JP2015208753A - Molten solder feeding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a molten solder feeding device capable of feeding a minutely small amount of molten solder to a predetermined position with high accuracy.SOLUTION: A molten solder feeding device includes: a solder bath 1; a division plate 7; a shaft 3; and a compression gas supply port 6. The solder bath 1 may store molten solder 4 and an opening part 2a capable of discharging the molten solder 4 is formed in the solder bath 1. The division plate 7 is provided in the solder bath 1 and divides the solder bath 1 into a first solder bath 1a and a second solder bath 1b. The shaft 3 is provided in the solder bath 1, extends in a first direction that connects the first solder bath 1a with the second solder bath 1b, and may move in the first direction. The compression gas supply port 6 applies a pressure to the molten solder 4 with a gas in a direction such that the molten solder 4 in the solder tank 1 is discharged. A division plate opening hole 7a is formed so as to penetrate through the division plate 7. The shaft 3 opens and closes the division plate opening hole 7a thereby controlling discharge of the molten solder 4 in the opening part 2a.

Description

  The present invention relates to a molten solder supply apparatus, and more particularly to a molten solder supply apparatus for supplying a minute amount of molten solder to a fine region.

  As an apparatus for supplying molten solder, for example, in Patent Document 1, an opening hole is provided at the bottom of a solder tank provided with a heating mechanism, and the opening hole is opened and closed by moving a shaft provided in the solder tank up and down. Discloses an apparatus for discharging molten solder from the above.

  Patent Document 2 discloses an apparatus that discharges molten solder from a hole provided at the bottom of a solder bath by flowing gas into the solder bath from the top of the solder bath and applying pressure to the molten solder in the solder bath. Has been.

  Patent Document 3 discloses an apparatus that closes the outflow of molten metal from a discharge nozzle using a plate provided in an opening for discharging molten solder.

JP-A-60-92072 JP 2008-178892 A Japanese Patent Laid-Open No. 10-156520

  In recent years, with the miniaturization of semiconductor elements, electrodes on a substrate on which the semiconductor elements are placed tend to be miniaturized. For this reason, it is necessary to supply a very small amount of molten solder onto a fine electrode as a target with high accuracy.

  The apparatus of Patent Document 1 has a configuration in which an opening hole for supplying molten solder at the bottom of a solder tank and a shaft corresponding to an opening / closing valve for the opening hole are in direct contact with each other. For this reason, the opening hole rubs and wears and deforms when the shaft moves in the vertical direction, and when the opening hole is closed, the shaft cannot completely close the opening hole, and supply of molten solder in the opening hole There is a possibility of causing problems that make it difficult to control the supply amount, for example, the amount fluctuates unintentionally.

  In the apparatus of Patent Document 2, the molten solder is discharged by making the inside of the molten solder tank a positive pressure, and the discharge of the molten solder is stopped by making the inside of the molten solder tank a negative pressure. In this case, when the pressure in the molten solder tank is switched between a positive pressure and a negative pressure, the molten solder may be unintentionally discharged from a hole provided at the bottom of the solder tank due to the residual pressure. As described above, it may be insufficient to use only the pressure in the molten solder bath as a means for controlling the discharge of the molten solder.

  In the device of Patent Document 3, a plate is placed at the tip of the discharge nozzle, and the plate and the hydraulic cylinder that drives the plate have a considerable thickness. For this reason, it is necessary to increase the distance between the discharge nozzle and the target to which the solder is supplied by the thickness of the plate and the hydraulic cylinder. In order to supply a minute amount of molten solder onto a minute electrode with high accuracy, it is preferable to reduce the distance between the discharge nozzle and the target as much as possible. However, in Patent Document 3, since the distance is increased as described above, it is difficult to supply molten solder with high accuracy.

  This invention is made | formed in view of said subject, The objective is to provide the molten solder supply apparatus which can supply a micro amount molten solder to a desired position with high precision.

  In the molten solder supply apparatus of the present invention, a partition plate is provided in the solder tank, and the shaft controls the discharge of the molten solder by opening and closing the opening hole of the partition plate.

  According to the present invention, since the opening hole for discharging the molten solder to the outside of the solder bath is not opened and closed by the shaft, deformation due to wear of the opening hole can be suppressed, and the accuracy of supplying the molten solder can be improved. . Also, since the position accuracy with respect to the opening hole of the shaft, which is required when opening and closing the opening hole for discharging molten solder to the outside of the solder tank, is not required, an apparatus capable of controlling the pressure in the solder tank is easily manufactured. be able to.

1 is a cross-sectional view schematically showing a configuration of a molten solder supply device in Embodiment 1. FIG. It is sectional drawing which shows schematically the state which opened the partition plate opening hole of the molten solder supply apparatus of Embodiment 1. FIG. It is sectional drawing which shows schematically the state which closed the partition plate opening hole of the molten solder supply apparatus of Embodiment 1. FIG. It is sectional drawing which shows schematically the structure of the modification of the molten solder supply apparatus of Embodiment 1. FIG. FIG. 5 is a cross-sectional view schematically showing a configuration of a molten solder supply apparatus in a second embodiment. FIG. 10 is a cross-sectional view schematically showing a configuration of a molten solder supply device in a third embodiment. It is sectional drawing for demonstrating the effect of the molten solder supply apparatus of Embodiment 3. FIG. FIG. 10 is a cross sectional view schematically showing a configuration of a molten solder supply device in a fourth embodiment. FIG. 10 is a cross sectional view schematically showing a configuration of a molten solder supply device in a fifth embodiment. It is sectional drawing which shows schematically the state which opened the partition plate opening hole of the molten solder supply apparatus of Embodiment 5. FIG. It is sectional drawing which shows roughly the state which closed the partition plate opening hole of the molten solder supply apparatus of Embodiment 5. FIG. It is sectional drawing which shows schematically the 1st example of the aspect which supplies molten solder using the molten solder supply apparatus in Embodiment 6. FIG. It is sectional drawing which shows schematically the 2nd example of the aspect which supplies a molten solder using the molten solder supply apparatus in Embodiment 6. FIG.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(Embodiment 1)
First, the configuration of the molten solder supply apparatus according to the present embodiment will be described with reference to FIG. Referring to FIG. 1, molten solder supply apparatus 10 of the present embodiment mainly has solder bath 1, nozzle 2 included in solder bath 1, and shaft 3 installed in solder bath 1. ing.

  The solder tank 1 has a container-like configuration in which the molten solder 4 can be stored. Solder tank 1 may have a circular shape in plan view, or may have a square shape (rectangular shape).

  The nozzle 2 is a flat plate-like member installed as a bottom wall surface (lower surface in FIG. 1) of a region where the molten solder 4 in the solder bath 1 is accommodated, and the molten solder 4 in the solder bath 1 is It has a role of discharging out of the solder tank 1. Accordingly, the plate-like member extends in the left-right direction of FIG. 1 so that the nozzle 2 is connected to the outer edge portion of the cylindrical portion constituting the main body of the solder tank 1 in the bottom view of FIG. So that it is arranged.

  In the nozzle 2, for example, a nozzle opening hole 2 a as an opening for discharging the molten solder 4 in the solder tank 1 is formed in the center portion in plan view. The nozzle opening hole 2a is formed so as to penetrate the nozzle 2 from one main surface (for example, the upper surface in FIG. 1) of the nozzle 2 to the other main surface (for example, the lower surface in FIG. 1). ing. The nozzle opening hole 2a is preferably, for example, a circle having a diameter of 0.1 to 0.5 mm in a plan view, but is not limited thereto, and may have a square shape in a plan view, for example. Accordingly, the nozzle opening hole 2 a is formed so as to face the lower side of the solder tank 1. Therefore, the molten solder 4 is discharged from the nozzle opening hole 2a downward in the drawing.

  The shaft 3 is a member provided in the solder bath 1 and extending in the vertical direction (first direction) in FIG. 1, and can be moved in the solder bath 1 in the vertical direction in FIG. 1 as will be described later. The shaft 3 may be circular in a plan view, but may be square.

  A heater 5 as a heating mechanism is disposed in a cylindrical portion corresponding to the side portion of the entire solder tank 1 (in other words, near the inner wall surface of the region in the solder tank 1 where the molten solder 4 is accommodated). . The heater 5 extends along the vertical direction of FIG. The heater 5 is melted by heating the molten solder 4 in the solder bath 1 surrounded by the heater 5. For example, Sn-3Ag-0.5Cu or Sn-0.7Cu is preferably used as the molten solder 4.

  A pressurized gas supply port 6 is installed in the solder tank 1. In FIG. 1, a pressurized gas supply port 6 is disposed immediately above a region where the molten solder 4 in the solder tank 1 is accommodated. The pressurized gas supply port 6 is a device that applies a downward pressure in FIG. 1 to the molten solder 4 in the solder bath 1 by releasing gas into the solder bath 1.

  The gas discharged from the pressurized gas supply port 6 is preferably an inert gas such as nitrogen. If it does in this way, the oxidation of the surface of the molten solder 4 which may occur, for example when the surface of the molten solder 4 in the solder tank 1 is exposed to air | atmosphere can be suppressed.

  In the molten solder supply apparatus 10, the molten solder 4 is discharged downward from the nozzle opening hole 2a. For this reason, the pressurized gas supply port 6 applies downward pressure to the molten solder 4 in the direction in which the molten solder 4 is discharged. In this way, in order to allow the gas released from the pressurized gas supply port 6 to apply a downward pressure, the pressurized gas supply port 6 is located above the solder bath 1 and the gas outlet is located below. It is arranged to face.

  A partition plate 7 is disposed in the solder bath 1. The partition plate 7 is a plate-like member formed so as to divide the inside of the solder tank 1 into a first solder tank 1a above this and a second solder tank 1b below this. The main surface of the partition plate 7 is preferably arranged so as to extend in the left-right direction (second direction) in FIG. 1 so as to be substantially parallel to the main surface of the nozzle 2. Further, since the nozzle 2 is formed at the bottom of the second solder bath 1b, the nozzle opening hole 2a is connected to the inside of the second solder bath 1b (located below the first solder bath 1a). Is formed.

  The partition plate 7 is formed with a partition plate opening hole 7a, for example, in a central portion in plan view. The partition plate opening hole 7a passes through the partition plate 7 from one main surface (for example, the upper surface in FIG. 1) of the partition plate 7 to the other main surface (for example, the lower surface in FIG. 1) opposite to the main surface. Is formed.

  The partition plate opening hole 7a is preferably, for example, a circle having a diameter of 1 to 2 mm in a plan view, but is not limited thereto, and may have a square shape in a plan view, for example. As described above, the partition plate opening hole 7a is preferably formed to be larger than the nozzle opening hole 2a. In this case, however, the nozzle opening hole 2a completely overlaps with the partition plate opening hole 7a in plan view. It is preferable that the nozzle opening hole 2a be formed in the partition plate opening hole 7a in plan view.

  Since the partition plate 7 is disposed in the solder bath 1, the inside of the partition plate opening hole 7 a can be filled with the molten solder 4 in the same manner as other regions in the solder bath 1. The area | region in the partition plate 7 and the partition plate opening hole 7a is corresponded to the boundary part of the 1st solder tank 1a in the solder tank 1, and the 2nd solder tank 1b, and this area is here a 3rd solder tank. It is defined as 1c.

  The solder tank 1 (including the nozzle 2), the shaft 3, the pressurized gas supply port 6 and the partition plate 7 are preferably all formed of a corrosion-resistant material. Specifically, for example, stainless steel, titanium, etc. It is preferably formed of one selected from the group consisting of carbon.

  In the present embodiment, the shaft 3 is particularly disposed in the first solder bath 1a. The shaft 3 has a size such that the shaft tip 3a, which is the tip of the shaft 3, overlaps with the uppermost surface of the partition plate opening hole 7a in a plan view and can close the partition plate opening hole 7a from above. Therefore, the shaft 3 (particularly the shaft tip 3a) is larger than the partition plate opening hole 7a in a plan view and has a size extending to the outside of the partition plate opening hole 7a so as to completely overlap the partition plate opening hole 7a. It is preferable to be formed as follows.

  The shaft 3 can control the discharge of the molten solder 4 from the inside of the solder bath 1 to the outside of the solder bath 1 by opening and closing the partition plate opening hole 7a by the shaft tip portion 3a. Next, operation | movement of the molten solder supply apparatus 10 is demonstrated using FIG. 2 and FIG.

  As described above, the shaft 3 can move in the solder tank 1 (first solder tank 1a) in the vertical direction of FIG. Referring to FIG. 2, for example, shaft 3 moves upward in FIG. 1, shaft tip 3a, which is the lower end of shaft 3 in FIG. 1, is separated above partition plate 7, and the partition plate opening hole Consider a case where 7a is opened (not closed). 1 is preferably moved by a generally known air cylinder or motor, and more preferably by a generally known stepping motor from the viewpoint of improving responsiveness.

  In FIG. 2, gas is ejected downward from the pressurized gas supply port 6 in FIG. 2, whereby pressure is applied to the molten solder 4 in the solder tank 1 downward in FIG. 2. In FIG. 2, since the partition plate opening hole 7a is opened, the first solder bath 1a and the second solder bath 1b are not separated and are connected to one through the third solder bath 1c. It is in a state. For this reason, the downward pressure by the gas of the pressurized gas supply port 6 is applied not only to the molten solder 4 in the first solder tank 1a but also to the molten solder 4 in the second solder tank 1b.

  On the other hand, surface tension is applied to the molten solder 4 in the solder tank 1 (second solder tank 1b) in the nozzle opening hole 2a from the nozzle opening hole 2a upward in FIG.

  Therefore, in the state where the entire shaft 3 is disposed above the partition plate 7 (on the first solder tank 1a side) as shown in FIG. 2, the molten solder 4 in the second solder tank 1b has a nozzle. Rather than the upward surface tension from the opening hole 2a, the downward pressure due to the gas in the pressurized gas supply port 6 and the downward force due to the weight of the molten solder 4 in the first and second solder tanks 1a and 1b are better. Add a lot. For this reason, the molten solder 4 is discharged downwardly from the nozzle opening hole 2 a to the outside of the solder tank 1. At this time, if the target 8 to which the molten solder 4 is supplied is arranged so as to face the nozzle opening hole 2 a, the molten solder 4 can be supplied onto the target 8. The target 8 is, for example, an electronic substrate having a fine electrode or a fine electrode on the electronic substrate. In order to supply the molten solder 4 on the fine electrode with high accuracy so as not to shift the position, it is preferable to make the distance between the nozzle opening hole 2a and the target 8 (in the vertical direction in FIG. 2) as small as possible. .

  Next, referring to FIG. 3, for example, shaft 3 moves downward in FIG. 1, and shaft tip 3a comes into contact with the upper main surface of partition plate 7 so as to close partition plate opening hole 7a from above. Consider the situation. At this time, the partition plate opening hole 7a is in a closed state.

  Since the partition plate opening hole 7a is closed (closed), the molten solder 4 in the first solder bath 1a and the molten solder 4 in the second solder bath 1b are separated from each other by the partition plate 7. Become. For this reason, even if downward pressure due to the gas from the pressurized gas supply port 6 is applied to the molten solder 4 in the first solder tank 1a, at least the molten solder 4 in the second solder tank 1b is directed downward. No more pressure is applied. Further, since the first solder tank 1a and the second solder tank 1b are separated by the partition plate 7, the molten solder 4 in the second solder tank 1b is separated from the molten solder 4 in the first solder tank 1a. The downward force due to its own weight is no longer applied. For this reason, the downward force applied to the molten solder 4 in the second solder tank 1b is almost only the force due to the weight of the molten solder 4 in the second solder tank 1b.

  Therefore, the upward surface tension in FIG. 2 from the nozzle opening hole 2a is applied to the molten solder 4 in the second solder tank 1b more than the downward force. For this reason, the molten solder 4 is not discharged downward from the nozzle opening hole 2a. That is, the supply of the molten solder 4 onto the target 8 is stopped. By controlling the timing of stopping the supply of the molten solder 4, the amount of the molten solder 4 supplied onto the target 8 can be precisely controlled.

  In FIG. 1, as in FIG. 3, the shaft 3 is lowered and the shaft tip 3a is in a state of closing the partition plate opening hole 7a. Therefore, in FIG. 1, as in FIG. 3, the discharge of the molten solder 4 from the nozzle opening hole 2a is stopped.

  In the present embodiment, the nozzle opening hole 2a is always open without being blocked by, for example, the shaft tip 3a both when the partition plate opening hole 7a is opened and closed. That is, the nozzle opening hole 2a is separated from the shaft 3 (shaft tip 3a) both when the partition plate opening hole 7a is opened and closed. Here, when opened, the partition plate opening hole 7a is not blocked by the shaft tip 3a as shown in FIG. 2, and when closed, the partition plate opening hole 7a is connected to the shaft tip 3a as shown in FIG. It means the state of being blocked by each.

  Although the nozzle opening hole 2a is not closed as described above, the molten solder 4 can be discharged from the nozzle opening hole 2a only by closing the partition plate opening hole 7a with the shaft tip 3a as shown in FIG. Can be stopped.

  As shown in FIG. 2, when the partition plate opening hole 7a is opened, the molten solder 4 is discharged to the molten solder 4 according to the size of the nozzle opening hole 2a in plan view and the gas flowing out from the pressurized gas supply port 6. It depends on the applied pressure and the time when the partition plate opening hole 7a by the shaft 3 is opened. As an example, the nozzle opening hole 2a has a circular shape with a diameter of 0.15 mm in plan view, the pressure by the gas from the pressurized gas supply port 6 is 50 KPa, and the opening time of the partition plate opening hole 7a is 10 ms. In this case, 4 mg of molten solder 4 can be supplied.

  Next, a modification of the present embodiment will be described with reference to FIG. Referring to FIG. 4, the configuration of the molten solder supply device 10 of the modification is basically the same as that of the molten solder supply device 10 of FIG. 1, but a gas discharge port 9 is installed in the solder tank 1.

  In FIG. 4, a gas discharge port 9 is disposed immediately above a region where the molten solder 4 in the solder tank 1 is stored. However, the present invention is not limited thereto, and the gas discharge port 9 may be formed in a cylindrical portion corresponding to the side portion of the solder tank 1, for example.

  The inert gas from the pressurized gas supply port 6 applies downward pressure to the molten solder 4 in the second solder tank 1b when the shaft 3 is not opened as shown in FIG. 2 so as to block the partition plate opening hole 7a. From the viewpoint, it may be supplied at least when the partition plate opening hole 7a is opened. More specifically, the inert gas may be supplied at least between immediately before the partition plate opening hole 7a is opened and immediately after the partition plate opening hole 7a is closed (closed). However, from the viewpoint of suppressing oxidation due to exposure of the molten solder 4 in the solder tank 1 to the atmosphere, it is preferable that gas is supplied both when the partition plate opening hole 7a is opened and when it is closed. May be supplied.

  Therefore, in order to suppress the occurrence of the problem that the pressure due to the gas in the solder tank 1 abnormally increases even when the gas is constantly supplied into the solder tank 1, the molten solder supply apparatus 10 in FIG. A gas discharge port 9 having a function of discharging the gas in 1 to the outside of the solder tank 1 by a minute amount is provided.

Next, the effect of this Embodiment is demonstrated.
In this embodiment, when controlling the discharge of the molten solder 4 from the nozzle opening hole 2a, instead of bringing the shaft 3 into direct contact with the nozzle opening hole 2a, the end of the shaft is inserted into the partition plate opening hole 7a in the solder tank 1. The partition plate opening hole 7a that opens the portion 3a is opened and closed. As a result, as shown in FIG. 2 and FIG. 3, the surface tension applied upward to the molten solder 4 in the second solder bath 1b is applied downward to the molten solder 4 in the second solder bath 1b. By controlling the magnitude relationship of the force, it is possible to control whether or not the molten solder 4 is discharged downward from the nozzle opening hole 2a.

  Since the shaft 3 according to the present embodiment supplies a minute amount of the nozzle opening hole 2a to a minute region, it is normally separated from the nozzle opening hole 2a whose size in plan view is usually small. The possibility that the nozzle opening hole 2a is worn and deformed by receiving contact with the shaft 3 is eliminated. For this reason, there is a possibility that a problem such as unintentional leakage of the molten solder 4 from the deformed nozzle opening hole 2a or fluctuation (for example, abnormal increase) in the supply amount of the molten solder 4 from the nozzle opening hole 2a may occur. Can be reduced.

  This is because, when the partition plate opening hole 7a is closed, only the downward force due to the weight of the solder is applied to the molten solder 4 in the second solder tank 1b, whereas when the partition plate opening hole 7a is opened, pressure is applied. This is realized by adding a downward force due to the gas from the gas supply port 6 and a downward force due to the weight of the molten solder 4 in the first solder tank 1a.

  Further, for example, when switching from the open state of FIG. 2 to the closed state of FIG. 3 (that is, the supply of the molten solder 4 is finished), the nozzle opening hole 2a is not blocked. For this reason, for example, when this is closed, it is possible to suppress problems such as the molten solder 3 splashing vigorously from a minute gap in the nozzle opening hole 2a.

  Further, in the present embodiment, it is not necessary to align the shaft 3 with the nozzle opening hole 2a with high accuracy in order to penetrate and close the fine nozzle opening hole 2a. For this reason, the structure of the molten solder supply apparatus 10 whole can be simplified, and the molten solder supply apparatus 10 can be manufactured easily.

  Furthermore, the technique of supplying the solder melted by heating to the target 8 can reduce the number of steps compared to the technique of performing the heat treatment after supplying the solid solder. The molten solder supply device 10 has a configuration capable of supplying the solder 4 melted by the heating of the heater 5. Therefore, it is possible to reduce the number of processes and supply the molten solder 4 at a low cost.

(Embodiment 2)
Referring to FIG. 5, molten solder supply apparatus 20 of the present embodiment has a shape in which partition plate opening hole 7 a is inclined with respect to a direction perpendicular to the main surface of partition plate 7 (that is, the vertical direction in FIG. 5). Have. Further, at the lower end of the shaft 3 in FIG. 5, the outer edge in plan view is chamfered and has a shaft outer edge chamfered portion 3b. The shaft outer edge chamfered portion 3b has a shape inclined with respect to a direction (vertical direction in FIG. 5 in which the shaft 3 extends) perpendicular to the main surface of the partition plate 7 in the same manner as the partition plate opening hole 7a. It is preferable that it is inclined by substantially the same angle as the partition plate opening hole 7a with respect to the extending direction of the.

  FIG. 5 shows a closed state in which the shaft 3 closes the partition plate opening hole 7a. At this time, the shaft tip 3a moved downward from the first solder tank 1a moves the partition plate 7 downward from above. It is arranged at a position that penetrates and overlaps the main surface on the lower side of the partition plate 7. Therefore, a part of the shaft 3 is lowered so as to reach the third solder tank 1c, and the shaft 3 is in the partition plate opening hole 7a so that the partition plate opening hole 7a and the shaft outer edge chamfered portion 3b are in contact with each other. Inserted into. In this respect, the present embodiment closes the partition plate opening hole 7a so that the shaft tip 3a contacts the uppermost surface of the partition plate 7, and the shaft 3 is inserted into the partition plate opening hole 7a even when closed. This is different from the first embodiment (FIG. 3) which is arranged in the first solder bath 1a without any problems.

  Although not shown, also in the molten solder supply device 20, when the partition plate opening hole 7a is opened, the shaft tip portion 3a is separated above the partition plate 7 as in the first embodiment (FIG. 2), for example.

  In addition, since the structure of this Embodiment other than this is as substantially the same as the structure of Embodiment 1, the same code | symbol is attached | subjected about the same element and the description is not repeated.

Next, the effect of this Embodiment is demonstrated.
The partition plate opening hole 7a has a shape inclined with respect to the vertical direction (first direction) in FIG. 5 as in the present embodiment, and the shaft 3 has the shaft outer edge chamfered portion 3b. When closing the hole 7a, the shaft 3 can be accurately inserted into the partition plate opening hole 7a. If the partition plate opening hole 7a is inclined with respect to the first direction, it is possible to reduce the possibility of generating a gap with the shaft outer edge chamfered portion 3b. The solder bath 1b can be reliably separated.

  For this reason, the difference of the force which the molten solder 4 in the 2nd solder tank 1b receives at the time of opening and closing can be made clearer. Therefore, the discharge of the molten solder 4 from the nozzle opening hole 2a at the time of opening and closing can be controlled with higher accuracy, and the reliability of the molten solder supply device 20 can be improved.

(Embodiment 3)
Referring to FIG. 6, in the molten solder supply device 30 of the present embodiment, the dimension a1 in the left-right direction (second direction) of the outer wall of the second solder tank 1b is the first solder tank 1a ( And smaller than the dimension a2 in the second direction of the outer wall of the third solder bath 1c). The dimension regarding the up-down direction (1st direction) of the figure of the 2nd solder tank 1b is b.

  In addition, since the structure of this Embodiment other than this is as substantially the same as the structure of Embodiment 1, the same code | symbol is attached | subjected about the same element and the description is not repeated.

Next, the effect of this Embodiment is demonstrated using FIG.
Referring to FIG. 7, for example, consider a case where component 11 or the like is mounted on the main surface of an electronic substrate as target 8 to which molten solder 4 is supplied by molten solder supply device 30. Here, it is assumed that two parts 11 having the same size are mounted on the main surface of the target 8, and the distance between them in the horizontal direction in FIG. 7 is a3, and a1 <a3 <a2.

  When the target 8 including the component 11 is viewed as a whole, the region where the component 11 is mounted protrudes above the main surface of the electronic substrate as compared with other regions. However, the solder tank 1 according to the present embodiment can be installed below so that the second solder tank 1b having a smaller dimension a1 in the left-right direction than a3 fits in a region sandwiched between the two components 11. .

  If the entire solder tank 1 has the same horizontal dimension a2 as in the first embodiment, the molten solder 4 is supplied to the surface area of the target 8 sandwiched between the two parts 11 having the dimension a3. When it is desired to do so, the lowermost part (nozzle opening hole 2a) of the solder tank 1 needs to be disposed above the uppermost part of the component 11. For this reason, the distance between the nozzle opening hole 2a and the target 8 in the vertical direction in the figure becomes large, and it becomes difficult to supply the molten solder 4 with high accuracy onto the target 8 such as a fine electrode so that the position does not shift. there is a possibility.

  However, in the present embodiment, since the solder bath 1 can be set downward by the size b shown in FIG. 6, the nozzles can be formed on the target 8 where the protrusions (parts 11) as shown in FIG. The distance between the opening hole 2a and the target 8 in the vertical direction in the figure can be reduced. For this reason, it becomes easier to supply the molten solder 4 with high accuracy onto the target 8 such as the fine electrode so that the position does not shift.

  Therefore, it is preferable that the vertical dimension b of the second solder tank 1b in FIG. 6 is increased as the vertical height of the component 11 mounted on the target 8 is higher.

  Even if the outer wall dimension a3 of the second solder tank 1b is reduced as in the present embodiment, there is no influence such as a decrease in the discharge amount of the molten solder 4 from the nozzle opening hole 2a. Although the discharge amount of the molten solder 4 depends on the size of the nozzle opening hole 2a in a plan view and the pressure of the gas discharged from the pressurized gas supply port 6, it depends on the dimension a3 of the outer wall of the second solder tank 1b. Is because it does not depend.

(Embodiment 4)
Referring to FIG. 8, molten solder supply device 40 of the present embodiment is formed such that partition plate 7 is integrated with the nozzle. For this reason, the partition plate opening hole 7a and the nozzle opening hole 2a are connected so as to be integrated. Here, “integral” means that two or more regions are combined to form one member.

  A second solder tank 1b is formed by the partition plate opening hole 7a and the nozzle opening hole 2a. Since the inside of the partition plate opening hole 7a is the third solder tank 1c, in the present embodiment, the second solder tank 1b and the third solder tank 1c are formed as the same region.

  In the present embodiment, the second solder tank 1b is formed by the partition plate opening hole 7a and the nozzle opening hole 2a, so that the volume of the second solder tank 1b is suppressed from becoming very small. Compared to the other embodiments, it is preferable that the partition plate 7 has a larger thickness (in the vertical direction in the drawing) and a wider width (in the horizontal direction in the drawing) of the partition plate opening hole 7a. . However, the present embodiment is not limited to such a mode.

  Further, the partition plate 7 formed integrally with the nozzle may be formed as a part of the solder tank 1. Furthermore, the partition plate 7 may be formed so as to be integrated with the main body (side portion) of the solder tank 1 which is a cylindrical member.

  In FIG. 8, the shaft 3 has a first shaft portion 3c and a second shaft portion 3d. The first shaft portion 3c is a portion having an elongated shape extending in the vertical direction (first direction) in the figure. The second shaft portion 3d is connected to the lower end portion of the first shaft portion 3c in the figure (the front end portion on the second solder tank 1b side), and the dimension in the left-right direction (second direction) in the drawing. Is a part larger than the said dimension of the 1st shaft part 3c. In the present embodiment, both the first shaft portion 3c and the second shaft portion 3d are disposed in the first solder bath 1a.

  The reason for having such a configuration is that the molten solder supply device 40 of the present embodiment has a wider partition plate opening hole 7a than the same device of the other embodiments. In order to make it possible to close the wide partition plate opening hole 7a, the width of the second shaft portion 3d corresponding to the tip of the shaft 3 is made wider than the width of the first shaft portion 3c. However, the present invention is not limited to such a mode, and in the present embodiment, for example, the shaft 3 having only a rod-like portion extending in the first direction is used as in the other embodiments by widening the entire width. May be.

  In addition, since the structure of this Embodiment other than this is as substantially the same as the structure of Embodiment 1, the same code | symbol is attached | subjected about the same element and the description is not repeated.

Next, the effect of this Embodiment is demonstrated.
In the present embodiment, by forming the partition plate 7 and the nozzle together, or by forming the partition plate 7 and the solder tank 1 together, the number of components of the molten solder supply apparatus 40 as a whole can be reduced. Can be reduced. For this reason, a manufacturing process can be simplified and cost can be reduced.

  Further, by reducing the number of components of the molten solder supply device 40 as a whole, the load applied to the partition plate 7 can be dispersed, and the life of the device can be extended. This is because the partition plate 7 is formed thick in the vertical direction in the figure in the present embodiment.

  Furthermore, for example, when the solder tank 1, the nozzle 2, and the partition plate 7 are formed as separate members, a load such as thermal stress may be generated between them. However, since these are formed as an integral member in the present embodiment, the above-described load can be eliminated and the life of the apparatus can be extended.

(Embodiment 5)
9 to 11, FIG. 9 corresponds to FIG. 1 of the first embodiment, FIG. 10 corresponds to FIG. 2 of the first embodiment, and FIG. 11 corresponds to FIG. 3 of the first embodiment. Is shown. That is, FIG. 10 and FIG. 11 show the operation in this embodiment, FIG. 10 shows the open time, and FIG. 11 shows the closed time.

  In the molten solder supply apparatus 50 according to the present embodiment, the shaft 3 has a first shaft portion 3c and a second shaft portion 3d. The first shaft portion 3c extends from the first solder tank 1a side (upper side in the figure) to the first solder tank 1a and the partition plate opening hole 7a in the vertical direction (first direction) in the figure. It extends to. The second shaft portion 3d exists in the second solder bath 1b, and the first shaft portion 3c has a first end portion on the second solder bath 1b side (lower side in FIGS. 9 to 11). It is connected to the shaft portion 3c, and constitutes an integral shaft 3 together with the first shaft portion 3c.

  More specifically, the 2nd shaft part 3d has the shaft front-end | tip part 3a and the shaft connection part 3e. The shaft tip portion 3a corresponds to the lower tip portion of the entire shaft 3 as in the shaft tip portion 3a of the other embodiments. The shaft connecting portion 3e is the upper surface of the second shaft portion 3d in the figure, and the second shaft portion 3d is the surface that connects to the first shaft portion 3c. As described above, the shaft 3 having the first shaft portion 3c and the second shaft portion 3d as a whole penetrates the partition plate opening hole 7a from the first solder tank 1a to the second solder tank 1b. It extends in the vertical direction of the figure to reach.

  The first shaft portion 3c is preferably smaller than the partition plate opening hole 7a in a plan view, and is disposed so as to overlap with the partition plate opening hole 7a in a plan view (contains in the partition plate opening hole 7a). For this reason, the 1st shaft part 3c is movable to the up-down direction of a figure, without contacting with the partition plate opening hole 7a.

  On the other hand, the second shaft portion 3d is larger than the partition plate opening hole 7a in a plan view and overlaps with the partition plate opening hole 7a in a plan view. That is, the second shaft portion 3d extends to the outside of the partition plate opening hole 7a in plan view and completely overlaps with the partition plate opening hole 7a so as to cover the entire partition plate opening hole 7a. .

  The first shaft portion 3c and the second shaft portion 3d are made of the same material as the shaft 3 of the other embodiments described above. Further, the first shaft portion 3c and the second shaft portion 3d may be circular in a plan view, for example, may be square.

  Referring to FIG. 10, for example, the shaft 3 moves downward in FIG. 9, and the shaft connecting portion 3 e which is the upper end portion of the second shaft portion 3 d in FIG. 9 is separated below the partition plate 7. Consider a case where the plate opening hole 7a is opened. At this time, a force is applied to the molten solder 4 in the second solder bath 1b in the same manner as the molten solder 4 in the second solder bath 1b of FIG. Therefore, the molten solder 4 is discharged out of the solder tank 1 from the nozzle opening hole 2a by applying a large downward force.

  Referring to FIG. 11, for example, the shaft 3 moves upward in FIG. 9, and the shaft connecting portion 3 e of the second shaft portion 3 d is located below the partition plate 7 so as to close the partition plate opening hole 7 a from below. Consider the case of contact with the main surface. At this time, the partition plate opening hole 7a is in a closed state.

  When the shaft 3 is moved upward in FIG. 9, an upward force is applied to the molten solder 4 in the second solder tank 1 b by the shaft 3 pulling the molten solder 4 upward. In the state where the shaft 3 is lifted upward and the partition plate opening hole 7a is closed, the molten solder 4 in the second solder tank 1b has a surface tension higher than the downward force as in FIG. Will be greatly added. As a result, the molten solder 4 is not discharged from the nozzle opening hole 2a. This is the state shown in FIG.

  As described above, in the present embodiment, the shaft 3 is pulled upward when closing the partition plate opening hole 7a. Further, since the partition plate opening hole 7a is opened and closed depending on whether or not the shaft connecting portion 3e of the second shaft portion 3d in the second solder tank 1b contacts the partition plate 7, the third solder is closed when closed. The tank 1c (in the partition plate opening hole 7a) is integrated with the first solder tank 1a. In this respect, in the present embodiment, when closing the partition plate opening hole 7a, the shaft 3 is pressed downward from the first solder bath 1a side so that the third solder bath 1c (in the partition plate opening hole 7a) is closed. Is different from the first embodiment integrated with the inside of the second solder bath 1b.

  In addition, since the structure of this Embodiment other than this is as substantially the same as the structure of Embodiment 1, the same code | symbol is attached | subjected about the same element and the description is not repeated.

Next, the effect of this Embodiment is demonstrated.
In the present embodiment, the shaft 3 is pulled upward when the partition plate opening hole 7a is closed. That is, the molten solder 4 in the second solder tank 1b, particularly near the nozzle opening hole 2a, is pulled upward. Due to the force that the molten solder 4 is pulled upward, a large upward force is applied to the molten solder 4 in the second solder bath 1b. Thereby, when performing the operation | movement which closes the partition plate opening hole 7a, the effect of reducing possibility that the molten solder 4 leaks from the nozzle opening hole 2a can be heightened further. Therefore, a desired amount of molten solder 4 can be supplied to a desired position with high accuracy.

(Embodiment 6)
Referring to FIG. 12, in molten solder supply device 60 of the present embodiment, nozzle 2 has a plurality of nozzle opening holes 2 a spaced from each other. In addition, since the structure of this Embodiment other than this is as substantially the same as the structure of Embodiment 1, the same code | symbol is attached | subjected about the same element and the description is not repeated.

Next, the effect of this Embodiment is demonstrated.
By using the molten solder supply device 60 of the present embodiment, for example, the molten solder 4 can be simultaneously supplied onto each of a plurality of electrodes formed on the electronic substrate as the target 8 at intervals. Manufacturing tact can be shortened. For example, when the size and position of each of the plurality of nozzle opening holes 2a in plan view are changed according to the size and number of electrodes as the target 8, the sizes of the plurality of targets 8 are different. In this case, the optimum amount of molten solder 4 can be simultaneously supplied to them.

  FIG. 13 shows an example in which the molten solder 4 is supplied over a wide range on the target 8 using the molten solder supply device 60 of the present embodiment. If the molten solder supply device 60 of the present embodiment is used, a plurality of small molten solder 4 supply regions can be formed at intervals as shown in FIG. 12, but a plurality of nozzle openings as shown in FIG. By supplying the molten solder 4 supplied from each of the holes 2 a to each other on one target 8, one large molten solder 4 supply region can be formed.

  From FIG. 13, in the present embodiment, for example, the molten solder 4 can be supplied in a wider range than in the first embodiment, and the entire thickness of the molten solder 4 in the wide range is made more uniform. Can be said. That is, in this embodiment, the molten solder 4 can be supplied onto an electrode having a particularly large area.

  You may use combining the characteristic of the molten solder supply apparatus of each above embodiment suitably. For example, by combining the configurations of the sixth embodiment and the fourth embodiment, a nozzle having a plurality of nozzle opening holes 2a is integrated with the partition plate 7 (and the solder tank 1) (one member). Also good. Alternatively, in combination with the sixth and fourth embodiments, the inclined shape of the partition plate opening hole 7a as in the second embodiment and / or the second solder tank 1b in which the outer wall width is narrow as in the third embodiment. The structure which has this may be sufficient. Furthermore, the shaft 3 of Embodiment 5 may be used in each embodiment.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  DESCRIPTION OF SYMBOLS 1 Solder tank, 1a 1st solder tank, 1b 2nd solder tank, 1c 3rd solder tank, 2 nozzle, 2a nozzle opening hole, 3 shaft, 3a shaft front-end | tip part, 3b shaft outer edge chamfer, 3c 1st Shaft portion, 3d second shaft portion, 3e shaft connecting portion, 4 molten solder, 5 heater, 6 pressurized gas supply port, 7 partition plate, 7a partition plate opening hole, 8 target, 9 gas discharge port, 10, 20, 30, 40, 50, 60 Molten solder supply device.

Claims (8)

A solder bath in which molten solder can be stored and an opening capable of discharging the molten solder is formed;
A partition plate provided in the solder bath and dividing the solder bath into a first solder bath and a second solder bath;
A shaft provided in the solder bath, extending in a first direction connecting the first solder bath and the second solder bath, and movable in the first direction;
A pressurized gas supply port for applying a pressure in a direction in which the molten solder in the solder tank is discharged by gas,
A partition plate opening hole is formed so as to penetrate the partition plate,
The molten solder supply apparatus, wherein the shaft can control discharge of the molten solder from the opening by opening and closing the opening of the partition plate. The solder bath includes a nozzle;
The opening is formed in the nozzle;
2. The molten solder supply device according to claim 1, wherein the opening is separated from the shaft 3 both when the partition plate opening hole is opened and closed.   The molten solder supply device according to claim 2, wherein the partition plate and the nozzle are integrally formed.   The molten solder supply device according to claim 2, wherein the nozzle has a plurality of the openings spaced from each other.   The molten solder supply apparatus according to any one of claims 1 to 4, wherein a heating mechanism is installed in the solder tank.   The molten solder supply apparatus according to any one of claims 1 to 5, wherein the partition plate opening hole has a shape inclined with respect to a direction orthogonal to a main surface of the partition plate. The opening is formed to be connected to the inside of the second solder bath,
7. The outer wall of the second solder tank has a smaller dimension in a second direction orthogonal to the first direction than the outer wall of the first solder tank. The molten solder supply apparatus as described. The shaft extends from the first solder tank so as to penetrate the partition plate opening hole and reach the second solder tank,
The shaft has a first shaft portion that extends through the partition plate opening hole and extends in the first direction, and a tip portion of the first shaft portion on the second solder bath side, and the first shaft portion. A connected second shaft portion,
The molten solder supply device according to any one of claims 1 to 7, wherein the second shaft portion is capable of opening and closing the partition plate opening hole.

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