JP2015216238A - Mounting structure and mounting method of electronic component - Google Patents
Mounting structure and mounting method of electronic component Download PDFInfo
- Publication number
- JP2015216238A JP2015216238A JP2014098210A JP2014098210A JP2015216238A JP 2015216238 A JP2015216238 A JP 2015216238A JP 2014098210 A JP2014098210 A JP 2014098210A JP 2014098210 A JP2014098210 A JP 2014098210A JP 2015216238 A JP2015216238 A JP 2015216238A
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- electronic component
- support member
- mounting member
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/28—Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices with other electric components not covered by this subclass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
Abstract
Description
本発明は、電解コンデンサ等の電子部品がその長手方向を基板実装面に沿わせて実装するための電子部品の実装構造および実装方法に関する。 The present invention relates to an electronic component mounting structure and mounting method for mounting an electronic component such as an electrolytic capacitor along a longitudinal direction of a substrate mounting surface.
電子部品の中には、円柱状のアルミニウム電解コンデンサのように大型のものが存在する。たとえば、１Ｕタイプの電解コンデンサは実装高さが約４４ｍｍであり、プリント基板に起立状態で実装すると、薄型筐体内で収納することはできない。 Some electronic components are large, such as cylindrical aluminum electrolytic capacitors. For example, a 1U type electrolytic capacitor has a mounting height of about 44 mm and cannot be housed in a thin housing when mounted on a printed circuit board in an upright state.
したがって、従来は、小容量の実装高さの低いコンデンサを複数個並べて実装するか、もしくは大型のコンデンサがその長手方向を基板実装面に沿わせて実装するという対策を採っていた。 Therefore, conventionally, a countermeasure has been taken in which a plurality of capacitors each having a small capacity and a low mounting height are mounted side by side, or a large capacitor is mounted with its longitudinal direction along the board mounting surface.
電子部品がその長手方向を基板実装面に沿わせて実装する構造に関する技術としては、たとえば、電気・電子部品をプリント基板に実装するにあたり、複数の接続端子が突出する部品下面をプリント基板に対し略直交するような横向きの実装とし、かつ複数の接続端子のうち一つをプリント基板の上方空間に空中配索される電源供給用のバスバーに接続した基板装置が開示されている（特許文献１参照）。 For example, when mounting electrical / electronic components on a printed circuit board, the bottom surface of the part from which multiple connection terminals protrude is attached to the printed circuit board. There is disclosed a board device that is mounted in a sideways orientation that is substantially orthogonal, and one of a plurality of connection terminals is connected to a power supply bus bar that is routed in the space above the printed board (Patent Document 1). reference).
ところで、従来の小容量の実装高さの低いコンデンサを複数個並べて実装する対策は、実装作業の工数が増加し、実装作業が煩雑であった。 By the way, the conventional measures for arranging a plurality of capacitors having a small capacity and a low mounting height have increased the number of man-hours for the mounting work and the mounting work is complicated.
他方、大型のコンデンサを横向きで実装する対策は、実装スペースが狭小である場合に、実装作業の効率が悪くなり、実装作業が煩雑であった。 On the other hand, as a countermeasure for mounting a large capacitor in a horizontal direction, when the mounting space is small, the efficiency of the mounting work is deteriorated and the mounting work is complicated.
また、特許文献１の技術は、上記と同様に実装スペースが狭小である場合に、実装作業の効率が悪くなり、実装作業が煩雑となる。 Further, in the technique of Patent Document 1, when the mounting space is narrow as described above, the efficiency of the mounting work is deteriorated and the mounting work is complicated.
本発明は、上記の事情に鑑みてなされたものであり、簡単な構造で、大型の電子部品の実装の作業効率を向上させて、実装作業の工数を低減することができ、薄型筐体内に収納することができる電子部品の実装構造および実装方法の提供を目的とする。 The present invention has been made in view of the above circumstances, has a simple structure, can improve the work efficiency of mounting a large-sized electronic component, and can reduce the man-hours of the mounting work. It is an object of the present invention to provide a mounting structure and mounting method for electronic components that can be stored.
上記目的を達成するための本発明に係る電子部品の実装構造は、支持部材と装着部材を備える。上記支持部材は、基板上に固定され、軌道部を有する。上記装着部材は、本体部に電子部品がその長手方向を基板実装面に沿わせて取り付けられ、上記軌道部に沿って案内されるガイド部を有する。 In order to achieve the above object, a mounting structure for an electronic component according to the present invention includes a support member and a mounting member. The support member is fixed on the substrate and has a track portion. The mounting member includes a guide portion in which an electronic component is attached to the main body portion with its longitudinal direction being along the board mounting surface, and is guided along the track portion.
上記支持部材には、取付孔を有する着座部が形成される。上記装着部材には、取付孔を有する当接部が形成される。上記電子部品が取り付けられた上記装着部材の上記当接部を上記支持部材の上記着座部に当接させて、連通した上記取付孔に係止部材が固定されることを特徴とする。 A seating portion having a mounting hole is formed on the support member. The mounting member is formed with a contact portion having a mounting hole. The contact portion of the mounting member to which the electronic component is attached is brought into contact with the seating portion of the support member, and the locking member is fixed to the communicating attachment hole.
また、本発明に係る電子部品の実装方法は、基板上に支持部材を固定する手順と、装着部材の本体部に電子部品を取り付ける手順と、前記支持部材の軌道部に沿って、前記装着部材のガイド部を案内する手順と、前記支持部材の着座部に前記装着部材の当接部を当接させて、係止部材で固定する手順と、を有することを特徴とする。 The electronic component mounting method according to the present invention includes a procedure for fixing a support member on a substrate, a procedure for attaching an electronic component to a main body portion of the mounting member, and the mounting member along the track portion of the support member. And a step of bringing the contact portion of the mounting member into contact with the seating portion of the support member and fixing the contact portion with the locking member.
本発明に係る電子部品の実装構造は、装着部材の本体部に、電子部品がその長手方向を基板実装面に沿わせて取り付けられる。基板上に固定された支持部材の軌道部に沿って、電子部品が取り付けられた装着部材のガイド部が案内される。支持部材の着座部に装着部材の当接部が当接すると、双方の取付孔が連通する。連通した取付孔には係止部材が固定され、支持部材と装着部材が一体化される。 In the electronic component mounting structure according to the present invention, the electronic component is attached to the main body of the mounting member with its longitudinal direction along the board mounting surface. A guide portion of the mounting member to which the electronic component is attached is guided along the track portion of the support member fixed on the substrate. When the contact portion of the mounting member comes into contact with the seating portion of the support member, both the mounting holes communicate with each other. A locking member is fixed to the communicating mounting hole, and the support member and the mounting member are integrated.
したがって、本発明によれば、簡単な構造で、大型の電子部品の実装の作業効率を向上させて、実装作業の工数を低減することができ、薄型筐体内に収納可能な電子部品の実装構造を提供することができる。 Therefore, according to the present invention, it is possible to improve the work efficiency of mounting a large-sized electronic component with a simple structure, reduce the man-hour of the mounting work, and mount the electronic component in a thin housing. Can be provided.
以下、図面を参照して、本実施形態に係る電子部品の実装構造について説明する。 The electronic component mounting structure according to the present embodiment will be described below with reference to the drawings.
本実施形態に係る電子部品の実装構造は、装着部材の本体部に、電子部品がその長手方向を基板実装面に沿わせた転倒姿勢で取り付けられる。基板上に起立固定された支持部材の軌道部に沿って、電子部品が取り付けられた装着部材のガイド部が案内される。支持部材の着座部に装着部材の当接部が当接すると、双方の取付孔が連通する。連通した取付孔には係止部材が固定され、支持部材と装着部材が一体化される。したがって、本実施の形態によれば、簡単な構造で、大型の電子部品の転倒姿勢における実装の作業効率を向上させて、実装作業の工数を低減することができ、薄型筐体内に収納可能な電子部品の実装構造を実現することができるようになる。 In the electronic component mounting structure according to the present embodiment, the electronic component is attached to the main body portion of the mounting member in a falling posture with the longitudinal direction thereof being along the board mounting surface. A guide portion of the mounting member to which the electronic component is attached is guided along the track portion of the support member that is erected and fixed on the substrate. When the contact portion of the mounting member comes into contact with the seating portion of the support member, both the mounting holes communicate with each other. A locking member is fixed to the communicating mounting hole, and the support member and the mounting member are integrated. Therefore, according to the present embodiment, it is possible to improve the work efficiency of mounting in a fall posture of a large-sized electronic component with a simple structure, to reduce the man-hours for mounting work, and to be housed in a thin housing An electronic component mounting structure can be realized.
〔電子部品の実装構造の構成〕
まず、図１および図２を参照して、本実施形態に係る電子部品の実装構造の構成について説明する。図１は本実施形態に係る電子部品の実装構造の斜視図である。図２は図１の要部拡大図である。
[Configuration of electronic component mounting structure]
First, the configuration of the electronic component mounting structure according to the present embodiment will be described with reference to FIGS. FIG. 1 is a perspective view of a mounting structure for an electronic component according to this embodiment. FIG. 2 is an enlarged view of a main part of FIG.
本実施形態に係る電子部品の実装構造は、薄型筐体内に収納される基板上への大型の電子部品の実装に好適である。無停電電源装置（ＵＰＳ）では、たとえば、筐体内の上部にバッテリパックや主回路モジュールが収納される。したがって、ＵＳＰでは、電子部品を実装したプリント基板は、たとえば、底部の薄型筐体内に収納される。 The electronic component mounting structure according to the present embodiment is suitable for mounting a large electronic component on a substrate housed in a thin casing. In an uninterruptible power supply (UPS), for example, a battery pack and a main circuit module are housed in an upper part of a housing. Therefore, in USP, a printed circuit board on which electronic components are mounted is housed in, for example, a thin casing at the bottom.
図１および図２に示すように、本実施形態に係る電子部品の実装構造１００は、支持部材２０と装着部材３０を有する。 As shown in FIGS. 1 and 2, the electronic component mounting structure 100 according to the present embodiment includes a support member 20 and a mounting member 30.
支持部材２０は、基板１０上に起立させて固定される。支持部材２０は、当該支持部材２０の下端部が基板１０上に半田等のろう付けにより固定される。 The support member 20 is fixed upright on the substrate 10. The support member 20 has its lower end fixed to the substrate 10 by soldering or the like.
支持部材２０は、たとえば、チャンネル状（コの字状）に成形された板金により形成されている。支持部材２０の両端部は一方の面側へ折り曲げ成形され、直条の軌道部２２が形成されている。直条の軌道部２２は、基板１０に対して起立している。 The support member 20 is formed of, for example, a sheet metal formed in a channel shape (U-shape). Both end portions of the support member 20 are bent toward one surface side to form straight track portions 22. The straight track portion 22 stands with respect to the substrate 10.
また、支持部材２０の上端部には、着座部２３が形成されている。着座部２３は、支持部材２０の本体部２１に対して、直角もしくは略直角となるように折り曲げ成形されている。着座部２３の中央部には、後述する係止部材５０を取り付けるための取付孔２４が穿設されている。 Further, a seating portion 23 is formed at the upper end portion of the support member 20. The seating portion 23 is bent and formed so as to be perpendicular or substantially perpendicular to the main body portion 21 of the support member 20. An attachment hole 24 for attaching a locking member 50 described later is formed in the central portion of the seating portion 23.
装着部材３０は、たとえば、略チャンネル状（略コの字状）に成形された板金により形成されている。装着部材３０の本体部３１には、電子部品４０がその長手方向を基板１０の実装面に沿わせた転倒姿勢で取り付けられる。装着部材３０の本体部３１には、電子部品４０の座部４１の挿通孔４２に合わせて、取付孔３５が穿設されている。装着部材３０の本体部３１の取付孔３５に、電子部品４０の座部４１の挿通孔４２を一致させて、ビス５１を螺合固定することにより、装着部材３０の本体部３１に電子部品４０を取り付けることができる。 The mounting member 30 is formed of, for example, a sheet metal formed in a substantially channel shape (substantially U-shape). The electronic component 40 is attached to the main body portion 31 of the mounting member 30 in a falling posture with the longitudinal direction thereof being along the mounting surface of the substrate 10. A mounting hole 35 is formed in the main body 31 of the mounting member 30 so as to match the insertion hole 42 of the seat 41 of the electronic component 40. The insertion hole 35 of the seat part 41 of the electronic component 40 is aligned with the mounting hole 35 of the main body part 31 of the mounting member 30 and the screw 51 is screwed and fixed, whereby the electronic component 40 is fixed to the main body part 31 of the mounting member 30. Can be attached.
なお、電子部品４０を取り付ける際には、装着部材３０の本体部３１を横転させて配置し、電子部品４０を正立させた状態で取り付けることができる。例示した電子部品４０は実装高さが４４ｍｍの電解コンデンサであるが、電子部品４０は電解コンデンサに限定されない。 In addition, when attaching the electronic component 40, the main-body part 31 of the mounting member 30 can be turned over and can be attached in the state where the electronic component 40 was set upright. The illustrated electronic component 40 is an electrolytic capacitor having a mounting height of 44 mm, but the electronic component 40 is not limited to an electrolytic capacitor.
装着部材３０の本体部３１の両端部には、支持部材２０の軌道部２２に沿って案内されるガイド部３２が形成されている。ガイド部３２は、装着部材３０の両端部を一方の面側へ折り曲げて成形される。ガイド部３２の端縁部には、ホールド部３２Ａが形成されている。ホールド部３２Ａは、支持部材２０の軌道部２２を囲い込むようにＬ字状に屈曲している。 Guide portions 32 that are guided along the track portion 22 of the support member 20 are formed at both ends of the main body portion 31 of the mounting member 30. The guide portion 32 is formed by bending both end portions of the mounting member 30 to one surface side. A holding portion 32 </ b> A is formed at the edge of the guide portion 32. The hold portion 32 </ b> A is bent in an L shape so as to surround the track portion 22 of the support member 20.
また、装着部材３０の上端部には、当接部３３が形成されている。当接部３３は、装着部材３０の本体部３１に対して、直角もしくは略直角となるように折り曲げ成形されている。当接部３３の中央部には、後述する係止部材５０を取り付けるための取付孔３４が穿設されている。 A contact portion 33 is formed at the upper end of the mounting member 30. The contact portion 33 is bent and formed so as to be perpendicular or substantially perpendicular to the body portion 31 of the mounting member 30. An attachment hole 34 for attaching a locking member 50 described later is formed in the central portion of the contact portion 33.
支持部材２０および装着部材３０の構成材料としては、たとえば、折り曲げ成形が容易なアルミニウム板材や軟鋼板材等の板金材が採用されるが、例示の材質に限定されない。 As a constituent material of the support member 20 and the mounting member 30, for example, a sheet metal material such as an aluminum plate material or a mild steel plate material that can be easily bent is employed, but is not limited to the exemplified materials.
電子部品４０が取り付けられた装着部材３０のガイド部３２は、基板１０上に起立固定された支持部材２０の軌道部２２に沿って案内される。装着部材３０の当接部３３は、支持部材２０の着座部２３に当接する。装着部材３０の当接部３３が支持部材２０の着座部２３に当接すると、当接部３３の取付孔３４と着座部２３の取付孔２４が連通する。連通した取付孔３４，２４には係止部材５０が固定され、支持部材２０と装着部材３０が一体化される。 The guide portion 32 of the mounting member 30 to which the electronic component 40 is attached is guided along the track portion 22 of the support member 20 that is erected and fixed on the substrate 10. The contact portion 33 of the mounting member 30 contacts the seat portion 23 of the support member 20. When the contact portion 33 of the mounting member 30 contacts the seating portion 23 of the support member 20, the attachment hole 34 of the contact portion 33 and the attachment hole 24 of the seating portion 23 communicate with each other. The locking member 50 is fixed to the connecting mounting holes 34 and 24, and the support member 20 and the mounting member 30 are integrated.
係止部材５０としては、たとえば、簡単に固定でき、着脱可能なことからビスが採用されるが、他の形式の係止部材であっても構わない。 As the locking member 50, for example, a screw is adopted because it can be easily fixed and is detachable, but other types of locking members may be used.
〔電子部品の実装構造の作用〕
次に、図１および図２を参照して、本実施形態に係る電子部品の実装構造１００の作用とともに、本実施形態に係る電子部品の実装方法について説明する。
[Operation of electronic component mounting structure]
Next, with reference to FIG. 1 and FIG. 2, the electronic component mounting method according to the present embodiment will be described together with the operation of the electronic component mounting structure 100 according to the present embodiment.
本実施形態に係る電子部品の実装方法は、基板上に支持部材を固定する手順と、装着部材の本体部に電子部品を取り付ける手順と、前記支持部材の軌道部に沿って、前記装着部材のガイド部を案内する手順と、前記支持部材の着座部に前記装着部材の当接部を当接させて、係止部材で固定する手順と、を有する。以下、本実施形態に係る電子部品の実装方法を具体的に説明する。 The mounting method of the electronic component according to the present embodiment includes a procedure for fixing the support member on the substrate, a procedure for attaching the electronic component to the main body portion of the mounting member, and the mounting member along the track portion of the support member. And a procedure of guiding the guide portion and a procedure of bringing the abutting portion of the mounting member into contact with the seating portion of the support member and fixing with the locking member. The electronic component mounting method according to the present embodiment will be specifically described below.
本実施形態に係る電子部品の実装方法は、まず、基板１０上に支持部材２０が起立させた状態で固定される。支持部材２０の固定には、たとえば、半田等のろう付けが採用される。 In the electronic component mounting method according to this embodiment, first, the support member 20 is fixed on the substrate 10 in a standing state. For example, soldering or the like is used for fixing the support member 20.
次に、装着部材３０の本体部３１に、電子部品４０が取り付けられる。装着部材３０の本体部３１の取付孔３５に、電子部品４０の座部４１の挿通孔４２を一致させ、ビス５１を螺合固定することにより、装着部材３０の本体部３１に、電子部品４０がその長手方向を基板実装面に沿わせた転倒姿勢で取り付けられる。電子部品４０を取り付ける際には、装着部材３０の本体部３１を横転させて配置し、電子部品４０を正立させた状態で取り付けることができる。 Next, the electronic component 40 is attached to the main body 31 of the mounting member 30. By aligning the insertion hole 42 of the seat portion 41 of the electronic component 40 with the mounting hole 35 of the main body portion 31 of the mounting member 30 and screwing and fixing the screw 51, the electronic component 40 is mounted on the main body portion 31 of the mounting member 30. Is attached in a falling posture with its longitudinal direction being along the board mounting surface. When the electronic component 40 is attached, the main body 31 of the mounting member 30 can be turned over to be attached in a state where the electronic component 40 is upright.
次に、基板１０上に起立固定された支持部材２０の直条の軌道部２２に沿って、電子部品４０が取り付けられた装着部材３０のガイド部３２が案内される。ガイド部３２の端縁部には、軌道部２２を囲い込むようにホールド部３２Ａが形成されている。したがって、装着部材３０のガイド部３２は、支持部材２０の軌道部２２から外れることはなく、装着部材３０のガタツキを防止することができる。 Next, the guide portion 32 of the mounting member 30 to which the electronic component 40 is attached is guided along the straight track portion 22 of the support member 20 that is erected and fixed on the substrate 10. A holding portion 32 </ b> A is formed at the edge portion of the guide portion 32 so as to surround the track portion 22. Therefore, the guide portion 32 of the mounting member 30 does not come off from the track portion 22 of the support member 20 and can prevent the mounting member 30 from rattling.
そのまま装着部材３０を降下させると、装着部材３０の当接部３３は支持部材２０の着座部２３に当接する。支持部材２０の着座部２３に装着部材３０の当接部３３が当接すると、装着部材３０の取付孔３４と支持部材２０の取付孔２４が連通する。連通した取付孔３４，３４に係止部材５０としてのビスを螺合固定すると、支持部材２０と装着部材３０が一体化される。 When the mounting member 30 is lowered as it is, the contact portion 33 of the mounting member 30 contacts the seating portion 23 of the support member 20. When the contact portion 33 of the mounting member 30 contacts the seating portion 23 of the support member 20, the mounting hole 34 of the mounting member 30 and the mounting hole 24 of the support member 20 communicate with each other. When the screws as the locking members 50 are screwed and fixed to the connecting mounting holes 34, 34, the support member 20 and the mounting member 30 are integrated.
なお、電子部品４０の端子部６０への電気的接続は、装着部材３０の本体部３１への電子部品４０の取り付け前に行ってもよいし、取り付け後に行ってもよい。 Note that the electrical connection of the electronic component 40 to the terminal portion 60 may be performed before or after the electronic component 40 is attached to the main body 31 of the mounting member 30.
すなわち、本実施形態に係る電子部品の実装構造１００によれば、電子部品４０を予め装着部材３０の本体部３１に取り付けておくため、狭い場所で非効率的な実装作業を行う必要はない。すなわち、本実施形態に係る電子部品の実装構造１００は、簡単な構造で、大型の電子部品４０の転倒姿勢における実装の作業効率を向上させて、実装作業の工数を低減することができる。 That is, according to the electronic component mounting structure 100 according to the present embodiment, since the electronic component 40 is attached to the main body 31 of the mounting member 30 in advance, it is not necessary to perform an inefficient mounting operation in a narrow place. That is, the electronic component mounting structure 100 according to the present embodiment has a simple structure, and can improve the mounting work efficiency in the fall posture of the large electronic component 40 and reduce the number of mounting work steps.
また、本実施形態によれば、ＵＰＳの底部筐体のように薄型の筐体１１内に収納可能な電子部品の実装構造１００を実現することができる。 In addition, according to the present embodiment, it is possible to realize the electronic component mounting structure 100 that can be housed in a thin casing 11 such as a bottom casing of a UPS.
以上、本発明の好適な実施形態を説明したが、これらは本発明の説明のための例示であり、本発明の範囲をこれらの実施形態にのみ限定する趣旨ではない。本発明は、その要旨を逸脱しない範囲で、上記実施形態とは異なる種々の態様で実施することができる。 The preferred embodiments of the present invention have been described above, but these are examples for explaining the present invention, and the scope of the present invention is not intended to be limited to these embodiments. The present invention can be implemented in various modes different from the above-described embodiments without departing from the gist thereof.
たとえば、上記の実施形態では、基板１０上に支持部材２０を起立させて固定しているが、基板１０の実装面に沿って支持部材２０を固定してもよい。 For example, in the above embodiment, the support member 20 is raised and fixed on the substrate 10, but the support member 20 may be fixed along the mounting surface of the substrate 10.
１０ 基板、
２０ 支持部材、
２２ 軌道部、
２３ 着座部、
２４，３４ 取付孔、
３０ 装着部材、
３１ 装着部材の本体部、
３２ ガイド部、
３３ 当接部、
４０ 電子部品、
５０ 係止部材、
１００ 電子部品の実装構造。
10 substrates,
20 support member,
22 Track part,
23 Seating part,
24, 34 mounting holes,
30 mounting member,
31 The body part of the mounting member,
32 guide section,
33 abutting part,
40 electronic components,
50 locking member,
100 Electronic component mounting structure.
Claims (3)
本体部に電子部品がその長手方向を基板実装面に沿わせて取り付けられ、前記軌道部に沿って案内されるガイド部を有する装着部材と、を備え、
前記支持部材には取付孔を有する着座部が形成されるとともに、前記装着部材には取付孔を有する当接部が形成され、
前記電子部品が取り付けられた前記装着部材の前記当接部を前記支持部材の前記着座部に当接させて、連通した前記取付孔に係止部材が固定されることを特徴とする電子部品の実装構造。 A support member fixed on the substrate and having a track portion;
An electronic component is attached to the main body portion with its longitudinal direction along the board mounting surface, and a mounting member having a guide portion guided along the track portion, and
A seating portion having a mounting hole is formed on the support member, and a contact portion having a mounting hole is formed on the mounting member,
An abutting portion of the mounting member to which the electronic component is attached is brought into contact with the seating portion of the support member, and a locking member is fixed to the communicating attachment hole. Mounting structure.
装着部材の本体部に電子部品を取り付ける手順と、
前記支持部材の軌道部に沿って、前記装着部材のガイド部を案内する手順と、
前記支持部材の着座部に前記装着部材の当接部を当接させて、係止部材で固定する手順と、
を有することを特徴とする電子部品の実装方法。 Fixing the support member on the substrate; and
Attaching electronic components to the body of the mounting member;
A procedure for guiding the guide portion of the mounting member along the track portion of the support member;
The contact portion of the mounting member is brought into contact with the seating portion of the support member and fixed with a locking member;
An electronic component mounting method characterized by comprising:
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014098210A JP2015216238A (en) | 2014-05-11 | 2014-05-11 | Mounting structure and mounting method of electronic component |
| CN201510220915.8A CN105101730A (en) | 2014-05-11 | 2015-05-04 | Mounting structure and mounting method for electronic component |
| PH12015000152A PH12015000152A1 (en) | 2014-05-11 | 2015-05-08 | Mounting structure and mounting method for electronic component |
| DE102015006087.2A DE102015006087A1 (en) | 2014-05-11 | 2015-05-11 | MOUNTING STRUCTURE AND ASSEMBLY METHOD FOR AN ELECTRONIC COMPONENT |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014098210A JP2015216238A (en) | 2014-05-11 | 2014-05-11 | Mounting structure and mounting method of electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2015216238A true JP2015216238A (en) | 2015-12-03 |
Family
ID=54336699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014098210A Pending JP2015216238A (en) | 2014-05-11 | 2014-05-11 | Mounting structure and mounting method of electronic component |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2015216238A (en) |
| CN (1) | CN105101730A (en) |
| DE (1) | DE102015006087A1 (en) |
| PH (1) | PH12015000152A1 (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5879878U (en) * | 1981-11-18 | 1983-05-30 | 沖電気工業株式会社 | Plugin structure |
| JPH0410607A (en) * | 1990-04-27 | 1992-01-14 | Fuji Electric Co Ltd | Capacitor mounting apparatus |
| JPH0518065U (en) * | 1991-08-09 | 1993-03-05 | 富士通テン株式会社 | Printed circuit board mounting structure |
| JPH08298367A (en) * | 1995-04-26 | 1996-11-12 | Sony Corp | Mounting method of capacitor with lead terminals and mounting structure |
| JP2012049253A (en) * | 2010-08-25 | 2012-03-08 | Kitagawa Ind Co Ltd | Capacitor holder |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006294311A (en) * | 2005-04-06 | 2006-10-26 | Smk Corp | Structure for mounting terminal and the like onto housing |
| JP2011061104A (en) | 2009-09-14 | 2011-03-24 | Yazaki Corp | Board device |
-
2014
- 2014-05-11 JP JP2014098210A patent/JP2015216238A/en active Pending
-
2015
- 2015-05-04 CN CN201510220915.8A patent/CN105101730A/en active Pending
- 2015-05-08 PH PH12015000152A patent/PH12015000152A1/en unknown
- 2015-05-11 DE DE102015006087.2A patent/DE102015006087A1/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5879878U (en) * | 1981-11-18 | 1983-05-30 | 沖電気工業株式会社 | Plugin structure |
| JPH0410607A (en) * | 1990-04-27 | 1992-01-14 | Fuji Electric Co Ltd | Capacitor mounting apparatus |
| JPH0518065U (en) * | 1991-08-09 | 1993-03-05 | 富士通テン株式会社 | Printed circuit board mounting structure |
| JPH08298367A (en) * | 1995-04-26 | 1996-11-12 | Sony Corp | Mounting method of capacitor with lead terminals and mounting structure |
| JP2012049253A (en) * | 2010-08-25 | 2012-03-08 | Kitagawa Ind Co Ltd | Capacitor holder |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102015006087A1 (en) | 2015-11-12 |
| PH12015000152A1 (en) | 2016-11-21 |
| CN105101730A (en) | 2015-11-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100816619B1 (en) | Board mounted terminal construction | |
| US8011951B2 (en) | Rail mounting apparatus | |
| US10985429B2 (en) | Connection module | |
| JP4632353B2 (en) | Storage element connection structure and storage element module | |
| JP2015026517A (en) | Nut press-fitting holding structure | |
| JP2012222168A (en) | Electronic module | |
| US20190239378A1 (en) | Circuit board fixation structure and electrical apparatus | |
| WO2019151414A1 (en) | Electronic circuit | |
| JP2016015821A (en) | Electric connection box | |
| KR20130018521A (en) | Terminal for electrical connection and method for mounting the terminal | |
| JP2006237022A (en) | Conduction terminal | |
| JP2015216238A (en) | Mounting structure and mounting method of electronic component | |
| US8254146B2 (en) | Detachable capacitor device | |
| JP4010512B2 (en) | connector | |
| JP2009193677A (en) | Adapter, socket, electronic device, and mounting method | |
| JP2014236564A (en) | Bus bar | |
| US20130171893A1 (en) | Electrical connecting device | |
| JP7107738B2 (en) | Guide support structure for bus bar for circuit board mounting, mounting board, and electric connection box | |
| JP2008016547A (en) | Substrate fixing structure | |
| JP2009032863A (en) | Cement resistor attaching structure | |
| JP5124301B2 (en) | Sub board mounting structure | |
| JP2015092435A (en) | Screw terminal block for printed board, and printed board mounted with the screw terminal block | |
| JP2012160286A (en) | Terminal block | |
| JP2006066123A (en) | Connecting terminal structure of electric connection box | |
| JP2006148011A (en) | Fitting structure for electric element to substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20160215 |
|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20160223 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170209 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20171027 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20171031 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20180424 |