JP2015185331A - Heat sink and led lighting device using the hear sink - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a low-cost heat sink which can efficiently cool down a dottedly-disposed substrate of an LED power source, and an LED lighting device.SOLUTION: There are provided: a heat receiving bottom plate 23 having a thermal connection face 26a thermally connected to a heating body; and a plurality of blocks 8a-8d for forming a heat sink, the blocks having a plurality of plate-like radiation fins 24 and being formed integrally with the radiation fins 24 and a heat receiving bottom plate 23. The radiation fins 24 are provided so as to stand up with an interval therebetween on a surface opposite to a thermal connection face 26a of the heat receiving bottom plate 23. Side faces of the heat receiving bottom plate 23 are formed adjacent to each other so that thermal connection faces 26a of the plurality of blocks 8a-8d for forming heat sink form a flush surface, where the flush thermal connection faces 26a formed by connections of the blocks 8a-8d for forming heat sink serve as a connection face to which a plurality of LED light surfaces provided with an interval therebetween are thermally connected directly or indirectly.

Description

  The present invention is applied to, for example, an LED lighting device including an LED (light emitting diode) light source, and a heat sink for cooling the heat generated from the LED light source through the mounting substrate, and the LED illumination using the heat sink It is the one to be bound.

  Conventionally, various heat sinks are used for cooling a heat generating electronic component such as an IC. The heat sink has a heat receiving surface (thermal connection surface) that receives heat from a component to be cooled (heat generating component) and a heat radiating fin for radiating the heat received on the heat receiving surface. Various methods such as extrusion molding, forging, cutting and raising, and metallurgy have been proposed as methods (see, for example, Patent Document 1).

JP-A-6-244327

  By the way, in recent years, various LED lighting devices using LED light sources have been proposed. In such LED lighting devices, a plurality of LED light sources are scattered (dispersed) on the LED light source arrangement surface of the substrate. Arrangement). When a plurality of LED light sources are scattered on the substrate in this manner, the substrate is heated almost uniformly over the entire substrate surface direction by the heat generated from the LED light sources. Therefore, a configuration for radiating and cooling heat uniformly from a large-area substrate or the like was not provided.

  That is, in the conventional heat sink, the heat receiving function that receives the heat of the heat source, the heat spread function that expands the heat from the heat source area, and the function that dissipates the heat to the air or the like are regarded as important components. In order to ensure the heat spread function, the thickness of the heat receiving plate portion forming the heat receiving surface of the heat sink is increased, and as a result, the weight of the heat sink is increased.

  However, in the LED heat sink for the LED lighting device, since the point light source is disposed in a relatively large area, the heat spread function is not important, and the thickness of the bottom plate portion of the heat sink is also functionally thin. The present inventor considered that it would be important to be light and rather light, and thought that the application of such a heat sink could also reduce the weight of the LED lighting device. In addition, for the spread of LED lighting devices, it is important to reduce the cost, and it is important to reduce the cost of the heat sink applied to the LED lighting device.

  The present invention has been made in order to solve the above-mentioned problems, and the object thereof is, for example, without using a fan or the like to dissipate heat from LED light source interspersed boards or LED light sources provided in an LED lighting device. It is an object of the present invention to provide a heat sink that can be efficiently cooled and reduced in weight and cost, and an LED lighting device using the heat sink.

  In order to achieve the above object, the present invention has the following configuration as means for solving the problems. That is, the heat sink according to the first aspect of the present invention is a heat-receiving bottom plate portion having a thermal connection surface to which the heating element is thermally connected, and a surface opposite to the thermal connection surface of the heat-receiving bottom plate portion. A plurality of plate-like heat radiating fins provided to be spaced apart from each other, and a plurality of heat sink forming blocks in which the heat radiating fins and the heat receiving bottom plate are integrally formed, The heat connection surfaces of the plurality of heat sink forming blocks are arranged so as to form the same surface, the side surfaces of the adjacent heat receiving bottom plate portions are bonded to each other, and the plurality of heat sink forming blocks are bonded to each other. The same surface-like thermal connection surface is formed as a joint surface that is thermally connected directly or indirectly to the plurality of LED light sources as the heating elements disposed at intervals. Hands solving problems with It is set to.

  In the heat sink of the second invention, in addition to the structure of the first invention, the plurality of heat radiation fins formed on the individual heat sink forming blocks are formed to extend in the same direction in parallel to each other. Features.

  Further, in the heat sink of the third invention, in addition to the structure of the second invention, the thermal connection surface formed by joining the heat receiving bottom plate portions of the plurality of heat sink forming blocks is in the central portion in the surface. Among the plurality of radiating fins formed in a form having through holes and arranged in individual heat sink forming blocks, at least the plurality of radiating fins in the central portion of the arrangement are the edges of the through holes and the outer peripheral edge of the thermal connection surface. It is formed in the direction which connects.

  Furthermore, the heat sink of the fourth invention is characterized in that, in addition to the configuration of the first, second or third invention, the heat sink forming block is formed by die casting.

  Further, a heat sink according to a fifth aspect of the present invention is the heat sink formed by joining heat receiving bottom plate portions of a plurality of heat sink forming blocks in addition to the configuration of any one of the first to fourth aspects of the invention. The thickness is reduced as it goes from the central part of the general connection surface to the outer peripheral edge part.

  Furthermore, a heat sink according to a sixth aspect of the present invention is the structure according to any one of the first to fifth aspects, wherein the heat receiving bottom plate portions of the adjacent heat sink forming blocks are mechanically coupled and are used for heat reception. The joint part of the side surfaces of the bottom plate part is sealed with a sealing material.

  Furthermore, the LED lighting device of the present invention has the heat sink of the present invention, and is arranged on the same thermal connection surface formed by joining a plurality of heat sink forming blocks of the heat sink with a space therebetween. A plurality of LED light sources provided are formed by thermal connection directly or indirectly.

  The heat sink of the present invention has a heat receiving bottom plate portion having a thermal connection surface to which a heating element is thermally connected, and a surface opposite to the thermal connection surface of the heat receiving bottom plate portion with a space therebetween. A plurality of plate-like heat dissipating fins provided in a standing manner, and a plurality of heat sink forming blocks in which the heat dissipating fins and the heat receiving bottom plate are integrally formed. The heat sink forming block has a simple configuration, and can be manufactured with good productivity and low cost by using die casting or the like with good productivity. The heat sink can be formed with high productivity by combining the heat sink forming blocks so that the thermal connection surfaces of the plurality of heat sink forming blocks form the same surface.

  The heat sink of the present invention is thermally connected directly or indirectly to the plurality of LED light sources as the heating elements disposed on the same surface with the same thermal connection surface interposed therebetween. By forming the bonding surface, the heat of the LED light source device can be uniformly and efficiently radiated. For example, the thermal connection surface of the heat sink is configured to be indirectly thermally connected to the LED light source as a joint surface with a plurality of LED light sources arranged at intervals from each other, Even if the substrate area is large, it is possible to dissipate heat substantially evenly over the entire substrate surface of the LED light source substrate. Further, when the same planar thermal connection surface is a joint surface with an LED light source assembly in which a plurality of LED light sources are integrated, the heat of the LED light source assembly can be directly and efficiently radiated. .

  In addition, the heat sink forming block can be formed by molding, for example, by die casting as described above. However, a molding machine such as a die cast machine used for molding the heat sink forming block forms the entire heat sink at once. Therefore, it can be made smaller than a molding machine such as a die-casting machine used for the purpose. Therefore, the heat sink forming block can be manufactured at a low cost, and the heat sink manufacturing cost can be reduced and the cost can be reduced by manufacturing the heat sink by joining the heat sink forming block. Furthermore, according to the heat sink of the present invention, the mold cost used when forming the heat sink forming block by molding or the like can be made smaller than that of the conventional integral mold, so that the mold cost is also reduced. can do.

  Also, when molding such as die-casting, the work of removing the mold (molding mold) is performed after injecting a liquid in which a material such as metal or resin is dissolved into the molding mold and solidifying it. By forming a plurality of radiating fins formed on the heat sink forming block in parallel and extending in the same direction, the molding die used for molding by die casting or the like can be easily slid in the extending direction of the radiating fins. Since it can be removed, the heat sink forming block can be formed easily and efficiently, and the heat sink forming block can be formed in a good shape and with a high yield.

  Further, the thermal connection surface formed by joining the heat receiving bottom plate portions of the plurality of heat sink forming blocks is formed in a mode having a through hole in the central portion in the surface, and a plurality of heat connection surfaces are arranged in each heat sink forming block. Among the radiating fins, at least a plurality of radiating fins in the central portion of the array are formed in a direction connecting the edge of the through hole and the outer peripheral edge of the thermal connection surface. An LED lighting device can be formed by providing a storage portion for storing the above.

  In addition, among the plurality of heat radiation fins arranged in each heat sink forming block in this way, at least the plurality of heat radiation fins in the central portion of the array is in a direction connecting the edge of the through hole and the outer peripheral edge of the thermal connection surface. When the heat dissipating fins are arranged and formed, the heat dissipating fins may be disposed in a shape close to a radial shape centering on the through hole on the heat receiving bottom plate portion formed by joining the heat receiving bottom plate portions of the plurality of heat sink forming blocks. it can. Therefore, it becomes easy to cool the heat from the substrate on which the LED light source is disposed evenly, and even if the LED lighting device is disposed to be inclined from the horizontal direction, the air flows between the radiation fins by natural convection. The heat of the LED light source can be efficiently radiated through the radiation fins.

  Furthermore, by forming the heat sink forming block by die casting, each heat sink forming block can be formed instantaneously, for example, 0.5 seconds, and the heat sink forming blocks can be joined to form a heat sink with high productivity.

  Furthermore, by forming the radiating fins so that the thickness decreases from the central part of the thermal connection surface formed by joining the heat receiving bottom plate parts of the plurality of heat sink forming blocks to the outer peripheral edge part, the following Such effects can be achieved. In other words, as described above, when die casting or the like is performed, a liquid in which a material such as metal or resin is dissolved is poured into a mold and solidified, and then the mold (molding mold) is removed. In the heat sink forming block, for example, die casting is performed when forming the heat sink forming block from the side of the central portion of the same planar thermal connection surface formed by joining the heat receiving bottom plate portions of the plurality of heat sink forming blocks. By injecting a liquid in which a metal, a resin, or the like, which is a molding material such as, is melted, into the molding die, the molding material can be injected and filled into the molding die satisfactorily and efficiently.

  Then, after the molding material filled in the molding die is solidified, the mold is removed (for example, the die is slid from the liquid injection tip side) to form the heat sink forming block in a good state with good yield. Therefore, the heat sink can be formed efficiently in a good state and with a high yield by using the formed heat sink forming block.

  Further, the heat receiving bottom plate portions of adjacent heat sink forming blocks are mechanically coupled, and the joint portions between the side surfaces of the heat receiving bottom plate portions are sealed with a sealing material, thereby strongly joining the heat sink forming blocks. In addition, it is possible to prevent moisture and the like from entering from the joint portion. In the LED lighting device, if there is a water intrusion in the LED light source arrangement region, a problem arises. Therefore, a waterproof structure is important in the LED light source arrangement region. By sealing the joint portion with a sealing material, it is possible to prevent the intrusion of moisture or the like from the heat sink side into the LED light source arrangement region, thereby reliably preventing the occurrence of the trouble.

  Furthermore, the LED lighting device of the present invention has the heat sink of the present invention, and a plurality of heat sink forming blocks of the heat sink are joined to the same thermal connection surface formed with a space therebetween. It is possible to realize an LED lighting device that is easy to manufacture and can be reduced in weight and cost by forming a plurality of LED light sources arranged in a thermal connection directly or indirectly. can do.

It is a typical perspective view showing one example of a heat sink concerning the present invention. It is typical perspective explanatory drawing which shows the heat sink of an Example in a decomposition | disassembly state. It is typical perspective explanatory drawing which looked at the heat sink of the Example from the thermal connection surface side with a LED light source arrangement | positioning board | substrate in a decomposition | disassembly state. It is a typical top view which shows the heat sink of an Example in a decomposition | disassembly state. It is a typical top view of the heat sink of an Example. It is a perspective explanatory view showing one block for heat sink formation applied to the heat sink of an example. FIG. 7 is a perspective explanatory view of one heat sink forming block applied to the heat sink of the embodiment as seen from an angle different from FIG. 6. It is typical explanatory drawing for demonstrating the thickness of the radiation fin which changes with the die cutting directions for shaping | molding in the manufacturing process of the block for heat sink formation. It is a typical perspective view which shows one Example of the LED lighting apparatus which concerns on this invention. It is typical sectional drawing of the LED lighting apparatus of an Example. It is typical explanatory drawing which expands and shows the part shown to A of FIG. It is typical plane explanatory drawing which looked at the LED lighting apparatus of the Example from the LED light source arrangement | positioning board | substrate side. It is typical sectional drawing for demonstrating the thermal radiation operation | movement by the LED lighting apparatus of an Example. It is typical perspective explanatory drawing which shows the other Example of the LED lighting apparatus which concerns on this invention. It is typical sectional explanatory drawing (a) which shows a partial structure of the LED illuminating device of the Example shown by FIG. 14, and typical plane explanatory drawing (b) which shows the example of arrangement | positioning of a LED light source. It is a typical perspective view for demonstrating an example of the heat sink formed by arrange | positioning a radiation fin radially on the bottom plate for heat receiving of donut shape. It is a typical perspective view for demonstrating another example of the heat sink formed by arrange | positioning a radiation fin radially on the bottom plate for heat receiving of donut shape. It is a plane block diagram of the heat sink shown by FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 shows a schematic perspective view of an embodiment of a heat sink according to the present invention, and FIG. 2 shows a schematic perspective view of the heat sink of this embodiment in an exploded state. . As shown in these drawings, the heat sink 8 of the present embodiment is an aluminum die formed by combining a plurality of (individually four) heat sink forming blocks 8a to 8d having the same shape formed by aluminum die casting. Each of the heat sink forming blocks 8a to 8d has a thermal connection surface 26a to which a heating element is thermally connected, as shown in FIGS. 2, 6, and 7. It has a heat-receiving bottom plate portion 23, a plurality of flat plate-like heat radiation fins 24, and a curved plate-like cylindrical wall forming plate portion 32.

  FIG. 7A shows a perspective view of the heat sink forming block 8a viewed from the outer peripheral side of the heat sink 8 formed by joining the heat sink forming blocks 8a to 8d, and FIG. FIG. 6 is a perspective view of the heat sink forming block 8a viewed from the outer peripheral side of the heat sink 8. FIG. 6 and FIG. 7 show one heat sink forming block 8a. The blocks 8b to 8d are formed in the same manner.

  As shown in FIGS. 2 and 3, the plurality of heat sink forming blocks 8a to 8d are arranged and combined so as to form the same surface by the thermal connection surface 26a, as shown in FIG. The side surfaces of the adjacent heat receiving bottom plate portions 23 are joined to each other. And the same surface-shaped thermal connection surface 26 (surface on the opposite side of the formation surface of the radiation fin 24) formed by joining the plurality of heat sink formation blocks 8a to 8d is disposed with a space therebetween. The LED light sources 3 are directly or indirectly thermally connected. As an example, for example, as shown in FIG. 12, the thermal connection surface 26 of the heat sink 8 is bonded to the LED light source arrangement substrate, which is the substrate 3 in which the plurality of LED light sources 6 as the heating elements are interspersed. A heat receiving surface that receives heat from the LED light source 6 can be formed.

  The diameter of the same thermal connecting surface 26 is such that t / D is an appropriate value of 0.2 or less, where D is the diameter and t is the thickness of the bottom plate 23 for heat receiving. Is formed. Further, the thickness of the heat receiving bottom plate portion 23 is uniformly formed, for example, about 4 mm, and the edge of the heat receiving bottom plate portion 23 which is the outer peripheral side of the thermal connection surface 26 is bent to the side opposite to the arrangement side of the radiation fins 24. (Refer to FIG. 2, FIG. 3, FIG. 7, etc.).

  The heat receiving bottom plate portion 23 of the adjacent heat sink forming blocks 8a to 8d is inserted and fitted into the slit portion 47 of the one heat sink forming block 8a to 8d with the convex portion 48 of the other heat sink forming block 8a to 8d. Then, the convex portions 48 of the heat sink forming blocks 8a to 8d are superposed on the convex portion 44 formed on the lower side of the slit portion 47, and the screw hole 49 of the convex portion 48 and the screw hole 45 of the convex portion 44 are overlapped. It is mechanically coupled by screwing a commonly inserted screw (not shown). Moreover, the joint part of the side surfaces of the heat-receiving bottom plate part 23 is sealed with solder as a sealing material, and liquid-tightness and airtightness are ensured. The sealing material is not limited to solder, and an appropriate sealing material such as a resin or a wax material can be applied.

  FIG. 4 shows a schematic plan configuration of the heat sink 8 of this embodiment in an exploded state, and FIG. 5 shows a schematic plan view of the heat sink 8 of this embodiment. As shown in the figure, the thermal connection surface 26 formed by joining the heat receiving bottom plate portions 23 of the plurality of heat sink forming blocks 8a to 8d has a through hole 22 at the center in a circular surface. It is formed in a donut shape.

  Furthermore, the cylindrical wall forming plate portion 32 of each of the heat sink forming blocks 8a to 8d is joined by joining the plurality of heat sink forming blocks 8a to 8d, and the cylinder is raised upward from the vicinity of the edge of the through hole 22 A shaped wall is formed. The cylindrical wall forming plate portion 32 is formed to have a thickness of, for example, 1 mm, and the cylindrical wall is formed so that the cylinder diameter increases toward the upper side.

  In each of the heat sink forming blocks 8a to 8d, the heat radiating fins 24 are provided on the surface opposite to the thermal connection surface 26a of the heat receiving bottom plate portion 23 with being spaced from each other. The interval (see S in FIG. 5) is, for example, about 10 mm. Further, the heat radiating fins 24 and the heat receiving bottom plate 23 are integrally formed. Each radiating fin 24 is formed to have a length in a rising direction (Z direction in the drawing) from the heat receiving bottom plate portion 23 longer than a length in a direction (XY plane direction in the drawing) along the surface of the heat receiving bottom plate portion 23. The length in the rising direction (height H in FIG. 6) is, for example, 10 cm, and the tongue ratio (the height of the radiating fins / the interval between the radiating fins) is 5 or more and 20 or less, Heat of the substrate 3 on which a plurality of LED light sources are arranged can be efficiently radiated.

  Further, a plurality of heat radiation fins 24 are formed in parallel to each other in the same direction on each of the heat sink formation blocks 8a to 8d, and a plurality of heat radiation fins 24 arranged on each of the heat sink formation blocks 8a to 8d. Among them, the plurality of radiating fins 24 (here, the radiating fins 24 connected to the cylindrical wall forming plate portion 32) are arranged in a direction connecting the edge of the through hole 22 and the outer peripheral edge of the thermal connection surface 26. It is formed (see FIG. 4, FIG. 5, etc.).

  As described above, when the plurality of heat radiation fins 24 are formed in the direction connecting the edge of the through hole 22 and the outer peripheral edge of the thermal connection surface 26, the heat receiving bottom plate portions 23 of the plurality of heat sink forming blocks 8a to 8d are joined. The heat-radiating fins 24 can be disposed on the formed heat-receiving bottom plate portion 23 in a nearly radial manner with the through hole as the center. Therefore, the heat radiation efficiency can be increased, and even if the LED lighting device 1 is disposed to be inclined from the horizontal direction, air can easily flow between the heat radiation fins 24 by natural convection. Can be efficiently radiated through the radiation fins 24.

  In the present embodiment, among the radiation fins 24 arranged in the heat sink forming blocks 8a to 8d, the radiation fins 24 on the arrangement end side are connected to each other, and these radiation fins 24 are also arranged at the center of the arrangement. The heat radiating fins 24 are extended in the same direction in parallel. With the arrangement of these radiation fins 24, the number of the radiation fins 24 can be increased, and the heat radiation efficiency can be further improved.

  Further, the heat radiating fins 24 are formed so as to decrease in thickness from the central portion of the thermal connection surface 26 formed by joining the heat receiving bottom plate portions 23 of the plurality of heat sink forming blocks 8a to 8d to the outer peripheral edge portion. (See FIG. 4 etc.).

  As is well known, die casting is performed by pressing a liquid (melt) in which a material metal is melted into a molding die, and cooling and solidifying it in a short time such as 0.5 seconds. It is necessary to flow quickly to each part and end of the mold. Therefore, it is necessary to make the molten metal flow easily in the molding die, and the molding die has a width and thickness on the side that becomes the base end side where the molten metal flows into the molding die at the time of molding, and the side that becomes the tip side on which the molten metal flows It is necessary to make it larger than the width and thickness. As a result, the thickness of the molded product is formed with an inclination of the thickness so that the thickness decreases from the base end side toward the tip end side, and the inclination angle is formed at an angle of, for example, 1 ° to 2 °. It is formed so that the side becomes thin.

  Further, when removing the molding die after the molten metal has cooled and solidified, the molding die is slid and removed from the tip side, so when the heat sink forming blocks 8a to 8d are formed by die casting. The thickness of the radiation fins is formed in correspondence with the direction in which the radiation fins 24 are formed and the direction in which the molding die slides (ie, the direction in which the mold is removed). In other words, the thickness of the base end side into which the molten metal is poured becomes thicker than the distal end side where the molten metal poured into the molding die flows in correspondence with the mold drawing direction, and the longer the distance between the distal end side and the proximal end side, the longer the proximal end. The thickness on the side will increase.

  That is, as shown in FIG. 8, when the molding die 50 is slid and removed in the X direction in the figure, the thickness of the radiating fin 24 in the X direction is the cylindrical wall on the base end side. When the molding die 50 is slid and removed in the Z direction in the figure, the thickness in the Z direction of the heat dissipating fin 24 is the base end side of the heat receiving fin. It forms so that it may become thick as it goes to the bottom plate part 23 for use. Therefore, when the length of the radiating fin 24 in the Z direction is longer than the X direction of the radiating fin 24 as in this embodiment, the radiating fin 24 is formed by sliding the molding die 50 in the Z direction in the figure and removing it. The thickness of the base end side of becomes considerably thick.

  On the other hand, in this embodiment, the sliding movement direction of the molding die 50 by die casting in each of the heat sink forming blocks 8a to 8d is set to the arrow direction in FIG. The amount of change in thickness from the front end side (the outer peripheral edge side of the heat receiving bottom plate portion 23) to the base end side (the edge side of the through hole 22 of the heat receiving bottom plate portion 23) can be reduced. In other words, each radiating fin 24 is thinned over the entire thickness of the radiating fin 24 so as to have a thickness of, for example, about 2 mm even on the base end side. FIG. 8 is a schematic diagram for explaining the relationship between the manufacturing method of the radiating fins 24 and the thickness thereof, so that the cross section of the cylindrical wall forming plate portion 32 is linear (that is, the cylindrical wall forming plate portion). 32, the cylindrical wall forming plate portion 32 has a curved plate shape as described above.

  In FIG. 16, instead of forming a plurality of heat sink forming blocks 8a to 8d by die-casting and then forming the heat sink 8 as in this embodiment, the entire heat sink 8 is formed by die-casting. As an aspect in which the molding die 50 is slid and removed in the Z direction in the figure at the time of molding, an example of the heat sink 8 is shown in which the thickness in the Z direction of the radiation fins 24 increases toward the proximal end side. . In the heat sink 8 of this example, the radiation fins 24 are arranged in a radial pattern. If the spacing between the radiation fins 24 is increased to, for example, about 10 mm in order to increase the cooling efficiency by the radiation fins 24, the thickness of the radiation fins 24 is increased. As the thickness increases, the number of the radiating fins 24 is reduced, and as a result, the heat dissipation efficiency is lowered.

  Therefore, for example, as shown in FIGS. 17 and 18, when the number of the radiating fins 24 is increased, the interval between the adjacent radiating fins 24 becomes narrower, and the center side of the heat receiving bottom plate portion 23 (the edge side of the through hole 22). In FIG. 18, since the space between adjacent radiating fins 24 is almost eliminated, the radiating efficiency is lowered (in FIG. 18, in order to make the drawing easier to understand, the bottom plate portion 23 for heat receiving) The dots are marked on the portions where the heat radiating fins 24 are not formed).

  On the other hand, in the present embodiment, the thickness of the radiation fins 24 can be reduced, the spacing between the radiation fins 24 can be widened, and the tong ratio is formed to be 5 or more and 20 or less. A heat sink with high heat dissipation efficiency can be realized by the natural convection heat dissipation function in which heat is released by the flow of air due to the temperature difference of the air in the rising direction of the heat dissipation fins 24 (vertical direction in FIG. 1).

  In addition, as described above, the heat sink 8 of the present embodiment has good productivity, can achieve cost reduction, has good design, and is lightweight with a weight of about 1 kg, so it can be carried around. For example, by applying the heat sink 8 to the LED lighting device 1 as shown in FIGS. 9 and 10, it is possible to reduce the weight of the LED lighting device. 1 to 9, the protrusions denoted by reference numeral 43 are chains, strings, or plates when the LED lighting device 1 is suspended on a ceiling or the like when the heat sink 8 is applied to the LED lighting device 1. However, the protrusion 43 can be omitted.

  Hereinafter, based on FIG. 9, FIG. 10, etc., one Example of the LED illuminating device 1 is demonstrated. This LED lighting device 1 has a donut-shaped disk-shaped substrate 3 in which a substantially circular through hole 2 as shown in FIG. 12 is formed, and as shown in FIGS. 10 and 11, It has a cylindrical portion 4 provided in a manner that penetrates the through hole 2 of the substrate 3. The cylindrical part 4 has a cylindrical part 4a protruding from one side (lower side of FIG. 10) of the substrate 3 and a cylindrical part 4b protruding from the opposite side (upper surface of FIG. 10). Protruding from. The cylindrical portion 4b is formed of a resin member and has characteristics such as light weight, mechanical strength, and difficulty in transferring heat. The power source 11 of the LED light source 6 and its cable 20 can be stored in the cylinder of the cylindrical portion 4 (4b).

  The substrate 3 is an LED light source arrangement substrate in which a plurality of LED light sources are arranged. As shown in FIG. 12, a plurality (for example, 40) of LED light sources 6 are provided on the LED light source arrangement surface 5 of the substrate 3. Are interspersed at intervals. By providing the heat sink 8 of the above embodiment on the side of the substrate surface 7 (see FIG. 11) opposite to the LED light source arrangement surface 5, the heat sink 8 is provided so as to cover the outer periphery of the cylindrical portion 4b. 8 thermal connection surfaces 26 (see FIG. 3 and the like) are thermally connected to the substrate 3 and indirectly connected to the LED light source 6 to dissipate heat from the LED light source 6. ing.

  As shown in FIGS. 9 to 11, the cylindrical part 4 b has one end side in the cylindrical axis direction (Z-axis direction in the figure) protruding ahead of the tip of the heat sink 8, and the protruding cylindrical part 4 b side. A slit-like vent 9 is formed in the peripheral wall portion. Further, the cylindrical portion 4b has a perfect circular shape in the cross-sectional shape (XY cross-sectional shape) of the cylindrical hole, but the cylindrical portion 4b has a portion where the vent hole 9 is formed at the tip side (in FIG. 10). Having a region where the diameter continuously decreases toward the upper side) and a region where the diameter decreases stepwise, the diameter of the tip is formed smaller than the diameter in the region where the heat sink 8 is disposed, A base 30 for attaching the LED lighting device 1 to the attachment location is formed at the tip of the cylindrical portion 4b.

  Here, the base 30 is formed to a size specified in, for example, JIS base E39, and the LED lighting device 1 having a high wattage of 50 W or more (depending on the performance of the LED light source, about 300 W) as a corresponding lighting device. Even in the case of forming the LED lighting device, it is possible to reduce the weight by reducing the weight of the heat sink 8 as described above. Therefore, it is possible to reduce the risk of falling of the LED lighting device 1 against an earthquake, and it is possible to improve the workability at the time of construction and enable one person to work.

  The cylindrical portion 4a is provided so as to protrude from the LED light source arrangement surface 5 side of the substrate 3 and has a protruding length of, for example, about 2 to 3 cm, and a protruding tip portion (other than the cylindrical portion 4 in the cylinder axis direction). A transparent cover member 12 is formed from the end side) to the peripheral edge of the substrate 3. The transparent cover member 12 is provided so as to cover the LED light source arrangement surface 5 with a space from the LED light source arrangement surface 5, and the cylindrical body 15 is integrated with the transparent cover member 12 inside the transparent cover member 12. Provided.

  In addition, the cylindrical part 4a is provided inside the cylindrical body 15 with a space from the cylindrical body 15, and the cylindrical part 4a and the cylindrical body 15 are connected via a connecting plate portion 27, so that the cylindrical part is provided. 4a, the cylindrical body 15, and the transparent cover member 12 are integrally formed of, for example, a transparent resin. An opening 10 is formed at the protruding tip of the cylindrical portion 4a, and the diameter of the opening 10 and the cylindrical inner diameter of the cylindrical portion 4a are formed to be 30 mm or more (for example, 80 mm).

  In this LED lighting device 1, as shown in FIG. 11, the contact portion between the lower surface (base end surface 26) of the heat receiving bottom plate portion 23 of the heat sink 8 and the peripheral edge portion of the transparent cover member 12 is a sealing member. An O-ring 33 is provided, an O-ring 34 as a seal member is provided at a contact portion between the bottom plate 23 of the heat sink 8 and the cylinder 15, and the LED covered with the transparent cover member 12 and the cylinder 15 is provided. The light source 6 is formed in a liquid-tight and air-tight manner so that water does not enter the region where the light source 6 is disposed.

  The cylindrical wall of the cylindrical portion 4a is formed to increase in thickness from the opening 10 side to the substrate 3 side. However, the contact portion side of the cylindrical portion 4a with the bottom plate 23 is connected to the contact portion side. A groove portion 35 having an opening is formed over the entire circumference of the cylindrical portion 4a so that the contact area between the cylindrical portion 4a and the bottom plate 23 of the heat sink 8 is reduced. It is comprised so that heat may not be easily transmitted to the site | part 4a side.

  In this LED lighting device 1, when heat is generated by driving the LED light source 6 and the temperature of the substrate 3 rises, heat is transferred from the substrate 3 to the heat receiving bottom plate portion 23 of the heat sink 8, and further, heat is transferred to the radiation fins 24. The heat is radiated from the radiation fins 24. Further, when the temperature of the substrate 3 rises due to the heat of the LED light source 6, an ascending air current is generated in the interval between the heat radiation fins 24 of the heat sink 8, and as shown by the arrow A in FIG. The air that has entered the base end side (interval between the fins 23 on the base end side) flows to the front end side of the heat sink 8 along the outer wall surface side of the cylindrical portion 4 and is led out from the front end side to the outside. Consists of composition.

  On the other hand, when the temperature of the air in the cylinder of the cylindrical part 4 rises due to the rise in the temperature of the power supply 11 housed in the cylindrical part 4, as shown by the arrow B in FIG. Ascending airflow is generated in the tube, and air having a temperature lower than that of the air in the cylinder is introduced from the outside into the cylinder of the cylindrical part 4 through the opening 10 of the cylindrical part 4. By being derived, the power source 11 is cooled.

  In addition, as shown in FIG. 11, the LED lighting device 1 is provided with a heat insulating layer 13 on the outer peripheral wall of the cylindrical portion 4 b surrounded by the heat sink 8. As shown by an arrow C in FIG. 13 along the outer peripheral side of the cylindrical portion 4 from the tip portion where the opening 10 is formed to the tip portion of the heat sink 8, air passes in the cylindrical axis direction of the cylindrical portion 4. An air passage 14 is formed. As shown in FIG. 11, the air passage 14 is connected to the air passage 14a, the air passage 14b, and the air passages 14a and 14b so as to communicate with each other. The plate portion 27 is formed with a plurality of through holes 16 (see also FIG. 12) formed at intervals.

  The present invention is not limited to the above embodiments, and can take various forms. For example, in the above-described embodiment, the individual heat sink forming blocks 8a to 8d are formed by die casting. However, the method of forming the heat sink forming blocks 8a to 8d is not particularly limited, and is appropriately set. It can also be formed by molding other than die casting. However, the productivity can be improved by forming the individual heat sink forming blocks 8a to 8d by die casting, and the heat sink 8 can be formed by accurately forming the heat sink forming blocks 8a to 8d. Formation of the forming blocks 8a to 8d is preferable.

  In the heat sink 8 of the above embodiment, the thickness of the heat receiving bottom plate 23 is 4 mm, the thickness of the radiating fins 24 is approximately 1.5 mm, and the interval between the radiating fins 24 is 10 mm. 23 and the thickness of the radiation fin 24 and the interval between the radiation fins 24 are not particularly limited, and are set as appropriate. In addition, in order to form the tong ratio of the heat sink 8 to 5 or more and 20 or less and to reduce the weight of the heat sink 8, the thickness t of the heat receiving bottom plate portion 23 is set to 8 mm or less (for example, the diameter D of the heat receiving bottom plate portion 23 is set to be smaller). Preferably, the thickness of the heat dissipating fin 24 is set to an appropriate thickness that can maintain the mechanical strength of 2 mm or less, and the like. It is preferable that the space | interval of the radiation fin 24 shall be about 5-15 mm.

  Furthermore, in the said Example, although the length of the Z direction was formed in each radiation fin 24 of the heat sink formation blocks 8a-8d longer than the length of an XY surface, the formation aspect of the radiation fin 24 is set suitably. The radiating fins 24 may be formed such that the length in the Z direction is shorter than the length in the XY plane. In this case, for example, by removing the mold in the Z direction after molding the heat sink forming block, it is possible to reduce the thickness of the radiating fin and reduce the weight of the radiating fin 24 as described in the above embodiment. Can be realized.

  Furthermore, the material for forming the heat sink 8 is not particularly limited, and is appropriately set. The heat receiving bottom plate portion 23 and the heat radiating fins 24 are made of, for example, aluminum or an aluminum alloy, magnesium, a magnesium alloy, or thermal conductivity. The resin can be formed.

  Furthermore, in the said Example, although the heat-receiving bottom-plate part 23 which has the thermal connection surface 26 formed by joining several heat sink formation blocks 8a-8d was made into the shape which has the through-hole 22, the bottom-plate part for heat receiving 23 may be a disk shape in which the through hole 22 is not formed, or may have another shape (for example, a polygonal shape). In addition, the formation form such as the arrangement form of the radiating fins 24 is not particularly limited, but in accordance with the shape of the thermal connection surface 26 formed by joining the plurality of heat sink forming blocks 8a to 8d, It is preferable that the heat radiation fins 24 be formed from the central side of the target connection surface 26 toward the outer peripheral edge side, so that the heat of the substrate 3 on which the LED light source 6 is disposed can be efficiently radiated.

  Furthermore, in the said Example, although the heat sink 8 was formed by providing the four heat sink formation blocks 8a-8d, the number of the heat sink formation blocks which form the heat sink 8 is not limited, What is set suitably In addition, the shape of the heat sink forming block to be applied is also set as appropriate, and a plurality of heat sink forming blocks are arranged so that their thermal connection surfaces 26a form the same surface. As long as they are combined and joined, they do not necessarily have the same shape.

  Further, the LED lighting device of the present invention is not necessarily formed in the same manner as the LED lighting device 1 of the above embodiment, but has the heat sink of the present invention, and is formed by joining a plurality of heat sink forming blocks of the heat sink. A plurality of LED light sources arranged with a space therebetween may be directly or indirectly thermally connected to the planar thermal connection surface. For example, in the said Example, you may provide a fan as shown to the broken line F of FIG. 13 in the cylindrical member 4, or arrange | position the power supply 11 outside without providing the cylindrical member 4 etc. which the power supply 11 can accommodate. You may make it do.

  Moreover, the LED lighting apparatus 1 is good also as an aspect as is shown by FIGS. That is, as shown in FIG. 15B, the LED light source integrated body in which a plurality of LED light sources 6 are integrated as shown in FIG. A COB (chip-on-board) 40 may be directly joined to the thermal connection surface 26 of the heat sink 8 and arranged with a space therebetween, or the cylindrical portion 4a and the cylindrical body 15 may be disposed as in the above embodiment. The cylindrical body 15 may be omitted as shown in FIG. 15 (a) without providing it with a gap and forming a double cylindrical structure.

  In the example shown in FIGS. 14 and 15, the cable 20 drawn from the lower side of the power supply 11 is folded and disposed on the cylindrical portion 4 a side, and a part (folded portion) of the cable 20 is supported. An opening 10 is formed between the support plate 41 and the cylindrical portion 4a. When the LED lighting device 1 is formed as shown in FIGS. 14 and 15, the cost can be further reduced by the amount that the substrate 3 and the cylindrical body 15 can be omitted.

  Since the heat sink of the present invention can dissipate almost uniform heat on the substrate surface with a simple configuration, it can be used, for example, as a heat dissipating means for an LED lighting device in the household or industrial fields. It can be used as a lighting device in industrial fields.

DESCRIPTION OF SYMBOLS 1 LED lighting apparatus 2 Through-hole 3 Substrate 4 (4a, 4b) Cylindrical part 5 LED light source arrangement surface 6 LED light source 7 Substrate surface 8 Heat sink 8a-8d Heat sink formation block 9 Vent 10 Open 11 Power source 12 Transparent cover member DESCRIPTION OF SYMBOLS 13 Heat insulation layer 14 Air passage 15 Cylinder 16 Through-hole 23 Heat-receiving bottom board part 24 Radiation fin 26,26a Thermal connection surface 32 Cylindrical wall formation board part 40 COB (chip on board)

Claims (7)

  A heat receiving bottom plate portion having a thermal connection surface to which the heating element is thermally connected, and a surface opposite to the thermal connection surface of the heat receiving bottom plate portion are provided to be spaced from each other. A plurality of heat sink forming blocks in which the heat dissipating fins and the heat receiving bottom plate are integrally formed, and the plurality of heat sink forming blocks have the thermal The connecting surfaces are arranged so as to form the same surface, the side surfaces of the adjacent heat receiving bottom plate portions are bonded to each other, and the plurality of heat sink forming blocks are bonded to form the same surface-shaped thermal connecting surface. A heat sink, wherein the heat sink is formed as a joint surface that is directly or indirectly thermally connected to the plurality of LED light sources serving as the heating elements disposed with a space therebetween.   2. The heat sink according to claim 1, wherein the plurality of heat radiation fins formed on each of the heat sink forming blocks are extended in the same direction in parallel to each other.   The thermal connection surfaces formed by joining the heat-receiving bottom plate portions of the plurality of heat sink forming blocks are formed in a mode having a through hole in the center of the surface, and a plurality of heat connection surfaces are arranged in each heat sink forming block. The heat sink according to claim 2, wherein at least a plurality of the heat dissipating fins in the center of the array are formed in a direction connecting the edge of the through hole and the outer peripheral edge of the thermal connection surface.   The heat sink according to claim 1, wherein the heat sink forming block is formed by die casting.   2. The heat dissipating fins are formed such that the thickness decreases from the central portion of the thermal connection surface formed by joining the heat receiving bottom plate portions of the plurality of heat sink forming blocks toward the outer peripheral edge portion. The heat sink according to claim 1.   The heat receiving bottom plate portions of adjacent heat sink forming blocks are mechanically coupled, and the joint portion between the side surfaces of the heat receiving bottom plate portions is sealed with a sealing material. Item 6. The heat sink according to any one of Items 5.   A heat sink according to any one of claims 1 to 6, wherein a plurality of heat sink forming blocks of the heat sink are joined to each other on a same thermal connection surface with a space therebetween. A plurality of LED light sources arranged in this manner are directly or indirectly thermally connected to form an LED lighting device.

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