suitable for output current inspection by use is realized, and the versatility of the apparatus is enhanced. Furthermore, the separation distance between the through hole and the predetermined edge portion is more preferably less than 5 mm. In this way, the width of the substrate portion including the predetermined wiring portion is less than the measurable conductor diameter of a general current clamp and relatively large and relatively small current probes, so that these current clamps and current probes can be used. The configuration suitable for the output current inspection is realized, and the versatility of the apparatus is further enhanced.

  A load-integrated power supply apparatus according to a second embodiment of the present invention includes a power supply circuit that generates an output current, a load, an output wiring for supplying the output current from the power supply circuit to the load, a power supply circuit, the load, and the output wiring. And a substrate provided with first and second through holes at positions facing each other across a predetermined wiring portion which is a part of the output wiring.

  According to the load-integrated power supply device described above, the first and second through holes are provided at positions facing each other across the predetermined wiring portion of the output wiring on the substrate, so that they are arranged in a relatively inner region of the substrate. It becomes possible to clamp the output wiring with a current probe and measure the current. According to this configuration, the connector pins for the output current inspection and the wiring accompanying the inspection on various boards in which other wiring or parts are arranged between the output wiring to be inspected and the board edge. No processing is required, and the cost of the apparatus can be reduced and the production efficiency can be improved.

  Moreover, it is preferable that the 1st and 2nd through-holes make the substantially rectangular shape orthogonally arranged with respect to the predetermined wiring part from a viewpoint of space efficiency improvement similarly to the 1st form. And it is preferable that the separation distance of a 1st through-hole and a 2nd through-hole is less than 20 mm. As described above, the separation distance, that is, the width of the substrate portion including the predetermined wiring portion is smaller than the measurable conductor diameter of the relatively large current probe, which is suitable for the output current inspection by using such a current probe. Configuration is realized. Furthermore, the separation distance between the first through hole and the second through hole is more preferably less than 5 mm. As described above, since the width of the substrate portion including the predetermined wiring portion is smaller than the measurable conductor diameter of the relatively large and relatively small current probes, the configuration suitable for the output current inspection by using these current probes can be obtained. Realized and increases the versatility of the device.

  The present invention includes an LED-integrated power source lighting device comprising the load-integrated power source device of the first or second form. In this LED integrated power lighting device, the power circuit is a DC power circuit that outputs a DC current, and the load is an LED. In the LED-integrated power lighting device, since the LED is a semiconductor element, it is often mounted on the same substrate as the power circuit, and the application of the present invention is particularly useful.

It is a figure which shows the LED integrated power supply illuminating device of the 1st Embodiment of this invention. It is a figure explaining the measurement by a current clamp in 1st Embodiment. It is a figure explaining the measurement by a current probe in a 1st embodiment. It is a figure explaining the measurement by a current probe in a 1st embodiment. It is a figure explaining arrangement | positioning of the through-hole in 1st Embodiment. It is a flowchart of the manufacturing method of the LED integrated power lighting device of 1st Embodiment. It is a figure which shows the board | substrate in the LED integrated power lighting device of the 2nd Embodiment of this invention. It is a figure explaining the measurement by a current probe in 2nd Embodiment. It is a figure which shows the application example of 2nd Embodiment. It is a figure explaining the conventional LED integrated power supply lighting device.

First embodiment.
FIG. 1 shows a schematic configuration of an LED-integrated power lighting device 1 (hereinafter referred to as “device 1”) according to the first embodiment of the present invention. In the following drawings, the drawings are not exactly the same. The apparatus 1 includes a power supply circuit 10 that generates an output current, an LED 20 that is a load, output wirings 31 and 32 that supply an output current from the power supply circuit 10 to the LED 20, and a power supply circuit 10, the LED 20, and the output wirings 31 and 32. A substrate 40 is mounted.

  The power supply circuit 10 receives input power from the input lines 11 and 12 and converts the input power into a direct current having a current value suitable for lighting the LED 20. When the input power supply is an AC power supply such as a commercial power supply, the power supply circuit 10 is an AC / DC converter. For example, a full-wave rectifier that full-wave rectifies the AC power supply and a full-wave rectified output from the full-wave rectifier are predetermined. And a step-down converter that converts the current into a direct current. When the input power source is a direct current power source such as a battery, the power source circuit 10 includes a DC / DC converter.

  The LED 20 includes a single LED element or an LED array in which a plurality of LED elements are connected in series or in series-parallel. A direct current from the power supply circuit 10 is supplied to the LED 20 via the output wirings 31 and 32. Here, one of the output wirings 31 and 32 is a high potential side wiring, and the other is a low potential side wiring. The anode end of the LED 20 is connected to the high potential side wiring (one of the output wirings 31 and 32), and the cathode end of the LED 20 is connected to the low potential side wiring (the other of the output wirings 31 and 32).

  The board | substrate 40 should just be a board | substrate of a general material as a circuit board, for example, may be a glass epoxy board | substrate, a paper phenol board | substrate, etc. The substrate 40 may be a single-sided mounting substrate, a double-sided mounting substrate, or a substrate capable of multilayer wiring. In any case, the components constituting the power supply circuit 10, the LED 20, and the output wirings 31 and 32 are mounted on any mounting surface or layer of the substrate 40. In the present embodiment, at least a predetermined wiring portion 31 a that is a part of the output wiring 31 is mounted so as to extend substantially in parallel along the predetermined edge portion 41 a that is a part of the edge 41 of the substrate 40.

  In the substrate 40, a through hole 45 is provided in a region surrounded by the output wirings 31 and 32, the power supply circuit 10, and the LED 20. The through hole 45 is provided at a position where the predetermined wiring portion 31a is sandwiched between the predetermined edge portion 41a. In other words, the predetermined edge portion 41 a and the predetermined wiring portion 31 a are defined by the through hole 45. As will be described in detail later, the through hole 45 is a through hole into which a current clamp or a current probe can be inserted for output current inspection. That is, the predetermined wiring portion 31a is clamped by the current clamp closed through the through hole 45 or the core portion of the current probe, and the output current flowing through the output wiring 31 is measured. Hereinafter, the predetermined wiring portion 31a is also referred to as a measured portion 31a.

  FIG. 2 shows a mode in which measurement by current clamping is performed as one usage mode of the present embodiment. The upper diagram of FIG. 2 is a partial plan view of the substrate 40 and the current clamp 50 as viewed from the direction perpendicular to the substrate mounting surface, and the lower diagram is an AA ′ arrow view of the upper diagram.

  The current clamp 50 may be a commercially available general current clamp (however, in the present embodiment, it is necessary to be a current clamp capable of direct current measurement). For example, the current clamp 50 includes core portions 51 and 52 and a main body 53. The core portion 51 can be pivoted with respect to a predetermined axis in the main body 53 by operating the button 54 of the main body 53, and is opened and closed with respect to the core portion 52 by this pivoting. When the tip portions of the core portions 51 and 52 abut (close) on the core contact surface C, an inner diameter space 55 is formed by the inner peripheral surfaces of the core portions 51 and 52. As described above, the core portion 51 and the core portion 52 are closed through the through hole 45, and the measured portion 31a of the output wiring 31 is included in the inner diameter space 55, whereby the output current can be measured.

  FIG. 3A shows an aspect in which measurement by a current probe is performed as one utilization aspect of the present embodiment. The upper diagram in FIG. 3A is a partial plan view of the substrate 40 and the current probe 60 as viewed from the direction perpendicular to the substrate mounting surface, and the lower diagram is a BB ′ arrow view of the upper diagram.

  The current probe 60 may be a commercially available general current probe (however, in this embodiment, it is necessary to be a current probe capable of direct current measurement). For example, the current probe 60 includes a fixed core portion 61, a slide core portion 62, and a main body 63, and an oscilloscope (amplifier if necessary), a memory hicoder, and the like are connected to the main body 63 via a cable 66. The The slide core portion 62 can slide in the longitudinal direction of the main body 63 by a slide operation of the slider 64 of the main body 63, and the fixed core portion 61 and the slide core portion 62 are opened and closed by the slide operation of the slide core portion 62. . By closing the distal end portions of the fixed core portion 61 and the slide core portion 62, an inner diameter space 65 is formed by the inner surfaces of the fixed core portion 61 and the slide core portion 62. As described above, the fixed core portion 61 passes through the through hole 45 and the slide core portion 62 is closed, and the measured portion 31a of the output wiring 31 is included in the inner diameter space 65, whereby the output current can be measured. .

  The current probe 60 may be used in a manner as shown in the cross-sectional view of FIG. 3B. That is, the mounting surface of the substrate 40 and the longitudinal direction of the current probe 60 are arranged substantially perpendicularly. The slide core portion 62 is closed through the through hole 45 and the inner diameter space 65 includes the portion to be measured 31a, whereby the output current can be measured. Of course, the current values measured in the arrangements shown in FIGS. 3A and 3B are the same.

  Next, with reference to FIGS. 2, 3A and 3B, the arrangement and dimensions of the through holes 45 will be discussed with reference to FIG. FIG. 4 is a partially enlarged view of the substrate 40 viewed from a direction perpendicular to the mounting surface. The output wiring 31 may be mounted on the upper surface of the substrate in FIG. 4, may be mounted on the lower surface (back surface) of the substrate, or may be mounted on an inner layer of the substrate. In the present embodiment, the through hole 45 has a rectangular shape and is arranged orthogonal to the predetermined edge portion 41a and the measured portion 31a. Since the components and the wirings on the substrate 40 are normally arranged orthogonally and the tip of the core portion of the current clamp or current probe is generally rectangular, the space on the substrate 40 is determined by the rectangular through hole 45. Efficiency is improved. The through hole 45 includes a near end 45a parallel to the part to be measured 31a and close to the part to be measured 31a, a far end 45b parallel to the part to be measured 31a and far from the part to be measured 31a, and the part to be measured. It is defined by side edges 45c and 45d perpendicular to the portion 31a.

  The separation distance D between the predetermined edge portion 41a and the near end portion 45a includes the line width d1 of the measured portion 31a, the separation distance d2 between the measured portion 31a and the predetermined edge portion 41a, and the measured portion 31a and the near end portion 45a. Determined by the sum of the separation distances d3. The lower limit of each value of the line width d1 and the separation distances d2 and d3 (therefore, the separation distance D determined by the sum of these) is the separation distance d2 = d3, and the current flowing through the output wiring 31, that is, the value of the LED lighting current, the substrate It is determined on the basis of the material. For these specific values, for example, refer to Appendix 8 of the Electrical Appliance and Material Safety Law, Appendix 2 and the like. On the other hand, the upper limit value of the separation distance D is determined by the dimensions of the current clamp or current probe used, as will be described in detail below.

  When the current clamp is used for measurement, referring to FIG. 2, the separation distance D needs to be set to be less than the diameter d55 of the inner diameter space 55 (hereinafter referred to as “measurable conductor diameter d55”). Here, when a comparatively small commercial current clamp capable of measuring direct current is illustrated, the measurable conductor diameter d55 of Hioki Electric Co., Ltd. current clamp (type names: 3284, 3287) is φ33 mm and φ35 mm, respectively. The measurable conductor diameter d55 of the current clamp (model name: CL220) manufactured by Yokogawa Meters & Instruments Co., Ltd. is 24 mm, and the measurable conductor diameter d55 of the current clamp manufactured by Kyoritsu Electric Instruments Co., Ltd. (model name: MODEL 2033). Is φ24 mm. Thus, if the separation distance D (that is, the width of the substrate portion including the portion to be measured 31a) is less than 24 mm, the portion to be measured 31a can be clamped through the through hole 45 by a commercially available current clamp. Therefore, when the current clamp is used for measurement, the separation distance D is preferably less than 24 mm.

  In addition, it is preferable that the dimension of the through-hole 45 is larger than about 10 mm square. This is because, for example, the above-mentioned current clamp (model name: 3287) manufactured by Hioki Electric Co., Ltd. has a 10 mm square core cross section (core contact surface C). This is because the contact surface C is about 10 mm square. However, these are merely examples, and the dimension of the through hole 45 may be set as appropriate according to the current clamp to be used. In addition, each of the far end 45b, the side end 45c, and the side end 45d of the through hole 45 has an appropriate separation distance (insulation distance, etc.) between the output wiring 32, the power supply circuit 10, and the LED 20. The range to be limited is the limit.

  When a current probe is used for measurement, referring to FIGS. 3A and 3B, the separation distance D needs to be set to be less than the diameter of the inner diameter space 65 (hereinafter referred to as “measurable conductor diameter d65”). Here, when a comparatively large commercial current clamp capable of measuring a direct current is illustrated, a measurable conductor diameter d65 of a current probe (model name: 3274, 3275) manufactured by Hioki Electric Co., Ltd. is 20 mm, and Yokogawa Meter Measured conductor diameter d65 of the current probe (model name: 701930, 701931) manufactured by & Instruments Co., Ltd. is φ20 mm, and the measurable conductor size of the current probe manufactured by Tektronix (model name: TCP303 type) is 21 mm × 25 mm Yes (corresponding to measurable conductor diameter d65 = φ21 mm). Thus, if the separation distance D (that is, the width of the substrate portion including the portion to be measured 31a) is less than 20 mm, the portion to be measured 31a can be clamped via the through hole 45 by a generally relatively large commercial current probe. Therefore, when the current probe is used for measurement, the separation distance D is preferably less than 20 mm.

  Here, when a DC current can be measured and a comparatively small commercial current clamp is illustrated, a measurable conductor diameter d65 of a current probe (model name: 3273-50, 3276) manufactured by Hioki Electric Co., Ltd. is φ5 mm, The measurable conductor diameter d65 of the current probe (model name: 701932, 701933) manufactured by Yokogawa Meter & Instruments Co., Ltd. is 5 mm, and the measurable conductor diameter d65 of the current probe manufactured by Tektronix (model name: TCP312A type) is φ5 mm. Thus, if the separation distance D (that is, the width of the substrate portion including the portion to be measured 31a) is less than 5 mm, the through-hole 45 can be clamped by a generally relatively small commercial current probe. Therefore, when a relatively small or relatively large commercial current probe is used for measurement, the separation distance D is preferably less than 5 mm.

  In addition, what is necessary is just to set suitably according to the dimension of the through-hole 45, and the current probe used. In addition, each of the far end 45b, the side end 45c, and the side end 45d of the through hole 45 has an appropriate separation distance (insulation distance, etc.) between the output wiring 32, the power supply circuit 10, and the LED 20. The range to be limited is the limit.

  Summarizing the above regarding the arrangement of the through-holes 45, if the separation distance D between the predetermined edge portion 41a and the near end 45a is less than 24 mm, it is suitable for measurement by current clamping. And if the separation distance D is less than 20 mm, it is suitable for the measurement by a current clamp and a comparatively large current probe, and the versatility of the apparatus 1 increases. Furthermore, if the separation distance D is less than 5 mm, it is suitable for measurement with a current clamp, a relatively large current probe, and a relatively small current probe, and the versatility of the apparatus 1 is further enhanced. And the dimension of the through-hole 45 is suitably set on condition that the appropriate separation distance with other circuit components and wiring is ensured according to the current clamp or current probe to be used.

FIG. 5 shows a flowchart of the manufacturing method of the device 1.
In step S100 (substrate preparation step), the substrate 40 in which the wiring pattern in the power supply circuit 10, the patterns of the output wirings 31 and 32, and the through holes 45 are formed is prepared. The through hole 45 is punched, for example. The pattern wiring may be formed after the formation of the through hole 45, or the through hole 45 may be formed after the formation of the pattern wiring.

  In step S102 (component mounting step), each component of the power supply circuit 10 and the LED 20 are mounted on the substrate 40. This process includes adhesion of each component and LED element to the substrate 40, and subsequent solder reflow. In step S102, the input lines 11 and 12 are connected to the substrate 40 (power supply circuit 10).

  In step S104 (output inspection step), a current clamp or current probe is inserted into the through hole 45, and the portion to be measured 31a of the output wiring 31 is clamped to these. Input power is supplied to the power supply circuit 10 from the input lines 11 and 12, and an output current supplied from the power supply circuit 10 to the LED 20 via the output wiring 31 is measured by a current clamp or a current probe. Here, when the output current is variable depending on the volume resistor for control adjustment of the power supply circuit 10, the output current may be adjusted by adjusting the resistance value of the volume resistor.

  In step S106 (pass / fail judgment step), it is determined whether or not the output current measured in step S104 is within the specified range. If the output current is within the specified range (S106: YES), the test is performed. The device 1 that is present is determined to be acceptable. When the device 1 does not require a housing or the like, that is, when shipped or distributed as a single integrated substrate, the device 1 (integrated substrate) is completed in the next step S108. If another component is attached to the substrate 40, the flow proceeds to step S110. On the other hand, if the output current measured in step S104 is outside the specified range, or if the output current does not fall within the specified range even if the output current is adjusted (S106: NO), the device 1 to be inspected is rejected. As a result, the flow proceeds to step S112.

  In step S110 (additional assembly step), the substrate 40 is attached to another constituent member such as a housing, whereby the apparatus 1 is completed. Here, for example, the through hole 45 may be used as a positioning hole when the substrate 40 is attached to the housing. For example, a convex portion having a shape corresponding to the through hole 45 is formed on the surface of the housing that faces the substrate 40, and the convex portion is fitted into the through hole 45 during mounting, whereby the position of the substrate 40 with respect to the housing. May be determined. Alternatively, the through hole 45 may be used as a lead route. For example, input lines 11 and 12 connected to the power supply circuit 10 and signal lines such as dimming signal lines and sensor output signal lines (when connected) are routed through the through holes 45. Also good. Further, the through hole 45 may be used as an injection port for injecting a filler into the back surface of the substrate. For example, after the substrate 40 is fixed to the housing, a filler (silicon or the like) such as a heat radiating material or an insulating material is injected from the substrate surface into the space between the substrate back surface and the housing through the through hole 45. May be. Thus, by adopting a configuration in which the through hole 45 can be used for other purposes after the output current inspection, it is possible to reduce the number of members for the other purposes, which is advantageous in terms of cost.

  In step S112, a rejected product is processed. For example, the rejected product may be re-introduced in the pass / fail judgment step S104 after parts replacement or the like, or may be substantially discarded.

  As described above, according to the device 1 according to the present embodiment, in the substrate 40 on which the power supply circuit 10, the LED 20, and the output wirings 31 and 32 are mounted, the portion to be measured 31a is inserted between the predetermined edge portion 41a. A hole 45 is provided. As a result, it is possible to measure the output current on the output wiring 31 by passing the core portion of the current clamp or current probe through the through hole 45 and clamping the measured portion 31a in the core portion. Therefore, it is not necessary to mount the connector pins for the inspection of the output current supplied from the power supply circuit 10 to the LED 20 on the substrate 40 and the wiring process associated with the inspection, thereby reducing the cost of the apparatus 1 and improving the production efficiency.

Second embodiment.
In the first embodiment, the configuration in which the measured portion of the output wiring is mounted along the vicinity of the edge 41 of the substrate 40 is shown. However, in this embodiment, the measured portion of the output wiring is compared with the substrate 40. A configuration when mounted in a region inside the target is shown. FIG. 6 shows a schematic configuration of the substrate 40 in the LED integrated power lighting device 2 (hereinafter referred to as “device 2”) according to the present embodiment. In the device 2, the same or similar components as those in the first embodiment are denoted by the same reference numerals regardless of whether they are illustrated or not illustrated, and detailed description thereof is omitted.

  As shown in FIG. 6, in the substrate 40, through holes 46 and 47 are provided at positions facing each other across a predetermined wiring portion 33 a of the output wiring 33 (hereinafter referred to as “measured portion 33 a”). The output wiring 33 may be any output wiring connected to the power supply circuit 10, and the angle formed between the portion to be measured 33a and the edge 41 of the substrate 40 may be any angle (parallel). Or vertical).

  In the present embodiment, it is assumed that the portion to be measured 33a is clamped by a current probe. FIG. 7 is a sectional side view of the positional relationship between the substrate 40 and the current probe 60 as viewed from the thickness direction of the substrate 40. As shown in FIG. 7, the current probe 60 is used in an arrangement in which the longitudinal direction is substantially perpendicular to the substrate 40. Regarding a specific clamping operation, first, from the state where the current probe 60 is below the drawing of the substrate 40, the slider 64 of the current probe 60 is pulled (that is, the slide core 62 is in the open position). The current probe 60 is raised, whereby the fixed core portion 61 penetrates the through hole 47. Next, the probe 60 is moved in the direction of the through hole 46 (left direction in FIG. 7) so that the inner diameter space 65 contains the portion to be measured 33a in a state where the slide core portion 62 is maintained in the open position. . Thereafter, the slider 64 is returned and the slider core portion 62 is in the closed position. As a result, the portion to be measured 33a is clamped by the fixed core portion 61 and the slider core portion 62, and the current of the output wiring 33 can be measured.

  Returning to FIG. 6, in this embodiment as well, from the viewpoint of space efficiency, the through holes 46 and 47 are rectangular and are arranged orthogonal to the portion to be measured 33a, as in the first embodiment. The through hole 46 is parallel to the part to be measured 33a and close to the part to be measured 33a, near end 46a, parallel to the part to be measured 33a and far from the part to be measured 33a, and far from the part to be measured 33a. It is defined by side edges 46c and 46d perpendicular to the portion 33a. Similarly, the through hole 47 has a near end portion 47a parallel to the measured portion 33a and close to the measured portion 33a, a far end portion 47b parallel to the measured portion 33a and far from the measured portion 33a, And is defined by side end portions 47c and 47d perpendicular to the portion to be measured 33a.

  The lower limit value of the separation distance D between the through hole 46 and the through hole 47, that is, the separation distance D (= d4 + d5 + d6) between the near end portion 46a and the near end portion 47a is the separation distance D (= d1 + d2 + d3) of the first embodiment. Any value similar to the lower limit value may be used. That is, the lower limit value of each value of the line width d4 and the separation distances d5 and d6 (therefore, the separation distance D determined by the sum of these) is based on the current flowing through the output wiring 33, the material of the board, etc., with the separation distance d5 = d6. Determined.

  Further, as described in the first embodiment, if the separation distance D is less than 20 mm, it is suitable for measurement with a relatively large current probe, and if it is less than 5 mm, it is relatively large current probe and relatively small. It is suitable for the measurement with the current probe and increases versatility. And each dimension of the through-holes 46 and 47 is suitably set according to the current probe used on condition that the appropriate separation distance (insulation distance etc.) with other circuit components and wiring is ensured.

  An application example of this embodiment is shown in FIG. In the example shown in FIG. 8, two LEDs 21 and 22 are connected in parallel to the power supply circuit 10. Each of the LEDs 21 and 22 has the same or similar configuration as the LED 20. In this mounted state, the configuration of the present embodiment is used when measuring the current of the LED 21 inside the substrate alone. As shown in FIG. 8, the output wirings 31 and 32 from the power supply circuit 10 are branched into an output wiring 33 connected to the LED 21 and an output wiring 34 connected to the LED 22. The through holes 46 and 47 are arranged at positions facing each other across the portion to be measured 33 a of the output wiring 33. With the operation described with reference to FIG. 7, the measured portion 33 a is clamped to the core portion of the current probe, whereby the output current flowing through the output wiring 33 and the LED 21 can be measured (inspected).

  Further, the positional relationship among the through hole 46, the edge portion 41, and the output wiring 34 satisfies the relationship defined for the through hole 45, the edge portion 41, and the output wiring 31 described in the first embodiment. Measurement (inspection) of the flowing output current is possible. Similarly, when the positional relationship among the through hole 47, the edge portion 41, and the output wiring 31 satisfies the relationship defined for the through hole 45, the edge portion 41, and the output wiring 31 described in the first embodiment, It is possible to measure (inspect) the output current flowing through the. The output current value flowing through the output wiring 33 can be obtained by subtracting the current value measured by the output wiring 34 from the current value measured by the output wiring 31. However, by directly measuring the current of the output wiring 33, the subtraction process is not required, so that the data processing process is simplified.

  As described above, according to the apparatus 2 of the present embodiment, the through-holes 46 and 47 are provided in the substrate 40 at positions facing each other with the measured portion 33a of the output wiring 33 interposed therebetween. It is possible to measure (inspect) the current of the output wiring arranged at the current probe. Therefore, with respect to various boards 40 in which other wiring or parts are arranged between the output wiring portion to be inspected and the board edge, wiring processing associated with mounting and inspection of connector pins for output current inspection Becomes unnecessary, and the cost of the apparatus 2 can be reduced and the production efficiency can be improved.

Modified example.
Although the preferred embodiment of the present invention has been described above, the present invention is not limited to the above configuration, and various modifications are possible as described below.

(1) Modifications related to load In each of the above embodiments, the LEDs 20, 21, and 22 are exemplified as the load. Since the LED is a semiconductor element, it is often mounted on the same substrate 40 as the power supply circuit 10 (including other semiconductor elements), and the application of the present invention is particularly useful. On the other hand, the load fed from the power supply circuit is not limited to the LED, and may be another load as long as it can be mounted on the same substrate as the power supply circuit. The present invention is also applicable to a load-integrated power supply device having such a load. The present invention is also applicable when the output current is not direct current but alternating current.

(2) Modification regarding shape of through-hole In each of the above embodiments, the shape of through-holes 45, 46, and 47 is rectangular from the viewpoint of space efficiency, but the shape of the through-hole is not limited to a rectangle. For example, the shape of the through hole may be a circle, an ellipse, an ellipse, a semicircle (a chord is on the measured portion 31a or 33a side), a polygon, or the like as long as the above-described conditions are satisfied. A circle, an ellipse, an ellipse, a semicircle, a polygon or the like circumscribing the rectangle defined above may be used.

1, 2 LED integrated power lighting device (load integrated power device)
10 Power supply circuit 20, 21, 22 LED (load)
31, 32, 33, 34 Output wiring 31a, 33a Predetermined wiring portion or portion to be measured 40 Substrate 41 Edge portion 41a Predetermined edge portion 45, 46, 47 Through hole

Claims (8)

A load-integrated power supply,
A power supply circuit for generating an output current;
Load,
Output wiring for supplying the output current from the power supply circuit to the load;
A substrate on which the power supply circuit, the load, and the output wiring are mounted, and a predetermined wiring portion that is a part of the output wiring is mounted substantially parallel to a predetermined edge portion of the substrate, and the output wiring, the power supply circuit And a load-integrated power supply device comprising: a substrate provided with a through hole at a position sandwiching the predetermined wiring portion with the predetermined edge portion in a region surrounded by the load.   The load-integrated power supply apparatus according to claim 1, wherein the through-hole has a substantially rectangular shape arranged orthogonal to the predetermined wiring portion.   The load-integrated power supply apparatus according to claim 2, wherein a separation distance between the through hole and the predetermined edge portion is less than 24 mm.   4. The load-integrated power supply apparatus according to claim 2 or 3, wherein a distance between the through hole and the predetermined edge portion is less than 20 mm, preferably less than 5 mm. A load-integrated power supply,
A power supply circuit for generating an output current;
Load,
Output wiring for supplying the output current from the power supply circuit to the load;
A load including the power supply circuit, the load, and the output wiring, and a substrate provided with first and second through holes at positions facing each other across a predetermined wiring portion that is a part of the output wiring. Integrated power supply.   6. The load-integrated power supply apparatus according to claim 5, wherein the first and second through holes form a substantially rectangular shape arranged orthogonal to the predetermined wiring portion.   The load-integrated power supply device according to claim 6, wherein a separation distance between the first through hole and the second through hole is less than 20 mm, preferably less than 5 mm. 8. An LED-integrated power source lighting device comprising the load-integrated power source device according to claim 1, wherein the power circuit is a DC power circuit that outputs a DC current, and the load is an LED. An LED-integrated power source lighting device.

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