JP2016025186A - Substrate processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus in which the position of a chuck can be detected reliably, even when the chuck is moved by using magnetic force.SOLUTION: In a region between a sensor mechanism 50 in a rotary chamber 91 and a flange 39 in a first lifting plate 31, a hole is formed, in which a translucent member 53 of quartz, or the like, is disposed. In a region between the sensor mechanism 50 in a fixed chamber 92 and the flange 39 in the first lifting plate 31, a hole is formed, in which a translucent member 54 of quartz, or the like, is disposed. The light emitted from a projection part 51 is irradiated to the flange 39 of the first lifting plate 31, through the translucent members 54, 53. The light reflected on the flange 39 of the first lifting plate 31 reaches a light-receiving part 52 through the translucent members 53, 54, and is received by the light-receiving part 52.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a substrate processing apparatus that performs processing while rotating a substrate.

  In a substrate processing apparatus that processes a substrate by rotating a substantially circular substrate such as a semiconductor wafer while supplying the processing liquid to the main surface, the substrate that rotates the substrate that holds the main surface in a horizontal direction A holding mechanism is used. The substrate holding mechanism includes a plurality of chucks that hold the substrate by contacting the edge of the substrate. The plurality of chucks are movable between a holding position for holding the substrate and a delivery position for delivering the substrate to and from a transfer arm or the like.

  The plurality of chucks rotate while holding the substrate. On the other hand, in order to move the plurality of chucks between the holding position and the delivery position, it is necessary to provide a chuck moving mechanism including a drive source such as a motor. When this moving mechanism is configured to rotate together with a plurality of chucks holding the substrate, there is a problem that the rotating member becomes large and it is difficult to rotate the substrate at high speed.

  Patent Document 1 discloses a spin head that moves three chucking pins out of six chucking pins alternately to a position for chucking a substrate by raising and lowering a magnet.

JP 2008-135750 A

  For example, as described in Patent Document 1, magnetic force generated between a driven magnet connected to a chuck for holding a substrate and a drive magnet connected to a drive mechanism for moving these chucks. When the configuration for moving the chuck is adopted, the chuck can be rotated together with the substrate without connecting the moving mechanism and the chuck, so that the substrate can be rotated at a high speed without increasing the size of the rotating member. Is possible.

  However, when such a configuration is adopted, there arises a problem that the position of the chuck cannot be confirmed. That is, when such a configuration is adopted, the drive mechanism and the chuck are not mechanically connected even if the drive magnet is moved to the correct position by the moving mechanism for moving the drive magnet. Therefore, it cannot be surely confirmed whether the chuck is actually in the holding position or the delivery position.

  On the other hand, when the detection mechanism for detecting the actual position of the chuck is disposed at a position mechanically connected to the chuck, it is necessary to rotate the detection mechanism together with the substrate. This increases the size and hinders the substrate from rotating at high speed.

  The present invention has been made to solve the above-described problem, and an object of the present invention is to provide a substrate processing apparatus capable of reliably detecting the position of the chuck even when the chuck is moved using magnetic force. And

  The invention described in claim 1 is a substrate processing apparatus for processing a substrate while rotating the substrate, the rotating chamber rotating by driving a motor, the rotating chamber being disposed in the rotating chamber, and contacting the edge of the substrate. A plurality of chucks for holding the substrate, and a holding position for holding the substrate and a delivery position for delivering the substrate as the driven magnet disposed in the rotating chamber moves. An opening / closing mechanism disposed in the rotating chamber, a fixed chamber, a driving magnet disposed in the fixed chamber for moving the driven magnet, and moving the driving magnet A moving mechanism, a light projecting unit that irradiates light to a moving member that moves as the plurality of chucks move, and light reflected by the moving member A light receiving unit that receives light, and is arranged in the fixed chamber that detects movement of the moving member from light received by the light receiving unit that is irradiated from the light projecting unit and reflected by the moving member. And a sensor mechanism provided.

  According to a second aspect of the present invention, in the first aspect of the present invention, the driven magnet includes the first elevating plate disposed in the rotating chamber so as to be movable up and down, the driving magnet, and the fixed magnet. A second elevating plate disposed opposite to the first elevating plate in the chamber, wherein the opening / closing mechanism is connected to the plurality of chucks and the first elevating plate, and elevating operation of the first elevating plate Accordingly, the plurality of chucks are moved synchronously between a holding position for holding the substrate and a delivery position where the substrate can be delivered, and the moving mechanism raises and lowers the second lifting plate. The sensor mechanism is configured to irradiate light from the light projecting unit to the first lifting plate and to be reflected by the light receiving unit by the first lifting plate. Receive the received light.

  A third aspect of the present invention includes the spring according to the second aspect, wherein the plurality of chucks bias the first elevating plate in a direction toward the holding position.

  According to a fourth aspect of the present invention, in the invention of the second or third aspect, the region between the light projecting unit and the light receiving unit and the first lifting plate in the rotating chamber and the fixed chamber is , Composed of a translucent member.

  According to the first aspect of the present invention, even when the chuck is moved using the magnetic force between the driving magnet and the driven magnet, the position of the chuck is determined by detecting the movement of the moving member by the sensor mechanism. It becomes possible to detect reliably.

  According to the second aspect of the present invention, the plurality of chucks can be moved synchronously between the holding position and the delivery position by the action of the first and second lifting plates, and the first lifting plate can be moved by the sensor mechanism. By detecting the position, it is possible to reliably detect whether the chuck is in the holding position or the delivery position.

  According to the third aspect of the present invention, even when the rotating chamber rotates at a high speed, the substrate can be reliably held by the action of the spring.

  According to invention of Claim 4, it becomes possible to comprise a rotation chamber and a fixed chamber liquid-tightly by the effect | action of a translucent member.

It is a side surface schematic diagram of the substrate processing apparatus concerning this invention. 3 is a partial perspective view of an opening / closing mechanism for rotating the chuck 11. FIG. It is a perspective view of the opening-and-closing mechanism for rotating a chuck. FIG. 6 is an explanatory diagram showing an arrangement of a semiconductor wafer 100 and a chuck 11. It is an enlarged view of the sensor mechanism 50 vicinity. 5 is a graph showing the relationship between the height position of the first lifting plate 31 and the amount of light received by the light receiving unit 52 in the sensor mechanism 50. It is a block diagram which shows the main control systems of the substrate processing apparatus which concerns on this invention. It is explanatory drawing which shows the relationship between received light quantity and a threshold value. It is explanatory drawing which shows the relationship between received light quantity and a threshold value. It is a flowchart which shows the substrate processing process using the substrate processing apparatus which concerns on this invention. It is a front view which shows the moving member 71 which concerns on 2nd Embodiment of this invention. 7 is a plan view of a moving member 71. FIG. 7 is a plan view of a moving member 73. FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic side view of a substrate processing apparatus according to the present invention. FIG. 2 is a partial perspective view of an opening / closing mechanism for rotating the chuck 11. FIG. 3 is a perspective view of an opening / closing mechanism for rotating the chuck 11. 2 and 3, illustration of a flange portion 39 of the first elevating plate 31 described later is omitted.

  The substrate processing apparatus performs processing by supplying a processing liquid from the processing liquid supply nozzle 10 to the semiconductor wafer 100 while rotating the semiconductor wafer 100 as a substrate. It has the structure hold | maintained rotatably in a parallel plane. The substrate processing apparatus includes a rotating chamber 91 that rotates by driving of a motor 61 and a fixed chamber 92.

  The rotating chamber 91 is provided with six chucks 11 for holding the semiconductor wafer 100 by contacting the edge of the semiconductor wafer 100 having a substantially circular shape except for the orientation flat portion. The number of chucks 11 disposed in the rotating chamber 91 may be other than six. The chuck 11 is configured to rotate between a holding position, a delivery position, and a retracted position, which will be described later, by swinging about a rotating shaft 21 that is disposed in the rotating chamber 91 and faces the vertical direction. Yes.

  As shown in FIG. 1, a first elevating plate 31 is disposed in the rotary chamber 91 in a state that can be moved up and down by a guide mechanism (not shown). The first elevating plate 31 is urged downward by the action of the plurality of springs 35. A ring-shaped driven magnet 33 is attached to the lower surface of the first lifting plate 31.

  On the other hand, in the fixed chamber 92, the second elevating plate 32 is arranged in a state of being opposed to the first elevating plate 31. As shown in FIG. 1, the second lift plate 32 is connected to a slider 63 that is guided by a guide member 64 and moves up and down via a support member 65. The second elevating plate 32 is connected to the cylinder rod of the air cylinder 62 disposed in the fixed chamber 92. For this reason, the second elevating plate 32 moves up and down by driving the air cylinder 62. On the upper surface of the second elevating plate 32, a ring-shaped driving magnet 34 having the characteristic of repelling the ring-shaped driven magnet 33 attached to the lower surface of the first elevating plate 31 is disposed.

  Therefore, when the second elevating plate 32 in the fixed chamber 92 is raised by driving the air cylinder 62, the first elevating plate 31 in the rotating chamber 91 is caused by the action of the driven magnet 33 and the drive magnet 34 that repel each other. Also rises. On the other hand, when the second elevating plate 32 in the fixed chamber 92 is lowered by driving the air cylinder 62, the first elevating plate 31 in the rotating chamber 91 is caused by the weight of the first elevating plate 31 itself and the action of the spring 35. Also descends.

  The driven magnet 33 and the drive magnet 34 do not necessarily have a ring shape. A plurality of magnets may be arranged on the first lifting plate 31 and the second lifting plate 32 as long as the above-described lifting operation of the first lifting plate 31 can be performed.

  As shown in FIG. 2, the first elevating plate 31 is provided with a cam plate 24 via a connecting member 25. The cam plate 24 is formed with a hole 23 that faces in an oblique direction. The tip of a shaft 22 attached to the rotary shaft 21 is engaged with the hole 23. For this reason, when the 1st raising / lowering board 31 raises / lowers, the rotating shaft 21 rotates centering on the shaft center by the effect | action of the hole 23 and the axis | shaft 22 which face the diagonal direction. Along with the rotation of the rotating shaft 21, the chuck 11 is also rotated about the axis of the rotating shaft 21. The rotation angle position of the chuck 11 is determined by the height position of the first elevating plate 31.

  An opening / closing mechanism for rotating the chuck 11 provided with the cam plate 24 and the shaft 22 is provided for each of the six chucks 11. In FIG. 3, only the connecting member 25 is shown, and the cam plate 24 and the shaft 22 are not shown.

  FIG. 4 is an explanatory view showing the arrangement of the semiconductor wafer 100 and the chuck 11. 4A shows a state where the chuck 11 is disposed at the delivery position, and FIG. 4B shows a state where the chuck 11 is disposed at the holding position.

  As shown in FIG. 4, the chuck 11 includes a support portion 13 formed of a tapered surface disposed to face the lower surface of the semiconductor wafer 100 so as to support the lower surface near the edge of the semiconductor wafer 100, and the vicinity of the edge of the semiconductor wafer 100. The guide part 14 which consists of a taper surface opposingly arrange | positioned is provided. The distance from the rotating shaft 21 to the tip of the support portion 13 is larger than the distance from the rotating shaft 21 to the tip of the guide portion 14. That is, when the chuck 11 is disposed at a holding position for holding the semiconductor wafer 100, the tip of the guide portion 14 extending toward the rotation center of the semiconductor wafer 100 faces the rotation center of the semiconductor wafer 100. It is arranged at a position separated from the center of rotation of the semiconductor wafer 100 from the tip of the support portion 13 extending in the direction.

  As the first elevating plate 31 moves to the above-described raised position, the chuck 11 is rotated to an angular position rotated by a predetermined angle (15 to 45 degrees) from the state shown in FIG. At this time, due to the difference between the distance from the rotating shaft 21 to the tip of the support portion 13 and the distance from the rotating shaft 21 to the tip of the guide portion 14, as shown in FIG. The tip is disposed inside the edge of the semiconductor wafer 100, and the tip of the guide portion 14 in the chuck 11 is disposed outside the edge of the semiconductor wafer 100. In this state, the semiconductor wafer 100 is supported by the support portion 13 in the chuck 11 but is movable upward. In the state where the chuck 11 is disposed at the delivery position shown in FIG. 4A, the semiconductor wafer 100 supported by the chuck 11 can be delivered between the chuck 11 and a transfer arm or the like (not shown). Become.

  When the first elevating plate 31 moves to the above-described lowered position, the chuck 11 is rotated to an angular position slightly rotated (5 to 10 degrees) from the state shown in FIG. At this time, as shown in FIG. 4B, the support portion 13 and the guide portion 14 in the chuck 11 are arranged at positions where they abut against the edge of the semiconductor wafer 100 (that is, the rotation is stopped). In this state, the semiconductor wafer 100 comes into contact with the support portion 13 and the guide portion 14 in the chuck 11. In the state where the chuck 11 is disposed at the holding position shown in FIG. 4B, the semiconductor wafer 100 is securely held by the chuck 11.

  On the other hand, in a state where the semiconductor wafer 100 is not disposed at a position where the semiconductor wafer 100 contacts the chuck 11, the chuck 11 further rotates without stopping at the holding position. At this time, the chuck 11 rotates after reaching the retracted position where the tip of the shaft 22 attached to the rotating shaft 21 shown in FIG. Stop after reaching the bottom edge of. In this state, the first elevating plate 31 is lowered to the retracted position further below the lowered position described above.

  As shown in FIG. 1, a sensor mechanism 50 for detecting the height position of the first elevating plate 31 is disposed in the fixed chamber 92.

  FIG. 5 is an enlarged view of the vicinity of the sensor mechanism 50.

  The sensor mechanism 50 includes a light projecting unit 51 and a light receiving unit 52. A hole is formed in a region between the sensor mechanism 50 in the rotating chamber 91 and the flange 39 in the first elevating plate 31, and a translucent member 53 such as quartz is disposed in the hole. ing. Further, a hole is formed in a region between the sensor mechanism 50 in the fixed chamber 92 and the flange 39 in the first elevating plate 31, and a translucent member 54 such as quartz is disposed in the hole. It is installed.

  The light emitted from the light projecting unit 51 is applied to the lower surface of the first elevating plate 31, preferably the flange 39 on the lower surface, through the translucent member 54 and the translucent member 53. The light reflected by the flange portion 39 of the first elevating plate 31 reaches the light receiving portion 52 via the light transmitting member 53 and the light transmitting member 54 and is received by the light receiving portion 52.

  FIG. 6 is a graph showing the relationship between the height position of the first lifting plate 31 and the amount of light received by the light receiving unit 52 in the sensor mechanism 50. In this graph, the vertical axis represents the amount of received light, and the horizontal axis represents the distance (mm) between the lower surface of the first elevating plate 31 and the lower surface of the translucent member 53.

  In the range shown in this graph, the amount of light received by the light receiving unit 52 increases as the first elevating plate 31 rises and is separated from the sensor mechanism 50. For this reason, the height position of the 1st raising / lowering board 31 can be recognized by observing this received light quantity.

  FIG. 7 is a block diagram showing a main control system of the substrate processing apparatus according to the present invention.

  This substrate processing apparatus includes a ROM that stores an operation program necessary for controlling the apparatus, a RAM that temporarily stores data and the like during control, and a CPU that executes logical operations, and controls the entire apparatus. A control unit 80 is provided. The control unit 80 is connected to the motor 61 for rotating the rotary chamber 91 described above, the air cylinder 62 for raising and lowering the second elevating plate 32, and the sensor mechanism 50. The control unit 80 controls the opening / closing operation of the chuck 11 and the rotating operation of the rotating chamber 91. In addition, the control unit 80 includes a storage unit 81 that stores the relationship between the height position of the first lifting plate 31 illustrated in FIG. 6 and the amount of light received by the light receiving unit 52 in the sensor mechanism 50.

  8 and 9 are explanatory diagrams illustrating the relationship between the amount of received light and the threshold value.

  The storage unit 81 illustrated in FIG. 7 stores the relationship between the height position of the first lifting plate 31 and the amount of light received by the light receiving unit 52 in the sensor mechanism 50. Then, the light amount when the first elevating plate 31 is arranged at the raised position indicated by the symbol A in FIG. 8, the light amount when arranged at the lowered position indicated by the symbol B, and the retracted position indicated by the symbol C. Is stored. The control unit 80 has an intermediate amount of light between when the first elevating plate 31 indicated by symbol A in FIG. 8 is disposed at the raised position and when the first elevating plate 31 indicated by reference B is disposed at the lowered position. Is determined as a threshold value S1 for determining whether the first elevating plate 31 is in the raised position or the lowered position. Further, the control unit 80 includes a light amount when the first elevating plate 31 indicated by symbol B in FIG. 8 is disposed at the lowered position, and a light amount when the first elevating plate 31 indicated by reference symbol C is disposed at the retracted position. Is determined as a threshold value S2 for determining whether the first elevating plate 31 is in the lowered position or the retracted position.

  Thereby, the height position of the first elevating plate 31 can be recognized from the amount of light received by the light receiving unit 52 in the sensor mechanism 50. Then, from the height position of the first elevating plate 31, it is possible to recognize at which position of the delivery position, the holding position, or the retracted position the chuck 11 is disposed.

  As shown in FIG. 9, the relationship between the height position of the first elevating plate 31 and the amount of light received by the light receiving unit 52 in the sensor mechanism 50 varies depending on dirt on the translucent members 53 and 54 and other factors. . In the case where the relationship between the height position of the first elevating plate 31 indicated by the solid line in FIG. 9 and the amount of light received by the light receiving unit 52 in the sensor mechanism 50 changes as indicated by the broken line, the thresholds S1 and S2 are set to S1b and S2b. It is necessary to change to. The change of the threshold values S1b and S2b may be executed by an operator at regular intervals, or may be automatically executed under the control of the control unit 80.

  Next, a substrate processing process when processing the semiconductor wafer 100 with the processing liquid using the substrate processing apparatus according to the present invention will be described. FIG. 10 is a flowchart showing a substrate processing process using the substrate processing apparatus according to the present invention.

  When processing the semiconductor wafer 100, the semiconductor wafer 100 is first carried in (step S1). Specifically, the control unit 80 drives the air cylinder 62 to move the second lifting plate 32 to the raised position. By moving the second elevating plate 32 to the raised position, the first elevating plate 31 in the rotation chamber 91 is also moved to the raised position by the action of the driven magnet 33 and the drive magnet 34 that repel each other. In this state, the chuck 11 rotates around the rotation shaft 21 and is disposed at the delivery position shown in FIG. Then, the semiconductor wafer 100 is transferred onto the six chucks 11 by a transfer arm (not shown). As a result, as shown in FIG. 4A, the semiconductor wafer 100 is supported by the six chucks 11 in a state where the edge thereof is in contact with the support portion 13 in the chuck 11.

  At this time, the controller 80 confirms that the chuck 11 is disposed at the delivery position by specifying the height position of the first elevating plate 31 based on the amount of light received by the sensor mechanism 50. When the control unit 80 determines that the chuck 11 is not disposed at the delivery position, an error signal or the like is transmitted.

  Next, the semiconductor wafer 100 is held by the six chucks 11 (step S2). Specifically, the controller 80 drives the air cylinder 62 to move the second elevating plate 32 in the fixed chamber 92 to the lowered position. As a result, the first elevating plate 31 in the rotation chamber 91 moves to the lowered position by its own weight and the action of the spring 35. In this state, the chuck 11 is rotated about the rotation shaft 21 and rotated so as to approach the holding position shown in FIG.

  The six chucks 11 are connected to the first elevating plate 31 via an opening / closing mechanism including a shaft 22, a cam plate 24, a connecting member 25, and the like. For this reason, when the six chucks 11 are rotated, they are rotated in complete synchronization with each other as the first elevating plate 31 moves up and down. Therefore, even when there is an error in the diameter of the semiconductor wafer 100 having a substantially circular shape, the center of the semiconductor wafer 100 can always be arranged at a fixed position (the center of the rotating chamber 91), and the semiconductor wafer 100 is eccentric. It can be prevented from being held. The holding force of the semiconductor wafer 100 by the chuck 11 at this time is kept constant by the action of the spring 35.

  At this time, the control unit 80 confirms that the chuck 11 is disposed at the holding position by specifying the height position of the first elevating plate 31 based on the amount of light received by the sensor mechanism 50. When the control unit 80 determines that the chuck 11 is not disposed at the holding position, an error signal or the like is transmitted.

  When the holding operation of the semiconductor wafer 100 by the six chucks 11 is completed, the control unit 80 drives the motor 61 to rotate the rotating chamber 91 together with the chuck 11 and the semiconductor wafer 100 (step S3).

  When the rotating semiconductor wafer 100 held by the chuck 11 reaches a predetermined number of revolutions, the control unit 80 supplies the processing liquid from the processing liquid supply nozzle 10 toward the main surface of the semiconductor wafer 100 (step S4).

  In this state, the rotation of the semiconductor wafer 100 is continued and the semiconductor wafer 100 is processed with the processing liquid (step S5).

  As described above, when the semiconductor wafer 100 is processed with the processing liquid, the substrate processing apparatus includes the first elevating plate 31 including the driven magnet 33, the opening / closing mechanism including the shaft 22, the cam plate 24, the connecting member 25, and the like. Are housed in the rotating chamber 91, and the second elevating plate 32 having the drive magnet 34 and the elevating mechanism of the second elevating plate 32 are accommodated in the fixed chamber 92, so that these members are processed. It is possible to isolate it from the liquid atmosphere.

  When the processing using the processing liquid for the semiconductor wafer 100 is completed (step S6), the control unit 80 stops the supply of the processing liquid from the processing liquid supply nozzle 10. Then, the semiconductor wafer 100 is rotated at a high speed together with the rotating chamber 91 to perform a drying process. When the semiconductor wafer 100 is dried, the rotation of the rotation chamber 91 is stopped (step S7).

  Thereafter, the semiconductor wafer 100 is unloaded (step S8). Specifically, the control unit 80 drives the air cylinder 62 to move the second lifting plate 32 to the raised position. Thereby, the 1st raising / lowering board 31 also moves to a raise position. In this state, the chuck 11 rotates around the rotation shaft 21 and is disposed at the delivery position shown in FIG. Then, the semiconductor wafer 100 is unloaded by a transfer arm (not shown).

  Also at this time, the controller 80 confirms that the chuck 11 is disposed at the delivery position by specifying the height position of the first elevating plate 31 based on the amount of light received by the sensor mechanism 50. When the control unit 80 determines that the chuck 11 is not disposed at the delivery position, an error signal or the like is transmitted.

  After the semiconductor wafer 100 is unloaded, the controller 80 drives the air cylinder 62 to move the second elevating plate 32 to the lowered position. As a result, the first elevating plate 31 is also lowered. At this time, since the semiconductor wafer 100 is not disposed at a position where the semiconductor wafer 100 contacts the chuck 11, the chuck 11 further rotates to the retracted position without stopping at the holding position. By this. The first elevating plate 31 is lowered to the retracted position further below the lowered position.

  At this time, the control unit 80 confirms that the chuck 11 is disposed at the retracted position by specifying the height position of the first elevating plate 31 based on the amount of light received by the sensor mechanism 50. When the control unit 80 determines that the chuck 11 is not disposed at the retracted position, an error signal or the like is transmitted.

  As described above, in the substrate processing apparatus according to the present invention, the opening / closing operation of the chuck 11 that is not mechanically connected to the moving mechanism that raises and lowers the drive magnet 34 is separated from the rotation chamber 91. This can be confirmed by the mechanism 50. Thus, even when the chuck 11 is moved using the magnetic force between the drive magnet 34 and the driven magnet 33, the position of the chuck 11 can be determined by detecting the movement of the first lifting plate 31 by the sensor mechanism 50. It becomes possible to detect reliably.

  Other embodiments of the present invention will be described below with reference to the drawings. FIG. 11 is a front view showing a moving member 71 according to the second embodiment of the present invention, and FIG. 12 is a plan view of the moving member 71.

  In 1st Embodiment mentioned above, the 1st raising / lowering board 31 for rotating the chuck | zipper 11 is utilized as a moving member which concerns on this invention, The change of the height position accompanying the movement of this 1st raising / lowering board 31 is used. Detection is performed by the sensor mechanism 50. On the other hand, in the second embodiment, a chuck is used by using a moving member 71 attached to the rotary shaft 21 for rotating any one of the six chucks 11. 11 is used to confirm the movement state.

  As shown in FIG. 11, a moving member 71 is attached to the lower end portion of the rotating shaft 21 disposed in the rotating chamber 91. The moving member 71 is disposed at a height position corresponding to the flange portion 39 in place of the flange portion 39 of the first elevating plate 31 in the first embodiment. A sensor mechanism 50 similar to that in the first embodiment is disposed at a position facing the moving member 71 in the fixed chamber 92. And when the rotating shaft 21 rotates with rotation of the chuck | zipper 11, either of the three area | regions 71a, 71b, 71c in the moving member 71 shown in FIG. It is configured as follows. More specifically, when the chuck 11 is disposed at the delivery position, the region 71a is disposed opposite to the sensor mechanism 50, and when the chuck 11 is disposed at the holding position, the region 71b is disposed opposite to the sensor mechanism 50. When the chuck 11 is disposed at the retracted position, the region 71 c is disposed to face the sensor mechanism 50.

  As shown in FIG. 12, three holes 72 are formed in the region 71a of the moving member 71, and one hole 72 is formed in the region 71b. On the other hand, no hole is formed in the region 71c. For this reason, the amount of light received by the light receiving unit 52 in the sensor mechanism 50 varies depending on which region of the moving member 71 is disposed opposite to the sensor mechanism 50. More specifically, when the chuck 11 is disposed at the delivery position, the amount of received light is the smallest, when the chuck 11 is disposed at the retracted position, the amount of received light is greatest, and when the chuck 11 is disposed at the holding position. The amount of received light is an intermediate value. In this way, by detecting the amount of received light by the sensor mechanism 50, it is possible to determine at which position the chuck 11 is disposed.

  In the embodiment shown in FIGS. 11 and 12, by forming the hole 72, the amount of light incident on the light receiving portion 52 is changed by changing the reflectance of each of the regions 71a, 71b, 71c. However, the reflectance of the surface of the moving member 71 is sequentially changed for each region 71a, 71b, 71c, and the distance between the moving member 71 and the sensor mechanism 50 is sequentially changed for each region 71a, 71b, 71c. Accordingly, a configuration in which the amount of light incident on the light receiving unit 52 is changed may be employed.

  FIG. 13 is a plan view of a moving member 73 according to still another embodiment.

  In this embodiment, a moving member 73 is used instead of the moving member 71 of the second embodiment. The moving member 73 is not formed with the hole 72 as formed in the moving member 71 shown in FIG. However, the amount of light incident on the light receiving unit 52 after being irradiated from the light projecting unit 51 and reflected by the moving member 73 varies depending on how much the moving member 73 faces the sensor mechanism 50 depending on the angular position of the moving member 73. It is possible to determine at which position the chuck 11 is arranged by utilizing this.

  In the embodiment shown in FIGS. 11 to 13, the moving members 71 and 73 are connected to the rotating shaft 21 that rotates the chuck 11, and the moving members 71 and 73 are centered on the rotating shaft 21 together with the rotating shaft 21. Although the structure to rotate is employ | adopted, you may employ | adopt the structure which detects the movement of the moving member which reciprocates in a horizontal direction with the movement of the chuck | zipper 11 with the sensor mechanism 50, for example.

DESCRIPTION OF SYMBOLS 10 Treatment liquid supply nozzle 11 Chuck 12 2nd chuck 13 Support part 14 Guide part 21 Rotating shaft 22 Axis 23 Hole 24 Cam plate 25 Connection member 31 1st raising / lowering plate 32 2nd raising / lowering plate 33 Driven magnet 34 Drive magnet 35 Spring 39 Flange part 50 Sensor mechanism 51 Light projecting part 52 Light receiving part 53 Translucent member 54 Translucent member 61 Motor 62 Air cylinder 63 Slider 64 Guide member 71 Moving member 73 Moving member 80 Control part 81 Storage part 91 Rotating chamber 92 Fixed chamber 100 Semiconductor wafer

Claims (4)

A substrate processing apparatus for processing while rotating a substrate,
A rotating chamber that rotates by driving a motor;
A plurality of chucks disposed in the rotating chamber and holding the substrate by contacting an edge of the substrate;
As the driven magnet disposed in the rotating chamber moves, the plurality of chucks move in synchronization between a holding position for holding the substrate and a delivery position where the substrate can be delivered. An opening and closing mechanism disposed in the chamber;
A fixed chamber;
A drive magnet disposed in the fixed chamber for moving the driven magnet;
A moving mechanism for moving the drive magnet;
A light projecting unit that emits light to a moving member that moves as the plurality of chucks move; and a light receiving unit that receives light reflected by the moving member, and the movement from the light projecting unit. A sensor mechanism disposed in the fixed chamber for detecting movement of the moving member from light irradiated to the member and reflected by the moving member and received by the light receiving unit;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1,
A first elevating plate provided with the driven magnet and disposed in the rotating chamber so as to be movable up and down;
A second elevating plate provided with the drive magnet, and disposed opposite to the first elevating plate in the fixed chamber;
The opening / closing mechanism is connected to the plurality of chucks and the first elevating plate, and with the elevating operation of the first elevating plate, the plurality of chucks are transferred to a holding position for holding the substrate and the substrate. Move in sync with possible delivery positions,
The moving mechanism is composed of an elevating mechanism disposed in the fixed chamber for elevating the second elevating plate,
The said sensor mechanism is a substrate processing apparatus which irradiates light to the said 1st raising / lowering board from the said light projection part, and receives the light reflected by the said 1st raising / lowering board by the said light-receiving part. The substrate processing apparatus according to claim 2,
A substrate processing apparatus comprising a spring that biases the first lifting plate in a direction in which the plurality of chucks are directed toward the holding position. In the substrate processing apparatus of Claim 2 or Claim 3,
In the rotating chamber and the fixed chamber, a region between the light projecting unit and the light receiving unit and the first lifting plate is a substrate processing apparatus configured by a translucent member.

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