JP2015514826A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2015514826A5 JP2015514826A5 JP2014561411A JP2014561411A JP2015514826A5 JP 2015514826 A5 JP2015514826 A5 JP 2015514826A5 JP 2014561411 A JP2014561411 A JP 2014561411A JP 2014561411 A JP2014561411 A JP 2014561411A JP 2015514826 A5 JP2015514826 A5 JP 2015514826A5
- Authority
- JP
- Japan
- Prior art keywords
- mol
- aliphatic
- diamine
- total amount
- amine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 150000004985 diamines Chemical class 0.000 description 6
- 239000004952 Polyamide Substances 0.000 description 5
- 229920002647 polyamide Polymers 0.000 description 5
- 125000001931 aliphatic group Chemical group 0.000 description 4
- 235000014113 dietary fatty acids Nutrition 0.000 description 4
- 239000000539 dimer Substances 0.000 description 4
- 229930195729 fatty acid Natural products 0.000 description 4
- 239000000194 fatty acid Substances 0.000 description 4
- 150000004665 fatty acids Chemical class 0.000 description 4
- -1 alicyclic diamines Chemical class 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 150000002763 monocarboxylic acids Chemical class 0.000 description 3
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000002462 imidazolines Chemical class 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 150000002892 organic cations Chemical class 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 125000005207 tetraalkylammonium group Chemical group 0.000 description 1
- 125000005497 tetraalkylphosphonium group Chemical group 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- WYURNTSHIVDZCO-UHFFFAOYSA-N tetrahydrofuran Substances C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE201210203794 DE102012203794A1 (de) | 2012-03-12 | 2012-03-12 | Elektrisch lösbarer Polyamid-Klebstoff |
| DE102012203794.2 | 2012-03-12 | ||
| PCT/EP2013/054972 WO2013135677A1 (de) | 2012-03-12 | 2013-03-12 | Elektrisch lösbarer polyamid-klebstoff |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2015514826A JP2015514826A (ja) | 2015-05-21 |
| JP2015514826A5 true JP2015514826A5 (enExample) | 2015-11-05 |
Family
ID=47844378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014561411A Withdrawn JP2015514826A (ja) | 2012-03-12 | 2013-03-12 | 電気的可分性ポリアミド接着剤 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20140374032A1 (enExample) |
| EP (1) | EP2825608A1 (enExample) |
| JP (1) | JP2015514826A (enExample) |
| KR (1) | KR20140133606A (enExample) |
| CN (1) | CN104204129A (enExample) |
| DE (1) | DE102012203794A1 (enExample) |
| WO (1) | WO2013135677A1 (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES2625552T3 (es) * | 2014-06-17 | 2017-07-19 | 3M Innovative Properties Company | Composición de adhesivo epoxídico de curado rápido |
| EP2990437B1 (en) * | 2014-08-26 | 2017-10-04 | Henkel AG & Co. KGaA | Polyamide Hot Melt Coating |
| CN107207938B (zh) | 2015-02-27 | 2020-12-15 | 汉高股份有限及两合公司 | 可脱粘的反应性热熔粘合剂 |
| JP6407825B2 (ja) | 2015-09-02 | 2018-10-17 | 信越化学工業株式会社 | 永久磁石磁気回路の製造方法 |
| EP3199344B1 (en) * | 2016-02-01 | 2022-04-13 | Henkel AG & Co. KGaA | Electrical debonding of pu hot melt adhesives by use of conductive inks |
| EP3236479A1 (en) | 2016-04-21 | 2017-10-25 | Henkel AG & Co. KGaA | An electrically conductive, hot-melt adhesive or moulding composition |
| CN109749695A (zh) * | 2017-11-06 | 2019-05-14 | 山东凯恩新材料科技有限公司 | 一种新型聚酰胺热熔胶及其制备方法 |
| DE102018201470A1 (de) * | 2018-01-31 | 2019-01-10 | Carl Zeiss Smt Gmbh | Lithographieanlage und verfahren |
| IT201800021346A1 (it) | 2018-12-28 | 2020-06-28 | Enrico Luigi Seveso | Resina di tipo hot-melt per dissipare calore, non conduttiva elettricamente e/o isolante elettricamente. |
| KR20230004524A (ko) | 2020-04-24 | 2023-01-06 | 헨켈 아게 운트 코. 카게아아 | 열 분리형 2 층 점착제 시스템 및 이를 이용한 점착제 디본딩 방법 |
| KR20230027053A (ko) | 2020-06-22 | 2023-02-27 | 헨켈 아게 운트 코. 카게아아 | 전기화학적으로 탈착가능한 접착제 조성물 |
| EP4050040A1 (en) | 2021-02-26 | 2022-08-31 | Henkel AG & Co. KGaA | One component (1k) curable adhesive composition |
| EP4067401A1 (en) | 2021-03-30 | 2022-10-05 | Henkel AG & Co. KGaA | Two component (2k) curable adhesive composition |
| WO2022218630A1 (en) | 2021-04-14 | 2022-10-20 | Henkel Ag & Co. Kgaa | Debondable structure based on a solvent-borne pressure sensitive adhesive (psa) |
| JP2024546652A (ja) * | 2021-12-07 | 2024-12-26 | スリーエム イノベイティブ プロパティズ カンパニー | アイオノマーポリアミド、プライマー、物品、及びこれらを作製する方法 |
| DE102022104817A1 (de) | 2022-03-01 | 2023-09-07 | Tesa Se | Haftklebstoffzusammensetzung |
| KR102730909B1 (ko) * | 2022-03-30 | 2024-11-15 | 실버스타케미칼(주) | 바이오매스를 포함하는 생분해성 폴리아마이드 핫멜트 접착제 |
| DE102022110643A1 (de) | 2022-05-02 | 2023-11-02 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Thermisch aktivierbares Expansionselement, Verwendung desselben sowie Fügeteil und Verbundbauteil umfassend das thermisch aktivierbare Expansionselement |
| KR102842845B1 (ko) * | 2023-02-17 | 2025-08-06 | 실버스타케미칼(주) | 바이오매스를 포함하는 바이오플라스틱 복합 조성물 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2497518A1 (fr) * | 1981-01-05 | 1982-07-09 | Ato Chimie | Compositions adhesives thermofusibles a base de copolyetheramides sequences |
| US4548996A (en) * | 1984-01-09 | 1985-10-22 | Monsanto Company | Hot melt adhesive compositions |
| US7332218B1 (en) * | 1999-07-14 | 2008-02-19 | Eic Laboratories, Inc. | Electrically disbonding materials |
| GB0023706D0 (en) | 2000-09-27 | 2000-11-08 | Scionix Ltd | Ionic liquids |
| US7537840B2 (en) * | 2004-08-05 | 2009-05-26 | H.B. Licensing & Financing, Inc. | Polyamide adhesive and articles including the same |
| CN101258215A (zh) * | 2005-09-08 | 2008-09-03 | 陶氏环球技术公司 | 聚酯-酰胺基热熔粘合剂 |
| DE102005050632A1 (de) * | 2005-10-20 | 2007-05-03 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Klebstoffzusammensetzung für Klebeverbindungen, die mittels Anlegen von elektrischer Spannung gelöst werden können |
| WO2008150227A1 (en) | 2007-06-05 | 2008-12-11 | Stora Enso Ab | An electrochemically weakable adhesive and a laminate structure |
-
2012
- 2012-03-12 DE DE201210203794 patent/DE102012203794A1/de not_active Ceased
-
2013
- 2013-03-12 CN CN201380013098.8A patent/CN104204129A/zh active Pending
- 2013-03-12 EP EP13708485.1A patent/EP2825608A1/de not_active Withdrawn
- 2013-03-12 JP JP2014561411A patent/JP2015514826A/ja not_active Withdrawn
- 2013-03-12 WO PCT/EP2013/054972 patent/WO2013135677A1/de not_active Ceased
- 2013-03-12 KR KR1020147028297A patent/KR20140133606A/ko not_active Withdrawn
-
2014
- 2014-09-12 US US14/484,451 patent/US20140374032A1/en not_active Abandoned
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2015514826A5 (enExample) | ||
| JP2012531508A5 (enExample) | ||
| JP2014148600A5 (enExample) | ||
| MX379595B (es) | Sales de amidas de acido n-(1,3,4-oxadiazol-2-il) aril carboxilico y su uso como herbicidas. | |
| JP2014148602A5 (enExample) | ||
| MX353511B (es) | Amida de acido n-(tetrazol-5-il)arilcarboxilico y amida de n-(triazol-5-il)arilcarboxilico sustituidas con 5-fenilo y uso de las mismas como herbicidas. | |
| RU2012149242A (ru) | Полиамидное соединение | |
| JP2014509678A5 (enExample) | ||
| JP2014517106A5 (enExample) | ||
| ES2964342T3 (es) | Poliamidas multifuncionales para recubrimientos protectores | |
| JP2017515949A5 (enExample) | ||
| RU2018105596A (ru) | Растянутая пленка, способ изготовления растянутой пленки и композиция полиамидной смолы | |
| RU2013158170A (ru) | Многослойное изделие, полученное литьем под давлением | |
| JP2016523313A5 (enExample) | ||
| JP2015048478A5 (enExample) | ||
| PH12014502161A1 (en) | Polyamide acid and resin composition containing same | |
| MY152420A (en) | Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same | |
| JP2016511777A5 (enExample) | ||
| WO2014029606A3 (de) | 2-k-kaschierklebstoff | |
| JP2018502174A5 (enExample) | ||
| JP2015520782A5 (enExample) | ||
| UA115581C2 (uk) | Біоактивні полімери | |
| JP2014532616A5 (enExample) | ||
| JP2013506733A5 (enExample) | ||
| RU2015146550A (ru) | Композиция ксилилендиамина и способ получения полиамидной смолы |