JP2016062739A - Lamp device and luminaire - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lamp device capable of improving assemblability and capable of coping with automatic assembly.SOLUTION: A lamp device includes: a light-emitting module; a housing; a base 14; and a power supply circuit 15. In the housing, the light-emitting module is arranged on one end side. The base 14 is mounted on the other end side of the housing, and it has a storage part 55 on one end side, and also it has an electrode pin 51 which penetrates from the one end side to the other end side. The power supply circuit 15 includes a circuit board 70 which has a substrate part 73 to which the electrode pin 51 is soldered and connected, and an electronic component 71 mounted on the circuit board 70, and they are stored in the storage part 55 of the base 14.SELECTED DRAWING: Figure 1

Description

  Embodiments described herein relate generally to a lamp device using a light emitting module, and an illumination device using the lamp device.

  Conventionally, as a lamp device using a light emitting module, for example, there is a flat lamp device using a GX53 type base.

  The lamp device includes a housing in which the light emitting module is disposed on one end side, a base attached to the other end side of the housing, a power supply circuit incorporated in the base, and the like. An electrode pin penetrating from one end side to the other end side is arranged on the base. In the base, the power supply circuit and the electrode pins are electrically connected by electric wires. One end of the electrode of the electric wire is connected in advance to the circuit board of the power supply circuit, and when assembling the lamp device, for example, wrapping connection is performed in which the electric wire is wound around the electrode pin.

JP 2012-22994 A

  However, when the electric wire from the power supply circuit is lapped to the electrode pins, there is a problem that the workability is poor and the electrode pins are expensive. This is because the space in the base is narrow and the electric wire is easy to move, so that it is difficult to position the electric wire and the electrode pin, and the electric wire must be wound around and connected to the electrode pin while holding the electric wire.

  The problem to be solved by the present invention is to provide a lamp device that can improve assemblability and can be adapted to automatic assembly, and a lighting device using the lamp device.

  The lamp device of the embodiment includes a light emitting module, a housing, a base, and a power circuit. The housing has a light emitting module disposed on one end side. The base is attached to the other end side of the housing, has an accommodating portion on one end side, and has an electrode pin penetrating from the one end side to the other end side. The power supply circuit includes a circuit board having a board part to which electrode pins are soldered and connected, and an electronic component to be mounted on the circuit board, and is housed in a base housing part.

  According to the present invention, it can be expected that assemblability can be improved and automatic assembly can be supported.

It is a perspective view of the nozzle | cap | die and power supply circuit of the lamp device which show 1st Embodiment. It is sectional drawing of a base same as the above and a power supply circuit. It is sectional drawing of a lamp device same as the above. It is a perspective view of the illuminating device using a lamp device same as the above. The circuit board of the lamp device which shows 2nd Embodiment is shown, (a) is a front view of the circuit board before a division | segmentation, (b) is a front view of the circuit board of the state arrange | positioned to a nozzle | cap | die after a division | segmentation. It is a front view of the circuit board of the lamp device which shows 3rd Embodiment. It is a perspective view of the nozzle | cap | die and power supply circuit of the lamp | ramp apparatus which shows 4th Embodiment.

  Hereinafter, a first embodiment will be described with reference to FIGS. 1 to 4.

  1 to 4 show a flat lamp device 10. In the following description, one end side of the lamp device 10 is assumed to be the front (front side or front side) and the other end side is assumed to be the rear side (rear side or rear side). As shown in FIG. 4, the light emitting surface is directed downward in the use state of the present embodiment, but in FIGS. 1 to 3, the light emitting surface that is opposite to the use state is illustrated upward.

  The lamp device 10 includes a housing 11, a light emitting module 12 and a globe 13 attached to the front side of the housing 11, a base 14 attached to the rear side of the housing 11, and a power supply circuit 15 accommodated in the base 14. It has.

  The housing 11 includes a substrate attachment portion 20 and an outer peripheral portion 21 formed on the outer periphery of the substrate attachment portion 20. The board mounting portion 20 is formed in a flat plate shape. The outer peripheral portion 21 is formed in a cylindrical shape and protrudes in front of and behind the substrate mounting portion 20, respectively.

  A substrate attachment surface 22 to which the light emitting module 12 is attached is formed at the front center of the substrate attachment portion 20. A plurality of mounting holes through which screws for fixing the cap 14 to the housing 11 are inserted are formed through the board mounting portion 20 at a peripheral position of the board mounting surface 22, and one wiring hole 24 is formed. It is formed so as to penetrate through the board mounting portion 20. On the rear surface of the substrate mounting portion 20, a cylindrical wall portion 25 is formed in which the rear portion of the outer peripheral portion 21 protrudes and into which the base 14 is fitted.

  The casing 11 is integrally formed by insert molding that covers the heat diffusing plate 28 with the resin portion 29.

  The heat diffusing plate 28 is made of, for example, a metal material that has a good effect of diffusing heat. For example, aluminum is used as the metal material. The heat diffusing plate 28 is disposed from the substrate mounting portion 20 to the wall portion 25. The heat diffusion plate 28 is formed with a plurality of holes so that the resin portion 29 on the front surface side and the resin portion 29 on the back surface side of the heat diffusion plate 28 are coupled to each other.

  The resin part 29 has an insulating property and, for example, a white highly reflective resin is used. A resin surface 29 is formed on the front surface of the substrate mounting portion 20 of the housing 11 and the inner peripheral surface of the outer peripheral portion 21 to form a highly reflective reflective surface.

  An opening 30 is formed in the center of the front surface of the resin portion 29, and the heat diffusing plate 28 is exposed from the opening 30. The exposed portion of the heat diffusing plate 28 is configured as a substrate mounting surface 22 to which the light emitting module 12 is attached. The board mounting surface 22 is a quadrangular shape and is formed in a flat shape. A pressing portion 31 protrudes from the edge of the wiring hole 24 on the rear surface of the housing 11.

  The light emitting module 12 includes a substrate 40 and a light emitting element 41 mounted on the front surface of the substrate 40. Further, a terminal portion 42 for electrically connecting the light emitting element 41 and the power supply circuit 15 is mounted on the front surface of the substrate 40.

  The substrate 40 is formed in a square plate shape, for example, with a metal such as aluminum having excellent thermal conductivity or ceramics. A wiring pattern is formed on the front surface of the substrate 40 through an insulating layer, and a light emitting element 41 is mounted on the wiring pattern and a terminal portion 42 is formed. Further, on the wiring pattern, a white insulating layer having a high reflectance is formed except for the mounting position of the light emitting element 41 and the terminal portion. The substrate 40 is thermally bonded to the heat diffusion plate 28 by joining the rear surface of the substrate 40 to the substrate mounting surface 22 of the housing 11 and screwing a plurality of screws 43 to the heat diffusion plate 28 through the substrate 40. It is connected to the.

  The light emitting element 41 is, for example, an LED. In the present embodiment, as the light emitting element 41, a plurality of SMD (Surface Mount Device) packages on which LED chips are mounted are used. The light emitting element 41 emits white illumination light. The light emitting element 41 may be a COB (Chip On Board) module or other light emitting element such as an EL element.

  The globe 13 is made of a synthetic resin having translucency and diffusibility and is formed in a disc shape. The globe 13 is attached by being fitted inside the outer peripheral portion 21 of the housing 11 so as to cover the lower surface of the housing 11.

  The base 14 is, for example, a GX53 type base. The base 14 includes a base body 50 and a pair of electrode pins 51 protruding from the rear surface of the base body 50.

  The base body 50 is integrally formed of an insulating resin. The base body 50 includes an annular portion 52, a cylindrical fitting portion 53 protruding from the peripheral portion of the annular portion 52 to the front surface side, and a cylindrical protruding portion 54 protruding rearward from the central region of the annular portion 52. Have. Thus, the front surface of the base body 50 is opened, and a housing portion 55 for incorporating the power supply circuit 15 is formed inside the base body 50.

  A plurality of bosses 56 project from the front surface of the annular portion 52. Then, the housing 11 and the base 14 are fixed by fitting the fitting portion 53 to the wall portion 25 of the housing 11 and screwing a plurality of screws from the housing 11 to the boss 56.

  The annular portion 52 is formed with a pair of electrode pin attachment portions 57 to which the pair of electrode pins 51 are attached so as to penetrate from the front side to the rear side. A circuit board mounting portion 58 (shown in FIG. 3) for mounting the circuit board 70 of the power supply circuit 15 is provided on both side positions orthogonal to the pair of electrode pin mounting portions 57.

  On the front side of the base 14, a guide part 59 projects from the side part of the housing part 55. The guide portion 59 is disposed at a position facing the wiring hole 24 on the side portion of the pressing portion 31 in a state where the housing 11 and the base 14 are combined. A holding groove 60 is formed in the guide portion 59 on the side surface facing the accommodating portion 55.

  A pair of L-shaped key grooves 61 are formed on the outer peripheral surface of the projecting portion 54 at positions that are symmetrical with respect to the center of the base 14 and are shifted from the positions where the pair of electrode pins 51 are disposed. Further, the end surface of the protruding portion 54 is formed in a planar shape.

  The pair of electrode pins 51 is made of a metal having conductivity, and is attached to the electrode pin attachment portion 57 by being inserted from the front side to the rear side. A large diameter portion 62 is formed at the tip of the electrode pin 51. A pin portion 63 projects from the rear end of the electrode pin 51.

  Further, the power supply circuit 15 receives AC power, converts it into predetermined DC power, and supplies it to the light emitting module 12.

  The power supply circuit 15 includes a circuit board 70 and a plurality of electronic components 71 mounted on the circuit board 70.

  The circuit board 70 is a printed wiring board. A wiring pattern surface 70a having a wiring pattern is formed on the front surface of the circuit board 70, and a mounting surface 70b is formed on the rear surface. The circuit board 70 includes a board body 72, a pair of board portions 73 disposed on both sides of the board body 72, and jumper wires 74 that electrically connect the board body 72 and the board portion 73, respectively. Note that both the substrate body 72 and the substrate portion 73 have a wiring pattern surface 70a.

  The board main body 72 has an area larger than that of the board portion 73, and all of the electronic components 71 are mounted, or most of the electronic components 71 except a part thereof are mounted. Among the electronic components 71, the electronic component 71 having the lead wire 71a is mounted on the mounting surface 70b of the substrate body 72, and the lead wire 71a penetrates the substrate body 72 and is soldered to the wiring pattern to form a chip-like small size. The electronic component 71 is disposed on the wiring pattern of the substrate body 72 and soldered. On both sides of the substrate body 72, jumper wire connecting portions 75 to which the jumper wires 74 are connected are formed.

  The board portion 73 has a smaller area than the board body 72, and the electronic component 71 is not mounted thereon, or a part of the electronic component 71 is mounted. Although the board | substrate part 73 is formed in the substantially L shape, it is not limited to this. A jumper wire connecting portion 76 to which the jumper wire 74 is connected is formed at one end of the substrate portion 73, and a pin connecting portion 77 to which the pin portion 63 of the electrode pin 51 is connected is formed at the other end.

  The jumper wire 74 is made of, for example, a copper wire and has flexibility.

  In the circuit board 70, the electronic component 71 is mounted in a state where the board body 72 and the pair of board parts 73 are integrally formed, and a jumper wire 74 is provided between the board body 72 and the board part 73. Connected. The lead wire 71a and the jumper wire 74 of the electronic component 71 are soldered to the wiring pattern. Thereafter, the substrate body 72 and the substrate portion 73 are divided along a dividing line such as a groove formed in advance between the substrate body 72 and the substrate portion 73 of the circuit board 70. The divided substrate body 72 and the substrate portion 73 are electrically connected by a jumper wire 74.

  The circuit board 70 on which the electronic component 71 is mounted is incorporated in the housing part 55 of the base 14 and is held on the base 14 by the circuit board mounting part 58.

  In the power supply circuit 15, a pair of substrate portions 73 are used for inputting AC power from the pair of electrode pins 51, and an output line 78 is used for outputting DC power from the power supply circuit 15 to the light emitting module 12. The output line 78 is formed of, for example, a flexible wiring board, one end of which is connected to the wiring pattern on the board body 72 and protrudes to the side of the board body 72.

  Next, assembly of the lamp device 10 will be described.

  First, the pin portion 63 of the electrode pin 51 is passed through the pin connection portion 77 of the substrate portion 73, and the pin connection portion 77 of the substrate portion 73 and the pin portion 63 of the electrode pin 51 are connected by soldering. Next, the substrate body 72 and the substrate portion 73 are attached to the circuit board attachment portion 58 in a state where the electrode pins 51 are connected to the substrate portion 73. The electrode pin 51 is attached to the base 14 and the power supply circuit 15 is incorporated into the housing part 55 of the base 14, and then the pin connection part 77 of the substrate part 73 and the pin part 63 of the electrode pin 51 are connected by soldering. May be.

  In a state where the power supply circuit 15 is incorporated in the housing portion 55 of the base 14, the substrate body 72 and the substrate portion 73 are arranged with a step in the front-rear direction that is perpendicular to the surfaces of the substrate body 72 and the substrate portion 73. Yes.

  Further, when the power supply circuit 15 is assembled in the housing portion 55 of the base 14, the output line 78 comes into contact with the guide portion 59 and rises while being bent along the guide portion 59.

  The casing 11 to which the light emitting module 12 is attached in advance and the base 14 incorporating the power supply circuit 15 are combined, and the casing 11 and the base 14 are fixed with a plurality of screws.

  When the casing 11 and the base 14 are combined, the output line 78 rising from the base 14 along the guide portion 59 is inserted into the wiring hole 24 of the casing 11. When the housing 11 and the base 14 are combined, the tip of the pressing portion 31 of the housing 11 comes into contact with the output line 78, the output line 78 is along the guide part 59, and the output line 78 is along the guide part 59. Make sure you get up.

  The output line 78 protruding from the wiring hole 24 of the housing 11 is bent toward the light emitting module 12, and the tip of the output line 78 is electrically connected to the terminal portion 42 of the light emitting module 12.

  Finally, the globe 13 is attached to the housing 11.

  Next, FIG. 4 shows an illumination device 80 that uses the lamp device 10. The illumination device 80 is, for example, a downlight. The lighting device 80 includes an instrument body 81, a socket 82, and the lamp device 10.

  The instrument body 81 is opened downward and is also configured as a reflector.

  The socket 82 includes a socket body 83 and terminals accommodated in the socket body 83. The socket body 83 is made of an insulating resin and is formed in an annular shape, and an insertion hole 84 through which the protruding portion 54 of the lamp device 10 is inserted is formed at the center.

  On the lower surface of the socket main body 83, a pair of connection holes 85 are formed at the positions symmetrical with respect to the center of the socket 82 so that the electrode pins 51 of the lamp device 10 are inserted and rotated. These connection holes 85 are long holes along the circumferential direction of the socket body 83, and at one end thereof, a hole portion 86 through which the large diameter portion 62 of the electrode pin 51 can be inserted is formed. Inside each connection hole 85, a terminal to which the electrode pin 51 inserted into the connection hole 85 is electrically connected is accommodated.

  A substantially L-shaped key formed on the outer peripheral surface of the projecting portion 54 of the base 14 as the electrode pin 51 of the base 14 is inserted into the connection hole 85 and rotated on the inner peripheral surface of the socket body 83. A key 87 that protrudes into the groove 61 and supports the base 14 to the socket body 83 is provided.

  Then, with the lamp device 10 mounted in the socket 82, AC power is supplied to the power supply circuit 15 through the terminal of the socket 82 and the electrode pin 51 of the lamp device 10, whereby the power supply circuit 15 converts the AC power to predetermined DC power. And is supplied to the light emitting element 41 of the light emitting module 12, and the light emitting element 41 emits light.

  The light from the light emitting element 41 passes through the globe 13 and is irradiated to the illumination space.

  According to the lamp device 10 of the present embodiment, since the circuit board 70 of the power supply circuit 15 includes the board portion 73 that is soldered to the electrode pins 51, the power supply circuit 15 is provided in the housing portion 55 of the base 14. It is possible to easily connect the substrate portion 73 to the electrode pins 51 only by incorporating them, so that the assemblability can be improved and automatic assembly can be supported. In addition, when the power supply circuit 15 is incorporated in the housing part 55 of the base 14 with the electrode pins 51 connected to the board part 73, the assemblability can be improved and heat from soldering affects the base 14 There is no.

  Further, thermal expansion and thermal contraction occur in each component of the lamp device 10 due to a thermal effect caused by turning on and off the lamp device 10. Such a thermal effect also acts on the circuit board 70 connected between the pair of electrode pins 51. However, the circuit board 70 divides the board body 72 and the board part 73, and the board body 72 and the board part 73 are separated. Are electrically connected by a jumper wire 74, so even if the dimension between the pair of electrode pins 51 changes due to thermal influence, the dimension change is formed between the board body 72 and the board part 73. Can be absorbed in gaps. Therefore, an unreasonable load is not applied to the soldering connection part between the board part 73 and the electrode pin 51, and the soldering connection part between the board body 72 and the board part 73 and the jumper wire 74, ensuring connection reliability. it can.

  In the state where the power supply circuit 15 is incorporated in the housing part 55 of the base 14, the board body 72 and the board part 73 are arranged with a step in the front-rear direction, which is a direction perpendicular to the surface of the board body 72 and the board part 73. Has been. Therefore, even if the dimension between the pair of electrode pins 51 changes due to the thermal influence, the substrate main body 72 and the substrate portion 73 can be prevented from contacting each other, and the dimension change due to the thermal influence can be reliably absorbed.

  Further, the substrate body 72 and the substrate portion 73 can be disposed on the base 14 with the electrode pins 51 attached to the substrate portion 73. That is, since the power supply circuit 15 can be attached to the base 14 after the electronic component 71, the jumper wire 74, and the electrode pin 51 are soldered to the circuit board 70, it is necessary to solder the power supply circuit 15 after the power supply circuit 15 is attached to the base 14. Absent. For this reason, the base 14 is not deformed by heat during soldering, and the assembly workability is improved.

  Next, FIG. 5 shows a second embodiment. In addition, the same code | symbol is used about the same structure as the said embodiment, and the description about the structure and effect is abbreviate | omitted.

  FIG. 5A shows the circuit board 70 before division. In the state where the substrate body 72 and the substrate portion 73 are integrated, a dividing line 90 formed by, for example, a groove or the like between the substrate body 72 and the substrate portion 73 is formed. The jumper line connection part 75 of the substrate body 72 and the jumper line connection part 76 of the substrate part 73 are provided not at symmetrical positions with respect to the dividing line 90 but at shifted positions. Therefore, the jumper line 74 is connected to the dividing line 90 along the oblique direction.

  FIG. 5B shows the circuit board 70 in a state where it is arranged on the base 14 after being divided. The substrate portion 73 divided from the substrate body 72 is disposed at a position shifted along the substrate body 72 from the division position where the substrate body 72 is divided. This shifted position is a position where the jumper line connecting portion 75 of the board body 72 and the jumper line connecting portion 76 of the board portion 73 are symmetric with respect to the dividing line 90.

  The jumper wire 74 has the same distance for connecting the board body 72 and the board part 73 at the division position of the board part 73 and the distance for connecting the board body 72 and the board part 73 at a position shifted from the board part 73. The board portion 73 is arranged at a position shifted along the board body 72 from the division position where the board portion 72 is divided from the board body 72, thereby forming a gap between the board body 72 and the board portion 73. The Note that the position where the board portion 73 is displaced along the board body 72 is not necessarily a position that is symmetrical with respect to the dividing line 90. It suffices that the gap is formed between the substrate main body 72 and the substrate portion 73 when the jumper line connecting portion 76 of 73 approaches the symmetrical position. Further, the gap may be formed not only in the horizontal direction with respect to the surface of the circuit board 70 but also in the vertical direction.

  Since a gap is formed between the substrate body 72 and the substrate portion 73, even if the dimension between the pair of electrode pins 51 changes due to thermal influence, the change in dimension can be absorbed.

  Next, FIG. 6 shows a third embodiment. In addition, the same code | symbol is used about the same structure as the said embodiment, and the description about the structure and effect is abbreviate | omitted.

  Of the pair of substrate portions 73, one substrate portion 73 is divided from the substrate body 72 and electrically connected by a jumper wire 74. However, the other substrate portion 73 may remain integral with the substrate body 72. Also in this case, a dimensional change due to thermal influence can be absorbed between the one substrate portion 73 and the substrate body 72.

  Next, FIG. 7 shows a fourth embodiment. In addition, the same code | symbol is used about the same structure as the said embodiment, and the description about the structure and effect is abbreviate | omitted.

  The substrate body 72 and the pair of substrate portions 73 may be integrated without being divided. In this case, since the circuit board 70 is integrated, the power supply circuit 15 can be easily incorporated into the housing portion 55 of the base 14, the assemblability is improved, and automatic assembly can be accommodated.

  Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

10 Lamp device
11 Enclosure
12 Light emitting module
14 base
15 Power supply circuit
51 Electrode pin
55 containment
70 circuit board
71 Electronic components
72 Board body
73 Board
74 Jumper wire
80 Lighting equipment
82 socket

Claims (5)

A light emitting module;
A housing in which the light emitting module is disposed on one end side;
A base attached to the other end of the housing, having an accommodating portion on one end and having an electrode pin penetrating from the one end to the other end;
A circuit board having a board part to which the electrode pins are connected by soldering, and an electronic component mounted on the circuit board, and a power supply circuit housed in the housing part of the base;
A lamp device comprising: 2. The lamp device according to claim 1, wherein the circuit board includes a substrate body that is divided from the substrate portion, and a jumper wire that electrically connects the substrate body and the substrate portion. The lamp device according to claim 2, wherein the substrate body and the substrate portion are arranged with a step in a direction perpendicular to the surface of the circuit board. The jumper wire includes a distance for connecting the substrate body and the substrate portion at a division position of the substrate portion, and the substrate body when the substrate portion is disposed at a position shifted along the substrate body. The distance between the substrate body and the substrate body is the same, and the substrate section is disposed at a position shifted along the substrate body from a dividing position where the substrate section is divided from the substrate body. The lamp device according to claim 2, wherein a gap is formed between the substrate portion and the substrate portion. A lamp device according to any one of claims 1 to 4;
A socket for connecting the base of the lamp device;
An illumination device comprising:

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