JP2015514826A5 - - Google Patents

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Publication number
JP2015514826A5
JP2015514826A5 JP2014561411A JP2014561411A JP2015514826A5 JP 2015514826 A5 JP2015514826 A5 JP 2015514826A5 JP 2014561411 A JP2014561411 A JP 2014561411A JP 2014561411 A JP2014561411 A JP 2014561411A JP 2015514826 A5 JP2015514826 A5 JP 2015514826A5
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JP
Japan
Prior art keywords
mol
aliphatic
diamine
total amount
amine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2014561411A
Other languages
English (en)
Japanese (ja)
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JP2015514826A (ja
Filing date
Publication date
Priority claimed from DE201210203794 external-priority patent/DE102012203794A1/de
Application filed filed Critical
Publication of JP2015514826A publication Critical patent/JP2015514826A/ja
Publication of JP2015514826A5 publication Critical patent/JP2015514826A5/ja
Withdrawn legal-status Critical Current

Links

JP2014561411A 2012-03-12 2013-03-12 電気的可分性ポリアミド接着剤 Withdrawn JP2015514826A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE201210203794 DE102012203794A1 (de) 2012-03-12 2012-03-12 Elektrisch lösbarer Polyamid-Klebstoff
DE102012203794.2 2012-03-12
PCT/EP2013/054972 WO2013135677A1 (de) 2012-03-12 2013-03-12 Elektrisch lösbarer polyamid-klebstoff

Publications (2)

Publication Number Publication Date
JP2015514826A JP2015514826A (ja) 2015-05-21
JP2015514826A5 true JP2015514826A5 (enExample) 2015-11-05

Family

ID=47844378

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014561411A Withdrawn JP2015514826A (ja) 2012-03-12 2013-03-12 電気的可分性ポリアミド接着剤

Country Status (7)

Country Link
US (1) US20140374032A1 (enExample)
EP (1) EP2825608A1 (enExample)
JP (1) JP2015514826A (enExample)
KR (1) KR20140133606A (enExample)
CN (1) CN104204129A (enExample)
DE (1) DE102012203794A1 (enExample)
WO (1) WO2013135677A1 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PL2957584T3 (pl) * 2014-06-17 2017-08-31 3M Innovative Properties Company Szybko utwardzane epoksydowe kompozycje klejące
EP2990437B1 (en) * 2014-08-26 2017-10-04 Henkel AG & Co. KGaA Polyamide Hot Melt Coating
JP6770523B2 (ja) * 2015-02-27 2020-10-14 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンHenkel AG & Co. KGaA 剥離可能な反応性ホットメルト接着剤
JP6407825B2 (ja) 2015-09-02 2018-10-17 信越化学工業株式会社 永久磁石磁気回路の製造方法
EP3199344B1 (en) * 2016-02-01 2022-04-13 Henkel AG & Co. KGaA Electrical debonding of pu hot melt adhesives by use of conductive inks
EP3236479A1 (en) 2016-04-21 2017-10-25 Henkel AG & Co. KGaA An electrically conductive, hot-melt adhesive or moulding composition
CN109749695A (zh) * 2017-11-06 2019-05-14 山东凯恩新材料科技有限公司 一种新型聚酰胺热熔胶及其制备方法
DE102018201470A1 (de) * 2018-01-31 2019-01-10 Carl Zeiss Smt Gmbh Lithographieanlage und verfahren
IT201800021346A1 (it) 2018-12-28 2020-06-28 Enrico Luigi Seveso Resina di tipo hot-melt per dissipare calore, non conduttiva elettricamente e/o isolante elettricamente.
WO2021213815A1 (en) 2020-04-24 2021-10-28 Henkel Ag & Co. Kgaa Heat separable two-layer adhesive system and process of adhesive debonding using the same
WO2021259594A1 (en) 2020-06-22 2021-12-30 Henkel Ag & Co. Kgaa Electrochemically debondable adhesive composition
EP4050040A1 (en) 2021-02-26 2022-08-31 Henkel AG & Co. KGaA One component (1k) curable adhesive composition
EP4067401A1 (en) 2021-03-30 2022-10-05 Henkel AG & Co. KGaA Two component (2k) curable adhesive composition
KR20230169152A (ko) 2021-04-14 2023-12-15 헨켈 아게 운트 코. 카게아아 용매계 감압성 접착제 (psa)를 기반으로 하는 탈결합가능한 구조체
CN118251443A (zh) * 2021-12-07 2024-06-25 3M创新有限公司 离聚物聚酰胺、底胶、制品及其制备方法
DE102022104817A1 (de) 2022-03-01 2023-09-07 Tesa Se Haftklebstoffzusammensetzung
KR102730909B1 (ko) * 2022-03-30 2024-11-15 실버스타케미칼(주) 바이오매스를 포함하는 생분해성 폴리아마이드 핫멜트 접착제
DE102022110643A1 (de) 2022-05-02 2023-11-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Thermisch aktivierbares Expansionselement, Verwendung desselben sowie Fügeteil und Verbundbauteil umfassend das thermisch aktivierbare Expansionselement
KR102842845B1 (ko) * 2023-02-17 2025-08-06 실버스타케미칼(주) 바이오매스를 포함하는 바이오플라스틱 복합 조성물

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2497518A1 (fr) * 1981-01-05 1982-07-09 Ato Chimie Compositions adhesives thermofusibles a base de copolyetheramides sequences
US4548996A (en) * 1984-01-09 1985-10-22 Monsanto Company Hot melt adhesive compositions
US7332218B1 (en) 1999-07-14 2008-02-19 Eic Laboratories, Inc. Electrically disbonding materials
GB0023706D0 (en) 2000-09-27 2000-11-08 Scionix Ltd Ionic liquids
US7537840B2 (en) * 2004-08-05 2009-05-26 H.B. Licensing & Financing, Inc. Polyamide adhesive and articles including the same
ATE464364T1 (de) * 2005-09-08 2010-04-15 Dow Global Technologies Inc Schmelzklebstoffe auf polyesteramidbasis
DE102005050632A1 (de) * 2005-10-20 2007-05-03 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Klebstoffzusammensetzung für Klebeverbindungen, die mittels Anlegen von elektrischer Spannung gelöst werden können
WO2008150227A1 (en) 2007-06-05 2008-12-11 Stora Enso Ab An electrochemically weakable adhesive and a laminate structure

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