JP2015078253A5 - - Google Patents

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JP2015078253A5
JP2015078253A5 JP2013214426A JP2013214426A JP2015078253A5 JP 2015078253 A5 JP2015078253 A5 JP 2015078253A5 JP 2013214426 A JP2013214426 A JP 2013214426A JP 2013214426 A JP2013214426 A JP 2013214426A JP 2015078253 A5 JP2015078253 A5 JP 2015078253A5
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resin composition
base materials
substrate
organic group
polyimide
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JP2013214426A
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JP2015078253A (en
JP6206071B2 (en
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すなわち本発明は、（ａ）一般式（１）で表される構造単位を有するポリイミド前駆体と、（ｂ）一般式（２）で表されるエポキシ化合物とを含む基材用樹脂組成物である。 That is, this invention is the resin composition for base materials containing (a) the polyimide precursor which has a structural unit represented by General formula (1), and the epoxy compound represented by (b) General formula (2). is there.

Claims (14)

（ａ）一般式（１）で表される構造単位を有するポリイミド前駆体と、（ｂ）一般式（２）で表されるエポキシ化合物とを含む基材用樹脂組成物。
Figure 2015078253
 （一般式（１）中、Ｘ１、Ｘ２は各々独立に水素原子または炭素数１〜１０の１価の有機基であり、Ａは４価の有機基であり、Ｂは２価の有機基である。）
Figure 2015078253
 （一般式（２）中、Ｒ１、Ｒ２は各々独立に炭素数１〜１０の２価の有機基であり、Ｒ３、Ｒ４、Ｒ５、Ｒ６は各々独立に水素原子、ハロゲン原子、水酸基または炭素数１〜１０の１価の有機基であり、ａ、ｂ、ｃ、ｄは各々独立に０〜４の整数である。） (A) The resin composition for base materials containing the polyimide precursor which has a structural unit represented by General formula (1), and the epoxy compound represented by (b) General formula (2).
Figure 2015078253
 (In the general formula (1), X 1 and X 2 are each independently a hydrogen atom or a monovalent organic group having 1 to 10 carbon atoms, A is a tetravalent organic group, and B is a divalent organic group. Group.)
Figure 2015078253
 (In General Formula (2), R 1 and R 2 are each independently a divalent organic group having 1 to 10 carbon atoms, and R 3 , R 4 , R 5 and R 6 are each independently a hydrogen atom, halogen, An atom, a hydroxyl group or a monovalent organic group having 1 to 10 carbon atoms, and a, b, c and d are each independently an integer of 0 to 4). 一般式（１）中Ａが下記式（３）〜（７）から選択される４価の有機基であり、Ｂは下記式（１３）〜（１８）から選択される２価の有機基である請求項１記載の基材用樹脂組成物。
Figure 2015078253
 In general formula (1), A is a tetravalent organic group selected from the following formulas (3) to (7), and B is a divalent organic group selected from the following formulas (13) to (18). The resin composition for base materials according to claim 1.
Figure 2015078253
 前記エポキシ化合物が、９，９−ビス（４−グリシジルオキシフェニル）フルオレンである請求項１または２記載の基材用樹脂組成物 The resin composition for a substrate according to claim 1 or 2, wherein the epoxy compound is 9,9-bis (4-glycidyloxyphenyl) fluorene. さらに溶剤を含む請求項１〜３のいずれかに記載の基材用樹脂組成物。 Furthermore , the resin composition for base materials in any one of Claims 1-3 containing a solvent. 請求項１から４のいずれかに記載の基材用樹脂組成物を加熱してなるポリイミド樹脂基材。 Polyimide resin base material formed by heating the base resin composition according to any one of claims 1 to 4. 請求項５記載のポリイミド樹脂基材上にブラックマトリックスおよび着色画素を備えたカラーフィルタ。 A color filter comprising a black matrix and colored pixels on the polyimide resin substrate according to claim 5. 前記ブラックマトリックスが、ポリイミド樹脂に黒色顔料を分散した樹脂ブラックマトリックスである請求項６記載のカラーフィルタ。 The color filter according to claim 6, wherein the black matrix is a resin black matrix in which a black pigment is dispersed in a polyimide resin. 以下の工程を含むことを特徴とする請求項６または７に記載のカラーフィルタの製造方法。
（１）請求項４に記載の基材用樹脂組成物を基板上に塗布する工程
（２）塗布された基材用樹脂組成物から溶剤を除去する工程
（３）基材用樹脂組成物中のポリイミド前駆体をイミド化してポリイミド樹脂基材を得る工程
（４）ブラックマトリックスおよび着色画素を形成する工程 The method for producing a color filter according to claim 6, comprising the following steps.
(1) The process of apply | coating the resin composition for base materials of Claim 4 on a board | substrate (2) The process of removing a solvent from the apply | coated resin composition for base materials (3) In the resin composition for base materials Step of obtaining a polyimide resin substrate by imidizing the polyimide precursor of (4) Step of forming a black matrix and colored pixels 請求項５に記載のポリイミド樹脂基材上に無機膜およびＴＦＴを備えたＴＦＴ基板。 A TFT substrate comprising an inorganic film and a TFT on the polyimide resin substrate according to claim 5. 前記無機膜が、ケイ素の酸化物、窒化物、または酸窒化物を含む請求項９に記載のＴＦＴ基板。 TFT substrate of claim 9, including pre-inorganic film, an oxide of silicon, nitride, or oxynitride. 以下の工程を含むことを特徴とする請求項９または１０に記載のＴＦＴ基板の製造方法。
（１）請求項４に記載の基材用樹脂組成物を基板上に塗布する工程
（２）塗布された基材用樹脂組成物から溶剤を除去する工程
（３）基材用樹脂組成物中のポリイミド前駆体をイミド化してポリイミド樹脂基材を得る工程
（４）ポリイミド樹脂基材上に無機膜を形成する工程
（５）ＴＦＴを形成する工程 The method for manufacturing a TFT substrate according to claim 9 or 10, comprising the following steps.
(1) The process of apply | coating the resin composition for base materials of Claim 4 on a board | substrate (2) The process of removing a solvent from the apply | coated resin composition for base materials (3) In the resin composition for base materials forming a step (5) TFT to step (4) of the polyimide precursor was imidized to obtain a polyimide resin base material forming the inorganic film on a polyimide resin substrate 請求項６または７に記載のカラーフィルタに発光デバイスを貼り合わせてなる表示デバイス。 A display device comprising a light-emitting device bonded to the color filter according to claim 6. 請求項９または１０に記載のＴＦＴ基板を有する表示デバイス。 Display device having a TFT substrate of claim 9 or 10. 前記表示デバイスが有機ＥＬ素子である請求項１２または１３に記載の表示デバイス。 The display device according to claim 12 or 13, wherein the display device is an organic EL element.
JP2013214426A 2013-10-15 2013-10-15 RESIN COMPOSITION, POLYIMIDE RESIN FILM USING THE SAME, COLOR FILTER CONTAINING THE SAME, TFT SUBSTRATE, DISPLAY DEVICE AND METHOD FOR PRODUCING THEM Active JP6206071B2 (en)

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JP2013214426A JP6206071B2 (en) 2013-10-15 2013-10-15 RESIN COMPOSITION, POLYIMIDE RESIN FILM USING THE SAME, COLOR FILTER CONTAINING THE SAME, TFT SUBSTRATE, DISPLAY DEVICE AND METHOD FOR PRODUCING THEM

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JP2013214426A JP6206071B2 (en) 2013-10-15 2013-10-15 RESIN COMPOSITION, POLYIMIDE RESIN FILM USING THE SAME, COLOR FILTER CONTAINING THE SAME, TFT SUBSTRATE, DISPLAY DEVICE AND METHOD FOR PRODUCING THEM

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KR101966731B1 (en) * 2015-05-01 2019-04-09 주식회사 엘지화학 Polyimide-based solution and polyimide-based film prepared by using same
KR102531268B1 (en) * 2015-12-31 2023-05-12 주식회사 동진쎄미켐 Polyimideprecursor, method for producing thereof and method for producing polyimide film using the same
KR102580455B1 (en) * 2015-12-31 2023-09-20 주식회사 동진쎄미켐 Polyimidepolymer composition, method for producing thereof and method for producing polyimide film using the same
CN109071774B (en) * 2016-04-18 2021-08-03 捷恩智株式会社 Thermosetting resin composition, cured film, substrate with cured film, and electronic component
CN110099974B (en) * 2016-12-27 2022-02-25 日产化学株式会社 Composition for forming protective layer on substrate
JP6981011B2 (en) * 2017-02-22 2021-12-15 東洋紡株式会社 Manufacturing method of temporary support substrate and device for device formation
JP6981010B2 (en) * 2017-02-22 2021-12-15 東洋紡株式会社 Manufacturing method of temporary support substrate and device for device formation
JP7092117B2 (en) 2017-04-13 2022-06-28 Jnc株式会社 Thermosetting resin composition, cured film, substrate with cured film, electronic components and ink for inkjet
JP2020105232A (en) * 2017-04-13 2020-07-09 Jnc株式会社 Thermosetting resin composition, cured film, substrate with cured film, electronic component and inkjet ink
JPWO2022045207A1 (en) * 2020-08-26 2022-03-03

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JP2002020459A (en) * 2000-07-13 2002-01-23 Yokohama Rubber Co Ltd:The Epoxy resin composition
JP2003292577A (en) * 2002-03-29 2003-10-15 Toray Ind Inc Thermosetting colored composition and color filter and liquid crystal display device using the same
TWI513735B (en) * 2012-09-13 2015-12-21 Daxin Materials Corp Polyimide precursor and photosensitive resin composition
TWI488887B (en) * 2013-02-08 2015-06-21 長興材料工業股份有限公司 Polyimides, coating composition formed therefrom and use thereof

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