JP2015191892A - Led lighting device - Google Patents

Led lighting device Download PDF

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JP2015191892A
JP2015191892A JP2015091409A JP2015091409A JP2015191892A JP 2015191892 A JP2015191892 A JP 2015191892A JP 2015091409 A JP2015091409 A JP 2015091409A JP 2015091409 A JP2015091409 A JP 2015091409A JP 2015191892 A JP2015191892 A JP 2015191892A
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led
lighting device
substrate
led substrate
plate
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彰男 前川
Akio Maekawa
彰男 前川
直輝 谷藤
Naoteru Tanifuji
直輝 谷藤
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Iris Ohyama Inc
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Iris Ohyama Inc
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Abstract

PROBLEM TO BE SOLVED: To provide an LED lighting device which fixes an LED substrate to a support part while inhibiting damage to the LED substrate.SOLUTION: An LED lighting device includes: a support plate 51 having a main surface 51a; two or more LED substrates 6 disposed on the main surface 51a side; and restriction parts 111, 116 which cover at least end parts of the LED substrates 6 and restrict positions of the LED substrates 6. Fastening members 112, 117 which attach the restriction parts 111, 116 to the support plate 51 are separated from the LED substrates 6 in a plan view.

Description

本発明は、ＬＥＤ（Ｌｉｇｈｔ Ｅｍｉｔｔｉｎｇ Ｄｉｏｄｅ：発光ダイオード）照明装置に関する。   The present invention relates to an LED (Light Emitting Diode) illumination device.

この種の従来技術としては、例えば特許文献１に開示されたものがある。即ち、特許文献１には、ベースフレームと、ＬＥＤが取り付けられた基板と、反射シートと、複数のリベットとを備えた照明装置が記載されている。この照明装置において、基部にはリベットが挿入される挿入孔が形成されている。また、基板には、挿入孔に対応した貫通孔が形成されている。さらに、反射シートには、挿入孔と貫通孔とに対応した取付孔が形成されている。そして、互いに対応する一組の取付孔と貫通孔と挿入孔とにリベットが挿入されることにより、基部と反射シートとの間に挟まれた基板が、反射シートととともに基部に固定される。   As this type of prior art, for example, there is one disclosed in Patent Document 1. That is, Patent Document 1 describes a lighting device including a base frame, a substrate on which LEDs are attached, a reflective sheet, and a plurality of rivets. In this lighting device, an insertion hole for inserting a rivet is formed in the base. Further, a through hole corresponding to the insertion hole is formed in the substrate. Furthermore, attachment holes corresponding to the insertion hole and the through hole are formed in the reflection sheet. And a board | substrate pinched | interposed between a base part and a reflective sheet is fixed to a base part with a reflective sheet by inserting a rivet into a pair of attachment hole, through-hole, and insertion hole corresponding to each other.

特開２０１３−１３７８７２号公報JP2013-137882A

特許文献１に開示された照明装置では、基板は、この基板の貫通孔に通されたリベットによって基部に固定される。ここで、リベットによる基板の固定を強くすると、リベットの頭部が基板の貫通孔周辺部を強く押圧したり、リベットの脚部が貫通孔を強く押し広げたりする可能性がある。その結果、基板の貫通孔周辺部に変形や亀裂が生じる可能性があった。   In the lighting device disclosed in Patent Document 1, the substrate is fixed to the base by a rivet passed through the through hole of the substrate. Here, if the fixing of the substrate by the rivet is strengthened, there is a possibility that the head portion of the rivet strongly presses the peripheral portion of the through hole of the substrate, or the leg portion of the rivet strongly presses the through hole. As a result, there is a possibility that deformation or cracks may occur in the periphery of the through hole of the substrate.

また、リベットと基板は平面視で重なっている。このため、基板を基材に取り付ける際に、リベットの頭部から取付工具等が外れて反射シートや基板を傷付ける可能性があった。基板に変形や亀裂、傷等のダメージが与えられると、基板の配線パターンが断線し、基板に取り付けられたＬＥＤ素子が正しく発光しなくなる可能性がある。
そこで、この発明はこのような事情に鑑みてなされたものであって、ＬＥＤ基板へのダメージを抑えつつ、ＬＥＤ基板を支持部に固定できるようにしたＬＥＤ照明装置の提供を目的とする。 Also, the rivet and the substrate overlap in plan view. For this reason, when attaching a board | substrate to a base material, there exists a possibility that an attachment tool etc. may remove | deviate from the head of a rivet, and a reflective sheet and a board | substrate may be damaged. If the substrate is damaged, such as deformation, cracks or scratches, the wiring pattern of the substrate may be disconnected, and the LED element attached to the substrate may not emit light correctly.
Therefore, the present invention has been made in view of such circumstances, and an object of the present invention is to provide an LED lighting device that can fix an LED substrate to a support portion while suppressing damage to the LED substrate.

上記課題を解決するために、本発明の一態様に係るＬＥＤ照明装置は、第１の面を有する支持部と、前記第１の面側に配置された２枚以上のＬＥＤ基板と、前記ＬＥＤ基板の少なくとも端部を覆って該ＬＥＤ基板の位置を規制する規制部とを備え、前記規制部を前記支持部に取り付ける締結部材は、平面視で前記ＬＥＤ基板から離れていることを特徴とする。   In order to solve the above problem, an LED lighting device according to an aspect of the present invention includes a support portion having a first surface, two or more LED substrates disposed on the first surface side, and the LED. A fastening portion that covers at least an end portion of the substrate and restricts the position of the LED substrate, and a fastening member that attaches the restriction portion to the support portion is separated from the LED substrate in a plan view. .

また、上記のＬＥＤ照明装置において、前記規制部は、前記２枚以上のＬＥＤ基板のうちのｎ（ｎは２以上の整数）枚の各位置を一括で規制することを特徴とする。
また、上記のＬＥＤ照明装置において、前記２枚以上のＬＥＤ基板は平面視で一方向に離間して並び、前記規制部は前記一方向に延設されていることを特徴とする。
また、上記のＬＥＤ照明装置において、前記規制部を複数備え、前記複数の規制部は、平面視で互いに離間して設けられていることを特徴とする。 In the LED lighting device, the restriction unit restricts each position of n (n is an integer of 2 or more) of the two or more LED substrates in a lump.
In the LED lighting device, the two or more LED substrates are arranged to be spaced apart from each other in one direction in a plan view, and the restricting portion extends in the one direction.
In the LED lighting device described above, a plurality of the restriction portions are provided, and the plurality of restriction portions are provided apart from each other in a plan view.

また、上記のＬＥＤ照明装置において、前記規制部は、前記第１の面のうち前記ＬＥＤ基板間の領域に取り付けられていることを特徴とする。
また、上記のＬＥＤ照明装置において、前記支持部は、前記第１の面を有する支持板と、前記支持板の外周部に沿って設けられた側板とを有し、前記規制部は、前記側板に取り付けられていることを特徴とする。 In the LED lighting device, the restricting portion is attached to a region between the LED substrates in the first surface.
In the LED lighting device, the support portion includes a support plate having the first surface and a side plate provided along an outer peripheral portion of the support plate, and the restricting portion is the side plate. It is attached to.

また、上記のＬＥＤ照明装置において、前記支持部は、前記第１の面を有する支持板と、前記支持板の外周部に沿って設けられた側板とを有し、前記側板には切込み部が設けられており、前記切込み部は、前記第１の面側に折り曲げられることによって、前記側板に隣接する前記ＬＥＤ基板の位置を規制することを特徴とする。
本発明の別の態様に係るＬＥＤ照明装置は、第１の面と、前記第１の面の反対に位置する第２の面とを有し、前記第１の面と前記第２の面との間に貫通穴が設けられた支持部と、前記第１の面側に配置された２枚以上のＬＥＤ基板と、前記ＬＥＤ基板の位置を規制する規制部とを備え、前記規制部は、前記第２の面側に配置された掛止板を有し、該掛止板の端片が前記第２の面側から前記貫通穴を通して前記第１の面側に突出し、該突出した先端部が前記ＬＥＤ基板の側に折り曲げられて該ＬＥＤ基板の位置を規制していることを特徴とする。 In the LED lighting device, the support portion includes a support plate having the first surface and a side plate provided along an outer peripheral portion of the support plate, and the side plate has a cut portion. The cut portion is bent toward the first surface to restrict the position of the LED substrate adjacent to the side plate.
The LED lighting device according to another aspect of the present invention includes a first surface and a second surface located opposite to the first surface, the first surface and the second surface, A support portion provided with a through-hole between, two or more LED substrates disposed on the first surface side, and a restriction portion for restricting the position of the LED substrate, the restriction portion, A latch plate disposed on the second surface side, and an end piece of the latch plate projects from the second surface side to the first surface side through the through hole, and the projecting tip portion Is bent to the LED substrate side to regulate the position of the LED substrate.

本発明の一態様によれば、ＬＥＤ基板へのダメージを抑えつつ、ＬＥＤ基板を支持部に固定することができる。   According to one embodiment of the present invention, the LED substrate can be fixed to the support portion while suppressing damage to the LED substrate.

本発明の実施形態に係るＬＥＤ照明装置１の構成例を示す図である。It is a figure which shows the structural example of the LED lighting apparatus 1 which concerns on embodiment of this invention. ＬＥＤ照明装置１の構成例を示す分解斜視図である。FIG. 2 is an exploded perspective view showing a configuration example of an LED lighting device 1. ＬＥＤ基板６の構成例を示す平面図である。3 is a plan view showing a configuration example of an LED substrate 6. FIG. 第１のコネクタ６７の構成例を示す斜視図である。FIG. 6 is a perspective view showing a configuration example of a first connector 67. 第１のＬＥＤ素子回路６１の構成例を示す回路図である。3 is a circuit diagram illustrating a configuration example of a first LED element circuit 61. FIG. 第１、第２のＬＥＤ照明回路１０、２０の構成例を示す平面図である。It is a top view which shows the structural example of the 1st, 2nd LED illumination circuits 10 and 20. FIG. 第１のＬＥＤ照明回路１０の構成と電流の流れを模式的に示す平面図である。It is a top view which shows typically the structure of the 1st LED illumination circuit 10, and the flow of an electric current. 第２のＬＥＤ照明回路２０の構成と電流の流れを模式的に示す平面図である。It is a top view which shows typically the structure of the 2nd LED illumination circuit 20, and the flow of an electric current. 第１実施形態におけるＬＥＤ基板６の取付状態を模式的に示す図である。It is a figure which shows typically the attachment state of LED board 6 in 1st Embodiment. 第１のＬＥＤ点灯装置７１の構成例を示す斜視図である。It is a perspective view which shows the structural example of the 1st LED lighting device 71. FIG. 主面反射シート８１の構成例を示す平面図である。5 is a plan view showing a configuration example of a main surface reflection sheet 81. FIG. 収容取付部３の構成例を示す斜視図である。FIG. 6 is a perspective view illustrating a configuration example of a housing mounting portion 3. 第１実施形態におけるＬＥＤ基板６の取付状態の変形例（その１）を示す図である。It is a figure which shows the modification (the 1) of the attachment state of LED board 6 in 1st Embodiment. 第１実施形態におけるＬＥＤ基板６の取付状態の変形例（その２）を示す図である。It is a figure which shows the modification (the 2) of the attachment state of LED board 6 in 1st Embodiment. 第１実施形態におけるＬＥＤ基板６の取付状態の変形例（その３）を示す図である。It is a figure which shows the modification (the 3) of the attachment state of LED board 6 in 1st Embodiment. 第１のＬＥＤ照明回路１０の変形例を模式的に示す平面図である。4 is a plan view schematically showing a modification of the first LED illumination circuit 10. FIG. 第２実施形態におけるＬＥＤ基板６の取付状態を模式的に示す図である。It is a figure which shows typically the attachment state of LED board 6 in 2nd Embodiment. 第２実施形態におけるＬＥＤ基板６の取付状態の変形例を示す図である。It is a figure which shows the modification of the attachment state of LED board 6 in 2nd Embodiment. 第３実施形態におけるＬＥＤ基板６の取付状態を模式的に示す図である。It is a figure which shows typically the attachment state of LED board 6 in 3rd Embodiment. 第３実施形態におけるＬＥＤ基板６の取付状態の変形例を示す図である。It is a figure which shows the modification of the attachment state of LED board 6 in 3rd Embodiment. 第４実施形態におけるＬＥＤ基板６の取付状態を模式的に示す図である。It is a figure which shows typically the attachment state of LED board 6 in 4th Embodiment. 第５実施形態におけるＬＥＤ基板６の取付状態を模式的に示す図である。It is a figure which shows typically the attachment state of LED board 6 in 5th Embodiment.

以下、本発明の実施形態を、図面を用いて説明する。なお、以下に説明する各図において、同一の構成を有する部分には同一の符号を付し、その繰り返しの説明は省略する。
＜第１実施形態＞
（構成）
図１は、本発明の第１実施形態に係るＬＥＤ照明装置１の構成例を示す図である。詳しくは、図１（ａ）はＬＥＤ照明装置１を斜め上方から見た斜視図であり、図１（ｂ）（ｃ）はＬＥＤ照明装置１の側面図である。また、図２は、ＬＥＤ照明装置１の構成例を示す分解斜視図である。なお、図１（ａ）〜（ｃ）では、ヒートシンク５及びＬＥＤ基板６を明示するために、図２に示すパネル板９１と、反射シート８及び収容取付部３の図示を省略している。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that, in each drawing described below, parts having the same configuration are denoted by the same reference numerals, and repeated description thereof is omitted.
<First Embodiment>
(Constitution)
FIG. 1 is a diagram illustrating a configuration example of an LED lighting device 1 according to the first embodiment of the present invention. Specifically, FIG. 1A is a perspective view of the LED lighting device 1 as viewed obliquely from above, and FIGS. 1B and 1C are side views of the LED lighting device 1. FIG. 2 is an exploded perspective view showing a configuration example of the LED lighting device 1. In FIGS. 1A to 1C, the panel plate 91, the reflection sheet 8, and the housing mounting portion 3 shown in FIG. 2 are not shown in order to clearly show the heat sink 5 and the LED substrate 6.

図１（ａ）〜（ｃ）及び図２に示すように、ＬＥＤ照明装置１はスクエア型の照明装置である。このＬＥＤ照明装置１は、ＬＥＤユニット２と、ＬＥＤユニット２を収容すると共に、収容したＬＥＤユニット２を被取付部（例えば、天井）に取り付ける収容取付部３と、を備える。また、ＬＥＤユニット２は、ヒートシンク５と、ヒートシンク５の主面側に設けられた複数の（即ち、２枚以上の）ＬＥＤ基板６と、ＬＥＤ基板６の端部を覆って、このＬＥＤ基板６の位置を規制する規制部１１１、１１６と、ヒートシンク５の主面の反対に位置する背面側に設けられたＬＥＤ点灯装置７と、ヒートシンク５の主面側に設けられて複数のＬＥＤ基板６等を覆う反射シート８と、ヒートシンク５の主面側に設けられて複数のＬＥＤ基板６及び反射シート８等を覆うカバーパネル９と、を備える。ＬＥＤ点灯装置７は、例えば、第１のＬＥＤ点灯装置７１と第２のＬＥＤ点灯装置７２とを有する。
なお、ＬＥＤ照明装置１を建物の天井に取り付ける場合は、図１（ａ）〜（ｃ）及び図２において、Ｚ軸方向のマイナス側（即ち、下側）が建物の天井側に相当し、Ｚ軸方向のプラス側（即ち、上側）が建物の床側に相当する。以下、ＬＥＤ照明装置１を構成する各構成部について説明する。 As shown in FIGS. 1A to 1C and FIG. 2, the LED lighting device 1 is a square type lighting device. The LED lighting device 1 includes an LED unit 2 and a housing attachment portion 3 that houses the LED unit 2 and attaches the housed LED unit 2 to a portion to be attached (for example, a ceiling). The LED unit 2 covers the heat sink 5, a plurality of (ie, two or more) LED substrates 6 provided on the main surface side of the heat sink 5, and an end of the LED substrate 6. , The LED lighting device 7 provided on the back side opposite to the main surface of the heat sink 5, the plurality of LED substrates 6 provided on the main surface side of the heat sink 5, etc. And a cover panel 9 provided on the main surface side of the heat sink 5 and covering the plurality of LED substrates 6, the reflective sheet 8, and the like. The LED lighting device 7 includes, for example, a first LED lighting device 71 and a second LED lighting device 72.
In addition, when attaching LED lighting apparatus 1 to the ceiling of a building, in FIG. 1 (a)-(c) and FIG. 2, the negative | minus side (namely, lower side) of a Z-axis direction is equivalent to the ceiling side of a building, The plus side (that is, the upper side) in the Z-axis direction corresponds to the floor side of the building. Hereinafter, each component which comprises the LED lighting apparatus 1 is demonstrated.

（１）ヒートシンク
図１（ａ）〜（ｃ）及び図２に示すように、ヒートシンク５は、主面５１ａと背面５１ｂとを有し平面視による形状（以下、平面形状）が矩形である支持板５１と、支持板５１の外周部に沿って設けられ、支持板５１の主面５１ａからカバーパネル９に向かって斜め（又は、略垂直方向）に延びる側板と、を有する。図２に示すように、支持板５１の中央部には、主面５１ａと背面５１ｂとの間を貫通する２つの貫通穴５３ａ、５３ｂが設けられている。 (1) Heat Sink As shown in FIGS. 1A to 1C and 2, the heat sink 5 has a main surface 51 a and a back surface 51 b and has a rectangular shape (hereinafter referred to as a planar shape) in plan view. And a side plate provided along the outer peripheral portion of the support plate 51 and extending obliquely (or substantially vertically) from the main surface 51a of the support plate 51 toward the cover panel 9. As shown in FIG. 2, two through holes 53 a and 53 b that penetrate between the main surface 51 a and the back surface 51 b are provided in the central portion of the support plate 51.

また、側板は、支持板５１の外周の４辺に沿って配置された第１の側板５５、第２の側板５６、第３の側板５７及び第４の側板５８を含み、支持板５１の主面５１ａ側を囲んでいる。第１の側板５５と、第１の側板５５と対向する第３の側板５７は、支持板５１と一体化している（即ち、支持板５１のＸ軸方向の両端部を折り曲げて第１の側板５５及び第３の側板５７としている。）。また、第２の側板５６と第４の側板５８は、ネジ、ロックピン又はリベット等の締結部材５９を用いて、第１の側板５５と第３の側板５７及び支持板５１に取り付けられている。   The side plate includes a first side plate 55, a second side plate 56, a third side plate 57, and a fourth side plate 58 arranged along the four sides of the outer periphery of the support plate 51. It surrounds the surface 51a side. The first side plate 55 and the third side plate 57 facing the first side plate 55 are integrated with the support plate 51 (that is, the first side plate is bent by bending both end portions of the support plate 51 in the X-axis direction). 55 and the third side plate 57). The second side plate 56 and the fourth side plate 58 are attached to the first side plate 55, the third side plate 57, and the support plate 51 using fastening members 59 such as screws, lock pins, or rivets. .

また、第１の側板５５と、第３の側板５７には、複数の切込み部が設けられている。これらの切込み部を、支持板５１の主面５１ａ側に折り曲げることによって、第１の側板５５や第３の側板５７に隣接するＬＥＤ基板６を、主面５１ａ側に固定することができる。この側板に設けられた切込み部によるＬＥＤ基板の固定方法については、後述の第５実施形態で説明する。支持板５１及び側板は、例えばステンレス鋼など、熱伝導性に優れた材料からなる。   Further, the first side plate 55 and the third side plate 57 are provided with a plurality of cut portions. The LED board 6 adjacent to the first side plate 55 and the third side plate 57 can be fixed to the main surface 51a side by bending these cut portions to the main surface 51a side of the support plate 51. A method for fixing the LED substrate by the notch provided in the side plate will be described in a fifth embodiment described later. The support plate 51 and the side plate are made of a material having excellent thermal conductivity, such as stainless steel.

なお、この第１実施形態では、第２、第４の側板５６、５８を支持板５１の主面５１ａに対して略垂直に取り付けることが好ましい。第２、第４の側板５６、５８を支持板５１の主面５１ａに対して斜めに取り付けてもよいが、略垂直に取り付けることによって、ヒートシンク５の加工精度を向上できるという利点がある。
また、第１、第３の側板５５、５７は、ＬＥＤ素子６５が光を照らす方向に向かって広がるように、支持板５１の主面５１ａに対して一定の角度を設けた方が良い（即ち、光が拡散するように、第１、第３の側板５５、５７をそれぞれ角度を広げて設けるとよい。）。これにより、第１、第３の側板５５、５７の上にそのまま反射シートを貼ることができる。 In the first embodiment, the second and fourth side plates 56 and 58 are preferably attached substantially perpendicular to the main surface 51 a of the support plate 51. The second and fourth side plates 56 and 58 may be attached obliquely with respect to the main surface 51a of the support plate 51, but by attaching them substantially vertically, there is an advantage that the processing accuracy of the heat sink 5 can be improved.
In addition, the first and third side plates 55 and 57 are preferably provided at a certain angle with respect to the main surface 51a of the support plate 51 so that the LED element 65 spreads in the direction of illuminating light (that is, The first and third side plates 55 and 57 may be provided with wide angles so that the light is diffused.) Thereby, a reflective sheet can be affixed on the 1st, 3rd side plates 55 and 57 as it is.

詳しく説明すると、第２、第４の側板５６、５８は主面５１ａに対して略垂直に取り付けられている。このため、第２、第４の側板５６、５８の上に反射シートを斜めに貼る場合は、反射シートが主面５１ａ上で斜めに自立するように、反射シートの加工が必要となる場合がある。これに対して、第１、第３の側板５５、５７は、主面５１ａに対して斜めに設けられているので、これら第１、第３の側板５５、５７の上にそのまま反射シートを貼ることができる。反射シートを斜めに自立させるなどの加工が不要であるため、反射シートのコスト低減に寄与することができる。   More specifically, the second and fourth side plates 56 and 58 are attached substantially perpendicular to the main surface 51a. For this reason, when sticking a reflective sheet diagonally on the 2nd, 4th side plates 56 and 58, the process of a reflective sheet may be needed so that a reflective sheet may become diagonally independent on the main surface 51a. is there. On the other hand, since the first and third side plates 55 and 57 are provided obliquely with respect to the main surface 51a, the reflection sheet is pasted on the first and third side plates 55 and 57 as they are. be able to. Since processing such as making the reflective sheet stand at an angle is unnecessary, it is possible to contribute to cost reduction of the reflective sheet.

（２）ＬＥＤ基板
図３はＬＥＤ基板６の構成例を示す平面図である。詳しくは、図３（ａ）はＬＥＤ基板６の外観を示す平面図であり、図３（ｂ）はＬＥＤ基板６に配置される第１のＬＥＤ素子回路６１の構成例を模式的に示す平面図である。なお、図３（ａ）では、ＬＥＤ素子６５及び抵抗素子６６を明示するために、これら各素子の下方に配置されている導電層６３の図示を省略している。また、図３及び後述する図５において、ＬＥＤ素子６５の、符号６５の後に続く下付き表記の符号「ｉ、ｉ＋１、…、ｉ＋１９」、「ｋ、ｋ＋１、…、ｋ＋１９」は、複数のＬＥＤ素子６５を個々に識別するための符号である。 (2) LED Board FIG. 3 is a plan view showing a configuration example of the LED board 6. Specifically, FIG. 3A is a plan view showing the appearance of the LED board 6, and FIG. 3B is a plan view schematically showing a configuration example of the first LED element circuit 61 arranged on the LED board 6. FIG. In FIG. 3A, in order to clearly show the LED element 65 and the resistance element 66, the conductive layer 63 disposed below these elements is not shown. Also, in FIG. 3 and FIG. 5 described later, the subscript notations “i, i + 1,..., I + 19”, “k, k + 1,. It is a code | symbol for identifying the element 65 individually.

図３（ａ）及び（ｂ）に示すように、ＬＥＤ基板６の平面視による形状は矩形状（例えば、長方形）である。このＬＥＤ基板６は、複数のＬＥＤ素子６５と、複数の抵抗素子６６と、複数のＬＥＤ素子６５間や、ＬＥＤ素子６５と抵抗素子６６との間を接続する導電層６３と、導電層６３を覆って保護する保護層６４と、導電層６３に接続する第１のコネクタ６７及び第２のコネクタ６８と、を有する。そして、これら複数のＬＥＤ素子６５と複数の抵抗素子６６及び導電層６３とで、第１のＬＥＤ素子回路６１と第２のＬＥＤ素子回路６２とが構成されている。   As shown in FIGS. 3A and 3B, the shape of the LED substrate 6 in plan view is a rectangular shape (for example, a rectangle). The LED substrate 6 includes a plurality of LED elements 65, a plurality of resistance elements 66, a plurality of LED elements 65, a conductive layer 63 that connects the LED elements 65 and the resistance element 66, and a conductive layer 63. It has a protective layer 64 that covers and protects, and a first connector 67 and a second connector 68 that are connected to the conductive layer 63. The plurality of LED elements 65, the plurality of resistance elements 66, and the conductive layer 63 constitute a first LED element circuit 61 and a second LED element circuit 62.

抵抗素子６６は、電源オフ時の放電電流によりＬＥＤ素子６５が発光することを抑制するための素子である。電源オフ時の放電電流を、ＬＥＤ素子６５だけでなく抵抗素子６６にも流すことにより、ＬＥＤ素子６５に流れる電流量を低減し、電源オフ時の発光を抑制することができる。また、保護層６４は絶縁性であり、その色は反射シート８と同じ色（例えば、白色）であることが好ましい。   The resistance element 66 is an element for suppressing the LED element 65 from emitting light due to a discharge current when the power is turned off. By causing the discharge current when the power is off to flow not only to the LED element 65 but also to the resistance element 66, the amount of current flowing through the LED element 65 can be reduced, and light emission when the power is off can be suppressed. Moreover, it is preferable that the protective layer 64 is insulating and the color is the same color (for example, white) as the reflective sheet 8.

図３（ａ）に示すように、第１のＬＥＤ素子回路６１はＬＥＤ基板６の第１の領域６ａに配置され、第２のＬＥＤ素子回路６２はＬＥＤ基板６の第２の領域６ｂに配置されている。例えば、第１の領域６ａはＬＥＤ基板６の長手方向の中央部より一方の側（図３（ａ）では、左側）に位置する領域である。第２の領域６ｂは、ＬＥＤ基板６の長手方向の中央部より他方の側（図３（ａ）では、右側）に位置する領域である。   As shown in FIG. 3A, the first LED element circuit 61 is disposed in the first region 6a of the LED substrate 6, and the second LED element circuit 62 is disposed in the second region 6b of the LED substrate 6. Has been. For example, the first region 6 a is a region located on one side (the left side in FIG. 3A) from the central portion in the longitudinal direction of the LED substrate 6. The second region 6b is a region located on the other side (the right side in FIG. 3A) from the central portion of the LED substrate 6 in the longitudinal direction.

また、第１のコネクタ６７はＬＥＤ基板６の中央部の第１の長辺Ｌ１の側に配置されており、第２のコネクタ６８はＬＥＤ基板６の中央部の第２の長辺Ｌ２の側に配置されている。また、ＬＥＤ基板６の複数個所には貫通穴６９が複数設けられている。上述した支持板５１の第１の主面５１ａ上にＬＥＤ基板６を配置し、これらの貫通穴６９にネジ、ロックピン又はリベット等の締結部材を通すことによって、ＬＥＤ基板６を支持板５１に取り付けることができる。
図３（ｂ）に示す導電層６３は、ＬＥＤ基板６の基材上に形成されている。例えば、基材はＦＲ−４又はＣＥＭ−３であり、導電層６３は銅（Ｃｕ）からなる。導電層６３にＬＥＤ素子６５や抵抗素子６６が選択的に取り付けられることにより、複数のＬＥＤ素子６５間や、ＬＥＤ素子６５と抵抗素子６６との間が接続される。 The first connector 67 is disposed on the first long side L1 side of the central portion of the LED board 6, and the second connector 68 is on the second long side L2 side of the central portion of the LED board 6. Is arranged. A plurality of through holes 69 are provided at a plurality of locations on the LED substrate 6. The LED board 6 is disposed on the first main surface 51 a of the support plate 51 described above, and a fastening member such as a screw, a lock pin, or a rivet is passed through these through holes 69, so that the LED board 6 is attached to the support plate 51. Can be attached.
The conductive layer 63 shown in FIG. 3B is formed on the base material of the LED substrate 6. For example, the base material is FR-4 or CEM-3, and the conductive layer 63 is made of copper (Cu). By selectively attaching the LED element 65 and the resistance element 66 to the conductive layer 63, the LED elements 65 and the LED elements 65 and the resistance element 66 are connected.

（２．１）コネクタ
図４は第１のコネクタ６７の構成例を示す斜視図である。詳しくは、図４（ａ）は第１のコネクタ６７を基板の外側から見た図であり、図４（ｂ）は第１のコネクタ６７を基板の内側から見た図である。
図４（ａ）及び（ｂ）に示すように、第１のコネクタ６７は、２ピンタイプのコネクタ端子であり、第１のメス穴６７ａと第２のメス穴６７ｂとを有する。ここで、２ピンタイプとは、２つのメス穴を有し、これらメス穴に配線をそれぞれ接続されるタイプのことを意味する。また、第１のコネクタ６７は、第１のメス穴６７ａに接続する第１のピン端子６７ｃと、第２のメス穴６７ｂに接続する第２のピン端子６７ｄとを有する。そして、第１のピン端子６７ｃ及び第２のピン端子６７ｄは、半田で固定されることにより、ＬＥＤ基板６の導電層６３にそれぞれ接続されている。 (2.1) Connector FIG. 4 is a perspective view showing a configuration example of the first connector 67. Specifically, FIG. 4A is a view of the first connector 67 viewed from the outside of the substrate, and FIG. 4B is a view of the first connector 67 viewed from the inside of the substrate.
As shown in FIGS. 4A and 4B, the first connector 67 is a two-pin type connector terminal, and has a first female hole 67a and a second female hole 67b. Here, the 2-pin type means a type having two female holes, and wirings are respectively connected to these female holes. The first connector 67 has a first pin terminal 67c connected to the first female hole 67a and a second pin terminal 67d connected to the second female hole 67b. The first pin terminal 67c and the second pin terminal 67d are connected to the conductive layer 63 of the LED substrate 6 by being fixed with solder.

この第１実施形態では、例えば、第１のメス穴６７ａ及び第１のピン端子６７ｃはＬＥＤ基板６へ電流を入力する入力用端子に用いられ、第２のメス穴６７ｂ及び第２のピン端子６７ｄはＬＥＤ基板６から電流を出力する出力用端子に用いられる。なお、図示しないが、第２のコネクタ６８も、第１のコネクタ６７と同じ２ピンタイプのコネクタ端子であり、入力用端子及び出力用端子を有する。   In the first embodiment, for example, the first female hole 67a and the first pin terminal 67c are used as input terminals for inputting a current to the LED board 6, and the second female hole 67b and the second pin terminal are used. 67d is used as an output terminal for outputting a current from the LED substrate 6. Although not shown, the second connector 68 is also the same 2-pin type connector terminal as the first connector 67, and has an input terminal and an output terminal.

（２．２）第１のＬＥＤ素子回路
図５（ａ）は、第１のＬＥＤ素子回路６１の構成例を示す回路図である。図３（ｂ）に示したように、第１のＬＥＤ素子回路６１は、ＬＥＤ基板６の第１の領域６ａに配置された２０個のＬＥＤ素子６５のうち、ＬＥＤ基板６の側辺に沿って隣り合う４個のＬＥＤ素子６５が並列に接続され、この並列に接続されたＬＥＤ素子群が直列に接続された構成を有する。即ち、図５（ａ）に示すように、ＬＥＤ素子６５ｉ、１０ｉ＋１、１０ｉ＋２、１０ｉ＋３が並列に接続されて、第１のＬＥＤ素子群６１ａを構成している。また、ＬＥＤ素子６５ｉ＋４、１０ｉ＋５、１０ｉ＋６、１０ｉ＋７が並列に接続されて、第２のＬＥＤ素子群６１ｂが構成されている。以下同様に、第３のＬＥＤ素子６５ｉ＋８〜１０ｉ＋１１、１０ｉ＋１２〜１０ｉ＋１５、１０ｉ＋１６〜１０ｉ＋１９がそれぞれ並列に接続されて、第３〜第５のＬＥＤ素子群６１ｃ〜６１ｅが構成されている。そして、電流の入力側（第１のコネクタ６７の入力用端子）から出力側（第２のコネクタ６８の出力用端子）に向けて第１〜第５のＬＥＤ素子群６１ａ〜６１ｅがこの順で直列に接続されている。 (2.2) First LED Element Circuit FIG. 5A is a circuit diagram showing a configuration example of the first LED element circuit 61. As shown in FIG. 3B, the first LED element circuit 61 is arranged along the side of the LED substrate 6 among the 20 LED elements 65 arranged in the first region 6 a of the LED substrate 6. Next, four LED elements 65 adjacent to each other are connected in parallel, and the LED element groups connected in parallel are connected in series. That is, as shown in FIG. 5 (a), LED elements 65 i, 10 i + 1, 10 i + 2, 10 i + 3 are connected in parallel to form a first LED element group 61a. Further, the LED elements 65 i + 4 , 10 i + 5 , 10 i + 6 , 10 i + 7 are connected in parallel to constitute a second LED element group 61b. Similarly, the third LED elements 65 i + 8 to 10 i + 11 , 10 i + 12 to 10 i + 15 , 10 i + 16 to 10 i + 19 are connected in parallel, and the third to fifth LED element groups 61c to 61e are configured. Yes. The first to fifth LED element groups 61a to 61e are arranged in this order from the current input side (input terminal of the first connector 67) to the output side (output terminal of the second connector 68). Connected in series.

また、図５（ａ）に示すように、複数の抵抗素子６６が、第１〜第５のＬＥＤ素子群６１ａ〜６１ｅに並列に接続されている。例えば、１つの抵抗素子６６が、第２〜第５のＬＥＤ素子群６１ｂ〜６１ｅに並列に接続されている。また、並列に接続された２つの抵抗素子６６が、直列に接続された第３、第４のＬＥＤ素子群６１ｃ、６１ｄに並列に接続されている。   Moreover, as shown to Fig.5 (a), the some resistive element 66 is connected in parallel with the 1st-5th LED element group 61a-61e. For example, one resistance element 66 is connected in parallel to the second to fifth LED element groups 61b to 61e. In addition, two resistance elements 66 connected in parallel are connected in parallel to the third and fourth LED element groups 61c and 61d connected in series.

（２．３）第２のＬＥＤ素子回路
図５（ｂ）は、第２のＬＥＤ素子回路６２の構成例を示す回路図である。図５（ｂ）に示すように、第２のＬＥＤ素子回路６２も、第１のＬＥＤ素子回路６１と同様の構成を有する。即ち、ＬＥＤ素子６５ｉ＋１６、１０ｉ＋１７、１０ｉ＋１８、１０ｉ＋９が並列に接続されて、第１のＬＥＤ素子群６２ａを構成している。また、ＬＥＤ素子６５ｉ＋１２、１０ｉ＋１３、１０ｉ＋１４、１０ｉ＋１５が並列に接続されて、第２のＬＥＤ素子群６２ｂが構成されている。以下同様に、第３のＬＥＤ素子６５ｉ＋８〜１０ｉ＋１１、１０ｉ＋４〜１０ｉ＋７、１０ｉ〜１０ｉ＋３がそれぞれ並列に接続されて、第３〜第５のＬＥＤ素子群６２ｃ〜６２ｅが構成されている。そして、電流の入力側（第２のコネクタ６８の入力用端子）から出力側（第１のコネクタ６７の出力用端子）に向けて第１〜第５のＬＥＤ素子群６２ａ〜６２ｅがこの順で直列に接続されている。 (2.3) Second LED Element Circuit FIG. 5B is a circuit diagram showing a configuration example of the second LED element circuit 62. As shown in FIG. 5B, the second LED element circuit 62 has the same configuration as the first LED element circuit 61. That is, the LED elements 65 i + 16 , 10 i + 17 , 10 i + 18 , 10 i + 9 are connected in parallel to constitute the first LED element group 62a. Further, the LED elements 65 i + 12 , 10 i + 13 , 10 i + 14 , 10 i + 15 are connected in parallel to constitute a second LED element group 62b. Similarly, the third LED elements 65 i + 8 to 10 i + 11 , 10 i + 4 to 10 i + 7 , 10 i to 10 i + 3 are connected in parallel, and the third to fifth LED element groups 62c to 62e are configured. Yes. The first to fifth LED element groups 62a to 62e are arranged in this order from the current input side (input terminal of the second connector 68) to the output side (output terminal of the first connector 67). Connected in series.

また、図５（ｂ）に示すように、抵抗素子６６が、第１〜第５のＬＥＤ素子群６２ａ〜６２ｅに並列に接続されている。例えば、並列に接続された２つの抵抗素子６６が、第２〜第５のＬＥＤ素子群６２ｂ〜６２ｅに並列に接続されている。また、並列に接続された２つの抵抗素子６６が、直列に接続された第３、第４のＬＥＤ素子群６２ｃ、６２ｄに並列に接続されている。   Moreover, as shown in FIG.5 (b), the resistive element 66 is connected in parallel with the 1st-5th LED element group 62a-62e. For example, two resistance elements 66 connected in parallel are connected in parallel to the second to fifth LED element groups 62b to 62e. Further, the two resistance elements 66 connected in parallel are connected in parallel to the third and fourth LED element groups 62c and 62d connected in series.

なお、図５（ａ）及び（ｂ）に示す抵抗素子６６の個数や配置は、あくまで一例であり、これに限定されるものではない。本発明の第１実施形態では、複数のＬＥＤ基板６の各々で、抵抗素子６６の個数や配置を任意に設定してよい。また、各抵抗素子６６の抵抗値も任意に設定してよい。所望の特性に合わせて、抵抗素子６６の個数や配置、抵抗値を設定してよい。   Note that the number and arrangement of the resistance elements 66 shown in FIGS. 5A and 5B are merely examples, and are not limited thereto. In the first embodiment of the present invention, the number and arrangement of the resistance elements 66 may be arbitrarily set in each of the plurality of LED substrates 6. Further, the resistance value of each resistance element 66 may be arbitrarily set. The number, arrangement, and resistance value of the resistance elements 66 may be set in accordance with desired characteristics.

（３）ＬＥＤ照明回路
図１（ａ）〜（ｃ）及び図２に示したように、ＬＥＤ照明装置１は、ＬＥＤ基板６を複数備える。これら複数のＬＥＤ基板６は、ＬＥＤ基板６の幅方向（例えば、Ｘ軸方向）に離間して並び、且つ隣り合うＬＥＤ基板６間が配線で接続されてＬＥＤ照明回路を構成している。 (3) LED illumination circuit As shown in FIGS. 1A to 1C and FIG. 2, the LED illumination device 1 includes a plurality of LED substrates 6. The plurality of LED substrates 6 are arranged apart from each other in the width direction of the LED substrate 6 (for example, the X-axis direction), and adjacent LED substrates 6 are connected by wiring to form an LED illumination circuit.

図６は、第１、第２のＬＥＤ照明回路１０、２０の構成例を示す平面図である。なお、図６及び、後述の図７、図８において、ＬＥＤ基板６の符号６の後に続く下付き表記の符号「ｍ、ｍ＋１、…、ｍ＋４」、「ｐ、ｐ＋１、…、ｐ＋４」は、複数のＬＥＤ基板６を個々に識別するための符号である。
図６に示すように、ＬＥＤ照明装置１は、例えば１０枚のＬＥＤ基板６を有する。これら１０枚のＬＥＤ基板６は、Ｘ軸方向に離間して並んでいる。また、これら１０枚のＬＥＤ基板６のうち、紙面の右側に並ぶ５枚のＬＥＤ基板６ｍ、６ｍ＋１、６ｍ＋２、６ｍ＋３、６ｍ＋４は、隣り合うＬＥＤ基板６間が配線１１で接続されて第１のＬＥＤ照明回路１０を構成している。また、紙面の左側に並ぶ５枚のＬＥＤ基板６ｐ、６ｐ＋１、６ｐ＋２、６ｐ＋３、６ｐ＋４も、隣り合うＬＥＤ基板６間が配線２１で接続されて第２のＬＥＤ照明回路２０を構成している。第１のＬＥＤ照明回路１０と第２のＬＥＤ照明回路２０は電気的に接続していないため、例えば、個々に点灯させたり、個々に消灯させたりしてもよい。 FIG. 6 is a plan view illustrating a configuration example of the first and second LED illumination circuits 10 and 20. 6 and FIG. 7 and FIG. 8 to be described later, subscript symbols “m, m + 1,..., M + 4”, “p, p + 1,. It is the code | symbol for identifying the some LED board 6 individually.
As shown in FIG. 6, the LED lighting device 1 has, for example, ten LED substrates 6. These ten LED boards 6 are arranged apart from each other in the X-axis direction. Of these ten LED boards 6, five LED boards 6m , 6m + 1 , 6m + 2 , 6m + 3 , and 6m + 4 arranged on the right side of the drawing are connected by the wiring 11 between the adjacent LED boards 6. The first LED illumination circuit 10 is configured. In addition, the five LED boards 6 p , 6 p + 1 , 6 p + 2 , 6 p + 3 , and 6 p + 4 arranged on the left side of the paper surface are connected to each other by the wiring 21 to constitute the second LED illumination circuit 20. doing. Since the first LED illumination circuit 10 and the second LED illumination circuit 20 are not electrically connected, for example, they may be individually turned on or individually turned off.

また、図６に示すように、Ｘ軸方向において、ＬＥＤ基板６内で隣り合うＬＥＤ素子６５間の距離をｄ１とし、ＬＥＤ基板６間で隣り合うＬＥＤ素子６５間の距離をｄ２としたとき、ｄ１＝ｄ２又はｄ１≒ｄ２となるように、複数のＬＥＤ基板６をそれぞれ配置することが好ましい。これにより、第１のＬＥＤ照明回路１０及び第２のＬＥＤ照明回路２０において、複数のＬＥＤ素子６５のＸ軸方向の配置間隔が一定となる。その結果、ＬＥＤ照明装置１の光束の面内均一化に寄与することができる。次に、第１のＬＥＤ照明回路１０と第２のＬＥＤ照明回路２０とについて、ＬＥＤ基板６間の接続と電流の流れをそれぞれ説明する。   Further, as shown in FIG. 6, in the X-axis direction, when the distance between the LED elements 65 adjacent in the LED board 6 is d1, and the distance between the LED elements 65 adjacent between the LED boards 6 is d2, It is preferable to arrange the plurality of LED substrates 6 so that d1 = d2 or d1≈d2. Thereby, in the 1st LED lighting circuit 10 and the 2nd LED lighting circuit 20, the arrangement | positioning space | interval of the X-axis direction of the some LED element 65 becomes fixed. As a result, it is possible to contribute to in-plane uniformity of the luminous flux of the LED lighting device 1. Next, regarding the first LED illumination circuit 10 and the second LED illumination circuit 20, the connection between the LED substrates 6 and the flow of current will be described.

（３．１）第１のＬＥＤ照明回路
まず、第１のＬＥＤ照明回路１０について説明する。
図７は、第１のＬＥＤ照明回路１０の構成と電流の流れを模式的に示す平面図である。図７に示すように、第１のＬＥＤ照明回路１０では、貫通穴５３ａの両側にＬＥＤ基板６ｍ、６ｍ＋１がそれぞれ配置されている。また、ＬＥＤ基板６ｍの第２のコネクタ６８と、ＬＥＤ基板６ｍ＋１の第１のコネクタ６７は、貫通穴５３ａにそれぞれ隣接している。
第１のＬＥＤ点灯装置のアノード側を第１のＬＥＤ照明回路１０に接続する第１の配線７１ａは、ヒートシンクの背面側から貫通穴５３ａを通り主面側に引き出されて、貫通穴５３ａに隣接するＬＥＤ基板６ｍ＋１の第１のコネクタ６７に接続されている。また、第１のＬＥＤ点灯装置のカソード側を第１のＬＥＤ照明回路１０に接続する第２の配線７１ｂは、ヒートシンクの背面側から貫通穴５３ａを通り主面側に引き出されて、貫通穴５３ａに隣接するＬＥＤ基板６ｍの第２のコネクタ６８に接続されている。 (3.1) First LED Lighting Circuit First, the first LED lighting circuit 10 will be described.
FIG. 7 is a plan view schematically showing the configuration of the first LED lighting circuit 10 and the current flow. As shown in FIG. 7, in the first LED lighting circuit 10, LED substrates 6m and 6m + 1 are arranged on both sides of the through hole 53a. Further, the second connector 68 of the LED substrate 6 m, first connector 67 of the LED substrate 6 m + 1 are respectively adjacent to the through hole 53a.
The first wiring 71a that connects the anode side of the first LED lighting device to the first LED lighting circuit 10 is drawn from the back side of the heat sink to the main surface side through the through hole 53a, and is adjacent to the through hole 53a. Connected to the first connector 67 of the LED board 6m + 1 . The second wiring 71b that connects the cathode side of the first LED lighting device to the first LED lighting circuit 10 is drawn from the back side of the heat sink to the main surface side through the through hole 53a, and the through hole 53a. Is connected to the second connector 68 of the LED board 6 m adjacent to the LED board 6 m .

また、ＬＥＤ基板６ｍ＋１の第２のコネクタ６８とＬＥＤ基板６ｍ＋２の第１のコネクタ６７とが配線１１で接続されている。同様に、ＬＥＤ基板６ｍ＋２の第２のコネクタ６８とＬＥＤ基板６ｍ＋３の第１のコネクタ６７とが配線１１で接続されており、ＬＥＤ基板６ｍ＋３の第２のコネクタ６８とＬＥＤ基板６ｍ＋４の第１のコネクタ６７とが配線１１で接続されている。さらに、ＬＥＤ基板６ｍ＋４の第２のコネクタ６８（即ち、第１のＬＥＤ照明回路１０において、Ｘ軸方向の一端部に位置するコネクタ）の入力端子と出力端子とが配線１１で接続（即ち、短絡）されている。同様に、ＬＥＤ基板６ｍの第１のコネクタ６７（即ち、第１のＬＥＤ照明回路１０において、Ｘ軸方向の他端部に位置するコネクタ）の入力端子と出力端子とが配線１１で短絡されている。 Further, a first connector 67 of the second connector 68 of the LED substrate 6 m + 1 and the LED substrate 6 m + 2 are connected by wiring 11. Similarly, the first connector 67 of the second connector 68 of the LED substrate 6 m + 2 and the LED substrate 6 m + 3 are connected by wiring 11, the second connector 68 of the LED substrate 6 m + 3 and the LED substrate 6 m + 4 The first connector 67 is connected to the wiring 11. Furthermore, the input terminal and the output terminal of the second connector 68 of the LED board 6 m + 4 (that is, the connector located at one end in the X-axis direction in the first LED lighting circuit 10) are connected by the wiring 11 (that is, Short circuit). Similarly, the input terminal and the output terminal of the first connector 67 of the LED board 6 m (that is, the connector located at the other end in the X-axis direction in the first LED lighting circuit 10) are short-circuited by the wiring 11. ing.

これにより、ＬＥＤ基板６ｍ＋１〜６ｍ＋４の第１のＬＥＤ素子回路６１は配線１１を介して直列に接続され、ＬＥＤ基板６ｍ〜６ｍ＋４の第２のＬＥＤ素子回路６２も配線１１を介して直列に接続される。そして、第１のＬＥＤ照明回路１０では、図７の矢印で示す方向に電流が流れる。
即ち、第１のＬＥＤ点灯装置のアノード側から出力される電流は、第１の配線７１ａからＬＥＤ基板６ｍ＋４の第２のコネクタ６８に向けて、直列に接続された第１のＬＥＤ素子回路６１を流れる。ＬＥＤ基板６ｍ＋４の第２のコネクタ６８の出力端子から出力された電流は、この出力端子に短絡された入力端子に流れる。そして、この入力端子からＬＥＤ基板６ｍの第１のコネクタ６７に向けて、直列に接続された第２のＬＥＤ素子回路６２を流れる。直列に接続された第２のＬＥＤ素子回路６２のうちの最終段に位置する（即ち、ＬＥＤ基板６ｍに配置された）第２のＬＥＤ素子回路６２を流れた電流は、ＬＥＤ基板６ｍの第１のコネクタ６７の出力端子から、この出力端子に短絡された入力端子に流れる。そして、この入力端子からＬＥＤ基板６ｍの第１のＬＥＤ素子回路６１を流れ、その後、第２の配線７１ｂから第１のＬＥＤ点灯装置のカソード側に戻る。 Accordingly, the first LED element circuits 61 of the LED substrates 6 m + 1 to 6 m + 4 are connected in series via the wiring 11, and the second LED element circuits 62 of the LED substrates 6 m to 6 m + 4 are also connected via the wiring 11. Connected in series. And in the 1st LED lighting circuit 10, an electric current flows in the direction shown by the arrow of FIG.
That is, the current output from the anode side of the first LED lighting device is the first LED element circuit 61 connected in series from the first wiring 71a toward the second connector 68 of the LED substrate 6m + 4 . Flowing. The current output from the output terminal of the second connector 68 of the LED board 6 m + 4 flows to the input terminal short-circuited to the output terminal. Then, the second LED element circuit 62 connected in series flows from the input terminal toward the first connector 67 of the LED board 6 m . The current flowing through the second LED element circuit 62 located at the last stage of the second LED element circuits 62 connected in series (that is, disposed on the LED board 6 m ) is the current of the LED board 6 m . A current flows from the output terminal of the first connector 67 to the input terminal short-circuited to the output terminal. Then, the first LED element circuit 61 of the LED substrate 6 m from the input terminal flow then returns from the second wiring 71b on the cathode side of the first LED lighting device.

（３．２）第２のＬＥＤ照明回路
次に、第２のＬＥＤ照明回路２０について説明する。
図８は、第２のＬＥＤ照明回路２０の構成と電流の流れを模式的に示す平面図である。図８に示すように、第２のＬＥＤ照明回路２０では、貫通穴５３ｂの両側にＬＥＤ基板６ｐ、６ｐ＋１がそれぞれ配置されている。また、ＬＥＤ基板６ｐの第１のコネクタ６７とＬＥＤ基板６ｐ＋１の第２のコネクタ６８とが貫通穴５３ｂにそれぞれ隣接している。第２のＬＥＤ点灯装置のアノード側を第２のＬＥＤ照明回路２０に接続する第１の配線７２ａは、ヒートシンクの背面側から貫通穴５３ｂを通り主面側に引き出されて、貫通穴５３ｂに隣接するＬＥＤ基板６ｐ＋１の第２のコネクタ６８に接続されている。また、第２のＬＥＤ点灯装置のカソード側を第２のＬＥＤ照明回路２０に接続する第２の配線７２ｂは、ヒートシンクの背面側から貫通穴５３ｂを通り主面側に引き出されて、貫通穴５３ｂに隣接するＬＥＤ基板６ｐの第１のコネクタ６７に接続されている。 (3.2) Second LED Lighting Circuit Next, the second LED lighting circuit 20 will be described.
FIG. 8 is a plan view schematically showing the configuration of the second LED illumination circuit 20 and the current flow. As shown in FIG. 8, in the 2nd LED illumination circuit 20, LED board 6p and 6p + 1 are each arrange | positioned at the both sides of the through-hole 53b. Further, the first connector 67 of the LED board 6p and the second connector 68 of the LED board 6p + 1 are adjacent to the through hole 53b. The first wiring 72a that connects the anode side of the second LED lighting device to the second LED lighting circuit 20 is drawn from the back side of the heat sink to the main surface side through the through hole 53b, and is adjacent to the through hole 53b. Connected to the second connector 68 of the LED board 6p + 1. Further, the second wiring 72b that connects the cathode side of the second LED lighting device to the second LED lighting circuit 20 is drawn from the back side of the heat sink to the main surface side through the through hole 53b, and the through hole 53b. Is connected to the first connector 67 of the LED board 6p adjacent to the LED board 6p.

また、ＬＥＤ基板６ｐ＋１の第１のコネクタ６７とＬＥＤ基板６ｐ＋２の第２のコネクタ６８とが配線２１で接続されている。同様に、ＬＥＤ基板６ｐ＋２の第１のコネクタ６７とＬＥＤ基板６ｐ＋３の第２のコネクタ６８とが配線２１で接続されており、ＬＥＤ基板６ｐ＋３の第１のコネクタ６７とＬＥＤ基板６ｐ＋４の第２のコネクタ６８とが配線２１で接続されている。さらに、ＬＥＤ基板６ｐ＋４の第１のコネクタ６７（即ち、第２のＬＥＤ照明回路２０において、Ｘ軸方向の一端部に位置するコネクタ）の入力端子と出力端子とが配線２１で短絡されている。同様に、ＬＥＤ基板６ｐの第２のコネクタ６８（即ち、第２のＬＥＤ照明回路２０において、Ｘ軸方向の他端部に位置するコネクタ）の入力端子と出力端子とが配線２１で短絡されている。   Further, the first connector 67 of the LED board 6p + 1 and the second connector 68 of the LED board 6p + 2 are connected by the wiring 21. Similarly, the first connector 67 of the LED board 6p + 2 and the second connector 68 of the LED board 6p + 3 are connected by the wiring 21, and the first connector 67 of the LED board 6p + 3 and the second connector of the LED board 6p + 4. 68 is connected by a wiring 21. Furthermore, the input terminal and the output terminal of the first connector 67 of the LED board 6p + 4 (that is, the connector located at one end in the X-axis direction in the second LED illumination circuit 20) are short-circuited by the wiring 21. Similarly, the input terminal and the output terminal of the second connector 68 of the LED board 6p (that is, the connector located at the other end in the X-axis direction in the second LED illumination circuit 20) are short-circuited by the wiring 21. Yes.

これにより、第２のＬＥＤ照明回路２０では、ＬＥＤ基板６ｐ＋１〜６ｐ＋４の第２のＬＥＤ素子回路６２は配線２１を介して直列に接続され、ＬＥＤ基板６ｐ〜６ｐ＋４の第１のＬＥＤ素子回路６１も配線２１を介して直列に接続される。そして、第２のＬＥＤ照明回路２０では、図８の矢印で示す方向に電流が流れる。
即ち、第２のＬＥＤ点灯装置のアノード側から出力される電流は、第１の配線７２ａからＬＥＤ基板６ｐ＋４の第１のコネクタ６７に向けて、直列に接続された第２のＬＥＤ素子回路６２を流れる。ＬＥＤ基板６ｐ＋４の第２のコネクタ６８の出力端子から出力された電流は、この出力端子に短絡された入力端子に流れる。そして、この入力端子からＬＥＤ基板６ｐの第２のコネクタ６８に向けて、直列に接続された第１のＬＥＤ素子回路６１を流れる。直列に接続された第１のＬＥＤ素子回路６１のうちの最終段に位置する（即ち、ＬＥＤ基板６ｐに配置された）第１のＬＥＤ素子回路６１を流れた電流は、このＬＥＤ基板６の第２のコネクタ６８の出力端子から、この出力端子に短絡された入力端子に流れる。そして、この入力端子からＬＥＤ基板６ｐの第２のＬＥＤ素子回路６２を流れ、その後、第２の配線７２ｂから第２のＬＥＤ点灯装置のカソード側に戻る。 Thus, in the second LED lighting circuit 20, the second LED element circuits 62 of the LED substrates 6p + 1 to 6p + 4 are connected in series via the wiring 21, and the first LED element circuits 61 of the LED substrates 6p to 6p + 4 are also connected. They are connected in series via the wiring 21. And in the 2nd LED illumination circuit 20, an electric current flows in the direction shown by the arrow of FIG.
That is, the current output from the anode side of the second LED lighting device passes through the second LED element circuit 62 connected in series from the first wiring 72a toward the first connector 67 of the LED substrate 6p + 4. Flowing. The current output from the output terminal of the second connector 68 of the LED board 6p + 4 flows to the input terminal short-circuited to this output terminal. And it flows through the 1st LED element circuit 61 connected in series toward the 2nd connector 68 of LED board 6p from this input terminal. The current flowing through the first LED element circuit 61 located at the last stage of the first LED element circuits 61 connected in series (that is, disposed on the LED board 6p) 2 flows from the output terminal of the connector 68 to the input terminal short-circuited to the output terminal. Then, the second LED element circuit 62 of the LED substrate 6p flows from the input terminal, and then returns from the second wiring 72b to the cathode side of the second LED lighting device.

（４）規制部
次に、規制部１１１、１１６について説明する。
図９は、第１実施形態におけるＬＥＤ基板６の取付状態を模式的に示す図である。詳しくは、図９（ａ）はＬＥＤ基板６の取付状態を模式的に示す平面図であり、図９（ｂ）は図９（ａ）のＸ９−Ｘ’９断面を拡大した断面図である。図９（ａ）及び（ｂ）に示すように、ＬＥＤ照明装置１は、ＬＥＤ基板６の端部を覆ってその位置を規制する規制部として、複数の規制部１１１と複数の規制部１１６とを有する。 (4) Restriction Part Next, the restriction parts 111 and 116 will be described.
FIG. 9 is a diagram schematically showing an attachment state of the LED substrate 6 in the first embodiment. Specifically, FIG. 9A is a plan view schematically showing the mounting state of the LED substrate 6, and FIG. 9B is an enlarged sectional view taken along the X9-X'9 section of FIG. 9A. . As shown in FIGS. 9A and 9B, the LED lighting device 1 includes a plurality of restricting portions 111 and a plurality of restricting portions 116 as restricting portions that cover the end portions of the LED substrate 6 and restrict their positions. Have

規制部１１１は、ＬＥＤ基板６の端部を覆う被覆部１１１ａと、ヒートシンクの支持板５１に取り付けられる取付部１１１ｂとを有する。また、取付部１１１ｂには貫通穴が設けられている。規制部１１１の被覆部１１１ａがＬＥＤ基板６の端部を覆い、且つ、取付部１１１ｂが支持板５１と対向した状態で、取付部１１１ｂの貫通穴にネジ、ロックピン又はリベット等の締結部材１１２が通される。これにより、取付部１１１ｂは支持板５１に固定され、被覆部１１１ａはＬＥＤ基板６の端部を支持板５１側に押圧して、ＬＥＤ基板６を固定する。このように規制部１１１は締結部材１１２によってヒートシンクの支持板５１に取り付けられるが、その取付位置は平面視でＬＥＤ基板６から離れた位置となっている。   The restricting portion 111 includes a covering portion 111 a that covers the end portion of the LED substrate 6, and an attachment portion 111 b that is attached to the support plate 51 of the heat sink. In addition, a through hole is provided in the attachment portion 111b. A fastening member 112 such as a screw, a lock pin, or a rivet is inserted into the through hole of the attachment portion 111b in a state where the covering portion 111a of the restriction portion 111 covers the end portion of the LED substrate 6 and the attachment portion 111b faces the support plate 51. Is passed. Thereby, the attachment part 111b is fixed to the support plate 51, and the coating | coated part 111a presses the edge part of the LED board 6 to the support plate 51 side, and fixes the LED board 6. FIG. As described above, the restricting portion 111 is attached to the support plate 51 of the heat sink by the fastening member 112, and the attachment position is a position away from the LED substrate 6 in plan view.

規制部１１６は、ＬＥＤ基板の端部を覆う被覆部１１６ａと、ヒートシンクの側板に取り付けられる取付部１１６ｂとを有する。また、取付部１１６ｂには貫通穴が設けられている。規制部１１６の被覆部１１６ａがＬＥＤ基板６の端部を覆い、且つ、取付部１１６ｂが側板と対向した状態で、取付部１１６ｂの貫通穴にネジ、ロックピン又はリベット等の締結部材１１７が通される。これにより、取付部１１６ｂは側板に固定され、被覆部１１６ａはＬＥＤ基板６の端部を支持板５１側に押圧して、ＬＥＤ基板６を固定する。このように規制部１１６は締結部材１１７によってヒートシンクの側板（例えば、図９（ｂ）に示すように第３の側板５７）に取り付けられるが、その取付位置は、規制部１１１と同様に、平面視でＬＥＤ基板６から離れた位置となっている。   The restricting portion 116 includes a covering portion 116a that covers an end portion of the LED substrate, and an attachment portion 116b that is attached to a side plate of the heat sink. Further, the attachment portion 116b is provided with a through hole. With the covering portion 116a of the restricting portion 116 covering the end of the LED substrate 6 and the attachment portion 116b facing the side plate, a fastening member 117 such as a screw, a lock pin, or a rivet is passed through the through hole of the attachment portion 116b. Is done. Thereby, the attachment portion 116b is fixed to the side plate, and the covering portion 116a presses the end portion of the LED substrate 6 toward the support plate 51 to fix the LED substrate 6. As described above, the restricting portion 116 is attached to the side plate of the heat sink (for example, the third side plate 57 as shown in FIG. 9B) by the fastening member 117, but the attachment position is flat as in the restricting portion 111. It is in a position away from the LED substrate 6 in view.

また、規制部１１６は、ヒートシンクの側板に取り付けられることから、被覆部１１６ａと取付部１１６ｂとの間の中間部が屈曲していることが好ましい。この屈曲の角度θは、ヒートシンクの支持板５１と側板とが成す角度と同じ角度であることが好ましい。これにより、規制部１１６を支持板５１及び側板に沿って配置することができ、規制部１１６を目立たないように配置することができる。   Further, since the restricting portion 116 is attached to the side plate of the heat sink, it is preferable that the intermediate portion between the covering portion 116a and the attaching portion 116b be bent. The bending angle θ is preferably the same as the angle formed between the support plate 51 of the heat sink and the side plate. Thereby, the control part 116 can be arrange | positioned along the support plate 51 and the side plate, and the control part 116 can be arrange | positioned so that it may not stand out.

この第１実施形態では、複数のＬＥＤ基板６のうち、ヒートシンクの第１の側板に隣接して配置されたＬＥＤ基板６ｐ＋４と、ヒートシンクの第３の側板５７に隣接して配置されたＬＥＤ基板６ｍ＋４とが、規制部１１１、１１６によって支持板５１に取り付けられている。それ以外のＬＥＤ基板６ｍ〜６ｍ＋３、６ｐ〜６ｐ＋３は、ネジ、ロックピン又はリベット等の締結部材によって支持板５１に取り付けられている。   In the first embodiment, among the plurality of LED substrates 6, the LED substrate 6p + 4 disposed adjacent to the first side plate of the heat sink and the LED substrate 6m + 4 disposed adjacent to the third side plate 57 of the heat sink. Are attached to the support plate 51 by the restriction portions 111 and 116. The other LED substrates 6m to 6m + 3 and 6p to 6p + 3 are attached to the support plate 51 by fastening members such as screws, lock pins, or rivets.

なお、規制部１１１、１１６、及び後述の第２、第３実施形態（各変形例を含む）で説明する規制部は、例えば樹脂又は金属等からなる。
また、規制部１１１、１１６、及び後述の第２、第３実施形態（各変形例を含む）で説明する規制部の被覆部は、ＬＥＤ基板６を必ずしも固定しなくてもよい。即ち、被覆部と支持板５１との間の離間距離はＬＥＤ基板６の厚みよりも多少大きくてもよく、規制部とＬＥＤ基板６との間に遊び（即ち、密着せず、ある程度動きうる余裕）があってもよい。このような構成でも、規制部はＬＥＤ基板６の鉛直方向への移動を規制できるので、ＬＥＤ照明装置を天井等に設置した場合にＬＥＤ基板６が支持板５１から離れて、鉛直方向へ落下することを防ぐことができる。 The restricting portions 111 and 116, and the restricting portions described in second and third embodiments (including modifications) described later are made of, for example, resin or metal.
Further, the restriction portions 111 and 116 and the covering portion of the restriction portion described in the second and third embodiments (including each modification example) described later may not necessarily fix the LED substrate 6. That is, the separation distance between the covering portion and the support plate 51 may be slightly larger than the thickness of the LED substrate 6, and there is play (that is, no contact between the restricting portion and the LED substrate 6, and a margin for movement to some extent). ) May be present. Even in such a configuration, since the restricting portion can restrict the movement of the LED board 6 in the vertical direction, the LED board 6 moves away from the support plate 51 and falls in the vertical direction when the LED lighting device is installed on the ceiling or the like. Can be prevented.

（５）ＬＥＤ点灯装置
図１０は、第１のＬＥＤ点灯装置７１の構成例を示す斜視図である。
図１０に示すように、第１のＬＥＤ点灯装置７１は、プラスチック、アルミニウム又はステンレス等の材料からなる筐体１７１と、この筐体１７１に収容される電源回路と、この電源回路のアノード側に接続された第１の配線７１ａと、この電源回路のカソード側に接続された第２の配線７１ｂと、を備える。筐体１７１にはネジ、ロックピン又はリベット等の締結部材を通すための貫通穴１７２が設けられている。電源回路を収容した筐体１７１は、この貫通穴１７２に締結部材が通されて支持板の背面に取り付けられる。 (5) LED Lighting Device FIG. 10 is a perspective view showing a configuration example of the first LED lighting device 71.
As shown in FIG. 10, the first LED lighting device 71 includes a housing 171 made of a material such as plastic, aluminum, or stainless steel, a power supply circuit accommodated in the housing 171, and an anode side of the power supply circuit. The first wiring 71a is connected, and the second wiring 71b is connected to the cathode side of the power supply circuit. The housing 171 is provided with a through hole 172 for passing a fastening member such as a screw, a lock pin or a rivet. The casing 171 containing the power supply circuit is attached to the back surface of the support plate with a fastening member passing through the through hole 172.

また、この筐体１７１には蓋体１７３が取り付けられており、蓋体１７３の一部に切欠き部１７４が設けられている。例えば、蓋体１７３の平面視による形状は長方形であり、蓋体１７３の中央部の長辺側の端部に切欠き部１７４が設けられている。そして、この切欠き部１７４を通して、筐体１７１の内側から外側へ第１の配線７１ａ及び第２の配線７１ｂがそれぞれ引き出されている。第１のＬＥＤ点灯装置７１では、この切欠き部１７４が、図７等に示した貫通穴５３ａの近傍に位置するように（例えば、切欠き部１７４が貫通穴５３ａの直下に位置するように）、支持板に対する取付位置が調整されている。
なお、第２のＬＥＤ点灯装置７２も、第１のＬＥＤ点灯装置７１と同様の構成を有する。そして、第２のＬＥＤ点灯装置７２においても、その蓋体の切欠き部が、図８等に示した貫通穴５３ｂの近傍に位置するように（例えば、切欠き部が貫通穴５３ｂの直下に位置するように）、支持板に対する取付位置が調整されている。 In addition, a lid 173 is attached to the housing 171, and a notch 174 is provided in a part of the lid 173. For example, the shape of the lid 173 in plan view is a rectangle, and a notch 174 is provided at the end on the long side of the center of the lid 173. The first wiring 71 a and the second wiring 71 b are drawn out from the inside to the outside of the housing 171 through the notch 174. In the first LED lighting device 71, the notch 174 is located in the vicinity of the through hole 53a shown in FIG. 7 and the like (for example, the notch 174 is located immediately below the through hole 53a). ), The mounting position with respect to the support plate is adjusted.
The second LED lighting device 72 also has the same configuration as the first LED lighting device 71. In the second LED lighting device 72 as well, the cutout portion of the lid is positioned in the vicinity of the through hole 53b shown in FIG. 8 and the like (for example, the cutout portion is directly below the through hole 53b). The mounting position with respect to the support plate is adjusted.

（６）反射シート
図２に示すように、反射シート８は、ヒートシンク５の支持板５１の主面側に配置されて、複数のＬＥＤ基板６を連続して覆う主面反射シート８１と、ヒートシンク５の側板のうち主面反射シート８１の側を向いている側面を覆う側面反射シートとを有する。例えば、側面反射シートは、ヒートシンク５の第１の側板５５のうち主面反射シート８１の側を向いている側面を覆う第１の側面反射シート８５と、第２の側板５６のうち主面反射シート８１の側を向いている側面を覆う第２の側面反射シート８６と、第３の側板５７のうち主面反射シート８１の側を向いている側面を覆う第３の側面反射シート８７と、第４の側板５８のうち主面反射シート８１の側を向いている側面を覆う第４の側面反射シート８８を有する。反射シート８は、例えばロックピン又はプッシュピンによって、ヒートシンク５に取り付けられる。 (6) Reflective Sheet As shown in FIG. 2, the reflective sheet 8 is disposed on the main surface side of the support plate 51 of the heat sink 5, and the main surface reflective sheet 81 that continuously covers the plurality of LED substrates 6, and the heat sink. And a side surface reflection sheet that covers a side surface of the five side plates facing the main surface reflection sheet 81 side. For example, the side reflection sheet includes a first side reflection sheet 85 that covers a side surface of the first side plate 55 of the heat sink 5 facing the main surface reflection sheet 81 side, and a main surface reflection of the second side plate 56. A second side reflecting sheet 86 covering the side facing the sheet 81 side, a third side reflecting sheet 87 covering the side facing the main surface reflecting sheet 81 side of the third side plate 57, and It has the 4th side surface reflection sheet 88 which covers the side surface which has faced the main surface reflection sheet 81 side among the 4th side plates 58. The reflection sheet 8 is attached to the heat sink 5 by, for example, a lock pin or a push pin.

図１１は、主面反射シート８１の構成例を示す平面図である。詳しくは、図１１（ａ）は１枚の主面反射シート８１を示す平面図であり、図１１（ｂ）は２枚の主面反射シート８１の端部８１ａを互いに重ねた状態を示す平面図である。
図１１（ａ）に示す主面反射シート８１には、複数のＬＥＤ基板６のＬＥＤ素子６５のみを露出する第１の開口部８２と、ＬＥＤ素子６５及び抵抗素子６６の両方を露出する第２の開口部８３とが設けられている。また、図２及び図１１（ｂ）に示すように、この第１実施形態では、２枚の主面反射シート８１をその端部８１ａを互いに重ねた状態で、複数のＬＥＤ基板６上に配置する。これにより、２枚の主面反射シート８１は、互いに離間して配置されている複数のＬＥＤ基板６を連続して覆っている。 FIG. 11 is a plan view illustrating a configuration example of the main surface reflection sheet 81. Specifically, FIG. 11A is a plan view showing one main surface reflecting sheet 81, and FIG. 11B is a plan view showing a state in which the end portions 81a of the two main surface reflecting sheets 81 are overlapped with each other. FIG.
In the main surface reflection sheet 81 shown in FIG. 11A, a first opening 82 that exposes only the LED elements 65 of the plurality of LED substrates 6 and a second opening that exposes both the LED elements 65 and the resistance elements 66 are provided. The opening 83 is provided. Further, as shown in FIGS. 2 and 11 (b), in the first embodiment, two main surface reflection sheets 81 are arranged on a plurality of LED substrates 6 with their end portions 81a overlapped with each other. To do. Thereby, the two main surface reflection sheets 81 continuously cover the plurality of LED substrates 6 that are arranged apart from each other.

反射シート８の材質は、例えばポリエチレンテレフタラート（ＰＥＴ）又はポリプロピレン（ＰＰ）である。また、反射シート８の表面は、例えば白色であり、光沢を有する。なお、反射シート８の材質、表面の色及び光沢の有無に特に制限はないが、光の反射率が高いものを用いることによって、ＬＥＤ照明装置１の光束を高めることができる。
なお、この第１実施形態では、主面反射シート８１と第１〜第４の側面反射シート８５〜８８とを互いに分離した、別個のシートとすることが好ましい。主面反射シート８１と第１〜第４の側面反射シート８５〜８８とが一体化したシートをヒートシンク５に取り付けてもよいが、別個のシートとする場合は、貼り付け精度の向上を期待することができる。また、別個のシートとする場合は、主面反射シート８１と第１〜第４の側面反射シート８５〜８８とで、材質や厚さを異ならせることが可能であり、反射シート８の設計の自由度が高いという利点がある。例えば、主面反射シート８１に対して、第１〜第４の側面反射シート８５〜８８を硬い材質で構成することによって、第１〜第４の側面反射シート８５〜８８を支持板５１の主面５１ａ上で自立させることも可能である。 The material of the reflection sheet 8 is, for example, polyethylene terephthalate (PET) or polypropylene (PP). Moreover, the surface of the reflection sheet 8 is, for example, white and has gloss. In addition, although there is no restriction | limiting in particular in the material of the reflection sheet 8, the color of a surface, and the presence or absence of glossiness, the light beam of the LED lighting apparatus 1 can be raised by using a thing with a high reflectance of light.
In the first embodiment, it is preferable that the main surface reflecting sheet 81 and the first to fourth side reflecting sheets 85 to 88 are separated from each other. A sheet in which the main surface reflection sheet 81 and the first to fourth side surface reflection sheets 85 to 88 are integrated may be attached to the heat sink 5. However, when a separate sheet is used, an improvement in pasting accuracy is expected. be able to. Moreover, when it is set as a separate sheet | seat, it is possible to change material and thickness with the main surface reflection sheet 81 and the 1st-4th side surface reflection sheets 85-88, and the design of the reflection sheet 8 is possible. There is an advantage that the degree of freedom is high. For example, the first to fourth side reflection sheets 85 to 88 are made of the hard material by configuring the first to fourth side reflection sheets 85 to 88 with respect to the main surface reflection sheet 81. It is also possible to stand on the surface 51a.

（７）収容取付部
図２に示すように、収容取付部３は、本体３１と、本体３１の両側に取り付けられる第１の側板３２及び第２の側板３３と、本体３１の中央部を補強する補強板３４と、バネ受け金具３５とを有する。第１の側板３２及び第２の側板３３と補強板３４は、ネジ、ロックピン又はリベット等の締結部材によって、本体３１に取り付けられる。また、本体３１の端部のうち、第１の側板３２又は第２の側板３３が取り付けられない端部は、ヒートシンク５の側に折り曲げられて、第３の側板３６及び第４の側板３７を構成している。 (7) Accommodation attachment part As shown in FIG. 2, the accommodation attachment part 3 reinforces the center part of the main body 31, the 1st side plate 32 and the 2nd side plate 33 which are attached to the both sides of the main body 31, and the main body 31. A reinforcing plate 34 and a spring bracket 35. The first side plate 32, the second side plate 33, and the reinforcing plate 34 are attached to the main body 31 by fastening members such as screws, lock pins, or rivets. Further, of the end portions of the main body 31, the end portion to which the first side plate 32 or the second side plate 33 is not attached is bent toward the heat sink 5 so that the third side plate 36 and the fourth side plate 37 are connected. It is composed.

第３の側板３６及び第４の側板３７には、バネ受け金具３５を係止するための係止部３６ａ、３７ａがそれぞれ設けられている。さらに、本体３１と補強板３４には、ボルトを通すための貫通穴３１ａ、３４ａが設けられている。例えば、ＬＥＤ照明装置１を建物の天井に取り付ける場合は、天井から床面に向かって突き出た長ボルトが用意されている。この長ボルトを本体３１と補強板３４の各貫通穴３１ａ、３４ａに通し、ナットで固定することにより、収容取付部３を天井に固定する。   The third side plate 36 and the fourth side plate 37 are provided with locking portions 36a and 37a for locking the spring bracket 35, respectively. Furthermore, the main body 31 and the reinforcing plate 34 are provided with through holes 31a and 34a for passing bolts. For example, when the LED lighting device 1 is attached to the ceiling of a building, a long bolt protruding from the ceiling toward the floor surface is prepared. The housing mounting portion 3 is fixed to the ceiling by passing this long bolt through the through holes 31a and 34a of the main body 31 and the reinforcing plate 34 and fixing them with nuts.

図１２は、収容取付部３の構成例を示す斜視図である。詳しくは、図１２（ａ）は収容取付部３のバネ受け金具を取り外した状態を示す斜視図であり、図１２（ｂ）は収容取付部３のバネ受け金具３５を取り付けた状態を拡大して示した斜視図である。図１２（ａ）に示すように、収容取付部３は、本体３１と第１の側板３２、第２の側板３３、第３の側板３６及び第４の側板３７とで囲まれた凹部３８を有する。この凹部３８はＬＥＤユニット２を収容するためのスペースである。   FIG. 12 is a perspective view illustrating a configuration example of the housing mounting portion 3. Specifically, FIG. 12A is a perspective view showing a state in which the spring bracket of the accommodation mounting portion 3 is removed, and FIG. 12B is an enlarged view of the state where the spring bracket 35 of the accommodation mounting portion 3 is attached. It is the perspective view shown. As shown in FIG. 12 (a), the housing mounting portion 3 has a recess 38 surrounded by the main body 31, the first side plate 32, the second side plate 33, the third side plate 36 and the fourth side plate 37. Have. The recess 38 is a space for accommodating the LED unit 2.

この凹部３８にＬＥＤユニットを収容する場合は、図１２（ｂ）に示すように、凹部の内側に面する係止部３６ａ、３７ａにバネ受け金具３５を取り付けておく。また、ＬＥＤユニットを構成するヒートシンク５の外側の側面に、バネの弾性力で２本のアーム部４１ａ、４１ｂが横方向に広がる（即ち、互いに反対方向へ広がる）バネ金具４１を取り付けておく。このバネ金具４１の取り付けは、図２に示す取付金具４２を用いて行う。   When the LED unit is accommodated in the recess 38, as shown in FIG. 12B, the spring receiving bracket 35 is attached to the locking portions 36a and 37a facing the inside of the recess. In addition, a spring metal fitting 41 is attached to the outer side surface of the heat sink 5 constituting the LED unit in such a manner that the two arm portions 41a and 41b spread laterally (that is, spread in opposite directions to each other) by the elastic force of the spring. The attachment of the spring metal fitting 41 is performed using an attachment metal fitting 42 shown in FIG.

バネ受け金具３５とバネ金具４１とを所定位置に取り付け、ヒートシンクの支持板の背面を収容取付部３の凹部３８に対向させた状態で、ＬＥＤユニットを凹部３８に収容すると、バネ金具４１のアーム部４１ａ、４１ｂが弾性力で横方向に広がり、バネ受け金具３５に係止される。これにより、ＬＥＤユニットは収容取付部３の凹部３８内に収容されて固定される。
バネ金具４１のアーム部４１ａ、４１ｂを横方向に広げたり、狭めたりすることによって、ＬＥＤユニットを収容取付部３に着脱することができるので、例えば、ＬＥＤユニット２ごとの交換が可能である。 When the LED receiving unit is housed in the recess 38 with the spring receiving bracket 35 and the spring bracket 41 attached at predetermined positions and the back surface of the support plate of the heat sink is opposed to the recess 38 of the housing mounting portion 3, The portions 41 a and 41 b spread in the lateral direction by elastic force and are locked to the spring support fitting 35. As a result, the LED unit is housed and fixed in the recess 38 of the housing mounting portion 3.
Since the LED unit can be attached to and detached from the housing mounting portion 3 by expanding or narrowing the arm portions 41a and 41b of the spring metal fitting 41 in the lateral direction, for example, the LED unit 2 can be replaced.

（８）カバーパネル
図２に示すように、カバーパネル９は、平面形状が矩形のパネル板９１と、このパネル板９１の外周部に取り付けられる枠体９２とを有する。パネル板９１は、ＬＥＤ基板６の各ＬＥＤ素子６５（例えば、図３参照。）から発せられた光と、反射シート８によって反射された光とを拡散及び透過させるものである。このパネル板９１によって、多数のＬＥＤ素子による発光の粒々（ツブツブ）感を低減することができ、面発光により近づけることができる。例えば、上記のツブツブ感を改善するために、組み立て後のＬＥＤ照明装置１において、ＬＥＤ素子６５からパネル板９１までの距離を５５ｍｍ確保した。 (8) Cover Panel As shown in FIG. 2, the cover panel 9 includes a panel plate 91 having a rectangular planar shape and a frame body 92 attached to the outer peripheral portion of the panel plate 91. The panel plate 91 diffuses and transmits the light emitted from each LED element 65 (for example, see FIG. 3) of the LED substrate 6 and the light reflected by the reflection sheet 8. The panel plate 91 can reduce the feeling of light emission caused by a large number of LED elements, and can be made closer to surface emission. For example, in order to improve the above-mentioned smooth feeling, in the LED lighting device 1 after assembly, the distance from the LED element 65 to the panel plate 91 is 55 mm.

枠体９２は、パネル板９１を支持すると共に、これをヒートシンク５側に固定するものである。枠体９２は、パネル板９１の外周の４辺に沿って配置された第１のフレーム９５、第２のフレーム９６、第３のフレーム９７及び第４のフレーム９８を有する。そして、これら各フレームの端部が互いに連結されて、枠体９２を構成している。この連結には、連結部材９９が用いられる。   The frame 92 supports the panel plate 91 and fixes it to the heat sink 5 side. The frame body 92 includes a first frame 95, a second frame 96, a third frame 97, and a fourth frame 98 that are disposed along four outer peripheral sides of the panel plate 91. And the edge part of each of these flame | frames is mutually connected, and the frame 92 is comprised. For this connection, a connecting member 99 is used.

（９）対応関係
この第１実施形態及び後述する第２〜第５実施形態では、ヒートシンク５が本発明の「支持部」に対応し、主面５１ａが本発明の「第１の面」に対応し、背面５１ｂが本発明の「第２の面」に対応している。また、Ｘ軸方向が本発明の「一方向」に対応している。さらに、第１のコネクタ６７及び第２のコネクタ６８のうちの一方が本発明の「第１の接続端子」に対応し、他方が本発明の「第２の接続端子」に対応している。また、第１の長辺Ｌ１及び第２の長辺Ｌ２のうちの一方が本発明の「第１の側辺」に対応し、他方が本発明の「第２の側辺」に対応している。 (9) Correspondence In the first embodiment and the second to fifth embodiments described later, the heat sink 5 corresponds to the “support portion” of the present invention, and the main surface 51a corresponds to the “first surface” of the present invention. Correspondingly, the back surface 51b corresponds to the “second surface” of the present invention. The X-axis direction corresponds to “one direction” in the present invention. Further, one of the first connector 67 and the second connector 68 corresponds to the “first connection terminal” of the present invention, and the other corresponds to the “second connection terminal” of the present invention. One of the first long side L1 and the second long side L2 corresponds to the “first side” of the present invention, and the other corresponds to the “second side” of the present invention. Yes.

第１のＬＥＤ照明回路１０では、ＬＥＤ基板６ｍ、６ｍ＋１が本発明の「貫通穴に隣接するＬＥＤ基板」に対応している。また、ＬＥＤ基板６ｍ、６ｍ＋１のうちの一方が本発明の「第１のＬＥＤ基板」に対応し、他方が「第２のＬＥＤ基板」に対応している。さらに、ＬＥＤ基板６ｍ＋４が有する第２のコネクタ６８が、本発明の「（一方向の）一端部に位置する接続端子」に対応している（ＬＥＤ基板６ｍが有する第１のコネクタ６７が一方向の他端部に位置する接続端子に対応している。）。また、貫通穴５３ａが本発明の「貫通穴」に対応している。 In the first LED lighting circuit 10, the LED substrates 6 m and 6 m + 1 correspond to the “LED substrate adjacent to the through hole” of the present invention. One of the LED substrates 6 m and 6 m + 1 corresponds to the “first LED substrate” of the present invention, and the other corresponds to the “second LED substrate”. Further, the second connector 68 included in the LED board 6 m + 4 corresponds to the “connecting terminal located at one end (in one direction)” of the present invention (the first connector 67 included in the LED board 6 m includes It corresponds to the connection terminal located at the other end in one direction.) The through hole 53a corresponds to the “through hole” of the present invention.

第２のＬＥＤ照明回路２０では、ＬＥＤ基板６ｐ、６ｐ＋１が本発明の「貫通穴に隣接するＬＥＤ基板」に対応している。また、ＬＥＤ基板６ｐ、６ｐ＋１のうちの一方が本発明の「第１のＬＥＤ基板」に対応し、他方が「第２のＬＥＤ基板」に対応している。さらに、ＬＥＤ基板６ｐ＋４が有する第１のコネクタ６７が、本発明の「（一方向の）一端部に位置する接続端子」に対応している（ＬＥＤ基板６ｐが有する第２のコネクタ６８が一方向の他端部に位置する接続端子に対応している。）。また、貫通穴５３ｂが本発明の「貫通穴」に対応している。 In the second LED lighting circuit 20, the LED substrates 6 p and 6 p + 1 correspond to the “LED substrate adjacent to the through hole” of the present invention. In addition, one of the LED substrates 6 p and 6 p + 1 corresponds to the “first LED substrate” of the present invention, and the other corresponds to the “second LED substrate”. Furthermore, the first connector 67 included in the LED board 6 p + 4 corresponds to the “connecting terminal located at one end (in one direction)” of the present invention (the second connector 68 included in the LED board 6 p includes It corresponds to the connection terminal located at the other end in one direction.) The through hole 53b corresponds to the “through hole” of the present invention.

（第１実施形態の効果）
本発明の第１実施形態は、以下の効果を奏する。
（１）ＬＥＤ基板６ｍ＋４、６ｐ＋４のヒートシンク５への取付に規制部１１１、１１６が用いている。この取付にビス等を用いる場合と比べて、規制部１１１、１１６とＬＥＤ基板６ｍ＋４、６ｐ＋４との接触面積を大きくすることができ、ＬＥＤ基板６ｍ＋４、６ｐ＋４を支持板５１側に押圧する力（荷重）について、その単位面積当たりの大きさを小さくすることができる。又は、規制部１１１、１１６は必ずしもＬＥＤ基板６ｍ＋４、６ｐ＋４をヒートシンク５側へ押圧しなくてもよく、規制部１１１、１１６とＬＥＤ基板６ｍ＋４、６ｐ＋４との間に遊びがあってもよい。荷重による変形や亀裂がＬＥＤ基板６ｍ＋４、６ｐ＋４に生じる可能性を低減することができる。 (Effect of 1st Embodiment)
The first embodiment of the present invention has the following effects.
(1) The restricting portions 111 and 116 are used to attach the LED substrates 6m + 4 and 6p + 4 to the heat sink 5. Compared with the case where screws or the like are used for this attachment, the contact area between the regulating portions 111 and 116 and the LED boards 6m + 4 and 6p + 4 can be increased, and the force (load) that presses the LED boards 6m + 4 and 6p + 4 toward the support plate 51 side. ), The size per unit area can be reduced. Alternatively, the restricting portions 111 and 116 do not necessarily have to press the LED substrates 6m + 4 and 6p + 4 toward the heat sink 5, and there may be play between the restricting portions 111 and 116 and the LED substrates 6m + 4 and 6p + 4. It is possible to reduce the possibility that deformation and cracks due to load occur in the LED substrates 6m + 4 and 6p + 4.

（２）規制部１１１、１１６をヒートシンク５に取り付ける締結部材１１２、１１７は、平面視でＬＥＤ基板６から離れている。これにより、ＬＥＤ基板６ｍ＋４、６ｐ＋４をヒートシンク５に取り付ける際に、締結部材１１２、１１７の頭部から取付工具が外れた場合でも、この取付工具がＬＥＤ基板６に接触する可能性は小さい。ＬＥＤ基板６を傷付けてしまう可能性を低減することができる。 (2) The fastening members 112 and 117 for attaching the restricting portions 111 and 116 to the heat sink 5 are separated from the LED substrate 6 in plan view. Thereby, when attaching LED board 6m + 4, 6p + 4 to the heat sink 5, even when an attachment tool remove | deviates from the head of fastening member 112,117, possibility that this attachment tool will contact LED board 6 is small. The possibility of damaging the LED substrate 6 can be reduced.

なお、本発明において、規制部を支持部に取り付ける締結部材はネジ、ロックピン又はリベットに限定されるものではない。規制部を支持部に取り付ける締結部材は接着剤でもよい。接着剤を用いる場合は、予め設定した塗布領域から接着剤がはみ出してしまう場合が想定されるが、この場合でも、塗布領域はＬＥＤ基板から離れている。このため、ＬＥＤ基板に接着剤が付着することを防ぐことができ、接着剤がＬＥＤ基板にダメージを与えること（例えば、接着剤がＬＥＤ素子やコネクタ等に付着する等）を防ぐことができる。   In the present invention, the fastening member for attaching the restricting portion to the support portion is not limited to a screw, a lock pin, or a rivet. The fastening member that attaches the restricting portion to the support portion may be an adhesive. In the case of using an adhesive, it is assumed that the adhesive protrudes from a preset application region, but even in this case, the application region is separated from the LED substrate. For this reason, it can prevent that an adhesive agent adheres to an LED board, and can prevent that an adhesive agent damages an LED board (for example, an adhesive agent adheres to an LED element, a connector, etc.).

（３）また、複数のＬＥＤ基板６は、Ｘ軸方向に離間して並び、且つ隣り合うＬＥＤ基板６間が配線で接続されて第１のＬＥＤ照明回路１０、第２のＬＥＤ照明回路２０を構成している。これにより、ＬＥＤ照明回路を１枚の連続したＬＥＤ基板で構成する場合と比べて、基材の使用量を減らすことができるので、製造コストの低減に寄与することができる。 (3) Further, the plurality of LED boards 6 are arranged apart from each other in the X-axis direction, and the adjacent LED boards 6 are connected by wiring so that the first LED illumination circuit 10 and the second LED illumination circuit 20 are connected. It is composed. Thereby, since the usage-amount of a base material can be reduced compared with the case where an LED illumination circuit is comprised with one continuous LED board, it can contribute to reduction of manufacturing cost.

（４）また、第１のＬＥＤ照明回路１０では、第１のＬＥＤ点灯装置７１のアノード側を第１のＬＥＤ照明回路１０に接続する第１の配線７１ａ、及び、第１のＬＥＤ点灯装置７１のカソード側を第１のＬＥＤ照明回路１０に接続する第２の配線７１ｂは、支持板５１の背面５１ｂ側から貫通穴５３ａを通り主面５１ａ側に引き出されて、複数のＬＥＤ基板６のうち貫通穴５３ａに隣接するＬＥＤ基板６ｍ、６ｍ＋１にそれぞれ接続されている。 (4) Moreover, in the 1st LED lighting circuit 10, the 1st wiring 71a which connects the anode side of the 1st LED lighting device 71 to the 1st LED lighting circuit 10, and the 1st LED lighting device 71 The second wiring 71b that connects the cathode side of the first LED lighting circuit 10 to the first LED illumination circuit 10 is led out from the back surface 51b side of the support plate 51 to the main surface 51a side through the through hole 53a. The LED boards 6 m and 6 m + 1 adjacent to the through hole 53a are connected to the LED board 6 m and 6 m + 1 respectively.

同様に、第２のＬＥＤ照明回路２０でも、第２のＬＥＤ点灯装置７２のアノード側を第２のＬＥＤ照明回路２０に接続する第１の配線７２ａ、及び、第２のＬＥＤ点灯装置７２のカソード側を第２のＬＥＤ照明回路２０に接続する第２の配線７２ｂは、支持板５１の背面５１ｂ側から貫通穴５３ｂを通り主面５１ａ側に引き出されて、複数のＬＥＤ基板６のうち貫通穴５３ｂに隣接するＬＥＤ基板６ｐ、６ｐ＋１にそれぞれ接続されている。
これにより、第１、第２の配線の各配線長をそれぞれ短くすることができ、配線材の使用量を抑制することができるので、製造コストの低減に寄与することができる。 Similarly, also in the 2nd LED lighting circuit 20, the 1st wiring 72a which connects the anode side of the 2nd LED lighting device 72 to the 2nd LED lighting circuit 20, and the cathode of the 2nd LED lighting device 72 The second wiring 72b connecting the side to the second LED lighting circuit 20 is drawn from the back surface 51b side of the support plate 51 through the through hole 53b to the main surface 51a side, and the through hole of the plurality of LED substrates 6 The LED boards 6 p and 6 p + 1 adjacent to 53b are respectively connected.
Thereby, each wiring length of a 1st, 2nd wiring can be shortened, respectively, and since the usage-amount of a wiring material can be suppressed, it can contribute to reduction of manufacturing cost.

（５）また、第１のＬＥＤ照明回路１０では、ＬＥＤ基板６ｍの第１のコネクタ６７と、ＬＥＤ基板６ｍ＋１の第２のコネクタ６８とが貫通穴５３ａに隣接している。同様に、第２のＬＥＤ照明回路２０でも、ＬＥＤ基板６ｐの第１のコネクタ６７と、ＬＥＤ基板６ｐ＋１の第２のコネクタ６８とが貫通穴５３ｂに隣接している。
これにより、貫通穴から（第１、第２の配線が接続する）各コネクタまでの距離をより短く（理想的には、最短）にすることができるので、第１、第２の配線の配線材の使用量をさらに抑制することができる。 (5) Also, the first LED lighting circuit 10, a first connector 67 of the LED substrate 6 m, and the second connector 68 of the LED substrate 6 m + 1 is adjacent to the through hole 53a. Similarly, in the second LED lighting circuit 20, a first connector 67 of the LED substrate 6 p, a second connector 68 of the LED substrate 6 p + 1 is adjacent to the through hole 53b.
As a result, the distance from the through hole to each connector (to which the first and second wirings are connected) can be made shorter (ideally the shortest), so the wiring of the first and second wirings The amount of material used can be further suppressed.

（６）また、第１のＬＥＤ照明回路１０では、第１のＬＥＤ点灯装置７１の蓋体１７３の切欠き部１７４が貫通穴５３ａの近傍に位置するように（例えば、切欠き部１７４が貫通穴５３ａの直下に位置するように）、第１のＬＥＤ点灯装置７１の支持板５１に対する取付位置が調整されている。同様に、第２のＬＥＤ照明回路２０でも、第２のＬＥＤ点灯装置７２の蓋体の切欠き部が貫通穴５３ｂの近傍に位置するように（例えば、切欠き部が貫通穴５３ｂの直下に位置するように）、第２のＬＥＤ点灯装置７２の支持板５１に対する取付位置が調整されている。これにより、切欠き部から貫通穴までの距離をより短く（理想的には、最短）にすることができるので、第１、第２の配線の配線材の使用量をさらに抑制することができる。 (6) Further, in the first LED lighting circuit 10, the notch 174 of the lid 173 of the first LED lighting device 71 is positioned in the vicinity of the through hole 53a (for example, the notch 174 penetrates). The mounting position of the first LED lighting device 71 with respect to the support plate 51 is adjusted so as to be positioned directly below the hole 53a. Similarly, in the second LED lighting circuit 20, the notch portion of the lid of the second LED lighting device 72 is positioned in the vicinity of the through hole 53 b (for example, the notch portion is directly below the through hole 53 b. The mounting position of the second LED lighting device 72 with respect to the support plate 51 is adjusted. Thereby, since the distance from a notch part to a through-hole can be shortened (ideally, the shortest), the usage-amount of the wiring material of a 1st, 2nd wiring can further be suppressed. .

（７）また、支持板５１の背面５１ｂ側で第１の配線７１ａ、７２ａと、第２の配線７１ｂ、７２ｂの各配線長をそれぞれ短くすることができるので、ＬＥＤユニット２を収納取付部３に取り付ける（又は、取り外す）際に、作業者の指が第１、第２の配線に触れる機会を少なくすることができる。これにより、作業者の指に第１、第２の配線が絡まったり、作業者の指が第１、第２の配線を引っ張ったりすることを防ぐことができるので、ＬＥＤユニットの取付け（又は、取外し）の作業性の向上に寄与することができる。 (7) Since the lengths of the first wires 71a and 72a and the second wires 71b and 72b can be shortened on the back surface 51b side of the support plate 51, the LED unit 2 can be accommodated in the housing mounting portion 3. When attached to (or removed from) the operator, the operator's finger can be less likely to touch the first and second wirings. As a result, it is possible to prevent the operator's finger from being entangled with the first and second wires and the operator's finger from pulling the first and second wires. It is possible to contribute to the improvement of workability of removal.

特に、上記の第１実施形態では、第１のＬＥＤ点灯装置７１と第２のＬＥＤ点灯装置７２は支持板５１の中央部の背面側に取り付けられており、支持板５１の貫通穴５３ａ、５３ｂも支持板５１の中央部に設けられている。ＬＥＤユニットの取付け（又は、取外し）の際は、作業者は支持部の外周部を手で支えることが想定されるが、第１、第２の配線は支持板の中央部付近に配設されており、外周部付近には配設されていないので、第１、第２の配線に構造的に手が届きにくい。
このように、上記の第１実施形態では、第１、第２の配線長が短く、かつ、構造的にも第１、第２の配線に手が届きにくい。これにより、ＬＥＤユニットの取付け（又は、取外し）の作業性の向上に大きく寄与することができる。 In particular, in the first embodiment, the first LED lighting device 71 and the second LED lighting device 72 are attached to the back side of the center portion of the support plate 51, and the through holes 53 a and 53 b of the support plate 51 are provided. Is also provided at the center of the support plate 51. When attaching (or removing) the LED unit, it is assumed that the operator supports the outer periphery of the support portion by hand, but the first and second wirings are arranged near the center portion of the support plate. Therefore, the first and second wirings are difficult to reach structurally.
As described above, in the first embodiment, the first and second wiring lengths are short, and the first and second wirings are difficult to reach structurally. Thereby, it can contribute greatly to the improvement of workability of attachment (or removal) of the LED unit.

（８）また、第１のＬＥＤ照明回路１０では、第１の配線７１ａと第２の配線７１ｂの配線長をそれぞれ短くすることができる。同様に、第２のＬＥＤ照明回路２０でも、第１の配線７２ａと第２の配線７２ｂの配線長をそれぞれ短くすることができる。これにより、高周波ノイズを低減することができる。 (8) Moreover, in the 1st LED lighting circuit 10, the wiring length of the 1st wiring 71a and the 2nd wiring 71b can be shortened, respectively. Similarly, in the second LED lighting circuit 20, the wiring lengths of the first wiring 72a and the second wiring 72b can be shortened, respectively. Thereby, high frequency noise can be reduced.

＜第１実施形態の変形例＞
（１）上記の第１実施形態では、図９（ａ）及び（ｂ）に示したように、ＬＥＤ照明装置１が２種類の規制部１１１、１１６を有する場合について説明した。しかしながら、本発明はこれに限定されるものではない。ＬＥＤ照明装置１は、２種類ではなく、１種類の規制部のみを有していてもよい。 <Modification of First Embodiment>
(1) In said 1st Embodiment, as shown to Fig.9 (a) and (b), the case where the LED lighting apparatus 1 had two types of control parts 111 and 116 was demonstrated. However, the present invention is not limited to this. The LED lighting device 1 may have only one type of restricting portion instead of two types.

図１３は、第１実施形態におけるＬＥＤ基板６の取付状態の変形例（その１）を示す図である。詳しくは、図１３（ａ）はＬＥＤ基板６の取付状態を模式的に示す平面図であり、図１３（ｂ）は図１３（ａ）のＸ１３−Ｘ’１３断面を拡大した断面図である。
図１３（ａ）及び（ｂ）に示すように、ＬＥＤ照明装置１は、ＬＥＤ基板６の端部を覆ってその位置を規制する規制部として、規制部１１１のみを有していてもよい。即ち、規制部１１６を規制部１１１で置き換えてもよい。このような構成であっても、上記の第１実施形態の効果（１）〜（８）と同様の効果を奏する。 FIG. 13 is a view showing a modification (No. 1) of the mounting state of the LED substrate 6 in the first embodiment. Specifically, FIG. 13A is a plan view schematically showing the mounting state of the LED substrate 6, and FIG. 13B is an enlarged cross-sectional view taken along the line X13-X′13 of FIG. .
As shown in FIGS. 13A and 13B, the LED lighting device 1 may include only the restriction portion 111 as a restriction portion that covers the end portion of the LED substrate 6 and restricts its position. That is, the restriction unit 116 may be replaced with the restriction unit 111. Even with such a configuration, the same effects as the effects (1) to (8) of the first embodiment described above can be obtained.

（２）また、上記の第１実施形態では、複数のＬＥＤ基板６のうち、ヒートシンクの第１の側板に隣接して配置されたＬＥＤ基板６ｐ＋４と、ヒートシンクの第３の側板５７に隣接して配置されたＬＥＤ基板６ｍ＋４とが、規制部１１１、１１６によって支持板５１に取り付けられている場合について説明した。しかしながら、本発明では、ＬＥＤ照明装置１が備える全てのＬＥＤ基板６を、規制部によって支持板５１に取り付けるようにしてもよい。 (2) Moreover, in said 1st Embodiment, it adjoins the LED board 6p + 4 arrange | positioned adjacent to the 1st side plate of a heat sink among the some LED boards 6, and the 3rd side plate 57 of a heat sink. The case where the arranged LED substrate 6m + 4 is attached to the support plate 51 by the restriction portions 111 and 116 has been described. However, in this invention, you may make it attach all the LED boards 6 with which the LED lighting apparatus 1 is provided to the support plate 51 by a control part.

図１４は、第１実施形態におけるＬＥＤ基板６の取付状態の変形例（その２）を示す図である。詳しくは、図１４（ａ）はＬＥＤ基板６の取付状態を模式的に示す平面図であり、図１４（ｂ）は図１４（ａ）のＸ１４−Ｘ’１４断面を拡大した断面図である。図１４（ａ）及び（ｂ）に示すように、この変形例では、複数のＬＥＤ基板６のうち、ヒートシンクの第１の側板に隣接して配置されたＬＥＤ基板６ｐ＋４及びヒートシンクの第３の側板５７に隣接して配置されたＬＥＤ基板６ｍ＋４が、規制部１１１、１１６によって支持板５１に取り付けられている。また、それ以外のＬＥＤ基板６ｍ〜６ｍ＋３、６ｐ〜６ｐ＋３は、規制部１１１によって支持板５１に取り付けられている。   FIG. 14 is a view showing a modification (No. 2) of the mounting state of the LED substrate 6 in the first embodiment. Specifically, FIG. 14A is a plan view schematically showing the mounting state of the LED substrate 6, and FIG. 14B is an enlarged cross-sectional view taken along the X14-X'14 section of FIG. . As shown in FIGS. 14A and 14B, in this modification, among the plurality of LED substrates 6, the LED substrate 6p + 4 disposed adjacent to the first side plate of the heat sink and the third side plate of the heat sink. LED board 6m + 4 arranged adjacent to 57 is attached to support plate 51 by restricting portions 111 and 116. Further, the other LED substrates 6m to 6m + 3 and 6p to 6p + 3 are attached to the support plate 51 by the restricting portion 111.

このような構成であっても、上記の第１実施形態の効果（１）〜（８）と同様の効果を奏する。また、ＬＥＤ基板６ｍ＋４、６ｐ＋４だけでなく、ＬＥＤ基板６ｍ〜６ｍ＋３、６ｐ〜６ｐ＋３についても、第１実施形態の効果（１）、（２）と同様の効果を奏する。   Even with such a configuration, the same effects as the effects (1) to (8) of the first embodiment described above can be obtained. Further, not only the LED boards 6m + 4 and 6p + 4 but also the LED boards 6m to 6m + 3 and 6p to 6p + 3 have the same effects as the effects (1) and (2) of the first embodiment.

（３）また、本発明の第１実施形態では、上記の変形例（１）と（２）を組み合わせてもよい。即ち、ＬＥＤ照明装置１は、ＬＥＤ基板６の位置を規制する規制部として１種類の規制部のみを有し、且つ、ＬＥＤ照明装置１が備える全てのＬＥＤ基板を１種類の規制部によって支持板５１に取り付けるようにしてもよい。
図１５は、第１実施形態におけるＬＥＤ基板６の取付状態の変形例（その３）を示す図である。詳しくは、図１５（ａ）はＬＥＤ基板６の取付状態を模式的に示す平面図であり、図１５（ｂ）は図１５（ａ）のＸ１５−Ｘ’１５断面を拡大した断面図である。図１５（ａ）及び（ｂ）に示すように、ＬＥＤ照明装置１が備える全てのＬＥＤ基板６は、規制部１１１によって支持板５１に取り付けられている。このような構成であっても、上記の第１実施形態の効果（１）、（２）と同様の効果を奏する。また、ＬＥＤ基板６ｍ〜６ｍ＋３、６ｐ〜６ｐ＋３についても、第１実施形態の効果（１）〜（８）と同様の効果を奏する。 (3) In the first embodiment of the present invention, the above modifications (1) and (2) may be combined. In other words, the LED lighting device 1 has only one type of regulating unit as a regulating unit that regulates the position of the LED substrate 6, and all the LED boards included in the LED lighting device 1 are supported by one type of regulating unit. You may make it attach to 51.
FIG. 15 is a view showing a modification (No. 3) of the attached state of the LED substrate 6 in the first embodiment. Specifically, FIG. 15A is a plan view schematically showing the mounting state of the LED substrate 6, and FIG. 15B is an enlarged cross-sectional view taken along the X15-X′15 section of FIG. . As shown in FIGS. 15A and 15B, all the LED substrates 6 included in the LED lighting device 1 are attached to the support plate 51 by the restriction portion 111. Even with such a configuration, the same effects as the effects (1) and (2) of the first embodiment described above can be obtained. Further, the LED substrates 6m to 6m + 3 and 6p to 6p + 3 also have the same effects as the effects (1) to (8) of the first embodiment.

（４）上記の第１実施形態では、ＬＥＤ照明装置１が第１のＬＥＤ照明回路１０と第２のＬＥＤ照明回路２０を有する場合について説明した。しかしながら、本発明はこれに限定されるものではない。ＬＥＤ照明装置１は、第１のＬＥＤ照明回路１０及び第２のＬＥＤ照明回路２０のうちの一方のみを有していてもよい。このような構成であっても、上記の第１実施形態の効果（１）〜（６）、（８）と同様の効果を奏する。 (4) In said 1st Embodiment, the case where the LED lighting apparatus 1 had the 1st LED lighting circuit 10 and the 2nd LED lighting circuit 20 was demonstrated. However, the present invention is not limited to this. The LED lighting device 1 may have only one of the first LED lighting circuit 10 and the second LED lighting circuit 20. Even with such a configuration, the same effects as the effects (1) to (6) and (8) of the first embodiment described above can be obtained.

（５）また、上記の第１実施形態では、支持板５１の貫通穴５３ａ、５３ｂはそれぞれ、平面視で隣り合う一対のＬＥＤ基板６間に位置する場合について説明した。しかしながら、本発明はこれに限定されるものではない。
図１６は、第１のＬＥＤ照明回路１０の変形例である、第１のＬＥＤ照明回路１０Ａの構成と電流の流れを模式的に示す平面図である。図１６に示すように、支持板の貫通穴５３ａは、平面視で、Ｘ軸方向に並ぶ複数のＬＥＤ基板６の列の他端部に位置してもよい。 (5) Moreover, in said 1st Embodiment, the case where each of the through-holes 53a and 53b of the support plate 51 was located between a pair of LED board 6 adjacent by planar view was demonstrated. However, the present invention is not limited to this.
FIG. 16 is a plan view schematically showing the configuration of the first LED lighting circuit 10A and the flow of current, which is a modification of the first LED lighting circuit 10. As shown in FIG. As shown in FIG. 16, the through hole 53 a of the support plate may be located at the other end of the row of the plurality of LED substrates 6 arranged in the X-axis direction in plan view.

例えば、貫通穴５３ａは、ＬＥＤ基板６ｍの、ＬＥＤ基板６ｍ＋１と隣り合う側の反対側に位置してもよい。そして、第１のＬＥＤ点灯装置の第１の配線７１ａ及び第２の配線７１ｂの両方が、ＬＥＤ基板６ｍの第１のコネクタ６７に接続していてもよい。このような構成であっても、上記の第１実施形態の効果（１）〜（６）、（８）と同様の効果を奏する。なお、図示しないが、第２のＬＥＤ照明回路２０についても同様の変形例を適用してよい。 For example, the through hole 53a is of a LED substrate 6 m, may be located on the opposite side of the LED substrate 6 m + 1 and the adjacent side. And both the 1st wiring 71a and the 2nd wiring 71b of the 1st LED lighting device may be connected to the 1st connector 67 of LED board 6m. Even with such a configuration, the same effects as the effects (1) to (6) and (8) of the first embodiment described above can be obtained. Although not shown, the same modification may be applied to the second LED illumination circuit 20 as well.

（６）また、上記の第１実施形態では、支持板５１の貫通穴５３ａ、５３ｂの内側面や、開口端の縁に、弾性のある保護テープ等を貼ってもよい。また、第１、第２の配線を熱収縮チューブで保護してもよい。これにより、第１、第２の配線が、貫通穴の内側面や開口端の縁に直接接触することを防ぐことができ、これらの箇所に擦られて断線する可能性を十分に低減することができる。 (6) Moreover, in said 1st Embodiment, you may stick an elastic protective tape etc. to the inner surface of the through-holes 53a and 53b of the support plate 51, or the edge of an opening end. Moreover, you may protect the 1st, 2nd wiring with a heat contraction tube. As a result, the first and second wirings can be prevented from coming into direct contact with the inner surface of the through hole and the edge of the opening end, and the possibility of disconnection due to rubbing against these portions is sufficiently reduced. Can do.

（７）また、上記の第１実施形態では、支持板５１の貫通穴５３ａ、５３ｂの平面形状が矩形である場合を図示したが、本発明はこれに限定されるものではない。貫通穴５３ａ、５３ｂの平面形状は角丸矩形でもよく、楕円でもよく、正円でもよい。何れの場合も、上記の第１実施形態の効果（１）〜（８）と同様の効果を奏する。 (7) In the first embodiment, the case where the planar shape of the through holes 53a and 53b of the support plate 51 is rectangular is illustrated, but the present invention is not limited to this. The planar shape of the through holes 53a and 53b may be a rounded rectangle, an ellipse, or a perfect circle. In any case, the same effects as the effects (1) to (8) of the first embodiment are obtained.

（８）また、上記の第１実施形態では、図１１（ｂ）に示したように、２枚の主面反射シート８１の端部８１ａを互いに重ねて、支持板５１の主面５１ａ側を連続して覆う場合について説明した。しかしながら、本発明はこれに限定されるものではない。
支持板５１の主面５１ａ側を連続して覆う主面反射シートは、２枚ではなく、１枚の主面反射シート（即ち、図１１（ａ）に示した主面反射シート８１よりもサイズが大きい、例えば、面積が約２倍の主面反射シート）で構成されていてもよい。或いは、支持板５１の主面５１ａ側を連続して覆う主面反射シートは、２枚ではなく３枚以上の主面反射シート（即ち、図１１（ａ）に示した主面反射シート８１よりもサイズが小さい主面反射シート）が互いに端部を重ねて構成されていてもよい。何れの場合も、ＬＥＤ照明装置１の光束を高めることができる。 (8) In the first embodiment, as shown in FIG. 11B, the end portions 81 a of the two main surface reflection sheets 81 are overlapped with each other, and the main surface 51 a side of the support plate 51 is disposed. The case where it covers continuously was demonstrated. However, the present invention is not limited to this.
The main surface reflection sheet continuously covering the main surface 51a side of the support plate 51 is not two sheets, but a single main surface reflection sheet (that is, a size larger than the main surface reflection sheet 81 shown in FIG. 11A). For example, a main surface reflection sheet having an area approximately twice as large. Alternatively, the main surface reflecting sheet that continuously covers the main surface 51a side of the support plate 51 is not two, but three or more main surface reflecting sheets (that is, the main surface reflecting sheet 81 shown in FIG. 11A). Also, the main surface reflection sheet having a small size may be configured such that the end portions overlap each other. In either case, the luminous flux of the LED lighting device 1 can be increased.

＜第２実施形態＞
（構成）
図１７（ａ）及び（ｂ）は、本発明の第２実施形態におけるＬＥＤ基板６の取付状態を模式的に示す図である。詳しくは、図１７（ａ）はＬＥＤ基板６の取付状態を模式的に示す平面図であり、図１７（ｂ）は図１７（ａ）のＸ１７−Ｘ’１７断面を拡大した断面図である。図１７（ａ）及び（ｂ）に示すように、ＬＥＤ照明装置１は、ＬＥＤ基板６の端部を覆ってその位置を規制する規制部として、複数の規制部１１６と複数の規制部１２１とを有する。これら２種類の規制部１１６、１２１のうち、規制部１１６の構成は第１実施形態で説明した通りである。即ち、規制部１１６は、ＬＥＤ基板６ｐ＋４の第１の側板側の端部を覆ってその位置を規制する。また、規制部１１６は、ＬＥＤ基板６ｍ＋４の第３の側板５７側の端部を覆ってその位置を規制する。 Second Embodiment
(Constitution)
FIGS. 17A and 17B are views schematically showing the mounting state of the LED substrate 6 in the second embodiment of the present invention. Specifically, FIG. 17 (a) is a plan view schematically showing the mounting state of the LED substrate 6, and FIG. 17 (b) is an enlarged cross-sectional view taken along the X17-X'17 section of FIG. 17 (a). . As shown in FIGS. 17A and 17B, the LED lighting device 1 includes a plurality of restriction portions 116 and a plurality of restriction portions 121 as restriction portions that cover the end portions of the LED substrate 6 and restrict the positions thereof. Have Of these two types of restriction parts 116 and 121, the structure of the restriction part 116 is as described in the first embodiment. That is, the regulation part 116 covers the edge part by the side of the 1st side plate of LED board 6p + 4, and regulates the position. The restricting portion 116 covers the end portion of the LED substrate 6m + 4 on the third side plate 57 side and restricts its position.

規制部１２１は、平面視で隣り合う２枚のＬＥＤ基板６の各端部を覆って、これら２枚のＬＥＤ基板６の位置をそれぞれ規制するものである。規制部１２１は、例えば、隣り合う２枚のＬＥＤ基板６のうち一方のＬＥＤ基板６の端部を覆う被覆部１２１ａと、他方のＬＥＤ基板６の端部を覆う被覆部１２１ｂと、支持板５１に取り付けられる取付部１２１ｃとを有する。取付部１２１ｃは、被覆部１２１ａ、１２１ｂの間に位置する。また、取付部１２１ｃには貫通穴が設けられている。規制部１２１の被覆部１２１ａ、１２１ｂがＬＥＤ基板６の端部をそれぞれ覆い、且つ、取付部１２１ｃが支持板５１と対向した状態で、取付部１２１ｃの貫通穴に締結部材１２２が通される。これにより、取付部１２１ｃは支持板５１に固定され、被覆部１２１ａ、１２１ｂは隣り合う２枚のＬＥＤ基板６の端部をそれぞれ支持板５１側に押圧して、これら２枚のＬＥＤ基板６を一括で固定する。   The restricting portion 121 covers each end portion of the two LED substrates 6 that are adjacent in plan view, and restricts the positions of the two LED substrates 6. For example, the restricting portion 121 includes a covering portion 121 a that covers an end portion of one LED substrate 6 of two adjacent LED substrates 6, a covering portion 121 b that covers an end portion of the other LED substrate 6, and a support plate 51. And a mounting portion 121c attached to the head. The attachment portion 121c is located between the covering portions 121a and 121b. Further, the attachment portion 121c is provided with a through hole. The fastening member 122 is passed through the through hole of the attachment portion 121c in a state where the covering portions 121a and 121b of the restriction portion 121 respectively cover the end portions of the LED substrate 6 and the attachment portion 121c faces the support plate 51. As a result, the mounting portion 121c is fixed to the support plate 51, and the covering portions 121a and 121b press the end portions of the two adjacent LED substrates 6 toward the support plate 51, respectively. Fix in bulk.

このように規制部１２１はネジ、ロックピン又はリベット等の締結部材１２２によってヒートシンクの支持板５１に取り付けられるが、その取付位置は平面視で隣り合うＬＥＤ基板６間となっている。一例を挙げると、規制部１２１がＬＥＤ基板６ｍ＋３、６ｍ＋４の各端部を覆って、これらＬＥＤ基板６ｍ＋３、６ｍ＋４の位置をそれぞれ規制するが、この規制部１２１の支持板５１への取付位置は、平面視でＬＥＤ基板６ｍ＋３、６ｍ＋４間となっている。   As described above, the restricting portion 121 is attached to the heat sink support plate 51 by the fastening member 122 such as a screw, a lock pin, or a rivet, and the attachment position is between the adjacent LED substrates 6 in plan view. For example, the restricting portion 121 covers the end portions of the LED substrates 6m + 3 and 6m + 4, and restricts the positions of the LED substrates 6m + 3 and 6m + 4. The attachment position of the restricting portion 121 to the support plate 51 is as follows. It is between LED board 6m + 3 and 6m + 4 by planar view.

第２実施形態において、規制部以外の構成は、第１実施形態と同じである。
（第２実施形態の効果）
第２実施形態は、第１実施形態の効果（１）〜（８）と同様の効果を奏する。
また、規制部１２１は、２枚の隣り合うＬＥＤ基板６の位置を規制する。このため、第１実施形態の変形例（２）、（３）と比べて、規制部の個数を減らすことができる。 In the second embodiment, the configuration other than the restricting portion is the same as that of the first embodiment.
(Effect of 2nd Embodiment)
The second embodiment has the same effects as the effects (1) to (8) of the first embodiment.
Further, the restricting unit 121 restricts the positions of the two adjacent LED substrates 6. For this reason, compared with the modifications (2) and (3) of the first embodiment, the number of restricting portions can be reduced.

（第２実施形態の変形例）
第２実施形態において、ＬＥＤ照明装置１は、規制部１１６の代わりに、規制部１１１を備えていてもよい。
図１８（ａ）及び（ｂ）は、第２実施形態におけるＬＥＤ基板６の取付状態の変形例を示す図である。詳しくは、図１８（ａ）はＬＥＤ基板６の取付状態を模式的に示す平面図であり、図１８（ｂ）は図１８（ａ）のＸ１８−Ｘ’１８断面を拡大した断面図である。 (Modification of the second embodiment)
In the second embodiment, the LED lighting device 1 may include a restriction unit 111 instead of the restriction unit 116.
FIGS. 18A and 18B are views showing a modification of the mounting state of the LED board 6 in the second embodiment. Specifically, FIG. 18A is a plan view schematically showing the mounting state of the LED substrate 6, and FIG. 18B is an enlarged cross-sectional view taken along the X18-X′18 section of FIG. .

図１８（ａ）及び（ｂ）に示すように、規制部１１１は、ＬＥＤ基板６ｐ＋４の第１の側板側の端部を覆って、ＬＥＤ基板６ｐ＋４の位置を規制する。また、規制部１１１は、ＬＥＤ基板６ｍ＋４の第３の側板側の端部を覆って、ＬＥＤ基板６ｍ＋４の位置を規制する。規制部１１１の構成は第１実施形態で説明した通りである。このような構成であっても、上記の第２実施形態の効果と同様の効果を奏する。   As shown in FIGS. 18A and 18B, the restricting portion 111 covers the end of the LED substrate 6p + 4 on the first side plate side and restricts the position of the LED substrate 6p + 4. The restricting unit 111 covers the end of the LED substrate 6m + 4 on the third side plate side and restricts the position of the LED substrate 6m + 4. The configuration of the restricting unit 111 is as described in the first embodiment. Even with such a configuration, the same effects as those of the second embodiment described above can be obtained.

＜第３実施形態＞
（構成）
図１９（ａ）及び（ｂ）は、本発明の第３実施形態におけるＬＥＤ基板６の取付状態を模式的に示す図である。詳しくは、図１９（ａ）はＬＥＤ基板６の取付状態を模式的に示す平面図であり、図１９（ｂ）は図１９（ａ）のＸ１９−Ｘ’１９断面を拡大した断面図である。 <Third Embodiment>
(Constitution)
FIGS. 19A and 19B are views schematically showing the mounting state of the LED substrate 6 in the third embodiment of the present invention. Specifically, FIG. 19A is a plan view schematically showing the mounting state of the LED substrate 6, and FIG. 19B is an enlarged cross-sectional view taken along the X19-X'19 section of FIG. .

図１９（ａ）及び（ｂ）に示すように、ＬＥＤ照明装置１は、ＬＥＤ基板６を覆ってその位置を規制する規制部として、複数の規制部１３１を有する。複数の規制部１３１の各々は、ＬＥＤ基板６ｍ〜６ｍ＋４、６ｐ〜６ｐ＋４と交差する方向にそれぞれ延設されており、ＬＥＤ基板６ｍ〜６ｍ＋４、６ｐ〜６ｐ＋４を覆って、ＬＥＤ基板６ｍ〜６ｍ＋４、６ｐ〜６ｐ＋４の各位置を一括で規制するものである。   As shown in FIGS. 19A and 19B, the LED lighting device 1 includes a plurality of restricting portions 131 as restricting portions that cover the LED substrate 6 and restrict its position. Each of the plurality of regulating portions 131 extends in a direction intersecting with the LED boards 6m to 6m + 4 and 6p to 6p + 4, covers the LED boards 6m to 6m + 4 and 6p to 6p + 4, and covers the LED boards 6m to 6m + 4 and 6p. Each position of ˜6p + 4 is regulated collectively.

規制部１３１は、例えば、ＬＥＤ基板６ｍ〜６ｍ＋４、６ｐ〜６ｐ＋４をそれぞれ覆う被覆部１３１ａと、ヒートシンクの支持板５１に取り付けられる取付部１３１ｂと、ヒートシンクの第１、第３の側板にそれぞれ取り付けられる取付部１３１ｃとを有する。規制部１３１の長手方向に沿って被覆部１３１ａと取付部１３１ｂとが交互に位置し、規制部１３１の長手方向の両端部に取付部１３１ｃがそれぞれ位置する。また、取付部１３１ｂ、１３１ｃにはそれぞれ貫通穴が設けられている。   For example, the restricting portion 131 is attached to the covering portion 131a that covers the LED substrates 6m to 6m + 4 and 6p to 6p + 4, the attachment portion 131b attached to the support plate 51 of the heat sink, and the first and third side plates of the heat sink, respectively. And an attachment portion 131c. The covering portions 131 a and the attaching portions 131 b are alternately positioned along the longitudinal direction of the restricting portion 131, and the attaching portions 131 c are located at both ends of the restricting portion 131 in the longitudinal direction. The attachment portions 131b and 131c are each provided with a through hole.

規制部１３１の被覆部１３１ａがＬＥＤ基板６ｍ〜６ｍ＋４、６ｐ〜６ｐ＋４をそれぞれ覆い、且つ、取付部１３１ｂが支持板５１上に位置し、且つ、取付部１３１ｃが第１、第３の側板５７と対向した状態で、取付部１３１ｂの貫通穴に締結部材１３２が通され、取付部１３１ｃの貫通穴に締結部材１３３が通される。これにより、取付部１３１ｂは支持板５１に固定され、取付部１３１ｃは第１、第３の側板にそれぞれ固定され、被覆部１３１ａはＬＥＤ基板６ｍ〜６ｍ＋４、６ｐ〜６ｐ＋４をそれぞれ支持板５１側に押圧して、これらを一括で固定する。   The covering portion 131a of the restricting portion 131 covers the LED substrates 6m to 6m + 4 and 6p to 6p + 4, the mounting portion 131b is located on the support plate 51, and the mounting portion 131c is connected to the first and third side plates 57. In a state of being opposed to each other, the fastening member 132 is passed through the through hole of the mounting portion 131b, and the fastening member 133 is passed through the through hole of the mounting portion 131c. Accordingly, the attachment portion 131b is fixed to the support plate 51, the attachment portion 131c is fixed to the first and third side plates, respectively, and the covering portion 131a places the LED substrates 6m to 6m + 4 and 6p to 6p + 4 on the support plate 51 side. Press to fix them together.

このように、規制部１３１はネジ、ロックピン又はリベット等の締結部材１３２、１３３によってヒートシンクに取り付けられるが、その取付位置は支持板５１のうち平面視で隣り合うＬＥＤ基板間、又は、第１、第３の側板となっている。
第３実施形態において、規制部以外の構成は、第１実施形態と同じである。 As described above, the restricting portion 131 is attached to the heat sink by the fastening members 132 and 133 such as screws, lock pins, or rivets, and the attachment position thereof is between the LED substrates adjacent to each other in the plan view of the support plate 51 or the first. This is the third side plate.
In 3rd Embodiment, structures other than a control part are the same as 1st Embodiment.

（第３実施形態の効果）
第３実施形態は、第１実施形態の効果（１）〜（８）と同様の効果を奏する。
また、規制部１１１は、ＬＥＤ基板６ｍ〜６ｍ＋４、６ｐ〜６ｐ＋４を一括で規制する。このため、第１、第２実施形態と比べて、規制部の個数をさらに減らすことができる。 (Effect of the third embodiment)
The third embodiment has the same effects as the effects (1) to (8) of the first embodiment.
Moreover, the control part 111 controls LED board 6m-6m + 4 and 6p-6p + 4 collectively. For this reason, compared with 1st, 2nd embodiment, the number of a control part can further be reduced.

（第３実施形態の変形例）
図２０（ａ）及び（ｂ）は、第３実施形態におけるＬＥＤ基板６の取付状態の変形例を示す図である。詳しくは、図２０（ａ）はＬＥＤ基板６の取付状態を模式的に示す平面図であり、図２０（ｂ）は図２０（ａ）のＸ２０−Ｘ’２０断面を拡大した断面図である。図２０（ａ）及び（ｂ）に示すように、第３実施形態において、規制部１３１の長手方向の両端部に位置する取付部１３１ｃは、ヒートシンクの第１、第３の側板ではなく、支持板５１に取り付けられてもよい。このような構成であっても、上記の第３実施形態の効果と同様の効果を奏する。 (Modification of the third embodiment)
FIGS. 20A and 20B are diagrams showing a modification of the mounting state of the LED board 6 in the third embodiment. Specifically, FIG. 20A is a plan view schematically showing the mounting state of the LED substrate 6, and FIG. 20B is an enlarged cross-sectional view taken along the X20-X′20 section of FIG. . As shown in FIGS. 20A and 20B, in the third embodiment, the attachment portions 131c located at both ends in the longitudinal direction of the restriction portion 131 are not the first and third side plates of the heat sink but are supported. It may be attached to the plate 51. Even with such a configuration, the same effects as those of the third embodiment described above can be obtained.

＜第４実施形態＞
図２１（ａ）及び（ｂ）は、本発明の第４実施形態に係るＬＥＤ基板６の取付状態を模式的に示す図である。図２１（ａ）及び（ｂ）に示すように、ＬＥＤ照明装置１は、ＬＥＤ基板６の端部を覆ってその位置を規制する規制部として、規制部１４１を有する。この第４実施形態では、ヒートシンクの支持板５１には、その主面５１ａと背面５１ｂとの間に貫通穴が設けられている。規制部１４１は、背面５１ｂ側に配置された掛止板１４１ａを有する。この掛止板１４１ａの端片１４１ｂ、１４１ｃは、背面５１ｂ側から貫通穴を通して主面５１ａ側に突出し、この突出した先端部がＬＥＤ基板６の側に折り曲げられている。これにより、規制部１４１は、ＬＥＤ基板６を背面５１ｂ側から抱え込んでその位置を規制している。規制部１４１は、例えば金属等からなる。 <Fourth embodiment>
FIGS. 21A and 21B are views schematically showing the mounting state of the LED substrate 6 according to the fourth embodiment of the present invention. As shown in FIGS. 21A and 21B, the LED lighting device 1 includes a restricting portion 141 as a restricting portion that covers the end portion of the LED substrate 6 and restricts its position. In the fourth embodiment, the support plate 51 of the heat sink is provided with a through hole between the main surface 51a and the back surface 51b. The restricting portion 141 has a retaining plate 141a disposed on the back surface 51b side. The end pieces 141b and 141c of the retaining plate 141a protrude from the back surface 51b side through the through hole to the main surface 51a side, and the protruding tip is bent to the LED substrate 6 side. Thereby, the restriction | limiting part 141 holds the LED board 6 from the back surface 51b side, and has controlled the position. The restricting portion 141 is made of, for example, metal.

なお、規制部１４１の端片１４１ａ、１４１ｂは、ＬＥＤ基板６を必ずしも固定しなくてもよい。即ち、ＬＥＤ基板６側に折り曲げた後の端片１４１ｂ、１４１ｃと掛止板１４１ａとの離間距離は、ＬＥＤ基板６及び支持板５１とを合わせた厚みよりも多少大きくてもよく、規制部１４１とＬＥＤ基板６との間に遊び（即ち、密着せず、ある程度動きうる余裕）があってもよい。このような構成でも、規制部１４１はＬＥＤ基板６の鉛直方向及び水平方向への移動を規制できるので、ＬＥＤ照明装置１を天井等に設置した場合にＬＥＤ基板６が支持板５１から離れて、鉛直方向へ落下することを防ぐことができる。
（第４実施形態の効果）
第４実施形態は、第１実施形態の効果（１）、（３）〜（８）と同様の効果を奏する。 Note that the end pieces 141a and 141b of the restricting portion 141 do not necessarily have to fix the LED substrate 6. That is, the separation distance between the end pieces 141b and 141c and the retaining plate 141a after being bent toward the LED substrate 6 may be slightly larger than the combined thickness of the LED substrate 6 and the support plate 51, and the restricting portion 141. There may be play between the LED board 6 and the LED board 6 (that is, there is a margin that the LED board 6 does not adhere and can move to some extent). Even in such a configuration, the regulation unit 141 can regulate the movement of the LED board 6 in the vertical direction and the horizontal direction. Therefore, when the LED lighting device 1 is installed on a ceiling or the like, the LED board 6 is separated from the support plate 51, It can prevent falling in the vertical direction.
(Effect of 4th Embodiment)
The fourth embodiment has the same effects as the effects (1) and (3) to (8) of the first embodiment.

＜第５実施形態＞
図２２（ａ）及び（ｂ）は、本発明の第５実施形態に係るＬＥＤ基板６の取付状態を模式的に示す図である。詳しくは、図２２（ａ）はＬＥＤ基板６の取付状態を模式的に示す平面図である。また、図２２（ｂ）は、ＬＥＤ基板６の取付に用いられるヒートシンク側板の切込み部５４を拡大して示す斜視図である。 <Fifth Embodiment>
FIGS. 22A and 22B are views schematically showing the mounting state of the LED substrate 6 according to the fifth embodiment of the present invention. Specifically, FIG. 22A is a plan view schematically showing the mounting state of the LED substrate 6. FIG. 22B is an enlarged perspective view showing the notch portion 54 of the heat sink side plate used for mounting the LED substrate 6.

図２２（ｂ）に示すように、ヒートシンク５は、その第１の側板５５に切込み部５４が設けられている。また、図示しないが、第３の側板にも切込み部５４が設けられている。これらの切込み部５４が、支持板５１の主面５１ａ側に折り曲げられることによって、第１の側板５５や第３の側板に隣接するＬＥＤ基板６を、主面５１ａ側に固定することができる。   As shown in FIG. 22B, the heat sink 5 is provided with a cut portion 54 in the first side plate 55. Although not shown, the third side plate is also provided with a cut portion 54. The LED board 6 adjacent to the first side plate 55 and the third side plate can be fixed to the main surface 51a side by bending these cut portions 54 toward the main surface 51a side of the support plate 51.

例えば、第１の側板５５に設けられた切込み部５４を、第１の側板５５に隣接するＬＥＤ基板６ｐ＋４の側に折り曲げる。これにより、図２２（ａ）に示すように、ＬＥＤ基板６ｐ＋４の長手方向に沿う両端部のうち、第１の側板の側に位置する端部を切込み部５４で固定する。ＬＥＤ基板６ｐ＋４の長手方向に沿う両端部のうち、第１の側板の反対側に位置する端部は、例えば規制部１１１で固定する。   For example, the cut portion 54 provided in the first side plate 55 is bent toward the LED substrate 6p + 4 adjacent to the first side plate 55. Thereby, as shown to Fig.22 (a), the edge part located in the 1st side plate side is fixed by the notch part 54 among the both ends along the longitudinal direction of LED board 6p + 4. Of both end portions along the longitudinal direction of the LED substrate 6p + 4, an end portion located on the opposite side of the first side plate is fixed by, for example, the restriction portion 111.

同様に、第３の側板に設けられた切込み部５４を、第３の側板に隣接するＬＥＤ基板６ｍ＋４の側に折り曲げる。これにより、図２２（ａ）に示すように、ＬＥＤ基板６ｍ＋４の長手方向に沿う両端部のうち、第３の側板の側に位置する端部を切込み部５４で固定する。ＬＥＤ基板６ｐ＋４の長手方向に沿う両端部のうち、第３の側板の反対側に位置する端部は、例えば規制部１１１で固定する。   Similarly, the cut portion 54 provided in the third side plate is bent toward the LED substrate 6m + 4 adjacent to the third side plate. Thereby, as shown to Fig.22 (a), the edge part located in the side of the 3rd side board among the both ends along the longitudinal direction of LED board 6m + 4 is fixed with the notch part 54. FIG. Of the both end portions along the longitudinal direction of the LED substrate 6p + 4, the end portion located on the opposite side of the third side plate is fixed by, for example, the restriction portion 111.

なお、ＬＥＤ基板６の側に折り曲げた切込み部５４は、ＬＥＤ基板６を必ずしも固定しなくてもよい。折り曲げた後の切込み部５４とＬＥＤ基板６との間に遊び（即ち、密着せず、ある程度動きうる余裕）があってもよい。このような構成でも、切込み部５４はＬＥＤ基板６の鉛直方向及び水平方向への移動を規制できるので、ＬＥＤ照明装置１を天井等に設置した場合にＬＥＤ基板６が支持板５１から離れて、鉛直方向へ落下することを防ぐことができる。   Note that the cut portion 54 bent toward the LED substrate 6 does not necessarily fix the LED substrate 6. There may be play (that is, there is room for movement to some extent without close contact) between the cut portion 54 after bending and the LED substrate 6. Even in such a configuration, the notch 54 can regulate the movement of the LED substrate 6 in the vertical direction and the horizontal direction, so when the LED lighting device 1 is installed on the ceiling or the like, the LED substrate 6 is separated from the support plate 51, It can prevent falling in the vertical direction.

＜第５実施形態の効果＞
第５実施形態は、第１実施形態の効果（１）〜（８）と同様の効果を奏する。
また、ＬＥＤ基板６の位置規制に切込み部５４を用いることにより、使用する規制部の個数を減らすことができる。例えば、規制部１１１や、側板に固定される規制部１１６の個数を減らすことができる。 <Effect of Fifth Embodiment>
The fifth embodiment has the same effects as the effects (1) to (8) of the first embodiment.
Moreover, the number of the control parts to be used can be reduced by using the notch part 54 for the position control of the LED board 6. For example, the number of restricting portions 111 and restricting portions 116 fixed to the side plates can be reduced.

＜その他＞
本発明は、以上に記載した各実施形態や各変形例に限定されるものではない。当業者の知識に基づいて各実施形態や各変形例に設計の変更等を加えてもよく、また、これらを任意に組み合わせてもよく、そのような変更が加えられた態様も本発明の範囲に含まれる。 <Others>
The present invention is not limited to each embodiment and each modification described above. Based on the knowledge of those skilled in the art, design changes or the like may be added to each embodiment or each modification, and these may be arbitrarily combined, and an aspect in which such a change is added is also within the scope of the present invention. include.

本発明の実施例として、パネル径ごとに、光束、ヒートシンクの面積、ＬＥＤ基板のサイズ及びＬＥＤ基板間の距離を示す。なお、パネル径とは、図２に示したカバーパネル９のパネル板９１の径（縦、横の一辺の長さ）のことである。また、ヒートシンクの面積とは、図２に示したヒートシンク５の支持板５１の面積のことである。   As an embodiment of the present invention, the light flux, the area of the heat sink, the size of the LED substrate, and the distance between the LED substrates are shown for each panel diameter. The panel diameter is the diameter (length of one side in the vertical and horizontal directions) of the panel plate 91 of the cover panel 9 shown in FIG. The area of the heat sink means the area of the support plate 51 of the heat sink 5 shown in FIG.

Figure 2015191892
Figure 2015191892

１ ＬＥＤ照明装置
２ ＬＥＤユニット
３ 収容取付部
５ ヒートシンク
６ ＬＥＤ基板
６ａ 第１の領域
６ｂ 第２の領域
７ ＬＥＤ点灯装置
８ 反射シート
９ パネル板
９ カバーパネル
１０、１０Ａ 第１のＬＥＤ照明回路
１１、２１ 配線
２０ 第２の照明回路
３１ 本体
３１ａ 貫通穴
３２ 第１の側板
３３ 第２の側板
３４ 補強板
３５ バネ受け金具
３６ 第３の側板
３６ａ 、３７ａ 係止部
３７ 第４の側板
３８ 凹部
４１ バネ金具
４１ａ、４２ｂ アーム部
４２ 取付金具
５１ 支持板
５１ａ 主面
５１ｂ 背面
５３ａ、５３ｂ 貫通穴
５４ 切込み部
５５ 第１の側板
５６ 第２の側板
５７ 第３の側板
５８ 第４の側板
５９ 締結部材
６１ 第１のＬＥＤ素子回路
６１ａ、６２ａ 第１のＬＥＤ素子群
６１ｂ、６２ｂ 第２のＬＥＤ素子群
６１ｃ、６２ｃ 第３のＬＥＤ素子群
６１ｄ、６２ｄ 第４のＬＥＤ素子群
６１ｅ、６２ｅ 第５のＬＥＤ素子群
６２ 第２のＬＥＤ素子回路
６３ 導電層
６４ 保護層
６５ ＬＥＤ素子
６６ 抵抗素子
６７ 第１のコネクタ
６７ａ 第１のメス穴
６７ｂ 第２のメス穴
６７ｃ 第１のピン端子
６７ｄ 第２のピン端子
６８ 第２のコネクタ
６９ 貫通穴
７１ 第１の点灯装置
７１ａ、７２ａ 第１の配線
７１ｂ、７２ｂ 第２の配線
７２ 第２の点灯装置
８１ 主面反射シート
８１ａ 端部
８２ 第１の開口部
８３ 第２の開口部
８５ 第１の側面反射シート
８６ 第２の側面反射シート
８７ 第３の側面反射シート
８８ 第４の側面反射シート
９１ パネル板
９２ 枠体
９５ 第１のフレーム
９６ 第２のフレーム
９７ 第３のフレーム
９８ 第４のフレーム
９９ 連結部材
１１１、１１６、１２１、１３１、１４１ 規制部
１１１ａ、１１６ａ、１２１ａ、１２１ｂ、１３１ａ 被覆部
１１１ｂ、１１６ｂ、１３１ｂ 取付部
１１２、１１７、１２２ 締結部材
１４１ａ 掛止板
１４１ｂ、１４１ｃ 端片
１７１ 筐体
１７２ 貫通穴
１７３ 蓋体
１７４ 切欠き部 DESCRIPTION OF SYMBOLS 1 LED lighting apparatus 2 LED unit 3 Housing attachment part 5 Heat sink 6 LED board 6a 1st area | region 6b 2nd area | region 7 LED lighting device 8 Reflective sheet 9 Panel board 9 Cover panel 10, 10A 1st LED illumination circuit 11, 21 Wiring 20 Second lighting circuit 31 Main body 31a Through hole 32 First side plate 33 Second side plate 34 Reinforcement plate 35 Spring receiving bracket 36 Third side plate 36a, 37a Locking portion 37 Fourth side plate 38 Recess 41 Spring Metal fittings 41a, 42b Arm portion 42 Mounting metal fitting 51 Support plate 51a Main surface 51b Rear surface 53a, 53b Through hole 54 Cut portion 55 First side plate 56 Second side plate 57 Third side plate 58 Fourth side plate 59 Fastening member 61 First LED element circuit 61a, 62a 1st LED element group 61b, 62b 2nd LED element group 61c, 62c 3rd LED element 61d, 62d Fourth LED element group 61e, 62e Fifth LED element group 62 Second LED element circuit 63 Conductive layer 64 Protective layer 65 LED element 66 Resistive element 67 First connector 67a First female hole 67b First Second female hole 67c First pin terminal 67d Second pin terminal 68 Second connector 69 Through hole 71 First lighting device 71a, 72a First wiring 71b, 72b Second wiring 72 Second lighting device 81 Main surface reflection sheet 81a End portion 82 First opening 83 Second opening 85 First side reflection sheet 86 Second side reflection sheet 87 Third side reflection sheet 88 Fourth side reflection sheet 91 Panel Plate 92 Frame 95 First frame 96 Second frame 97 Third frame 98 Fourth frame 99 Connecting member 111, 116, 121, 131, 141 Restriction 111a, 116a, 121a, 121b, 131a covering portion 111b, 116b, 131b mounting portion 112,117,122 fastening member 141a Kaketomeban 141b, 141c end piece 171 housing 172 through hole 173 lid 174 notch

また、上記のＬＥＤ照明装置において、前記支持部は、前記第１の面を有する支持板と、前記支持板の外周部に沿って設けられた側板とを有し、前記側板には切込み部が設けられており、前記切込み部は、前記第１の面側に折り曲げられることによって、前記側板に隣接する前記ＬＥＤ基板の位置を規制することを特徴とする。
本発明の別の態様に係るＬＥＤ照明装置は、第１の面と、前記第１の面の反対に位置する第２の面とを有し、前記第１の面と前記第２の面との間に貫通穴が設けられた支持部と、前記第１の面側に配置された２枚以上のＬＥＤ基板と、前記ＬＥＤ基板の位置を規制する規制部とを備え、前記規制部は、前記第２の面側に配置された掛止板を有し、該掛止板の端片が前記第２の面側から前記貫通穴を通して前記第１の面側に突出し、該突出した先端部が前記ＬＥＤ基板の側に折り曲げられて該ＬＥＤ基板の位置を規制していることを特徴とする。
本発明のさらに別の態様に係るＬＥＤ照明装置は、支持部と、前記支持部の一方の面側に配置された２枚以上のＬＥＤ基板と、前記一方の面側に配置されて、前記２枚以上のＬＥＤ基板のうちのｎ（ｎは２以上の整数）枚のＬＥＤ基板の各位置を一括で規制する規制部とを備え、前記ｎ枚のＬＥＤ基板の各々は平面視で第１の側端と第２の側端とを有し、前記規制部は、前記ｎ枚のＬＥＤ基板の各々を前記第１の側端から前記第２の側端にかけて連続して覆うことを特徴とする。 In the LED lighting device, the support portion includes a support plate having the first surface and a side plate provided along an outer peripheral portion of the support plate, and the side plate has a cut portion. The cut portion is bent toward the first surface to restrict the position of the LED substrate adjacent to the side plate.
The LED lighting device according to another aspect of the present invention includes a first surface and a second surface located opposite to the first surface, the first surface and the second surface, A support portion provided with a through-hole between, two or more LED substrates disposed on the first surface side, and a restriction portion for restricting the position of the LED substrate, the restriction portion, A latch plate disposed on the second surface side, and an end piece of the latch plate projects from the second surface side to the first surface side through the through hole, and the projecting tip portion Is bent to the LED substrate side to regulate the position of the LED substrate.
The LED lighting device according to yet another aspect of the present invention includes a support portion, two or more LED substrates disposed on one surface side of the support portion, and disposed on the one surface side. A regulating unit that collectively regulates the positions of n (n is an integer of 2 or more) LED substrates among the plurality of LED substrates, and each of the n LED substrates is a first in a plan view. It has a side end and a second side end, and the restricting portion covers each of the n LED boards continuously from the first side end to the second side end. .

Claims (7)

第１の面を有する支持部と、
前記第１の面側に配置された２枚以上のＬＥＤ基板と、
前記ＬＥＤ基板の少なくとも端部を覆って該ＬＥＤ基板の位置を規制する規制部とを備
え、
前記規制部を前記支持部に取り付ける締結部材は、平面視で前記ＬＥＤ基板から離れて
おり、
前記支持部は、前記第１の面を有する支持板と、前記支持板の外周部に沿って設けられ
た側板とを有し、
前記側板には切込み部が設けられており、
前記２枚以上のＬＥＤ基板は前記側板に隣接する第１のＬＥＤ基板を有し、
前記第１のＬＥＤ基板の位置は、
前記切込み部が前記第１のＬＥＤ基板の側に折り曲げられて前記第１のＬＥＤ基板の長
手方向に沿う両端部のうち前記側板の側に位置する端部を覆い、且つ、前記規制部が前記
第１のＬＥＤ基板の長手方向に沿う両端部のうち前記側板の反対側に位置する端部を覆う
ことによって規制されることを特徴とするＬＥＤ照明装置。 A support having a first surface;
Two or more LED substrates disposed on the first surface side;
A regulation portion that covers at least an end of the LED substrate and regulates the position of the LED substrate;
The fastening member for attaching the restricting portion to the support portion is separated from the LED substrate in plan view,
The support portion includes a support plate having the first surface, and a side plate provided along an outer peripheral portion of the support plate,
The side plate is provided with a notch,
The two or more LED substrates have a first LED substrate adjacent to the side plate,
The position of the first LED substrate is:
The cut portion is bent to the side of the first LED substrate to cover the end portion located on the side plate side of both end portions along the longitudinal direction of the first LED substrate, and the regulating portion is The LED lighting device is characterized by being restricted by covering an end portion located on the opposite side of the side plate among both end portions along the longitudinal direction of the first LED substrate. 前記規制部は、前記２枚以上のＬＥＤ基板のうちのｎ（ｎは２以上の整数）枚の各位置
を一括で規制することを特徴とする請求項１に記載のＬＥＤ照明装置。 2. The LED lighting device according to claim 1, wherein the restricting unit restricts each position of n (n is an integer of 2 or more) of the two or more LED substrates at a time. 前記２枚以上のＬＥＤ基板は平面視で一方向に離間して並び、
前記規制部は前記一方向に延設されていることを特徴とする請求項２に記載のＬＥＤ照
明装置。 The two or more LED substrates are spaced apart in one direction in plan view,
The LED lighting device according to claim 2, wherein the restricting portion extends in the one direction. 前記規制部を複数備え、
前記複数の規制部は、平面視で互いに離間して設けられていることを特徴とする請求項
３に記載のＬＥＤ照明装置。 A plurality of the restriction portions are provided,
The LED lighting device according to claim 3, wherein the plurality of restricting portions are provided apart from each other in a plan view. 前記規制部は、前記第１の面のうち前記ＬＥＤ基板間の領域に取り付けられていること
を特徴とする請求項１から請求項４の何れか一項に記載のＬＥＤ照明装置。 5. The LED illumination device according to claim 1, wherein the restricting portion is attached to a region between the LED substrates in the first surface. 前記支持部は、前記第１の面を有する支持板と、前記支持板の外周部に沿って設けられ
た側板とを有し、
前記規制部は、前記側板に取り付けられていることを特徴とする請求項１から請求項５
の何れか一項に記載のＬＥＤ照明装置。 The support portion includes a support plate having the first surface, and a side plate provided along an outer peripheral portion of the support plate,
The said restriction | limiting part is attached to the said side plate, The Claims 1-5 characterized by the above-mentioned.
LED lighting apparatus as described in any one of these. 第１の面と、前記第１の面の反対に位置する第２の面とを有し、前記第１の面と前記第
２の面との間に複数の貫通穴が設けられた支持部と、
前記第１の面側に配置された２枚以上のＬＥＤ基板と、
前記ＬＥＤ基板の位置を規制する規制部とを備え、
前記規制部は、前記第２の面側に配置された掛止板を有し、
前記ＬＥＤ基板の位置は、
前記掛止板の第１の端片が前記第２の面側から前記複数の貫通穴のうちの第１の貫通穴
を通して前記第１の面側に突出し、該突出した先端部が前記ＬＥＤ基板の側に折り曲げら
れ、且つ、前記掛止板の第２の端片が前記第２の面側から前記複数の貫通穴のうちの第２
の貫通穴を通して前記第１の面側に突出し、該突出した先端部が前記ＬＥＤ基板の側に折
り曲げられることによって規制されることを特徴とするＬＥＤ照明装置。 A support portion having a first surface and a second surface located opposite to the first surface, wherein a plurality of through holes are provided between the first surface and the second surface. When,
Two or more LED substrates disposed on the first surface side;
A regulation part for regulating the position of the LED substrate;
The restricting portion has a retaining plate disposed on the second surface side,
The position of the LED substrate is
A first end piece of the retaining plate protrudes from the second surface side through the first through hole of the plurality of through holes to the first surface side, and the protruding tip portion is the LED substrate. And the second end piece of the retaining plate is a second of the plurality of through holes from the second surface side.
The LED lighting device is characterized by protruding toward the first surface through the through-hole and being regulated by bending the protruding tip portion toward the LED substrate.
JP2015091409A 2015-04-28 2015-04-28 Led lighting device Pending JP2015191892A (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010146914A1 (en) * 2009-06-15 2010-12-23 シャープ株式会社 Illuminating device, display device, and television receiver
WO2010146918A1 (en) * 2009-06-15 2010-12-23 シャープ株式会社 Illumination device, display device, and television receiver
JP2012115172A (en) * 2010-11-30 2012-06-21 Showa Denko Aluminum Trading Kk Led lighting system

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010146914A1 (en) * 2009-06-15 2010-12-23 シャープ株式会社 Illuminating device, display device, and television receiver
WO2010146918A1 (en) * 2009-06-15 2010-12-23 シャープ株式会社 Illumination device, display device, and television receiver
JP2012115172A (en) * 2010-11-30 2012-06-21 Showa Denko Aluminum Trading Kk Led lighting system

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