JP2015222911A - Electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mechanism capable of preventing a pressing force and a tensile force from acting on other components by suppressing the excess part of a flexible substrate from being carelessly deformed after assembly, even when the length of the flexible substrate is set long enough.SOLUTION: An electronic apparatus includes a flexible substrate 202 on which an imaging element 201 is mounted, a lens barrel 200 which holds the imaging element 201, a main substrate 605 to which the flexible substrate 202 can be electrically connected, a battery housing part 300 which holds the main substrate 605, and a chassis 303 to which the lens barrel 200 and the battery housing part 300 are attached. The lens barrel 200 and the battery housing part 300 are attached to the chassis 303, so that the imaging element 201 and the main substrate 605 are arranged side by side along the surface of the chassis 303 on one surface side of the chassis 303. The flexible substrate 202 passes through between a projection 304 and a recess 210, to be connected to the main substrate 605.

Description

  The present invention relates to an electronic apparatus such as a digital camera or a digital video camera.

  Some electronic devices such as digital cameras use a flexible substrate to connect an electric circuit (Patent Document 1). In this proposal, a battery storage unit is provided adjacent to the side of the lens barrel, and a display unit such as an LCD is provided on the back side of the battery storage and the lens barrel. Also, a printed circuit board is provided on the back side of the battery storage unit, and a connector is mounted near the end of the printed circuit board on the lens barrel side.

  The flexible substrate extending from the image sensor disposed on the back side of the lens barrel passes between the lens barrel and the display unit, and then the extended end is connected to the connector of the printed circuit board. Thereby, an image pick-up element and the connector of a printed circuit board are electrically connected via a flexible substrate.

JP 2009-177276 A

  By the way, in recent years, with the demand for higher image quality, there is an increasing need for highly accurate alignment of the light receiving surface of the image sensor with respect to the imaging surface of the photographing optical system. For this reason, it is necessary to perform surface tilt adjustment for adjusting the position and inclination of the image sensor with respect to the lens barrel.

  However, in Patent Document 1, when the connector and the image sensor are connected via the flexible substrate, it is necessary to take into account the displacement of the mounting position of the image sensor and the connector and the adjustment margin for the surface tilt adjustment of the image sensor. For this reason, the length of the flexible substrate is set longer with a margin than the minimum length required for assembly. In addition, since the lens barrel and the battery housing are each fixed to a structure such as a chassis, it is difficult to obtain relative position accuracy.

  Therefore, when a flexible substrate with sufficient margin is assembled as described above, a tensile force or a compressive force is generated due to inadvertent deformation of the excess portion of the length, and acts as a pressing force or a tensile force on other parts. .

  For example, if the surplus portion of the flexible substrate is inadvertently deformed after assembly, a pressing force of a predetermined value or more acts on the LCD panel of the display unit, causing problems such as moiré on the display surface of the display unit.

  In addition, if the surplus portion of the flexible substrate is inadvertently deformed, there arises a problem that an excessive tensile force acts on the connection portion (soldering portion) between the flexible substrate and the imaging element.

  Thus, even if the flexible board is set to be long with a margin, the present invention suppresses inadvertent deformation of the surplus portion of the flexible board after assembly, and the pressing force and tensile force are applied to other parts. The purpose is to provide a mechanism to prevent it from acting.

  In order to achieve the above object, an electronic device according to the present invention electrically connects an imaging element, a flexible board on which the imaging element is mounted, a first holding member that holds the imaging element, and the flexible board. A circuit board that can be connected; a second holding member that holds the circuit board; and a chassis member to which the first holding member and the second holding member are attached. The first holding member and the second holding member are attached to the chassis member so that the circuit board is aligned along the surface of the chassis member on one side of the chassis member, and the chassis The member has a convex portion protruding from the one surface side of the chassis member, and the first holding member has a concave portion at a position facing the convex portion of the chassis member. Ri, the flexible substrate passes between said recess and said protrusion, characterized in that it is electrically connected to the circuit board.

  According to the present invention, even if the flexible board is set to be long with a margin, it is possible to prevent the excessive portion of the flexible board from being inadvertently deformed after assembly, and to exert a pressing force or tensile force on other components. It can be prevented from working.

(A) is the perspective view which looked at the digital camera which is 1st Embodiment of the electronic device of this invention from the front side (subject side), (b) is the perspective view which looked at the digital camera shown to (a) from the back side. FIG. FIG. 2 is an exploded perspective view of the digital camera shown in FIG. (A) is the schematic which shows the wiring pattern of the 1st wiring part which looked at the flexible substrate from the front side of the camera body, (b) is the wiring of the 2nd wiring part which looked at the flexible substrate from the back side of the camera body It is the schematic which shows a pattern. It is principal part sectional drawing of a camera main body. (A) is the figure which looked at the state which removed the back cover and the display part from the back side of the camera body, (b) looked at the state which removed the main chassis from the state of (a) further from the back side of the camera body. FIG. It is the BB sectional view taken on the line of Fig.5 (a). It is a partial expanded sectional view of FIG. It is principal part sectional drawing of the camera main body in the digital camera which is 2nd Embodiment of the electronic device of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
FIG. 1A is a perspective view of a digital camera which is a first embodiment of an electronic apparatus according to the present invention as seen from the front side (subject side), and FIG. 1B is a digital camera shown in FIG. It is the perspective view seen from the back side.

  In the digital camera of this embodiment, as shown in FIG. 1, the exterior of the camera body 100 is formed by a front cover 109 and a back cover 110. A retractable lens barrel 200 is provided on the front side of the camera body 100. A strobe light emission window 400 a is provided on the upper right side of the lens barrel 200 when the camera body 100 is viewed from the front side, and a battery storage unit 300 is provided on the left side in the radial direction of the lens barrel 200.

  On the upper surface of the camera body 100, a power button 101, a release button 102, a zoom lever 103, and the like are provided. In addition, a display unit 500 configured by an LCD or the like is provided on the back side of the camera body 100, various operation button groups 105 are provided on the side of the display unit 500, and on the upper side of the display unit 500, Speaker holes 301a are provided corresponding to the speakers 301 (see FIG. 2).

  FIG. 2 is an exploded perspective view of the digital camera shown in FIG. In FIG. 2, an image sensor 201 is composed of a CCD sensor, a CMOS sensor, or the like, mounted on a flexible substrate 202, and photoelectrically converts a subject image formed through the photographing optical system of the lens barrel 200 to obtain an image. Output a signal.

  The flexible substrate 202 is formed by sandwiching a wiring pattern made of copper foil between a base film such as polyimide having insulation properties and a cover film, and using a thermosetting adhesive.

  The top unit 108 includes a power button 101, a release button 102, and a zoom lever 103, and is fixed to the battery storage unit 300 from the upper side of the camera body 100 by a locking claw (not shown). The front cover 109 and the back cover 110 are fixed to each other by a locking claw (not shown), and fixed to a structure such as the battery storage unit 300 by screws or the like.

  In addition, the flexible operation board 600 (hereinafter referred to as the operation board 600) is arranged on the side portion of the display unit 500 so as to be bent on the upper surface side and the back surface side of the battery storage unit 300. The upper surface side of the operation board 600 is held in the battery storage unit 300, and the rear surface side of the operation board 600 is held by the subchassis 302.

  On the operation board 600, a metal dome sheet 601, a release switch 602, and a zoom pattern 603 for detecting operations of the power button 101, the release button 102, and the zoom lever 103 are mounted. In addition, a metal dome sheet 604 for detecting each operation of the operation button group 105 is mounted on the operation board 600.

  The main board 605 is fixed to the back side of the battery storage unit 300 with screws or the like. A main chassis 303 is disposed on the back side of the main board 605. The main board 605 corresponds to an example of the circuit board of the present invention.

  The lens barrel 200, the battery storage unit 300, the strobe unit 400, the subchassis 302, and the display unit 500 are attached to the main chassis 303. The lens barrel 200, the battery housing unit 300, and the subchassis 302 are attached to the main chassis 303 so as to be aligned along the surface of the main chassis 303 on one side of the main chassis 303. The main chassis 303 corresponds to an example of the chassis member of the present invention. The lens barrel 200 corresponds to an example of the first holding member of the present invention. The battery storage unit 300 corresponds to an example of the second holding member of the present invention.

  A connector 606 (see FIG. 5B) is mounted on the substrate surface of the main substrate 605 on the lens barrel 200 side. The flexible substrate 202 passes between the lens barrel 200 and the main chassis 303, and then the connection portion is connected to the connector 606 mounted on the main substrate 605. As a result, the image sensor 201 and the main board 605 are electrically connected via the flexible board 202.

  The image sensor 201 is fixed to the fixing plate 203 integrally with the flexible substrate 202. The fixing plate 203 is provided so that its position and inclination can be adjusted with respect to the optical axis of the lens barrel 200, and the light receiving surface of the image sensor 201 is aligned with high accuracy with respect to the imaging surface of the photographing optical system. It is possible.

  Here, the length of the flexible substrate 202 is set to be longer with a margin in consideration of misalignment of the mounting positions of the image sensor 201 and the connector 606, adjustment of surface tilt adjustment of the image sensor 201, and the like.

  FIG. 3A is a schematic diagram showing a wiring pattern of the first wiring portion 202a when the flexible substrate 202 is viewed from the front side of the camera body 100. FIG. FIG. 3B is a schematic diagram illustrating a wiring pattern of the second wiring portion 202 b when the flexible substrate 202 is viewed from the back side of the camera body 100.

  As shown in FIGS. 3A and 3B, metal patterns made of copper foil are formed on both surfaces of the flexible substrate 202. By connecting the metal patterns on both surfaces of the flexible substrate 202 by through-hole plating or the like, the flexible substrate 202 functions as a circuit substrate capable of wiring on both sides.

  The imaging element 201 is mounted on the first wiring portion 202 a when the flexible substrate 202 is viewed from the front side of the camera body 100. The first wiring portion 202a includes a differential signal wiring pattern 204 that transfers image data photoelectrically converted by the image sensor 201, a wiring pattern 205 that controls the image sensor 201, a power supply wiring pattern 206 of the image sensor 201, and a ground. A wiring pattern 207a and the like are formed. In the first wiring portion 202a, a connector connection pattern 208 is formed at a location where it is connected to the connector 606 of the main board 605.

  On the other hand, a ground wiring pattern 207b that protects the wiring patterns 204 to 206 and 207a of the first wiring portion 202a is formed on the second wiring portion 202b when the flexible substrate 202 is viewed from the back side of the camera body 100. . Further, a reinforcing plate 209 is attached to the surface of the second wiring portion 202b corresponding to the connector connection pattern 208 of the first wiring portion 202a, that is, the back surface of the connector connection pattern 208.

  FIG. 4 is a cross-sectional view of the main part of the camera body 100. FIG. 5A is a view of the camera body 100 viewed from the back side with the back cover 110 and the display unit 500 removed. FIG. 5B is a view of the camera body 100 as viewed from the back side when the main chassis 303 is further removed from the state of FIG. FIG. 6 is a cross-sectional view taken along line BB in FIG. FIG. 7 is a partially enlarged cross-sectional view of FIG.

  As shown in FIGS. 4 to 6, in the state where the flexible board 202 is connected to the connector 606, the surplus portion of the flexible board 202 is pressed against the lens barrel 200 in the vicinity of the main board 605. One convex portion 304 is formed.

  Similarly, the main chassis 303 is formed with a second convex portion 305 that presses the surplus portion of the flexible substrate 202 toward the lens barrel 200 in the vicinity of the imaging element 201. In this embodiment, the 1st convex part 304 and the 2nd convex part 305 are mutually spaced apart and arrange | positioned in the width direction of the flexible substrate 202 (refer FIG. 6).

  In the lens barrel 200, a first concave portion 210 is formed to project at a position facing the first convex portion 304. In the lens barrel 200, a second concave portion 211 is formed so as to protrude at a position facing the second convex portion 305. In the first concave portion 210 and the second concave portion 211, the surplus portion of the flexible substrate 202 pressed by the first convex portion 304 and the second convex portion 305 is retracted and accommodated.

  The connector 606 is configured to hold the flexible substrate 202 in a direction inclined toward the subject with respect to a plane orthogonal to the optical axis in a state where the flexible substrate 202 is connected. The battery housing part 300 is provided with a receiving part 306 that abuts against the subject-side surface of the flexible substrate 202 between the connector 606 and the first convex part 304 of the main chassis 303.

  The receiving portion 306 is disposed closer to the first convex portion 304 than the connector 606, and the connector 606 is disposed closer to the subject than the receiving surface of the flexible substrate 202 of the receiving portion 306. The receiving surface of the receiving portion 306 is an inclined surface that is inclined toward the connector 606 with respect to a plane orthogonal to the optical axis. The receiving portion 306 corresponds to an example of the contact portion of the present invention. Therefore, the flexible substrate 202 extends in a direction inclined toward the subject with respect to a plane orthogonal to the optical axis in a state where movement is restricted by the first convex portion 304 and the receiving portion 306, and is connected to the connector 606. .

  In a state where the flexible substrate 202 is connected to the connector 606, the end portion 209 a on the side away from the connector 606 of the reinforcing plate 209 extends to a position reaching the receiving portion 306. On the main substrate 605, an element 607 is mounted in the vicinity of the connection port 606a of the flexible substrate 202 of the connector 606.

  In addition, as shown in FIG. 6, between the two first convex portions 304 in the width direction of the flexible substrate 202 and between the two second convex portions 305, there are retreat concave portions 307 that are recessed on the back side. It is provided along the longitudinal direction of the flexible substrate 202.

  The retracting recess 307 avoids contact between the differential signal wiring pattern 204 of the flexible substrate 202 and the main chassis 303 so as not to affect the impedance control of the differential signal.

  Here, as shown in FIG. 7, the first convex portion 304 is along a line connecting the receiving surface of the receiving portion 306 and the connection port 606 a of the connector 606 in a state where the flexible substrate 202 is connected to the connector 606. It is arranged on the extended line of the flexible substrate 202.

  The width H1 of the first recess 210 formed in the lens barrel 200 is larger than the width H2 of the first protrusion 304. Similarly, the width of the second recess 211 formed in the lens barrel 200 is also larger than the width of the second protrusion 305. Thereby, the flexible substrate 202 pressed against the convex portions 304 and 305 can be retracted to the concave portions 210 and 211 without interfering with the concave portions 210 and 211.

  As described above, in the present embodiment, the surplus portion after assembly of the flexible substrate 202 having a long length with a margin is retracted to the first recess 210 and the second recess 211. Yes. For this reason, it can suppress that the excessive part of the flexible substrate 202 after an assembly | attachment deform | transforms carelessly, and it can prevent that pressing force and tension | tensile_strength act on other components.

  Specifically, in the present embodiment, the excess portion of the flexible substrate 202 after assembly is inadvertently deformed so that the pressing force does not act on the display screen of the display unit 500, and moiré occurs. Can be avoided. Further, in this embodiment, an excessive portion of the flexible substrate 202 after assembly is inadvertently deformed so that an excessive tensile force does not act on a connection portion (soldering portion) between the flexible substrate 202 and the image sensor 201. Can be.

(Second Embodiment)
FIG. 8 is a cross-sectional view of the main part of the camera body 100 in the digital camera which is the second embodiment of the electronic apparatus of the present invention. In addition, about the part which overlaps or corresponds to the said 1st Embodiment, the same code | symbol is attached | subjected to a figure and the description is abbreviate | omitted.

  In the digital camera of this embodiment, as shown in FIG. 8, a BtoB connector 308 is mounted on a portion of the connector connection pattern 208 (see FIG. 3A) of the flexible substrate 202. On the other hand, a BtoB connector 309 to which the BtoB connector 308 is fitted in the optical axis direction is mounted on the main board 605. By fitting the BtoB connector 308 of the flexible board 202 to the BtoB connector 309 of the main board 605 in the optical axis direction, the main board 605 and the flexible board 202 are electrically connected.

  Further, the receiving surface of the receiving portion 306 that supports the flexible substrate 202 in the vicinity of the first convex portion 304 is formed along a plane perpendicular to the optical axis. Therefore, the flexible substrate 202 extends in a direction along a plane orthogonal to the optical axis in a state where the movement is restricted by the first convex portion 304 and the receiving portion 306, and the BtoB connector 308 is connected to the BtoB connector 309 of the main substrate 605. Are fitted in the optical axis direction. Other configurations and operational effects are the same as those in the first embodiment.

  The configuration of the present invention is not limited to those exemplified in the above embodiments, and the material, shape, dimensions, form, number, arrangement location, and the like are appropriately changed without departing from the gist of the present invention. Is possible.

DESCRIPTION OF SYMBOLS 100 Camera main body 200 Lens barrel 201 Image pick-up element 202 Flexible substrate 210 1st recessed part 211 2nd recessed part 300 Battery storage part 303 Main chassis 304 1st convex part 305 2nd convex part 306 Receiving part 606 Connector

Claims (4)

An image sensor;
A flexible substrate on which the image sensor is mounted;
A first holding member for holding the image sensor;
A circuit board capable of electrically connecting the flexible board;
A second holding member for holding the circuit board;
A chassis member to which the first holding member and the second holding member are attached;
The first holding member and the second holding member are attached to the chassis member so that the imaging element and the circuit board are arranged along the surface of the chassis member on one surface side of the chassis member. And
On the chassis member, a convex portion is formed to project to the one surface side of the chassis member,
The first holding member has a recess formed at a position facing the projection of the chassis member.
The electronic device, wherein the flexible substrate passes between the convex portion and the concave portion and is electrically connected to the circuit board.   2. The electronic apparatus according to claim 1, wherein the second holding member is formed with a contact portion that contacts the flexible substrate at a position that does not face the convex portion of the chassis member.   The electronic apparatus according to claim 1, wherein a differential signal wiring pattern is formed on the flexible substrate, and the convex portion is provided at a position that avoids the differential signal wiring pattern. The circuit board is mounted with a connector capable of connecting the connecting portion of the flexible board,
A reinforcing plate is provided on the back surface of the connecting portion of the flexible substrate,
4. The electronic device according to claim 1, wherein the reinforcing plate is arranged to extend to the contact portion of the second holding member. 5.