JP2015207705A - Electronic device and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shorten curing time of mold resin in a mold to perform mold release appropriately in manufacturing a half-molded type electronic device.SOLUTION: Of a metal plate 10 where an electronic component 20 is mounted on a surface 11, another surface 12 is exposed from mold resin 40. Further, a part of a lead 30 at a side of the surface 11 of the metal plate 10 is an exposed part 31 exposed from the mold resin 40 at an inner peripheral side of an end part 41 of the mold resin 40. While an upper mold 210 of a mold 200 and a lower mold 220 are separated, the other surface 12 of the metal plate 10 is pushed by an ejector pin 221 of the lower mold 220 and the exposed part 31 is pushed by an ejector pin 211 of the upper mold 210, which causes a workpiece W sealed with the mold resin 40 to be released from the mold 200. In this mold release process, the workpiece W is released when the mold resin 40 is molded at a semi-cured B stage.

Description

  The present invention relates to a half-mold type electronic device in which an electronic component is mounted on one surface, and one surface of the metal plate is sealed together with the electronic component, and the other surface of the metal plate is exposed from the mold resin. And a method of manufacturing such an electronic device.

  Conventionally, as this type of electronic apparatus, an apparatus described in Patent Document 1, particularly, FIG. 10 has been proposed. This is a metal plate, an electronic component mounted on one surface of the metal plate, a metal lead connected to the electronic component, and a thermosetting resin that seals one surface of the metal plate together with the electronic component and the lead. And a mold resin.

  And the other surface side opposite to the one surface of the metal plate is not sealed with the mold resin but exposed from the mold resin. Since the electronic device of such a sealing form is sealed with a mold resin on one side of a metal plate, it is said to be a so-called half mold type electronic device. A conventional method of manufacturing such an electronic device is generally as follows.

  First, as a work to be sealed with mold resin, a metal plate is prepared in which an electronic component is connected to a lead and the electronic component is mounted on one surface. Next, the mold resin is sealed. As this mold, a space-shaped cavity corresponding to the outer shape of the mold resin is formed by matching the upper mold and the lower mold. As the lower mold and the lower mold, those having an ejector pin for releasing are used.

  This ejector pin is provided so as to be inserted so that the tip surface reaches the cavity in each of the upper die and the lower die. Then, the workpiece is placed in the cavity with the other surface of the metal plate in contact with the inner surface of the lower mold. Subsequently, in this state, the mold resin is filled in the cavity to seal one side of the metal plate with the mold resin.

  In this sealing step, the mold resin is heated to bring the mold resin into a substantially completed state. After that, while separating the upper mold and the lower mold, the other side of the metal plate was pushed with the ejector pin on the lower mold side, and the mold resin was pushed with the ejector pin on the upper mold side, and sealed with the mold resin. Release the workpiece from the mold. An electronic device is thus completed.

Japanese Patent Laid-Open No. 5-55410

  However, in the above-described conventional manufacturing method, the mold resin is heated by the mold in the sealing process, and is cured to a state substantially close to the completion of curing, so that the curing time by the mold becomes long.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to shorten the curing time of a mold resin by a mold so that the mold can be appropriately released when manufacturing a half mold type electronic device. And

  In order to achieve the above-mentioned object, the invention described in claim 1 includes a metal plate (10), an electronic component (20) mounted on one surface (11) of the metal plate, and a metal plate connected to the electronic component. And a mold resin (40) made of a thermosetting resin for sealing one surface of the metal plate together with the electronic component and the lead, and the other surface (12) side opposite to the one surface of the metal plate Is exposed from the mold resin, and further includes a metal exposed portion (31) that is fixed to the mold resin and exposed from the mold resin on one surface side of the metal plate. A method of manufacturing an electronic device that is located on the inner peripheral side of a mold resin from an end (41) that is an outer shape of the mold resin when viewed from above, and includes the following steps: It is a feature.

  A preparation step of preparing a workpiece (W) in which an exposed part is integrated with a metal plate mounted on one surface with an electronic component connected to a lead.

  A space cavity (230) corresponding to the outer shape of the mold resin is formed by matching the upper mold (210) and the lower mold (220), and the upper mold and the lower mold are separated from each other. A metal mold (200) provided with ejector pins (211 and 221), and the other surface of the metal plate is brought into contact with the inner surface of the lower mold and the tip surface of the ejector pin (221) on the lower mold side, and the exposed portion is A mold installation process in which the workpiece is installed in the cavity in a state where it is in contact with the tip surface of the ejector pin (211) on the upper mold side.

  A sealing process in which one side of the metal plate is sealed with the mold resin by filling the cavity with the mold resin in the workpiece installation state.

  -While separating the upper mold and the lower mold, simultaneously press the other side of the metal plate with the ejector pin (221) on the lower mold side, and press the exposed part with the ejector pin on the upper mold side to seal with the mold resin. A mold release step of releasing the stopped workpiece from the mold.

  Furthermore, in the manufacturing method according to claim 1, in the mold release step, when the mold resin is molded in a semi-cured B stage state, the workpiece is released, and after the mold release step, The work taken out from the mold and sealed with the mold resin is placed in a heating oven (300) to complete the curing of the mold resin. The manufacturing method according to claim 1 includes these steps.

  According to the first aspect of the present invention, when the mold resin is molded in a semi-cured B-stage state, the mold is released and the workpiece is taken out. Therefore, the curing time by the mold can be shortened. Further, when the mold resin in the B stage state is released, if the mold resin itself is pushed with the ejector pin, the mold resin is likely to be deformed.

  However, in the manufacturing method of the present invention, the exposed portion made of metal on each of both the upper mold side (one surface side of the metal plate) and the lower mold side (other surface side of the metal plate), not the mold resin itself, The other surface of the metal plate is exposed from the mold resin, and the metal portion exposed on each side is pushed with an ejector pin. Therefore, the mold release can be performed appropriately without deforming the mold resin in the B stage state. Therefore, according to the present invention, the mold resin can be appropriately released by shortening the curing time of the mold resin by the mold.

  Here, as in the invention described in claim 2, in the manufacturing method of claim 1, the other surface of the metal plate is inserted into the tip portion of the lower mold side ejector pin so that the ejector pin and the metal plate The first groove (61) for preventing displacement from the other surface is provided, and the exposed portion on the one surface side of the metal plate enters the tip of the ejector pin on the upper die side, It is preferable that a second groove (62) for preventing displacement between the ejector pin and the exposed portion is provided.

  According to this, since it is possible to prevent the positional deviation between each ejector pin and the other side in contact with the ejector pin, it is possible to ensure the adhesion between each ejector pin and the other side in the sealing process, and the mold resin enters between them. It becomes easy to prevent it.

  In invention of Claim 3, the metal plate (10), the electronic component (20) mounted on one surface (11) of the metal plate, the metal lead (30) connected to the electronic component, A mold resin (40) made of a thermosetting resin for sealing one surface of the metal plate together with the electronic component and the lead, and the other surface (12) side opposite to the one surface of the metal plate is exposed from the mold resin. And a metal exposed portion (31) which is fixed to the mold resin and exposed from the mold resin on one surface side of the metal plate, and the exposed portion is formed of the mold resin as viewed from one surface of the metal plate. It is supposed to be located on the inner peripheral side of the mold resin with respect to the end portion (41) serving as the outer shell, and on the other surface of the metal plate, a first groove (61) is provided, and on the one surface side of the metal plate The exposed portion is provided with a second groove (62). Electronic device characterized in that there are provided.

  Since the electronic device according to the present invention is appropriately manufactured by the manufacturing method according to the second aspect of the present invention, it is possible to perform the mold release appropriately by shortening the curing time by the mold. .

  In addition, the code | symbol in the bracket | parenthesis of each means described in the claim and this column is an example which shows a corresponding relationship with the specific means as described in embodiment mentioned later.

1 is a schematic top view of an electronic device according to a first embodiment of the present invention. It is a schematic bottom view of the electronic device concerning the said 1st Embodiment. It is an AA schematic sectional drawing in FIG. It is a BB schematic sectional drawing in FIG. FIG. 5 is a process diagram showing a method for manufacturing the electronic device according to the first embodiment in a cross section corresponding to FIG. 4. FIG. 6 is a process diagram illustrating a method for manufacturing the electronic device following FIG. 5. FIG. 7 is a process diagram illustrating a method for manufacturing the electronic device following FIG. 6. FIG. 8 is a process diagram illustrating the method for manufacturing the electronic device following FIG. 7. FIG. 9 is a process diagram illustrating the manufacturing method of the electronic device following FIG. 8. It is a graph which shows typically the general relationship between the heating time of mold resin, viscosity, and hardness in the manufacturing method of a half mold type electronic device. It is a schematic top view of the electronic device concerning 2nd Embodiment of this invention. It is CC schematic sectional drawing in FIG. It is a schematic top view of the electronic device concerning 3rd Embodiment of this invention. It is DD schematic sectional drawing in FIG. It is a schematic top view of the electronic device concerning 4th Embodiment of this invention. It is a schematic bottom view of the electronic device concerning the said 4th Embodiment. It is EE schematic sectional drawing of FIG. It is a schematic top view of the electronic device concerning 5th Embodiment of this invention. It is a schematic bottom view of the electronic device concerning the said 5th Embodiment. It is FF schematic sectional drawing of FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, parts that are the same or equivalent to each other are given the same reference numerals in the drawings in order to simplify the description.

(First embodiment)
The electronic device S1 according to the first embodiment of the present invention will be described with reference to FIGS. In FIGS. 1 and 2, the outer shapes of the tip surfaces of the ejector pins 211 and 221 that are in contact with each other by a manufacturing method described later are indicated by broken lines. The electronic device S1 is mounted on a vehicle such as an automobile and is applied as a device for driving various devices for the vehicle, and is a half mold type.

  The electronic device S1 of the present embodiment is roughly composed of a metal plate 10, an electronic component 20 mounted on one surface 11 of the metal plate 10, a metal lead 30 connected to the electronic component 20, and an electronic component 20. And a mold resin 40 made of a thermosetting resin that seals one surface 11 of the metal plate 10 together with the leads 30.

  And the other surface 12 side opposite to the one surface 11 of the metal plate 10 is exposed from the mold resin 40 similarly to a typical half mold type. Here, the electronic device S1 has a basic configuration of a typical half mold type QFP (quad flat package).

  Here, the metal plate 10 and the lead 30 are originally composed of the same lead frame material, and the lead frame material is integrated by a tie bar or a frame. The metal plate 10 and the lead 30 are separated by lead cutting after sealing with the mold resin 40.

  That is, the metal plate 10 is configured as an island of a lead frame, and the lead 30 is configured as a lead portion of the lead frame. The metal plate 10 and the lead 30 are plate-shaped made of a metal such as Cu or Fe, or an alloy thereof (for example, 42 alloy).

  Here, the metal plate 10 has one of the front and back plate surfaces as one surface 11 of the metal plate 10 and the other as the other surface 12 of the metal plate 10. In this embodiment, the metal plate 10 has a rectangular plate shape. Has been. The electronic component 20 is joined to one surface 11 of the metal plate 10 via a die mount material (not shown) such as solder or conductive adhesive, and is fixed to the metal plate 10.

  The electronic component 20 may be a surface mount component that can be mounted on the metal plate 10. For example, examples of the electronic component 20 include semiconductor chips such as IC chips and transistor elements, and passive elements such as resistors and capacitors.

  The lead 30 is composed of a plurality of leads arranged radially outside the metal plate 10 as an island, like a typical QFP. Each lead 30 has a portion sealed with the mold resin 40 as an inner lead, and a portion protruding from the mold resin 40 as an outer lead. Here, like the normal QFP, the outer lead is bent. .

  Each lead 30 and the electronic component 20 are connected by a bonding wire 50 to be electrically and mechanically connected. The bonding wire 50 is formed by ordinary wire bonding and is made of Al, Au, Cu, or the like.

  The mold resin 40 is made of a normal mold material used for this type of mold resin, such as an epoxy resin, and is formed by a transfer mold method using a mold as will be described later. The mold resin 40 typically contains a filler made of an insulating material such as alumina or silica.

  Here, the mold resin 40 has a rectangular plate shape that is slightly larger than the metal plate 10 when viewed from the one surface 11 of the metal plate 10, and becomes an outline of the mold resin 40 when viewed from the one surface 11 of the metal plate 10. The end portion 41 is the four sides of the rectangle. Note that the outer lead of the above-described lead 30 protrudes from the end portion 41 of the mold resin 40.

  Here, in the electronic device S1 of the present embodiment, as shown in FIGS. 1 and 4, the electronic device S1 is further fixed to the mold resin 40 and exposed from the mold resin 40 on the one surface 11 side of the metal plate 10. A metal exposed portion 31 is provided.

  The exposed portion 31 of the present embodiment is configured as a part of the lead 30 located at the four corners of the mold resin 40 among the plurality of leads 30. The leads 30 located at the four corners are fixed to the mold resin 40 in contact with the mold resin 40 except for the exposed portions 31, but are not electrically connected to the electronic component 20 and are electrically independent. ing.

  The exposed portion 31 of the lead 30 is located on the inner peripheral side of the mold resin 40 with respect to the end portion 41 of the mold resin 40 as viewed from above the one surface 11 of the metal plate 10. Specifically, as shown in FIGS. 1 and 4, the four rectangular corners of the planar resin resin 40 are partially cut out, and the exposed portions of the leads 30 are formed in the cut portions. 31 is exposed from the mold resin 40.

  A first groove 61 formed by pressing or the like is provided on the other surface 12 of the metal plate 10 exposed from the mold resin 40. This 1st groove | channel 61 is a groove | channel for position shift prevention of the ejector pin 221 by the side of the lower mold | type 220 used for the manufacturing method mentioned later. In other words, the tip end portion of the ejector pin 221 on the lower mold 220 side enters the first groove 61, thereby preventing the positional deviation between the ejector pin 221 and the other surface 12 of the metal plate 10.

  Since the first groove 61 is for releasing by pushing up the ejector pin 221 on the lower mold 220 side, it is desirable that two or more first grooves 61 are provided on the other surface 12 of the metal plate 10. Here, as shown in FIG. 2, a total of four first grooves 61 are provided one by one near the four corners of the other surface 12 of the metal plate 10.

  Next, a method for manufacturing the electronic device S1 of the present embodiment will be described with reference to FIGS. First, a preparation process is performed. In this preparation process, a workpiece W is prepared in which the metal plate 10 on which the electronic component 20 connected to the lead 30 is mounted on the one surface 11 and the exposed portion 31 are integrated.

  Specifically, in the state of the lead frame material described above, a plurality of leads 30 including the metal plate 10 as an island and the leads 30 serving as the exposed portions 31 are prepared. In this lead frame material, the metal plate 10 and the plurality of leads 30 are connected and integrated by a tie bar, a frame, or the like.

  Here, the first groove 61 in the metal plate 10 is formed by pressing or the like, and the height relationship between the metal plate 10 and the lead 30 is also offset by the press or the like shown in FIGS. It is related. In this lead frame material, the electronic component 20 is mounted and fixed on one surface 11 of the metal plate 10, and the electronic component 20 and the lead 30 are wire-bonded. Thereby, the work W is completed.

  Next, as shown in FIG. 5, a mold installation step is performed in which the workpiece W is installed in a mold 200 for molding the mold resin 40. In this process, as the mold 200, a mold that forms a cavity 230 having a spatial shape corresponding to the outer shape of the mold resin 40 by matching the upper mold 210 and the lower mold 220 is used.

  Further, in this mold 200, an upper mold 210 and a lower mold 220 are provided with ejector pins 211 and 221 for releasing, respectively. The ejector pin 211 on the upper mold 210 side and the ejector pin 221 on the lower mold 220 side are the same as the normal one, and the tip surface of each of the upper mold 210 and the lower mold 220 reaches the cavity 230. It is provided by being inserted. Each ejector pin 211, 221 can be moved in the vertical direction in the figure by a hydraulic operation system.

  In the mold installation process using such a mold 200, the other surface 12 of the metal plate 10 in the work W is brought into contact with the inner surface of the lower mold 220 and the tip surface of the ejector pin 221 on the lower mold 220 side. At this time, the tip end surface of the ejector pin 221 on the lower mold 220 side comes into contact with the first groove 61 in a state where the ejector pin 221 and the metal plate 10 are prevented from being displaced.

  At the same time, the exposed portion 31 of the lead 30 in the workpiece W is brought into contact with the tip surface of the ejector pin 211 on the upper mold 210 side. The workpiece W is placed in the cavity 230 in a state where the workpiece W and the mold 200 are in contact with each other.

  Next, a sealing process is performed in such an installed state of the workpiece W. In this sealing step, the mold resin 40 is filled into the cavity 230 from a gate (not shown) to seal the one surface 11 side of the metal plate 10 with the mold resin 40 as shown in FIG. At this time, the temperature of the mold 200 is equal to or higher than the thermosetting temperature, for example, about 175 ° C.

  And after the workpiece | work W will be in the state sealed with the mold resin 40, the mold release process shown by FIGS. 6-8 is performed. In this mold release process, while the upper mold 210 and the lower mold 220 are separated, the other surface 12 of the metal plate 10 is pushed by the ejector pin 221 on the lower mold 220 side, and the metal plate is ejected by the ejector pin 211 on the upper mold 210 side. 10, the exposed portion 31 of the lead 30 is pushed on the one surface 11 side.

  As a result, as shown in FIG. 8, the workpiece W sealed with the mold resin 40 is released from the mold 200. Here, in this embodiment, as shown in FIG. 6, the mold is first released on the lower mold 220 side, and then the mold is released on the upper mold 210 side as shown in FIG. The order of the upper and lower mold release may be reversed.

  Here, in the mold release process of the present embodiment, when the mold resin 40 in a state where the work W is sealed in the sealing process is formed in a semi-cured B-stage state, The mold is released. This will be specifically described with reference to FIG.

  The time shown on the horizontal axis of FIG. 10 starts from the time when the mold resin 40 is put into the pot of the mold 200, and the viscosity of the mold resin 40 in the mold 200 and the time when the time changes, The hardness is shown on the vertical axis.

  When the mold resin 40 is put into the mold 200 heated to a temperature equal to or higher than the curing temperature, the mold resin 40 is heated to decrease in viscosity and hardness, and becomes liquid at the minimum value portion in FIG. The liquid mold resin 40 enters the cavity 230 from the gate of the mold 200 and fills the cavity 230. That is, the workpiece W is sealed with the mold resin 40.

  Thereafter, as time elapses, the mold resin 40 is heated, and the curing of the mold resin 40 proceeds. Here, in the conventional normal sealing process, the mold release is performed when the curing is substantially completed after passing the semi-cured B stage state.

  However, in this embodiment, the above-described release process is performed in this B stage state. In the B stage state, the mold resin 40 is soft, but has a viscosity enough to maintain the outer shape of the mold resin 40. Therefore, in the present embodiment, the heating time of the mold resin 40 by the mold 200 can be significantly shortened.

  After performing the mold release step in this way, in the present embodiment, the main curing step shown in FIG. 9 is performed. In this main curing step, the workpiece W taken out from the mold 200 and sealed with the B stage mold resin 40 is placed in a heating oven 300 to complete the curing of the mold resin 40.

  Thereafter, in the present embodiment, lead cutting and lead molding are performed on the metal plate 10 and the plurality of leads 30 that are in the state of the lead frame material. As a result, the electronic device S1 of the present embodiment shown in FIGS. 1 to 4 is completed. The above is the manufacturing method of the electronic device S1 according to the present embodiment.

  By the way, according to the manufacturing method of the present embodiment, when the mold resin 40 is molded in a semi-cured B-stage state, the mold is released and the workpiece W is taken out. it can. Further, when the mold resin 40 in the B-stage state is released, the mold resin 40 is likely to be deformed if the mold resin 40 itself is pushed with an ejector pin as in the conventional general method.

  However, in the manufacturing method of the present embodiment, the metal is formed on both sides of the upper mold 210 side (that is, the one surface 11 side of the metal plate 10) and the lower mold 220 side (that is, the other surface 12 side of the metal plate 10). The exposed portion 31 and the other surface 12 of the metal plate 10 are exposed from the mold resin 40.

  Then, on both the upper and lower sides, not the mold resin 40 itself but the exposed metal part is pushed by the ejector pins 211 and 221. Therefore, the mold release can be performed appropriately without deforming the mold resin 40 in the B stage state.

  In particular, as described above, on the upper mold 210 side, the exposed portion 31 of the lead 30 on the one surface 11 side of the metal plate 10 is more than the end portion 41 that is an outline of the mold resin 40 when viewed from the one surface 11 of the metal plate 10. It is assumed that it is located on the inner peripheral side of the mold resin 40. Therefore, pressing when the exposed portion 31 is pressed by the ejector pin 211 on the upper mold 210 side is easily applied directly to the mold resin 40, so that the mold resin 40 can be easily released.

  The outer lead of the lead 30 is also a metal portion that is fixed to the mold resin 40 and exposed from the mold resin 40 on the one surface 11 side of the metal plate 10. Therefore, it may be considered that the outer lead of the lead 30 is pushed by the ejector pin 211 on the upper mold 210 side in the mold release step.

  However, in this case, the outer lead of the lead 30 is located on the outer side of the mold resin 40 with respect to the end portion 41 of the mold resin 40 when viewed from the top surface 11 of the metal plate 10. Therefore, the pressing from the ejector pin 211 is applied to a position away from the mold resin 40 as compared with the case where the exposed portion 31 of the lead 30 is pressed.

  If it does so, there exists a possibility that peeling may generate | occur | produce in the contact part of the lead | read | reed 30 and the mold resin 40. FIG. In this respect, according to the present embodiment, such a problem can be avoided. Therefore, according to the present embodiment, the mold resin 40 can be appropriately released by shortening the curing time of the mold resin 40 by the mold 200.

  In the present embodiment, the other surface 12 of the metal plate 10 is prevented from being misaligned between the ejector pin 221 and the other surface 12 of the metal plate 10 because the tip of the ejector pin 221 on the lower mold 220 side enters. A first groove 61 is provided for this purpose.

  According to this, since it is possible to prevent the positional deviation between the ejector pin 221 on the lower mold 220 side and the other surface 12 of the metal plate 10 in contact with the ejector pin 221, the ejector pin 221 and the other surface 12 of the metal plate 10 are sealed in the sealing process. It becomes easy to prevent the mold resin 40 from entering between the two.

(Second Embodiment)
The electronic device S2 according to the second embodiment of the present invention will be described mainly with respect to differences from the first embodiment with reference to FIGS. As shown in FIGS. 11 and 12, in the present embodiment, the configuration of the exposed portion 31 of the lead 30 is partially modified.

  The exposed portion 31 of the present embodiment is also configured as a part of the lead 30 located near the four corners of the mold resin 40 among the plurality of leads 30 as in the first embodiment. Also in the present embodiment, the lead 30 located in the vicinity of the four corners is fixed to the mold resin 40 while the portions other than the exposed portions 31 are in contact with the mold resin 40, but are electrically connected to the electronic component 20. It is independent without being.

  Here, unlike the first embodiment, in this embodiment, the leads 30 located near the four corners of the planar rectangular mold resin 40 are not cut out, and the leads 30 are bent by a press or the like. The exposed portion 31 is disposed on the upper surface side of the mold resin 40.

  Thereby, also in the present embodiment, the exposed portion 31 is located on the inner peripheral side of the mold resin 40 relative to the end portion 41 of the mold resin 40 when viewed from the one surface 11 of the metal plate 10 and is exposed from the mold resin 40. doing.

  Therefore, according to the present embodiment, the same manufacturing method as that of the first embodiment can be applied, and the mold resin 40 can be appropriately released by shortening the curing time of the mold resin 40 by the mold 200.

  Also in the present embodiment, the first groove 61 is provided on the other surface 12 of the metal plate 10 as in the first embodiment, but in the present embodiment, the exposed portion 31 of the lead 30 is further improved. Each is provided with a second groove 62. The second groove 62 is formed by pressing or the like.

  The second groove 62 is a groove for preventing displacement of the ejector pin 211 on the upper mold 210 side. In other words, the tip end portion of the ejector pin 211 on the upper mold 210 side enters the second groove 62, thereby preventing the positional deviation between the ejector pin 211 and the exposed portion 31.

  Further, due to the effect of preventing the positional deviation, as with the first groove 61 described above, on the upper mold 210 side, a mold is formed between the ejector pin 211 on the upper mold 210 side and the exposed portion 31 during the sealing process. It is possible to prevent the resin 40 from entering.

  The second groove 62 is preferably provided also in the exposed portion 31 of each lead 30 in the first embodiment. Here, of course, the first groove 61 and the second groove 62 have a size and a shape for allowing the above-described ejector pins 211 and 221 to enter and prevent the displacement thereof. It is.

(Third embodiment)
The electronic device S3 according to the third embodiment of the present invention will be described with reference to FIGS. 13 and 14, focusing on differences from the first embodiment. As shown in FIGS. 13 and 14, in the present embodiment, the exposed portion 31 on the one surface 11 side of the metal plate 10 is configured by one surface 71 of another metal plate 70 instead of the lead 30.

  As shown in FIGS. 13 and 14, another metal plate 70 of the present embodiment has a rectangular plate shape that is slightly smaller than the metal plate 10. Further, the other metal plate 70 is exposed on the upper surface of the mold resin 40 at the inner peripheral side of the end portion 41 of the mold resin 40, here, at a portion closer to the center of the mold resin 40.

  The other metal plate 70 is made of Cu, Fe, or the like. One surface 71 is exposed from the mold resin 40, and the other surface 72 on the opposite side is in close contact with the mold resin 40 and fixed to the mold resin 40. One surface 71 of another metal plate 70 is the exposed portion 31, and a second groove 62 is provided on one surface 71 of the other metal plate 70.

  As described above, also in the present embodiment, the same manufacturing method as in the first embodiment can be applied to obtain the same effect, and both the first groove 61 and the second groove 62 are provided. Therefore, the same effect as the second embodiment can be expected.

(Fourth embodiment)
The electronic device S4 according to the fourth embodiment of the present invention will be described mainly with respect to differences from the first embodiment with reference to FIGS. As shown in FIGS. 15 to 17, in the present embodiment, the exposed portion 31 on the one surface 11 side of the metal plate 10 is not a lead 30 or another metal plate 70 but a part of the one surface 11 of the metal plate 10. It is composed.

  Here, the metal plate 10 of the present embodiment is configured as a heat sink that is thicker than the island, and is originally separate from the lead frame material that constitutes the lead 30.

  Therefore, in order to fix the metal plate 10 as the heat sink and the lead frame material before sealing with the mold resin 40, a part of the plurality of leads 30 and the metal plate 10 are not shown. And joined by caulking or the like.

  In the present embodiment, a part of the mold resin 40 is cut out from the end portion 41 of the mold resin 40 to form a part of the one surface 11 of the metal plate 10 at the cutout portion. The exposed portion 31 is exposed from the resin 40. Here, as shown in FIG. 15, the exposed portions 31 are provided on opposite sides of the planar rectangular metal plate 10, and are provided in two places in total.

  Thereby, also in this embodiment, the same effect can be acquired by applying the manufacturing method similar to the said 1st Embodiment. Also in the present embodiment, the second groove 62 may be provided in the exposed portion 31, and in that case, the second groove 62 is provided with both the first groove 61 and the second groove 62. The same effect as the third embodiment can be expected.

  Further, in this embodiment, a part of one surface 11 of the metal plate 10 as the heat sink is the exposed portion 31, but the present embodiment can also be applied to the metal plate 10 as an island as in the first embodiment. Needless to say.

(Fifth embodiment)
An electronic device S5 according to a fifth embodiment of the present invention will be described with reference to FIGS. In the first to fourth embodiments, the electronic devices S1 to S4 are based on the QFP. However, the electronic device S5 of the present embodiment is a QFN (quad flat non-lead package). The basic configuration is different.

  In the electronic device S5 having the QFN configuration, the lead 30 is exposed on the lower surface of the mold resin 40 shown in FIG. 19, but does not protrude from the end portion 41 of the mold resin 40, and the inner periphery of the end portion 41 of the mold resin 40 Located in. Here, the electronic device S5 of the present embodiment has the reinforcing lands 30a at the four corners of the planar rectangular mold resin 40, as in the case of normal QFN.

  In the present embodiment, the reinforcing land 30 a is the exposed portion 31 on the one surface 11 side of the metal plate 10. Specifically, the reinforcing lands 30a located at the four corners of the mold resin 40 are fixed to the mold resin 40 while the portions other than the exposed portions 31 are in contact with the mold resin 40. It is electrically independent without being connected.

  The exposed portion 31 of the reinforcing land 30 a is located on the inner peripheral side of the mold resin 40 with respect to the end portion 41 of the mold resin 40 when viewed from the top surface 11 of the metal plate 10. Specifically, as shown in FIGS. 18 to 20, the mold resin 40 has a shape in which a part of the four corners is notched, and the exposed portion 31 of the reinforcing land 30 a is formed in the notch. It is exposed from the mold resin 40.

  Thus, also in the present embodiment, the same effect can be obtained by applying the same manufacturing method as in the first embodiment. In the present embodiment, the second groove 62 may be provided in the exposed portion 31 of the reinforcing land 30a. In this case, the first groove 61 and the second groove 62 are provided. The same effects as those of the second and third embodiments can be expected.

(Other embodiments)
By the way, in each of the above embodiments, the exposed portion 31 is configured by a part of the lead 30, another metal plate 70, a part of one surface 11 of the metal plate 10, or the reinforcing land 30a. The unit 31 may be a mixture of these components if possible.

  In each of the above embodiments, as the half mold type electronic devices S1 to S5, the ejector pin 211 on the upper mold 210 side and the ejector pin 221 on the lower mold 220 side on the one surface 11 side and the other surface 12 side of the metal plate 10 are used. The thing of the structure which provided the metal exposed part in the site | part corresponding to is provided.

  Further, the electronic devices S1 to S5 are characterized in that grooves 61 and 62 for preventing displacement of the ejector pins 211 and 212 are provided in the exposed portions. According to such electronic devices S <b> 1 to S <b> 5, the manufacturing method shown in the first embodiment can be applied to shorten the curing time of the mold resin 40 by the mold 200 and perform appropriate release. . Moreover, the said effect by the grooves 61 and 62 is also exhibited.

  Further, in the above embodiments, the misalignment preventing grooves 61 and 62 are provided on one or both of the other surface 12 and the exposed portion 31 of the metal plate 10, but the other surface 12 and the exposed surface of the metal plate 10 are exposed. Both of the portions 31 may be configured without the groove.

  In each of the above embodiments, the planar shape of the metal plate 10 and the planar shape of the mold resin 40 are typical rectangles, but the present invention is not limited to this. Arbitrary shapes such as a square shape are possible as appropriate.

  Moreover, the electronic component 20 mounted on the one surface 11 of the metal plate 10 may be plural. Further, the connection between the electronic component 20 and the lead 30 is not limited to the bonding wire 50 described above, and other than that, for example, a connection method such as solder or bump may be used.

  Further, the present invention is not limited to the above-described embodiment, and can be appropriately changed within the scope described in the claims. The above embodiments are not irrelevant to each other, and can be combined as appropriate unless the combination is clearly impossible, and the above embodiments are not limited to the illustrated examples. Absent. In each of the above-described embodiments, it is needless to say that elements constituting the embodiment are not necessarily essential unless explicitly stated as essential and clearly considered essential in principle. Yes. Further, in each of the above embodiments, when numerical values such as the number, numerical value, quantity, range, etc. of the constituent elements of the embodiment are mentioned, it is clearly limited to a specific number when clearly indicated as essential and in principle. The number is not limited to the specific number except for the case. Further, in each of the above embodiments, when referring to the shape, positional relationship, etc. of the component, etc., the shape, unless otherwise specified and in principle limited to a specific shape, positional relationship, etc. It is not limited to the positional relationship or the like.

DESCRIPTION OF SYMBOLS 10 Metal plate 11 One side of metal plate 12 Other side of metal plate 20 Electronic component 30 Lead 31 Exposed portion 40 Mold resin 41 End portion of mold resin 200 Mold 210 Upper die 211 Ejector pin on upper die side 220 Lower die 221 Lower die Side ejector pin 230 Cavity 300 Oven

Claims (3)

A metal plate (10);
An electronic component (20) mounted on one surface (11) of the metal plate;
A metal lead (30) connected to the electronic component;
A mold resin (40) made of a thermosetting resin for sealing one surface of the metal plate together with the electronic component and the lead;
The other surface (12) side opposite to the one surface of the metal plate is exposed from the mold resin,
Furthermore, it comprises a metal exposed portion (31) that is fixed to the mold resin and exposed from the mold resin on one surface side of the metal plate, and the exposed portion is seen from above the one surface of the metal plate. It is a method for manufacturing an electronic device that is positioned on the inner peripheral side of the mold resin with respect to an end (41) that is an outer shell of the mold resin,
A preparation step of preparing a workpiece (W) in which the electronic component in a state connected to the leads is integrated with the exposed portion of the metal plate mounted on the one surface;
The upper mold (210) and the lower mold (220) are matched to form a cavity (230) having a spatial shape corresponding to the outer shape of the mold resin, and each of the upper mold and the lower mold includes Using a mold (200) provided with ejector pins (211, 221) for mold release,
The other surface of the metal plate is brought into contact with the inner surface of the lower die and the tip surface of the ejector pin (221) on the lower die side, and the exposed portion is the tip surface of the ejector pin (211) on the upper die side. A mold installation step of installing the workpiece in the cavity in a state of being in contact with
In the installation state of the workpiece, a sealing step of sealing one surface side of the metal plate with the mold resin by filling the mold resin in the cavity;
While separating the upper mold and the lower mold, simultaneously pressing the other surface of the metal plate by the ejector pin (221) on the lower mold side and pushing the exposed portion by the ejector pin on the upper mold side A release step of releasing the workpiece sealed with the mold resin from the mold, and
In the mold release step, when the mold resin is molded in a semi-cured B stage state, the workpiece is released.
After the mold release step, the work taken out from the mold and sealed with the mold resin is placed in a heating oven (300) to complete the curing of the mold resin. A method for manufacturing an electronic device. The other surface of the metal plate has a first groove (61) for preventing displacement of the ejector pin and the other surface of the metal plate when the tip of the ejector pin on the lower mold side enters. It was supposed to be provided,
The exposed portion on the one surface side of the metal plate has a second groove (62) for preventing the displacement between the ejector pin and the exposed portion by the tip portion of the ejector pin on the upper die side entering. The method for manufacturing an electronic device according to claim 1, wherein the electronic device is provided. A metal plate (10);
An electronic component (20) mounted on one surface (11) of the metal plate;
A metal lead (30) connected to the electronic component;
A mold resin (40) made of a thermosetting resin for sealing one surface of the metal plate together with the electronic component and the lead;
The other surface (12) side opposite to the one surface of the metal plate is exposed from the mold resin,
Furthermore, it comprises a metal exposed portion (31) that is fixed to the mold resin and exposed from the mold resin on one surface side of the metal plate, and the exposed portion is seen from above the one surface of the metal plate. It is supposed to be located on the inner peripheral side of the mold resin from the end (41) which becomes the outer shell of the mold resin,
On the other surface of the metal plate, a first groove (61) is provided,
The electronic device according to claim 1, wherein a second groove (62) is provided in the exposed portion on the one surface side of the metal plate.

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