CN104854573A - 减小板到板电子通信中的串扰 - Google Patents

减小板到板电子通信中的串扰 Download PDF

Info

Publication number
CN104854573A
CN104854573A CN201380052555.4A CN201380052555A CN104854573A CN 104854573 A CN104854573 A CN 104854573A CN 201380052555 A CN201380052555 A CN 201380052555A CN 104854573 A CN104854573 A CN 104854573A
Authority
CN
China
Prior art keywords
card assembly
connector
midplane
signal
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201380052555.4A
Other languages
English (en)
Chinese (zh)
Inventor
艾伯特·G·贝兹
唐保罗·C·斯蒂芬丝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Encyclopaedia Holds Co
Original Assignee
Encyclopaedia Holds Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Encyclopaedia Holds Co filed Critical Encyclopaedia Holds Co
Publication of CN104854573A publication Critical patent/CN104854573A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1439—Back panel mother boards
    • H05K7/1444—Complex or three-dimensional-arrangements; Stepped or dual mother boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1424—Card cages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1459—Circuit configuration, e.g. routing signals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0062—Structures of standardised dimensions, e.g. 19" rack, chassis for servers or telecommunications
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Cable Transmission Systems, Equalization Of Radio And Reduction Of Echo (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
CN201380052555.4A 2012-09-06 2013-09-06 减小板到板电子通信中的串扰 Pending CN104854573A (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201261697711P 2012-09-06 2012-09-06
US61/697,711 2012-09-06
US201361798800P 2013-03-15 2013-03-15
US201361798395P 2013-03-15 2013-03-15
US61/798,800 2013-03-15
US61/798,395 2013-03-15
PCT/US2013/058645 WO2014039924A1 (en) 2012-09-06 2013-09-06 Reducing crosstalk in board-to-board electronic communication

Publications (1)

Publication Number Publication Date
CN104854573A true CN104854573A (zh) 2015-08-19

Family

ID=50237641

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380052555.4A Pending CN104854573A (zh) 2012-09-06 2013-09-06 减小板到板电子通信中的串扰

Country Status (6)

Country Link
US (1) US20150181774A1 (enExample)
EP (1) EP2893457A4 (enExample)
JP (1) JP2015530717A (enExample)
CN (1) CN104854573A (enExample)
IN (1) IN2015DN02749A (enExample)
WO (1) WO2014039924A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106684595A (zh) * 2015-11-06 2017-05-17 富士康(昆山)电脑接插件有限公司 电连接器组件及使用该电连接器组件的电连接系统

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9907156B1 (en) 2015-03-06 2018-02-27 Juniper Networks, Inc. Cross-talk reduction for high speed signaling at ball grid array region and connector region
US10390462B2 (en) * 2017-02-16 2019-08-20 Dell Products, Lp Server chassis with independent orthogonal airflow layout
JP7091203B2 (ja) 2018-09-19 2022-06-27 キオクシア株式会社 メモリシステムおよび制御方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040092168A1 (en) * 2002-11-08 2004-05-13 Force Computers, Inc. Rear interconnect blade for rack mounted systems
US7154902B1 (en) * 2002-10-21 2006-12-26 Force10 Networks, Inc. Epoch-based packet switching
CN101799973A (zh) * 2010-01-26 2010-08-11 华为技术有限公司 一种信号传输电路及方法
US20100229071A1 (en) * 2009-03-09 2010-09-09 Ilango Ganga Interconnections techniques

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0548278A (ja) * 1991-08-09 1993-02-26 Toshiba Corp スロツト挿入型信号処理ボード
US6816486B1 (en) * 1999-03-25 2004-11-09 Inrange Technologies Corporation Cross-midplane switch topology
US6325636B1 (en) * 2000-07-20 2001-12-04 Rlx Technologies, Inc. Passive midplane for coupling web server processing cards with a network interface(s)
US6757177B2 (en) * 2001-07-05 2004-06-29 Tropic Networks Inc. Stacked backplane assembly
JP4258168B2 (ja) * 2002-04-12 2009-04-30 日本電気株式会社 マザーボード
US6968413B2 (en) * 2002-10-07 2005-11-22 International Business Machines Corporation Method and system for configuring terminators in a serial communication system
JP2005251965A (ja) * 2004-03-04 2005-09-15 Mitsubishi Electric Corp 基板の接続構造
US7189926B2 (en) * 2004-08-04 2007-03-13 P-Two Industries Inc. Low voltage differential signal (LVDS) interface flexible flat cable (FFC) and LVDS signal transmission system using the same
US8724678B2 (en) * 2010-05-28 2014-05-13 Aquantia Corporation Electromagnetic interference reduction in wireline applications using differential signal compensation

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7154902B1 (en) * 2002-10-21 2006-12-26 Force10 Networks, Inc. Epoch-based packet switching
US20040092168A1 (en) * 2002-11-08 2004-05-13 Force Computers, Inc. Rear interconnect blade for rack mounted systems
US20100229071A1 (en) * 2009-03-09 2010-09-09 Ilango Ganga Interconnections techniques
CN101799973A (zh) * 2010-01-26 2010-08-11 华为技术有限公司 一种信号传输电路及方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106684595A (zh) * 2015-11-06 2017-05-17 富士康(昆山)电脑接插件有限公司 电连接器组件及使用该电连接器组件的电连接系统

Also Published As

Publication number Publication date
EP2893457A4 (en) 2016-05-04
US20150181774A1 (en) 2015-06-25
IN2015DN02749A (enExample) 2015-08-28
WO2014039924A1 (en) 2014-03-13
JP2015530717A (ja) 2015-10-15
EP2893457A1 (en) 2015-07-15

Similar Documents

Publication Publication Date Title
US6422876B1 (en) High throughput interconnection system using orthogonal connectors
CN102695393B (zh) 一种垂直正交互连系统及通信设备
CN103051566B (zh) 背板装置及通信设备
US10925167B2 (en) Modular expansion card bus
US8425236B2 (en) Tall mezzanine connector
US10555435B2 (en) Hot-pluggable connection for data communications
CN103718658A (zh) 背板、插框和网络设备
JP6483579B2 (ja) データ・バス・イン・ア・ボックス（ｂｉｂ）システムの設計および実装
CN104871656A (zh) 轴向对齐的电子机架
CN104854573A (zh) 减小板到板电子通信中的串扰
US6485309B2 (en) Virtual midplane to enhance card interconnections using a matrix of interconnecting assemblies
US6578103B1 (en) Compact PCI backplane and method of data transfer across the compact PCI backplane
CN104752851B (zh) 一种系统
CN201436831U (zh) 线路板的布局结构
US7800915B2 (en) Printed board assembly
CN105027518A (zh) 用于通信设备的互连系统
CN114079211B (zh) 通信设备
WO2019128448A1 (zh) 线缆背板、线缆盒和线缆组件
CN104080308B (zh) 背板及具有该背板的通讯设备
US7017001B2 (en) Compact PCI backplane and method of data transfer across the compact PCI backplane
US6289042B1 (en) Media independent modular communication repeater system
US20080025007A1 (en) Partially plated through-holes and achieving high connectivity in multilayer circuit boards using the same
US8664806B2 (en) Communication bus and electric panel comprising said bus
CN214413127U (zh) 电子设备、第一连接器和印制电路板
CN116743678A (zh) 交换系统及电子设备

Legal Events

Date Code Title Description
PB01 Publication
EXSB Decision made by sipo to initiate substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20150819

WD01 Invention patent application deemed withdrawn after publication