JP2016016486A5

JP2016016486A5 -

Info

Publication number: JP2016016486A5
Application number: JP2014141044A
Authority: JP
Filing date: 2014-07-09
Publication date: 2016-12-22
Anticipated expiration: 2034-07-09

Description

前記の目的を達成するために、本発明は、メッキ層を介して台金に固着された砥粒を有する電着砥石において、
前記メッキ層は、前記台金に指向して陥没し前記砥粒の一部を該メッキ層から露呈させる凹部と、前記砥粒を挟んで前記凹部の反対側に形成され、且つ他の部位に比して層厚が大きな層厚部とを有することを特徴とする。
In order to achieve the above object, the present invention provides an electrodeposition grindstone having abrasive grains fixed to a base metal through a plating layer,
The plating layer is formed on the opposite side of the concave portion with the abrasive grains sandwiched between the concave portion that exposes a part of the abrasive grains from the plating layer and that is depressed toward the base metal. It has a layer thickness part with a larger layer thickness than that .

また、本発明は、メッキ層を介して台金に砥粒を固着する電着砥石の製造方法において、
前記砥粒が付着した前記台金をメッキ処理槽内に収容する工程と、
前記メッキ処理槽内でメッキ液を前記砥粒に対して相対的に流動させながらメッキ処理を行い、前記砥粒を前記台金に固着するためのメッキ層を形成する工程と、
を有し、
前記メッキ液を前記砥粒に衝突させることで、前記メッキ層を、前記台金に指向して陥没し前記砥粒の一部を該メッキ層から露呈させる凹部と、前記砥粒を挟んで前記凹部の反対側に形成され、且つ他の部位に比して層厚が大きな層厚部とを有するものとして形成することを特徴とする。
Further, the present invention is an electrodeposition grindstone manufacturing method for fixing abrasive grains to a base metal via a plating layer.
Storing the base metal to which the abrasive grains are attached in a plating tank;
Performing a plating process while flowing a plating solution relative to the abrasive grains in the plating tank, and forming a plating layer for fixing the abrasive grains to the base metal;
Have
By causing the plating solution to collide with the abrasive grains, the plating layer is depressed toward the base metal, and a concave portion that exposes a part of the abrasive grains from the plating layer, and the abrasive grains sandwiched therebetween It is formed on the opposite side of the concave portion and has a layer thickness portion that is thicker than other portions .

Claims

In the electrodeposition grindstone having abrasive grains fixed to the base metal through the plating layer,
The plating layer is formed on the opposite side of the concave portion with the abrasive grains sandwiched between the concave portion that exposes a part of the abrasive grains from the plating layer and that is depressed toward the base metal. An electrodepositing grindstone characterized by having a layer thickness portion having a larger layer thickness .

In electrodeposition grindstone according to claim 1, wherein the plating layer is further electrodeposited grindstone layer thickness as a starting point the thickness portion and said Rukoto to have a layer thickness change portion gradually reduced.

The electrodeposition grindstone according to claim 2, wherein the depth of the concave portion of the plating layer is 5 to 35% of the average particle diameter of the abrasive grains, and the maximum layer thickness of the layer thickness changing portion is the plating layer. An electrodeposition grindstone characterized by being 5 to 25% larger than the average particle size of the abrasive grains than the layer thickness of the flat portion.

The electrodeposition grindstone according to any one of claims 1 to 3, wherein the adjacent abrasive grains are separated by a distance of at least twice the average grain size of the abrasive grains. Whetstone.

The electrodeposition grindstone according to any one of claims 1 to 4, wherein the plating layer includes a brightening material.

In the manufacturing method of the electrodeposition grindstone that fixes the abrasive grains to the base metal through the plating layer,
Storing the base metal to which the abrasive grains are attached in a plating tank;
Performing a plating process while flowing a plating solution relative to the abrasive grains in the plating tank, and forming a plating layer for fixing the abrasive grains to the base metal;
Have
By causing the plating solution to collide with the abrasive grains, the plating layer is depressed toward the base metal, and a concave portion that exposes a part of the abrasive grains from the plating layer, and the abrasive grains sandwiched therebetween A method for producing an electrodeposition grindstone, characterized in that the electrodeposition grindstone is formed on the opposite side of the concave portion and has a layer thickness portion having a larger layer thickness than other portions .

The manufacturing method according to claim 6, the plating layer, the electrodeposition grindstone, characterized in that thickness is formed as shall further having a layer thickness changing portion which progressively reduces as a starting point the thickness portion Production method.

8. The electrodeposition method according to claim 6, wherein the adjacent abrasive grains are adhered to the base metal so as to be separated by a distance of twice or more the average grain size of the abrasive grains. A manufacturing method of a grindstone.

The method for manufacturing an electrodeposition grindstone according to any one of claims 6 to 8, wherein the plating solution contains a brightening material.