JP2016039639A - Power conversion device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a power conversion device which can reduce the number of components and achieve low cost and downsizing.SOLUTION: A power conversion device 1 comprises: a semiconductor module 2; and a control circuit board 3 for performing operational control of the semiconductor module 2. The semiconductor module 2 includes: a body part 21 which incorporates a semiconductor element 20; a plurality of board connection terminals 23 which project from the body part 21 and are connected to the control circuit board 3; and a plurality of power terminals 22. The power terminals 22 include a positive electrode terminal 22a, a negative electrode terminal 22b and an AC terminal 22c. The control circuit board 3 includes a voltage measurement circuit 30 for measuring voltage between the positive electrode terminal 22a and the negative electrode terminal 22b. The power conversion device 1 comprises as the board connection terminal 23, a positive-side connection terminal 23a which is connected to the positive electrode terminal 22a in the body part 21 and has a tip connected to the voltage measurement circuit 30.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a power conversion device including a semiconductor module containing a semiconductor element and a control circuit board connected to the semiconductor module.

  For example, as a power conversion device that performs power conversion between direct current power and alternating current power, a semiconductor module including a semiconductor element and a control circuit board that is connected to the semiconductor module and controls a switching operation of the semiconductor element (See Patent Document 1 below).

  The semiconductor module includes a positive terminal connected to a positive electrode of a DC power source, a negative terminal connected to a negative electrode of the DC power source, and an AC terminal connected to an AC load. The power converter converts the DC power supplied from the DC power source into AC power by switching the semiconductor element with the control circuit board, and drives the AC load using the AC power. It is configured as follows.

  On the control circuit board, a voltage measuring circuit for measuring a voltage between the positive terminal and the negative terminal is formed. The power conversion apparatus measures the voltage using the voltage measurement circuit, and uses the measurement result for operation control of the semiconductor element.

  A bus bar serving as a path for direct current is welded to the positive terminal. A wire is connected to this bus bar. The control circuit board is provided with a connector that is electrically connected to the voltage measurement circuit. The voltage measuring circuit and the positive terminal are electrically connected by connecting the wire to a connector.

JP 2010-1234523 A

  However, the power conversion device requires a wire and a connector to connect the positive electrode terminal and the voltage measurement circuit, so that there is a problem that the number of components tends to increase. Therefore, the manufacturing cost of the power conversion device is likely to increase. Moreover, since it is necessary to ensure the space for routing a wire, a power converter device becomes easy to enlarge.

  The present invention has been made in view of such a background, and an object of the present invention is to provide a power conversion device capable of reducing the number of parts, reducing the cost, and reducing the size.

One embodiment of the present invention is a semiconductor module including a semiconductor element;
A control circuit board connected to the semiconductor module and controlling the switching operation of the semiconductor element,
The semiconductor module has a main body portion containing the semiconductor element, a plurality of substrate connection terminals protruding from the main body portion and connected to the control circuit board, and a plurality of power terminals protruding from the main body portion, The plurality of power terminals include a positive electrode terminal and a negative electrode terminal to which a DC voltage is applied, and an AC terminal connected to an AC load.
The control circuit board is formed with a voltage measuring circuit for measuring a voltage between the positive terminal and the negative terminal,
As the substrate connection terminal, a negative side connection terminal connected to the negative electrode terminal in the main body portion and connected to the voltage measurement circuit, and a negative connection terminal connected to the positive electrode terminal in the main body portion and connected to the voltage measurement circuit. The power converter is provided with a connected positive-side connection terminal.

The semiconductor module of the power converter includes the positive connection terminal as the board connection terminal. The positive connection terminal is connected to the positive terminal in the main body of the semiconductor module, and the tip thereof is connected to the voltage measurement circuit.
Therefore, the positive electrode terminal and the voltage measurement circuit can be electrically connected without using a wire, a connector, or the like. Therefore, the number of parts can be reduced, and the manufacturing cost of the power conversion device can be reduced. Moreover, since it is not necessary to secure a space for routing the wire, the power converter can be reduced in size.

  As described above, according to the present invention, it is possible to provide a power conversion device that can reduce the number of components, reduce costs, and can be reduced in size.

It is sectional drawing of the power converter device in Example 1, Comprising: II sectional drawing of FIG. II-II sectional drawing of FIG. III-III sectional drawing of FIG. IV-IV sectional drawing of FIG. 1 is a circuit diagram of a semiconductor module in Embodiment 1. FIG. The circuit diagram of the power converter device in Example 1. FIG. The top view of a semiconductor module provided with the positive side connection terminal in Example 1. FIG. VIII-VIII sectional drawing of FIG. IX-IX sectional drawing of FIG. The top view of the semiconductor module which is not provided with the positive side connection terminal in Example 1. FIG. The principal part enlarged view of FIG. XII-XII sectional drawing of FIG. The principal part enlarged view of FIG. Sectional drawing of the power converter device in Example 2. FIG. It is sectional drawing of the power converter device in Example 3, Comprising: It is XV-XV sectional drawing of FIG. XVI-XVI sectional drawing of FIG.

  The power conversion device can be a vehicle-mounted power conversion device to be mounted on a vehicle such as an electric vehicle or a hybrid vehicle.

Example 1
The Example which concerns on the said power converter device is described using FIGS. As shown in FIG. 1, the power conversion device 1 of this example includes a semiconductor module 2 and a control circuit board 3. The semiconductor module 2 includes a semiconductor element 20 (see FIG. 6). The control circuit board 3 is connected to the semiconductor module 2 and controls the switching operation of the semiconductor element 20.

  The semiconductor module 2 includes a main body 21 containing the semiconductor element 20, a plurality of board connection terminals 23 protruding from the main body 21 and connected to the control circuit board 3, and a plurality of power terminals 22 protruding from the main body 21. Have The plurality of power terminals 22 include a positive terminal 22a and a negative terminal 22b to which a DC voltage of the DC power supply 8 (see FIG. 6) is applied, and an AC terminal 22c connected to the AC load 83.

As shown in FIGS. 3 and 6, the control circuit board 3 is formed with a voltage measurement circuit 30 that measures the voltage between the positive terminal 22 a and the negative terminal 22 b.
The power conversion device 1 includes a negative side connection terminal 23 b and a positive side connection terminal 23 a as the board connection terminals 23. The negative connection terminal 23 b is connected to the negative electrode terminal 22 b in the main body 21 (see FIG. 9), and the tip thereof is connected to the voltage measurement circuit 30. Further, the positive side connection terminal 23 a is connected to the positive electrode terminal 22 a in the main body 21 (see FIG. 8), and the tip thereof is connected to the voltage measurement circuit 30.

  The power conversion device 1 of this example is a vehicle-mounted power conversion device to be mounted on a vehicle such as an electric vehicle or a hybrid vehicle.

  As shown in FIG. 5, the semiconductor module 2 of this example includes two semiconductor elements 20 (IGBT elements). In addition to the positive connection terminal 23a, the substrate connection terminal 23 includes an anode terminal 23A and a cathode terminal 23K connected to the diode 29, a gate terminal 23G of an IGBT element, a sense emitter 23Se, and a Kelvin emitter 23Ke. . The anode terminal 23 </ b> A and the cathode terminal 23 </ b> K are used for measuring the temperature of the semiconductor module 2. The sense emitter 23Se is used to extract and measure a part of the emitter current of the IGBT element. The Kelvin emitter 23Ke is used for taking out a reference potential for the gate terminal 23G. The Kelvin emitter 23 Ke of the lower arm side IGBT element is the negative side connection terminal 23 b.

  As shown in FIG. 2, in this example, a stacked body 10 is configured by stacking a plurality of semiconductor modules 2 and a plurality of cooling pipes 11. Among the plurality of semiconductor modules 2, the positive connection terminal 23 a and the negative connection terminal 23 b are formed on the end semiconductor module 2 a located at one end in the stacking direction (X direction) of the stacked body 10. The semiconductor module 2 other than the end semiconductor module 2a is not formed with the positive connection terminal 23a. Further, as shown in FIG. 3, when viewed from the protruding direction (Z direction) of the board connection terminal 23, the end semiconductor module 2 a is arranged at a position adjacent to the edge 31 of the control circuit board 3 in the X direction. ing.

  The plurality of substrate connection terminals 23 formed in each semiconductor module 2 are arranged in the width direction (Y direction) orthogonal to both the Z direction and the X direction. Of the plurality of substrate connection terminals 23 formed in the end semiconductor module 2a, the substrate connection terminal 23 located at one end in the Y direction is the positive connection terminal 23a. The board connection terminal 23 located at the other end in the Y direction is the negative connection terminal 23b.

  As shown in FIGS. 7 to 9, the end semiconductor module 2a includes three heat radiating plates 28, a positive heat radiating plate 28a, a negative electrode radiating plate 28b, and an AC heat radiating plate 28c. These three heat radiating plates 28 are sealed in the main body 21 with their respective surfaces exposed. The positive heat sink 28a is connected to the positive terminal 22a, and the negative heat sink 28b is connected to the negative terminal 22b. The AC heat radiating plate 28c is connected to the AC terminal 22c. The upper arm side semiconductor element 20a is interposed between the positive electrode heat sink 28a and the AC heat sink 28c. Further, the lower arm side semiconductor element 20b is interposed between the negative electrode heat sink 28b and the AC heat sink 28c.

  As shown in FIG. 8, the positive side connection terminal 23a, the positive electrode heat dissipation plate 28a, and the positive electrode terminal 22a are integrally formed. The positive side connection terminal 23a is connected to the positive electrode terminal 22a through the positive electrode heat dissipation plate 28a. The positive side connection terminal 23a is used for fixing the positive side heat radiating plate 28a in the mold when the heat radiating plate 28 and the semiconductor element 20 are placed in a mold during resin module molding. Used. The distal end portion 230 of the positive connection terminal 23a is formed to be narrower than the proximal end portion 239. The outer diameter of the tip portion 230 is substantially equal to the outer diameter of the other board connection terminals 23.

  As shown in FIG. 9, the negative connection terminal 23 b is connected to the negative electrode heat radiating plate 28 b by a wire 238. The negative connection terminal 23b is connected to the negative electrode terminal 22b via the wire 238 and the negative heat dissipation plate 28b.

  Further, as shown in FIG. 10, in the semiconductor modules 2 other than the end semiconductor module 2a, the positive connection terminal 23a is cut off near the root. The end semiconductor module 2a and the other semiconductor modules 2 are all the same except for the positive connection terminal 23a.

  On the other hand, as shown in FIG. 6, in this example, the inverter circuit 200 is formed using a plurality of semiconductor modules 2. The control circuit board 3 is used to control the switching operation of the semiconductor element 20 in the semiconductor module 2. Thereby, the DC power supplied from the DC power source 81 is converted into AC power, and the AC load 83 (three-phase AC motor) is driven. As a result, the vehicle is running.

  The voltage measurement circuit 30 described above is formed on the control circuit board 3. The voltage measurement circuit 30 includes an insulation resistor 5, an amplifier circuit 39, and a microcomputer 38. The positive side connection terminal 23 a and the negative side connection terminal 23 b are each connected to the voltage measurement circuit 30. The microcomputer 38 measures the voltage between the positive side connection terminal 23a and the negative side connection terminal 23b, that is, the voltage between the positive terminal 22a and the negative terminal 22b via the insulation resistor 5 and the amplifier circuit 39. Has been. The measured value is used when controlling the operation of the semiconductor element 20.

  Moreover, as shown in FIG. 6, the power converter device 1 of this example includes a capacitor 12 connected between a positive electrode terminal 22a and a negative electrode terminal 22b. The capacitor 12 smoothes the DC voltage applied between the positive terminal 22a and the negative terminal 22b.

  A plurality of discharge resistors 4 for discharging the electric charge stored in the capacitor 12 are mounted on the control circuit board 3. The discharge resistor 4 is connected to the positive connection terminal 23a and the negative connection terminal 23b. That is, in this example, the electric charge stored in the capacitor 12 is caused to flow through the discharge resistor 4 via the positive side connection terminal 23a and the negative side connection terminal 23b to be discharged. A switch or the like is not provided between the discharge resistor 4 and the capacitor 12. Therefore, in the state where the power conversion device 1 is used, the electric charge stored in the capacitor 12 always flows through the discharge resistor 4. Therefore, even when the relays 150 and 151 are turned off for some reason, the electric charge stored in the capacitor 12 is discharged in a short time. This prevents an electric shock accident or the like from occurring.

  As shown in FIG. 3, the plurality of discharge resistors 4 are arranged in the Y direction. The discharge resistor 4 is arranged between the board connection terminal 23 of the end semiconductor module 2a (see FIG. 2) and the edge 31 of the control circuit board 3 in the X direction. Among the plurality of discharge resistors 4, the discharge resistor 4a located at one end in the Y direction is electrically connected to the positive connection terminal 23a. In addition, the discharge resistor 4b located at the other end in the Y direction is electrically connected to the negative connection terminal 23b.

  Further, the plurality of discharge resistors 4 are arranged at positions overlapping the cooling tube 11 when viewed from the Z direction. As described above, while the power conversion device 1 is in operation, the charge stored in the capacitor 12 is always passed through the discharge resistor 4. Therefore, the discharge resistor 4 always generates heat while the power conversion device 1 is operating. Therefore, by disposing the discharge resistor 4 at a position close to the cooling tube 11, the cooling resistor 11 is used to cool the discharge resistor 4.

  In this example, the discharge resistor 4 is arranged at a position overlapping with the end cooling tube 11a (see FIG. 2) located at one end in the X direction among the plurality of cooling tubes 11 in the Z direction. Since the end cooling pipe 11a is in contact with the semiconductor module 2 only on one side, the temperature of the refrigerant 16 flowing in the end cooling pipe 11a is relatively low. Therefore, as in this example, if the plurality of discharge resistors 4 are arranged at positions overlapping the end cooling tubes 11a in the Z direction, the discharge resistors 4 can be effectively cooled.

  As shown in FIGS. 11 and 12, a resistance side heat radiation layer 36 made of a metal thin film is formed on the surface 32 of the control circuit board 3. Wiring 360 and the like are also formed by this metal thin film. The discharge resistor 4 is placed on the resistance-side heat radiation layer 36 and soldered. The resistance-side heat radiation layer 36 forms a path through which the discharge current of the capacitor 12 flows. The resistance-side heat radiation layer 36 also has a role of cooling the discharge resistor 4 by conducting heat generated from the discharge resistor 4.

  As shown in FIG. 12, a cooling pipe side heat radiation layer 37 made of a metal thin film is formed on the surface 33 of the control circuit board 3 on the cooling pipe 11 side. A through hole 35 penetrating in the Z direction is formed in the control circuit board 3. As shown in FIG. 13, a plating layer 351 is formed on the inner peripheral surface of the through hole 35. The resistance heat generated from the discharge resistor 4 is conducted through the resistance side heat radiation layer 36, the plating layer 351, and the cooling pipe side heat radiation layer 37 and is transmitted to the cooling pipe 11. Thereby, the discharge resistor 4 is effectively cooled.

  As shown in FIG. 2, an inlet pipe 13 for introducing the refrigerant 16 and a lead-out pipe 14 for discharging the refrigerant 16 are attached to the end cooling pipe 11 a. Moreover, the two cooling pipes 11 adjacent to each other in the X direction are connected by connecting pipes 15 at both ends in the Y direction. When the refrigerant 16 is introduced into the introduction pipe 13, the refrigerant 16 flows through all the cooling pipes 11 through the connecting pipe 15 and is led out from the outlet pipe 14. Thereby, the semiconductor module 2 is configured to be cooled.

  In this example, as shown in FIGS. 2 and 4, a pressure member 17 (plate spring) is provided at a position adjacent to the laminated body 10 in the X direction. The pressurizing member 17 presses the laminated body 10 toward the wall portion 61 of the case 6. Thereby, the laminated body 10 is fixed in the case 6 while ensuring a contact pressure between the semiconductor module 21 and the cooling pipe 11.

  As shown in FIG. 4, the capacitor 12 includes a capacitor element 121, a sealing member 122 that seals the capacitor element 121, and metal plates 123 and 124 connected to the electrode surfaces of the capacitor element 121. Part of the metal plates 123 and 124 protrudes from the sealing member 122 to form connection terminals 125 and 126. The connection terminals 125 and 126 are connected to the positive terminal 22a (see FIG. 1) and the negative terminal 22b of the semiconductor module 2 by a bus bar (not shown).

The effect of this example will be described. As shown in FIG. 1, the power conversion device 1 of this example includes a positive side connection terminal 23 a as a board connection terminal 23. The positive connection terminal 23 a is connected to the positive terminal 22 a in the main body 21 of the semiconductor module 2, and the tip thereof is connected to the voltage measurement circuit 30.
Therefore, the positive electrode terminal 22a and the voltage measurement circuit 30 can be electrically connected without using a wire or a connector. Therefore, the number of parts can be reduced, and the manufacturing cost of the power conversion device 1 can be reduced. Moreover, since it is not necessary to ensure the space around which a wire is routed, the power converter device 1 can be reduced in size.

Moreover, in this example, as shown in FIG. 2, the positive side connection terminal 23a and the negative side connection terminal 23b are formed in the edge part semiconductor module 2a located in the one end in a X direction among the several semiconductor modules 2. FIG. As shown in FIG. 3, when viewed from the Z direction, the end semiconductor module 2 a is disposed at a position adjacent to the edge 31 of the control circuit board 3 in the X direction.
Therefore, as shown in FIG. 3, components such as the discharge resistor 4 connected to the positive side connection terminal 23 a and the negative side connection terminal 23 b are connected between the substrate connection terminal 23 of the end semiconductor module 2 a and the edge 31. Can be placed in the area. Therefore, the above-described area of the control circuit board 3 can be effectively used.

In this example, as shown in FIG. 2, among the plurality of substrate connection terminals 23 formed in the end semiconductor module 2a, the substrate connection terminal 23 located at one end in the Y direction is used as the positive connection terminal 23a.
Therefore, as shown in FIG. 3, when a plurality of components such as a discharge resistor 4 are connected in series and mounted on the control circuit board 3 and connected to the positive connection terminal 23a, the plurality of components are connected to one end in the Y direction. From the side, that is, the side where the positive connection terminal 23a is provided, it can be arranged toward the other end. Therefore, the region between the substrate connection terminal 23 of the end semiconductor module 2a and the end edge 31 can be effectively used from one end side to the other end side in the Y direction.

  In this example, a plurality of discharge resistors 4 are connected in series between the positive side connection terminal 23a and the negative side connection terminal 23b. The plurality of discharge resistors 4 are arranged in a line in the Y direction. Therefore, a plurality of discharge resistors 4 are arranged even in a region having a narrow width in the X direction, such as a region between the substrate connection terminal 23 of the end semiconductor module 2a (see FIG. 2) and the end edge 31. can do. Therefore, the above-mentioned area of the control circuit board 3 can be effectively used.

Further, in this example, as shown in FIGS. 2 and 3, the discharge resistor 4 is arranged at a position overlapping the cooling tube 11 when viewed from the Z direction.
Therefore, the discharge resistor 4 can be disposed at a position close to the cooling 11, and the discharge resistor 4 can be effectively cooled using the cooling tube 11.

  As described above, according to this example, it is possible to provide a power conversion device that can reduce the number of components, reduce costs, and can be reduced in size.

(Example 2)
In the following embodiments, the same reference numerals used in the drawings among the reference numerals used in the drawings represent the same components as in the first embodiment unless otherwise specified.

  In this example, the configuration of the semiconductor module 2 is changed. As shown in FIG. 14, in this example, the upper arm semiconductor element 20a (see FIG. 5) and the lower arm semiconductor element 20b are sealed in separate semiconductor modules 2, respectively. The upper arm semiconductor element 20a is sealed by the upper arm semiconductor module 2a, and the lower arm semiconductor element 20b is sealed by the lower arm semiconductor module 2b.

A positive side connection terminal 23a is formed on the upper arm semiconductor module 2a. The lower arm semiconductor module 2b has a negative connection terminal 23b.
In addition, the configuration and operational effects similar to those of the first embodiment are provided.

(Example 3)
In this example, the configuration of the semiconductor module 2 is changed. As shown in FIGS. 15 and 16, in this example, all the semiconductor elements 20 constituting the inverter circuit 200 (see FIG. 6) are sealed in one semiconductor module 2. From the main body 21 of the semiconductor module 2, a positive terminal 22 a, a negative terminal 22 b, and three AC terminals 22 c protrude. A plurality of substrate connection terminals 23 protrude from the main body 21. Among the plurality of board connection terminals 23, some of the board connection terminals 23 are used as positive side connection terminals 23 a. The other part of the board connection terminals 23 is used as the negative connection terminal 23b.

In addition, the power conversion apparatus 1 of this example includes one cooler 110. A flow path 111 through which the refrigerant 16 flows is formed in the cooler 110. The single cooler 110 is used to cool the semiconductor module 2.
In addition, the configuration and operational effects similar to those of the first embodiment are provided.

DESCRIPTION OF SYMBOLS 1 Power converter 2 Semiconductor module 20 Semiconductor element 21 Main-body part 22 Power terminal 22a Positive electrode terminal 22b Negative electrode terminal 22c AC terminal 23 Board | substrate connection terminal 23a Positive side connection terminal 23b Negative side connection terminal 3 Control circuit board 30 Voltage measurement circuit

Claims (5)

A semiconductor module (2) containing a semiconductor element (20);
A control circuit board (3) connected to the semiconductor module (2) and controlling the switching operation of the semiconductor element (20),
The semiconductor module (2) includes a main body (21) containing the semiconductor element (20) and a plurality of substrate connection terminals (23) protruding from the main body (21) and connected to the control circuit board (3). And a plurality of power terminals (22) protruding from the main body (21), and a positive terminal (22a) and a negative terminal (22b) to which a DC voltage is applied are applied to the plurality of power terminals (22). ) And an AC terminal (22c) connected to the AC load (83),
On the control circuit board (3), a voltage measuring circuit (30) for measuring a voltage between the positive terminal (22a) and the negative terminal (22b) is formed.
As the substrate connection terminal (23), a negative connection terminal (23b) having a tip connected to the voltage measurement circuit (30) connected to the negative terminal (22b) in the main body (21), and the main body A power converter (1) comprising a positive side connection terminal (23a) connected to the positive terminal (22a) and connected to the voltage measurement circuit (30) in the portion (21).   A laminated body (10) is formed by laminating a plurality of the semiconductor modules (2) and a plurality of cooling pipes (11) for cooling the semiconductor modules (2), and the plurality of semiconductor modules (2) The positive connection terminal (23a) and the negative connection terminal (23b) are formed on the end semiconductor module (2a) positioned at one end in the stacking direction of the stacked body (10), and the substrate When viewed from the protruding direction of the connection terminal (23), the end semiconductor module (2a) is arranged at a position adjacent to the edge (31) of the control circuit board (3) in the stacking direction. The power conversion apparatus according to claim 1.   The plurality of substrate connection terminals (23) formed in each of the semiconductor modules (2) are arranged in a width direction orthogonal to both the projecting direction and the stacking direction, and the end semiconductor modules ( Of the plurality of substrate connection terminals (23) formed in 2a), the substrate connection terminal (23) located at one end in the width direction is the positive connection terminal (23a). The power converter device (1) according to claim 2.   A capacitor (12) electrically connected between the positive terminal (22a) and the negative terminal (22b) is provided, and the capacitor is connected via the positive connection terminal (23a) and the negative connection terminal (23b). A plurality of discharge resistors (4) for discharging the charge stored in the capacitor (12) are mounted on the control circuit board (3), and the plurality of discharge resistors (4) are connected in series with each other, In the stacking direction (10), the plurality of discharge resistors (4) are located between the substrate connection terminal (23) and the edge (31) formed in the end semiconductor module (2a). The power converter (1) according to claim 3, wherein the plurality of discharge resistors (4) are arranged in a line in the width direction.   At least a part of the discharge resistors (4) among the plurality of discharge resistors (4) is arranged at a position overlapping the cooling tube (11) when viewed from the projecting direction. Item 5. The power conversion device (1) according to Item 4.

Images