JP2016022496A - Laser processing apparatus and processing head calibration method for laser processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laser processing apparatus which can determine a laser output by high-precision measurement, and to calibrate a processing head in a short time.SOLUTION: The laser processing apparatus of this invention, which is a laser processing apparatus comprising an actuator that mechanically controls a laser irradiation position and a processing head that scans the laser irradiation position by driving an optical member to execute a processing method so set that the scanning of the laser irradiation position by the processing head may draw a predetermined trajectory at a laser processing part of a workpiece, comprises a luminous quantity sensor that measures a luminous quantity of laser light, a mask where a slit in a shape similar to a part or the whole of the trajectory is formed to restrict an incidence of laser light into the luminous quantity sensor, and trajectory drawing means that controls the processing head to draw a part or the whole of the trajectory on the mask.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a laser processing apparatus and a method for calibrating a processing head provided in the laser processing apparatus.

  In recent years, laser processing has become widespread. In particular, a laser processing head that emits laser light and a workpiece to be laser processed can freely draw a laser trajectory using a galvano mirror or a parallel plate without moving each other and perform laser processing. Laser trepanning has been attracting attention.

  Accordingly, in laser trepanning processing, it is important to measure and determine whether or not a predetermined output of a predetermined beam size (diameter) can reach a predetermined position. When the standard is not reached, it is essential to perform calibration (processing calibration).

  In a conventional laser processing apparatus, there are an off-line processing method and a processing head calibration method using a power meter and a photo detector offline.

  FIG. 13 is an overall configuration diagram of a laser processing apparatus according to the prior art.

  The laser processing apparatus includes a laser oscillation unit 310, a laser power supply unit 312 that supplies laser oscillation power to the laser oscillation unit 310, a control unit 314 that controls each unit in the apparatus and the entire apparatus, and laser output calibration. Optical power monitor unit 318. The control unit 314 controls the laser output of the laser generation unit 325 based on the monitor information from the laser control unit 322 that controls the laser power supply unit 312 according to the predetermined setting value given from the setting unit 320 and the optical power monitor unit 318. And a calibration unit 326 that calibrates related functions.

  The optical power monitor unit 318 includes an optical power meter 28 and a PIN photodiode 330. The output of the pulse laser incident on the optical power monitor unit 318 is fed back to calibrate the output of the laser oscillation unit (see, for example, Patent Document 1).

JP 2013-239572 A

  However, in the conventional process monitoring method, the measurement aperture is one point, and therefore measurement is performed at one point. In laser trepanning processing with high drawability, measurement points are insufficient, and sufficient process monitoring accuracy is obtained. There was a problem that it could not be obtained.

  Specifically, the laser output is measured and calibrated at one point, usually at the machining start point. However, as it is, for example, even if the trepanning head used for laser trepanning machining is tilted, it is detected. Can not. To sense this tilt, it is necessary to move the trepanning head up and down, but it is necessary to fix the focal position at that time, and the trepanning head itself takes time to move up and down, or It is necessary to install a complicated mechanism such as a zoom lens in the optical path. Furthermore, since the shape of the opening is different from the laser processing shape, and the scanning trajectory used for the processing monitor is different from the trajectory used for laser processing, there is a problem that the accuracy of the processing monitor cannot be improved.

  On the other hand, in the conventional machining head calibration method, the trepanning head is misaligned (including rotational misalignment) only from the measurement value obtained from the trepanning head at a certain position. Whether it is tilted or out of focus (ie, misaligned in the vertical plane), and can be used for calibration of the trepanning head, it must be positioned in the horizontal and vertical planes of the trepanning head. It was necessary to repeat the measurement while changing the time, and it took time.

  An object of this invention is to provide the laser processing apparatus which can measure and determine a laser output with high precision, and to calibrate a processing head in a short time.

  In order to solve the above-described problem, a laser processing apparatus according to the present invention includes an actuator that mechanically controls a laser irradiation position, and a processing head unit that drives an optical member to scan the laser irradiation position. A laser processing apparatus for executing a processing method set so that scanning of an irradiation position by the processing head unit in a laser processing portion of an object draws a predetermined locus, and detects the amount of laser light. A slit having a shape similar to a part or all of the trajectory, a mask for limiting the incidence of laser light to the light amount detector, and a part of the trajectory on the mask by controlling the processing head Alternatively, a trajectory drawing unit that draws the whole is provided.

  Further, in the processing head calibration method of the laser processing apparatus according to the present invention, the processing head is controlled, a part or all of the locus is drawn on the mask, the amount of transmitted light from the slit is measured, and the measured amount of light is measured. This is a method for calibrating the position or the like of the machining head based on the measured value.

  With the above configuration, the laser processing apparatus and the processing head calibration method of the laser processing apparatus according to the present invention can detect the positional deviation and focus shift of the processing head, and can realize good laser processing. .

The figure which shows the whole structure of the laser processing apparatus which concerns on embodiment of this invention. The conceptual diagram which shows the structure of the site | part which detects the laser output which concerns on embodiment of this invention 1st explanatory drawing of the method of measuring and judging the laser output in Embodiment 1 of this invention 2nd explanatory drawing of the method of measuring and determining the laser output in Embodiment 1 of this invention 3rd explanatory drawing of the method of measuring and determining the laser output in Embodiment 1 of this invention The flowchart which shows the procedure of the processing head calibration method which concerns on embodiment of this invention. 1st explanatory drawing of the method of measuring and determining the laser output in Embodiment 2 of this invention 2nd explanatory drawing of the method of measuring and determining the laser output in Embodiment 2 of this invention Third explanatory diagram of the method for measuring and judging the laser output in the second embodiment of the present invention 4th explanatory drawing of the method of measuring and judging the laser output in Embodiment 2 of this invention 5th explanatory drawing of the method of measuring and determining the laser output in Embodiment 2 of this invention 6th explanatory drawing of the method of measuring and judging the laser output in Embodiment 2 of this invention Overall configuration diagram of a conventional laser processing apparatus

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, the same components are denoted by the same reference numerals, and the description thereof may be omitted.

(Embodiment 1)
(Embodiment 1)
FIG. 1 is a diagram showing an overall configuration of a laser processing apparatus according to an embodiment of the present invention. FIG. 2 is a conceptual diagram showing a configuration of a part for detecting a laser output according to the embodiment of the present invention. 3, 4, and 5 are explanatory diagrams according to Embodiment 1 of the present invention.

  As shown in FIG. 1, the laser processing apparatus of the present invention includes an actuator 22 that mechanically controls a laser irradiation position, and a trepanning head 21 as a processing head unit that drives the optical member to scan the laser irradiation position. ing. Laser light used for processing is guided to the trepanning head 21 by the optical fiber 23, and scanning of the irradiation position by the trepanning head 21 is drawn in a laser processing portion of the workpiece 24 so as to draw a predetermined drawing locus 25. Is set to In this figure, a circular orbit is drawn.

  Next, referring to FIG. 2, the configuration of the part for detecting the laser output of the present invention will be described.

  The mask 11 is made of copper and has a spherical shape with a diameter of 30 millimeters, a thickness of 5 millimeters, and a curvature radius of 20 millimeters. On the surface, there is an alphabetic C-shaped or Landolt-shaped through slit having a radius of curvature of 7.5 mm so that the center of curvature of the C-shape coincides with the center of the mask 11 with respect to a diameter of 30 mm. Provided.

  The width of the C-shaped slit is 1 mm, and it is provided from 1 o'clock to 5 o'clock counterclockwise when expressed using a clock face. The C-shaped slit ends, i.e., the 1 o'clock and 5 o'clock portions, are arc-shaped with a radius of 0.5 mm, with the center of curvature of the C-shaped slit end coinciding with the 1 o'clock and 5 o'clock positions, respectively. The mask 11 is installed at the incident port of the integrating sphere 12 so as to limit incident light.

  The integrating sphere 12 is made of aluminum and has a spherical shape with an inner diameter of 100 mm and an outer diameter of 127 mm. The integrating sphere 12 has an inner surface coating having a reflectivity of 95% with respect to the wavelength of the laser beam to be used, and the intensity of the incident laser beam. Uniform and attenuate the distribution.

  The exit port of the integrating sphere 12 is provided with a copper aperture 13 having an opening with a diameter of 0.5 millimeters to limit the laser light emitted from the integrating sphere 12.

  A photodetector 14 is installed on the opposite side of the integrating sphere 12 from the aperture 13, and the light emitted from the aperture 13 is measured. The detector of the photodetector 14 is an indium gallium arsenide detector whose rise time is 10 nanoseconds.

  Further, a trepanning head 21 which is a processing head for performing laser processing is installed on a robot wrist shown in another figure, and has a built-in mechanism, preferably two inclined pieces of laser light having a wavelength of 1064 nm. A laser beam is emitted by a mechanism that rotates a parallel plate to freely draw the locus of the laser.

  Thereby, by using the robot body, the robot wrist, and the built-in mechanism of the trepanning head 21, a desired laser beam can be emitted in a desired direction at a desired position, and a desired laser can be freely emitted by continuous irradiation. Drawing can be performed with a light trajectory, and a workpiece, preferably an iron plate, can be laser processed, for example, trepanning processed in accordance with the drawing.

  Regarding the method for measuring and determining the laser output in the laser processing apparatus configured as described above, the operation will be described taking laser trepanning as an example.

  First, the trepanning head 21 standing vertically downwards faces the mask 11 at a reference position. The laser beam emitted from the trepanning head 21 reaches the mask 11 while condensing in accordance with a command signal for controlling the laser beam, and part or all of the laser beam is transmitted through the C-shaped slit of the mask 11 (transmitted). Light) is attenuated and made uniform by the integrating sphere 12, further attenuated by the aperture 13, and reaches the photodetector 14. The photodetector 14 outputs a voltage according to the amount of received laser light.

  The waveform of the voltage, that is, the change in output voltage over time is recorded by a waveform analysis device (not shown) such as an oscilloscope. The waveform analyzer also records the command signal waveform. The waveform analyzer is connected to a control device of a laser oscillator (not shown) that supplies laser light to the trepanning head 21, and a control device of a robot (not shown) that holds and moves the trepanning head 21, and the waveform analyzer Each control device is controlled by a signal from.

  First, as a first example, a case where the machining position, the beam diameter, and the laser output are normal at a laser machining point will be described with reference to FIG.

  The trepanning head 21 faces the mask 11 at a reference position. The laser beam emitted from the trepanning head 21 has a low output (preferably 1 watt) in accordance with a command signal for controlling the laser beam, and a beam diameter (for example, 86.5 against energy) used for processing on the mask 11. The trajectory of a laser of a circle with a diameter of 15 mm with the same beam diameter as the% beam diameter (0.6 mm) takes 240 milliseconds so that its center coincides with the center of the mask, and is used for processing. That is, a C-shaped trajectory is drawn.

  The locus of the laser at that time and the waveform in the waveform analyzer are shown in FIG. In FIG. 3, the laser beam starts irradiation from a laser irradiation start point indicated by a black dot. At that time, the output voltage of the photodetector 14 recorded by the waveform analyzer rises almost simultaneously with the command signal and is turned off when the command signal on time is 240 milliseconds. That is, the on time of the output voltage is 240 milliseconds.

  Further, since the C-shaped slit width is larger than the beam diameter, the entire energy of the laser light passes through the mask. The output voltage of the photodetector 14 at this time is set as a reference voltage. Similarly, the output voltage of the photodetector 14 obtained at a high output, preferably 4 kilowatts, is set to a large reference voltage. These output voltage waveforms, delay, ON time, reference voltage, and reference voltage large are stored in the waveform analyzer and can be compared with measured values as needed.

  Next, an example in which the trepanning head 21 has a normal inclination and stands upright in the vertical direction, but the trepanning head 21 is rotationally displaced and the processing position is displaced will be described with reference to FIG. To do.

  The trepanning head 21 has the same beam diameter as that used for processing on the mask 11 on the mask 11 in accordance with a command signal for controlling the laser beam at a reference position with respect to the mask 11. Irradiation and drawing are carried out in a trajectory of a C-shaped laser having an energy of 86.5% and a beam diameter of 0.6 mm, and taking 240 milliseconds.

  FIG. 4 shows the locus of the laser at that time and the waveform in the waveform analyzer. In FIG. 4, the laser beam starts irradiation from the laser irradiation start point indicated by a black dot. However, since the position shift occurs, there is a delay with respect to the command signal. Similarly, since there is a displacement in the machining end position, there is a difference in the end time with respect to the command signal. Further, since a part of the locus of the C-shaped laser does not enter the C-shaped slit, the output voltage waveform of the photodetector 14 is not one rectangle but two small rectangles. These are compared with normal values to determine whether they are normal or abnormal.

  Further, as an example of a different positional deviation, a case where the trepanning head 21 does not cause a positional deviation of the processing start point but has an abnormal inclination and is not upright with respect to the vertically downward direction will be described with reference to FIG. explain.

  The trepanning head 21 has the same beam diameter as that used for processing on the mask 11 on the mask 11 in accordance with a command signal for controlling the laser beam at a reference position with respect to the mask 11. Irradiation and drawing are carried out in a trajectory of a C-shaped laser having an energy of 86.5% and a beam diameter of 0.6 mm, and taking 240 milliseconds.

  The locus of the laser at that time and the waveform in the waveform analyzer are shown in FIG. In FIG. 5, the laser beam starts irradiation from the laser irradiation start point indicated by a black dot, but since there is no positional shift, there is no delay with respect to the command signal. Similarly, since there is no position shift at the machining end position, there is no difference in the end time with respect to the command signal. On the other hand, since a part of the locus of the C-shaped laser does not enter the C-shaped slit, the output voltage waveform of the photodetector 14 is not one rectangle but two rectangles. These are compared with normal values to determine whether they are normal or abnormal.

  Although the slit shape of the mask 11 is a C-shape, it may be a cross shape, a semicircular shape, a spiral shape, or a linear shape in accordance with laser processing. Although the slit width is 1 mm, it may be changed according to the beam diameter, or may be adjusted to the processing width (for example, heat affected zone width) of the workpiece.

  Further, the thickness of the mask 11 may be determined by the required resolution of the tilt angle of the trepanning head 21, and the radius of curvature of the mask 11 may be determined by the required return light amount from the mask 11 to the trepanning head 21.

  As described above, a laser locus is drawn on a mask having a slit, and the transmitted light is measured, analyzed, and compared, so that the positional deviation and inclination of the laser trepanning head can be known separately. In addition, the same locus as that of the laser beam used for laser processing is analyzed as an object to measure and judge the laser output, so the positional deviation, tilting and defocusing of the processing head used for processing are accurate. It can be grasped well, and the accuracy of measuring and judging the laser output is high. In addition, since the mask is spherical, the return light from the mask is difficult to return to the laser trepanning head.

(Embodiment 2)
In the present embodiment, points that are the same as those in the first embodiment are simplified or omitted, and different portions will be described. Further, the same reference numerals are assigned to the same components.

  In FIG. 6, the processing head calibration method of the trepanning head 21 is shown by a flowchart. FIG. 7, FIG. 8, FIG. 9, FIG. 10, FIG. 11, and FIG. 12 are explanatory diagrams in the second embodiment of the present invention for explaining an example shown in the flowchart. 11 is a top view, a laser trajectory, a laser command voltage waveform, and a waveform of an output voltage of the photodetector 14 corresponding to the command voltage, and a black dot indicates a laser irradiation start point.

  The difference from Embodiment 1 is that the locus of the laser is not a C-shape but a circle. Since the time required to draw one circle is 360 milliseconds, the on time of the command voltage is 360 milliseconds, but the output voltage of the photodetector 14 is the time that the laser light passes through the slit, that is, 360 milliseconds. Two thirds of 240 milliseconds is the specified value for the end time.

  The operation of the method for measuring and determining the laser output of the laser processing apparatus configured as described above will be described.

  First, the trepanning head 21 moves to a reference point facing the mask 11. Draw a predetermined laser trajectory at a specified low power, preferably less than 1 watt. As a result, it is determined whether the start delay of the photodetector 14 output voltage with respect to the start of the laser command voltage is within a specified value.

  If it is not within the specified value, it is considered that the trepanning head 21 is displaced at least in the horizontal plane. Therefore, the position in the horizontal plane is changed, and a predetermined laser trajectory is drawn and determined again at a specified low output. This loop is repeated until it falls within the specified value.

  For example, suppose that the waveform of the output voltage of the photodetector 14 in FIG. 7 is obtained. Since the start delay of the output voltage of the photodetector 14 relative to the start of the laser command voltage is not within the specified value, it can be considered that the horizontal displacement of the trepanning head 21 has occurred.

  FIG. 8 is an explanatory diagram when the delay judgment loop of FIG. 6 is completed. In FIG. 8, since the delay is within a specified value, it can be considered that the horizontal displacement of the trepanning head 21 does not occur.

  Next, according to the determination of the end of the flowchart in FIG. 6, it is determined whether or not the end time of the output voltage of the photodetector 14 with respect to the start of the laser command voltage is within a specified value.

  If it is not within the specified value, the trepanning head 21 is considered to have a rotational displacement in the horizontal plane, so the rotational angle in the horizontal plane is changed while maintaining the target position on the mask 11, and again, The loop of drawing, delaying and ending the predetermined laser trajectory at a specified low output is repeated until it falls within the specified value. FIG. 9 is an explanatory diagram when the flowchart end judgment loop is completed. In FIG. 9, since the delay is within a specified value, it can be considered that there is no rotational displacement of the trepanning head 21 in the horizontal plane.

  Next, according to the determination of the flowchart rectangle in FIG. 6, it is determined whether or not the waveform of the output voltage of the photodetector 14 is one, that is, whether the peak voltage is a flat rectangle.

  When the output voltage waveform is not rectangular, for example, two or more rectangles, the laser trajectory can be considered to be an ellipse because it crosses the mask 11 slit twice or more, for example, one trapezoid, When the peak voltage is a waveform that uniquely increases or decreases, it can be considered that the laser light passing through the mask 11 is obliquely incident. For example, one M-shaped waveform, that is, the peak voltage is unique. If the waveform increases after decreasing, it can be considered that the slit has been passed through the slit twice at an oblique incidence.

  Accordingly, when the waveform of the command voltage is rectangular but the waveform of the output voltage of the photodetector 14 is not rectangular, that is, when the waveform similarity is not within the specified range, the trepanning head 21 is tilted. Since it can be considered, the tilt is changed while the target position on the mask 11 is maintained, a predetermined laser output is drawn again at a specified low output, and a loop of delay, end and rectangle judgment is performed. Repeat until the specified value is reached.

  FIG. 10 shows a state in the middle of the loop, and shows how the laser trajectory is closer to a circle by correcting the tilting of the trepanning head 21.

  FIG. 11 is an explanatory diagram when the rectangular determination loop of FIG. 6 is completed. In FIG. 11, since the peak voltage of the output voltage of the photodetector 14 does not reach the reference voltage, it can be considered that the focal position of the trepanning head 21 is shifted.

  In accordance with the determination of the reference voltage in the flowchart of FIG. 6, it is determined whether or not the peak voltage of the photodetector 14 output voltage has reached the reference voltage.

  When the peak voltage of the output voltage of the photodetector 14 does not reach the reference voltage, the trepanning head 21 is moved vertically up and down to draw the laser trajectory each time. The loop is repeated until it falls within the specified value. However, if the reference voltage is not reached even if the number of times exceeds the predetermined number, preferably 10 times, it can be considered that the laser output for processing is reduced, the loop is terminated, Is displayed, and the calibration of the second embodiment is completed.

  When the peak voltage of the photodetector 14 output voltage has reached the reference voltage in accordance with the determination of the reference voltage in the flowchart of FIG. 6, the specified high power used for processing, for example, a high output of 4000 watts and the same laser as the low output Draw a trajectory. Then, it is determined whether or not the peak voltage of the output voltage of the photodetector 14 has reached a large reference voltage.

  When the peak voltage of the output voltage of the photodetector 14 does not reach the reference voltage, the trepanning head 21 is moved vertically in the vertical plane with respect to the mask, and the laser trajectory is drawn each time. It repeats until the peak voltage of the photodetector 14 output voltage reaches a large reference voltage. However, when the number of times exceeds a predetermined number, for example, 10 times, the reference voltage is not reached, it can be considered that the laser output to be used for processing is lowered, the loop is terminated, A message to that effect is displayed and the calibration of the second embodiment is completed.

  When the peak voltage of the output voltage of the photodetector 14 reaches the reference voltage high, the position is set as a calibration position, a display indicating that it is normal is displayed, and the calibration of the second embodiment is completed. FIG. 12 is an explanatory diagram at this time.

  Instead of the end determination loop, a loop until the maximum end time is obtained may be used. Further, a loop for obtaining the head vertical position that gives the maximum voltage without using the reference voltage or the large reference voltage as a criterion may be used.

  In this embodiment, when the reference voltage or the reference voltage is not reached within the specified number of times, the calibration is completed as an abnormality, but the output is increased under a certain limit, and the reference voltage or the reference voltage is increased. A machining head calibration method for reaching a large value or a machining head calibration method for determining whether the output is increased under a certain condition to reach a reference voltage or a large reference voltage may be used.

  Further, in this embodiment, the process of calibrating the position of the machining head from the start delay time, the process of calibrating the rotation angle of the machining head from the end delay time, and the process of calibrating the angle formed by the machining head from the similarity of the waveforms. Although the calibration method to be performed has been described, each calibration step may be performed independently.

  As described above, the position of the laser trepanning head is measured by drawing a laser trajectory on a mask with slits, measuring, analyzing, and comparing the transmitted light delay, end time difference, and similarity to the command voltage. Displacement and inclination can be known separately, and further, the machining head position deviation can be calibrated corresponding to each of delay, end time difference, and degree of similarity to command voltage, and then focus deviation is detected and calibrated. Thus, unnecessary reflection from the mask can be suppressed.

  The laser processing apparatus and the processing head calibration method of the laser processing apparatus according to the present invention can measure and judge the laser output with high accuracy, and can calibrate the processing head in a short time. Useful in processing equipment and the like.

DESCRIPTION OF SYMBOLS 10 Laser processing apparatus 11 Mask 12 Integrating sphere 13 Aperture 21 Trepanning head 22 Actuator 23 Optical fiber 24 Workpiece 25 Drawing locus

Claims (9)

An actuator for mechanically controlling the laser irradiation position;
A processing head unit that drives the optical member to scan the laser irradiation position,
A laser processing apparatus that executes a processing method that is set so as to draw a predetermined trajectory of scanning of an irradiation position by the processing head unit in a laser processing part of a workpiece,
A light amount detector for measuring the amount of laser light;
A mask having a shape similar to part or all of the locus, and a mask for limiting the incidence of laser light on the light amount detector,
A laser processing apparatus comprising: a locus drawing unit that controls the machining head to draw a part or all of the locus on the mask.   The laser processing apparatus according to claim 1, wherein the light quantity detector includes an integrating sphere for uniformizing and outputting incident laser light. 3. The laser processing apparatus according to claim 1, wherein a width of the slit is 1.5 times a beam diameter of 86.5% of a laser beam used for the laser processing.
  The laser processing apparatus according to claim 1, wherein a width of the slit is a heat-affected zone width of a laser processing portion of the workpiece.   The laser processing apparatus according to claim 1, wherein the locus is a circular orbit. A method for calibrating a processing head of a laser processing apparatus according to claim 1,
A first locus drawing step for controlling the processing head to draw a part or all of the locus on the mask;
A first light amount measuring step for measuring the amount of light transmitted through the slit;
Processing of a laser processing apparatus comprising a first calibration step of calibrating the position of the processing head and the output of the laser beam used for the laser processing based on the measurement value of the light amount measured in the first light amount measurement step Head calibration method. A method for calibrating a processing head of a laser processing apparatus according to claim 1,
A second locus drawing step of controlling the processing head and drawing a part or all of the locus on the mask;
A second light amount measurement step for measuring the amount of light transmitted through the slit;
A start delay time for calculating a start delay time that is a difference between the start time of the second locus drawing step and the rise time of the light amount measurement value based on the measurement value of the light amount measured in the second light amount measurement step. A calculation process;
A machining head calibration method for a laser machining apparatus, comprising: a second calibration step for calibrating the position of the machining head in a plane parallel to the mask so that the start delay time is 0 to a predetermined value or less. A method for calibrating a processing head of a laser processing apparatus according to claim 1,
A second locus drawing step of controlling the processing head and drawing a part or all of the locus on the mask;
A second light amount measurement step for measuring the amount of light transmitted through the slit;
Based on the measurement value of the light quantity measured in the second light quantity measurement step, an end delay time that is a difference between the estimated end time calculated from the locus and the shape of the slit and the detection end time of the light quantity measurement value is calculated. An end delay time calculating step to calculate,
A machining head calibration method for a laser machining apparatus, comprising: a third calibration step for calibrating the rotation angle of the machining head in a plane parallel to the mask so that the end delay time is 0 to a predetermined value or less. A method for calibrating a processing head of a laser processing apparatus according to claim 1,
A second locus drawing step of controlling the processing head and drawing a part or all of the locus on the mask;
A second light amount measurement step for measuring the amount of light transmitted through the slit;
A waveform similarity calculation step of calculating a similarity between the output waveform of the command signal and the waveform of the light amount measurement value with respect to the time axis based on the measurement value of the light amount measured in the second light amount measurement step;
A machining head calibration method for a laser machining apparatus, comprising: a fourth calibration step for calibrating an angle formed by the mask and the machining head so that the similarity of the waveform falls within a predetermined range.

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