JP2015208737A - Wiping device and laminate making device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce harmful effects caused in sticking films by wiping deposited sealant, and provide a wiping device using a solvent that is low in volatility and is not designated as dangerous material.SOLUTION: A wiping device comprises a stage that supports a sheet-like member, wiping means, a wiping member that wipes deposit on the outer periphery of the sheet-like member, solvent supply means that supplies solvent, and recovery means that recovers a residue after wiping. The wiping means has the wiping member, the solvent supply means, and the recovery means arranged thereon. The solvent supply means supplies solvent onto the deposit, the wiping member wipes the deposit that is supplied with the solvent and dissolved, and the recovery means recovers a residue after wiping. There is also provided a device of making a laminate comprising such a wiping device.

Description

  The present invention relates to, for example, a wiping device for wiping off an adhering material when a laminated body such as a semiconductor device, a display device, a light emitting device, a power storage device, and a power generation device is produced, or a laminated body producing apparatus.

  In recent years, development of a flexible device in which functional elements such as a semiconductor element, a display element, and a light emitting element are provided over a flexible substrate (hereinafter also referred to as a flexible substrate) has been advanced. Typical examples of the flexible device include various semiconductor circuits having semiconductor elements such as transistors in addition to lighting devices and image display devices.

  As a method for manufacturing a device using a flexible substrate, a technique in which a functional element such as a thin film transistor or an organic EL element is manufactured over a substrate such as a glass substrate or a quartz substrate, and then the functional element is transferred to the flexible substrate. Has been developed. In this method, a peeling process for peeling the layer to be peeled including the functional element from the substrate is necessary.

  For example, in the peeling technique using laser ablation disclosed in Patent Document 1, first, a peeling layer including a layer containing tungsten and a layer containing tungsten oxide is provided on a substrate, and a thin film element is formed on the peeling layer. A layer to be peeled is provided, and the layer to be peeled is adhered to the transfer body by the adhesive layer. Then, the release layer is ablated by irradiation with laser light, thereby causing the release layer to peel.

  As a method for manufacturing a light-emitting device using a flexible substrate, a separation layer is formed over a substrate such as a glass substrate or a quartz substrate, and a semiconductor element such as a thin film transistor is formed over the separation layer. A technique for transferring a semiconductor element to a substrate (for example, a flexible substrate) has been developed (see Patent Document 1).

JP 2003-174153 A

  By the way, when producing the processed member 90 shown in FIG. 4 (A-1), (A-2) and FIGS. 6 (A-1) and (A-2) which will be described later, the upper first substrate 11 (glass) A first peeling layer 12 made of a layer containing tungsten and a layer containing tungsten oxide, and a first peeled layer 13 made of a thin film element therebelow, and a lower second substrate 21. (A glass substrate or the like), a second peeling layer 22 made of a layer containing tungsten and a layer containing tungsten oxide, and a second peeled layer 23 made of a thin film element thereabove interposed a bonding layer 30 When the pressure bonding is performed, a part of the sealing material of the bonding layer 30 flows out and adheres to one or more sides of one to four sides of the outer periphery of the lower second substrate 21 and the second release layer 22. (The broken line area shown in FIG. 4A-1) - see sealing material 30a).

  In such a case, as shown in FIG. 4C, when the upper first substrate 11 or the like is peeled off, one to four sides of the outer peripheral portion of the lower second substrate 21 and the second peeled layer 23 are removed. The sealing material remains on any one side or a plurality of sides.

  Therefore, on the second substrate 21, the second release layer 22, and the second peeled layer 23 (corresponding to the first remaining portion and the sheet-like member) as shown in FIG. When the first adhesive layer 31 is formed, a step is generated on any one or a plurality of sides of one to four sides of the outer peripheral portion due to the remaining sealing material 30a (for example, shown by a broken line in FIG. 4D-1). (See the raised portion 31a).

  Then, as shown in FIG. 4E-1, when the film-like first support body 41 is pressure-bonded to the upper surface of the first adhesive layer 31 using a roller, the roller picks up the first step. The support body 41 cannot be uniformly bonded.

  An object of the present invention is to eliminate the adverse effect of crimping the first support by wiping off the remaining sealing material, that is, the attached deposits. It is another object of the present invention to provide a wiping device using a solvent that has low volatility and is not designated as a hazardous material. It is another object of the present invention to provide a laminate manufacturing apparatus capable of appropriately peeling and transferring a laminate including a functional element formed on a substrate and a flexible substrate in a short time. Note that the description of these problems does not disturb the existence of other problems.

  One aspect of the present invention is a stage for supporting a sheet-like member, a wiping means, a wiping member for wiping off deposits adhering to the outer periphery of the sheet-like member, a solvent supplying means for supplying a solvent, Recovery means for recovering residues, wherein the wiping means includes the wiping member, the solvent supply means, and the recovery means, and the solvent supply means is a solvent on the deposit. The wiping member is a wiping device that wipes off the deposits that are supplied with the solvent and dissolves, and the collecting means collects the residue after wiping.

  According to another aspect of the present invention, a first supply unit that supplies a processed member, a support supply unit that supplies first and second supports, and one surface of the processed member are peeled, A first separation unit that separates the first remaining portion, a first cleaning device that cleans the first remaining portion, and a first adhesive layer that uses the first adhesive layer as the first remaining portion. A first laminating unit for laminating, and a first unloading unit for unpacking a first laminate including the first remaining portion and the first support bonded by the first adhesive layer; A second supply unit for supplying the first laminated body, a starting point forming unit for forming a separation starting point in the vicinity of the first remaining portion and an end of the first support, and the first laminated body. A second separation unit that peels off one surface of the body and separates the second remaining part A second bonding unit for bonding the second support to the second remaining portion using a second adhesive layer; and a second bonding unit bonded to the second remaining portion and the second adhesive layer. A second unloading unit that unloads a second laminate including two supports, and the first cleaning device includes a stage that supports the sheet-like member that is the first remaining portion, and a wiper. Means, a wiping member for wiping off deposits adhering to the outer peripheral portion of the sheet-like member, a solvent supplying means for supplying a solvent, and a collecting means for collecting the residue after wiping, the wiping means The wiping member, the solvent supply means, and the recovery means are arranged, the solvent supply means supplies a solvent onto the deposit, and the wiping member is supplied with the solvent and dissolves. Wipe off any deposits and It means a manufacturing apparatus of the laminate to recover residue after wiping.

  Moreover, the said laminated body can be made into the laminated body provided with the flexible board | substrate on the upper and lower surfaces.

  By using one embodiment of the present invention, when a flexible film is transferred to the sheet-like member or the first remaining part from which the substrate has been peeled, the flexible film can be attached almost uniformly, and the function of the functional element Can be prevented.

  Further, the wiping is performed by tilting the stage, and since the residue after wiping down flows, the adverse effect of flowing to the functional element side can be prevented.

  In addition, since it is wiped with a silicone rubber plate and can be reused, it can contribute to lower cost and resource saving than those using a disposable wipe, and the generation of dust and dust (disposable) The generation of the wiping cloth) can be eliminated, and the wiping surface can be properly wiped without damage.

  In addition, the solvent supply means is disposed in front of the wiping member with respect to the traveling direction of the wiping means, and the solvent is supplied to the deposit prior to wiping the wiping member, thereby making the entire wiping device compact. In addition, work efficiency can be improved.

  Further, by collecting the residue with the collection means positioned below the deposit, it is possible to facilitate the collection and to prevent the residue from wrapping around the back surface of the sheet-like member. In addition, collection can be performed more reliably by making the collection a forced collection using suction.

  Moreover, it is wiping off using a solvent, and the removal of the deposits can be facilitated. As a solvent, a solvent that is low in volatility and not designated as a hazardous material, for example, Elise M8902 from Asahi Kasei Materials can be used. By using such a solvent, for example, it becomes easier to handle as compared with the case of using highly flammable acetone, and it is not necessary to take safety measures, so that the production cost can be reduced accordingly.

  Moreover, the state after wiping off can be made more appropriate by washing or drying after wiping off.

  Further, by providing the cleaning liquid supply means and / or the drying means, the entire wiping device can be made compact and the work efficiency can be improved.

  In addition, the wiping member straddles the area where deposits adhere from the inside toward the outside, and the inner side is inclined so that the inner side precedes the outer side, so that residues such as dissolved substances are moved to the functional element side. The adverse effect of flowing can be prevented.

  In addition, one substrate is separated from the bonded upper and lower substrates to form a first remaining portion, a first flexible substrate is bonded to the first remaining portion, and the other substrate is separated to form a second A flexible laminate is produced in a short time and efficiently by a laminate production apparatus that forms the remainder and aggregates the various steps of attaching the second flexible substrate to the second remainder. be able to.

The figure explaining a wiping off apparatus. The figure explaining the wiping off procedure of the wiping off apparatus. 3A and 3B illustrate a structure of a stack manufacturing apparatus. 8A and 8B illustrate a manufacturing process of a stacked body. 8A and 8B illustrate a manufacturing process of a stacked body. The figure explaining a process member.

Embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and various changes and modifications can be made without departing from the spirit and scope of the present invention. Therefore, the present invention should not be construed as being limited to the description of the embodiments below. Note that in the structures of the invention described below, the same portions or portions having similar functions are denoted by the same reference numerals in different drawings, and description thereof is not repeated.
(Embodiment 1)
In this embodiment, a wiping device according to one embodiment of the present invention will be described.

  One embodiment of the present invention can be used in one step before a structure including a functional element formed over a substrate is transferred onto a flexible substrate. For example, it can be used in a cleaning process of a remaining portion (corresponding to a first remaining portion or a sheet-like member) after peeling one substrate from a processing member in which a structure is sandwiched between upper and lower substrates. Note that a hard substrate such as a glass substrate is preferably used as the substrate, but a flexible substrate such as a resin can also be used.

  FIG. 1 is a perspective view for explaining a wiping device which is one embodiment of the present invention, (A) is a schematic perspective view of the whole, and (B1) is a perspective view showing a state in which a table-like stage rotates. (B2) is a side view showing a state in which the table-like stage is tilted, (C1) is a side view showing a state where the wiping means wipes off the deposits, and (C2) is a side view showing that the wiping means wipes off the deposits. It is a side view which shows the state which reverse | retreats.

  FIG. 2 is a diagram for explaining wiping, cleaning, and drying. FIG. 2A is a diagram schematically showing various nozzles and a wiping member housed in the head portion, and FIG. 2B is a front-rear direction of the head portion. (The arrow Y direction is the forward direction, the opposite direction is called the backward direction) and the left and right direction (the arrow X direction is the left direction, the opposite direction is called the right direction). (C2) is a figure which shows the state of washing and drying, (D1) is a figure which collects the residue (it is also a dissolved material) at the time of wiping off, and (D2) is at the time of washing. It is a figure which collects cleaning liquids, such as water.

  The wiping device 200 includes a wiping means 210, a sheet-like member 220, a stage 230, a wiping member 240, a solvent supplying means 250 for supplying a solvent, and a collecting means 260 for collecting a residue at the time of wiping (FIG. 1A, etc.). reference). In addition, you may provide the washing | cleaning liquid supply means 270 and the drying means 280 as others.

  The wiping means 210 includes a head portion 211, a column portion 212, a pedestal portion 213, and the like. Wheels are provided on the lower surface of the pedestal 213, and the wiping means 210 can be moved in the left-right direction (X direction in FIG. 2) as indicated by arrows along the stage 230 on the rail 215 by a control device (not shown). It is.

  The head portion 211 located above the pedestal portion 213 via the support column 212 is a thick rectangular and plate-like member, and as shown by arrows in FIG. Can move in the rear direction), in other words, can move in the direction away from the stage 230 (backward direction), or the direction toward the stage 230 opposite to the arrow (forward direction) (the arrow in FIG. 2B) Y direction).

  The head portion 211 has a substantially U-shaped cutout recess 216 that is recessed from the front side to the rear side on the front side surface. The upper surface 216a of the notch recess 216 is an inclined surface that descends from the front to the rear, the side surface 216b is substantially vertical, and the bottom surface 216c is horizontal (see FIGS. 1C1 and 1C2).

  As shown in FIG. 2B, a concave space 217 having a rectangular cross section that opens upward from below is provided above the upper surface 216 a of the head portion 211. As shown in FIG. 2A, a solvent supply nozzle 251, a cleaning liquid supply nozzle 271, a wiping member 240, and an air nozzle 281 described later are arranged in order from the left side to the right side. A means 260 is provided.

  Note that the wiping means 210 can be reduced in size by disposing the solvent supply nozzle 251, the cleaning liquid supply nozzle 271, the wiping member 240, and the air nozzle 281 in the recess space 217.

  The sheet-like member 220 is a rectangular member placed on the stage 230 (see FIG. 1A). The sheet-like member 220 is composed of a functional element or the like on the substrate 21 on which the first substrate 11 as shown in FIG. 4 to be described later is peeled, and the sealing material 30a as the deposit remains on the outer peripheral surface as the deposit. The first remaining portion 90a on which the structure is stacked, and is placed on the stage 230 with the surface having the sealing material 30a remaining in the vicinity of the four sides of the outer periphery thereof, and suction using the suction of the stage 230 The lower surface is sucked and fixed to the upper surface of the stage 230 by the means. In addition, the sheet-like member 220 is not limited to the above, and any member may be used as long as an adhering material such as the sealing material 30a adheres thereto.

  The stage 230 is a kind of table, and a sheet-like member 220 is placed on an upper rectangular flat plate 231. The flat plate 231 is provided with a plurality of fine holes 232 in the vertical direction, and a negative pressure by a vacuum pump (not shown) is applied to the flat plate 231 through these fine holes 232 to allow the back surface of the sheet-like member 220 to be placed. Then, the sheet-like member 220 is adsorbed and fixed on the flat plate 231.

  Further, the flat plate 231 of the stage 230 can be controlled to be rotatable with respect to the horizontal plane as shown in FIG. 1 (B1), and can be controlled to be tiltable in the front-rear direction as shown in FIG. 1 (B2). is there. The rotation is performed, for example, by rotating the support column 234 with a motor (not shown), and the tilting is performed, for example, by tilting the joint portion 233 with a motor (not shown).

  At the time of wiping or cleaning, the stage 230 is inclined forward at the same angle as the upper surface 216a of the head portion 211 as shown in FIG. 1C1, and the remaining sealing material on one side of the sheet-like member 220, that is, adhered. Every time the deposits are wiped off, washed and dried, the inclination of the flat plate 231 is returned to the horizontal direction and rotated 90 degrees.

  As the wiping member 240, for example, an elastic body can be used. Specifically, it is a rectangular silicone rubber plate, and is attached in such a manner that its tip protrudes downward from the upper surface 216a of the head portion 211 as shown in FIGS. 2 (C1) to (D2). In addition, the wiping member 240 is disposed so as to incline so that the sealant 30a, which is a deposit, is adhered from the inside to the outside while wiping and cleaning, and the inner side precedes the outer side. (See FIGS. 2A, 2C1 and 2).

  Then, at the time of wiping or cleaning, the tip portion is pressed against the sealant 30a region and moves in the left-right direction. As a result, the sealing material 30a is wiped off, washed, and dried. In addition, since a front-end | tip part has elasticity, it deform | transforms a little and wipes off appropriately, without damaging a wiping surface. Moreover, since the wiping member 240 does not need to be replaced like a wiping cloth, it is inexpensive and contributes to resource saving.

  The solvent supply means 250 includes a container (not shown) for containing a solvent, a pump, piping, a solvent supply nozzle 251 as shown in FIG. The solvent supply nozzle 251 is attached to the upper surface 216a of the head portion 211 in such a manner that it opens downward from the wiping member 240 to the front side with respect to the traveling direction of the wiping means 210.

  At the time of wiping, a predetermined amount of solvent is supplied from the solvent supply nozzle 251 onto the sealing material 30 a prior to wiping the wiping member 240.

  The solvent supplied is a low-volatility solvent that is not designated as a hazardous material, that is, a solvent that does not conflict with the Fire Services Act, Industrial Safety and Health Act, PRTR Law, Ozone Layer Protection Law, Poisonous and Deleterious Substances Control Law, For example, glycol ether solvent or Elise M8902 from Asahi Kasei Materials can be used.

  By using such a solvent, for example, the handling becomes easier as compared with the case of using highly flammable acetone, and the production cost can be reduced because it is not necessary to take safety measures.

  Incidentally, Elise is a glycol ether solvent, having a boiling point of 108 ° C. (acetone is 56.5 ° C.) and no flash point (acetone is −17 ° C.). As described above, the above-mentioned Elise has high solubility like acetone but is not as volatile as acetone. Therefore, after wiping with Elise, it is recommended to perform cleaning by evaporating the residue with a mixed solution of ethanol and pure water. . However, such cleaning may be performed by spraying air or heated air or nitrogen gas at room temperature or dry because water remains on the wiping surface.

  The recovery means 260 includes a container for recovering a residue (not shown), a vacuum pump, piping, and a recovery recess 261 having an upper opening formed on the bottom surface 216c of the head portion 211 as shown in FIGS. 2 (D1) and 2 (D2). Consists of. In addition, as shown to FIG. 2 (D1) and (D2), the flat hygroscopic member 262 can be provided in the upper surface of the collection | recovery recessed part 261. FIG. This hygroscopic member 262 is a receptacle that properly receives the residue that is also the dissolved material that flows down or the cleaning liquid, and prevents it from splashing toward the sheet-like member 220.

  Then, at the time of wiping or cleaning, the residue or cleaning liquid that flows down is efficiently recovered in the recovery recess 261. By applying a negative pressure to the recovery recess 261, the residue or the cleaning liquid can be recovered more reliably.

  The cleaning liquid supply means 270 includes a container for storing a cleaning liquid (not shown), a pump, piping, and a cleaning liquid supply nozzle 271 as shown in FIG. The cleaning liquid supply nozzle 271 is attached to the upper surface 216 a of the head portion 211 in such a manner that it opens downward in front of the wiping member 240 with respect to the traveling direction of the wiping means 210.

  At the time of cleaning, a predetermined amount of cleaning liquid is supplied from the cleaning liquid supply nozzle 271 onto the area where the sealing material remains prior to the wiping off of the wiping member 240.

  The supplied cleaning liquid evaporates the residue with a mixed liquid of ethanol and pure water. After supplying the mixed solution of ethanol and pure water, the wiping member 240 wipes off and cleans.

  The drying means 280 includes an air pump (not shown), piping, an air nozzle 281 as shown in FIG. The air nozzle 281 is attached to the upper surface 216a of the head portion 211 in a form opening downward toward the rear side from the wiping member 240 in the traveling direction of the wiping means 210.

  Then, after the cleaning, a predetermined amount of air is supplied from the air nozzle 281 to the area after the cleaning after the wiping off of the wiping member 240, and the water remaining on the cleaning surface is dried.

  The procedure of wiping, washing and drying will be described with reference to FIGS.

  First, for example, the stage 230 is rotated so that the side on which the wiping operation is performed becomes the side where the head portion 211 is located among the sealing materials remaining and adhered to the four sides (see FIG. 1 (B1)). Then, the stage 230 is inclined at the same angle as the inclination of the upper surface 216a of the head portion 211 (see FIGS. 1B2 and 1).

  Next, the wiping means 210 is moved on the rail 215 and positioned at the right end of the stage 230 (see FIGS. 1A and 2B).

  Next, the head portion 211 of the wiping means 210 is moved forward to bring the tip of the wiping member 240 into contact with the stage 230 surface at a position slightly shifted to the right from the right end of the sealing material 30a. In this case, the tip of the solvent supply nozzle 251 is positioned slightly above the surface of the sealing material 30a at the right end of the sealing material 30a (see FIGS. 1A and 2C1). ) Is a schematic diagram, not necessarily as described.)

  Next, the wiping operation is started. First, a solvent (for example, the above-mentioned Elise etc.) is supplied from the solvent supply nozzle 251, and the wiping means 210 is moved toward the left which is the X direction (see FIG. 2 (C1)).

  Since the sealing material 30a is dissolved when the solvent is supplied, the wiping member 240 wipes off the residue. As shown in FIGS. 2A and 2C, the wiping member 240 straddles the area where the sealing material 30a is adhered during wiping from the inside toward the outside, and the inside side precedes the outside side. Therefore, it is possible to prevent the adverse effect of the residue toward the center of the sheet-like member 220.

  Further, since the stage 230 is inclined toward the rear side, the residue easily flows downward and drops onto the hygroscopic member 262 on the bottom surface 216c (see FIG. 2 (D1)). Then, the dropped residue is forcibly sucked out through the recovery recess 261. The hygroscopic member 262 may not be required to prevent the residue from rebounding, and the wiping member 240 may be substantially orthogonal to the sealing material 30a.

  When the wiping of one side is completed, the wiping means 210 stops. Then, the same side is cleaned and dried simultaneously by the following procedure.

  First, after the head portion 211 of the wiping means 210 is moved rearward, the wiping means 210 is moved on the rail 215 and positioned at the right end of the stage 230 (see FIGS. 1A and 2B).

  Next, the head portion 211 of the wiping means 210 is moved forward to bring the tip of the wiping member 240 into contact with the stage 230 surface at a position slightly shifted to the right from the right end of the sealing material 30a. In this case, the tip of the cleaning liquid supply nozzle 271 is positioned slightly above the surface where the sealing material 30a is located at the right end of the region where the sealing material 30a was present, and the tip of the air nozzle 281 is located from the tip of the wiping member 240. It is located slightly on the right and slightly above the surface of the stage 230 (see FIGS. 1A and 2C2; FIG. 2C2 is a schematic diagram and is not necessarily as described).

  Next, cleaning and drying operations are started. First, a cleaning liquid (for example, a mixed liquid of ethanol and pure water) is supplied from the cleaning liquid supply nozzle 271 and the wiping means 210 is moved to the left in the X direction (see FIG. 2 (C2)).

  Since the residue is washed away when the cleaning liquid is supplied, the wiping member 240 wipes off the remaining cleaning liquid (evaporating more easily than the residue). As described above, the wiping member 240 straddles the region where the sealing material 30a is located from the inside toward the outside and is inclined so that the inner side precedes the outer side, so that the remaining cleaning liquid Can prevent harmful effects toward the center of the sheet-like member 220.

  Furthermore, since the stage 230 is inclined toward the rear side, the remaining cleaning liquid easily flows downward and drops onto the hygroscopic member 262 on the bottom surface 216c (see FIG. 2 (D2)). Then, the remaining dropped cleaning liquid is forcibly sucked out through the recovery recess 261.

  Drying is performed simultaneously with the start of the cleaning operation. That is, air is ejected from the air nozzle 281 simultaneously with the start of the cleaning operation (see FIG. 2 (C2)). Then, the cleaning liquid remaining on the surface wiped by the wiping member 240 is dried with air. This operation is continuously performed to the left end in the same manner as the wiping operation described above. That is, the wiping member 240 is reciprocated twice on one side to remove the sealing material 30a and perform subsequent processing. With this operation, the removal of the sealing material 30a and the subsequent processing can be performed safely and appropriately.

  When the work on one side is completed, the stage 211 tilts so as to be approximately horizontal while the head portion 211 of the wiping means 210 moves rearward and the wiping means 210 moves on the rail 215 to the right end of the stage 230. , Rotate 90 degrees and move the other adjacent side to the position of the first side. Therefore, the time until the next process can be shortened.

  After moving as described above, similar wiping, washing and drying operations are performed. Thereafter, the remaining two sides are worked in the same procedure, and all the work is finished when the work on the four sides is finished.

  As described above, when the flexible film (corresponding to the first support) is pasted on the structure and the substrate made of the functional elements by using the wiping device of one embodiment of the present invention, the adhesive layer is interposed. The flexible film can be applied more uniformly.

  Note that this embodiment can be combined with any of the other embodiments described in this specification as appropriate.

(Embodiment 2)
In this embodiment, a stack manufacturing apparatus including the wiping device described in Embodiment 1 will be described. Note that although the use of the manufacturing apparatus is not limited, it is particularly useful to be used for a manufacturing process of a semiconductor device having a flexible substrate, a display device, a light-emitting device, a power storage device, a power generation device, or the like.

  FIG. 3 is a schematic diagram illustrating a configuration of a stack manufacturing apparatus 1000 according to one embodiment of the present invention and a route through which a processed member and a stack in process are conveyed.

  4 and 5 are schematic diagrams illustrating a process for manufacturing a stack using the stack manufacturing apparatus 1000 of one embodiment of the present invention. 4 and 5 are cross-sectional views illustrating the structure of the processed member and the laminated body, and the corresponding top views are shown except for FIGS. 4C, 5B, and 5C. Shown on the right.

  A laminate manufacturing apparatus 1000 described in this embodiment includes a first supply unit 100, a first separation unit 300, a first cleaning device 350, a first bonding unit 400, a support supply unit 500, A second supply unit 600, a starting point formation unit 700, a second separation unit 800, and a second bonding unit 900 are included. The name of each unit is arbitrary, and the function is not limited by the name.

  The individual elements included in the stack manufacturing apparatus of one embodiment of the present invention are described below.

<< First supply unit >>
The 1st supply unit 100 supplies the process member 90 (refer FIG. 4 (A-1) and FIG. 6 (A-1), (A-2).). For example, it can be set as the structure provided with the multistage storage which can accommodate the some process member 90 so that the conveyance means 111 can convey the process member 90 continuously.

  Further, the first supply unit 100 described in the present embodiment also serves as the first unloading unit. The first supply unit 100 includes a laminated body 91 (on the first laminated body) including the first remaining portion 90a, the first adhesive layer 31, and the first support body 41 bonded by the first adhesive layer 31. Equivalent) (see FIG. 4E-1). For example, it can be set as the structure provided with the multistage storage which can accommodate the some laminated body 91 so that the conveyance means 111 can convey the laminated body 91 continuously.

<First separation unit>
The first separation unit 300 includes means for holding one surface of the processing member 90 and means for holding the other surface facing each other. By pulling away each holding means, one surface of the processing member 90 is peeled off, and the first remaining portion 90a is separated (see FIGS. 3 and 4A-1 to 4C).

<< First cleaning device >>
In the first cleaning device 350, the remaining sealing material on one or more sides (for example, 2 to 4 sides) of one to four sides of the outer peripheral portion of the first remaining portion 90a has been described in the first embodiment. Remove with a wiping device. Note that this step corresponds to one embodiment of the present invention. See Embodiment 1 for details.

<First bonding unit>
The first bonding unit 400 includes means for forming the first adhesive layer 31 and pressure bonding means for bonding the first remaining portion 90a and the first support body 41 using the first adhesive layer 31 ( 3 and FIG. 4 (D-1) to FIG. 4 (E-2)).

  Examples of the means for forming the first adhesive layer 31 include a device for supplying an adhesive sheet previously formed into a sheet shape in addition to a dispenser that applies a liquid adhesive.

  Note that the first adhesive layer 31 may be formed on the first remaining portion 90 a and / or the first support body 41. Specifically, a method using the first support 41 on which the first adhesive layer 31 is formed in advance may be used. Further, the material is appropriately controlled so that the material of the first adhesive layer 31 does not stick out and adhere to the outer peripheral surface of the substrate and the first support 41. If the material sticks out, for example, an organic solvent such as acetone or a cloth is used. Can be wiped off.

  As the pressure bonding means for bonding the first remaining portion 90a and the first support, for example, a pressure means such as a pair of rollers, a flat plate and a roller, or a pair of opposed flat plates controlled so that the pressure or gap is constant. Is mentioned.

《Support body supply unit》
The support supply unit 500 supplies the first support 41. For example, a film supplied in a roll shape is unwound, cut into a predetermined length, the surface is activated with UV or the like, and supplied as the first support 41.

<< Second supply unit >>
The second supply unit 600 can supply the stacked body 91. The second supply unit 600 can also serve as the second unloading unit, and the same configuration as the first supply unit can be applied. That is, the laminated body 92 (corresponding to the second laminated body) including the second support body 42 bonded by the second remaining portion 91a and the second adhesive layer 32 is stacked (FIGS. 3 and 5E). -1) and (E-2)).

《Starting point formation unit》
The starting point forming unit 700 forms a peeling starting point 91s in the vicinity of the first remaining portion 90a of the laminate 91 and the end of the first support 41b (FIGS. 5A-1 and 5A-2). )reference). For example, a cutting means for cutting the first support 41 and the first adhesive layer 31 and peeling a part of the second peelable layer 23 from the second peelable layer 22 is provided.

  Specifically, the cutting means moves one or a plurality of blades having a sharp tip and the blades relative to the stacked body 91.

<< second separation unit >>
The second separation unit 800 peels one surface 91b of the stacked body 91 and separates the second remaining portion 91a (see FIG. 5B). Therefore, a means for holding one surface of the laminate 91 and a means for holding the other surface facing each other are provided. By separating the two holding means, one surface of the laminate 91 is peeled off, and the second remaining portion 91a is separated.

<Second bonding unit>
The second bonding unit 900 includes means for forming the second adhesive layer 32 and pressure bonding means for bonding the second remaining portion 91 a and the second support 42 using the second adhesive layer 32. That is, the second support 42 is supplied, and the second support 42 is bonded to the second remaining portion 91a by using the second adhesive layer 32 (FIGS. 5D-1 to 5E-). 2)).

  As a means for forming the second adhesive layer 32, for example, a configuration similar to that of the first bonding unit 400 can be applied.

  Note that the second adhesive layer 32 may be formed on the second remaining portion 91 a or / and the second support 42. Specifically, a method using the second support 42 in which the second adhesive layer 32 is formed in advance may be used.

  For example, a configuration similar to that of the first bonding unit 400 can be applied as the pressure-bonding means for bonding the second remaining portion 91a and the second support 42 together.

  As described above, the laminated body manufacturing apparatus “stacks the laminated body 91 including the first support body 41 that supplies the processed member 90 and is bonded by the first remaining portion 90 a and the first adhesive layer 31. Supply unit 100 that also serves as a loading unit, “first separation unit 300 that separates the first remaining portion 90 a”, “first cleaning device 350 that wipes off the remaining sealing material”, and “first Together with the “first bonding unit 400 for bonding the support body 41 to the first remaining portion 90a” and the “support body supply unit 500 for supplying the first support body 41 and the second support body 42”, the “laminated body” A supply unit 600 that supplies 91 and unloads the laminate 92 including the second remaining portion 91a, the second adhesive layer 32, and the second support 42 bonded by the second adhesive layer 32; Peeling "Start point forming unit 700 for forming a point", "Second separation unit 800 for separating second remaining portion 91a", and "Second bonding for bonding second support 42 to second remaining portion 91a" Unit 900 ".

  With these configurations, both surfaces of the processing member 90 can be peeled off, the second remaining portion 91a can be separated, and the first support body 41 and the second support body 42 can be bonded to each other. As a result, it is possible to provide a laminate manufacturing apparatus including the remaining processed member and the support.

  In addition, the stack manufacturing apparatus 1000 described in this embodiment includes a first storage portion 300b, a second storage portion 800b, a second cleaning device 850, a transport unit 111, a transport unit 112, and the like.

  And the 1st accommodating part 300b accommodates one surface 90b peeled from the process member 90, the 2nd accommodating part 800b accommodates one surface 91b peeled from the laminated body 91, and 2nd The cleaning device 850 cleans the second remaining portion 91a separated from the stacked body 91, and the transport means 111 transports the processed member 90, the first remaining portion 90a separated from the processed member 90, and the stacked body 91. The transport means 112 transports the stacked body 91, the second remaining portion 91a separated from the stacked body 91, and the stacked body 92.

  In this way, by consolidating the devices and passing the processed members and the like by two transport devices, the entire manufacturing device can be reduced in size, production time can be shortened, and production cost can be reduced.

  Next, a method for manufacturing the stacked body 92 from the processed member 90 using the stacked body manufacturing apparatus 1000 will be described with reference to FIGS.

  The processing member 90 includes a first substrate 11 made of glass or the like, a first release layer 12 made of a layer containing tungsten and a layer containing tungsten oxide on the first substrate 11, one of the first release layer 12 and the like. The first peelable layer 13 made of a functional element in contact with the surface of the first layer, the bonding layer 30 in contact with the other surface of the first peelable layer 13, and one surface on the other surface of the bonding layer 30 Second peelable layer 23 made of a functional element in contact with the second peelable layer 23, a second peelable layer made up of a layer containing tungsten, a layer containing tungsten oxide, and the other surface of the second peelable layer 23 in contact with one surface 22 and the second substrate 21 made of glass or the like on the second release layer 22 (see FIGS. 4A-1 and 4A-2).

  Note that reference numeral 30a in FIG. 4A-1 represents a part of the bonding layer 30 that protrudes at the time of pressure bonding. One embodiment of the present invention is a seal material that protrudes in this manner, on the first remaining portion 90a. The sealing material 30a remaining on the surface is wiped off.

  In addition, reference numeral 31a in FIG. 4D-1 is a raised portion that rises due to the remaining sealing material 30a when the first adhesive layer 31 is formed on the first remaining portion 90a. By implementing one aspect of the present invention, the raised portion 31a can be eliminated.

  In the present embodiment, a case where a processing member 90 formed in advance near the end of the bonding layer 30 is used as the separation starting point 13s will be described (see FIGS. 4B-1 and 4B-2). Details of the configuration of the processed member 90 will be described in a third embodiment.

<< First Step >>
The processing member 90 is carried into the first supply unit 100. The first supply unit 100 supplies the processing member 90, and the transport unit 111 transports the processing member 90 and supplies it to the first separation unit 300.

<< Second Step >>
The first separation unit 300 peels off one surface 90b of the processed member 90. Specifically, the first substrate 11 is separated from the first peelable layer 13 together with the first peelable layer 12 from the peeling start point 13s formed in the vicinity of the end of the bonding layer 30 (FIG. 4C )reference).

  By this step, the first remaining portion 90a is obtained from the processed member 90. Specifically, the first remaining portion 90a has one surface in contact with the first layer 13 to be peeled, the bonding layer 30 in contact with one surface of the first layer 13 to be peeled, and the other surface of the bonding layer 30. A second peelable layer 23, a second peelable layer 22 in contact with the other face of the second peelable layer 23, and a second substrate 21 on the second peelable layer 22 are provided.

  Thereafter, the first cleaning device 350 wipes off the sealing material 30a which is a protruding sealing material and remains on the outer periphery of the first remaining portion 90a by the wiping means which is one embodiment of the present invention. As a result, the rising portion 31a in FIG.

《Third step》
The transport unit 111 transports the first remaining portion 90 a, and the support supply unit 500 supplies the first support 41.

  And the 1st bonding unit 400 forms the 1st contact bonding layer 31 in the supplied 1st remainder 90a (refer to Drawing 4 (D-1) and (D-2)), and the 1st adhesion The first support 41 is bonded using the layer 31.

  By this step, the stacked body 91 is obtained from the first remaining portion 90a. Specifically, the laminate 91 includes a first support 41, a first adhesive layer 31, a first peelable layer 13, a bonding layer 30 in which one surface is in contact with the first peelable layer 13, and a bonding. The second peelable layer 23 in which one surface is in contact with the other surface of the layer 30, the second peelable layer 22 in contact with the other surface of the second peelable layer 23, and the second peelable layer 22. The second substrate 21 is provided (see FIGS. 4E-1 and 4E-2).

<< Fourth Step >>
The transport unit 111 transports the stacked body 91 and supplies the stacked body 91 to the first supply unit 100 that also serves as the first unloading unit.

  By this step, the stacked body 91 can be unloaded. For example, when it takes time to cure the first adhesive layer 31, the stacked body 91 in a state where the first adhesive layer is not cured is stacked, and the first adhesive layer 31 is removed from the stack manufacturing apparatus 1000. It can be cured externally. Thereby, the occupation time of an apparatus can be shortened.

<< 5th step >>
The stacked body 91 is carried into the second supply unit 600. The second supply unit 600 supplies the stacked body 91, and the transport unit 112 transports the stacked body 91 and supplies it to the starting point forming unit 700.

<< Sixth Step >>
The starting point forming unit 700 peels a part of the second peelable layer 23 in the vicinity of the end of the first adhesive layer 31 of the laminated body 91 from the second peeling layer 22, thereby starting the second peeling. 91s is formed.

  For example, the first support 41 and the first adhesive layer 31 are cut from the side where the first support 41 is provided, and a part of the second layer to be peeled 23 is removed from the second release layer 22. Peel off.

  Specifically, the first adhesive layer 31 and the first support body 41 in the region where the second layer to be peeled 23 is provided on the peeling layer 22 are closed using a blade having a sharp tip or the like. And a part of the second peeled layer 23 is peeled from the second peeling layer 22 along the closed curve (see FIGS. 5A-1 and 5A-2). .

  By this step, a peeling start point 91 s is formed in the vicinity of the cut out first support body 41 b and the first adhesive layer 31.

<< Seventh Step >>
The second separation unit 800 peels the second remaining portion 91a from the stacked body 91. Specifically, the second substrate 21 is separated from the second peelable layer 23 together with the second peelable layer 22 from the peeling start point formed in the vicinity of the end of the bonding layer 30 (FIG. 5C). reference).

  By this step, the second remaining portion 91a is obtained from the stacked body 91. Specifically, the second remaining portion 91a includes the first support body 41b, the first adhesive layer 31, the first peelable layer 13, and the bonding layer 30 in which one surface is in contact with the first peelable layer 13. And a second peeled layer 23 having one surface in contact with the other surface of the bonding layer 30.

<< Eighth Step >>
The conveying means 112 conveys the second remaining portion 91a, and the second remaining portion 91a is reversed so that the second peeled layer 23 faces the upper surface. The second cleaning device 850 cleans the supplied second remaining portion 91a with water or the like.

  The transporting unit 112 transports the cleaned second remaining portion 91a to the second bonding unit 900, and the support supply unit 500 supplies the second support 42. Note that the second remaining portion 91a may be directly supplied to the second bonding unit 900 without being supplied to the second cleaning device 850.

  The second bonding unit 900 forms the second adhesive layer 32 on the supplied second remaining portion 91a (see FIGS. 5D-1 and 5D-2), and the second adhesive layer 32 is formed. Is attached to the second support 42 (see FIGS. 5E-1 and 5E-2).

  By this step, the stacked body 92 is obtained from the second remaining portion 91a. Specifically, the laminated body 92 includes a first support 41b that is bonded to one surface of the first peelable layer 13 and the first peelable layer 13 using the first adhesive layer 31; The bonding layer 30 in which one surface is in contact with the other surface of the first layer 13, the second layer 23 and the second layer 23 in which one surface is in contact with the other surface of the bonding layer 30. A second support 42 bonded to the other surface using the second adhesive layer 32 is provided.

<< Ninth Step >>
The transport unit 112 transports the stacked body 92 and supplies the stacked body 92 to the second supply unit 600 that also serves as the second unloading unit. This step enables the stacked body 92 to be unloaded.

  Note that this embodiment can be combined with any of the other embodiments described in this specification as appropriate.

(Embodiment 3)
In this embodiment, a structure of a processed member that can be used in the stack manufacturing apparatus of one embodiment of the present invention will be described with reference to FIGS.

  FIG. 6 is a schematic diagram illustrating a structure of a processed member that can be formed into a stacked body using the stack manufacturing apparatus of one embodiment of the present invention. 6A-1 is a cross-sectional view illustrating the configuration of the processed member 90, and FIG. 6A-2 is a corresponding top view.

<Processed parts>
The processing member 90 includes a first substrate 11, a first release layer 12 on the first substrate 11, a first release layer 13 in contact with the first release layer 12, and a first release layer. A bonding layer 30 in which one surface is in contact with the other surface of the layer 13, a second layer to be peeled 23 in contact with the other surface of the bonding layer 30, and the other surface and one surface of the second layer to be peeled 23 are A second release layer 22 and a second substrate 21 on the second release layer 22 are provided (see FIGS. 6A-1 and 6A-2). Note that the separation starting point 13 s may be provided in the vicinity of the end of the bonding layer 30.

<< First substrate >>
The 1st board | substrate 11 will not be specifically limited if it is provided with the heat resistance of the grade which can endure a manufacturing process, and the thickness and magnitude | size applicable to a manufacturing apparatus. Examples of materials that can be used for the first substrate 11 include glass, ceramics, metals, inorganic materials, and resins.

  Specifically, examples of the glass include alkali-free glass, soda-lime glass, potash glass, and crystal glass. Examples of the metal include SUS and aluminum.

  The first substrate 11 may have a single layer structure or a laminated structure. For example, you may have the structure where the insulating layer which prevents the spreading | diffusion of the impurity contained in a base material and a base material was laminated | stacked. Specifically, a structure in which glass and various underlayers such as a silicon oxide layer, a silicon nitride layer, or a silicon oxynitride layer that prevent diffusion of impurities contained in the glass are stacked can be used.

<< First Release Layer >>
If the 1st peeling layer 12 can peel the 1st to-be-peeled layer 13 formed on the 1st peeling layer 12, and has heat resistance of the grade which can endure a manufacturing process, especially It is not limited. Examples of materials that can be used for the first release layer 12 include inorganic materials and organic resins.

  Specifically, as an inorganic material, a metal containing an element selected from tungsten, molybdenum, titanium, tantalum, niobium, nickel, cobalt, zirconium, zinc, ruthenium, rhodium, palladium, osmium, iridium, silicon, the element Or an alloy containing the element.

  Specifically, examples of the organic material include polyimide, polyester, polyolefin, polyamide, polycarbonate, and acrylic resin.

  The structure that can be used for the first release layer 12 may have a single-layer structure, a stacked structure, or the like. For example, a stacked structure of a layer containing tungsten and a layer containing an oxide of tungsten can be used.

  The layer containing tungsten oxide may be a layer formed by stacking another layer on the layer containing tungsten, for example, oxygen such as silicon oxide or silicon oxynitride on the layer containing tungsten. Alternatively, a layer containing tungsten oxide may be formed by stacking films containing tungsten.

For the layer containing tungsten oxide, the surface of the layer containing tungsten is subjected to thermal oxidation treatment, oxygen plasma treatment, nitrous oxide (N ₂ O) plasma treatment, treatment using a solution having strong oxidizing power such as ozone water. The layer formed by etc. may be sufficient.

<< first peeled layer >>
The first peelable layer 13 is not particularly limited as long as it can be peeled off from the first peelable layer 12 and has heat resistance enough to withstand the manufacturing process.

  Examples of the material that can be used for the first layer 13 include an inorganic material or an organic resin.

  The first peeled layer 13 may have a single layer structure or a laminated structure. For example, it has a structure in which a functional layer that overlaps with the first release layer 12 and an insulating layer that prevents diffusion of impurities that impair the characteristics of the functional layer are stacked between the first release layer 12 and the functional layer. Also good. Specifically, a structure in which a silicon oxynitride layer, a silicon nitride layer, and a functional layer are sequentially stacked from the first peeling layer 12 side can be applied.

  Examples of the functional layer that can be used for the first peelable layer 13 include a functional circuit, a functional element, an optical element, a functional film, and the like, or a layer that includes a plurality selected from these. Specifically, a pixel circuit of a known display device, a pixel driving circuit, a display element, a color filter, a moisture-proof film, or the like, or a layer including a plurality selected from these can be given.

<Joint layer>
The bonding layer 30 is not particularly limited as long as it bonds the first peelable layer 13 and the second peelable layer 23. Examples of materials that can be used for the bonding layer 30 include inorganic materials and organic resins.

  Specifically, a glass layer or an adhesive having a melting point of 400 ° C. or lower, preferably 300 ° C. or lower can be used.

  Examples of the sealing material that can be used for the bonding layer 30 include an ultraviolet curable photocurable adhesive, a reactive curable adhesive, a thermosetting adhesive, an anaerobic adhesive, and the like.

  Examples thereof include an epoxy resin, an acrylic resin, a silicone resin, a phenol resin, a polyimide resin, an imide resin, a PVC (polyvinyl chloride) resin, a PVB (polyvinyl butyral) resin, and an EVA (ethylene vinyl acetate) resin.

《Starting point of peeling》
The processing member 90 may have a configuration in which the separation starting point 13 s is provided in the vicinity of the end of the bonding layer 30. The peeling start point 13 s has a structure in which a part of the first peeled layer 13 is peeled from the first peeling layer 12.

  The separation starting point 13s can be formed by piercing the first layer 13 to be peeled from the first substrate 11 side with a sharp tip, or a non-contact method using a laser or the like (for example, a laser ablation method). ), A part of the first peelable layer 13 can be peeled from the peeling layer 12.

<< second substrate >>
The second substrate 21 can be the same as the first substrate 11. The second substrate 21 does not need to have the same configuration as the first substrate 11.

<< second release layer >>
The second release layer 22 can be the same as the first release layer 12. Note that the second release layer 22 need not have the same configuration as the first release layer 12.

<< Second peelable layer >>
The second peelable layer 23 can have the same structure as the first peelable layer 13. Further, the second layer to be peeled 23 can be configured differently from the first layer to be peeled 13. For example, the first peel-off layer 13 may include a functional circuit, and the second peel-off layer 23 may include a functional layer that prevents diffusion of impurities into the functional circuit.

  Specifically, the first peel-off layer 13 includes a light-emitting element that is connected to the pixel circuit of the display device, the driving circuit of the pixel circuit, and the pixel circuit and emits light toward the second peel-off layer. The layer to be peeled 23 may include a color filter and a moisture-proof film.

  Note that this embodiment can be combined with any of the other embodiments described in this specification as appropriate.

DESCRIPTION OF SYMBOLS 11 1st board | substrate 12 1st peeling layer 13 1st peeling layer 21 2nd board | substrate 22 2nd peeling layer 23 2nd peeling layer 30 Joining layer 30a Sealing material 31 1st adhesion layer 31a Swelling Part 32 Second adhesive layer 41, 41b First support 42 Second support 90 Work member 90a First remaining part 91 First laminated body 91a Second remaining part 91s, 13s Starting point 92 Second laminated body DESCRIPTION OF SYMBOLS 100 1st supply unit 111,112 Conveying means 200 Wiping apparatus 210 Wiping means 211 Head part 212 Supporting part 213 Base part 215 Rail 216 Notch recessed part 216a Upper surface 216b Side surface 216c Bottom surface 217 Recessed space 220 Sheet-like member 230 Stage 231 Flat plate 232 Thin Hole 233 Joint portion 234 Strut 240 Wiping member 250 Solvent supply means 51 Solvent supply nozzle 260 Recovery means 261 Recovery recess 262 Hygroscopic member 270 Cleaning liquid supply means 271 Cleaning liquid supply nozzle 280 Drying means 281 Air nozzle 300 First separation unit 300b First storage unit 350 First cleaning device 400 First Bonding unit 500 Support body supply unit 600 Second supply unit 700 Starting point forming unit 800 Second separation unit 800b Second storage portion 850 Second cleaning device 900 Second bonding unit 1000 Laminate manufacturing apparatus

Claims (15)

A stage for supporting the sheet-like member;
Wiping means;
A wiping member for wiping off deposits adhering to the outer periphery of the sheet-like member;
A solvent supply means for supplying the solvent;
Recovery means for recovering the residue after wiping,
The wiping means arranges the wiping member, the solvent supply means, and the recovery means,
The solvent supply means supplies a solvent onto the deposit,
The wiping member wipes off the deposit that is dissolved when the solvent is supplied,
The said collection | recovery means collect | recovers the residue after wiping off, The wiping apparatus characterized by the above-mentioned.   The wiping device according to claim 1, wherein the stage is inclined.   3. The wiping device according to claim 1, wherein the wiping member is a silicone rubber plate.   4. The solvent supply unit according to claim 1, wherein the solvent supply unit is disposed in front of the wiping member with respect to the traveling direction of the wiping unit, and the solvent prior to wiping the wiping member. A wiping device characterized in that a wiping device is supplied to the deposit.   5. The wiping device according to claim 1, wherein the collecting unit is located below the deposit and collects a residue that flows down after wiping by the wiping member.   6. The wiping apparatus according to claim 5, wherein the recovery by the recovery means is recovery using suction.   7. The wiping apparatus according to claim 1, wherein the solvent is a solvent that has low volatility and is not designated as a hazardous material.   8. The region according to claim 1, wherein the wiping unit further includes a cleaning liquid supply unit, the cleaning liquid is supplied after wiping off the deposit by the wiping member, and the deposit remains. A wiping device, characterized by cleaning.   9. The wiping device according to claim 8, wherein the cleaning liquid supply means is disposed in front of the wiping member with respect to the traveling direction of the wiping means, and supplies the cleaning liquid prior to wiping the wiping member. apparatus.   10. The wiping apparatus according to claim 8 or 9, wherein the cleaning liquid is a mixed liquid of ethanol and pure water.   11. The wiping apparatus according to claim 8, wherein the wiping unit further includes a drying unit, and dries the region after the cleaning.   12. The wiping apparatus according to claim 11, wherein the drying unit is disposed on the rear side of the wiping member with respect to the traveling direction of the wiping unit, and supplies air after wiping the wiping member.   13. The wiping member according to claim 1, wherein the wiping member is inclined so as to straddle a range where the deposits are adhered from the inside toward the outside, and the inside side precedes the outside side. A wiping device characterized by that. A first supply unit for supplying a processed member;
A support supply unit for supplying first and second supports;
A first separation unit for separating one surface of the processed member and separating a first remaining portion;
A first cleaning device for cleaning the first remaining portion;
A first bonding unit that bonds the first support to the first remaining portion using a first adhesive layer;
A first unloading unit that unloads the first laminate including the first remaining portion and the first support bonded with the first adhesive layer;
A second supply unit for supplying the first laminate;
A starting point forming unit for forming a starting point of peeling in the vicinity of the first remaining portion and the end of the first support;
A second separation unit for separating one surface of the first laminate and separating a second remaining portion;
A second bonding unit for bonding the second support to the second remaining portion using a second adhesive layer;
A second unloading unit for unloading the second laminate including the second remaining portion and the second support bonded with the second adhesive layer;
The first cleaning device includes:
A stage for supporting the sheet-like member which is the first remaining part;
Wiping means;
A wiping member for wiping off deposits adhering to the outer periphery of the sheet-like member;
A solvent supply means for supplying the solvent;
Recovery means for recovering the residue after wiping,
The wiping means arranges the wiping member, the solvent supply means, and the recovery means,
The solvent supply means supplies a solvent onto the deposit,
The wiping member wipes off the deposit that is dissolved when the solvent is supplied,
The said collection | recovery means collect | recovers the residue after wiping off, The laminated body preparation apparatus characterized by the above-mentioned.   The stack manufacturing apparatus according to claim 14, wherein the first support and the second support are flexible substrates.

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