JP2015523297A - 感光性耐熱材料、その製造方法及びその使用方法 - Google Patents
感光性耐熱材料、その製造方法及びその使用方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 4
- 239000003779 heat-resistant material Substances 0.000 title description 4
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000463 material Substances 0.000 claims abstract description 58
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 40
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 37
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims abstract description 34
- 239000011366 tin-based material Substances 0.000 claims abstract description 10
- 229910052738 indium Inorganic materials 0.000 claims abstract description 8
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052787 antimony Inorganic materials 0.000 claims abstract description 5
- 239000000203 mixture Substances 0.000 claims description 29
- 239000002105 nanoparticle Substances 0.000 claims description 21
- 229910006404 SnO 2 Inorganic materials 0.000 claims description 10
- 239000002904 solvent Substances 0.000 claims description 10
- 239000002082 metal nanoparticle Substances 0.000 claims description 8
- 238000001704 evaporation Methods 0.000 claims description 7
- 229910044991 metal oxide Inorganic materials 0.000 claims description 6
- 150000004706 metal oxides Chemical class 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 2
- 229920002120 photoresistant polymer Polymers 0.000 claims 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 abstract description 4
- 239000000976 ink Substances 0.000 description 19
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 8
- 238000000151 deposition Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 7
- 230000008020 evaporation Effects 0.000 description 6
- 230000008021 deposition Effects 0.000 description 5
- 238000000137 annealing Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000011819 refractory material Substances 0.000 description 2
- 238000012216 screening Methods 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- ULPMRIXXHGUZFA-UHFFFAOYSA-N (R)-4-Methyl-3-hexanone Natural products CCC(C)C(=O)CC ULPMRIXXHGUZFA-UHFFFAOYSA-N 0.000 description 1
- PFCHFHIRKBAQGU-UHFFFAOYSA-N 3-hexanone Chemical compound CCCC(=O)CC PFCHFHIRKBAQGU-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- AQCDIIAORKRFCD-UHFFFAOYSA-N cadmium selenide Chemical compound [Cd]=[Se] AQCDIIAORKRFCD-UHFFFAOYSA-N 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000295 emission spectrum Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000002329 infrared spectrum Methods 0.000 description 1
- 229910052981 lead sulfide Inorganic materials 0.000 description 1
- 229940056932 lead sulfide Drugs 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 238000001429 visible spectrum Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G19/00—Compounds of tin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/028—Inorganic materials including, apart from doping material or other impurities, only elements of Group IV of the Periodic Table
- H01L31/0288—Inorganic materials including, apart from doping material or other impurities, only elements of Group IV of the Periodic Table characterised by the doping material
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/05—Preparation or purification of carbon not covered by groups C01B32/15, C01B32/20, C01B32/25, C01B32/30
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G19/00—Compounds of tin
- C01G19/02—Oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
- H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/006—Thin film resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/008—Thermistors
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/32—Thermal properties
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/40—Electric properties
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/60—Optical properties, e.g. expressed in CIELAB-values
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Carbon And Carbon Compounds (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Thermistors And Varistors (AREA)
Abstract
Description
100から50重量部のグラフェン;
0から50重量部のアンチモンドープ二酸化錫(ATO);
0から50重量部のインジウムドープ二酸化錫(ITO);
を含む錫ベースの材料に関する。
言い換えると、錫ベースの材料は、有利には、
100から50重量部のグラフェン;
0から50重量部のアンチモンドープ二酸化錫(ATO);
0から50重量部のインジウムドープ二酸化錫(ITO);
の100から200重量部の材料を含む。
グラフェンインクを調製する段階と、
アンチモン及び/又はインジウムがドープされた二酸化錫のインクを調製する段階と、
グラフェンインク並びにアンチモン及び/又はインジウムがドープされ二酸化錫のインクを加える段階と、
必要があれば、金属ナノ粒子及び金属酸化物ナノ粒子の混合物、又は、金属ナノ粒子及び半導体ナノ粒子の混合物を加える段階と、
好ましくは30から60℃の範囲の温度で、得られた混合物を撹拌する段階と、
有利には溶媒の蒸発によって前記混合物を乾燥してグラフェン並びにATO及び/又はITOベースの材料を提供する段階と、
による、グラフェン並びにATO及び/又はITOベースの上記材料を調製する方法に関する。
100から50重量部のグラフェン;
0≦x≦50重量部のアンチモンドープ二酸化錫(ATO);
0≦y≦50重量部のインジウムドープ二酸化錫(ITO);
を含み、x+yが0ではない。
例えば10mlのシクロペンタノン中に6gのグラフェン(VORBECK)を分散させることによってグラフェンインクを調製した。
以上で得られた混合物を、溶媒の蒸発前に、シルクスクリーニングによって基板に堆積した。
Claims (15)
- 50から100重量部のグラフェン;
0から50重量部のアンチモンドープ二酸化錫(ATO);
0から50重量部のインジウムドープ二酸化錫(ITO);
を含む錫ベースの材料であって、
前記材料が、少なくともATO及び/又はITOを含む、錫ベースの材料。 - 1から10重量部の金属ナノ粒子及び金属酸化物粒子の混合物をさらに含むことを特徴とする、請求項1に記載の材料。
- 前記混合物が、銀、In2O3、InZnO、ZnO、CuO、NiOナノ粒子及びそれらの混合物を含む群から選択されるナノ粒子を含むことを特徴とする、請求項2に記載の材料。
- 1から5重量部の金属ナノ粒子及び半導体ナノ粒子の混合物をさらに含むことを特徴とする、請求項1に記載の材料。
- 前記混合物が、銀及びInGaZnOナノ粒子を含むことを特徴とする、請求項4に記載の材料。
- グラフェン並びにATO及び/又はITOの重量比が、1から5の範囲であることを特徴とする、請求項1から5の何れか一項に記載の材料。
- グラフェン並びにATO及び/又はITOの重量比が、3から4の範囲であることを特徴とする、請求項1から6の何れか一項に記載の材料。
- 前記ATO及び前記ITOがそれぞれ、5から10の範囲のSn/Sb及びSn/In重量比を有することを特徴とする、請求項1から7の何れか一項に記載の材料。
- 前記ATOが、式SnO2:Sb2O3、又は、SnO2:Sb2O5に相当することを特徴とする、請求項1から8の何れか一項に記載の材料。
- 前記ITOが、式SnO2:In2O3、又は、SnO2:In2O5に相当することを特徴とする、請求項1から9の何れか一項に記載の材料。
- グラフェンインクを調製する段階と、
ATO及び/又はITOインクを調製する段階と、
前記グラフェンインク並びに前記ATO及び/又はITOインクを加える段階と、
必要があれば、金属ナノ粒子及び金属酸化物ナノ粒子の混合物、又は、金属ナノ粒子及び半導体ナノ粒子の混合物を加える段階と、
得られた混合物を撹拌する段階と、
前記混合物を乾燥してグラフェン並びにATO及び/又はITOベースの材料を提供する段階と、
による、請求項1から10のグラフェン並びにATO及び/又はITOベースの材料を調製する方法。 - 前記得られた材料の撹拌が、30から60℃の範囲の温度で行われることを特徴とする、請求項11に記載の方法。
- 前記混合物の乾燥が、前記溶媒を蒸発することによって行われることを特徴とする、請求項11に記載の方法。
- 請求項1から10の何れか一項に記載の材料を含むフォトレジスタ。
- 請求項1から10の何れか一項に記載の材料を含むサーミスタ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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FR1253653 | 2012-04-20 | ||
FR1253653A FR2989677B1 (fr) | 2012-04-20 | 2012-04-20 | Materiau photosensible et thermoresistant, procede de preparation et utilisation |
PCT/FR2013/050713 WO2013156705A1 (fr) | 2012-04-20 | 2013-03-29 | Materiau photosensible et thermoresistant, procede de preparation et utilisation |
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JP2015523297A true JP2015523297A (ja) | 2015-08-13 |
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JP2015506280A Pending JP2015523297A (ja) | 2012-04-20 | 2013-03-29 | 感光性耐熱材料、その製造方法及びその使用方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10008619B2 (ja) |
EP (1) | EP2838849B1 (ja) |
JP (1) | JP2015523297A (ja) |
KR (1) | KR20150010703A (ja) |
FR (1) | FR2989677B1 (ja) |
WO (1) | WO2013156705A1 (ja) |
Cited By (1)
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JP2019128176A (ja) * | 2018-01-22 | 2019-08-01 | 公立大学法人大阪府立大学 | 温度センサ及び温度センサの製造方法 |
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CN103741094A (zh) * | 2014-01-22 | 2014-04-23 | 武汉理工大学 | 石墨烯复合导电氧化物靶材及其透明导电薄膜的制备方法 |
CN108323170B (zh) * | 2017-11-03 | 2020-09-22 | 江苏时瑞电子科技有限公司 | 一种用于热敏电阻的复合膜的制备方法 |
CN108863293A (zh) * | 2018-06-17 | 2018-11-23 | 赵娟 | 硫硒锌化合物光敏电阻材料的制备方法 |
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2012
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- 2013-03-29 JP JP2015506280A patent/JP2015523297A/ja active Pending
- 2013-03-29 KR KR1020147026614A patent/KR20150010703A/ko not_active Application Discontinuation
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JP2019128176A (ja) * | 2018-01-22 | 2019-08-01 | 公立大学法人大阪府立大学 | 温度センサ及び温度センサの製造方法 |
JP7014408B2 (ja) | 2018-01-22 | 2022-02-01 | 公立大学法人大阪 | 温度センサ |
Also Published As
Publication number | Publication date |
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FR2989677A1 (fr) | 2013-10-25 |
EP2838849B1 (fr) | 2020-03-25 |
FR2989677B1 (fr) | 2015-06-19 |
KR20150010703A (ko) | 2015-01-28 |
EP2838849A1 (fr) | 2015-02-25 |
US20150053895A1 (en) | 2015-02-26 |
US10008619B2 (en) | 2018-06-26 |
WO2013156705A1 (fr) | 2013-10-24 |
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