JP2016060110A - Mask for printing and printing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the breakage of a mask for printing while highly maintaining the opening part of the mask for printing and the precision of its thickness.SOLUTION: A mask 100 for printing in the form of the first execution comprises: a planar base material 110; a plurality of opening parts 120; and a high rigidity member 130. A plurality of the opening parts 120 are formed on the base material 110. The high rigidity member 130 has rigidity higher than that of the base material 110. The high rigidity member 130 is buried in the base material 110, at the outer peripheral part of an opening part forming region 111 in the base material 110 face. The opening part forming region 111 is the region formed with a plurality of the opening parts 120.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a printing mask and the like, and for example, relates to one used for printing a printing material such as a solder paste on a printing object such as a printed wiring board in a mounting process of an electronic device or the like.

  The printing mask prints a printed material such as a conductive paste mainly composed of a solder paste or a resin such as an adhesive on a printed object such as a printed wiring board.

  For example, a screen mask corresponding to screen printing or a metal metal mask has been widely used as the printing mask, but in recent years, a frameless mask is being used.

  In recent years, production models of electronic devices mounted on in-vehicle products are increasing, and the production volume is expanding. For this reason, the production period of these electronic devices tends to be prolonged, and it is necessary to store jigs and the like used during production, and securing storage spaces for these jigs and the like has been a problem.

  In the frameless mask, the printing mask can be shared, and only the plate can be attached or detached. For this reason, space saving can be achieved by using a frameless mask. Therefore, the above-described problem can be solved by using a frameless mask.

  In recent years, in order to reduce product costs, there is a tendency to adopt inexpensive parts for electronic devices. For this reason, mounting a large mounting component and a small mounting component (for example, 0603 chip component) on the same printed wiring board (mixed mounting) is becoming widespread. At this time, a printing mask (cavity mask) in which concave and convex portions are formed in the thickness direction is widely used so that the solder can be supplied in accordance with a desired amount of solder.

  By using a frameless mask, the storage area for jigs and the like could be saved as described above. However, with a frameless mask, it is necessary to handle a very thin plate of about 0.05 to 0.20 mm, for example. For this reason, when attaching and detaching the printing mask, there is a concern that the plate may be damaged or deformed by bending or striking the plate. Moreover, since the operation | work which attaches / detachs the printing mask which is a metal thin plate is handled manually, there is also a high risk that an operator may be cut.

  On the other hand, there are cases where the outermost four sides of the printing mask are subjected to a bending process, or the corners of the printing mask are rounded. As a result, the rigidity of the plate can be increased, the plate can be prevented from being damaged or deformed, and the risk of an operator's cut can be prevented. However, in this case, there is a problem that a mechanical secondary processing cost is newly generated. In this case, the rigidity of the outermost peripheral portion of the printing mask is enhanced, but the rigidity of the central portion of the printing mask is not enhanced. A plurality of openings are provided in the central portion of the printing mask. The distance between the region where these openings are formed and the outermost periphery is usually separated by several tens of mm. For this reason, there is a possibility that the printing mask may be deformed or damaged particularly during the stencil attaching / detaching operation in a plurality of opening regions that influence the printing workability. In particular, since the thickness of the printing mask is locally reduced in the recesses of the cavity mask, the risk of damage to the printing mask as described above increases.

  In order to solve these problems, it is conceivable to increase the rigidity of the entire printing mask by installing a highly rigid material in the vicinity of a plurality of opening regions provided in the vicinity of the center of the printing mask.

  For example, Patent Document 1 discloses a technique of laminating a reinforcing layer formed of a sheet-shaped plastic material and a metal layer on the entire surface or a part of a base material for a printing mask. Thereby, the rigidity of the printing mask can be increased.

  Techniques related to the present invention are also disclosed in Patent Documents 2 and 3. However, Patent Document 2 does not describe a difference in rigidity between the reinforcing portion and the mask layer. Moreover, since the Young's modulus of the material of the reinforcement part and mask layer which were illustrated by embodiment of patent document 2 is substantially equivalent, the reinforcement effect is low. The present invention is characterized in that “a material higher in rigidity than the mask layer” is applied around the opening region.

JP 2000-168256 A Japanese Patent Laid-Open No. 2008-200959 JP-A-11-170719

  However, in the technique described in Patent Document 1, a plastic material and a metal are laminated after laminating a reinforcing material formed of a sheet-like plastic material and a metal layer on the entire surface of the base material (base material) of the printing mask. Separate openings are provided for both layers. For this reason, the technique described in Patent Document 1 has a problem that the number of times of forming the opening is large. In addition, if the opening is formed at a stretch in a state where the reinforcing material is laminated, the weld between the base material (base material) and the reinforcing material may be peeled off, or burrs may be generated around the opening. There is a concern that the accuracy may decrease. In addition, the technique described in Patent Document 1 has a problem in that the thickness accuracy of the printing mask is reduced because the reinforcing material is selectively laminated on the base material by an etching process or the like.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a printing mask that can prevent breakage while maintaining high accuracy of the opening and thickness of the printing mask. It is in.

  The printing mask of the present invention has a plate-like base material, a plurality of openings formed in the base material, and a rigidity higher than the base material, and the plurality of openings in the base material surface. And a high-rigidity member embedded in the base material at the outer peripheral edge portion of the opening forming region, which is a region where is formed.

  The printing mask manufacturing method of the present invention includes an opening forming step of forming a plurality of openings in a plate-like base material in an opening forming region of the base material surface, and an outer peripheral edge of the opening forming region. A groove forming step for forming a concave groove on the surface of the base material, and a high rigidity member embedding a high rigidity member having higher rigidity than the base material in the groove formed in the groove step. Including steps.

  According to the printing mask and the like according to the present invention, it is possible to prevent breakage while maintaining high accuracy of the opening and thickness of the printing mask.

It is a figure which shows the structure of the mask for printing in the 1st Embodiment of this invention. FIG. 1A is a plan view of a printing mask according to the first embodiment of the present invention. FIG. 1B is a cross-sectional view of the printing mask according to the first embodiment of the present invention, and is a cross-sectional view taken along the line AA in FIG. It is a figure for demonstrating the method to manufacture the mask for printing in the 1st Embodiment of this invention. It is a figure for demonstrating the method to manufacture the mask for printing in the 1st Embodiment of this invention. It is a figure which shows the structure of the mask for printing in the 2nd Embodiment of this invention. FIG. 4A is a plan view of a printing mask according to the second embodiment of the present invention. FIG. 4B is a cross-sectional view of the printing mask according to the second embodiment of the present invention, and is a cross-sectional view taken along the line BB of FIG. It is a figure which shows the structure of the mask for printing in the 3rd Embodiment of this invention. FIG. 5A is a plan view of a printing mask according to the third embodiment of the present invention. FIG. 5B is a cross-sectional view of the printing mask according to the third embodiment of the present invention, and is a cross-sectional view taken along the line CC of FIG. It is a figure which shows the structure of the mask for printing in the 4th Embodiment of this invention. FIG. 6A is a plan view of a printing mask according to the fourth embodiment of the present invention. FIG. 6B is a cross-sectional view of the printing mask according to the fourth embodiment of the present invention, and is a cross-sectional view taken along the line DD in FIG. 6A. It is a figure which shows the structure of the mask for printing in the 5th Embodiment of this invention. FIG. 7A is a plan view of a printing mask according to the fifth embodiment of the present invention. FIG. 7B is a cross-sectional view of the printing mask according to the fifth embodiment of the present invention, and is a cross-sectional view taken along the line EE of FIG.

<First Embodiment>
A configuration of the printing mask 100 according to the first embodiment of the present invention will be described. FIG. 1 is a diagram illustrating a configuration of a printing mask 100. FIG. 1A is a plan view of the printing mask 100. FIG. 1B is a cross-sectional view of the printing mask 100, which is a cross-sectional view taken along the line AA in FIG.

  As shown in FIGS. 1A and 1B, the printing mask 100 includes a plate-like substrate 110, a plurality of openings 120, and a high-rigidity member 130.

  As shown in FIG. 1, the plate-like substrate 110 is a rectangular plate. In addition, the shape of the base material 110 may not be rectangular, for example, circular, elliptical, or polygonal shape may be sufficient. As the material of the base material 110, for example, steel, stainless steel, aluminum alloy, or the like is used.

  As shown in FIG. 1, the plurality of openings 120 are formed in an opening forming region 111 that is a predetermined region of the substrate 110 in the surface of the substrate 110. Note that the opening forming region 111 is provided on the surface of the base 110 so as to include a plurality of openings 120. The plurality of openings 120 are formed at positions corresponding to the print target.

  The high-rigidity member 130 is formed using a material that is at least more rigid than the base material 110. The highly rigid member 130 is made of, for example, a metal plating material or a metal wire. Thereby, the highly rigid member 130 can be formed with a simple material. The high-rigidity member 130 is provided on the outer peripheral edge portion of the opening forming region 111 in the surface of the base material 110. In the example of FIG. 1, the high-rigidity member 130 is embedded in the base material 110 at the outer peripheral edge of the opening forming region 111 so as to surround the opening forming region 111. As described above, the high-rigidity member 130 is embedded in the base material 110 at the outer peripheral edge portion of the opening forming region 111 in which the plurality of opening portions 120 are provided. Thereby, the rigidity of the printing mask 100 can be increased particularly at the outer peripheral edge of the opening forming region 111. As a result, the deflection in the opening forming region 111 can be reduced. Therefore, the handling of the printing mask 100 is facilitated, and the printing work efficiency is improved. In addition, the risk of damage to the printing mask 100 can be reduced. Furthermore, since the highly rigid member 130 is embedded in the base material 110 of the printing mask 100, it is possible to prevent the accuracy of the opening 120 and the thickness direction of the printing mask 100 from being lowered.

  The configuration of the printing mask 100 has been described above.

  Next, a method for manufacturing the printing mask 100 will be described.

  2 and 3 are diagrams for explaining a method of manufacturing the printing mask 100. FIG.

  As shown in FIG. 2A, first, the substrate 110 is prepared.

  Next, as illustrated in FIG. 2B, a plurality of openings 120 are formed in a predetermined opening formation region 111 in the base material 110. Note that the plurality of openings 120 correspond to positions corresponding to print targets. Here, for example, a plurality of openings 120 are formed in the opening formation region 111 using a laser opening method. The process of FIG. 2B corresponds to the opening forming step of the present invention.

  Next, as shown in FIG. 2C, a concave groove 112 is formed in the outer peripheral edge portion of the opening forming region 111 in the surface of the base material 110. Here, for example, the groove 112 having a desired depth and width is formed by laser cutting. However, not only laser cutting but also a construction method (for example, an additive construction method) capable of obtaining an equivalent finish may be used. On the other hand, when the additive method is used, the plurality of openings 120 and the grooves 112 are formed by performing the electroforming process in a plurality of times with respect to the positions where the openings 120 and the grooves 112 are formed. To do. The process of FIG. 2C corresponds to the concave groove forming step of the present invention.

  Next, as illustrated in FIG. 3D, a resist layer RE is formed in a region other than the plurality of openings 120 and the concave grooves 112 on the surface of the substrate 110.

  Next, as shown in FIG. 3 (e), the high-rigidity member 130 is electroplated in the groove 112. Thereby, the high-rigidity member 130 is buried in the concave groove 112 of the base material 110.

  Next, as shown in FIG. 3F, the resist layer RE is peeled off from the surface of the substrate 110.

  Finally, the surface of the printing mask 100 is uniformly polished so that the thickness of the printing mask 100 is equal to the thickness of the substrate 110. Thereby, the printing mask 100 is completed.

  The method for manufacturing the printing mask 100 has been described above.

  As described above, the printing mask 100 according to the first embodiment of the present invention includes the plate-like substrate 110, the plurality of openings 120, and the high-rigidity member 130. The plurality of openings 120 are formed in the base material 110. The high rigidity member 130 has higher rigidity than the base material 110. The high-rigidity member 130 is embedded in the base material 110 at the outer peripheral edge portion of the opening forming region 111 in the surface of the base material 110. The opening formation region 111 is a region where a plurality of openings 120 are formed.

  As described above, the high-rigidity member 130 having higher rigidity than the base material 110 is embedded in the base material 110 at the outer peripheral edge portion of the opening forming region 111 in the surface of the base material 110. Thereby, the rigidity of the printing mask can be increased particularly at the outer peripheral edge of the opening forming region 111. As a result, the deflection in the opening forming region 111 can be reduced. Therefore, the handling of the printing mask 100 is facilitated, and the printing work efficiency is improved. In addition, the risk of damage to the printing mask 100 can be reduced. Furthermore, since the high-rigidity member 130 is embedded in the base material 110 of the printing mask 100, the accuracy in the opening 120 and the thickness direction of the printing mask 100 can be prevented from decreasing. Therefore, the problem like the technique described in Patent Document 1 does not occur.

  As described above, according to the printing mask 100 in the first embodiment of the present invention, it is possible to prevent breakage while maintaining high accuracy of the opening and thickness of the printing mask.

  In the printing mask 100 according to the first embodiment of the present invention, the high-rigidity member 130 is embedded in the outer peripheral edge of the opening formation region 111 so as to surround the opening formation region 111. Thereby, the rigidity of the printing mask can be further increased at the entire outer peripheral edge portion of the opening forming region 111. As a result, the deflection in the opening forming region 111 can be further reduced.

  The high-rigidity member 130 is formed of a metal plating material or a metal wire. Thereby, the highly rigid member 130 can be formed with a simple material.

  The manufacturing method of the printing mask 100 according to the first embodiment of the present invention includes an opening forming step, a concave groove forming step, and a high-rigidity member embedding step. In the opening forming step, a plurality of openings 120 are formed in the opening forming region 111 on the surface of the substrate 110 in the plate-like substrate 110. In the groove forming step, a recessed groove 112 having a concave shape is formed on the surface of the substrate 10 at the outer peripheral edge of the opening forming region 111. In the high-rigidity member embedding step, a high-rigidity member having higher rigidity than the substrate 110 is embedded in the concave groove 112 formed by the concave groove step. Thereby, the effect similar to the effect obtained with the mask 100 for printing can be show | played.

<Second Embodiment>
Next, the configuration of the printing mask 100A according to the second embodiment of the present invention will be described. FIG. 4A is a plan view of the printing mask 100A. FIG. 4B is a cross-sectional view of the printing mask 100A, and is a cross-sectional view taken along the line BB in FIG. In FIG. 4, constituent elements that are equivalent to the constituent elements shown in FIGS. 1 to 3 are given the same reference numerals as those shown in FIGS.

  As shown in FIGS. 4A and 4B, the printing mask 100A includes a plate-like substrate 110, a plurality of openings 120, a highly rigid member, and 130A.

  Here, FIG. 1 (a), (b) and FIG. 4 (a), (b) are compared. In FIG. 1A and FIG. 1B, the high-rigidity member 130 is embedded in the base material 110 only at the outer peripheral edge of the opening forming region 111 so as to surround the opening forming region 111. . On the other hand, in FIGS. 4A and 4B, the highly rigid member 130 </ b> A is embedded in the base material 110 on the entire surface of the base material 110 other than the opening forming region 111. In this respect, they are different from each other.

  The highly rigid member 130 </ b> A is formed using a material having rigidity higher than that of at least the substrate 110. The highly rigid member 130A is formed of, for example, a metal plating material or a metal wire. Thereby, the highly rigid member 130 can be formed with a simple material. The high-rigidity member 130 </ b> A is provided on the entire surface of the base material 110 other than the opening forming region 111. As described above, the high-rigidity member 130 is buried in the base material 110 on the entire surface other than the opening formation region 111 in which the plurality of openings 120 are provided. Thereby, in particular, the rigidity of the printing mask 100A can be further increased over a wide range of the surface of the base 110 including the outer peripheral edge of the opening forming region 111.

  The configuration of the printing mask 100A has been described above.

  The manufacturing method of the printing mask 100A is the same as the manufacturing method shown in FIGS.

  As described above, in the printing mask 100 </ b> A according to the second embodiment of the present invention, the high-rigidity member 130 </ b> A is embedded in the substrate 110 on the entire surface of the substrate 110 other than the opening formation region 111. .

  Accordingly, the rigidity of the printing mask 100A can be further increased over a wide range of the surface of the base 110 including the outer peripheral edge of the opening forming region 111. As a result, it is possible to further reduce the deflection of the entire surface of the printing mask 110 </ b> A as well as the opening forming region 111. Therefore, the handling of the printing mask 100A is further facilitated, and the printing work efficiency is further improved. Further, the risk of damaging the printing mask 100A can be reduced. Further, along with the increase in rigidity of the printing mask 100A, it is possible to improve the printing durability that is affected by the squeezing operation and the plate separation operation in the printing process. As a result, the life of the printing mask 100A can be extended.

<Third Embodiment>
Next, the configuration of the printing mask 100B according to the third embodiment of the present invention will be described. FIG. 5A is a plan view of the printing mask 100B. FIG. 5B is a cross-sectional view of the printing mask 100B, and is a cross-sectional view taken along the line CC in FIG. In FIG. 5, constituent elements that are equivalent to the constituent elements shown in FIGS. 1 to 4 are given the same reference numerals as those shown in FIGS. 1 to 4.

  As shown in FIGS. 5A and 5B, the printing mask 100B includes a plate-like substrate 110, a plurality of openings 120, a plurality of high-rigidity members, and 130B.

  Here, FIG. 1 (a), (b) and FIG. 5 (a), (b) are compared. In FIG. 1A and FIG. 1B, the high-rigidity member 130 is embedded in the base material 110 only at the outer peripheral edge of the opening forming region 111 so as to surround the opening forming region 111. . On the other hand, in FIG. 5A and FIG. 5B, the plurality of high-rigidity members 130B are arranged in a mesh pattern at predetermined intervals in a region other than the opening forming region 111 on the surface of the base 110. And embedded in the base material 110. In this respect, they are different from each other.

  The plurality of high-rigidity members 130 </ b> B are formed using a material having higher rigidity than at least the base material 110. Each high-rigidity member 130B is formed of, for example, a metal plating material or a metal wire. Thereby, the highly rigid member 130B can be formed with a simple material. The plurality of high-rigidity members 130 </ b> B are arranged in a mesh pattern at predetermined intervals in a region other than the opening forming region 111 on the surface of the base material 110, and are embedded in the base material 110. Thereby, in particular, the rigidity of the printing mask can be further increased over a wide range of the surface of the substrate 110 including the outer peripheral edge of the opening forming region 111.

  The configuration of the printing mask 100B has been described above.

  The manufacturing method of the printing mask 100B is the same as the manufacturing method shown in FIGS.

  As described above, in the printing mask 100B according to the third embodiment of the present invention, the plurality of high-rigidity members 130B are mesh-like at predetermined intervals in the area other than the opening forming area 111 on the surface of the base 110. And embedded in the base material 110.

  Thereby, the rigidity of the printing mask 100B can be further increased over a wide range of the surface of the substrate 110 including the outer peripheral edge of the opening forming region 111. As a result, it is possible to further reduce the deflection of the entire surface of the printing mask 100B as well as in the opening forming region 111. Therefore, handling of the printing mask 100B is further facilitated, and printing work efficiency is further improved. Further, the risk of damage to the printing mask 100B can be reduced. Further, by partially burying the plurality of high-rigidity members 130B at predetermined intervals, the manufacturing cost including the material cost can be reduced as compared with the printing mask 100A in the second embodiment. it can. The buried pattern of the high-rigidity member 130B may be any shape that can maintain rigidity, such as a rectangle, a circle, or a polygon.

<Fourth embodiment>
Next, the configuration of a printing mask 100C according to the fourth embodiment of the present invention will be described. FIG. 6A is a plan view of the printing mask 100C. FIG. 6B is a cross-sectional view of the printing mask 100C, and is a cross-sectional view taken along the line DD in FIG. 6A. In FIG. 6, constituent elements that are equivalent to the constituent elements shown in FIGS. 1 to 5 are assigned the same reference numerals as those shown in FIGS. 1 to 5.

  As shown in FIGS. 6A and 6B, the printing mask 100C includes a plate-like substrate 110, a plurality of openings 120, and a highly rigid member 130C.

  Here, FIG. 1 (a), (b) and FIG. 6 (a), (b) are compared. In FIG. 1A and FIG. 1B, the high-rigidity member 130 is exposed on the surface of the base material 110 only at the outer peripheral edge of the opening forming region 111 so as to surround the opening forming region 111. As shown in FIG. On the other hand, in FIG. 6A and FIG. 6B, the high-rigidity member 130 </ b> C is not exposed on the surface of the base material 110 at the outer peripheral edge of the opening forming region 111 in the surface of the base material 110. Further, it is embedded in the substrate 110. In this respect, they are different from each other.

  The high-rigidity member 130 </ b> C is formed using a material having rigidity higher than that of at least the base material 110. The highly rigid member 130C is formed of, for example, a metal plating material or a metal wire. Thereby, the highly rigid member 130C can be formed with a simple material. The high-rigidity member 130 </ b> C is embedded in the base material 110 so as not to be exposed on the base material 110 surface at the outer peripheral edge portion of the opening forming region 111 in the base material 110 surface. Thereby, the rigidity of the printing mask 100 </ b> C can be increased particularly around the periphery of the opening forming region 111.

  The configuration of the printing mask 100C has been described above.

  Next, a method for manufacturing the printing mask 100C will be described.

  First, the base material 110 is prepared. Next, a resist is formed so that a plurality of openings 120 are formed in a predetermined opening formation region 111 in the substrate 110. Then, a thickness of, for example, about 10% or more with respect to the design value of the plate thickness of the printing mask 100C is laminated on the surface of the substrate 110 by electroforming plating.

  Next, the wire of the high-rigidity member 130C having a thickness that does not exceed the design value of the plate thickness of the printing mask 100C is placed on the substrate 110.

  Next, the electroforming plating is resumed, and the electroforming plating is continued until the printing mask 100C has a design thickness.

  Then, the resist is removed from the substrate 110. Thereby, the high-rigidity member 130 </ b> C is not exposed from the surface of the base material 110, and the printing mask 100 </ b> C embedded in the base material 110 can be obtained.

  In this manufacturing method, it is possible to reduce the secondary processing steps associated with the embedding of the highly rigid member 130C. Thereby, manufacturing cost can be reduced.

  The method for manufacturing the printing mask 100C has been described above.

  As described above, in the printing mask 100C according to the fourth embodiment of the present invention, the high-rigidity member 130C is embedded in the base 110 so that the high-rigidity member 130C is not exposed on the surface of the base 110. Yes.

  Thereby, the rigidity of the printing mask 100 </ b> C can be increased around the outer periphery of the opening forming region 111. As a result, in particular, the deflection of the opening forming region 111 can be further reduced. Therefore, the handling of the printing mask 100C is further facilitated, and the printing work efficiency is further improved. Further, the risk of damaging the printing mask 100C can be reduced. Further, since the high-rigidity member 130C is not exposed on the surface of the substrate 110, it is possible to prevent the high-rigidity member 130C from being damaged along with the squeezing operation in the printing process.

<Fifth embodiment>
Next, the configuration of the printing mask 100D according to the fifth embodiment of the present invention will be described. FIG. 7A is a plan view of the printing mask 100D. FIG. 7B is a cross-sectional view of the printing mask 100D, and is a cross-sectional view taken along the line E-E in FIG. In FIG. 7, constituent elements that are equivalent to the constituent elements shown in FIGS. 1 to 6 are assigned the same reference numerals as those shown in FIGS. 1 to 6.

  As shown in FIGS. 7A and 7B, the printing mask 100D includes a plate-like substrate 110, a plurality of openings 120, a high-rigidity member 130D, and a recess 115. Yes.

  Here, FIG. 1 (a), (b) and FIG. 7 (a), (b) are compared. 7A and 7B are different from FIGS. 1A and 1B in that a recess 115 is formed.

  The recess 115 is formed in a recessed shape in the opening forming region 111 on the surface of the base 110.

  The configuration of the printing mask 100D has been described above.

As described above, the printing mask 100D according to the fifth embodiment of the present invention further includes the recess 115. The recess 115 is formed in a concave shape in the opening forming region 111 on the surface of the base 110. The thickness of the region where the recess 115 of the substrate 110 is formed is thinner than the thickness of the substrate 110. For this reason, the opening forming region 111 in which the concave portion 115 is formed has low rigidity. However, since the high-rigidity member 130 is embedded in the base material 110 at the outer peripheral edge portion of the opening forming region 111, the printing mask 100D is formed around the outer peripheral edge portion of the opening forming region 111 where the recess 115 is formed. The rigidity can be increased. As a result, in particular, it is possible to suppress the bending of the opening forming region 111 in which the recess 115 is formed. Therefore, the handling of the printing mask 100C is further facilitated, and the printing work efficiency is further improved. In addition, it is possible to prevent the workability when handling the printing mask 110D having the recess 115 having a lower rigidity from being deteriorated, and to reduce the risk of the printing mask 100D being damaged.
[Example]
Next, an example of the printing mask 100 according to the first embodiment of the present invention will be described.

  In the printing mask 100, SUS304 was used as the material of the substrate 110. In addition to the SUS304, a plate material having equivalent rigidity such as SUS301 can be used as the material of the base material 110.

  In addition, chromium was used as the material of the high-rigidity member 130. As the material of the high-rigidity material 130, a material having higher rigidity than the base material 110 can be used. That is, as the material of the high-rigidity material 130, a material (200 GPa or more) having a higher Young's modulus than the base material 110, such as tungsten or molybdenum, can be used.

  In the printing mask 100, the size of the printing mask frame is 736 (mm) × 736 (mm), and the printing mask opening area (printing target substrate size) is 300 (mm) × 300 (mm).

  Further, the thickness of the printing mask 100 is 0.12 (mm), the minimum opening size of the opening 120 is φ0.28 (mm), the minimum pitch size of the opening 120 is 0.4 (mm), The minimum opening distance was set to 0.2 (mm).

  When manufacturing the printing mask 100, the base material 110 was opened with respect to the printing object location with the laser processing machine based on the opening design data prepared in advance.

  Next, a process (concave groove) is formed by a laser processing machine so as to surround the opening area of the printing mask 100 at a location 40 (mm) away from the opening area of the printing mask 100 toward the outer periphery. Groove forming treatment) was performed. The depth of the recessed groove 112 formed by this recessed groove forming process was set to 0.05 (mm) with respect to the thickness of the printing mask 100 of 0.12 (mm).

  Next, a dry film resist having a film thickness of 0.04 (mm) is laminated on the surface of the base material on which the concave groove forming process has been performed, and the portions other than the areas where the concave groove forming process has been performed are cured by exposure and developed. The process was performed and the chrome plating process to the location of the ditch | groove 112 was implemented by the electroplating method.

  Finally, the resist was peeled off, and the surface of the printing mask 100 was polished so as to have the designed thickness, and the level difference between the plated portion of the high-rigidity member 130 and the substrate 100 was reduced to 0.01 (mm) or less. .

  Therefore, the printing mask 100 that has been subjected to the polishing treatment has improved rigidity, and the amount of deflection is as small as 0.3 (mm). Thereby, the damage accompanying the handling operation of the printing mask 100 can be reduced.

  Furthermore, by minimizing the step between the high-rigidity member 130 and the substrate 110, as a synergistic effect, squeezing damage during actual printing can be minimized and the life of the printing mask 100 can be prevented from being reduced. it can.

  The present invention has been described above based on the embodiment. The embodiment is an exemplification, and various modifications, increases / decreases, and combinations may be added to the above-described embodiments without departing from the gist of the present invention. It will be understood by those skilled in the art that modifications to which these changes, increases / decreases, and combinations are also within the scope of the present invention.

100, 100A, 100B, 100C, 100D Printing mask 110 Base material 111 Opening formation region 112 Concave groove 115 Concave 120 Opening 130, 130A, 130B, 130C High rigidity member RE Resist layer

Claims (8)

A plate-like substrate;
A plurality of openings formed in the substrate;
A high-rigidity member embedded in the base material at an outer peripheral edge portion of an opening forming region that has higher rigidity than the base material and is an area where the plurality of openings are formed in the base material surface; Mask for printing.   The printing mask according to claim 1, wherein the high-rigidity member is embedded in an outer peripheral edge portion of the opening forming region so as to surround the opening forming region.   The printing mask according to claim 1, wherein the high-rigidity member is embedded in the base material over the entire surface of the base material other than the opening formation region.   2. The printing device according to claim 1, wherein the plurality of high-rigidity members are arranged in a mesh pattern at predetermined intervals in an area other than the opening forming area in the base material surface, and embedded in the base material. mask.   The high-rigidity member is embedded in the base material so as not to be exposed on the base material surface at an outer peripheral edge portion of the opening forming region in the base material surface. The printing mask according to item 1.   The printing mask according to any one of claims 1 to 3, further comprising a concave portion formed in a concave shape in the opening forming region of the base material surface.   The printing mask according to claim 1, wherein the high-rigidity member is formed of a metal plating material or a metal wire. An opening forming step for forming a plurality of openings in a plate-shaped substrate in the opening forming region of the substrate surface;
A groove forming step for forming a recessed groove on the substrate surface at the outer peripheral edge of the opening forming region;
A printing mask manufacturing method comprising: a high-rigidity member embedding step of embedding a high-rigidity member having higher rigidity than the base material in the concave groove formed in the concave groove step.