JP2015162624A - Electronic control device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic control device which enables reduction of the application quantity of a sealant needed for sealing between a case and a cover and fixation between the case and a circuit board.SOLUTION: A case 20 includes: a first coated surface 41 which faces a seal surface 43 of a cover 30 through a sealant 40 thereby achieving a seal function; pedestal bases 26 disposed at the inner side relative to the first coated surface 41 and supporting a circuit board 12 on top surfaces 26a; and a second coated surface 42 which continues into the first coated surface 41 and the pedestal bases 26, the second coated surface 42 which is coated by the sealant 40 along with the first coated surface 41. The second coated surface 42 is positioned on the same plane as a plane including the first coated surface 41, and the top surface 26a of each pedestal base 26 is positioned at the cover 30 side.

Description

  The present invention relates to an electronic control device in which a circuit board is accommodated in a casing in which a case and a cover are assembled.

  In general, a waterproof electronic control device is configured such that a circuit board on which electronic components and the like are mounted is housed in a casing formed by assembling a case and a cover, and seals between the cover and the case. Therefore, a sealant is applied. As a technique related to this waterproof structure, a control unit disclosed in Patent Document 1 below is known. In this control unit, a convex portion that is continuous along the edge of the cover is formed on the adhesive application surface of the cover. When the cover is assembled to the case, the sealing agent applied to the case side is crushed toward the outside and inside of the housing by the convex portion of the cover. The sealant that is squeezed inward is pushed to cover the end of the circuit board that is installed further inside than the convex part of the cover, so the circuit board is bonded and fixed to the cover and case via this sealant. The

JP 2011-031696 A

  The purpose of fixing the circuit board to the case is to improve the vibration resistance of the electronic control device. As a general fixing method, it is known that the above purpose can be achieved by partial fixing using screws. ing. In the configuration disclosed in Patent Document 1, a fixing method using a partial screw is not adopted for fixing the circuit board and the case, and almost the entire periphery of the circuit board is fixed to the case using a sealant. A fixing method is adopted. For this reason, the amount of sealant applied is greater than the amount of sealant applied to a typical electronic control device that uses a screw to secure the circuit board and case. The work time in the sealing agent application process in the process also becomes longer. Therefore, there arises a problem that the cost of the electronic control device is increased.

  The present invention has been made to solve the above-described problems, and the object of the present invention is to reduce the amount of sealant applied for sealing between the case and the cover and fixing between the case and the circuit board. It is an object of the present invention to provide an electronic control device that can be used.

In order to achieve the above object, the invention described in claim 1
An electronic control device (10) comprising a housing (11) assembled with a case (20) and a cover (30) and a circuit board (12) accommodated in the housing,
The case includes a first application surface (41) that exhibits a sealing function by facing the seal surface (43) of the cover via a sealant (40), and an inner side than the first application surface. A plurality of pedestals (26) arranged to support the circuit board on the top surface (26a) and a first coating surface and the first coating surface are applied to the sealing agent together with the first coating surface and the pedestal. 2 application surfaces (42),
The second coating surface is positioned on the same plane with respect to the plane (S) including the first coating surface, and the top surface is positioned on the cover side.
In addition, the code | symbol in the parenthesis of a claim and the said means shows a corresponding relationship with the specific means as described in embodiment mentioned later.

  According to the first aspect of the present invention, a plurality of cases are arranged on the inner side of the first application surface and a first application surface that exhibits a sealing function by facing the seal surface of the cover via a sealant. A pedestal that supports the substrate at the top surface, and a second application surface that is connected to both the first application surface and the pedestal and onto which the sealant is applied together with the first application surface. And with respect to the plane including the first application surface, the second application surface is located on the same plane, and the top surface is located on the cover side.

  As a result, the sealant applied to the second application surface functions to adhere (fix) the circuit board to the case by contacting the circuit board supported by the pedestal, so the circuit board is fixed to the case. It is possible to eliminate the need for screws. In particular, the sealant applied to the second application surface is crushed by the circuit board when the case and the cover are assembled, but the top surface of the pedestal connected to the second application surface is in a plane including the first application surface. Therefore, the pedestal can suppress the outflow to the inside of the housing. For this reason, the coating amount of the sealing agent for filling without a gap between the circuit board and the case can be reduced without reducing the adhesion between the circuit board and the case. Furthermore, since the circuit board is bonded to the case by the sealing agent applied to the second application surface, the sealing agent necessary for fixing is compared with the case where the entire circumference of the circuit board is bonded to the case by the sealing agent. The application amount can be reduced. Accordingly, it is possible to reduce the amount of sealant applied for sealing between the case and the cover and fixing between the case and the circuit board, simplifying the sealing agent application process, and reducing the cost of the electronic control device. .

It is a top view of the electronic control unit concerning a 1st embodiment. It is a disassembled perspective view of the electronic controller of FIG. It is a top view of a case. It is sectional drawing by the cut surface equivalent to the X1-X1 line | wire of FIG. It is sectional drawing by the cut surface equivalent to the X2-X2 line | wire of FIG. It is sectional drawing by the cut surface equivalent to the X3-X3 line | wire of FIG. It is a top view explaining the application locus of the sealant to the case. It is a perspective view which expands and shows the application state of the sealing agent with respect to a 2nd application surface. It is sectional drawing for demonstrating the process of assembling a case, a circuit board, and a cover through a sealing agent. It is sectional drawing which shows the principal part of the electronic control apparatus which concerns on 2nd Embodiment.

[First Embodiment]
Hereinafter, a first embodiment of an electronic control device according to the present invention will be described with reference to the drawings.
The electronic control device 10 according to the present embodiment has a waterproof structure, and is disposed in an engine room of a vehicle, for example, and executes a control of an engine (not shown) according to a driving operation by a driver. It is an apparatus having.

  As shown in FIGS. 1 and 2, the electronic control device 10 includes a housing 11 and a circuit board 12 on which a connector 13 for external connection is mounted. The housing 11 includes a case 20 and a cover 30 for housing the circuit board 12, and the case 20 and the cover 30 are bonded (joined) via a sealing agent 40, thereby having a waterproof housing space. Is formed. In addition, in FIG. 2, illustration of the sealing agent 40 is abbreviate | omitted for convenience.

  The circuit board 12 is formed in a rectangular plate shape, and a large number of electronic components (not shown) are mounted on both sides thereof. At the four corners of the circuit board 12, engagement holes 12 a for engaging protrusions 27 described later are formed. A connector 13 having a large number of pins is attached to the center of the upper surface of the circuit board 12. The connector 13 is connected to an external connector (not shown) for supplying various electric components and circuits for driving the circuit board 12 and for transmitting and receiving various signals. is there.

  Next, detailed shapes of the case 20 and the cover 30 will be described with reference to the drawings. FIG. 3 is a top view of the case 20. FIG. 4 is a cross-sectional view taken along the line X1-X1 in FIG. FIG. 5 is a cross-sectional view taken along the line X2-X2 in FIG. FIG. 6 is a cross-sectional view taken along the line X3-X3 in FIG.

  As shown in FIG. 3, the case 20 includes a bottom wall 21 and a peripheral wall 22 that is annularly connected to the outer peripheral edge of the bottom wall 21. On the outer surface of the bottom wall 21, a plurality of heat radiation fins 21a for heat radiation are formed. The upper end surface of the peripheral wall 22 is formed such that the groove portion 25 is disposed between the outer wall portion 23 and the inner wall portion 24 except for the four corners. A sealing agent 40 is applied to the bottom surface of the groove portion 25 (hereinafter also referred to as the first application surface 41). The outer side wall portion 23 is formed in a substantially square annular shape so as to constitute the outer edge of the case 20, and the first application surface 41 is also formed in a substantially rectangular annular shape so as to be located inside the outer wall portion 23. Further, the outer wall portion 23 is formed such that its upper surface (hereinafter also referred to as a contact surface 23b) is positioned on the cover 30 side with respect to the plane S including the first application surface 41 (see FIG. 4). . Female thread portions 23 a are formed at the four corners of the outer wall portion 23.

  At the four corners of the bottom wall 21, pedestals 26 for supporting the circuit board 12 from the lower side (bottom wall 21 side) are provided. The pedestal 26 is connected to the inner wall portion 24 in a substantially L shape when viewed from above, and the top surface 26a that contacts the circuit board 12 is closer to the bottom wall 21 than the first application surface 41, as shown in FIG. It is formed to have a high height.

  Between the 1st application surface 41 and the base 26, the 2nd application surface 42 connected to both is provided. The second application surface 42 is a region where a sealing agent 40 for adhering the case 20 and the circuit board 12 is applied, and is continuous with the first application surface 41 without a step. That is, with respect to the plane S including the first application surface 41, the second application surface 42 is located on the same plane, and the top surface 26a of the base 26 is located on the cover 30 side (see FIG. 4).

  The second application surface 42 is provided with a protrusion 27 for positioning the circuit board 12 on the case 20 by engaging with each engagement hole 12a. Each protrusion 27 is formed so that the protruding end portion 27 a is higher than the top surface 26 a of the base 26 from the bottom wall 21 (positioned on the cover 30 side).

  As shown in FIGS. 2 and 4 to 6, the cover 30 is formed such that the central portion 31 is higher than the outer edge portion 32 connected to the outer periphery of the central portion 31. The central portion 31 is formed with an opening 31a for exposing the connector 13, a mounting portion 31b for attaching the water repellent filter 14, a plurality of heat radiation fins 31c, and the like. At four corners of the outer edge portion 32, through holes 32a are formed through which the screws 15 fastened to the female screw portion 23a of the case 20 are inserted.

  On the outer peripheral side of the lower surface of the outer edge portion 32, a wall portion 33 that is annularly opposed to the outer wall portion 23 of the case 20 is provided. As shown in FIGS. 4 to 6, the lower surface 33 a of the wall portion 33 is formed so as to annularly contact the contact surface 23 b of the outer wall portion 23 when assembled with the case 20. Of the lower surface of the outer edge portion 32, the inner peripheral side of the wall portion 33 is formed as a sealing surface 43 that exhibits a sealing function by facing the first application surface 41 of the case 20 via the sealing agent 40. . On the seal surface 43, a pressing portion 34 for crushing the sealing agent 40 on the first application surface 41 when assembled with the case 20 is formed in an annular shape along the wall portion 33.

  On the inner peripheral side of the four corners of the lower surface of the outer edge portion 32, projections (hereinafter also referred to as clamping projections 35) facing the pedestal 26 of the case 20 are provided. As shown in FIGS. 4 and 5, the clamping protrusion 35 is formed so as to clamp the circuit board 12 from the vertical direction by the pedestal 26 when assembled to the case 20.

  Next, assembly of the case 20 and the cover 30 configured as described above via the sealant 40 will be described with reference to the drawings. FIG. 7 is a top view for explaining the application locus of the sealing agent 40 to the case 20. FIG. 8 is an enlarged perspective view showing the application state of the sealing agent 40 on the second application surface 42. FIG. 9 is a cross-sectional view for explaining a process of assembling the case 20, the circuit board 12 and the cover 30 via the sealing agent 40, and is an enlarged cross section taken along the line X1-X1 in FIG. is there. FIG. 9A shows a state in which the sealing agent 40 is applied on the first application surface 41 and the second application surface 42, and FIG. 9B shows that the circuit board 12 is sealed on the second application surface 42. FIG. 9C shows a state in which the case 20 and the cover 30 are assembled with the sealant 40 interposed therebetween.

  First, the sealing agent 40 is applied to the first application surface 41 and the second application surface 42 of the case 20 using a sealing agent application device (not shown). In this application step, as shown in FIG. 7, application is started from an application start position P1 on the first application surface 41 away from the four corners, and a nozzle (not shown) from which the sealing agent 40 is discharged is provided on the first application surface. The sealant 40 is applied onto the first application surface 41 by moving along the line 41. The nozzles are moved at the four corners of the first application surface 41 so as to make one rotation around the protrusion 27 when viewed from above. That is, the sealant 40 is applied not only on the first application surface 41 but also on the second application surface 42 by moving the nozzle as shown by a locus R shown in FIG.

  As a result, when the nozzle is moved along the locus R from the application start position P1 to the application end position P2, the process of temporarily stopping the discharge of the sealing agent 40 from the nozzle is performed on both the application surfaces 41 and 42. The sealing agent 40 can be applied like a single stroke. At this time, as shown in FIG. 8, the sealant 40 is applied twice at the positions corresponding to the four corners of the first application surface 41, so as shown in FIG. The application amount of the sealing agent 40 applied to the application surface is larger than the application amount of the sealing agent 40 applied to the second application surface 42 inside the protrusion 27.

  Next, as shown in FIG. 9B, the circuit board 12 is arranged on the case 20 so that each engagement hole 12 a faces the corresponding protrusion 27. At this time, the circuit board 12 is in contact with the sealing agent 40 applied on the second application surface 42 at the inner side of the engagement hole 12a in the lower surface of the four corners, and outside the engagement hole 12a. In contact with the sealing agent 40 applied on the first application surface 41.

  Then, as shown in FIG. 9C, the cover 15 and the case 20 are assembled by fastening the screw 15 inserted through the through hole 32 a to the female screw portion 23 a. Thereby, the sealing agent 40 on the second application surface 42 adheres to the four corners of the lower surface of the circuit board 12, so that the circuit board 12 is bonded and fixed to the case 20 via the sealing agent 40. Further, the sealing agent 40 on the first application surface 41 is annularly bonded to the sealing surface 43 of the cover 30, so that the case 20 and the cover 30 are bonded via the sealing agent 40, and the case 11 has a waterproof property. An accommodation space is formed.

  At this time, the sealing agent 40 on the second application surface 42 is crushed and spread by the circuit board 12, but the circuit board 12 is sandwiched from above and below by the pedestal 26 of the case 20 and the clamping protrusions 35 of the cover 30. Therefore, the outflow of the sealing agent 40 to the inner side than the base 26 is suppressed.

  Further, the sealant 40 on the first application surface 41 is crushed and spread by the seal surface 43 of the cover 30, but the contact surface 23 b of the outer wall portion 23 of the case 20 and the lower surface 33 a of the wall portion 33 of the cover 30 are formed. Since the annular surface contact is made, the outflow of the sealing agent 40 to the outside is suppressed. Furthermore, since the sealing agent 40 on the first application surface 41 whose outflow to the outside is suppressed spreads to the upper surface side of the circuit board 12, the sealing agent 40 adheres to the circuit board 12 from the vertical direction, and the case 20 The circuit board 12 is firmly fixed to the substrate. In particular, since the pressing portion 34 provided on the sealing surface 43 presses the sealing agent 40 on the first application surface 41, more sealing agent 40 can be spread on the upper surface side of the circuit board 12.

  As described above, in the electronic control device 10 according to the present embodiment, the case 20 faces the sealing surface 43 of the cover 30 via the sealing agent 40 and thereby exhibits the sealing function 41. A plurality of pedestals 26 arranged on the inner side of the first application surface 41 and supporting the circuit board 12 on the top surface 26a, and connected to both the first application surface 41 and the pedestal 26 and sealed together with the first application surface 41. And a second application surface 42 on which the agent 40 is applied. The second coating surface 42 is positioned on the same plane with respect to the plane S including the first coating surface 41, and the top surface 26a of the base 26 is positioned on the cover 30 side.

  Thereby, the sealing agent 40 applied to the second application surface 42 functions to adhere (fix) the circuit board 12 to the case 20 by contacting the circuit board 12 supported by the base 26 from below. Therefore, a screw or the like for fixing the circuit board 12 to the case 20 can be eliminated. In particular, the sealant 40 applied to the second application surface 42 is crushed by the circuit board 12 when the case 20 and the cover 30 are assembled, but the top surface 26 a of the base 26 connected to the second application surface 42 is the first. Since it is located on the cover 30 side with respect to the plane S including the first application surface 41, the pedestal 26 can suppress the outflow to the inside of the housing 11. For this reason, the application amount of the sealing agent 40 for filling the circuit board 12 and the case 20 without a gap can be reduced without reducing the adhesion between the circuit board 12 and the case 20. Furthermore, since the circuit board 12 is adhered to the case 20 by the sealing agent 40 applied to the second application surface 42, compared to the case where almost the entire circumference of the circuit board 12 is adhered to the case 20 by the sealing agent 40, The application amount of the sealing agent 40 necessary for fixing can be reduced. Therefore, the application amount of the sealing agent 40 necessary for sealing between the case 20 and the cover 30 and fixing between the case 20 and the circuit board 12 can be reduced, the application process of the sealing agent 40 is simplified, and the electronic control device 10 Cost can be reduced.

  In addition, the case 20 is disposed outside the first application surface 41, and is in outer surface contact with the lower surface 33 a of the wall 33 located outside the seal surface 43 of the cover 30 at the contact surface 23 b. The wall portion 23 is formed, and the contact surface 23 b is located on the cover 30 side with respect to the plane S including the first application surface 41. For this reason, the sealant 40 applied to the first application surface 41 is crushed by the seal surface 43 when the case 20 and the cover 30 are assembled, but the contact surface 23 b of the outer wall portion 23 and the lower surface of the wall portion 33. Since 33a is in surface contact, outflow to the outside of the housing 11 is suppressed. Thereby, the application amount of the sealing agent 40 can be further reduced without lowering the adhesion between the case 20 and the cover 30.

  Further, the second application surface 42 is formed with a protrusion 27 that protrudes so that the protruding end portion 27 a is positioned closer to the cover 30 than the top surface 26 a of the base 26. For this reason, the sealing agent 40 applied to the second application surface 42 is crushed by the circuit board 12 and spreads outward when the circuit board 12 is assembled to the case 20, but the protrusion 27 is formed on the base 26. Therefore, the spread of the sealing agent 40 in the outer direction is moderately suppressed. Thereby, the application quantity of the sealing agent 40 for filling without a gap between the circuit board 12 and the case 20 can be reduced without reducing the adhesiveness between the circuit board 12 and the case 20. Further, the sealant 40 applied to the first application surface 41 is crushed by the seal surface 43 and spreads inward when the case 20 and the cover 30 are assembled. Since it arrange | positions inside, the expansion to the inner side direction of the sealing agent 40 is suppressed moderately. Thereby, the application amount of the sealing agent 40 can be reduced without reducing the adhesiveness between the case 20 and the cover 30.

  In particular, since the protrusion 27 can be disposed at any position within the range of the second application surface 42, the sealing agent 40 applied to the application surface around the protrusion 27 is used for fixing the substrate at a desired ratio ( It can be assigned to the second application surface 42 and the seal function (first application surface 41). Therefore, it is possible to optimize the application amount of the sealing agent 40 necessary for the substrate fixing and the sealing function.

  In this embodiment, the application amount of the sealing agent 40 applied to the first application surface 41 outside the protrusion 27 is equal to the application amount of the sealing agent 40 applied to the second application surface 42 inside the protrusion 27. Since the amount is larger than the amount, when the case 20 and the cover 30 are assembled, the space formed between the case 20 and the cover 30 can be filled with the sealing agent 40 without any gap, and high sealing performance can be ensured.

  In particular, the application path R (see FIG. 7) of the sealant 40 can be set to an arbitrary shape according to the first application surface 41 and the second application surface 42, so that the housing 11 of various shapes and sizes can be used. Not only can it be applied, but it can also be applied to sealant applicators with various nozzle diameters.

  Further, since the circuit board 12 has the engagement holes 12a with which the protrusions 27 of the case 20 are engaged at the four corners, the circuit board 12 can be assembled to the case 20 with high accuracy. The shakiness of the circuit board 12 with respect to can be reduced. As a result, the stress applied to the sealing agent 40 applied to the second application surface 42 is relaxed, and the adhesion / fixability between the case 20 and the circuit board 12 can be improved. Can be improved.

  In addition, the cover 30 is formed with a pinching protrusion 35 that holds the circuit board 12 from above and below by the pedestal 26 when assembled to the case 20. As a result, the circuit board 12 is pressed in the direction of the bottom wall 21 when the cover 30 is assembled. Therefore, the sealing agent 40 applied to the second application surface 42 is further crushed by the circuit board 12 pressed against the cover 30. Further, the adhesion between the sealing agent 40 and the circuit board 12 can be further improved.

  Moreover, since each base 26 is arrange | positioned so that the four corners of the circuit board 12 may be supported, the increase in the application quantity of the sealing agent 40 for fixing the circuit board 12 to the case 20 is suppressed appropriately, and the sealing agent 40 is carried out. The vibration resistance of the electronic control device 10 can be improved by improving the adhesion / fixing property between the case 20 and the circuit board 12 while reducing the total coating amount.

  The sealing surface 43 of the cover 30 is formed with a pressing portion 34 that crushes the sealing agent 40 applied to the first application surface 41 when assembled with the case 20. For this reason, the sealing agent 40 applied to the first application surface 41 is crushed by the pressing portion 34 when the case 20 and the cover 30 are assembled, spreads in the inner direction, covers the upper surface of the circuit board 12, and extends in the outer direction. To fill the space between the case 20 and the cover 30. Therefore, the seal length is increased according to the length of contact between the pressing portion 34 and the sealant 40, and the waterproof performance of the electronic control device 10 can be improved.

[Second Embodiment]
Next, an electronic control device according to a second embodiment of the present invention will be described with reference to FIG. FIG. 10 is a cross-sectional view showing the main part of the electronic control apparatus 10 according to the second embodiment, and corresponds to a cross-sectional view taken along the line X3-X3 in FIG.
The second embodiment is mainly different from the first embodiment in that a moisture curing type is used as the sealing agent 40 and the case 20 and the cover 30 are formed so as to promote the curing of the sealing agent 40. . For this reason, substantially the same components as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.

  In the electronic control device 10 according to the present embodiment, a moisture curable sealant 40 is employed. As a configuration for promoting the hardening of the sealing agent 40, as shown in FIG. 10, between the upper surface of the outer wall portion 23 of the case 20 and the lower surface of the wall portion 33 of the cover 30, A gap C that exposes only the portion is formed. When the upper surface of the outer wall portion 23 of the case 20 and the lower surface of the wall portion 33 of the cover 30 are in annular contact with each other and the sealing agent 40 does not touch the outside air, the sealing agent 40 absorbs moisture in the outside air. This is because it takes time to cure. For example, the gap C is formed by assembling the case 20 formed so as to dent a part of the contact surface 23b of the outer wall portion 23 through the sealant 40 with respect to the cover 30 in the first embodiment. The

  As a result, the sealing agent 40 comes into contact with the outside air through the gap C between the outer wall portion 23 and the wall portion 33, and the curing of the sealing agent 40 is promoted to shorten the curing time of the sealing agent 40, that is, Thus, the manufacturing time for the electronic control device 10 can be shortened.

In addition, this invention is not limited to said each embodiment, You may actualize as follows.
(1) The sealing agent 40 applied on the second application surface 42 is not limited to being applied on the second application surface 42 corresponding to the four corners of the circuit board 12, but may be in other positions, for example, the circuit board. You may apply | coat only on the 2nd application | coating surface 42 corresponded to two corners on 12 diagonals.

(2) The present invention is not limited to being applied to an electronic control device for a vehicle, but may be applied to an electronic control device having other functions. In addition, it is possible to appropriately change the detailed configuration within the scope of the gist of the present invention.

DESCRIPTION OF SYMBOLS 10 ... Electronic control unit 11 ... Housing | casing 12 ... Circuit board 20 ... Case 26 ... Base 26a ... Top surface 30 ... Cover 40 ... Sealing agent 41 ... 1st application surface 42 ... 2nd application surface 43 ... Seal surface

Claims (9)

An electronic control device (10) comprising a housing (11) assembled with a case (20) and a cover (30) and a circuit board (12) accommodated in the housing,
The case includes a first application surface (41) that exhibits a sealing function by facing the seal surface (43) of the cover via a sealant (40), and an inner side than the first application surface. A plurality of pedestals (26) arranged to support the circuit board on the top surface (26a) and a first coating surface and the first coating surface are applied to the sealing agent together with the first coating surface and the pedestal. 2 application surfaces (42),
The electronic control device, wherein the second coating surface is located on the same plane with respect to the plane (S) including the first coating surface, and the top surface is located on the cover side. The case has a wall portion (23) disposed outside the first application surface and in surface contact with a surface (33a) outside the sealing surface of the cover at a contact surface (23b). Formed,
The electronic control device according to claim 1, wherein the contact surface is located on the cover side with respect to a plane including the first application surface.   The protrusion (27) protruding so that the protruding end (27a) is positioned on the cover side with respect to the top surface is formed on the second application surface. Electronic control unit.   The amount of the sealing agent applied to the first application surface outside the protrusion is larger than the amount of the sealing agent applied to the second application surface inside the protrusion. The electronic control device according to claim 3.   The electronic control device according to claim 3 or 4, wherein an engagement hole (12a) with which the protrusion is engaged is formed in the circuit board.   The said processus | protrusion (35) which clamps the said circuit board with the said base at the time of the assembly | attachment with the said case is formed in the said cover. Electronic control device.   The electronic control device according to claim 1, wherein the pedestal is arranged to support four corners of the circuit board.   The press surface (34) which crushes the sealant applied to the first application surface when assembled with the case is formed on the seal surface of the cover. The electronic control apparatus as described in any one. The sealing agent is a moisture curing type,
The electronic control device according to claim 1, wherein a gap that exposes only a part of the sealant is formed between the case and the cover.

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