JP2015530717A - 基板間電子通信におけるクロストークの低減 - Google Patents
基板間電子通信におけるクロストークの低減 Download PDFInfo
- Publication number
- JP2015530717A JP2015530717A JP2015531272A JP2015531272A JP2015530717A JP 2015530717 A JP2015530717 A JP 2015530717A JP 2015531272 A JP2015531272 A JP 2015531272A JP 2015531272 A JP2015531272 A JP 2015531272A JP 2015530717 A JP2015530717 A JP 2015530717A
- Authority
- JP
- Japan
- Prior art keywords
- midplane
- card assembly
- connector
- signal
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
- H05K7/1439—Back panel mother boards
- H05K7/1444—Complex or three-dimensional-arrangements; Stepped or dual mother boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1424—Card cages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
- H05K7/1459—Circuit configuration, e.g. routing signals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0062—Structures of standardised dimensions, e.g. 19" rack, chassis for servers or telecommunications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Computer Networks & Wireless Communication (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Cable Transmission Systems, Equalization Of Radio And Reduction Of Echo (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261697711P | 2012-09-06 | 2012-09-06 | |
| US61/697,711 | 2012-09-06 | ||
| US201361798800P | 2013-03-15 | 2013-03-15 | |
| US201361798395P | 2013-03-15 | 2013-03-15 | |
| US61/798,800 | 2013-03-15 | ||
| US61/798,395 | 2013-03-15 | ||
| PCT/US2013/058645 WO2014039924A1 (en) | 2012-09-06 | 2013-09-06 | Reducing crosstalk in board-to-board electronic communication |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2015530717A true JP2015530717A (ja) | 2015-10-15 |
Family
ID=50237641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015531272A Pending JP2015530717A (ja) | 2012-09-06 | 2013-09-06 | 基板間電子通信におけるクロストークの低減 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20150181774A1 (enExample) |
| EP (1) | EP2893457A4 (enExample) |
| JP (1) | JP2015530717A (enExample) |
| CN (1) | CN104854573A (enExample) |
| IN (1) | IN2015DN02749A (enExample) |
| WO (1) | WO2014039924A1 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9907156B1 (en) | 2015-03-06 | 2018-02-27 | Juniper Networks, Inc. | Cross-talk reduction for high speed signaling at ball grid array region and connector region |
| US10283885B2 (en) * | 2015-11-06 | 2019-05-07 | Foxconn Interconnect Technology Limited | Electrical connector assembly and system using the same |
| US10390462B2 (en) * | 2017-02-16 | 2019-08-20 | Dell Products, Lp | Server chassis with independent orthogonal airflow layout |
| JP7091203B2 (ja) | 2018-09-19 | 2022-06-27 | キオクシア株式会社 | メモリシステムおよび制御方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0548278A (ja) * | 1991-08-09 | 1993-02-26 | Toshiba Corp | スロツト挿入型信号処理ボード |
| JP2002540573A (ja) * | 1999-03-25 | 2002-11-26 | インレインジ テクノロジーズ コーポレイション | 中央平面で交差するスイッチの幾何学的な形態 |
| JP2003304045A (ja) * | 2002-04-12 | 2003-10-24 | Nec Corp | マザーボード |
| JP2005251965A (ja) * | 2004-03-04 | 2005-09-15 | Mitsubishi Electric Corp | 基板の接続構造 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6325636B1 (en) * | 2000-07-20 | 2001-12-04 | Rlx Technologies, Inc. | Passive midplane for coupling web server processing cards with a network interface(s) |
| US6757177B2 (en) * | 2001-07-05 | 2004-06-29 | Tropic Networks Inc. | Stacked backplane assembly |
| US6968413B2 (en) * | 2002-10-07 | 2005-11-22 | International Business Machines Corporation | Method and system for configuring terminators in a serial communication system |
| US7154902B1 (en) * | 2002-10-21 | 2006-12-26 | Force10 Networks, Inc. | Epoch-based packet switching |
| US6814582B2 (en) * | 2002-11-08 | 2004-11-09 | Force Computers, Inc. | Rear interconnect blade for rack mounted systems |
| US7189926B2 (en) * | 2004-08-04 | 2007-03-13 | P-Two Industries Inc. | Low voltage differential signal (LVDS) interface flexible flat cable (FFC) and LVDS signal transmission system using the same |
| US8307265B2 (en) * | 2009-03-09 | 2012-11-06 | Intel Corporation | Interconnection techniques |
| CN101799973A (zh) * | 2010-01-26 | 2010-08-11 | 华为技术有限公司 | 一种信号传输电路及方法 |
| US8724678B2 (en) * | 2010-05-28 | 2014-05-13 | Aquantia Corporation | Electromagnetic interference reduction in wireline applications using differential signal compensation |
-
2013
- 2013-09-06 EP EP13836026.8A patent/EP2893457A4/en not_active Withdrawn
- 2013-09-06 WO PCT/US2013/058645 patent/WO2014039924A1/en not_active Ceased
- 2013-09-06 JP JP2015531272A patent/JP2015530717A/ja active Pending
- 2013-09-06 IN IN2749DEN2015 patent/IN2015DN02749A/en unknown
- 2013-09-06 CN CN201380052555.4A patent/CN104854573A/zh active Pending
-
2015
- 2015-03-05 US US14/639,605 patent/US20150181774A1/en not_active Abandoned
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0548278A (ja) * | 1991-08-09 | 1993-02-26 | Toshiba Corp | スロツト挿入型信号処理ボード |
| JP2002540573A (ja) * | 1999-03-25 | 2002-11-26 | インレインジ テクノロジーズ コーポレイション | 中央平面で交差するスイッチの幾何学的な形態 |
| JP2003304045A (ja) * | 2002-04-12 | 2003-10-24 | Nec Corp | マザーボード |
| JP2005251965A (ja) * | 2004-03-04 | 2005-09-15 | Mitsubishi Electric Corp | 基板の接続構造 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104854573A (zh) | 2015-08-19 |
| EP2893457A4 (en) | 2016-05-04 |
| US20150181774A1 (en) | 2015-06-25 |
| IN2015DN02749A (enExample) | 2015-08-28 |
| WO2014039924A1 (en) | 2014-03-13 |
| EP2893457A1 (en) | 2015-07-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20150181760A1 (en) | Axially aligned electronic chassis | |
| US7929310B2 (en) | Cell board interconnection architecture | |
| TWI648613B (zh) | Routing component and system using routing component | |
| US7764511B2 (en) | Multidirectional configurable architecture for multi-processor system | |
| US10925167B2 (en) | Modular expansion card bus | |
| CN101452324B (zh) | 数据处理系统 | |
| CN103503590B (zh) | 用于通信设备的散热系统 | |
| US9837736B2 (en) | Printed circuit board comprising blind press-fit vias | |
| CN105474474A (zh) | 具有热表面的连接器系统 | |
| CN107005493B (zh) | 减少网络交换机板上高速信号的迹线长度和插入损耗 | |
| US8599564B2 (en) | Server architecture | |
| CN107241857B (zh) | 一种印刷电路板和通信设备 | |
| CN106855847B (zh) | 多插槽的插入式卡 | |
| CN110888498B (zh) | 计算装置及快速周边组件互连基板 | |
| TW201820945A (zh) | 使用模組化vpx技術的電子介面 | |
| US10353442B2 (en) | Expansion slot interface | |
| CN113050764B (zh) | 可折叠机板及数据信号传递方法 | |
| JP2015530717A (ja) | 基板間電子通信におけるクロストークの低減 | |
| US8597032B2 (en) | Electronic assemblies mating system | |
| CN105027518B (zh) | 用于通信设备的互连系统 | |
| CN119356492A (zh) | 服务器 | |
| US20080025007A1 (en) | Partially plated through-holes and achieving high connectivity in multilayer circuit boards using the same | |
| US11317533B2 (en) | Heat sink arrangements for data storage systems | |
| US20230098634A1 (en) | Right-angled orthogonal connector assembly having a wire termination to a high-speed cable | |
| JP2006520959A (ja) | セルラーコンピュータシステム |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20150427 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150819 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20160226 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160322 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20161108 |