JP2015179153A5

JP2015179153A5 -

Info

Publication number: JP2015179153A5
Application number: JP2014055952A
Authority: JP
Filing date: 2014-03-19
Publication date: 2017-03-30
Anticipated expiration: 2034-03-19

Description

すなわち本発明は、（ａ）一般式（１）で表される構造単位を有する樹脂、（ｂ）感光剤、（ｃ）一般式（３）で表されるアルキレンオキサイド鎖を含有する化合物、および（ｄ）一般式（２）で表される熱架橋剤を含有することを特徴とする感光性樹脂組成物である。 That is, the present invention provides (a) a resin having a structural unit represented by the general formula (1), (b) a photosensitizer, (c) a compound containing an alkylene oxide chain represented by the general formula (3) , and (D) A photosensitive resin composition comprising a thermal crosslinking agent represented by the general formula (2).

（一般式（１）中、Ｒ^１は２個以上の炭素原子を有する２価〜８価の有機基を示し、Ｒ^２は２個以上の炭素原子を有する２価〜８価の有機基を示し、Ｒ^３およびＲ４は同じでも異なっていてもよく、水素原子または炭素数１〜２０の有機基を示す。ｎは５〜１０００００の範囲、ｐおよびｑは、それぞれ０〜４の整数、ｒおよびｓは、それぞれ０〜２の整数であり、ｐ＋ｑ＞０である。）
（一般式（２）中、Ｒ ^６は炭素数１〜２０の１価の有機基、Ｃｌ、Ｂｒ、ＩまたはＦを示す。Ｒ ^７およびＲ ^８は、ＣＨ _２ＯＲ ^１０（Ｒ ^１０は水素原子または炭素数１〜６の１価の炭化水素基）を示す。Ｒ ^９は水素原子、メチル基またはエチル基を示す。ｈは０〜２の整数、ｉは１〜４の整数を示す。ｉが２〜４の場合、複数のＲ ^６〜Ｒ ^９はそれぞれ同じでも異なってもよいが、同一のベンゼン環がＲ ^６を２つ有する場合は、Ｒ ^６は同じである。Ｒ ^１１〜Ｒ ^３３は水素原子、炭素数１〜２０の１価の有機基、Ｃｌ、Ｂｒ、ＩまたはＦを示す。） (In the general formula (1), R ¹ represents a divalent to octavalent organic group having 2 or more carbon atoms, and R ² represents a divalent to octavalent organic group having 2 or more carbon atoms. R ³ and R 4 may be the same or different and each represents a hydrogen atom or an organic group having 1 to 20 carbon atoms, n is in the range of 5 to 100,000, p and q are each an integer of 0 to 4, r And s are each an integer of 0 to 2, and p + q> 0.)
(In General Formula (2), R ⁶ represents a monovalent organic group having 1 to 20 carbon atoms, Cl, Br, I, or F. R ⁷ and R ⁸ represent CH ₂ OR ¹⁰ (R ¹⁰ represents a hydrogen atom) Or a monovalent hydrocarbon group having 1 to 6 carbon atoms, R ⁹ represents a hydrogen atom, a methyl group or an ethyl group, h represents an integer of 0 to 2, and i represents an integer of 1 to 4. i If is 2-4, a plurality of ^R 6 to R ⁹ may be identical or different, if the same benzene ring has two ^{R 6,} ^{R 6} is the same ^.R 11 ^{to R 33} Represents a hydrogen atom, a monovalent organic group having 1 to 20 carbon atoms, Cl, Br, I or F.)

（上記一般式（３）中、ｌおよびｚはそれぞれ独立に０または１、ｎおよびｘはそれぞれ独立に１〜２０の整数、ｍおよびｙはそれぞれ独立に１〜２０の整数を示す。Ｒ ^３７はそれぞれ同じでも異なっていてもよく、水素原子または炭素数１〜２０の有機基を示す。）
また、本発明は、上記の感光性樹脂組成物を基板上に塗布し感光性樹脂膜を形成する工程、該感光性樹脂膜を乾燥する工程、該感光性樹脂膜を露光する工程、露光された感光性樹脂膜を現像する工程、および、加熱処理をする工程を含む耐熱性樹脂膜の製造方法である。 (In the general formula (3), l and z are each independently 0 or 1, n and x are each independently an integer of 1 to 20, and m and y are each independently an integer of 1 to 20. R ^37. May be the same or different and each represents a hydrogen atom or an organic group having 1 to 20 carbon atoms.)
The present invention also includes a step of coating the photosensitive resin composition described above on a substrate to form a photosensitive resin film, a step of drying the photosensitive resin film, a step of exposing the photosensitive resin film, and an exposure. The method for producing a heat resistant resin film includes a step of developing the photosensitive resin film and a step of heat treatment.

以下実施例等をあげて本発明を説明するが、本発明はこれらの例によって限定されるものではない。ただし、以下に示す実施例６および８は参考例である。なお、実施例中の感度測定とテーパー角の測定は以下の方法で行った。 Hereinafter, the present invention will be described with reference to examples and the like, but the present invention is not limited to these examples. However, Examples 6 and 8 shown below are reference examples. The sensitivity measurement and taper angle measurement in the examples were performed by the following methods.

Claims

(A) a resin having a structural unit represented by general formula (1), (b) a photosensitizer, (c) a compound containing an alkylene oxide chain represented by general formula (3) , and (d) a general formula A photosensitive resin composition comprising a thermal crosslinking agent represented by (2).

(In the general formula (1), R ¹ represents a divalent to octavalent organic group having 2 or more carbon atoms, and R ² represents a divalent to octavalent organic group having 2 or more carbon atoms. , R ³ and R ⁴ may be the same or different and each represents a hydrogen atom or an organic group having 1 to 20 carbon atoms, n is in the range of 5 to 100,000, p and q are each an integer of 0 to 4, r And s are each an integer of 0 to 2 and p + q> 0.)

In the general formula (2), R ⁶ represents a monovalent organic group having 1 to 20 carbon atoms, Cl, Br, I, or F. R ⁷ and R ⁸ represent CH ₂ OR ¹⁰ (R ¹⁰ is a hydrogen atom or a monovalent hydrocarbon group having 1 to 6 carbon atoms). R ⁹ represents a hydrogen atom, a methyl group or an ethyl group. h represents an integer of 0 to 2, and i represents an integer of 1 to 4. If i is 2 to 4, a plurality of ^R 6 to R ⁹ may be the same or different, respectively, but if the same benzene ring has two ^{R 6,} ^{R 6} is the same. )
(In the general formula (2), R ^{11 to} R ³³ each independently represent a hydrogen atom, a monovalent organic group having 1 to 20 carbon atoms, Cl, Br, I, or F.)

(In the general formula (3), l and z are each independently 0 or 1, n and x are each independently an integer of 1 to 20, and m and y are each independently an integer of 1 to 20. R ^37. May be the same or different and each represents a hydrogen atom or an organic group having 1 to 20 carbon atoms.)

The content of the compound containing an alkylene oxide chain represented by (c) general formula (3) is 0 with respect to 100 parts by weight of the resin having the structural unit represented by (a) general formula (1). The photosensitive resin composition according to claim 1 , wherein the content is 0.01 to 1 part by weight .

An electronic component using the photosensitive resin composition according to claim 1.

A step of applying the photosensitive resin composition according to claim 1 or 2 onto a substrate to form a photosensitive resin film, a step of drying the photosensitive resin film, a step of exposing the photosensitive resin film, and exposure. A method for producing a heat-resistant resin film, including a step of developing the photosensitive resin film and a step of heat treatment.

A step of applying the photosensitive resin composition according to claim 1 or 2 onto a substrate on which a first electrode is formed to form a photosensitive resin film, and drying, exposing, developing and heat-treating the photosensitive resin film. And forming the insulating layer, forming the light emitting layer, and forming the second electrode.