JP2016056261A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2016056261A5 JP2016056261A5 JP2014182932A JP2014182932A JP2016056261A5 JP 2016056261 A5 JP2016056261 A5 JP 2016056261A5 JP 2014182932 A JP2014182932 A JP 2014182932A JP 2014182932 A JP2014182932 A JP 2014182932A JP 2016056261 A5 JP2016056261 A5 JP 2016056261A5
- Authority
- JP
- Japan
- Prior art keywords
- polyamide resin
- weight
- melting
- viscosity
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004952 Polyamide Substances 0.000 claims description 20
- 229920002647 polyamide Polymers 0.000 claims description 20
- 239000011528 polyamide (building material) Substances 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 17
- 229920005989 resin Polymers 0.000 claims description 17
- 238000002844 melting Methods 0.000 claims description 11
- 239000011342 resin composition Substances 0.000 claims description 7
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- 239000003365 glass fiber Substances 0.000 claims description 6
- VTHJTEIRLNZDEV-UHFFFAOYSA-L Magnesium hydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 4
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 4
- 239000000347 magnesium hydroxide Substances 0.000 claims description 4
- 239000000155 melt Substances 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N Putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 claims 1
- -1 aliphatic dicarboxylic acid Chemical class 0.000 claims 1
- 125000004432 carbon atoms Chemical group C* 0.000 claims 1
- 239000003063 flame retardant Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 238000006068 polycondensation reaction Methods 0.000 claims 1
- 230000014759 maintenance of location Effects 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Description
本発明は、（Ａ）と（Ｂ）と（Ｃ）の合計１００重量部に対して、（Ａ）ポリアミド樹脂２５〜４５重量部、（Ｂ）水酸化マグネシウム２５〜７４重量部および（Ｃ）ガラス繊維１〜４０重量部を配合してなり、
前記（Ａ）ポリアミド樹脂の樹脂濃度０．０１ｇ／ｍｌの９８％硫酸溶液の２５℃における相対粘度が１．６以上２．２未満であり、
下記（Ｉ）〜（ＩＩＩ）の全てを満足することを特徴とするポリアミド樹脂組成物である。
（Ｉ）熱流計法で測定した熱伝導率が０．８Ｗ／ｍ・Ｋ以上。
（ＩＩ）融点＋３５℃で５分間溶融滞留させた後の１２１６ｓｅｃ−１における溶融粘度が２０〜２００Ｐａ・ｓ。
（ＩＩＩ）融点＋３５℃で５分間溶融滞留させた後の１２１６ｓｅｃ−１における溶融粘度をＡ、融点＋３５℃で３０分間溶融滞留させた後の１２１６ｓｅｃ−１における溶融粘度をＢとしたとき、Ｂ／Ａが０．７〜１．２。
The present invention relates to (A) 25 to 45 parts by weight of polyamide resin, (B) 25 to 74 parts by weight of magnesium hydroxide, and (C) with respect to 100 parts by weight of the total of (A), (B) and (C). 1 to 40 parts by weight of glass fiber is blended,
The relative viscosity at 25 ° C. of a 98% sulfuric acid solution having a resin concentration of 0.01 g / ml of the (A) polyamide resin is 1.6 or more and less than 2.2;
The polyamide resin composition satisfies all of the following (I) to (III).
(I) Thermal conductivity measured by a heat flow meter method is 0.8 W / m · K or more.
(II) Melting viscosity at 1216 sec −1 after melting and staying at melting point + 35 ° C. for 5 minutes is 20 to 200 Pa · s.
When the melt viscosity at 1216 sec -1 after being 5 minutes melt retention in (III) mp + 35 ° C. was A, the melt viscosity at 1216 sec -1 after being melt retention for 30 minutes at the melting point + 35 ℃ B, B / A is 0.7 to 1.2.
本発明に用いられるポリアミド樹脂は、樹脂濃度０．０１ｇ／ｍｌの９８％硫酸溶液の２５℃における相対粘度が１．６以上２．２未満である。相対粘度は重合度と相関があり、相対粘度が１．６以上であれば、ポリアミド樹脂自体の強度が高いため、水酸化マグネシウムおよびガラス繊維を配合してなるポリアミド樹脂組成物においても、成形品の機械強度をより高くすることができる。相対粘度は１．７以上が好ましい。一方、相対粘度が２．２未満であれば、ポリアミド樹脂自体の溶融粘度が低いため、水酸化マグネシウムおよびガラス繊維を配合してなるポリアミド樹脂組成物においても、射出成形時の流動性がより良好となり、かつガラス繊維の折損やせん断発熱による樹脂分解も抑制できるため、成形品の機械強度もより高くすることができる。また、相対粘度が２．２未満のポリアミド樹脂は末端基の総量が多く、重合方法によってはガラス繊維との密着性に寄与するアミノ末端基量も多くすることが可能となるため、成形品の機械強度をより高めることができる。相対粘度は２．１以下が好ましい。 Polyamide resin used in the present invention, the relative viscosity at 25 ° C. of 98% sulfuric acid solution of a resin concentration of 0.01 g / ml is Ru der less than 2.2 1.6 or more. The relative viscosity has a correlation with the degree of polymerization, and if the relative viscosity is 1.6 or more, the strength of the polyamide resin itself is high. Therefore, even in the polyamide resin composition comprising magnesium hydroxide and glass fiber, the molded product The mechanical strength of can be increased. The relative viscosity is preferably 1.7 or more. On the other hand, if the relative viscosity is less than 2.2, since the melt viscosity of the polyamide resin itself is low, even in the polyamide resin composition formed by mixing magnesium hydroxide and glass fiber, the fluidity at the time of injection molding is better. In addition, since the resin breakage due to breakage of the glass fiber and shearing heat generation can be suppressed, the mechanical strength of the molded product can be further increased. In addition, the polyamide resin having a relative viscosity of less than 2.2 has a large total amount of terminal groups, and depending on the polymerization method, it is possible to increase the amount of amino terminal groups that contribute to adhesion to glass fibers. The mechanical strength can be further increased. The relative viscosity is preferably 2.1 or less.
Claims (5)
前記（Ａ）ポリアミド樹脂の樹脂濃度０．０１ｇ／ｍｌの９８％硫酸溶液の２５℃における相対粘度が１．６以上２．２未満であり、
下記（Ｉ）〜（ＩＩＩ）の全てを満足することを特徴とするポリアミド樹脂組成物。
（Ｉ）熱流計法で測定した熱伝導率が０．８Ｗ／ｍ・Ｋ以上。
（ＩＩ）（Ａ）ポリアミド樹脂の融点＋３５℃で５分間溶融滞留させた後の１２１６ｓｅｃ−１における溶融粘度が２０〜２００Ｐａ・ｓ。
（ＩＩＩ）（Ａ）ポリアミド樹脂の融点＋３５℃で５分間溶融滞留させた後の１２１６ｓｅｃ−１における溶融粘度をＡ、（Ａ）ポリアミド樹脂の融点＋３５℃で３０分間溶融滞留させた後の１２１６ｓｅｃ−１における溶融粘度をＢとしたとき、Ｂ／Ａが０．７〜１．２。 (A) 25 to 45 parts by weight of polyamide resin, (B) 25 to 74 parts by weight of magnesium hydroxide, and (C) 1 to 40 glass fibers with respect to 100 parts by weight in total of (A), (B) and (C). Blended by weight,
The relative viscosity at 25 ° C. of a 98% sulfuric acid solution having a resin concentration of 0.01 g / ml of the (A) polyamide resin is 1.6 or more and less than 2.2;
A polyamide resin composition characterized by satisfying all of the following (I) to (III):
(I) Thermal conductivity measured by a heat flow meter method is 0.8 W / m · K or more.
(II) (A) Melting viscosity at 1216 sec −1 after melting and staying at 5 ° C. for 5 minutes at the melting point of the polyamide resin + 35 ° C. is 20 to 200 Pa · s.
(III) (A) Melting viscosity of polyamide resin at melting point + 12 ° C. after 5 minutes at 35 ° C. and 1216 sec −1 A (A) Polyamide resin melting point + 12 ° C. after melting and residence at 35 ° C. for 30 minutes − B / A is 0.7 to 1.2, where B is the melt viscosity in 1 .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014182932A JP6405811B2 (en) | 2014-09-09 | 2014-09-09 | Polyamide resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014182932A JP6405811B2 (en) | 2014-09-09 | 2014-09-09 | Polyamide resin composition |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016056261A JP2016056261A (en) | 2016-04-21 |
| JP2016056261A5 true JP2016056261A5 (en) | 2017-08-10 |
| JP6405811B2 JP6405811B2 (en) | 2018-10-17 |
Family
ID=55757595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014182932A Active JP6405811B2 (en) | 2014-09-09 | 2014-09-09 | Polyamide resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6405811B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6259142B2 (en) * | 2016-04-27 | 2018-01-10 | 花王株式会社 | fan |
| WO2021134733A1 (en) * | 2020-01-03 | 2021-07-08 | 耐特科技材料股份有限公司 | Flame-retardant thermoplastic material used for lithium battery module and having thermal runaway diffusion inhibition function |
| CN112194892B (en) * | 2020-09-07 | 2023-04-28 | 中广核瑞胜发（厦门）新材料有限公司 | Low-cost high-performance heat-conducting flame-retardant nylon composite material and preparation method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6127802B2 (en) * | 2012-08-10 | 2017-05-17 | 東レ株式会社 | Heat dissipation member for lighting |
| JP6243706B2 (en) * | 2012-11-12 | 2017-12-06 | 株式会社クラレ | Polyamide resin |
-
2014
- 2014-09-09 JP JP2014182932A patent/JP6405811B2/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102040830B (en) | Polyamide composition and preparation method thereof | |
| KR102256940B1 (en) | Filled polymer compositions for mobile electronic devices | |
| MX2013008263A (en) | Resin composition and molded article including same. | |
| BR112013029221A2 (en) | curable epoxy resin formulation composition, process for preparing a curable epoxy resin formulation composition, process for preparing an epoxy insulating material and product | |
| CN106633858B (en) | A kind of polyamide resin composite material and its preparation method and application | |
| JP2016056261A5 (en) | ||
| MY156527A (en) | Epoxy resin, process for production thereof, epoxy resin composition using same, and cured product | |
| EA201691050A1 (en) | SEMICONDUCTOR POLYMER COMPOSITION FOR ELECTRICAL POWER CABLES | |
| JP2007326925A5 (en) | ||
| PH12019500728A1 (en) | Composite resin composition and connector molded from composite resin composition | |
| TWI644977B (en) | Thermoplastic resin composition and molded article formed by molding the same | |
| MX2014014328A (en) | Poly(butylene terephthalate) resin composition and hydrolysis resistance-improving agent. | |
| KR101437880B1 (en) | Thermal conductive polyphenylene sulfide resin composition having a good surface gloss and article using the same | |
| CN103694704A (en) | Laser direct structuring heat-conducting insulating resin and preparation method thereof | |
| JP2016540067A (en) | Carbon fiber reinforced plastic molding material | |
| JP2015028155A5 (en) | ||
| CN103408928B (en) | A kind of fiberglass reinforced PA 6/PS alloy material and preparation method thereof | |
| MX2016003460A (en) | Heatable pipe. | |
| JP6177940B2 (en) | Resin composition, casting product for sensor and temperature sensor | |
| JP2014037526A5 (en) | ||
| CN104693791A (en) | Flame retardant high-temperature resistant thermal conductive composite material and preparation method thereof | |
| CN104419187A (en) | High-toughness aging-resistant hydrolysis-resistant PC (polycarbonate) composite material | |
| CN106633836A (en) | High-intensity deformation-resistant PA/PC alloy fixing frame material | |
| JP2012092195A5 (en) | ||
| CN106118011A (en) | A kind of use for electronic products plastic master batch |