JP2015170246A - Method for manufacturing package with rfid tag and package with rfid tag - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a tablet package with an RFID tag that is easy to form a slit.SOLUTION: A tablet package includes a resin sheet 111 capable of accommodating a tablet 200 and a metal sheet 112 glued to the resin sheet 111, and performs radio information communication by using the metal sheet 112 as an antenna. A method for manufacturing the tablet package includes the steps of: gluing the resin sheet 111 and the metal sheet 112 together to seal the tablet 200; forming a slit SLT on the metal sheet; and mounting an IC chip on the metal sheet 112. In the gluing step, a non-glued part is provided where the resin sheet 111 and the metal sheet 112 are not glued together in part of a region including a region where the slit SLT is formed.

Description

  The present invention relates to a method for manufacturing a package with an RFID tag and a package with an RFID tag, and more particularly, a method for manufacturing a package with an RFID tag for packaging predetermined contents, and an RFID tag for packaging predetermined contents. Regarding packages.

  An RFID (Radio Frequency Identification) system is known as one system that transmits information without contact.

  An RFID system generally includes an RFID tag (also referred to as a “wireless tag”) and a reader / writer (RW) device. Information is read from and written to the RFID tag from the RW device by wireless communication.

  The RFID tag includes a so-called active type tag that is mounted with a battery and driven by the electric power, and a so-called passive type tag that receives electric power from the RW device and drives it using it as a power source.

  Active tags have a battery compared to passive tags, so there are advantages in terms of communication distance and communication stability, but the structure is complicated and the size is increased and the cost is increased. There are also disadvantages.

  In addition, with recent improvements in semiconductor technology, IC tags for passive tags have become smaller and higher in performance, and can be attached to individual items such as apparel and industrial parts by extending communication distance and improving communication stability. RFID systems have begun to be used in a wide range of fields such as logistics.

  In recent years, the use of RFID tags for drugs such as tablets and capsules (hereinafter collectively referred to as tablets) has been desired. For example, Patent Document 1 discloses a wireless IC tag intended to be mounted on a PTP (Press Through Package) which is a kind of heat seal packaging for medicine packaging.

  Here, in general PTP, one surface is covered with a synthetic resin sheet (hereinafter referred to as “resin sheet”), and the other surface is covered with aluminum foil. And in patent document 1, in order to use PTP as an antenna of RFID, the slit is formed in the aluminum foil which has sealed PTP. For example, Patent Document 2 discloses that the slit is formed by a cutting process using a dicing blade or a laser.

  However, when the slit is formed by cutting the aluminum foil, dust (shaving residue) is generated, so that a dust removal step is required as an additional step, which is inefficient. Moreover, when the packaging object of PTP is a chemical | medical agent, generation | occurrence | production of the said dust (shaving residue) is unpreferable on hygiene.

  The present invention provides a package main body including a storage portion having a region in which contents can be stored and a metal sheet bonded to the storage portion, and is attached to the package main body, and wireless information is obtained by using the metal sheet as an antenna. An IC chip that performs communication, and a method of manufacturing a package with an RFID tag, the step of putting the contents into the container, the container and the metal sheet for sealing the contents A step of forming a slit in the metal sheet of the package main body containing the contents, and a step of mounting the IC chip on the package main body. In the part of the region including the region in which the slit is formed in the step of forming the slit, the accommodating portion and the metal sheet are interchanged. Is a manufacturing method of RFID tagged packages providing the non-adhesive portion which is not adhered to.

  According to the method for manufacturing a package with an RFID tag of the present invention, a part of the metal sheet removed to form the slit can be easily removed from the package body, so that the efficiency is high and hygienic is preferable.

It is the top view which looked at the tablet package concerning one embodiment of the present invention from the surface side. It is the top view which looked at the tablet package of FIG. 1 from the back side. It is AA arrow sectional drawing of FIG. It is BB arrow sectional drawing of FIG. It is a top view of a chip module. It is sectional drawing of the chip module of FIG. It is a figure for demonstrating the attachment structure of the chip module with respect to a metal sheet. It is the top view which looked at the tablet sheet containing multiple tablet packages of FIG. 1 from the surface side. It is the top view which looked at the tablet sheet of Drawing 8 from the back side. It is a figure for demonstrating the manufacturing method of a tablet sheet. It is the figure (the 1) which shows the state in which the several tablet package was put into the paper box. It is the figure (the 2) which shows the state in which the several tablet package was put into the paper box. FIG. 13A and FIG. 13B are diagrams for explaining a slit forming method for a metal sheet. It is a figure for demonstrating the modification of the formation method of the slit with respect to a metal sheet. It is a figure for demonstrating the formation method of the non-bonding part in a metal sheet. It is a figure for demonstrating the modification (the 1) of the formation method of a non-bonding part. It is a figure for demonstrating the modification (the 2) of the formation method of a non-bonding part.

  Hereinafter, an embodiment of the present invention will be described with reference to FIGS. 1 to 4 show a tablet package 100 according to an embodiment.

  In the tablet package 100, a plurality of tablets 200 are individually accommodated.

  In this specification, in the XYZ three-dimensional orthogonal coordinate system, the direction orthogonal to the sheet surface of the tablet package 100 is described as the Z-axis direction. The sheet surface is substantially rectangular, and the longitudinal direction is the Y-axis direction and the short direction is the X-axis direction.

  The tablet package 100 includes a package body 150 and a chip module 500. As shown in FIGS. 3 and 4, the package main body 150 is a so-called PTP (Press Through Package) type package member composed of a resin sheet 111 and a metal sheet 112.

  The resin sheet 111 as the accommodating portion has a plurality of accommodating areas for accommodating contents depending on the shape of the tablet 200 as the contents. Here, polyvinyl chloride (PVC) is used as the material of the resin sheet 111. The color of the resin sheet 111 is colorless (transparent) in the present embodiment, but is not limited thereto, and may be opaque or translucent (from the surface side) when it is necessary to ensure light shielding properties. The slit SLT may not be visible).

  The metal sheet 112 is a member for sealing (sealing) the tablet 200 in each accommodation region of the resin sheet 111. Here, an aluminum sheet is used as the metal sheet 112.

  In this case, when the accommodation area in which the tablet 200 is accommodated is crushed with a finger, the portion of the metal sheet 112 facing the accommodation area is broken by the tablet 200, and the tablet 200 can be taken out.

  As shown in FIG. 2, the metal sheet 112 is formed with a slit SLT extending in the Y-axis direction.

  As shown in FIG. 2, the chip module 500 is attached to the front surface of the metal sheet 112 (the back surface of the tablet package 100).

  As an example, the chip module 500 includes an IC chip 511 and two terminal members 520, as shown in FIG.

  The IC chip 511 stores an ID number (unique ID) unique to the IC chip 511. This ID number can be read using the RW device.

  As shown in FIG. 6 as an example, each terminal member 520 includes a metal foil 521 and a resin film 522 that laminates both surfaces of the metal foil 521. Here, an aluminum foil is used as the metal foil 521.

  The metal foil 521 of each terminal member 520 is connected to the electrode 512 of the IC chip 511.

  Then, as shown in FIG. 2, one terminal member 520 is attached to the + X side of the slit SLT in the metal sheet 112, and the other terminal member 520 is attached to the −X side of the slit SLT in the metal sheet 112. It is attached. That is, in the chip module 500, the IC chip 511 is attached to the metal sheet 112 so as to straddle the slit SLT. Further, the chip module 500 is attached at a position where impedance matching can be taken in the Y-axis direction.

  The metal foil 521 of each terminal member 520 is attached to the metal sheet 112 via the resin film 522 (see FIG. 7). The resin film 522 and the metal sheet 112 are bonded with an adhesive or an adhesive (for example, a double-sided tape).

  The resin film 522 has a role as an insulator between the metal sheet 112 and the metal foil 521 and a role of protecting the metal foil 521 from contamination and damage.

  The shape of each terminal member 520 is such that the chip module 500 has no shape even if the housing region of the resin sheet 111 is crushed with a finger in order to take out the tablet 200 from the tablet package 100 and the metal sheet 112 at the portion facing the housing region is torn. In order not to affect, it has a shape that avoids the portion facing the accommodation area.

  As described above, in the tablet package 100, the chip module 500 is attached to the metal sheet 112 via an insulator in a state of straddling the slit SLT formed in the metal sheet 112. Thus, the metal sheet 112 functions as an antenna when wireless information communication is performed between the IC chip 511 and an RW device (not shown). Therefore, the tablet package 100 itself as a whole including the metal sheet 112 functions as a passive RFID tag that constitutes an RFID system together with the RW device. The tablet package 100 can also be regarded as a package with an RFID tag.

  In the RFID system including the tablet package 100 of this embodiment, when linearly polarized waves or circularly polarized radio waves are radiated from the RW device toward the slit SLT, an electric field is generated around the slit SLT. The electric field generates opposite voltages (alternating current) on the + Y side and the −Y side of the slit SLT in the metal sheet 112. And since the chip module 500 is attached so that the slit SLT may be straddled, an electric current flows into the IC chip 511 of the chip module 500, and it starts.

  The width Lw (see FIG. 2) of the slit SLT formed in the metal sheet 112 is related to the frequency width at which a desired gain (good antenna performance) as an antenna can be obtained. That is, as the width Lw is reduced, the frequency width is reduced. Conversely, as the width Lw is increased, the frequency width is increased. However, as the width Lw is increased, the impedance increases and the efficiency of the antenna decreases. In the present embodiment, as an example, the frequency of a radio wave used for wireless communication is 950 MHz, and Lw = 3 mm.

  Here, in the present embodiment, as shown in FIGS. 8 and 9, the tablet package 100 is a state in which a plurality of tablet packages 100 (10 as an example in FIGS. 8 and 9) are connected to each other. After being manufactured in the form of the tablet sheet 10 of FIG. 1, it is cut into the form of the tablet package 100 shown in FIGS.

Hereinafter, the manufacturing method of the tablet sheet 10 and the tablet package 100 is demonstrated easily using FIG.
(1) A resin sheet is pulled out from a long roll of resin sheet, heated with a heating device and softened, and then an accommodation region is formed with a resin sheet molding device. The method for forming the accommodation region is not particularly limited, and for example, known vacuum forming, pressure forming, press forming, or the like can be used.
(2) Using a tablet insertion device, insert the tablet into the resin sheet storage area.
(3) Using a tablet inspection device, confirm that the tablet is correctly inserted into the resin sheet storage area.
(4) The metal sheet is pulled out from the long roll of metal sheet, and the metal sheet is attached to the resin sheet using a metal sheet sticking device, and the accommodation area is sealed. In the present embodiment, a thermocompression bonding apparatus is used as the metal sheet sticking apparatus.
(5) Using a slit forming apparatus, a slit SLT having a predetermined length is formed at a predetermined position of the metal sheet. A specific method for forming the slit SLT will be described later.
(6) The chip module 500 (see FIG. 5) is attached to the metal sheet using the chip attaching device.
(7) When the inspection device confirms that the chip module 500 is correctly attached, the information writing device is used to write predetermined information (for example, an ID number unique to the tablet package 100) to the IC chip 511.
(8) After cutting one tablet sheet 10 (see FIGS. 8 and 9) for each tablet package 100, a predetermined number of tablet packages 100 are placed in a paper box (see FIGS. 11 and 12). Here, as an example, ten tablet sheets 10 are put in one paper box.
(9) Using the RW apparatus, the ID numbers of the plurality of tablet sheets 10 in the paper box are read out and registered in the database as history information together with data specifying the manufacturing date, the manufacturing site, the manufacturing line, and the like. The RW device may be a stationary type, a portable type, or a fixed type.

  Here, at the time when the metal sheet is in the form of a long roll (that is, before being bonded to the resin sheet), a method of previously forming the slit SLT in the metal sheet is also conceivable. It is necessary to apply tension to the long roll sheet, and the sheet may be torn. Moreover, in order to prevent sheet tearing, it is conceivable to increase the thickness of the metal sheet. However, in this case, there is a problem that it is difficult to take out the tablet. On the other hand, in this embodiment, since the slit SLT is formed in the metal sheet 112 after the metal sheet 112 is bonded to the resin sheet 111, there is no problem as described above.

  Next, the slit formation process which forms a slit in a metal sheet among the manufacturing processes of the said tablet sheet 10 is demonstrated. The slits are formed on the metal sheet before being divided into a plurality of tablet packages 100 (before a plurality of chip modules 500 are mounted) (see FIG. 10). For convenience, only one package body 150 will be illustrated and described (actually, a plurality of package bodies 150 are continuously formed in a sheet shape).

  As shown in FIG. 13A and FIG. 13B as an example, the slit forming apparatus 180a has a blade 182 (so-called cutting edge) in which a cutting edge is formed corresponding to a desired punching shape (here, the shape of the slit SLT). Bikku type blade). In addition, the slit forming device 180a has a cradle 184 on the surface of the resin sheet 111 (the surface opposite to the adhesive surface with respect to the metal sheet 112).

  In the slit forming device 180a, the cutting edge of the blade 182 cuts the metal sheet 112 (aluminum foil) by being driven by a general press device. The cutter 182 is stopped at the cutting position by a stopper 186 attached to the press device, whereby only the metal sheet 112 is cut (so-called half-cut). A part of the metal sheet 112 cut (cut out) by the slit forming device 180a is removed using a robot hand (not shown) or the like.

  As another example, as illustrated in FIG. 14, the slit forming device 180 b may include a cutter 188 having a cutting edge whose width direction dimension is equal to the width direction dimension of the slit SLT.

  In addition, the forming apparatus and forming method of the slit SLT are not limited to those described above, and can be changed as appropriate.

  Here, as described above, in the present embodiment, the metal sheet 112 is attached to the resin sheet 111 by the metal sheet attaching apparatus. And when a metal sheet sticking apparatus sticks the metal sheet 112 to the resin sheet 111, the area | region where the slit SLT is formed in the post process among the metal sheets 112 is not stuck to the resin sheet 111 ( Do not adhere).

  In this embodiment, a thermocompression bonding apparatus 190 as shown in FIG. 15 is used as an example of the metal sheet sticking apparatus. On the back surface (bonding surface with the resin sheet 111) of the metal sheet 112, a thermal welding agent is applied (coated) in advance (in a state of being formed into a long roll). Moreover, the thermocompression bonding apparatus 190 has a heater 192, and presses and heats the metal sheet 112 from the surface side using the heater 192 in a state where the metal sheet 112 and the resin sheet 111 are overlapped. . Also in this case, a cradle 194 is provided to face the heater 192. Thus, the metal sheet 112 is bonded (thermally welded) to the resin sheet 111 by being melted by cooling and being cured by cooling.

  A depression 196 (concave portion) is formed on the pressing surface of the metal sheet 112 in the heater 192 of the thermocompression bonding device 190 in a shape corresponding to the slit SLT. Therefore, even if the metal sheet 112 is pressed / heated using the heater 192, the heat-welding agent at the location corresponding to the depression 196 is not heated and thus does not melt. As a result, a non-adhesive portion that is not bonded to the resin sheet 111 is formed in a region of the metal sheet 112 where the slit SLT is to be formed in a later step.

  Therefore, in the slit forming step, when a part of the metal sheet 112 is removed, the metal sheet 112 (non-bonded part) of the removed part can be easily removed. In FIG. 15, a heating device that sandwiches the resin sheet 111 and the metal sheet 112 is illustrated, but the heating device is not limited thereto, and may be, for example, a roller type. Further, the heat welding agent may be applied to the resin sheet 111.

  The non-bonded portion formed on the metal sheet 112 may be formed slightly wider than the width Lw (see FIG. 2) of the slit SLT designed in advance. In this case, the non-bonded portion of the metal sheet 112 can be reliably removed after the slit SLT is formed. However, when the metal sheet 112 is not bonded to the resin sheet 111 around the slit SLT, the impedance of the metal sheet 112 as an antenna may change due to the movement of the non-bonded portion. It is desirable that the area of the surrounding non-bonded portion is as small as possible.

  Moreover, the method of forming the non-adhesion part of the metal sheet 112 corresponding to the slit SLT is not limited to the above, and can be appropriately changed. For example, as shown in FIG. 16, in the step before bonding the resin sheet 111 and the metal sheet 112, an adhesion blocking substance 212 that blocks the bonding between the resin sheet 111 and the metal sheet 112 is interposed. May be. The adhesion preventing substance 212 is formed in a shape corresponding to the slit SLT. As the adhesion preventing substance 212, silicon, Teflon (registered trademark) resin, or a synthetic resin having a melting temperature higher than that of the heat welding agent applied to the metal sheet 112 may be used. The adhesion preventing substance 212 may be provided by printing on the metal sheet 112 in advance by transfer printing, screen printing, or the like, or may be applied using a stamp device, an inkjet device, a dispenser device, or the like. The adhesion preventing substance 212 may be applied to the resin sheet 111 side. Moreover, you may form a non-bonding part in the area | region where the slit SLT will be formed among the metal sheets 112 from the beginning by not applying a heat welding agent.

  Further, as another example for forming a non-adhesive portion in the metal sheet 112, as shown in FIG. 17, a recess 214 is formed in the resin sheet 111 so that the metal sheet 112 and the resin sheet 111 are separated from each other. Anyway. The recess 214 can be formed simultaneously with the accommodation area by a known forming method such as vacuum forming when the accommodation area is formed by the resin sheet molding apparatus. Note that the recess 214 may be formed in a separate process from the accommodation region.

  As described above, according to the manufacturing method of the tablet package 100 according to the present embodiment, the portion of the metal sheet 112 where the slit SLT is to be formed is not adhered to the resin sheet 111 (in other words, metal Since the slit SLT is formed in a portion where the sheet 112 and the resin sheet 111 are not bonded), a part of the metal sheet 112 can be easily removed in the slit forming step, which is efficient and preferable in terms of hygiene.

  In addition, the said embodiment is an example of the manufacturing method of the package with an RFID tag and the package with an RFID tag to which this invention was applied, Comprising: The component can be changed suitably. For example, although the said embodiment demonstrated the case where polyvinyl chloride (PVC) was used as a material of the resin sheet 111, a resin sheet is not limited to this.

  Moreover, although the said embodiment demonstrated the case where an aluminum sheet was used as the metal sheet 112, a metal sheet is not limited to this.

  Moreover, although the said embodiment demonstrated the case where aluminum foil was used as the metal foil 521 of the terminal member 520, a terminal member is not limited to this.

  In addition, the shape of the slit SLT in the above embodiment is a shape extending in the Y-axis direction, but this is an example, and the shape of the slit is not limited thereto, for example, a slit extending in the Y-axis direction. And a combination of slits extending in the X-axis direction. Further, the slit is not limited to a straight line, and may be curved.

  Moreover, although the said embodiment demonstrated the case where a tablet is a chemical | medical agent, it is not limited to this. For example, the tablet may be food.

  Moreover, in the said embodiment, although the chip module 500 was affixed on the metal sheet | seat 112 (the back surface of the tablet package 100) among the package main bodies 150, it is not restricted to this, The resin sheet 111 side (namely, between adjacent accommodation area | regions) ) May be attached to the chip module 500. Even in this case, the metal sheet 112 on which the slit SLT is formed can function as an antenna of the RFID tag.

  In the above-described embodiment, the slit SLT is formed in the metal sheet and the chip module 500 is pasted (slit formation and chip mounting are performed together) before being cut into the tablet package 100. Without being limited thereto, after a roll of a resin sheet and a roll of a metal sheet are bonded together, they are cut into tablet packages, and slits SLT are formed in the metal sheets of each of the cut tablet packages, and the chip module 500 is bonded. (Slit formation and chip mounting may be performed separately).

  Moreover, although the said embodiment demonstrated the case where the tablet package 100 was a PTP (Press Through Package) type, it is not limited to this. For example, a so-called blister type package member may be used. However, in this case, the metal sheet 112 needs to be attached to the mount.

  DESCRIPTION OF SYMBOLS 100 ... Tablet package (tablet package with RFID tag), 111 ... Resin sheet, 112 ... Metal sheet, 200 ... Tablet, 212 ... Adhesion inhibitor, 214 ... Recess, 500 ... Chip module, SLT ... Slit.

JP 2013-140575 A JP 2005-301738 A

Claims (10)

An IC that performs wireless information communication by using a package body including a housing portion having a region that can contain contents and a metal sheet bonded to the housing portion, and being attached to the package body and using the metal sheet as an antenna. A method of manufacturing a package with an RFID tag comprising a chip,
Putting the contents into the housing part;
Bonding the container and the metal sheet to seal the contents;
Forming a slit in the metal sheet of the package body containing the contents;
Mounting the IC chip on the package body,
In the bonding step, the RFID tag package of the present invention is provided with a non-adhesive portion where the housing portion and the metal sheet are not bonded to each other in a part of the region including the region where the slit is formed in the step of forming the slit. Production method. In the bonding step, the housing portion and the metal sheet are thermally welded,
The method for manufacturing a package with an RFID tag according to claim 1, wherein the non-adhering portion is formed by non-heating a part of a region including a region where the slit is formed in the bonding step. In the bonding step, the housing portion and the metal sheet are thermally welded,
2. The RFID tag package according to claim 1, wherein the non-adhesive portion is formed by interposing an adhesion-preventing substance that prevents adhesion between the container and the metal sheet prior to the bonding step. Production method. A thermal welding agent is applied to at least one of the housing part and the metal sheet,
The method of manufacturing a package with an RFID tag according to claim 3, wherein the adhesion preventing substance has a melting temperature higher than that of the thermal welding agent.   2. The method of manufacturing a package with an RFID tag according to claim 1, wherein the non-adhesive portion is formed by recessing a part of the housing portion so as to be separated from the metal sheet in a state of being bonded to the metal sheet. .   6. The method of manufacturing a package with an RFID tag according to claim 5, wherein the non-adhering portion is formed simultaneously with the formation of a region in which the contents can be stored in the storage portion.   The RFID according to any one of claims 1 to 6, wherein the step of forming the slit includes a step of cutting out the metal sheet using a blade and a step of removing a part of the cut out metal sheet. A method of manufacturing a tagged package. In the step of mounting the IC chip, a plurality of the IC chips are mounted on the package body,
The package with an RFID tag according to any one of claims 1 to 7, further comprising a step of dividing the package body on which the plurality of IC chips are mounted into a plurality of pieces so that each of the package bodies has one IC chip. Manufacturing method.   The package with an RFID tag manufactured by the manufacturing method as described in any one of Claims 1-8. An IC that performs wireless information communication by using a package body including a housing portion having a region that can contain contents and a metal sheet bonded to the housing portion, and being attached to the package body and using the metal sheet as an antenna. A package with an RFID tag comprising a chip,
A package with an RFID tag, wherein the housing portion and the metal sheet are not bonded to each other in an area around the slit of the package body.

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