JP2015170247A - Package with rfid tag and method for manufacturing package with rfid tag - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a tablet package with an RFID tag that is easy to form a slit.SOLUTION: A tablet package 100 includes: a package body 150 including a resin sheet 111 on which a region capable of accommodating a tablet 200 is formed and a metal sheet 112 glued to the resin sheet 111; and an IC chip for performing radio information communication by using the metal sheet 112 as an antenna. A recess 113 is formed at a gluing surface with the metal sheet 112 on the resin sheet 111, a slit SLT is formed on the metal sheet 112, a part including an end forming the slit SLT of the metal sheet 112 is folded, and thereby the metal sheet is glued to an inner wall surface forming the recess 113.

Description

  The present invention relates to a package with an RFID tag and a method for manufacturing the package with an RFID tag, and more specifically, manufacturing a package with an RFID tag for packaging a predetermined content and a package with an RFID tag for packaging a predetermined content. Regarding the method.

  An RFID (Radio Frequency Identification) system is known as one system that transmits information without contact.

  An RFID system generally includes an RFID tag (also referred to as a “wireless tag”) and a reader / writer (RW) device. Information is read from and written to the RFID tag from the RW device by wireless communication.

  The RFID tag includes a so-called active type tag that is mounted with a battery and driven by the electric power, and a so-called passive type tag that receives electric power from the RW device and drives it using it as a power source.

  Active tags have a battery compared to passive tags, so there are advantages in terms of communication distance and communication stability, but the structure is complicated and the size is increased and the cost is increased. There are also disadvantages.

  In addition, with recent improvements in semiconductor technology, IC tags for passive tags have become smaller and higher in performance, and can be attached to individual items such as apparel and industrial parts by extending communication distance and improving communication stability. RFID systems have begun to be used in a wide range of fields such as logistics.

  In recent years, the use of RFID tags for drugs such as tablets and capsules (hereinafter collectively referred to as tablets) has been desired. For example, Patent Document 1 discloses a wireless IC tag intended to be mounted on a PTP (Press Through Package) which is a kind of heat seal packaging for medicine packaging.

  Here, in general PTP, one surface is covered with a synthetic resin sheet (hereinafter referred to as “resin sheet”), and the other surface is covered with aluminum foil. And in patent document 1, in order to use PTP as an antenna of RFID, the slit is formed in the aluminum foil which has sealed PTP. For example, Patent Document 2 discloses that the slit is formed by a cutting process using a dicing blade or a laser.

  However, when the slit is formed by cutting the aluminum foil, dust (shaving residue) is generated, so that a dust removal step is required as an additional step, which is inefficient. Moreover, when the packaging object of PTP is a chemical | medical agent, generation | occurrence | production of the said dust (shaving residue) is unpreferable on hygiene.

  The present invention provides a package main body including a storage portion having a region in which contents can be stored and a metal sheet bonded to the storage portion, and is attached to the package main body, and wireless information is obtained by using the metal sheet as an antenna. An IC chip that performs communication, and the housing portion has a recess formed on a bonding surface of the metal sheet, the metal sheet has a slit, and a portion including an end portion that forms the slit is bent. As a result, the RFID tag-attached package is affixed to the inner wall surface forming the concave portion of the housing portion.

  According to the package with an RFID tag of the present invention, since the metal sheet cut to form the slit is attached to the inner wall surface that forms the recess, the efficiency is good and the hygiene is also preferable.

It is the top view which looked at the tablet package concerning one embodiment of the present invention from the surface side. It is the top view which looked at the tablet package of FIG. 1 from the back side. It is AA arrow sectional drawing of FIG. It is BB arrow sectional drawing of FIG. It is a top view of a chip module. It is sectional drawing of the chip module of FIG. It is a figure for demonstrating the attachment structure of the chip module with respect to a metal sheet. It is the top view which looked at the tablet sheet containing multiple tablet packages of FIG. 1 from the surface side. It is the top view which looked at the tablet sheet of Drawing 8 from the back side. It is a figure for demonstrating the manufacturing method of a tablet sheet. It is the figure (the 1) which shows the state in which the several tablet package was put into the paper box. It is the figure (the 2) which shows the state in which the several tablet package was put into the paper box. Fig.13 (a)-FIG.13 (d) are the figures for demonstrating the formation method of the slit with respect to a metal sheet. FIG. 14A to FIG. 14C are diagrams for explaining a modification of the method for forming the slits on the metal sheet.

  Hereinafter, an embodiment of the present invention will be described with reference to FIGS. 1 to 4 show a tablet package 100 according to an embodiment.

  In the tablet package 100, a plurality of tablets 200 are individually accommodated.

  In this specification, in the XYZ three-dimensional orthogonal coordinate system, the direction orthogonal to the sheet surface of the tablet package 100 is described as the Z-axis direction. The sheet surface is substantially rectangular, and the longitudinal direction is the Y-axis direction and the short direction is the X-axis direction.

  The tablet package 100 includes a package body 150 and a chip module 500. As shown in FIGS. 3 and 4, the package main body 150 is a so-called PTP (Press Through Package) type package member composed of a resin sheet 111 and a metal sheet 112.

  The resin sheet 111 as the accommodating portion has a plurality of accommodating areas for accommodating contents depending on the shape of the tablet 200 as the contents. Here, polyvinyl chloride (PVC) is used as the material of the resin sheet 111. The color of the resin sheet 111 is not particularly limited, and may be colorless (transparent), opaque, or translucent.

  The metal sheet 112 is a member for sealing (sealing) the tablet 200 in each accommodation region of the resin sheet 111. Here, an aluminum sheet is used as the metal sheet 112.

  In this case, when the accommodation area in which the tablet 200 is accommodated is crushed with a finger, the portion of the metal sheet 112 facing the accommodation area is broken by the tablet 200, and the tablet 200 can be taken out.

  As shown in FIG. 2, the metal sheet 112 is formed with a slit SLT extending in the Y-axis direction.

  As can be seen from FIGS. 1 and 2, a recess 113 is formed in the resin sheet 111 at a position overlapping the slit SLT in plan view. As shown in FIG. 3, the concave portion 113 is formed by projecting the central portion of the resin sheet 111 in the X-axis direction to the opposite side to the bonding surface with respect to the metal sheet 112 in the same manner as the accommodation region. In other words, the recess 113 is a groove formed in the bonding surface with respect to the metal sheet 112 and extending in the Y-axis direction.

  Of the inner wall surface of the recess 113, a part of the metal sheet 112 including the vicinity of the end portion that defines (forms) the slit SLT is bent and bonded. The method for forming the recess 113 and the slit SLT, and the bonding direction of the metal sheet 112 to the inner wall surface of the recess 113 will be described later.

  As shown in FIG. 2, the chip module 500 is attached to the front surface of the metal sheet 112 (the back surface of the tablet package 100).

  As an example, the chip module 500 includes an IC chip 511 and two terminal members 520, as shown in FIG.

  The IC chip 511 stores an ID number (unique ID) unique to the IC chip 511. This ID number can be read using the RW device.

  As shown in FIG. 6 as an example, each terminal member 520 includes a metal foil 521 and a resin film 522 that laminates both surfaces of the metal foil 521. Here, an aluminum foil is used as the metal foil 521.

  The metal foil 521 of each terminal member 520 is connected to the electrode 512 of the IC chip 511.

  Then, as shown in FIG. 2, one terminal member 520 is attached to the + X side of the slit SLT in the metal sheet 112, and the other terminal member 520 is attached to the −X side of the slit SLT in the metal sheet 112. It is attached. That is, in the chip module 500, the IC chip 511 is attached to the metal sheet 112 so as to straddle the slit SLT. Further, the chip module 500 is attached at a position where impedance matching can be taken in the Y-axis direction.

  The metal foil 521 of each terminal member 520 is attached to the metal sheet 112 via the resin film 522 (see FIG. 7). The resin film 522 and the metal sheet 112 are bonded with an adhesive or an adhesive (for example, a double-sided tape).

  The resin film 522 has a role as an insulator between the metal sheet 112 and the metal foil 521 and a role of protecting the metal foil 521 from contamination and damage.

  The shape of each terminal member 520 is such that the chip module 500 has no shape even if the housing region of the resin sheet 111 is crushed with a finger in order to take out the tablet 200 from the tablet package 100 and the metal sheet 112 at the portion facing the housing region is torn. In order not to affect, it has a shape that avoids the portion facing the accommodation area.

  As described above, in the tablet package 100, the chip module 500 is attached to the metal sheet 112 via an insulator in a state of straddling the slit SLT formed in the metal sheet 112. Thus, the metal sheet 112 functions as an antenna when wireless information communication is performed between the IC chip 511 and an RW device (not shown). Therefore, the tablet package 100 itself as a whole including the metal sheet 112 functions as a passive RFID tag that constitutes an RFID system together with the RW device. The tablet package 100 can also be regarded as a package with an RFID tag.

  In the RFID system including the tablet package 100 of this embodiment, when linearly polarized waves or circularly polarized radio waves are radiated from the RW device toward the slit SLT, an electric field is generated around the slit SLT. The electric field generates opposite voltages (alternating current) on the + Y side and the −Y side of the slit SLT in the metal sheet 112. And since the chip module 500 is attached so that the slit SLT may be straddled, an electric current flows into the IC chip 511 of the chip module 500, and it starts.

  The width Lw (see FIG. 2) of the slit SLT formed in the metal sheet 112 is related to the frequency width at which a desired gain (good antenna performance) as an antenna can be obtained. That is, as the width Lw is reduced, the frequency width is reduced. Conversely, as the width Lw is increased, the frequency width is increased. However, as the width Lw is increased, the impedance increases and the efficiency of the antenna decreases. In the present embodiment, as an example, the frequency of a radio wave used for wireless communication is 950 MHz, and Lw = 3 mm.

  Here, in the present embodiment, as shown in FIGS. 8 and 9, the tablet package 100 is a state in which a plurality of tablet packages 100 (10 as an example in FIGS. 8 and 9) are connected to each other. After being manufactured in the form of the tablet sheet 10 of FIG. 1, it is cut into the form of the tablet package 100 shown in FIGS.

Hereinafter, the manufacturing method of the tablet sheet 10 and the tablet package 100 is demonstrated easily using FIG.
(1) A resin sheet is pulled out from a long roll of resin sheet, heated with a heating device and softened, and then a storage region and a recess 113 (see FIG. 3 respectively) are formed with a resin sheet molding device. The formation method of the accommodation region and the recess 113 is not particularly limited, and for example, known vacuum forming, pressure forming, press forming or the like can be used.
(2) Using a tablet insertion device, insert the tablet into the resin sheet storage area.
(3) Using a tablet inspection device, confirm that the tablet is correctly inserted into the resin sheet storage area.
(4) The metal sheet is pulled out from the long roll of metal sheet, and the metal sheet is attached to the resin sheet using a metal sheet sticking device, and the accommodation area is sealed. In the present embodiment, a thermocompression bonding apparatus is used as the metal sheet sticking apparatus.
(5) Using a slit forming apparatus, a slit SLT having a predetermined length is formed at a predetermined position of the metal sheet. A specific method for forming the slit SLT will be described later.
(6) The chip module 500 (see FIG. 5) is attached to the metal sheet using the chip attaching device.
(7) When the inspection device confirms that the chip module 500 is correctly attached, the information writing device is used to write predetermined information (for example, an ID number unique to the tablet package 100) to the IC chip 511.
(8) After cutting one tablet sheet 10 (see FIGS. 8 and 9) for each tablet package 100, a predetermined number of tablet packages 100 are placed in a paper box (see FIGS. 11 and 12). Here, as an example, ten tablet sheets 10 are put in one paper box.
(9) Using the RW apparatus, the ID numbers of the plurality of tablet sheets 10 in the paper box are read out and registered in the database as history information together with data specifying the manufacturing date, the manufacturing site, the manufacturing line, and the like. The RW device may be a stationary type, a portable type, or a fixed type.

  Here, at the time when the metal sheet is in the form of a long roll (that is, before being bonded to the resin sheet), a method of previously forming the slit SLT in the metal sheet is also conceivable. It is necessary to apply tension to the long roll sheet, and the sheet may be torn. Moreover, in order to prevent sheet tearing, it is conceivable to increase the thickness of the metal sheet. However, in this case, there is a problem that it is difficult to take out the tablet. On the other hand, in this embodiment, since the slit SLT is formed in the metal sheet 112 after the metal sheet 112 is bonded to the resin sheet 111, there is no problem as described above.

  Next, the slit formation process which forms a slit in a metal sheet among the manufacturing processes of the said tablet sheet 10 is demonstrated. The slits are formed on the metal sheet before being divided into a plurality of tablet packages 100 (before a plurality of chip modules 500 are mounted) (see FIG. 10). For convenience, only one package body 150 will be illustrated and described (actually, a plurality of package bodies 150 are continuously formed in a sheet shape).

  FIG. 13A shows a state immediately after the housing area and the recess 113 are formed in the resin sheet 111 by the resin sheet molding apparatus (see FIG. 10). Note that the accommodation region and the recess 113 may be formed in separate steps.

  In FIG. 13B, the tablet 200 is inserted into the accommodation area by the tablet insertion device (see FIG. 10), the metal sheet 112 is pasted on the resin sheet 111 by the metal sheet pasting device, and the tablet 200 is sealed. The state immediately after is shown (completion of the package body 150).

  Here, since the metal sheet 112 is bonded to the resin sheet 111 by thermocompression bonding, a state in which the metal sheet 112 is formed in a long roll shape in advance on the back surface (bonding surface with the resin sheet 111). And) A thermal welding agent as an adhesive is applied (coated) over the entire surface. And the part which opposes an accommodation area | region and the part which opposes the recessed part 113 among the metal sheets 112 are spaced apart from the resin sheet 111, Therefore It does not adhere | attach on the resin sheet 111.

  FIG. 13C shows a state where the slit forming device (see FIG. 10) is cutting the metal sheet 112 in order to form the slit SLT. The slit forming device has a cutter 180, and uses the cutter 180 to cut a central portion of the metal sheet 112 in the X-axis direction of an area overlapping the recess 113 (area not bonded to the resin sheet 111). Form. Note that the slit forming device may have a cutter (blade) having the same length as the slit SLT extending in a direction perpendicular to the paper surface, or a cutter (blade) shorter than the slit SLT is orthogonal to the paper surface. It may be moved in the direction. Here, since the slit forming device only forms a cut having the same length as the slit SLT in the metal sheet 112, dust is not generated in the metal sheet cutting step shown in FIG.

  FIG. 13 (d) shows a state in which the welding apparatus adheres a portion of the metal sheet 112 that is not bonded to the resin sheet 111 to the inner wall surface of the recess 113. The welding apparatus has a pressing member 182 that is formed to be narrower than the interval between the pair of opposed surfaces of the recess 113. The pressing member has a heater and is provided so as to be movable in the vertical direction on the paper surface.

  When the welding device inserts the pressing member 182 into the recess 113, the metal sheet 112 is bent when the portion including the vicinity of the end that defines (forms) the slit SLT is pressed by the pressing member 182, and is bent. The heated portion is bonded to each of the pair of opposing surfaces of the recess 113 by heating. Note that the cradle of the tablet package 100 such as the slit forming apparatus and the welding apparatus shown in FIGS. 13A to 13D may be wholly or partially in common.

  In addition, the formation method of the slit SLT shown by Fig.13 (a)-FIG.13 (d) is an example, and can be changed suitably. For example, FIGS. 14A to 14B show another example (modified example) of the method of forming the slit SLT.

  FIG. 14A shows a state immediately after the housing area and the recess 114 are formed in the resin sheet 111 by the resin sheet molding apparatus. Here, in the above-described embodiment (see FIG. 13A), the recess 113 has a pair of opposed surfaces that are substantially parallel to each other as the surface to which the metal sheet 112 is bonded. 114 is formed such that the XZ section of the resin sheet 111 is V-shaped and has a pair of inclined surfaces.

  FIG. 14B shows a state immediately after the tablet 200 is inserted into the accommodation area and the metal sheet 112 is attached to the resin sheet 111. Also in this modification, the portion of the metal sheet 112 that faces the recess 114 is separated from the resin sheet 111, and thus is not bonded to the resin sheet 111.

  In FIG. 14 (c), the cutting and welding apparatus having the cutter 184 cuts the metal sheet 112, and the portion of the metal sheet 112 that is not bonded to the resin sheet 111 is bonded to the inner wall surface of the recess 114. It is shown. The cutter 184 has a blade having the same length as the slit SLT extending in a direction perpendicular to the paper surface. The cutter 184 has a heater (or is connected to the heater) and is provided so as to be movable in the vertical direction on the paper surface.

  The cutting and welding apparatus inserts the cutter 184 into the recess 113 as it is after cutting the metal sheet 112 using the cutter 184. As a result, a portion of the metal sheet 112 that includes the vicinity of the end that defines (forms) the slit SLT is bent by being pressed by the cutter 184, and the bent portion is heated to thereby form the recess 114. Bonded to each of the pair of inclined surfaces. In this modification, the cutting process and the bonding process of the metal sheet 112 can be performed continuously (substantially simultaneously), so that the efficiency is high.

  As described above, according to the tablet package 100 according to the present embodiment (including the above-described modification), the metal sheet 112 is bent near the end portion that defines (forms) the slit SLT to form the recess 113 (that is, the resin sheet). 111), so that no cuts (dust) are generated when the slit SLT is formed. In addition, the dust removal step is unnecessary, which is efficient.

  In addition, if the vicinity of the end of the metal sheet 112 that defines (forms) the slit SLT is not bonded to the resin sheet 111, the impedance of the metal sheet 112 (that is, the antenna) may become unstable (change). According to the tablet package 100 of this embodiment, since the metal sheet 112 is bonded to the resin sheet 111, stable antenna performance can be obtained.

  In addition, the said embodiment is an example of the manufacturing method of the package with an RFID tag and the package with an RFID tag to which this invention was applied, Comprising: The component can be changed suitably. For example, although the said embodiment demonstrated the case where polyvinyl chloride (PVC) was used as a material of the resin sheet 111, a resin sheet is not limited to this.

  Moreover, although the said embodiment demonstrated the case where an aluminum sheet was used as the metal sheet 112, a metal sheet is not limited to this.

  Moreover, although the said embodiment demonstrated the case where aluminum foil was used as the metal foil 521 of the terminal member 520, a terminal member is not limited to this.

  In addition, the shape of the slit SLT in the above embodiment is a shape extending in the Y-axis direction, but this is an example, and the shape of the slit is not limited thereto, for example, a slit extending in the Y-axis direction. And a combination of slits extending in the X-axis direction. Further, the slit is not limited to a straight line, and may be curved.

  Moreover, although the said embodiment demonstrated the case where a tablet is a chemical | medical agent, it is not limited to this. For example, the tablet may be food.

  Moreover, in the said embodiment, although the chip module 500 was affixed on the metal sheet | seat 112 (the back surface of the tablet package 100) among the package main bodies 150, it is not restricted to this, The resin sheet 111 side (namely, between adjacent accommodation area | regions) ) May be attached to the chip module 500. Even in this case, the metal sheet 112 on which the slit SLT is formed can function as an antenna of the RFID tag.

  In the above-described embodiment, the slit SLT is formed in the metal sheet and the chip module 500 is pasted (slit formation and chip mounting are performed together) before being cut into the tablet package 100. Without being limited thereto, after a roll of a resin sheet and a roll of a metal sheet are bonded together, they are cut into tablet packages, and slits SLT are formed in the metal sheets of each of the cut tablet packages, and the chip module 500 is bonded. (Slit formation and chip mounting may be performed separately).

  Moreover, although the said embodiment demonstrated the case where the tablet package 100 was a PTP (Press Through Package) type, it is not limited to this. For example, a so-called blister type package member may be used. However, in this case, the metal sheet 112 needs to be attached to the mount.

  DESCRIPTION OF SYMBOLS 100 ... Tablet package (tablet package with RFID tag), 111 ... Resin sheet, 112 ... Metal sheet, 113 ... Recess, 200 ... Tablet, 500 ... Chip module, SLT ... Slit.

JP 2013-140575 A JP 2005-301738 A

Claims (7)

A package main body including an accommodating portion having an area in which contents can be accommodated, and a metal sheet bonded to the accommodating portion;
An IC chip attached to the package body and performing wireless information communication by using the metal sheet as an antenna,
The housing portion has a recess formed on the bonding surface to the metal sheet,
The metal sheet is a package with an RFID tag attached to an inner wall surface forming the concave portion of the housing portion by forming a slit and bending a portion including an end portion forming the slit.   2. The package with an RFID tag according to claim 1, wherein the region in which the contents can be accommodated and the concave portion are provided by projecting a part of the accommodating portion to a side opposite to a bonding surface with respect to the metal sheet. The metal sheet is bonded to the storage portion via an adhesive applied to a bonding surface for the storage portion,
The package with an RFID tag according to claim 1 or 2, wherein a portion including an end portion defining the slit in the metal sheet is attached to an inner wall surface forming the concave portion of the housing portion via the adhesive. . An IC that performs wireless information communication by using a package body including a housing portion having a region that can contain contents and a metal sheet bonded to the housing portion, and being attached to the package body and using the metal sheet as an antenna. A method of manufacturing a package with an RFID tag comprising a chip,
Forming a recess in a bonding surface of the housing portion with respect to the metal sheet;
Putting the contents into the housing part;
Bonding the container and the metal sheet to seal the contents;
Forming a slit in the metal sheet of the package body containing the contents;
Bending the portion of the metal sheet that includes the end portion that forms the slit, and affixing it to the inner wall surface that forms the recess of the housing portion;
Mounting the IC chip on the package body, and a method of manufacturing a package with an RFID tag.   The method of manufacturing a package with an RFID tag according to claim 4, wherein the concave portion is formed in the accommodating portion simultaneously with an area in which the contents can be accommodated. In the step of forming the slit, a cutter is used to cut the metal sheet,
The method for manufacturing a package with an RFID tag according to claim 4 or 5, wherein, in the attaching step, the metal sheet is attached to the housing portion using the cutter. In the step of mounting the IC chip, a plurality of the IC chips are mounted on the package body,
The package with an RFID tag according to any one of claims 4 to 6, further comprising a step of dividing the package body on which the plurality of IC chips are mounted into a plurality of pieces so that each of the package bodies has one IC chip. Manufacturing method.

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