CN112404633B

CN112404633B - Welding device

Info

Publication number: CN112404633B
Application number: CN202010834385.7A
Authority: CN
Inventors: 林久树; 渡边保幸; 桥本升
Original assignee: Qianzhu System Technology Co ltd; Denso Ten Ltd
Current assignee: Qianzhu System Technology Co ltd; Denso Ten Ltd
Priority date: 2019-08-21
Filing date: 2020-08-18
Publication date: 2023-02-28
Anticipated expiration: 2040-08-18
Also published as: JP7340388B2; CN112404633A; JP2021030256A

Abstract

The welding device according to an embodiment includes a nozzle and a plate member. The nozzle has a tapered peripheral part in which a part of the internal space through which the solder passes is tapered toward the tip of the internal space. The plate member divides the tapered inner space into a first space corresponding to the tapered portion and a second space corresponding to the size of the ejection port on the nozzle.

Description

Welding device

Technical Field

One aspect of the embodiments relates to a welding device.

Background

There is conventionally provided a soldering apparatus that sprays solder from a nozzle to perform soldering on a circuit board. For this type of soldering apparatus, a technique has been proposed which tapers an outer peripheral part of a nozzle to extend an inflow port of a proximal end of the nozzle in order to suppress a temperature drop of flowing solder (for example, see japanese patent application laid-open No. 2004-106004).

However, in the conventional technique, the inner space through which the solder passes is tapered toward the ejection port, so that, for example, in the case where flushing is performed in order to eliminate an oxide film generated at such an ejection port, such an oxide film may not be eliminated with high accuracy by generating deflection in the flow of such solder.

Disclosure of Invention

An aspect of the embodiments is directed to providing a welding apparatus capable of eliminating an oxide film generated at an ejection port of a nozzle with high accuracy.

According to one aspect of an embodiment, a welding device includes a nozzle and a plate member. The nozzle has a tapered peripheral part in which a portion of the internal space through which the solder passes is tapered toward the tip of the internal space. The plate member divides the tapered inner space into a first space corresponding to the tapered portion and a second space corresponding to the size of the ejection port on the nozzle.

According to an aspect of the embodiment, the oxide film generated at the ejection port of the nozzle can be eliminated with high accuracy.

Drawings

Fig. 1 is a schematic diagram showing an outline of a control method for a welding apparatus according to an embodiment.

Fig. 2 is a schematic diagram showing the configuration of a welding apparatus according to the embodiment.

Fig. 3 is a schematic diagram illustrating the operation steps of a welding device according to an embodiment.

Fig. 4 is a schematic diagram illustrating the operation steps of a welding device according to an embodiment.

Fig. 5 is a schematic diagram illustrating the operation steps of the welding apparatus according to the embodiment.

Fig. 6 is a schematic view illustrating a configuration of a nozzle included in the welding apparatus according to the embodiment.

Fig. 7 is a schematic view illustrating a configuration of a nozzle included in the welding apparatus according to the embodiment.

Fig. 8 is a side view of a nozzle according to an embodiment.

Fig. 9 is a bottom view of a nozzle according to an embodiment.

Fig. 10 is a bottom view of the nozzle according to the modification.

Detailed Description

Hereinafter, a welding apparatus and a control method for the welding apparatus according to one or more embodiments will be described in detail with reference to the accompanying drawings. In addition, the present invention is not limited to the examples shown below.

First, an outline of a control method for a welding apparatus according to an embodiment will be described by using fig. 1. Fig. 1 is a schematic diagram showing an outline of a control method for a welding apparatus according to an embodiment. In addition, fig. 1 shows a schematic cross-sectional view of a welding device.

The soldering apparatus 1 according to the embodiment is a so-called nozzle flow type soldering apparatus which ejects solder stored in a solder bath from a nozzle 12 to thereby perform soldering locally on a circuit board.

As shown in fig. 1, a soldering apparatus 1 according to the embodiment includes a solder tank 10, a housing member 11, a nozzle 12, and a cover 13.

The solder bath 10 stores molten solder 20. The solder bath 10 includes, for example, a heater, not shown, wherein the solder in the solder bath 10 is heated by the heat of such a heater to provide molten solder 20, and the molten solder 20 is maintained at a temperature suitable for soldering.

The case member 11 is disposed in the solder tank 10, and as indicated by the hollow arrow in fig. 1, the case member 11 sucks the molten solder 20 in the solder tank 10 from a suction hole 11a provided on the bottom surface of the case member by a pump, not shown, and pressure-feeds the sucked molten solder 20 to the nozzle 12.

The nozzle 12 sprays molten solder 20, which is pressure-fed from the housing member, vertically upward. Thereby, the molten solder 20 ejected from the nozzle 12 is applied to each connection site of the printed circuit board 100 as an application target, thereby performing soldering.

Further, the nozzle 12 has a double-layer tube structure not shown. Then, in the double layer, the inner layer is a layer through which the molten solder 20 pressure-supplied from the housing portion 11 passes, and the outer layer is a layer for recovering and returning the molten solder 20, which is not attached to the printed circuit board 100, to the solder bath 10.

The lid 13 is a protection member that covers the solder bath 10 to prevent oxidation of the molten solder 20 stored in the solder bath 10. The interior 130 of the cap 13 is filled with an inert gas such as nitrogen.

Thus, the level of the molten solder 20 in the solder tank 10 is set in a low oxygen environment, so that oxidation of the molten solder 20 stored in the solder tank 10 can be prevented. In addition, the cap 13 has a hole portion 13a at a position corresponding to the nozzle 12, and the nozzle 12 is made to protrude from such hole portion 13a, which will be described later.

Here, the conventional cap is of a fixed type and is fixed to cover the solder bath in a state where the tip of the nozzle protrudes. Therefore, the tip of the nozzle is often placed in an atmospheric environment, thereby accelerating oxidation of the sprayed solder.

Therefore, for example, in the case where the solder after ejection is recovered by a solder bath and reused, oxidation of the solder stored in the solder bath may be generally accelerated.

Therefore, in the welding apparatus 1 according to the embodiment, the cover 13 is of a movable type.

Specifically, in the control method for the soldering apparatus 1 according to the embodiment, the nozzle 12 protrudes from the hole portion 13a during the application period in which the molten solder 20 is applied to the printed circuit board 100 as the application target, and the nozzle 12 is accommodated in the interior 130 during the waiting period other than the application period.

A control method for the welding apparatus 1 according to the embodiment is explained in detail with fig. 1 as an example. The upper part of fig. 1 shows the position of the cover 13 during the waiting period, and the lower part of fig. 1 shows the position of the cover 13 during the coating period.

In addition, the start of the application period (the end of the waiting period) is a timing at which the printed circuit board 100 is conveyed to a position where the molten solder 20 can be applied, and the end of the application period (the start of the waiting period) is a timing at which the printed circuit board 100 coated with the molten solder 20 is conveyed.

As shown in the upper part of fig. 1, in the control method for the welding apparatus 1 according to the embodiment, the entire nozzle 12 is accommodated in the interior 130 of the cover 13 for a waiting period. In addition, the inside 130 of the cover 13 is maintained in a positive pressure state by the inert gas during the waiting period. Thus, the tip of the nozzle 12 is covered with the inert gas to be set in a low oxygen state.

Then, as shown in the lower part of fig. 1, in the control method for the welding apparatus 1 according to the embodiment, the cap 13 is moved vertically downward during the coating period so that the tip of the nozzle 12 protrudes from the hole portion 13a. Then, the molten solder 20 ejected from the nozzle 12 is applied onto the printed circuit board 100 in a state where the nozzle protrudes from the cover 13.

Therefore, in the control method for the welding apparatus 1 according to the embodiment, the nozzle 12 is protruded only during the application period, and the nozzle 12 is accommodated in the interior 130 during the waiting period, so that the time during which the tip of the nozzle 12 is placed in the atmospheric environment is kept to a minimum. Therefore, in the control method for the soldering apparatus 1 according to the embodiment, the oxidation of the solder can be reduced.

In addition, the printed circuit board 100 is conveyed in a state where the printed circuit board 100 is accommodated in the interior of the tray (an example of a conveying body), and the interior of the tray and the interior 130 of the cover 13 are engaged through the hole portion 13a during the application period, but details thereof will be described later.

Therefore, the tip of the nozzle 12 protruding from the lid 13 is located in the interior of the tray and is kept in a low oxygen state, so that oxidation of the molten solder 20 can be reduced to a minimum even during the coating period.

Next, the configuration of the welding apparatus 1 according to the embodiment will be described in detail by using fig. 2. Fig. 2 is a schematic diagram showing the configuration of the welding apparatus 1 according to the embodiment.

As shown in fig. 2, the soldering apparatus 1 according to the embodiment includes a solder bath 10, a housing member 11, a nozzle 12, a lid 13, a control device 14, and a cylinder 15.

The cylinder 15 includes a support member 151 that supports the cap 13, and a detection member 152 that detects a lifting position or a lowering position (height position) of the cap 13. The detection member 152 detects the lift position and the lowering position of the cover 13 and informs the control device 14 of the lift position and the lowering position.

Further, as the detection means 152, a sensor that detects the position of the piston of the cylinder 15 may be used. Therefore, it is not necessary to separately provide a sensor for detecting the lift position or the lowering position of the lid 13, so that the cost can be reduced.

Further, the cylinder 15 is a pressing member that presses the cap 13. Specifically, in the case where contact between the tray and the cover 13 is caused during the application period, the air cylinder 15 presses the cover 13 against the tray and raises or lowers the cover 13 according to the magnitude of its pressing force (air pressure).

Further, the air pressure of the air cylinder 15 in association with the pressing force of the cover 13 is controlled by the control device 14. In addition, details of the lifting operation or the lowering operation of the lid 13 by the air cylinder 15 will be described below.

Therefore, the air cylinder 15 is used to perform a lifting operation or a lowering operation of the cover 13, wherein, for example, even in the case where aging degradation is caused to change the pressing force of the cover 13, the air pressure can be adjusted so that the influence of such aging degradation can be corrected.

In addition, the air cylinder 15 is an example of a pressing member. For example, a spring (spring member) may be used instead of the cylinder 15, or a spring (spring member) may be used in combination with the cylinder 15.

The control device 14 includes a computer having, for example, a Central Processing Unit (CPU), a Read Only Memory (ROM), a Random Access Memory (RAM), a data flash memory, input/output ports, and the like, as well as various types of circuits.

The CPU of the computer reads and executes a program stored in, for example, a ROM to execute each function.

Further, a part or all of the control device 14 may also be configured by hardware such as an Application Specific Integrated Circuit (ASIC) or a Field Programmable Gate Array (FPGA).

Further, the RAM or the data flash may store information of various types of programs, such as programs for executing the control process according to the control method as described above, and the like. In addition, the control device 14 may acquire the programs or various types of information as described above by another computer connected via a wired or wireless network or a portable recording medium.

The control device 14 controls the amount of inert gas supplied to the interior 130 of the lid 13. Specifically, the control device 14 controls a not-shown regulator provided on the flow passage to supply the inert gas, thereby regulating the gas pressure of the inert gas to control the amount of the inert gas supplied. In addition, details of the control of the supply of the inert gas will be described in later fig. 3 and subsequent drawings.

Further, the control device 14 controls the operation of the air cylinder 15 to lift, lower, or move the cover 13. Specifically, the control device 14 connects the air pipe for lowering to lower the lid 13 and the air pipe for raising to raise the lid 13 to the air cylinder 15.

For example, the control device 14 supplies air having an air pressure smaller than the pressing force of the tray against the cover 13 to the air cylinder 15 through an air pipe for lowering. Thus, the pressing force (reaction force) of the cover 13 to the tray is smaller than the pressing force of the tray, so that the cover 13 is pressed and lowered by the tray.

Further, the control device 14 supplies air to the air cylinder 15 through an air pipe for lifting, the air having an air pressure larger than the pressing force of the tray to the cover 13. Thus, the pressing force (reaction force) of the cover 13 to the tray is larger than the pressing force of the tray, so that the cover 13 presses the tray and is lifted.

More specifically, the control device 14 includes a pressure sensor and an electro-pneumatic regulator, not shown, on the air pipe for lifting. In this case, the control device 14 controls the electro-pneumatic regulator to control the air pressure, monitors the air pressure of the air output from the electro-pneumatic regulator by the pressure sensor, and performs feedback control of the electro-pneumatic regulator to provide the target air pressure.

Next, the operation steps of the welding apparatus 1 according to the embodiment will be explained by using fig. 3 to 5. Fig. 3 to 5 are schematic diagrams illustrating operation steps of a welding apparatus according to an embodiment. Hereinafter, the operation steps from the first step to the sixth step as shown in fig. 3 to 5 will be described in order.

First step of

First, in a first step shown in the upper part of fig. 3, a tray 200 accommodating the printed circuit board 100 is provided during transportation, and the tray does not reach a position where the molten solder 20 can be applied. That is, the first step is a waiting period for the welding apparatus 1. In this case, the welding device 1 provides the cover 13 in the raised position to house the nozzle 12 in its interior 130.

Furthermore, in the first step, the control device 14 of the welding device 1 supplies the inert gas in a supply amount with which the inside 130 of the lid 13 is set in a positive pressure state. That is, the inside 130 of the cover 13 is set to be in a positive pressure state by the inert gas during the waiting period.

This can reduce the air flowing from the hole 13a of the cover 13. Further, since the interior 130 of the lid 13 is provided in the positive pressure state, it is possible to provide the open state without providing a complicated opening and closing mechanism on the hole portion 13a, and therefore, it is possible to reduce the cost of the lid 13.

Second step of

The conversion to the second step is performed. As shown in the lower part of fig. 3, in the second step, contact between the bottom surface of the tray 200 and the top surface of the lid 13 is caused, that is, the tray 200 reaches a position where the molten solder 20 can be applied.

That is, in the second step, the welding apparatus 1 shifts from the waiting period to the coating period. In addition, in the second step, the hole portion 200a of the tray 200 and the hole portion 13a of the cover 13 are engaged, so that the inside of the tray 200 and the inside of the cover 13 provide one engaging space.

Then, in the second step, the control device 14 supplies air having an air pressure smaller than the pressing force of the tray 200 against the cover 13 to the air cylinder 15. Thus, the pressing force (reaction force) of the cover 13 to the tray is smaller than the pressing force of the tray, so that the cover 13 is pressed by the tray and lowering of the cover 13 is started. Further, the lid 13 is pressed against the tray 200 by the air pressure of the air cylinder 15, so that the lid 13 maintains a state in which the lid 13 contacts the tray 200 and is lowered. Accordingly, the lid 13 is pressed against the tray 200, so that the inert gas filling the lid 13 and the tray 200 can be prevented from escaping from the lid 13 and the tray 200.

Further, in the second step, the control device 14 reduces the amount of the inert gas supplied to the inside 130 of the lid 13 relative to the amount of the inert gas supplied to the inside 130 of the lid 13 in the first step. That is, the control device 14 reduces the amount of inert gas supplied during the coating period relative to the amount of inert gas supplied during the waiting period.

Thereby, a temperature drop at the time of soldering in the subsequent third and fourth steps can be prevented, and the molten solder 20 can be prevented from being hardly ejected from the nozzle 12.

The third step

The conversion to the third step is performed. As shown in the upper part of fig. 4, in the third step, the lid 13 is lowered to the lowered position by pressurizing the tray 200, and the lowering of the lid 13 is stopped. In addition, the third step is a coating period for the welding apparatus 1.

From the second step to the third step, when the cover 13 is lowered, the tip of the nozzle 12 protrudes from the hole portion 13a, and is inserted into the inside of the tray 200 through the hole portion 200 a. Further, the hole portions 13a of the cover 13 and the hole portions 200a of the tray 200 are designed to have a larger hole diameter than the outer diameter of the nozzle 12. Thus, in the case where the nozzle 12 protrudes from the cover 13, contact between the nozzle 12 and the cover 13 is not caused, so that the inside 130 of the cover 13 is not in a closed state, and the tray 200 and the cover 13 can be easily lowered. Further, the inert gas may be made to flow from the lid 13 into the tray 200 through the gap between the lid 13 and the nozzle 12.

Further, from the second step to the third step, the inert gas filling the inside 130 of the lid 13 flows into the inside of the tray 200. Further, a ventilation hole, not shown, is provided on the top surface of the tray 200, and when the inert gas flows into the inside of the tray 200, air including oxygen is pushed out from the ventilation hole to the outside. Thereby, the air inside the tray 200 is released to the outside and replaced with the inert gas, so that the inside of the tray 200 is set in a low oxygen state.

That is, the tip of the nozzle 12 is kept in a low oxygen state even during the coating period, so that oxidation of the sprayed molten solder 20 can be reduced. Further, the inside of the tray 200 is set in a low oxygen state so that soldering can be well done on one side of the component surface of the printed circuit board 100. Further, the inside of the tray 200 and the inside 130 of the cover 13 are not provided in the closed state by the vent holes provided on the top surface of the tray 200, so that the tray 200 and the cover 13 can be easily moved downward, and further, the tray 200 and the cover 13 can be easily separated after applying solder or the like.

The fourth step

The conversion to the fourth step is performed. As shown in the lower part of fig. 4, in the fourth step, the cover 13 is fixed to the lowered position, and soldering is performed on the printed circuit board. In addition, the fourth step is a coating period for the welding apparatus 1.

The fifth step

The conversion to the fifth step is performed. As shown in the upper part of fig. 5, in the fifth step, soldering on the printed circuit board 100 is ended, and lifting of the tray 200 and the cover 13 is started. That is, in the fifth step, the welding apparatus 1 shifts from the waiting period to the coating period.

In the fifth step, the control device 14 supplies the air having an air pressure larger than the pressing force of the tray against the cover 13 to the air cylinder 15. Thus, the pressing force (reaction force) of the lid 13 against the tray is larger than the pressing force of the tray, so that the lid 13 presses the tray and the lifting of the lid 13 is started.

Further, the inside of the tray 200 is filled with an inert gas to lift the lid 13 while maintaining a low oxygen state, so that cutting of the solder can be performed. Therefore, the viscosity of the solder is less than the surface tension of the solder, so that the generation of tin spikes or bridges can be reduced.

The sixth step

The conversion to the sixth step is performed. As shown in the upper part of fig. 5, in the sixth step, the lid 13 is lifted to the lift position, and then the lift of the lid 13 is stopped. Specifically, in a state where the nozzle 12 is accommodated in the interior 130, the lifting of the cap 13 is stopped.

That is, during the waiting period of the sixth step, the cap 13 is lifted until the nozzle 12 is accommodated in the interior 130. Then, after the lifting of the lid 13 is stopped, the tray 200 is separated from the lid 13, and the conveyance of the tray 200 to another position is started.

Further, after stopping the lifting of the lid 13, the control device 14 increases the amount of inert gas supplied to the inside 130 of the lid 13 at the timing when the tray 200 is separated from the lid 13. Specifically, the control device 14 restores the supply amount to the supply amount of the first step. Thus, the inside 130 of the cover 13 is maintained in a positive pressure state.

Therefore, soldering from the first step to the sixth step is performed on the printed circuit board 100.

As described above, the welding apparatus 1 according to the embodiment includes the nozzle 12 and the cap 13. The nozzle 12 ejects molten solder (molten solder 20). The cap 13 is filled with an inert gas in the interior 130 of the cap, and has a hole portion 13a at a position corresponding to the nozzle 12. The cap 13 causes the nozzle 12 to protrude from the hole portion 13a in a coating period of time for coating the molten solder 20 to the coating object (the printed circuit board 100), and accommodates the nozzle 12 in the inside 130 in a waiting period of time other than the coating period of time. Thereby, oxidation of the molten solder 20 can be reduced.

Next, the physical configuration of the nozzle 12 included in the welding apparatus 1 according to the embodiment will be explained by using fig. 6 to 10.

Fig. 6 and 7 are schematic views of the configuration of the nozzle 12 included in the welding apparatus 1 according to the embodiment. Fig. 6 shows a perspective view showing the appearance of the nozzle 12. Further, fig. 7 shows a sectional view in which a section provided by cutting the chain line in fig. 6 in a vertical direction (upward or downward direction on the paper plane) is viewed in the direction of a.

In addition, although fig. 6 and 7 show only the nozzle 12 included in the soldering apparatus 1, the soldering apparatus 1 further includes a solder tank 10 that stores molten solder, a pump for pressure-supplying the solder from the solder tank 10 to the nozzle 12, a heater that heats and melts the solder, and the like. In addition, the configuration of the nozzle 12 will be specifically described below.

As shown in fig. 6 and 7, the nozzle 12 is a pipe member having a substantially rectangular shape, and has an ejection port 120 in which solder is ejected and an inflow port 121 into which solder flows from the solder bath into the inflow port 121. In addition, although in the present embodiment, the injection port 120 and the inflow port 121 are substantially rectangular shapes, the opening shapes of the injection port 120 and the inflow port 121 are not limited to the rectangular shapes, and may be any shapes such as a circular shape, a triangular shape, an L-shape, or a V-shape.

As shown in fig. 6 and 7, the nozzle 12 includes a peripheral member 101 and a base member 104, the peripheral member 101 has a rectangular outer shape, and the base member 104 is connected to a solder bath, not shown. Further, the peripheral member 101 has a tapered portion 102 (the tapered portion 102 will be described as a tapered member 102 hereinafter).

Specifically, the tapered member 102 is a site provided at a position corresponding to one side of the nozzle 12, which is rectangular in plan view, and is formed such that the inner space 230 (see fig. 7) is tapered from the proximal end to the distal end of the nozzle 12.

In addition, although in the present embodiment, the case where the tapered member 102 is provided only at a position corresponding to one side of the nozzle 12 having a rectangular shape in plan view is shown, the tapered member 102 may be provided at positions corresponding to two or more sides of the nozzle 12 having a rectangular shape in plan view.

Further, as shown in fig. 7, a portion of the nozzle 12 near the ejection port 120 is provided as a double tube structure, and is configured such that the solder returned without being used for soldering passes through the inside of the double tube structure and returns to the solder bath along the outside of the tapered member 102. Further, the size of the ejection port 120 is a size that does not deflect the ejection of the solder, that is, a size that does not deteriorate the straight traveling characteristic of the solder.

Here, the flow of solder will be explained by using fig. 7. As shown in fig. 7, when the solder is pressure-supplied from the solder tank by a pump, not shown, the solder flows into the internal space 230 from the inflow port 121 of the nozzle 12.

Here, the inflow port 121 of the nozzle 12 is wider than the ejection port 120 by the tapered member 102, so that the temperature of the solder passing through the inside of the nozzle 12 is not easily lowered. That is, the tapered part 102 enlarges the inner space 230, so that the temperature drop of the solder can be prevented.

Then, the solder flowing into the internal space 230 is pushed up in the direction of the ejection port 120 of the nozzle 12 and ejected from the ejection port 120, thereby performing soldering on the circuit board. Further, the solder that is not used for soldering on the circuit board returns to the solder bath along the outside of the tapered member 102. That is, the tapered member 102 also serves as a buffer material when the solder returns to the solder bath, and prevents the returned solder from splashing.

Here, the ejection port 120 of the nozzle 12 is often exposed to the air of the atmosphere, so that an oxide film may be generated on the solder surface in the vicinity of the ejection port 120. Therefore, a method called rinsing is performed in which the momentum of the jet is increased to eliminate the oxide film.

However, in the case of flushing a nozzle having a tapered member in a conventional soldering apparatus, the solder flow may be deflected, making it impossible to remove the oxide film with high accuracy.

Specifically, among the solder passing through the inner space, the solder passing near the tapered member flows along the tapered shape during the rinsing so that the flow rate thereof is smaller than that of the solder passing straight at a position away from the tapered member.

Then, the solders having different flow rates simultaneously flow in the internal space, and thus the solders are not linearly ejected at the ejection port, thereby generating a portion where the oxide film cannot be removed.

Therefore, in the soldering apparatus 1 according to the embodiment, a flow regulating plate (plate member 103) that regulates the flow of solder is provided in the internal space 230 of the nozzle 12.

Specifically, the welding device 1 according to the embodiment includes the plate member 103 that partitions the internal space 230 tapered by the tapered part 102 into the first space 210 corresponding to the tapered portion (the tapered part 102) and the second space 220 corresponding to the size of the injection port 120 on the nozzle 12. The end of the injection port 120 is provided in a double pipe structure, and the second space 220 has the same size as an inner pipe (in a plan view) in the injection port 120 having the double pipe structure, but details thereof will be described later.

In other words, the plate member 103 partitions the internal space 230 into the first space 210 and the second space 220, and the flow rate of the solder is different in the first space 210 and the second space 220. Thereby, the solders flowing in the first and

second spaces

210 and 220 are not mixed in the inner space 230, so that the flow of the solders linearly flowing in the second space 220 is not easily disturbed.

Therefore, the solder linearly passing through the second space 220 is linearly ejected at the ejection port 120 without deflecting the flow, so that the oxide film generated at the ejection port 120 can be eliminated with high accuracy.

In addition, gaps are formed at the left and right ends of the plate member 103, and the first space and the second space 220 are connected by such gaps. That is, the solder passing through the first space 210 moves to the second space 220 through such a gap and is finally ejected from the ejection port 120, so that the solder does not remain in the first space 210.

In addition, the amount of solder that moves from the first space 210 to the second space 220 is small, so that the flow of solder that flows linearly in the second space 220 is not easily interrupted. This will be explained using fig. 8.

Fig. 8 is a side view of nozzle 12 according to an embodiment. The left side view in fig. 8 shows a part of the sectional view shown in fig. 7, and the right side view in fig. 8 is a side view seen in a case where the side face of the peripheral member 101 on the opposite side of the tapered member 102 is set as the front side.

As shown in the left side view of fig. 8, a double pipe structure is provided near the ejection port 120 of the nozzle 12. Specifically, in the double tube structure of the nozzle 12, the outer tube (outer tube) is formed by the outer peripheral part 101a and the outer peripheral part 101b, and the inner tube (inner tube) is formed by the outer peripheral part 101a and the outer peripheral part 101 c.

The outer tube formed by the peripheral part 101a and the peripheral part 101b is a site for preventing the solder sprayed at the time of soldering from jumping to the outside. Further, the inner tube (inner tube) formed by the peripheral part 101a and the peripheral part 101c serves as a guide member for returning the solder not used for soldering to the solder bath.

Specifically, the peripheral part 101c is joined to the tapered part 102, whereby the solder passes between the peripheral part 101c and the peripheral part 101b, flows into the outside of the tapered part 102, and finally returns to the solder bath.

Further, as shown in the left side view of fig. 8, the plate member 103 extends straightly in the extending direction of the nozzle 12 from the position of engagement of the tapered part 102 and the peripheral part 101c (extending direction of the peripheral part 101 c).

In other words, the plate member 103 is disposed at a position of the second space 220 where the size (surface area) in plan view is the same as the size in plan view of the inner pipe (the opening formed by the peripheral part 101a and the peripheral part 101 c).

Thereby, the solder passing through the second space 220 can be ejected without losing the solder, and turbulence can be prevented from being caused when the solder moves from the second space 220 to the ejection port 120. That is, the solder can be linearly sprayed without losing the solder.

Further, as shown in the left and right views of fig. 8, the end 103a of the plate member 103 on the ejection port 120 side is in contact with the nozzle 12 (peripheral part 101 c). Thereby, the solder flow having the maximum momentum (high flow rate) in the first space 210 can be stopped at the end 103 a.

That is, the solder moves from the first space 210 to the second space 220 in a state where the solder having the maximum momentum maintains a high flow rate, so that the deterioration of the straight traveling characteristic of the solder can be reduced.

In addition, the end 103a of the plate member 103 does not have to contact the nozzle 12 (the peripheral part 101 c) as long as the flow of solder through the first space 210 can be stopped.

Further, as shown in the left side view of fig. 8, the position of contact between the plate member 103 and the nozzle 12 is the end portion of the tapered part 102 on the injection port 120 side. This allows solder passing through the second space 220 to smoothly flow to the ejection port 120. That is, it is possible to prevent the deterioration of the straight traveling characteristic of the solder passing through the second space 220.

Further, as shown in the right side view of fig. 8, gaps 300 are opened between the left and right ends of the plate member 103 and the peripheral part 101. In other words, the length of the plate member 103 in the width direction orthogonal to the height direction is smaller than the length of the peripheral component 101a in the width direction.

That is, both ends of the plate member 103 in the width direction orthogonal to the height direction of the nozzle 12 are separated from the nozzle 12 (the peripheral component 101 a). Thereby, the solder flowing into the first space 210 can be prevented from remaining in the first space 210.

In addition, the amount of solder that moves from the first space 210 to the second space 220 through the gap 300 is small, so that even if the solder moves from the first space 210 to the second space 220, it is possible to reduce to a minimum the interruption of the solder flow that flows linearly in the second space 220.

Next, the bottom surface of the nozzle 12 will be described with reference to fig. 9. Fig. 9 is a bottom view of the nozzle 12 according to an embodiment. As shown in fig. 9, if the nozzle 12 is not inserted into the plate member 103, the inflow port 121 of the nozzle 12 is substantially rectangular.

If the inflow port 121 of the nozzle 12 is rectangular in shape, the amount of solder flowing into the first space 210 may increase, so that the solder that cannot move from the first space 210 into the second space 220 via the gap 300 is retained, as described above.

Therefore, as shown in fig. 9, the plate member 103 is partially inserted into an opening in the inflow port 121 of the nozzle 12 corresponding to the first space 210. Specifically, the plate member 103 extends from the end of the tapered part 102 toward the inflow port 121, bends toward the first space 210 side, and is inserted into a part of the inflow port 121.

More specifically, the plate member 103 is inserted into a portion of the opening corresponding to the first space 210, and is not inserted into the opening corresponding to the second space 220, so that the inflow port 121 is U-shaped in bottom view.

Thereby, the amount of solder flowing into the first space 210 can be reduced without reducing the amount of solder flowing into the second space 220, so that the retention of solder in the first space 210 can be reduced.

Further, in the bottom view, the plate member 103 protrudes from the first space 210 side toward the base part 104 side with respect to the inflow port 121. That is, the plate member 103 is configured as a member having an L-shape. This makes it possible to easily fix the plate member 103 to the base member 104 or the like, for example.

As described above, the welding apparatus 1 according to the embodiment includes the nozzle 12 and the plate member 103. The nozzle 12 has a tapered peripheral part 101 in which a portion of the inner space 230 through which the solder passes is tapered toward the end of the inner space 101. The plate member 103 divides the tapered inner space 230 into a first space 210 corresponding to the tapered portion and a second space 220 corresponding to the size of the ejection port 120 on the nozzle 12. Thereby, the oxide film generated at the ejection port 120 of the nozzle 12 can be eliminated with high accuracy.

In addition, although the above description shows a case where the plate member 103 is configured as a member having an L-shape, this is not restrictive. Another example of the plate member 103 will be described with reference to fig. 10.

Fig. 10 is a bottom view of the nozzle 12 according to the modification. As shown in fig. 10, similar to fig. 9, the plate member 103 is partially inserted into an opening in the inflow port 121 of the nozzle 12 corresponding to the first space 210.

Then, in fig. 10, unlike fig. 9, a plate member 103 is formed to surround the inflow port 121 of the nozzle 12. Specifically, the plate member 103 is engaged with a site surrounding four sides of the inflow port 121 having a rectangular shape in a bottom view, and is inserted into the inflow port 121 corresponding to the first space 210.

Then, the plate member 103 is fixed on the base part 104 at a site around the four sides of the inflow port 121. This enables the plate member 103 to be firmly fixed to the base member 104.

Claims

1. A welding device, comprising:

a nozzle having a tapered portion such that a portion of an inner space through which solder passes is tapered toward a tip end of the inner space; and

a plate member that partitions the tapered internal space into a first space corresponding to the tapered portion and a second space corresponding to a size of an injection port on the nozzle,

wherein both ends of the plate member in a width direction orthogonal to a height direction of the nozzle are separated from the nozzle, the first space and the second space are joined by a gap provided between the both ends of the plate member and the nozzle, and a position of contact between the plate member and the nozzle is an end of the tapered portion.

2. The welding device according to claim 1, wherein an end of the plate member on the injection port side is in contact with the nozzle.

3. The welding device according to any one of claims 1 to 2, wherein the plate member is partially inserted into an opening in an inflow port of the nozzle corresponding to the first space.