JP2015232538A5 - - Google Patents

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Publication number
JP2015232538A5
JP2015232538A5 JP2014231454A JP2014231454A JP2015232538A5 JP 2015232538 A5 JP2015232538 A5 JP 2015232538A5 JP 2014231454 A JP2014231454 A JP 2014231454A JP 2014231454 A JP2014231454 A JP 2014231454A JP 2015232538 A5 JP2015232538 A5 JP 2015232538A5
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JP
Japan
Prior art keywords
sensing element
subelement
pressure
field shield
pressure sensor
Prior art date
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Granted
Application number
JP2014231454A
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English (en)
Japanese (ja)
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JP6258185B2 (ja
JP2015232538A (ja
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Priority claimed from US14/082,562 external-priority patent/US20150135853A1/en
Priority claimed from US14/539,044 external-priority patent/US9557237B2/en
Application filed filed Critical
Publication of JP2015232538A publication Critical patent/JP2015232538A/ja
Publication of JP2015232538A5 publication Critical patent/JP2015232538A5/ja
Application granted granted Critical
Publication of JP6258185B2 publication Critical patent/JP6258185B2/ja
Ceased legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014231454A 2013-11-18 2014-11-14 油充填パッケージングにおける表面電荷耐性のためのｍｅｍｓ圧力センサフィールドシールドレイアウト Ceased JP6258185B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US14/082,562 US20150135853A1 (en) 2013-11-18 2013-11-18 Mems pressure sensor field shield layout for surface charge immunity in oil filled packaging
US14/082,562 2013-11-18
US14/539,044 US9557237B2 (en) 2013-11-18 2014-11-12 MEMS pressure sensor field shield layout for surface charge immunity in oil filled packaging
US14/539,044 2014-11-12

Publications (3)

Publication Number Publication Date
JP2015232538A JP2015232538A (ja) 2015-12-24
JP2015232538A5 true JP2015232538A5 (https=) 2017-12-07
JP6258185B2 JP6258185B2 (ja) 2018-01-10

Family

ID=53171941

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014231454A Ceased JP6258185B2 (ja) 2013-11-18 2014-11-14 油充填パッケージングにおける表面電荷耐性のためのｍｅｍｓ圧力センサフィールドシールドレイアウト

Country Status (3)

Country Link
US (1) US9557237B2 (https=)
JP (1) JP6258185B2 (https=)
KR (1) KR102194166B1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10682498B2 (en) 2015-09-24 2020-06-16 Silicon Microstructures, Inc. Light shields for catheter sensors
US10641672B2 (en) 2015-09-24 2020-05-05 Silicon Microstructures, Inc. Manufacturing catheter sensors
US9790085B1 (en) * 2016-06-16 2017-10-17 Nxp Usa, Inc. Actively preventing charge induced leakage of semiconductor devices
JP6992482B2 (ja) * 2017-12-18 2022-01-13 富士電機株式会社 圧力センサ
US11029227B2 (en) 2018-06-04 2021-06-08 Vitesco Technologies USA, LLC CSOI MEMS pressure sensing element with stress equalizers
CN209326840U (zh) 2018-12-27 2019-08-30 热敏碟公司 压力传感器及压力变送器
EP3832279B1 (en) * 2019-12-06 2023-11-29 Melexis Technologies NV Semiconductor stress sensor
US11573143B2 (en) 2021-04-21 2023-02-07 Vitesco Technologies USA, LLC Mems pressure sensing element with stress adjustors to minimize thermal hysteresis induced by electrical field
DE102021211561A1 (de) * 2020-11-19 2022-05-19 Vitesco Technologies USA, LLC Mems-druckerfassungselement mit spannungsjustierern
JP2025173150A (ja) * 2024-05-14 2025-11-27 ミツミ電機株式会社 圧力検出素子及び圧力センサ

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Publication number Priority date Publication date Assignee Title
US4131088A (en) 1976-11-08 1978-12-26 The Bendix Corporation Multiple function pressure sensor
US4347745A (en) 1980-12-22 1982-09-07 Bourns Instruments, Inc. Pressure measuring apparatus
US5231301A (en) 1991-10-02 1993-07-27 Lucas Novasensor Semiconductor sensor with piezoresistors and improved electrostatic structures
JP3319173B2 (ja) * 1994-09-19 2002-08-26 株式会社日立製作所 センサ
JP2000221091A (ja) * 1999-02-03 2000-08-11 Hitachi Ltd 歪み検出センサ
JP3619065B2 (ja) * 1999-07-16 2005-02-09 株式会社山武 圧力センサ
JP2001281085A (ja) * 2000-03-28 2001-10-10 Toyoda Mach Works Ltd 半導体圧力センサ及びその製造方法
JP2002162303A (ja) * 2000-11-27 2002-06-07 Yokogawa Electric Corp 圧力センサ
JP3987386B2 (ja) * 2001-11-20 2007-10-10 株式会社鷺宮製作所 圧力センサ
US6952042B2 (en) 2002-06-17 2005-10-04 Honeywell International, Inc. Microelectromechanical device with integrated conductive shield
KR100543371B1 (ko) * 2004-04-26 2006-01-20 (주)센서시스템기술 압력센서
US7884432B2 (en) * 2005-03-22 2011-02-08 Ametek, Inc. Apparatus and methods for shielding integrated circuitry
JP4421511B2 (ja) * 2005-05-30 2010-02-24 三菱電機株式会社 半導体圧力センサ
TWI286383B (en) * 2005-12-23 2007-09-01 Delta Electronics Inc Semiconductor piezoresistive sensor and operation method thereof
JP2009075056A (ja) * 2007-09-25 2009-04-09 Panasonic Electric Works Co Ltd 半導体圧力センサ
US7578194B1 (en) * 2008-02-11 2009-08-25 Sensata Technologies, Inc. Differential fluid pressure measurement apparatus
US7900521B2 (en) * 2009-02-10 2011-03-08 Freescale Semiconductor, Inc. Exposed pad backside pressure sensor package
JP2011102775A (ja) * 2009-11-11 2011-05-26 Panasonic Electric Works Co Ltd 半導体圧力センサおよびその製造方法
WO2012040211A2 (en) * 2010-09-20 2012-03-29 Fairchild Semiconductor Corporation Microelectromechanical pressure sensor including reference capacitor
DE112011104403T5 (de) 2010-12-15 2013-09-19 Panasonic Corporation Halbleiterdrucksensor
JP5793700B2 (ja) * 2010-12-15 2015-10-14 パナソニックＩｐマネジメント株式会社 半導体圧力センサ
JP5877248B2 (ja) * 2012-10-17 2016-03-02 株式会社鷺宮製作所 圧力センサおよび、それを備えるセンサユニット
JP2014206514A (ja) * 2013-04-16 2014-10-30 パナソニック株式会社 圧力センサ
US20150135853A1 (en) * 2013-11-18 2015-05-21 Mark P. McNeal Mems pressure sensor field shield layout for surface charge immunity in oil filled packaging

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