JP2016003181A5 - - Google Patents

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JP2016003181A5
JP2016003181A5 JP2015117569A JP2015117569A JP2016003181A5 JP 2016003181 A5 JP2016003181 A5 JP 2016003181A5 JP 2015117569 A JP2015117569 A JP 2015117569A JP 2015117569 A JP2015117569 A JP 2015117569A JP 2016003181 A5 JP2016003181 A5 JP 2016003181A5
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Japan
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brittle material
material substrate
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JP2015117569A
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English (en)
Japanese (ja)
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JP6551661B2 (ja
JP2016003181A (ja
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Priority claimed from TW103121259A external-priority patent/TWI527674B/zh
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JP2015117569A 2014-06-19 2015-06-10 脆性材料基板のスクライブ方法及びスクライブ装置 Expired - Fee Related JP6551661B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW103121259A TWI527674B (zh) 2014-06-19 2014-06-19 脆性材料基板之刻劃方法及裝置
TW103121259 2014-06-19

Publications (3)

Publication Number Publication Date
JP2016003181A JP2016003181A (ja) 2016-01-12
JP2016003181A5 true JP2016003181A5 (enExample) 2018-07-05
JP6551661B2 JP6551661B2 (ja) 2019-07-31

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ID=54944545

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015117569A Expired - Fee Related JP6551661B2 (ja) 2014-06-19 2015-06-10 脆性材料基板のスクライブ方法及びスクライブ装置

Country Status (4)

Country Link
JP (1) JP6551661B2 (enExample)
KR (1) KR20150145711A (enExample)
CN (1) CN105196423B (enExample)
TW (1) TWI527674B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3361839A1 (en) * 2017-02-14 2018-08-15 Infineon Technologies AG Multiple substrate and method for its fabrication
CN107538630A (zh) * 2017-07-14 2018-01-05 合肥文胜新能源科技有限公司 一种用于硅片切割的装置
CN107379292B (zh) * 2017-09-15 2019-07-02 京东方科技集团股份有限公司 显示面板的切割方法、系统和存储介质
TWI774883B (zh) * 2017-12-26 2022-08-21 日商三星鑽石工業股份有限公司 黏合基板的劃線方法以及劃線裝置
JP2021154502A (ja) * 2020-03-25 2021-10-07 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク方法並びに基板加工装置
KR102457343B1 (ko) * 2020-12-14 2022-10-21 한국미쯔보시다이아몬드공업(주) 단자부를 갖는 접합 취성 기판의 스크라이빙 방법

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000280234A (ja) * 1999-01-28 2000-10-10 Canon Inc 基板の切断方法
KR100573986B1 (ko) * 2001-07-18 2006-04-25 미쓰보시 다이야몬도 고교 가부시키가이샤 스크라이브 헤드 및 그 스크라이브 헤드를 이용한 스크라이브 장치 및 스크라이브 방법
JP2003212579A (ja) * 2002-01-24 2003-07-30 Nakamura Tome Precision Ind Co Ltd 硬質脆性板のクロススクライブ方法及び装置
JP5076662B2 (ja) * 2007-06-13 2012-11-21 澁谷工業株式会社 脆性材料の割断方法およびその装置
JP5139852B2 (ja) * 2008-03-17 2013-02-06 三星ダイヤモンド工業株式会社 スクライブ装置及びスクライブ方法
JP2011088382A (ja) * 2009-10-23 2011-05-06 Mitsuboshi Diamond Industrial Co Ltd ブレイク装置およびブレイク方法
JP2011155151A (ja) * 2010-01-27 2011-08-11 Mitsuboshi Diamond Industrial Co Ltd 薄膜太陽電池用スクライブ装置
JP2011178054A (ja) * 2010-03-02 2011-09-15 Ihi Corp 脆性材料の割断装置及び割断方法
JP5156080B2 (ja) * 2010-11-05 2013-03-06 三星ダイヤモンド工業株式会社 貼り合せ基板のスクライブ方法
JP5479424B2 (ja) * 2011-09-30 2014-04-23 三星ダイヤモンド工業株式会社 脆性材料用スクライビングホイール、これを用いた脆性材料基板のスクライブ装置及びスクライブ工具
JP2013159540A (ja) * 2012-02-08 2013-08-19 Mitsuboshi Diamond Industrial Co Ltd スクライブ装置

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