JP2015028155A5 - - Google Patents

Download PDF

Info

Publication number
JP2015028155A5
JP2015028155A5 JP2014128729A JP2014128729A JP2015028155A5 JP 2015028155 A5 JP2015028155 A5 JP 2015028155A5 JP 2014128729 A JP2014128729 A JP 2014128729A JP 2014128729 A JP2014128729 A JP 2014128729A JP 2015028155 A5 JP2015028155 A5 JP 2015028155A5
Authority
JP
Japan
Prior art keywords
polyamide resin
resin composition
composition according
weight
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014128729A
Other languages
Japanese (ja)
Other versions
JP2015028155A (en
JP6354379B2 (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2014128729A priority Critical patent/JP6354379B2/en
Priority claimed from JP2014128729A external-priority patent/JP6354379B2/en
Publication of JP2015028155A publication Critical patent/JP2015028155A/en
Publication of JP2015028155A5 publication Critical patent/JP2015028155A5/ja
Application granted granted Critical
Publication of JP6354379B2 publication Critical patent/JP6354379B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Description

本発明者らは、上記課題を解決すべく鋭意研究した結果、本発明に到達した。すなわち本発明は、
(1)ポリアミド樹脂(a)100重量部に対して、難燃剤(b)1〜100重量部、分子量が2600以上であるヒンダードアミン系安定剤(c)0.1〜5重量部およびシアノアクリレート系紫外線吸収剤(d)0.1〜5重量部を配合してなり、
前記ヒンダードアミン系安定剤(c)が末端アミノ基を封止されたものである、ポリアミド樹脂組成物。
)前記難燃剤(b)が窒素系難燃剤である(1)記載のポリアミド樹脂組成物。
)ポリアミド樹脂()100重量部に対して、さらに、芳香族オキシカルボニル単位(S)、芳香族および/または脂肪族ジオキシ単位(T)、および、芳香族ジカルボニル単位(U)から選ばれる少なくとも1種の構造単位と3官能以上の有機残基(D)とを含み、かつ、Dの含有量が樹状ポリエステルを構成する全単量体に対して7.5〜50モル%の範囲にある溶融液晶性を示す樹状ポリエステル樹脂(e)0.01〜10重量部および酸無水物(f)0.01〜10重量部を配合してなる(1)または(2)記載のポリアミド樹脂組成物。
)前記樹状ポリエステル樹脂(e)において、芳香族オキシカルボニル単位(S)、芳香族および/または脂肪族ジオキシ単位(T)、および、芳香族ジカルボニル単位(U)が、それぞれ下式(1)で表される構造単位から選ばれる少なくとも1種の構造単位であり、かつ、Dの含有量を1モルとした場合にS、TおよびUそれぞれの含有量p、qおよびrがp+q+r=1〜10モルの範囲にある(3)記載のポリアミド樹脂組成物。
The inventors of the present invention have arrived at the present invention as a result of intensive studies to solve the above problems. That is, the present invention
(1) 1 to 100 parts by weight of a flame retardant (b), hindered amine stabilizer (c) having a molecular weight of 2600 or more and 0.1 to 5 parts by weight of a cyanoacrylate based on 100 parts by weight of a polyamide resin (a) ultraviolet absorber (d) Ri greens by blending 0.1 to 5 parts by weight,
A polyamide resin composition , wherein the hindered amine stabilizer (c) has a terminal amino group sealed .
(2) the flame retardant (b) is a nitrogen-based flame retardant (1) Symbol placement of the polyamide resin composition.
( 3 ) From 100 parts by weight of the polyamide resin ( a ), further from the aromatic oxycarbonyl unit (S), the aromatic and / or aliphatic dioxy unit (T), and the aromatic dicarbonyl unit (U) It contains at least one selected structural unit and a tri- or higher functional organic residue (D), and the D content is 7.5 to 50 mol% based on the total monomers constituting the dendritic polyester. (1) or (2), which is obtained by blending 0.01 to 10 parts by weight of a dendritic polyester resin (e) having a melt liquid crystallinity in the range of 0.01 to 10 parts by weight and an acid anhydride (f). Polyamide resin composition.
( 4 ) In the dendritic polyester resin (e), the aromatic oxycarbonyl unit (S), the aromatic and / or aliphatic dioxy unit (T), and the aromatic dicarbonyl unit (U) are each represented by the following formulae: When at least one structural unit selected from the structural units represented by (1) and the D content is 1 mol, the contents p, q and r of S, T and U are p + q + r. The polyamide resin composition as described in (3) which exists in the range of = 1-10 mol.

(ただし、式中Yは、水素原子、ハロゲン原子およびアルキル基から選ばれる少なくとも1種である。式中nは2〜8の整数である。)
)前記樹状ポリエステル樹脂(e)が、式(2)で示される基本骨格を含有する()または()記載のポリアミド樹脂組成物。
(Wherein, Y is at least one selected from a hydrogen atom, a halogen atom and an alkyl group. In the formula, n is an integer of 2 to 8.)
( 5 ) The polyamide resin composition according to ( 3 ) or ( 4 ), wherein the dendritic polyester resin (e) contains a basic skeleton represented by the formula (2).

(ここで、Dは3官能化合物の有機残基であり、D−D間はエステル結合および/またはアミド結合により直接、あるいは、前記S、TおよびUから選ばれる構造単位を介して結合している。)
)前記樹状ポリエステル樹脂(e)が式(3)で示される基本骨格を含有する()または()記載のポリアミド樹脂組成物。
(Here, D is an organic residue of a trifunctional compound, and DD is bonded directly by an ester bond and / or an amide bond, or bonded via a structural unit selected from S, T and U. Yes.)
( 6 ) The polyamide resin composition according to ( 3 ) or ( 4 ), wherein the dendritic polyester resin (e) contains a basic skeleton represented by the formula (3).

(ここで、Dは4官能化合物の有機残基であり、D−D間はエステル結合および/またはアミド結合により直接、あるいは、前記S、TおよびUから選ばれる構造単位を介して結合している。)
)前記樹状ポリエステル樹脂(e)のDで表される有機残基が芳香族化合物由来の有機残基である()〜()のいずれか1項に記載のポリアミド樹脂組成物。
)前記樹状ポリエステル樹脂(e)のDで表される有機残基が式(5)または(6)で表される有機残基である()記載のポリアミド樹脂組成物。
(Here, D is an organic residue of a tetrafunctional compound, and DD is bonded directly by an ester bond and / or an amide bond or via a structural unit selected from S, T and U. Yes.)
( 7 ) The polyamide resin composition according to any one of ( 3 ) to ( 6 ), wherein the organic residue represented by D of the dendritic polyester resin (e) is an organic residue derived from an aromatic compound. .
( 8 ) The polyamide resin composition according to ( 7 ), wherein the organic residue represented by D of the dendritic polyester resin (e) is an organic residue represented by the formula (5) or (6).

)前記酸無水物(f)が不飽和炭化水素基を有しない()〜()のいずれか1項に記載のポリアミド樹脂組成物。
10)前記(1)〜()のいずれか1項に記載のポリアミド樹脂組成物を成形してなる成形品。
11)成形品の最薄肉部が0.5mm以下である(10)に記載の成形品。
( 9 ) The polyamide resin composition according to any one of ( 3 ) to ( 8 ), wherein the acid anhydride (f) does not have an unsaturated hydrocarbon group.
( 10 ) A molded product obtained by molding the polyamide resin composition according to any one of (1) to ( 9 ).
( 11 ) The molded product according to ( 10 ), wherein the thinnest portion of the molded product is 0.5 mm or less.

[実施例2、4〜16、比較例1〜11
表1〜4に示す各原料、熱安定剤(BASF社製“IRGANOX”1098)0.3重量部および二酸化チタン(石原産業(株)製“タイペーク”(登録商標)CR−60(平均粒径0.2μm))3.0重量部をドライブレンドし、得られた混合物を2軸押出機(スクリュー径:30mm、L/D:28、シリンダー温度:260℃、回転数:150rpm)のホッパーからフィードして溶融混練し、ストランド状に押出した後、ペレタイザにより切断してペレット状のポリアミド樹脂組成物を得た。その後、80℃で12時間減圧乾燥して得られたポリアミド樹脂組成物を使用して、前記した方法に従って所定形状の試験片を作製し、各種物性を評価した。結果を表1〜4に示す。
[Examples 2 , 4 to 16, Comparative Examples 1 to 11 ]
Each raw material shown in Tables 1 to 4, 0.3 parts by weight of heat stabilizer ("IRGANOX" 1098 manufactured by BASF) and titanium dioxide ("Typaque" (registered trademark) CR-60 manufactured by Ishihara Sangyo Co., Ltd.) 0.2 μm)) 3.0 parts by weight of the mixture was dry blended, and the resulting mixture was fed from a hopper of a twin screw extruder (screw diameter: 30 mm, L / D: 28, cylinder temperature: 260 ° C., rotation speed: 150 rpm). After feeding, melt-kneading and extruding into a strand shape, it was cut by a pelletizer to obtain a pellet-shaped polyamide resin composition. Then, using the polyamide resin composition obtained by drying under reduced pressure at 80 ° C. for 12 hours, a test piece having a predetermined shape was prepared according to the method described above, and various physical properties were evaluated. The results are shown in Tables 1-4.

実施例2のポリアミド樹脂組成物を用いた成形品は、ヒンダードアミン系安定剤(c)および紫外線吸収剤(d)の両方を配合していない比較例1のポリアミド樹脂組成物を用いた成形品に比べ良好な耐候性を有していた。また、実施例4のポリアミド樹脂組成物を用いた成形品は、ヒンダードアミン系安定剤(c)または紫外線吸収剤(d)を配合していない比較例3および4のポリアミド樹脂組成物を用いた成形品に比べ良好な耐候性を有していた。実施例4のポリアミド樹脂組成物を用いた成形品は、ポリアミド樹脂100重量部に対して、5重量部を越える分子量が2600以上であるヒンダードアミン系安定剤および5重量部を越えるシアノアクリレート系紫外線吸収剤を配合した比較例5のポリアミド樹脂組成物を用いた成形品に対し良好な機械特性を有していた。また、実施例4のポリアミド樹脂組成物を用いた成形品は、ポリアミド樹脂100重量部に対して、100重量部を超える難燃剤を配合した比較例6のポリアミド樹脂組成物を用いた成形品に対し良好な機械特性を有していた。実施例4のポリアミド樹脂組成物を用いた成形品は、分子量が2600未満であるヒンダードアミン系安定剤を配合した比較例7のポリアミド樹脂組成物を用いた成形品に対し、耐候性および機械特性を有していた。また、実施例4のポリアミド樹脂組成物を用いた成形品は、シアノアクリレート系でない紫外線吸収剤を配合した比較例8のポリアミド樹脂組成物を用いた成形品に対し良好な耐候性を有していた。 The molded article using the polyamide resin composition of Example 2 is a molded article using the polyamide resin composition of Comparative Example 1 in which both the hindered amine stabilizer (c) and the ultraviolet absorber (d) are not blended. It had better weather resistance. Moreover, the molded article using the polyamide resin composition of Example 4 was molded using the polyamide resin composition of Comparative Examples 3 and 4 in which no hindered amine stabilizer (c) or ultraviolet absorber (d) was blended. It had better weather resistance than the product. The molded article using the polyamide resin composition of Example 4 is a hindered amine stabilizer having a molecular weight of more than 2600 and a cyanoacrylate ultraviolet absorption of more than 5 parts by weight based on 100 parts by weight of the polyamide resin. The molded article using the polyamide resin composition of Comparative Example 5 containing the agent had good mechanical properties. Further, a molded article using the polyamide resin composition of Example 4 is a molded article using the polyamide resin composition of Comparative Example 6 in which a flame retardant exceeding 100 parts by weight is blended with 100 parts by weight of the polyamide resin. On the other hand, it had good mechanical properties. The molded article using the polyamide resin composition of Example 4 has weather resistance and mechanical properties compared to the molded article using the polyamide resin composition of Comparative Example 7 containing a hindered amine stabilizer having a molecular weight of less than 2600. Had. In addition, the molded article using the polyamide resin composition of Example 4 has better weather resistance than the molded article using the polyamide resin composition of Comparative Example 8 in which an ultraviolet absorber that is not cyanoacrylate is blended. It was.

Claims (11)

ポリアミド樹脂(a)100重量部に対して、難燃剤(b)1〜100重量部、分子量が2600以上であるヒンダードアミン系安定剤(c)0.1〜5重量部およびシアノアクリレート系紫外線吸収剤(d)0.1〜5重量部を配合してなり、
前記ヒンダードアミン系安定剤(c)が末端アミノ基を封止されたものである、ポリアミド樹脂組成物。
1-100 parts by weight of a flame retardant (b), 0.1-5 parts by weight of a hindered amine stabilizer (c) having a molecular weight of 2600 or more, and a cyanoacrylate ultraviolet absorber with respect to 100 parts by weight of the polyamide resin (a) (d) Ri greens by blending 0.1 to 5 parts by weight,
A polyamide resin composition , wherein the hindered amine stabilizer (c) has a terminal amino group sealed .
前記難燃剤(b)が窒素系難燃剤である請求項1記載のポリアミド樹脂組成物。 The flame retardant (b) is a polyamide resin composition according to claim 1 Symbol mounting a nitrogen-based flame retardant. ポリアミド樹脂(a)100重量部に対して、さらに、芳香族オキシカルボニル単位(S)、芳香族および/または脂肪族ジオキシ単位(T)、および、芳香族ジカルボニル単位(U)から選ばれる少なくとも1種の構造単位と3官能以上の有機残基(D)とを含み、かつ、Dの含有量が樹状ポリエステルを構成する全単量体に対して7.5〜50モル%の範囲にある溶融液晶性を示す樹状ポリエステル樹脂(e)0.01〜10重量部および酸無水物(f)0.01〜10重量部を配合してなる請求項1または2記載のポリアミド樹脂組成物。 At least selected from the aromatic oxycarbonyl unit (S), the aromatic and / or aliphatic dioxy unit (T), and the aromatic dicarbonyl unit (U) with respect to 100 parts by weight of the polyamide resin (a). It contains one type of structural unit and trifunctional or higher functional organic residue (D), and the content of D is in the range of 7.5 to 50 mol% with respect to all monomers constituting the dendritic polyester. The polyamide resin composition according to claim 1 or 2, comprising 0.01 to 10 parts by weight of a dendritic polyester resin (e) exhibiting a certain melt liquid crystallinity and 0.01 to 10 parts by weight of an acid anhydride (f). . 前記樹状ポリエステル樹脂(e)において、芳香族オキシカルボニル単位(S)、芳香族および/または脂肪族ジオキシ単位(T)、および、芳香族ジカルボニル単位(U)が、それぞれ下式(1)で表される構造単位から選ばれる少なくとも1種の構造単位であり、かつ、Dの含有量を1モルとした場合にS、TおよびUそれぞれの含有量p、qおよびrがp+q+r=1〜10モルの範囲にある請求項記載のポリアミド樹脂組成物。
(ここで、R1、R2およびR3は、それぞれ下式で表される構造単位から選ばれる少なくとも1種の構造単位である。)
(ただし、式中Yは、水素原子、ハロゲン原子およびアルキル基から選ばれる少なくとも1種である。式中nは2〜8の整数である。)
In the dendritic polyester resin (e), the aromatic oxycarbonyl unit (S), the aromatic and / or aliphatic dioxy unit (T), and the aromatic dicarbonyl unit (U) are each represented by the following formula (1): And at least one structural unit selected from the structural units represented by the formula (1), and when the D content is 1 mol, the contents p, q, and r of S, T, and U are p + q + r = 1 to The polyamide resin composition according to claim 3, which is in a range of 10 moles.
(Here, R1, R2 and R3 are each at least one structural unit selected from structural units represented by the following formula.)
(Wherein, Y is at least one selected from a hydrogen atom, a halogen atom and an alkyl group. In the formula, n is an integer of 2 to 8.)
前記樹状ポリエステル樹脂(e)が、式(2)で示される基本骨格を含有する請求項または記載のポリアミド樹脂組成物。
(ここで、Dは3官能化合物の有機残基であり、D−D間はエステル結合および/またはアミド結合により直接、あるいは、前記S、TおよびUから選ばれる構造単位を介して結合している。)
The polyamide resin composition according to claim 3 or 4, wherein the dendritic polyester resin (e) contains a basic skeleton represented by the formula (2).
(Here, D is an organic residue of a trifunctional compound, and DD is bonded directly by an ester bond and / or an amide bond, or bonded via a structural unit selected from S, T and U. Yes.)
前記樹状ポリエステル樹脂(e)が式(3)で示される基本骨格を含有する請求項または記載のポリアミド樹脂組成物。
(ここで、Dは4官能化合物の有機残基であり、D−D間はエステル結合および/またはアミド結合により直接、あるいは、前記S、TおよびUから選ばれる構造単位を介して結合している。)
The polyamide resin composition according to claim 3 or 4, wherein the dendritic polyester resin (e) contains a basic skeleton represented by the formula (3).
(Here, D is an organic residue of a tetrafunctional compound, and DD is bonded directly by an ester bond and / or an amide bond or via a structural unit selected from S, T and U. Yes.)
前記樹状ポリエステル樹脂(e)のDで表される有機残基が芳香族化合物由来の有機残基である請求項のいずれか1項に記載のポリアミド樹脂組成物。 The polyamide resin composition according to any one of claims 3 to 6 , wherein the organic residue represented by D of the dendritic polyester resin (e) is an organic residue derived from an aromatic compound. 前記樹状ポリエステル樹脂(e)のDで表される有機残基が式(5)または(6)で表される有機残基である請求項記載のポリアミド樹脂組成物。
The polyamide resin composition according to claim 7, wherein the organic residue represented by D of the dendritic polyester resin (e) is an organic residue represented by the formula (5) or (6).
前記酸無水物(f)が不飽和炭化水素基を有しない請求項のいずれか1項に記載のポリアミド樹脂組成物。 The polyamide resin composition according to any one of claims 3 to 8 , wherein the acid anhydride (f) does not have an unsaturated hydrocarbon group. 前記請求項1〜のいずれか1項に記載のポリアミド樹脂組成物を成形してなる成形品。 Claim 1 molded article obtained by molding the polyamide resin composition according to any one of 9. 成形品の最薄肉部が0.5mm以下である請求項10に記載の成形品。 The molded product according to claim 10 , wherein the thinnest portion of the molded product is 0.5 mm or less.
JP2014128729A 2013-06-28 2014-06-24 Polyamide resin composition Active JP6354379B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014128729A JP6354379B2 (en) 2013-06-28 2014-06-24 Polyamide resin composition

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013136270 2013-06-28
JP2013136270 2013-06-28
JP2014128729A JP6354379B2 (en) 2013-06-28 2014-06-24 Polyamide resin composition

Publications (3)

Publication Number Publication Date
JP2015028155A JP2015028155A (en) 2015-02-12
JP2015028155A5 true JP2015028155A5 (en) 2017-07-13
JP6354379B2 JP6354379B2 (en) 2018-07-11

Family

ID=52492024

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014128729A Active JP6354379B2 (en) 2013-06-28 2014-06-24 Polyamide resin composition

Country Status (1)

Country Link
JP (1) JP6354379B2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3543292A4 (en) 2016-11-15 2020-06-03 Toray Industries, Inc. Polyamide resin composition and molded article containing same
KR102218060B1 (en) * 2016-12-28 2021-02-19 주식회사 엘지화학 Polyamide-based resin molded article
WO2018181995A1 (en) 2017-03-30 2018-10-04 旭化成株式会社 Polyamide composition and molded article
KR20200062336A (en) 2017-10-17 2020-06-03 셀라니즈 세일즈 저머니 게엠베하 Flame retardant polyamide composition
JP7014633B2 (en) * 2018-02-21 2022-02-01 旭化成株式会社 Polyamide composition and molded products
CN112679919A (en) * 2020-12-18 2021-04-20 南阳金牛电气有限公司 Solidified core group injection molding material for lightning arrester

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0675160A3 (en) * 1994-03-29 1995-11-29 Gen Electric Ultraviolet light stabilized polyamide compositions.
MY139230A (en) * 2002-10-17 2009-08-28 Ciba Holding Inc Flame retardant polymeric electrical parts
PL2379643T3 (en) * 2008-12-17 2013-04-30 Basf Se Layered silicate flame retardant compositions
JP5790005B2 (en) * 2010-02-26 2015-10-07 東レ株式会社 Polyamide resin composition and method for producing the same
JP2013043975A (en) * 2011-08-26 2013-03-04 Unitika Ltd White polyamide film with excellent weather resistance
JP2013076001A (en) * 2011-09-30 2013-04-25 Toray Ind Inc Polyamide resin composition
US20140316032A1 (en) * 2011-11-11 2014-10-23 Basf Se P-n-compounds as flame retardants

Similar Documents

Publication Publication Date Title
JP2015028155A5 (en)
JP6959424B2 (en) Polyamide resin composition and molded product
EP2799478B1 (en) B-crystal form nucleating agent composition for polypropylene and application thereof
JP6174238B2 (en) Polylactic acid stereocomplex composition, molded product thereof, production method thereof and use thereof
JP2016519189A5 (en)
JP5779282B2 (en) Blends of polyetherimide sulfone and poly (arylene sulfide)
KR20130043231A (en) Heat-stabilized polyamide composition
JP2016514751A (en) Heat resistant polyamide composition
JP2015525813A5 (en)
JP2021113319A (en) Polyarylene sulfide resin composition, molded article thereof, and surface mounting electronic component
KR101755735B1 (en) Hydrolytically stable polyamide
JP2010189467A (en) Polyamide resin composition
TW201414770A (en) Fiber-reinforced polyamide resin material
JP2013532757A (en) Composite materials containing natural fibers
JP2012533658A5 (en)
JP2021507979A (en) Highly heat resistant polyamide molding compound
PH12019500728A1 (en) Composite resin composition and connector molded from composite resin composition
KR20180113972A (en) PBAT resin composition
CN105778493A (en) Polyamide Resin Composition And Molded Article
KR102012061B1 (en) Polyamide resin composition and article produced therefrom
CN108864618B (en) High-antibacterial wear-resistant PVC resin material and preparation method thereof
CA3089800A1 (en) Use of polyhydric alcohols to increase weld seam strength after thermal aging in polyamides
JP5669623B2 (en) Polyamide resin composition and molded product
JP5669627B2 (en) Polyamide resin composition and molded product
KR20180059163A (en) Compound