JP2015519740A5 - - Google Patents

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JP2015519740A5
JP2015519740A5 JP2015508995A JP2015508995A JP2015519740A5 JP 2015519740 A5 JP2015519740 A5 JP 2015519740A5 JP 2015508995 A JP2015508995 A JP 2015508995A JP 2015508995 A JP2015508995 A JP 2015508995A JP 2015519740 A5 JP2015519740 A5 JP 2015519740A5
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JP
Japan
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signal
value
monitoring system
values
series
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JP2015508995A
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Japanese (ja)
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JP2015519740A (ja
JP6181156B2 (ja
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Priority claimed from US13/456,801 external-priority patent/US9308618B2/en
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JP2015508995A 2012-04-26 2013-04-05 研磨のインシトゥ監視時にデータをフィルタリングするための線形予測 Active JP6181156B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/456,801 2012-04-26
US13/456,801 US9308618B2 (en) 2012-04-26 2012-04-26 Linear prediction for filtering of data during in-situ monitoring of polishing
PCT/US2013/035514 WO2013162857A1 (en) 2012-04-26 2013-04-05 Linear prediction for filtering of data during in-situ monitoring of polishing

Publications (3)

Publication Number Publication Date
JP2015519740A JP2015519740A (ja) 2015-07-09
JP2015519740A5 true JP2015519740A5 (cg-RX-API-DMAC7.html) 2016-06-02
JP6181156B2 JP6181156B2 (ja) 2017-08-16

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JP2015508995A Active JP6181156B2 (ja) 2012-04-26 2013-04-05 研磨のインシトゥ監視時にデータをフィルタリングするための線形予測

Country Status (5)

Country Link
US (1) US9308618B2 (cg-RX-API-DMAC7.html)
JP (1) JP6181156B2 (cg-RX-API-DMAC7.html)
KR (1) KR101919032B1 (cg-RX-API-DMAC7.html)
TW (1) TWI569919B (cg-RX-API-DMAC7.html)
WO (1) WO2013162857A1 (cg-RX-API-DMAC7.html)

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US8694144B2 (en) 2010-08-30 2014-04-08 Applied Materials, Inc. Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishing
US9490186B2 (en) * 2013-11-27 2016-11-08 Applied Materials, Inc. Limiting adjustment of polishing rates during substrate polishing
US9375824B2 (en) * 2013-11-27 2016-06-28 Applied Materials, Inc. Adjustment of polishing rates during substrate polishing with predictive filters
US9727054B2 (en) 2015-02-25 2017-08-08 Onesubsea Ip Uk Limited Impedance measurement behind subsea transformer
US10026537B2 (en) 2015-02-25 2018-07-17 Onesubsea Ip Uk Limited Fault tolerant subsea transformer
US10065714B2 (en) * 2015-02-25 2018-09-04 Onesubsea Ip Uk Limited In-situ testing of subsea power components
US9945909B2 (en) 2015-02-25 2018-04-17 Onesubsea Ip Uk Limited Monitoring multiple subsea electric motors
US9679693B2 (en) 2015-02-25 2017-06-13 Onesubsea Ip Uk Limited Subsea transformer with seawater high resistance ground
US10565701B2 (en) 2015-11-16 2020-02-18 Applied Materials, Inc. Color imaging for CMP monitoring
US11557048B2 (en) 2015-11-16 2023-01-17 Applied Materials, Inc. Thickness measurement of substrate using color metrology
JP2017102051A (ja) * 2015-12-03 2017-06-08 ニッタ株式会社 圧力測定装置及び圧力測定プログラム
JP2018001296A (ja) * 2016-06-28 2018-01-11 株式会社荏原製作所 研磨装置、研磨方法、及び研磨制御プログラム
WO2018057623A1 (en) 2016-09-21 2018-03-29 Applied Materials, Inc. Endpoint detection with compensation for filtering
JP6989317B2 (ja) 2017-08-04 2022-01-05 キオクシア株式会社 研磨装置、研磨方法、およびプログラム
KR102414470B1 (ko) * 2017-11-16 2022-06-30 어플라이드 머티어리얼스, 인코포레이티드 연마 패드 마모율 모니터링을 위한 예측 필터
JP7098311B2 (ja) * 2017-12-05 2022-07-11 株式会社荏原製作所 研磨装置、及び研磨方法
WO2019177842A1 (en) 2018-03-12 2019-09-19 Applied Materials, Inc. Filtering during in-situ monitoring of polishing
CN111263683B (zh) * 2018-03-14 2024-03-15 应用材料公司 垫调节器的切割速率监控
US11100628B2 (en) 2019-02-07 2021-08-24 Applied Materials, Inc. Thickness measurement of substrate using color metrology
US12164279B2 (en) * 2019-07-16 2024-12-10 Nec Corporation Estimation apparatus, control system, estimation method, and program
EP3800008B1 (de) * 2019-10-02 2024-12-04 Optikron GmbH Vorrichtung und verfahren zum schleifen und/oder polieren planer flächen von werkstücken
JP7374710B2 (ja) * 2019-10-25 2023-11-07 株式会社荏原製作所 研磨方法および研磨装置
JP7504713B2 (ja) * 2020-08-19 2024-06-24 キオクシア株式会社 半導体製造装置及び半導体製造方法
US11794305B2 (en) 2020-09-28 2023-10-24 Applied Materials, Inc. Platen surface modification and high-performance pad conditioning to improve CMP performance
JP7599330B2 (ja) * 2020-12-25 2024-12-13 株式会社荏原製作所 研磨装置、及び研磨方法
US12311494B2 (en) * 2021-03-03 2025-05-27 Applied Materials, Inc. Pressure signals during motor torque monitoring to provide spatial resolution
WO2022186993A1 (en) * 2021-03-03 2022-09-09 Applied Materials, Inc. Motor torque endpoint during polishing with spatial resolution
JP2023124546A (ja) * 2022-02-25 2023-09-06 株式会社荏原製作所 研磨装置および研磨装置における研磨終点検出方法

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US5036015A (en) * 1990-09-24 1991-07-30 Micron Technology, Inc. Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers
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