JP2015186237A - Piezoelectric vibration piece and piezoelectric vibrator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a piezoelectric vibration piece which has excellent mounting stability.SOLUTION: A piezoelectric vibration piece 10 comprises: a piezoelectric plate 20 which has a first principal surface 21 and a second principal surface 23; a first projecting part 31 formed on the first principal surface 21; a first excitation electrode 51 formed on the apex 31a of the first projecting part 31; a second excitation electrode 53 formed on the second principal surface 23 so as to be overlapped with the first excitation electrode 51 in a view from the thickness direction of the piezoelectric plate 20; and a pair of mount electrodes 55 formed in the periphery of the second excitation electrode 53 of the second principal surface 23 and connected with the first excitation electrode 51 and the second excitation electrode 53. The piezoelectric vibration piece 10 comprises first protrusions 41 formed integrally with the piezoelectric plate 20 on the first principal surface 21, and at least a part of the first protrusions 41 is formed overlapped with the mount electrodes 55 in the view from the thickness direction of the piezoelectric plate 20.

Description

  The present invention relates to a piezoelectric vibrating piece and a piezoelectric vibrator.

  For example, a piezoelectric vibrator using crystal is used as a time source, a control signal timing source, a reference signal source, and the like in a cellular phone, a portable information terminal device, a radio timepiece, and the like. Conventionally, a piezoelectric vibrator is stored in a state in which a piezoelectric vibrating piece is fixed to a package by a mounting adhesive. In this case, when the piezoelectric vibrating piece is mounted obliquely with respect to the package and the tip of the piezoelectric vibrating piece comes into contact with the package, vibration characteristic abnormality or damage of the piezoelectric vibrating piece occurs. Therefore, for example, as described in Patent Document 1, a configuration is known in which the tip of a piezoelectric vibrating piece is held in a state of being lifted from a package.

JP 2013-197801 A

  However, since the above-described piezoelectric vibrating piece has a convex structure at the center, the piezoelectric vibrating piece is adsorbed and held at the top of the convex when mounted on a package. When the piezoelectric vibrating piece is pressed and mounted in this state in this state, as shown in FIG. 13, the holding portion A by the suction means 70 of the piezoelectric vibrating piece 5 which is a power point, and the mounting adhesive 93 which is an action point The contact portion B does not overlap when viewed from the pressing direction, and a moment is generated in the piezoelectric vibrating piece 5. As a result, the piezoelectric vibrating piece 5 rotates about the contact portion B of the mounting adhesive 93 as the rotation axis, and the posture of the piezoelectric vibrating piece 5 is inclined with respect to the package 80. Therefore, high mounting accuracy is required to mount the piezoelectric vibrating piece with the tip of the piezoelectric vibrating piece floating from the package.

  Accordingly, the present invention provides a piezoelectric vibrating piece with excellent mounting stability. Moreover, the piezoelectric vibrator provided with the said piezoelectric vibrating piece is provided.

In order to solve the above problems, a piezoelectric vibrating piece according to the present invention includes a piezoelectric plate having a first main surface and a second main surface, a first convex portion formed on the first main surface, and the first A first excitation electrode formed on the top of a convex portion; a second excitation electrode formed on the second main surface so as to overlap the first excitation electrode when viewed from the thickness direction of the piezoelectric plate; A pair of mount electrodes formed around the second excitation electrode on the second main surface and connected to the first excitation electrode and the second excitation electrode, and integrally formed with the piezoelectric plate on the first main surface A first protrusion formed, and at least a part of the first protrusion is formed so as to overlap the mount electrode when viewed from the thickness direction of the piezoelectric plate.
According to the present invention, the piezoelectric vibrating piece has the first protrusion formed at a position overlapping the mount electrode when viewed from the thickness direction of the piezoelectric plate. At the time of mounting the piezoelectric vibrating piece, if the piezoelectric vibrating piece is pressed and mounted in the thickness direction of the piezoelectric plate, the first protrusion comes into contact with the suction means that holds the piezoelectric vibrating piece. Therefore, rotation about the contact portion of the piezoelectric vibrating piece with the mounting adhesive as a rotation axis is limited, and the inclination of the posture of the piezoelectric vibrating piece can be suppressed. Therefore, a piezoelectric vibrating piece with excellent mounting stability can be obtained.

In the above-described piezoelectric vibrating piece, it is desirable that the first protrusion is formed at the same height as the top of the first convex portion.
According to this configuration, when the piezoelectric vibrating piece is mounted, the piezoelectric vibrating piece suction means is parallel to the first main surface and the second main surface of the piezoelectric plate including the top portion of the first protrusion and the top portion of the first convex portion. The piezoelectric vibrating piece can be adsorbed and held on a flat surface. As a result, when the piezoelectric vibrating piece is pressed in the thickness direction of the piezoelectric plate, the holding portion of the piezoelectric vibrating piece that is the power point and the contact portion of the mounting adhesive that is the action point overlap when viewed from the pressing direction. Therefore, even if the piezoelectric vibrating piece is further applied after contact with the mounting adhesive, no moment is generated, so that it does not tilt and can be mounted parallel to the package. Therefore, a piezoelectric vibrating piece with more excellent mounting stability can be obtained.

In the above piezoelectric vibrating piece, it is preferable that the first protrusion is formed higher than a top portion of the first convex portion.
According to this configuration, when the piezoelectric vibrating piece is mounted, the piezoelectric vibrating piece can be sucked and held in a state where the sucking means is in contact with the top portion of the first protrusion and the peripheral portion of the first convex portion. Therefore, the adsorbing means does not contact the first excitation electrode, can prevent the first excitation electrode from being damaged, and can suppress the deterioration of the vibration characteristics of the piezoelectric vibrating piece. Therefore, a piezoelectric vibrating piece having excellent vibration characteristics can be obtained.

In the piezoelectric vibrating piece described above, it is preferable that a second protrusion is formed on the opposite side of the first protrusion with the first protrusion interposed therebetween.
According to this configuration, when the piezoelectric vibrating piece is mounted, the piezoelectric vibrating piece can be sucked and held in a state in which the piezoelectric vibrating piece suction means is in contact with the top of the first protrusion and the top of the second protrusion. Since the second protrusion is formed on the opposite side of the first protrusion across the first protrusion, the center of gravity of the piezoelectric vibrating piece can be shifted from the first protrusion side to the second protrusion side. That is, since it becomes possible to bring the center area of the suction means closer to the center of gravity of the piezoelectric vibrating piece, it becomes easier to suck the piezoelectric vibrating piece near the center of gravity of the piezoelectric vibrating piece, and the posture of the piezoelectric vibrating piece in the suctioned state is stabilized. Can be made. Since the first protrusion and the second protrusion are formed at the same height, the plane including the top of the first protrusion and the top of the second protrusion is parallel to the first main surface and the second main surface of the piezoelectric plate. It is. Therefore, even if the piezoelectric vibrating piece is pressed in the thickness direction of the piezoelectric plate, the piezoelectric vibrating piece does not tilt, so that the piezoelectric vibrating piece can be mounted in parallel to the package. Further, the suction means does not contact the first convex portion and the first excitation electrode, can prevent the first convex portion and the first excitation electrode from being damaged, and can suppress the deterioration of the vibration characteristics of the piezoelectric vibrating piece. Therefore, a piezoelectric vibrating piece with more excellent mounting stability and vibration characteristics can be obtained.

The piezoelectric vibrating piece includes a first bump formed on the second main surface, wherein at least a part of the first bump is seen from the thickness direction of the piezoelectric plate and the first electrode. It is desirable that the mount electrode is formed in an overlapping region, and at least a part of the mount electrode is formed in the overlapping region at the top of the first bump.
According to this configuration, when the piezoelectric vibrating piece is mounted, the mount electrode on the top of the first bump first comes into contact with the mounting adhesive. At this time, since the first bump overlaps the first protrusion when viewed from the thickness direction of the piezoelectric plate, the holding portion of the piezoelectric vibrating piece that is the power point and the contact portion of the mounting adhesive that is the action point are from the pressing direction. Duplicate to see. Therefore, even if the piezoelectric vibrating piece is pressed in the thickness direction of the piezoelectric plate, the piezoelectric vibrating piece does not tilt, so that the piezoelectric vibrating piece can be mounted in parallel to the package. Furthermore, since the mounting adhesive contacts from the top part to the side surface of the first bump, it is possible to suppress the wetting and spreading of the mounting adhesive in the surface direction of the piezoelectric plate. Therefore, it is possible to prevent deterioration and variation in the vibration characteristics of the piezoelectric vibrating piece due to the wet spread of the mounting adhesive. Therefore, it is possible to obtain a piezoelectric vibrating piece with more excellent mounting stability and vibration characteristics.

In the piezoelectric vibrating piece, the piezoelectric plate has a second convex portion formed on the second main surface, and the second excitation electrode is formed on a top portion of the second convex portion. Is desirable.
According to this configuration, the piezoelectric vibrating piece can confine the vibration energy to the second convex portion with high accuracy, and can suppress an increase in crystal impedance (CI value) due to vibration leakage. Therefore, a piezoelectric vibrating piece with more excellent vibration characteristics can be obtained.

In the above-described piezoelectric vibrating piece, it is preferable that the piezoelectric plate is formed by AT cut.
According to this configuration, it is possible to provide an AT-cut vibrating piece with excellent mounting stability.

A piezoelectric vibrator of the present invention includes the above-described piezoelectric vibrating piece and a package having a base member on which the piezoelectric vibrating piece is mounted, and the piezoelectric vibrating piece faces the second main surface toward the base member. Mounted on the base member.
According to this configuration, since the piezoelectric vibrator includes the above-described piezoelectric vibrating piece having excellent mounting stability, it is possible to obtain a piezoelectric vibrator free from abnormal vibration characteristics or damage of the piezoelectric vibrating piece.

  According to the piezoelectric vibrating piece of the present invention, the piezoelectric vibrating piece has the first protrusion formed at a position overlapping the mount electrode when viewed from the thickness direction of the piezoelectric plate. At the time of mounting the piezoelectric vibrating piece, if the piezoelectric vibrating piece is pressed and mounted in the thickness direction of the piezoelectric plate, the first protrusion comes into contact with the suction means that holds the piezoelectric vibrating piece. Therefore, rotation about the contact portion of the piezoelectric vibrating piece with the mounting adhesive as a rotation axis is limited, and the inclination of the posture of the piezoelectric vibrating piece can be suppressed. Therefore, a piezoelectric vibrating piece with excellent mounting stability can be obtained.

It is the schematic of the piezoelectric vibrating piece which concerns on 1st Embodiment, (a) is a top view, (b) is sectional drawing in the II line | wire of (a). It is sectional drawing which shows the structure of the piezoelectric vibrator which concerns on 1st Embodiment. It is sectional drawing in the part corresponded to the II line | wire of Fig.1 (a) of the other piezoelectric vibrating piece which concerns on 1st Embodiment. FIG. 6 is a plan view of another piezoelectric vibrating piece according to the first embodiment. FIG. 6 is a plan view of another piezoelectric vibrating piece according to the first embodiment. FIG. 6 is a plan view of another piezoelectric vibrating piece according to the first embodiment. FIG. 6 is a plan view of another piezoelectric vibrating piece according to the first embodiment. It is sectional drawing in the part corresponded to the II line | wire of FIG. 1 of the piezoelectric vibrating piece which concerns on 2nd Embodiment. It is the schematic of the piezoelectric vibrating piece which concerns on the 1st modification of 2nd Embodiment, (a) is a top view, (b) or (c) is sectional drawing in the IX-IX line of (a). It is the schematic of the piezoelectric vibrating piece which concerns on 3rd Embodiment, (a) is a top view, (b) or (c) is sectional drawing in the XX line of (a). It is the schematic of the other piezoelectric vibrating piece which concerns on 3rd Embodiment. It is sectional drawing which shows the structure of the piezoelectric vibrator which concerns on 3rd Embodiment. It is sectional drawing which shows the prior art example in which a piezoelectric vibrating piece inclines and is mounted.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In describing the configuration of each figure, an XY′Z ′ coordinate system is used. Each axis in this XY′Z ′ coordinate system is 35 degrees 15 minutes around the X axis with respect to the Z axis, the X axis being the electrical axis and the Z ′ axis being the optical axis, among the crystal axes of the crystal described later. The Y ′ axis is an axis orthogonal to the X axis and the Z ′ axis. In the X direction, the Y ′ direction, and the Z ′ direction, the arrow direction in FIG.

(First Embodiment, Piezoelectric Vibrating Piece and Piezoelectric Vibrator)
First, the piezoelectric vibrating piece and the piezoelectric vibrator of the first embodiment will be described.
1A and 1B are schematic views of the piezoelectric vibrating piece according to the first embodiment, in which FIG. 1A is a plan view and FIG. 1B is a cross-sectional view taken along line II of FIG.

  As shown in FIG. 1, the piezoelectric vibrating piece 10 of the present embodiment includes a piezoelectric plate 20 having a first main surface 21 and a second main surface 23, and a first convex portion 31 formed on the first main surface 21. The first excitation electrode 51 formed on the top 31a of the first convex portion 31 and the second excitation electrode 53 formed so as to overlap the first excitation electrode 51 when viewed from the Y ′ direction on the second main surface 23. And a pair of mount electrodes 55 formed around the second excitation electrode 53 on the second main surface 23 and connected to the first excitation electrode 51 and the second excitation electrode 53. The piezoelectric vibrating piece 10 includes a first protrusion 41 formed integrally with the piezoelectric plate 20 on the first main surface 21, and at least a part of the first protrusion 41 is a mount electrode as viewed from the Y ′ direction. 55 to overlap.

The piezoelectric vibrating piece 10 includes a piezoelectric plate 20 having a first main surface 21 and a second main surface 23.
The piezoelectric plate 20 is formed into a rectangular plate shape having a predetermined thickness by AT cut from artificial quartz crystal processed by lumbar processing.
The AT cut is 35 degrees around the X axis with respect to the Z axis among the three crystal axes of the electric axis (X axis), the mechanical axis (Y axis), and the optical axis (Z axis), which are crystal axes of artificial quartz. This is a processing method of cutting in a direction inclined by 15 minutes (Z′-axis direction). The piezoelectric plate 20 cut out by the AT cut has the advantage that the frequency temperature characteristic is stable, the structure and shape are simple, the processing is easy, and the CI value is low. The piezoelectric plate 20 of this embodiment is formed so that the length in the Z ′ direction is longer than the length in the X direction. The piezoelectric plate 20 has a first main surface 21 formed on the + Y ′ direction side parallel to the XZ ′ plane and a second main surface 23 formed on the −Y ′ direction side.

The piezoelectric vibrating piece 10 has a first convex portion 31 formed on the first main surface 21.
The first convex portion 31 has a so-called mesa shape formed on the first main surface 21, has a rectangular shape when viewed in the Y ′ direction, and is formed at the position of the central portion of the first main surface 21. The top portion 31 a of the first convex portion 31 is formed in a planar shape parallel to the first main surface 21.

Further, the piezoelectric vibrating piece 10 has a second convex portion 33 formed on the second main surface 23.
The 2nd convex part 33 is what is called a mesa shape formed in the 2nd main surface 23, and is formed in the same shape and position as the 1st convex part 31 in Y 'direction view. The top 33 a of the second convex portion 33 is formed in a planar shape parallel to the second main surface 23.
FIG. 3 is a cross-sectional view of another piezoelectric vibrating piece according to the first embodiment at a portion corresponding to the line I-I in FIG. As shown in FIG. 3, the piezoelectric vibrating piece 10 may not have the second convex portion on the second main surface 23 of the piezoelectric plate 20. Accordingly, since the gap between the piezoelectric vibrating piece 10 and the package mounting surface can be widened, the possibility that the piezoelectric vibrating piece 10 contacts the package can be reduced even if an external force acts on the piezoelectric vibrating piece 10 and the posture is inclined. . Further, the mounting adhesive to be brought into contact with the mount electrode 55 does not come into contact with the second convex portion to deteriorate the vibration characteristics.

As shown in FIG. 1, the piezoelectric vibrating reed 10 includes a first excitation electrode 51 as viewed from the Y ′ direction on the first excitation electrode 51 formed on the top 31 a of the first protrusion 31 and the second main surface 23. A second excitation electrode 53 formed so as to overlap with the electrode 51.
The first excitation electrode 51 has a rectangular shape as viewed in the Y ′ direction, and is formed at a position inside the top portion 31 a of the first convex portion 31. The second excitation electrode 53 is provided at a position inside the top portion 33a of the second convex portion 33 and is formed so as to overlap the first excitation electrode 51 when viewed in the Y ′ direction. In this way, by forming the first convex portion 31 and the second convex portion 33, and the first excitation electrode 51 and the second excitation electrode 53, it is possible to confine the vibration energy in the central portion of the piezoelectric vibrating piece 10 with high accuracy. And vibration characteristics can be stabilized.

Further, the piezoelectric vibrating piece 10 includes a first excitation electrode 51 and a pair of mount electrodes 55 connected to the second excitation electrode 53 and formed around the second excitation electrode 53 on the second main surface 23.
The mount electrode 55 includes a first mount electrode 55a and a second mount electrode 55b. The first mount electrode 55 a is formed in a rectangular shape when viewed in the Y ′ direction, and is provided at a corner of the second main surface 23 on the + X side and the −Z ′ side so as not to overlap the second excitation electrode 53. ing. The first mount electrode 55a is connected via the first connection portion 61 formed on at least one of the + X side surface and the −Z ′ side surface (the + X side surface in this embodiment) of the piezoelectric plate 20. The first mount back electrode 65 formed on the first main surface 21 is connected. The first mount back electrode 65 is formed so as to overlap the first mount electrode 55 a when viewed in the Y ′ direction, and is connected to the first excitation electrode 51 via a lead wiring 57.
The second mount electrode 55 b is formed in a rectangular shape as viewed in the Y ′ direction, and is provided at a corner of the second main surface 23 on the −X side and the −Z ′ side so as not to overlap the second excitation electrode 53. It has been. The second mount electrode 55 b is connected to the second excitation electrode 53 via the lead wiring 59. Further, the second mount electrode 55b is connected via a second connection portion 63 formed on at least one of the −X side surface and the −Z side surface (the −X side surface in the present embodiment) of the piezoelectric plate 20. The second mount back electrode 67 formed on the first main surface 21 is connected. The second mount back electrode 67 is formed so as to overlap the second mount electrode 55b when viewed in the Y ′ direction.

  The excitation electrode, mount electrode, routing wiring, mount back electrode, and connecting portion described above are laminated with a single layer film of metal such as gold, or a metal such as chromium as an underlayer and a metal such as gold as an upper layer. It is formed of a film or the like.

The piezoelectric vibrating piece 10 has a first protrusion 41 formed integrally with the piezoelectric plate 20 on the first main surface 21, and at least a part of the first protrusion 41 is a mount electrode when viewed from the Y ′ direction. 55 to overlap.
The piezoelectric vibrating piece 10 of this embodiment includes a pair of first protrusions 41. The first protrusion 41 is formed in, for example, an elliptical columnar shape when viewed in the Y ′ direction, and is formed in a rectangular shape or a trapezoidal shape when viewed in the X direction and the Z ′ direction. The top portion of the first protrusion 41 is formed in a flat shape, and can hold the piezoelectric vibrating piece 10 in a wider area when the piezoelectric vibrating piece 10 is held by a suction means described later.
The height of the first protrusion 41 may be lower than the height of the top 31 a of the first protrusion 31, but in the present embodiment, the first protrusion 41 is formed at the same time as the first protrusion 31 by a method described later. The first protrusion 41 and the top portion 31a of the first convex portion 31 are formed at the same height.

  One of the pair of first protrusions 41 is formed so as to overlap the first mount electrode 55a when viewed in the Y ′ direction. The other first protrusion 41b is formed to overlap the second mount electrode 55b when viewed in the Y ′ direction.

The first protrusion 41 is formed integrally with the piezoelectric plate 20. Below, the formation method of the 1st protrusion 41 is demonstrated.
First, an etching protection layer formed of a metal layer having resistance to crystal etching and a photoresist layer are sequentially laminated on both surfaces of a crystal wafer having a predetermined thickness.
Next, external patterns of the first protrusions 41 and the first protrusions 31 as viewed from the + Y ′ direction of the piezoelectric vibrating piece 10 are formed on the photoresist layer provided on one surface of the quartz wafer by a predetermined photolithography method. To do. Further, an external pattern of the second convex portion 33 viewed from the −Y ′ direction of the piezoelectric vibrating piece 10 is formed on the photoresist layer provided on the other surface of the quartz wafer by a predetermined photolithography method.
Next, the etching protection layer is etched using the photoresist layer as a mask. Then, by removing the photoresist layer, the etching protection layers patterned in the Y ′ direction view pattern of the first protrusion 41, the first protrusion 31, and the second protrusion 33 are formed on the respective surfaces of the crystal wafer. Formed.
Next, both surfaces of the crystal wafer are etched using the patterned etching protection layer as a mask. Thereby, the 1st protrusion 41 and the 1st convex part 31 are formed in one surface of a quartz wafer, and the 2nd convex part 33 is formed in the other surface.
Next, the etching protection layers on both sides of the quartz wafer are removed by etching.

  Then, the outer shape of the piezoelectric plate 20 is formed by etching the crystal wafer on which the first protrusion 41, the first convex portion 31, and the second convex portion 33 are formed by the above-described method using the outer shape pattern. An electrode is formed on the surface of the substrate. Finally, the piezoelectric vibrating piece 10 is separated into pieces. Thereby, the piezoelectric vibrating piece 10 in which the first protrusion 41 is formed integrally with the first convex portion 31 and the second convex portion 33 at the same height is obtained.

Next, the piezoelectric vibrator 1 including the piezoelectric vibrating piece 10 will be described.
FIG. 2 is a cross-sectional view showing the configuration of the piezoelectric vibrator according to the first embodiment.
As shown in FIG. 2, the piezoelectric vibrator 1 includes a piezoelectric vibrating piece 10 and a package 80 having a base member 81 on which the piezoelectric vibrating piece 10 is mounted.
The package 80 includes a base member 81 and a lid member (sealing plate) 89 joined to the base member 81.

  The base member 81 is formed in a rectangular shape in plan view, and has a bottom portion 83 and a side wall portion 85. The base member 81 is made of, for example, a ceramic material. Specific examples include HTCC (High Temperature Co-Fired Ceramic) made of alumina, and LTCC (Low Temperature Co-Fired Ceramic) made of glass ceramics. The base member 81 may be formed of, for example, glass or resin.

  The bottom 83 has a mounting surface 83a on which the piezoelectric vibrating piece 10 is mounted, and a bottom surface 83b provided on the opposite side of the mounting surface 83a. The mounting surface 83a is formed flat, and the piezoelectric vibrating piece 10 is mounted thereon. The side wall portion 85 is formed in a rectangular shape in plan view along the outer periphery of the bottom portion 83, and surrounds the central portion of the bottom portion 83. As described above, the base member 81 has a cavity 87 formed by the bottom 83 and the side wall 85.

  A pair of mounting electrodes 91 is formed on the mounting surface 83a. The mounting electrodes 91 are arranged side by side at a predetermined interval.

  The lid member 89 is disposed on the side wall portion 85 of the base member 81. The lid member 89 is formed in a rectangular plate shape in plan view using, for example, the above ceramic material. The lid member 89 is joined to the end surface 85a of the side wall 85 by, for example, an adhesive (not shown). By providing the lid member 89 in this way, the cavity 87 of the base member 81 is sealed.

The piezoelectric vibrating piece 10 is mounted on the base member 81 with the second main surface 23 facing the base member 81.
The piezoelectric vibrating piece 10 is fixed to the base member 81 via a mounting adhesive 93. As the mounting adhesive 93, a thermosetting conductive resin is used. The mounting adhesive 93 physically fixes and electrically connects the pair of mount electrodes 55 and the pair of mounting electrodes 91. At this time, in the piezoelectric vibrating piece 10, the second main surface 23 is substantially parallel to the mounting surface 83 a of the base member 81, and the second convex portion 33 is not in contact with the package 80 and the mounting adhesive 93. Implemented.

  Next, the mounting of the piezoelectric vibrating piece 10 will be described with reference to FIG. The mounting of the piezoelectric vibrating piece 10 is performed using a suction unit 70 that sucks and holds the piezoelectric vibrating piece 10 with a negative pressure or the like. Specifically, first, the piezoelectric vibrating piece 10 is adsorbed on the adsorption surface of the adsorption means 70 having a plane having the same area as the piezoelectric vibrating piece 10. At this time, since the first protrusion 41 of the piezoelectric vibrating piece 10 is formed at the same height as the first protrusion 31, the suction surface of the suction means 70 is the top of the first protrusion 41 and the top of the first protrusion 31. The piezoelectric vibrating reed 10 is adsorbed while being in contact with the plane 31a.

  Next, a mounting adhesive 93 is applied on the mounting electrode 91 of the base member 81 to mount the piezoelectric vibrating piece 10. The piezoelectric vibrating reed 10 is mounted with the second main surface 23 of the piezoelectric plate 20 and the mounting surface 83a of the base member 81 being substantially parallel to each other while the piezoelectric vibrating reed 10 is directed to the base member 81 -Y '. This is done by moving in the direction.

  The action line passing through the contact portion between the mount electrode 55 and the mounting adhesive 93 and parallel to the Y ′ direction at the time of loading after the contact between the piezoelectric vibrating piece 10 and the mounting adhesive 93 is the top of the first protrusion 41. Through. At this time, since the top portion of the first protrusion 41 abuts on the suction surface of the suction means 70, the inclination of the piezoelectric vibrating piece 10 during mounting can be suppressed. In addition, by suppressing the inclination of the piezoelectric vibrating piece 10 in this way, it is possible to suppress variation in the amount of wetting and spreading of the mounting adhesive 93 on the mount electrode 55 and to stabilize the vibration characteristics of the piezoelectric vibrating piece 10. be able to.

  Furthermore, since the first protrusion 41 is formed at the same height as the top portion 31 a of the first convex portion 31, the piezoelectric vibrating piece is formed on a plane parallel to the first main surface 21 and the second main surface 23 of the piezoelectric plate 20. 10 can be adsorbed and held. Thus, when a force is applied to the piezoelectric vibrating piece 10 in the −Y ′ direction, the contact portion A between the suction means 70 that is the power point and the top portion of the first protrusion 41 and the contact portion of the mounting adhesive 93 that is the action point. B overlaps when viewed from the direction in which the force is applied. For this reason, the piezoelectric vibrating reed 10 does not tilt even if further weighted after contact with the mounting adhesive 93, so that it does not tilt and can be mounted parallel to the mounting surface 83a.

  FIG. 4 is a plan view of another piezoelectric vibrating piece according to the first embodiment. As shown in FIG. 4, the first protrusion 41 may be integrally formed from the overlapping position with the first mount electrode 55a to the overlapping position with the second mount electrode 55b as viewed in the Y ′ direction. Thus, by forming the first protrusion 41 in a large area, the contact area with the suction means at the top of the first protrusion 41 is increased, and the piezoelectric vibrating piece 10 can be suctioned and held more stably.

  5 and 6 are plan views of other piezoelectric vibrating reeds according to the first embodiment. As shown in FIGS. 5 and 6, the first protrusion 41 is formed in a shape in which the central portion in the X direction is bent or curved in the −Z ′ direction so as to be separated from the first convex portion 31 when viewed in the Y ′ direction. May be. In this way, by increasing the distance between the first protrusion 41 and the first protrusion 31, the propagation distance of unnecessary vibration induced by the first protrusion 41 can be increased and the strength thereof can be attenuated. The deterioration of the vibration characteristics of the resonator element 10 can be prevented. Further, by shifting the first protrusion 41 in the −Z ′ direction, the contact portion between the suction unit and the piezoelectric vibrating piece 10 is shifted in the −Z ′ direction. Therefore, even when the close contact position of the mounting adhesive is shifted in the −Z ′ direction on the mount electrode 55, the tilt at the time of mounting the piezoelectric vibrating piece 10 can be sufficiently suppressed.

  FIG. 7 is a plan view of another piezoelectric vibrating piece according to the first embodiment. As shown in FIG. 7, the first protrusion 41 may be formed in a shape divided into a plurality in the overlapping region with the first mount electrode 55a and the second mount electrode 55b when viewed in the Y ′ direction. By reducing the volume of the first protrusion 41 in this manner, unnecessary vibration that causes deterioration of the vibration characteristics of the piezoelectric vibrating piece 10 can be suppressed.

As described above, the piezoelectric vibrating piece 10 of the present embodiment includes the piezoelectric plate 20 having the first main surface 21 and the second main surface 23, the first convex portion 31 formed on the first main surface 21, and the first A first excitation electrode 51 formed on the top 31a of the convex portion 31; a second excitation electrode 53 formed on the second main surface 23 so as to overlap the first excitation electrode 51 as viewed from the Y ′ direction; The second main surface 23 has a pair of mount electrodes 55 formed around the second excitation electrode 53 and connected to the first excitation electrode 51 and the second excitation electrode 53. The piezoelectric vibrating piece 10 includes a first protrusion 41 formed integrally with the piezoelectric plate 20 on the first main surface 21, and at least a part of the first protrusion 41 is a mount electrode as viewed from the Y ′ direction. It is formed so that it may overlap with 55.
According to the present embodiment, the piezoelectric vibrating piece 10 has the first protrusion 41 formed at a position overlapping the mount electrode 55 when viewed from the Y ′ direction. When the piezoelectric vibrating piece 10 is mounted by pressing the piezoelectric vibrating piece 10 in the −Y ′ direction, the first protrusion 41 comes into contact with the suction means that holds the piezoelectric vibrating piece 10. Therefore, rotation about the contact portion of the piezoelectric vibrating piece 10 with the mounting adhesive 93 as a rotation axis is limited, and the inclination of the posture of the piezoelectric vibrating piece 10 can be suppressed. Therefore, a piezoelectric vibrating piece with excellent mounting stability can be obtained.

Further, the piezoelectric vibrating piece 10 of the present embodiment is characterized in that the first protrusion 41 is formed at the same height as the top portion 31 a of the first convex portion 31.
According to the present embodiment, when the piezoelectric vibrating piece 10 is mounted, the suction means of the piezoelectric vibrating piece 10 includes the top portion of the first protrusion 41 and the top portion 31 a of the first convex portion 31. In addition, the piezoelectric vibrating piece 10 can be adsorbed and held on a plane parallel to the second main surface 23. As a result, when the piezoelectric vibrating piece 10 is pressed in the −Y ′ direction, the holding portion A of the piezoelectric vibrating piece 10 as a force point and the contact portion B of the mounting adhesive 93 as an action point overlap when viewed from the pressing direction. Therefore, the piezoelectric vibrating reed 10 does not tilt even if further loaded after contact with the mounting adhesive 93, so it does not tilt and can be mounted parallel to the package 80. Therefore, a piezoelectric vibrating piece with more excellent mounting stability can be obtained.

Furthermore, the piezoelectric vibrating piece 10 of the present embodiment has the second convex portion 33 in which the piezoelectric plate 20 is formed on the second main surface 23, and the second excitation electrode 53 is formed on the top portion 33 a of the second convex portion 33. It is characterized by being.
According to the present embodiment, the piezoelectric vibrating piece 10 can confine the vibration energy to the second convex portion 33 with high accuracy, and can suppress an increase in CI value due to vibration leakage. Therefore, a piezoelectric vibrating piece with more excellent vibration characteristics can be obtained.

And the piezoelectric vibrating reed 10 of this embodiment is formed by AT cut.
According to this embodiment, it is possible to provide an AT-cut vibrating piece with excellent mounting stability.

The piezoelectric vibrator 1 of this embodiment includes a piezoelectric vibrating piece 10 and a package 80 having a base member 81 on which the piezoelectric vibrating piece 10 is mounted. The piezoelectric vibrating piece 10 has a second main surface 23 as a base member. It is mounted on the base member 81 toward 81.
According to the present embodiment, since the piezoelectric vibrator 1 includes the piezoelectric vibrating piece 10 having excellent mounting stability described above, it is possible to obtain a piezoelectric vibrator free from abnormal vibration characteristics or damage of the piezoelectric vibrating piece.

(Second Embodiment, Piezoelectric Vibrating Piece)
Next, the piezoelectric vibrating piece according to the second embodiment will be described.
FIG. 8 is a cross-sectional view of the piezoelectric vibrating piece according to the second embodiment at a portion corresponding to the line II in FIG.

  In the first embodiment shown in FIG. 1, the height of the first protrusion 41 is the same as the height of the top 31a of the first protrusion 31, but in the second embodiment shown in FIG. The height of 141 is different in that it is formed higher than the top portion 31 a of the first convex portion 31. Note that detailed description of portions having the same configuration as that of the first embodiment shown in FIG. 1 is omitted.

As shown in FIG. 8, in the piezoelectric vibrating piece 110 of the present embodiment, the first protrusion 141 is formed higher than the top portion 31 a of the first convex portion 31.
Hereinafter, a method of forming the first protrusion 141 will be described. In the first embodiment, the first protrusion 41 is formed at the same time as the first protrusion 31, but in the present embodiment, the step of forming only the first protrusion 141 and the first protrusion 141 and the first protrusion 31 are simultaneously performed. It is formed through a two-stage process.

First, as in the first embodiment, an etching protective layer and a photoresist layer are sequentially laminated on both sides of a quartz wafer.
Next, an external pattern of the first protrusion 141 viewed from the + Y ′ direction of the piezoelectric vibrating piece 110 is formed on a photoresist layer provided on one surface of the quartz wafer by a predetermined photolithography method. At this time, the photoresist layer provided on the other surface of the quartz wafer is not patterned.
Next, the etching protection layer is etched using the photoresist layer as a mask. Then, by removing the photoresist layer, an etching protection layer patterned in the Y ′ direction view pattern of the first protrusion 141 is formed on one surface of the crystal wafer, and on the other surface of the crystal wafer. An etching protective layer is formed on the entire surface.
Next, the crystal wafer is etched using the patterned etching protection layer as a mask. At this time, the etching amount in the thickness direction of the quartz wafer is made to coincide with the difference in height between the first protrusion 141 and the first protrusion 31. As a result, a portion of the first protrusion 141 protruding from the plane including the top 31a of the first convex portion 31 is formed on one surface of the quartz wafer.
Next, the etching protection layers on both sides of the quartz wafer are removed by etching.
Thereafter, the unformed portion of the first protrusion 141, the first convex portion 31, and the second convex portion 33 are formed by the same method as in the first embodiment.

  As described above, the first protrusion 141 higher than the top 31 a of the first protrusion 31 can be formed by forming the first protrusion 141 by two-stage etching.

  The mounting of the piezoelectric vibrating piece 110 is performed using a suction unit as in the first embodiment. At this time, the suction unit sucks and holds the piezoelectric vibrating piece 110 while being in contact with the side 31b in the + Z ′ direction at the top of the first protrusion 141 and the peripheral portion of the top 31a of the first protrusion 31. Therefore, the suction unit can suck and hold the piezoelectric vibrating piece 110 without contacting the first excitation electrode 51 formed on the top 31 a of the first convex portion 31. Thereby, the deterioration of the vibration characteristics of the piezoelectric vibrating piece 110 due to the damage of the first excitation electrode 51 due to the contact with the suction means can be suppressed.

Thus, the piezoelectric vibrating piece 110 according to the present embodiment is characterized in that the first protrusion 141 is formed higher than the top portion 31 a of the first convex portion 31.
According to the present embodiment, when the piezoelectric vibrating piece 110 is mounted, the piezoelectric vibrating piece 110 can be sucked and held in a state where the sucking means is in contact with the top of the first protrusion 141 and the peripheral edge of the first convex portion 31. it can. Therefore, the attracting means does not contact the first excitation electrode 51, can prevent the first excitation electrode 51 from being damaged, and can suppress the deterioration of the vibration characteristics of the piezoelectric vibrating piece 110. Therefore, a piezoelectric vibrating piece having excellent vibration characteristics can be obtained.

(Second Embodiment, First Modification, Piezoelectric Vibrating Piece)
Next, a piezoelectric vibrating piece according to a first modification of the second embodiment will be described.
FIG. 9 is a schematic diagram of a piezoelectric vibrating piece according to a first modification of the second embodiment, where (a) is a plan view, and (b) or (c) is a cross section taken along line IX-IX in (a). FIG.

  The first modified example shown in FIG. 9 is different from the second embodiment shown in FIG. 8 in that the piezoelectric vibrating piece 110a has a second protrusion 143. In addition, detailed description is abbreviate | omitted about the part which becomes the structure similar to 2nd Embodiment shown in FIG.

As shown in FIG. 9, the piezoelectric vibrating piece 110 a of this modification has a second protrusion 143 formed at the same height as the first protrusion 141, and the second protrusion 143 sandwiches the first protrusion 31. And formed on the opposite side of the first protrusion 141.
The first protrusion 141 is located in the peripheral region on the −Z ′ direction side of the first convex portion 31 on the first main surface 21 of the piezoelectric plate 20 when viewed in the Y ′ direction.
The piezoelectric vibrating piece 110 a of this modification includes a pair of second protrusions 143. The second protrusion 143 is formed in the same shape as the first protrusion 141. The pair of second protrusions 143 are formed in the peripheral region on the + Z ′ direction side of the first protrusion 31 in the first main surface 21 of the piezoelectric plate 20. Of the second protrusions 143, one second protrusion 143 a is provided in the vicinity of the corner on the + X side and + Z ′ side of the first main surface 21, and the other second protrusion 143 b is included in the first main surface 21. It is provided near the corner on the −X side and the + Z ′ side. As a result, the center of gravity of the piezoelectric vibrating piece 110a can be shifted from the first protrusion 141 side to the second protrusion 143 side. That is, since the center region of the suction means and the center of gravity of the piezoelectric vibrating piece can be made closer, the piezoelectric vibrating piece 110a can be easily sucked near the center of gravity of the piezoelectric vibrating piece 110a, and the piezoelectric vibrating piece 110a in the sucked state can be easily attracted. It becomes possible to stabilize the posture.
Only one second protrusion 143 or a plurality of second protrusions 143 may be formed in the peripheral area of the first main surface 21 on the + Z ′ direction side of the first protrusion 31.

  The second protrusion 143 is formed at the same height as the first protrusion 141. By providing the second protrusion 143 in this manner, when the piezoelectric vibrating piece 110a is mounted, the suction unit sucks and holds the piezoelectric vibrating piece 110a while being in contact with the top of the first protrusion 141 and the top of the second protrusion 143. . At this time, since the plane including the contact portion between the suction unit and the piezoelectric vibrating piece 110a and the second main surface 23 are parallel, the piezoelectric vibrating piece 110a is mounted on the package mounting surface for the same reason as in the first embodiment. Can be mounted in parallel. Further, the suction means can suck and hold the piezoelectric vibrating piece 110 a without contacting the top 31 a of the first convex portion 31 and the first excitation electrode 51. Therefore, it is possible to prevent the piezoelectric vibrating reed 110a from being damaged due to contact with the suction means and deteriorating the vibration characteristics.

As described above, the piezoelectric vibrating piece 110 a according to the present modification has the second protrusion 143 formed at the same height as the first protrusion 141, and the second protrusion 143 has the first protrusion 31 interposed therebetween. It is formed on the opposite side of the protrusion 141.
According to this modification, when the piezoelectric vibrating piece 110a is mounted, the piezoelectric vibrating piece 110a is sucked and held in a state where the suction means of the piezoelectric vibrating piece 110a is in contact with the top of the first protrusion 141 and the top of the second protrusion 143. can do. At that time, since the second protrusion 143 is formed on the opposite side of the first protrusion 141 with the first protrusion 31 interposed therebetween, the suction means can suck and hold the piezoelectric vibrating piece 110a in a stable state. Since the first protrusion 141 and the second protrusion 143 are formed at the same height, the plane including the top of the first protrusion 141 and the top of the second protrusion 143 is the first main surface 21 of the piezoelectric plate 20 and It is parallel to the second major surface 23. Therefore, even if the piezoelectric vibrating piece 110a is pressed in the −Y ′ direction, the piezoelectric vibrating piece 110a does not tilt, so the piezoelectric vibrating piece 110a can be mounted in parallel to the package. Further, the suction means does not contact the first convex portion 31 and the first excitation electrode 51, can prevent the first convex portion 31 and the first excitation electrode 51 from being damaged, and suppress the deterioration of the vibration characteristics of the piezoelectric vibrating piece 110a. be able to. Therefore, it is possible to obtain a piezoelectric vibrating piece with more excellent mounting stability and vibration characteristics. In FIG. 9B, the first protrusion 141 and the second protrusion 143 are formed to be higher than the first protrusion 31. However, as shown in FIG. 9C, the first protrusion 141 and the second protrusion 143 may be formed to have substantially the same height as the first protrusion 31.

(Third Embodiment, Piezoelectric Vibrating Piece and Piezoelectric Vibrator)
Next, the piezoelectric vibrating piece and the piezoelectric vibrator of the third embodiment will be described.
10A and 10B are schematic views of the piezoelectric vibrating piece according to the third embodiment, in which FIG. 10A is a plan view and FIG. 10B is a cross-sectional view taken along line XX in FIG. FIG. 11 is a schematic view of another piezoelectric vibrating piece according to the third embodiment, and is a cross-sectional view taken along a line XX in FIG.

  The third embodiment shown in FIGS. 10 and 11 is different from the first embodiment shown in FIG. 1 in that the piezoelectric vibrating piece 210 has a first bump 47 formed on the second main surface 23. Note that detailed description of portions having the same configuration as in the first embodiment is omitted.

As shown in FIGS. 10 and 11, the piezoelectric vibrating piece 210 has a first bump 47 formed on the second main surface 23. At least a part of the first bump 47 is formed in the overlapping region of the mount electrode 55 and the first protrusion 41 when viewed from the Y ′ direction. In the present embodiment, the entire first bump 47 coincides with the formation region of the first protrusion 41.
A pair of first bumps 47 is formed on the second main surface 23 and has a shape overlapping the first protrusion 41 when viewed in the Y ′ direction. Further, as shown in FIG. 10B, the first bumps 47 may be formed so that the height thereof substantially coincides with the height of the second convex portion 33, as shown in FIG. 10C. As shown, the height may be higher than the second convex portion 33. At this time, the height of the first protrusion 41 may be substantially the same as that of the first protrusion 31 or may be formed higher than that. Moreover, as shown in FIG. 11, the structure which provides the above-mentioned 2nd protrusion 43 may be sufficient. In FIG. 11, the second protrusion 43 and the first protrusion 31 are the same height, but the height of the second protrusion 43 is not limited to this, and is higher than the first protrusion 31. It may be. A second bump similar to the first bump 47 described above may be formed on the opposite side of the second protrusion 43 in the thickness direction.

At least a part of the mount electrode 55 is formed in the overlapping region at the top 47 c of the first bump 47. In the present embodiment, the mount electrode 55 is formed on the entire top portion 47 c of the first bump 47.
Of the pair of first bumps 47, one first bump 47a has a top portion 47c covered with a first mount electrode 55a. Further, the top 47c of the other first bump 47b is covered with the second mount electrode 55b.

Next, mounting of the piezoelectric vibrating piece 210 on the package 80 will be described.
FIG. 12 is a cross-sectional view showing the configuration of the piezoelectric vibrator according to the third embodiment. As shown in FIG. 12, the piezoelectric vibrating piece 210 is mounted on the base member 81 so that the mount electrode 55 contacts the mounting adhesive 93. At this time, the mounting adhesive 93 first contacts the mount electrode 55 on the top 47 c of the first bump 47. That is, even if the mounting position of the piezoelectric vibrating piece 210 is deviated within a certain range with respect to the base member 81, the mounting adhesive 93 first contacts the top 47 c of the first bump 47. No deviation of the contact position with the mounting adhesive 93 occurs. Then, by pressing the piezoelectric vibrating piece 210 in the −Y ′ direction, the first bump 47 overlaps the first protrusion 41 in the pressing direction. Therefore, the piezoelectric vibrating piece 210 is mounted for the same reason as in the first embodiment. It can be mounted parallel to the surface 83a.

  Further, when the first bump 47 is loaded so as to be pushed into the mounting adhesive 93, the mounting adhesive 93 wets and spreads across the side surface of the first bump 47. As a result, the wetting and spreading of the mounting adhesive 93 in the XZ ′ plane direction is suppressed, and deterioration and variation in the vibration characteristics of the piezoelectric vibrating piece 10 can be prevented. Further, by bringing the mounting adhesive 93 into contact with the side surfaces of the first bumps 47, the bonding area between the piezoelectric vibrating piece 210 and the mounting adhesive 93 increases. That is, the first bump 47 is bonded by the mounting adhesive 93 from the X direction and the Z ′ direction in addition to the −Y ′ direction. Therefore, the piezoelectric vibrating piece 210 is more firmly fixed to the base member 81. Therefore, a highly reliable piezoelectric vibrator 201 is obtained.

As described above, the piezoelectric vibrating piece 210 according to the present embodiment includes the first bumps 47 formed on the second main surface 23. At least a part of the first bump 47 is formed in the overlapping region of the mount electrode 55 and the first protrusion 41 when viewed from the Y ′ direction. At least a part of the mount electrode 55 is formed in the overlapping region at the top 47 c of the first bump 47.
According to the present embodiment, when the piezoelectric vibrating piece 210 is mounted, the mount electrode 55 on the top 47 c of the first bump 47 first contacts the mounting adhesive 93. At this time, since the first bump 47 overlaps with the first protrusion 41 when viewed from the Y ′ direction, the holding portion of the piezoelectric vibrating piece 210 as a force point and the contact portion of the mounting adhesive 93 as an action point are pressed. Inevitably overlap from the viewpoint. Therefore, even if the piezoelectric vibrating piece 210 is pressed in the −Y ′ direction, the piezoelectric vibrating piece 210 does not tilt, so that the piezoelectric vibrating piece 210 can be mounted in parallel to the package 80. Further, since the mounting adhesive 93 is in contact with the side surface from the top 47 c of the first bump 47, the wetting spread of the mounting adhesive 93 in the surface direction of the piezoelectric plate 20 can be suppressed. Therefore, it is possible to prevent deterioration and variation in the vibration characteristics of the piezoelectric vibrating piece 210 due to the wet spreading of the mounting adhesive 93. Therefore, it is possible to obtain a piezoelectric vibrating piece with more excellent mounting stability and vibration characteristics.

The present invention is not limited to the embodiment described above.
For example, in the above embodiment, a mesa-shaped piezoelectric vibrating piece has been described. However, a bevel-shaped or convex-shaped piezoelectric vibrating piece may be used. In the above embodiment, the piezoelectric vibrating piece is formed by aligning the longitudinal direction of the piezoelectric vibrating piece with the Z ′ direction. However, the piezoelectric vibrating piece may be formed by aligning the longitudinal direction of the piezoelectric vibrating piece with the X direction. .

  DESCRIPTION OF SYMBOLS 1, 201 ... Piezoelectric vibrator 10, 110, 110a, 210 ... Piezoelectric vibration piece 20 ... Piezoelectric plate 21 ... 1st main surface 23 ... 2nd main surface 31 ... 1st convex part 31a ... Top part of 1st convex part 33 ... 2nd convex part 33a ... Top part 41, 141 of 2nd convex part 41 ... 1st protrusion 47 ... 1st bump 47c ... Top part of 1st bump 51 ... 1st excitation electrode 53 ... 2nd excitation electrode 55 ... Mount electrode 80 ... Package 81 ... Base member 143 ... Second projection

Claims (8)

A piezoelectric plate having a first main surface and a second main surface;
A first protrusion formed on the first main surface;
A first excitation electrode formed on the top of the first protrusion,
A second excitation electrode formed on the second main surface so as to overlap the first excitation electrode when viewed from the thickness direction of the piezoelectric plate;
A pair of mount electrodes formed around the second excitation electrode on the second main surface and connected to the first excitation electrode and the second excitation electrode;
A first protrusion formed integrally with the piezoelectric plate on the first main surface;
At least a part of the first protrusion is formed so as to overlap the mount electrode when viewed from the thickness direction of the piezoelectric plate.
A piezoelectric vibrating piece characterized by that. The piezoelectric vibrating piece according to claim 1,
The first protrusion is formed at the same height as the top of the first protrusion.
A piezoelectric vibrating piece characterized by that. The piezoelectric vibrating piece according to claim 1,
The first protrusion is formed higher than the top of the first protrusion.
A piezoelectric vibrating piece characterized by that. 4. The piezoelectric vibrating piece according to claim 1, wherein a second protrusion is formed on the opposite side of the first protrusion across the first protrusion.
A piezoelectric vibrating piece characterized by that. The piezoelectric vibrating piece according to any one of claims 1 to 4,
A first bump formed on the second main surface;
At least a part of the first bump is formed in an overlapping region of the mount electrode and the first protrusion when viewed from the thickness direction of the piezoelectric plate,
At least a part of the mount electrode is formed in the overlapping region at the top of the first bump.
A piezoelectric vibrating piece characterized by that. The piezoelectric vibrating piece according to any one of claims 1 to 5,
The piezoelectric plate has a second convex portion formed on the second main surface,
The second excitation electrode is formed on the top of the second protrusion.
A piezoelectric vibrating piece characterized by that. In the piezoelectric vibrating piece according to any one of claims 1 to 6,
The piezoelectric plate is formed by AT cut.
A piezoelectric vibrating piece characterized by that. The piezoelectric vibrating piece according to any one of claims 1 to 7,
A package having a base member on which the piezoelectric vibrating piece is mounted,
The piezoelectric vibrating piece is mounted on the base member with the second main surface facing the base member.
A piezoelectric vibrator characterized by that.

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