JP2015143964A - Touch sensor and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a touch sensor which can be efficiently manufactured even when holes are required thereon and which can satisfy recent needs for light-weight, thin, short, and small IT mobile devices with larger touch screen areas.SOLUTION: A touch sensor 80 of the present invention has a base sheet 10 having through-holes 50 formed near outer edges thereof and a transparent conductive pattern layer 20 made of a non-crystalline or low-crystalline indium tin oxide formed thereon. The touch sensor 80 has no frame sections on three sides of the transparent conductive pattern layer 20. The transparent conductive pattern layer 20 is formed on an entire surface of the base sheet 10 excluding a frame section 60 on one remaining side and the through-holes 50. The whole area with the transparent conductive pattern layer 20 becomes a sense-enabled touch screen area.

Description

  The present invention is directed to a touch sensor used for an IT mobile device such as a smartphone.

  In recent years, there are cases where IT mobile devices such as smartphones are operated while wearing polarized sunglasses in a region in summer. However, when wearing sunglasses, the conventional IT mobile device has a problem that the touch screen is dark and the screen is difficult to see. Accordingly, in IT mobile devices in such areas, cycloolefin polymer films and the like are used in addition to aluminosilicate glass and soda glass as the base material of the touch sensor (Patent Document 1).

JP2013-195864

  However, since the above-mentioned base material is brittle and easy to avoid, there is a problem that cracks and cracks are likely to occur during external punching and are difficult to handle. In recent years, IT mobile devices have become more and more diverse, and the shape of products has become complicated in combination with the needs of light, thin, and short, and accordingly, the demand for touch sensors that want to provide holes is increasing. . In the specification of such a touch sensor, there is a problem in that the yield is poor and the productivity is extremely low if the above-mentioned material is used as a base material.

  In addition, since touch sensors for IT mobile devices such as smartphones require high transparency, conductivity, and scratch resistance, the transparent conductive pattern layer of the touch screen is made of crystallized indium tin oxide (ITO). Although the film is composed of a film, the crystallized indium tin oxide film has a problem that the conductive performance is greatly deteriorated due to cracking or peeling when the holed portion is punched. In addition, the crystallized indium tin oxide film is difficult to etch, and there is a problem that much time and labor must be spent for patterning.

  Furthermore, in a general form of touch sensor in which a transparent conductive pattern layer is formed on the touch screen portion and a circuit layer is provided around the surrounding frame portion, if a perforated portion is to be provided around the frame portion, that portion Just have to take a wide frame. For this reason, there has been a problem that it is not possible to meet the recent needs of IT mobile devices that are light, thin, small and have a large touch screen. The present invention provides the following touch sensor in order to solve the above-described problems of the prior art.

  In the first embodiment of the present invention, a transparent conductive pattern layer made of amorphous or low crystalline indium tin oxide is formed on a base sheet made of a polyester film, and the transparent conductive pattern layer is formed by photolithography. The touch sensor is characterized in that a pattern is formed. A second embodiment of the present invention is the touch sensor according to the first embodiment, wherein the base sheet is a polyester film substrate having an in-plane retardation value of 8000 to 12000.

  According to the third embodiment of the present invention, there is no frame portion in the three directions of the outer periphery of the transparent conductive pattern layer, and the entire surface of the base sheet excluding the frame portion in the remaining one direction becomes a sensing touch screen portion. The touch sensor according to any one of the first embodiment and the second embodiment. According to a fourth embodiment of the present invention, the transparent conductive pattern layer made of the amorphous or low-crystal indium tin oxide is composed of a plurality of layers formed on both sides of the base sheet, and pattern formation on both sides simultaneously by photolithography. The touch sensor according to any one of the first to third embodiments.

  In a fifth embodiment of the present invention, the base sheet is made of at least a multilayer polyester film, and the transparent conductive pattern layer is made of amorphous or low-crystalline indium tin oxide only on one side of the polyester film. A transparent conductive pattern layer is formed on both sides of the base sheet by laminating and laminating the sides of the polyester film on which the conductive pattern layer is not formed. The touch sensor according to the fourth embodiment.

  In a sixth embodiment of the present invention, the base sheet is made of at least a multilayer polyester film, and the transparent conductive pattern layer is made of amorphous or low-crystalline indium tin oxide only on one side of the polyester film. From the first embodiment, a plurality of transparent conductive pattern layers are formed by laminating a plurality of polyester films having a transparent conductive pattern layer formed on one side thereof. The touch sensor according to any one of the third embodiments.

  In the seventh embodiment of the present invention, an adhesive substrate is laminated between the multilayer polyester films, and the ratio of the total thickness of the multilayer polyester films to the thickness of the adhesive substrate is 1: 5. The touch sensor according to the fifth embodiment or the sixth embodiment, which is ˜5: 1. In the eighth embodiment of the present invention, after a non-crystalline or low-crystalline transparent conductive pattern layer is formed on a base sheet, the base sheet is cut or punched, and then transparent conductive by far infrared treatment or plasma treatment. The touch sensor according to any one of the first to seventh embodiments, wherein the pattern layer is crystallized.

  In the touch sensor of the present invention, a transparent conductive pattern layer made of amorphous or low-crystal indium tin oxide is formed on a base sheet made of polyester film, and the transparent conductive pattern layer is patterned by photolithography. It is characterized by that. Polyester film is more flexible than glass or cycloolefin polymer, and amorphous or low crystalline indium tin oxide film is more flexible than that after crystallization. There are few cases where the pattern layer is cracked or cracked.

  Therefore, there is an effect that a touch sensor that requires a perforated portion can be efficiently produced. In addition, an amorphous or low-crystal indium tin oxide film is easy to etch and can be patterned in a short time, which has an effect of improving productivity. Moreover, since the transparent conductive pattern layer can be very delicately patterned by photolithography, there is an effect that the touch sensor of the third embodiment can be easily manufactured.

  In the touch sensor of the present invention, the base sheet is a polyester film substrate having an in-plane retardation value of 8000 to 12000. Therefore, by using a base sheet having a high in-plane retardation, it is possible to prevent image deterioration of the display screen, and there is an effect of being a touch sensor that can be used even when wearing polarized sunglasses.

  In the touch sensor of the present invention, there is no frame portion in the three outer peripheral directions of the transparent conductive pattern layer, and the entire surface of the base sheet excluding the frame portion in the remaining one direction becomes a sensing touch screen portion. And Therefore, since there is no frame portion in the three directions of the outer periphery, there is an effect that can meet the needs of recent IT mobile devices that want to make the touch screen portion light and thin, and the same applies to the case where a perforated portion is provided.

  In the touch sensor of the present invention, the transparent conductive pattern layer made of the amorphous or low-crystal indium tin oxide is composed of a plurality of layers formed on both sides of the base sheet, and both sides are patterned simultaneously by photolithography. It is characterized by that. Therefore, there is an effect that the touch sensor can be efficiently manufactured with high productivity. Moreover, since it becomes easy to keep the positional tolerance of the transparent conductive pattern layers on both sides within 0.2 mm, the touch sensor of the third embodiment can be easily manufactured.

  In the touch sensor of the present invention, the base sheet is made of at least a multilayer polyester film, and a transparent conductive pattern layer made of amorphous or low-crystalline indium tin oxide is formed only on one side of the polyester film. A transparent conductive pattern layer is formed on both surfaces of the base sheet by laminating and laminating the side surfaces of the polyester film on which the conductive pattern layer is not formed. In the touch sensor of the present invention, the base sheet is made of at least a multilayer polyester film, and a transparent conductive pattern layer made of amorphous or low-crystalline indium tin oxide is formed only on one side of the polyester film. A plurality of transparent conductive pattern layers are formed by laminating a plurality of polyester films formed and having a transparent conductive pattern layer formed on one side thereof.

  Accordingly, in any of the above embodiments, since the polyester film substrate on which each conductive pattern layer is formed can be used after having passed through exactly the same process, the non-crystalline or low crystalline condition is the same as the conductive pattern layer. can do. Therefore, since the crystallinity of each transparent conductive pattern layer is the same, only one transparent conductive pattern layer is not cracked or cracked at the time of punching, and the conductivity after annealing is not affected. Since the characteristics are almost the same on the front and back sides, there is an effect that there is no problem in sensing.

  In the touch sensor of the present invention, an adhesive base material is laminated between the multilayer polyester films, and the ratio of the total thickness of the multilayer polyester films to the thickness of the adhesive base material is 1: 5. It is characterized by being 5: 1. Therefore, there is an effect that the rigidity as the base sheet can be maintained while eliminating the shortage of cushioning property of the polyester film alone.

  In the touch sensor of the present invention, the substrate sheet is cut or punched after an amorphous or low-crystalline transparent conductive pattern layer is formed on the substrate sheet, and then transparent conductive material is obtained by far infrared treatment or plasma treatment. The pattern layer is crystallized. Therefore, not only can the perforated part be manufactured with high productivity, but also the conductive pattern layer after crystallization has the effect of being a highly sensitive and stable touch sensor having high surface strength.

(A) is sectional drawing which shows an example of the touch sensor in case the transparent conductive pattern layer of 3rd embodiment of this invention is a single layer, (b) is transparent of 3rd embodiment of this invention. It is a top view which shows an example of a touch sensor in case a conductive pattern layer is a single layer. It is sectional drawing which shows an example of the touch sensor of the 5th embodiment of this invention. It is sectional drawing which shows an example of the manufacturing method of the touch sensor of the 5th embodiment of this invention. It is sectional drawing which shows an example of the touch sensor of 6th embodiment of this invention, (a) is sectional drawing which shows an example of the touch sensor which the electroconductive pattern layers mutually laminate through the adhesive base material (B) is sectional drawing which shows an example of the touch sensor which the polyester film and the electroconductive pattern layer have laminated | stacked facing through the adhesive base material.

  Preferred embodiments of the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to these embodiments. FIG. 1A is a sectional view showing an example of a third embodiment of the touch sensor of the present invention, and FIG. 1B is a top view thereof.

  In FIG. 1A, a touch sensor 80 of the present invention has a perforated portion 50 formed in the vicinity of an outer peripheral end portion of a base sheet 10, and the base sheet 10 is made of a transparent material made of amorphous or low crystalline indium tin oxide. A conductive pattern layer 20 is formed. In FIG. 1B, the touch sensor 80 of the present invention has a base sheet excluding the frame portion 60 and the perforated portion 50 in the remaining one direction without the frame portion in the three directions of the outer periphery of the transparent conductive pattern layer 20. A transparent conductive pattern layer 20 is formed on the entire surface of 10, and the entire portion where the transparent conductive pattern layer 20 is formed serves as a sensing touch screen portion.

  The base sheet 10 is made of a polyester film such as polyethylene terephthalate, polybutylene terephthalate, or aromatic polyester. Since the polyester film is softer and tougher than the glass or cycloolefin polymer film, there is no problem even if the perforated portion 50 is formed because the crack does not occur or break in the process such as punching. .

  The polyester film is preferably a uniaxially or biaxially stretched film rather than an amorphous film. Since the transparent conductive pattern layer 20 requires a final crystallization step, the substrate sheet 10 is shrunk by this step and a load is applied to the conductive pattern layer 20 so that defects such as cracks do not occur. It is for doing so. The base sheet 10 may be composed of a single layer polyester film, but is preferably composed of a multilayer polyester film as will be described later.

  The base sheet 10 is preferably a polyester film having an in-plane retardation of 8000 to 12000. The value of the in-plane retardation is much higher than that of a general-purpose polyester film of about 1000 to 3000. This in-plane retardation value is a value of in-plane retardation in light having a wavelength of 550 nm measured in an environment of 23 ° C. and 55% RH, and is a value represented by (nx−ny) × d ( nx represents the refractive index in the direction (in-plane direction) perpendicular to the thickness direction of the base sheet 10 and gives the maximum refractive index, and ny is the in-plane direction and orthogonal to the nx direction. The refractive index in the direction, and d represents the thickness of the base sheet 10). The in-plane phase difference can be measured using a commercially available phase difference measuring device or the Senalmon method.

  Normally, the problem of image degradation such as color unevenness caused by birefringence can be dealt with by using a material having low birefringence, but it is extremely difficult to reduce birefringence with a polyester film. Therefore, by using a polyester film that exhibits a very high in-plane retardation value, it is a means of causing birefringence to a region where the color unevenness color disappears, thereby suppressing the color unevenness. There will be no unevenness and the display screen will not darken even when wearing sunglasses.

  The transparent conductive pattern layer 20 is formed of an indium tin oxide (ITO) film, but is not a commonly used crystalline indium tin oxide film, but first an amorphous or low crystalline indium tin oxide film. A film is preferably formed. A crystalline indium tin oxide film is highly conductive and excellent in various resistances, but it is a brittle and easily cracked film. If a load such as punching is applied in the vicinity of such a film, the load causes cracks. This is because it becomes easier. Therefore, in the process of applying a load such as punching, an amorphous or low-crystal indium tin oxide film that is still flexible and difficult to crack is left after the process of applying the load is completed. It is preferable to crystallize the indium tin oxide film by performing some kind of treatment. The thickness of the transparent conductive pattern layer 20 is preferably about 10 to 200 nm. If the thickness is less than 10 nm, pinholes are likely to occur and the conductivity may be deteriorated. If the thickness is greater than 200 nm, transparency and bending resistance may be reduced.

Examples of the method for forming the transparent conductive pattern layer 20 include a sputtering method, a spray pyrolysis method, and a pulse laser irradiation method. As an example of film formation of a sputtering method for forming an amorphous or low-crystalline indium tin oxide film, the amount of Sn atoms is 6 to 15% by weight with respect to the weight of In and Sn atoms added. There is an example in which a metal target or an oxide target is used, and the substrate temperature is 100 ° C. to 200 ° C. in an atmosphere where the partial pressure of water is 0.1% or less with respect to the partial pressure of Ar gas. The amorphous or low-crystalline indium tin oxide film thus obtained has a hole mobility of about 5 to ³⁰ cm ² / V · s and a carrier density of about 1 × 10 20 to 1 × 102 1 / cm ³ . Become.

  The term “non-crystalline or low crystalline” is not limited to a completely amorphous material, but also includes a material having a small amount of a crystalline component. Therefore, in the present invention, the profile of the X-ray analysis is taken, and when the clear X-ray analysis intensity peak indicating crystallization is not seen, the transparent conductive pattern layer is visible even when the peak is seen. The substrate sheet 10 on which the substrate 20 is formed is immersed in hydrochloric acid having a concentration of 5% by weight for 15 minutes, washed with water and dried. When the resistance between terminals of 15 mm is measured, Or “low crystal”. This is because the “non-crystalline or low-crystalline” film is etched by hydrochloric acid and partially disappears, so that the resistance between terminals is increased by immersion in hydrochloric acid.

  The pattern of the transparent conductive pattern layer 20 may be set in a general form in which a transparent conductive pattern layer is formed on the touch screen portion and a circuit layer is provided around the peripheral frame portion, but FIG. As described above, the frame portion does not exist in the three outer peripheral directions, and is formed on the entire surface of the base sheet 10 excluding the frame portion 60 and the perforated portion 50 in the remaining one direction, so that the entire touch panel portion can be sensed. It is preferable to set. As will be described later, when a plurality of transparent conductive pattern layers 20 are provided and formed simultaneously by a photolithography method, a pattern with high definition and high positional accuracy is obtained. It is more preferable. If it can be set as described above, there is an effect that it is possible to respond to the needs of recent IT mobile devices that want to make the touch screen portion lighter, smaller, and smaller even if there is a perforated portion 50.

  As a means for patterning the transparent conductive pattern layer 20, in addition to a method in which a resist is patterned by a general-purpose printing method and the exposed conductive layer is removed by etching, a method by photolithography (that is, photo Apply the resist to the entire surface, expose and harden the part to be patterned, remove the uncured part and etch the exposed conductive layer, and vice versa, expose and soften the part to be removed For example, a method of removing the exposed portion and etching the exposed conductive layer).

  Resist materials include vinyl, acrylic, urethane, alkyd, epoxy, polyester, and cellulose resins. Examples of the etching solution for etching the exposed transparent conductive pattern layer 20 include strongly acidic aqueous solutions such as hydrochloric acid, nitric acid, and sulfuric acid, and strong alkaline aqueous solutions such as caustic soda and caustic potash.

  In particular, in the case where the transparent conductive pattern layer 20 is provided as a single layer, a high fine processing technique capable of very finely patterning the transparent conductive pattern layer 20 is necessary. Of the above means, a photoresist is used. It is preferable to use an exposure photolithography method. On the other hand, when the transparent conductive pattern layer 20 is provided in a plurality of layers, a high positional accuracy technique is required so that the positional tolerances of these layers are at most within 0.2 mm. In such a manufacturing process, it is preferable to form a pattern on both sides simultaneously by photolithography. The position tolerance refers to the maximum value of the positional deviation that is allowed with respect to the exact position determined in the design.

  FIG. 2 is a cross-sectional view illustrating an example of a touch sensor according to a sixth embodiment of the present invention. That is, the base sheet 10 is composed of multilayer polyester films 101 and 102, and a transparent conductive pattern layer 201 composed of amorphous or low crystalline indium tin oxide on only one side of the polyester films 101 and 102, and 202 is formed, and the side of the polyester film on which the conductive pattern layers 201 and 202 are not formed are opposed to each other and laminated via the adhesive base material 30, so that both sides of the base sheet 10 are transparent. The touch sensor 80 is characterized in that the conductive pattern layers 201 and 202 are formed.

  Moreover, FIG. 3 is sectional drawing which shows an example of the manufacturing method of the touch sensor of 6th Embodiment of this invention. That is, a transparent conductive layer made of amorphous or low crystalline indium tin oxide is formed only on one side of the polyester films 101 and 102, and the sides of the polyester film on which the conductive layer is not formed are formed. FIG. 11 is a cross-sectional view of a manufacturing method of the touch sensor 80 in which transparent conductive pattern layers are formed on both surfaces of a base sheet by simultaneously patterning both surfaces of the conductive layer after laminating the layers. According to this manufacturing method, since the base sheet for patterning the conductive layer is already a laminate of a highly rigid polyester film, the patterning of the conductive layer is possible even if the thickness of the polyester film is slightly reduced. Can be done efficiently. As a result, compared to a touch sensor in which a polyester film in which a transparent conductive pattern layer is previously formed is laminated, there is an effect that the touch sensor can be improved to a thin film, light weight, and high transparency.

  2 and 3, it is preferable that the materials and thicknesses of the polyester films 101 and 102 are the same. This is because the entire base sheet 10 tends to warp if the materials and thicknesses thereof are different. The polyester films 101 and 102 may contain a plasticizer, a stabilizer, an ultraviolet absorber and the like in order to improve moldability, thermal stability, weather resistance and the like.

  Examples of the adhesive substrate 30 include an optical transparent adhesive tape and an optical curable adhesive layer. An optical transparent adhesive tape is a tape in which an adhesive layer made of an acrylic, urethane, or silicone resin is formed on both sides of a separator, and the adhesive layer is scattered from the adhesive solvent or irradiated with ultraviolet rays. It solidifies and adheres firmly to the polyester films 101 and 102. The thickness of the adhesive substrate 30 is preferably about 50 to 200 μm.

  In the touch sensor having a structure in which the adhesive layer of the optical transparent adhesive tape and the indium tin oxide layer are in contact with each other, there is a problem that acrylic acid contained in the adhesive layer corrodes the indium tin oxide layer. However, in the touch sensor 80 according to the fifth embodiment of the present invention, the polyester film 101 and 102 are opposite to the transparent conductive pattern layers 201 and 202 made of the adhesive layer and indium tin oxide. There is also a merit that such a problem does not occur at all because it is a structure that does not touch at all.

  The optical curable adhesive layer is an acrylic that is formed on the surface of the polyester film 101 and 102 opposite to the transparent conductive pattern layer 201 or 202 when the polyester films 101 and 102 are laminated. It is a curable adhesive layer made of a resin such as a silicone or silicone resin. The optical curable adhesive layer has a thickness of 10 to 100 μm, which corresponds to the thickness of the adhesive substrate 30.

  And it is preferable that the ratio of the sum total of the polyester films 101 and 102 and the thickness of the adhesive base material 30 is 1: 5-5: 1. When the total ratio of the polyester films 101 and 102 is higher than this ratio, the cushioning property of the base sheet 10 is insufficient, and the effects of the present invention tend not to be obtained. On the other hand, when the ratio of the adhesive base material 30 is high, the rigidity of the base sheet 10 is insufficient and the handling tends to be difficult.

  The method of laminating the polyester films 101 and 102 and the adhesive substrate 30 includes a surface opposite to the surface on which the conductive layer 221 of the polyester film 101 is formed and a surface on which the conductive layer 222 of the polyester film 102 is formed. A method in which the opposite surfaces face each other and the adhesive base material 30 is used as a core material and is continuously laminated on both surfaces by roll-to-roll is preferable because of high productivity. When an optical curable adhesive layer is used as the adhesive base 30, productivity is further improved by performing the process of applying the adhesive base 30 and the laminating process continuously in one process. When an optical transparent adhesive tape is used as the adhesive base material 30, the process of transporting the adhesive base material 30 and the process of laminating the polyester films 101 and 102 on the upper and lower sides thereof are continuously performed in one process. Productivity is further improved.

  Indium tin oxide has a high electrical resistance value and low electrical conductivity before crystallization, but has not yet developed the characteristic of being brittle and prone to crack, which is unique to inorganic oxide materials, and adheres to polyester films 101 and 102. When laminating the base material 30, it is easy to handle. Therefore, when there is a portion where crystallization has started even before crystallization, it is preferable that the conductive layer 221 and the conductive layer 222 have exactly the same degree. For this purpose, the conductive layer 221 For the conductive layer 222, it is preferable to use a product of exactly the same lot in which one winding is divided into two.

  The method of patterning the conductive layer 221 and the conductive layer 222 to form the transparent conductive pattern layers 201 and 202 is the above-described method in which the transparent conductive layer 221 and the conductive layer 222 are simultaneously patterned on both sides after being laminated. In addition to the method, the conductive layer 221 is formed on the polyester film 101, the conductive layer 222 is formed on the polyester film 102, and each of them is separately patterned on transparent conductive pattern layers 201 and 202, and then laminated. You may use the method. In that case, the conductive pattern layer 201 and the conductive pattern layer 202 may be laminated to face each other with the adhesive base material 30 interposed therebetween (FIG. 4A), and the polyester film 101 and the conductive pattern layer 202 are formed. You may laminate | stack facing through the adhesive base material 30 (FIG.4 (b)). However, in the case of the touch sensor as in the third embodiment, the transparent conductive pattern layers 201 and 202 must be stacked with high positional accuracy within a positional tolerance of 0.2 mm.

  Examples of a method for patterning the conductive layer 221 and the conductive layer 222 include a method of patterning a resist and etching away the exposed conductive layer. As a method of patterning a resist, a photolithography method (that is, a photoresist is applied to the entire surface, a portion to be patterned is exposed and cured, an uncured portion is removed, and an exposed conductive layer is etched. And a method of etching the exposed conductive layer by exposing and softening a portion to be removed and removing the softened portion). In the case of laminating after patterning, it is preferable that the resist can be used as a protective film for the conductive pattern layers 221 and 222. Therefore, a means for exposing a portion to be patterned to be cured and removing an uncured portion is more preferable. preferable.

  The perforated portion 50 may be formed by punching with a Thomson blade or the like, or cutting with a cutter or drilling. In addition, the hole said by this invention refers to the space formed in the surface of the base | substrate sheet | seat 10 irrespective of a shape, and not only a so-called circular hole but all shapes, such as a polygonal thing and a star shape. Including In consideration of mass productivity, punching with a large Thomson blade is preferable. In particular, it is particularly preferable in terms of production efficiency that the perforated portion 50 is cut or punched at the same time as the transparent conductive pattern layer 20 is formed and then cut or punched into a predetermined product outer dimension.

  After the perforated portion 50 is formed, a transparent conductive pattern layer having high conductivity can be obtained by introducing a step of crystallizing the amorphous portion of the transparent conductive pattern layer 20. Examples of the crystallization method include a heat treatment method at a temperature of 150 ° C. or higher, a laser irradiation method, a plasma treatment method, and the like. Plasma treatment is particularly preferable. In the method of heat treatment or the method of irradiating with laser light, the base sheet 10 may shrink due to excessive heat, or the time required for crystallization may become several tens of minutes or more and productivity may decrease. It is. In this respect, plasma treatment has the advantage that it generates little heat and can be crystallized in a few minutes.

  Examples of the far-infrared treatment include an annealing treatment using a far-infrared heater of about 150 ° C. to 250 ° C., but a treatment using a hybrid heat treatment apparatus to which hot air is simultaneously applied with far-infrared rays is preferable. Examples of the plasma treatment include high-frequency plasma treatment and atmospheric pressure plasma treatment, among which high-frequency plasma treatment is preferable. In the high-frequency plasma treatment, the amorphous portion of the transparent conductive pattern layer 20 can be crystallized at a low temperature of 100 ° C. or less in about 2 minutes. This is because there is a merit that the film forming method before crystallization and the material of the base sheet 10 are hardly affected.

  In addition, when the pattern of the transparent conductive pattern layer 20 is formed on the touch screen portion and is set to a general form in which a circuit layer is provided around the peripheral frame portion, the conductive circuit layer 20 is also transparent. The patterning is preferably performed by a photolithography method. Since the transparent conductive pattern layer 20 and the routing circuit layer can be patterned at the same time, the productivity is greatly improved, and the pattern of the routing circuit layer can be made high definition, and the frame portion can be narrowed. Because it can.

  Examples of the material of the routing circuit layer include a case where it is made of a single metal such as copper, aluminum, palladium, nickel, gold, and silver, and a case where the metal particles are made of a mixture in which a resin binder is mixed. As for patterning in the case of the former material, there is a method in which a resist is formed on the surface as described above, the resist is patterned by a photolithography method, and a single metal film at a portion where the resist is peeled is removed by etching. Can be mentioned. As a patterning method for the latter material, in addition to this method, a resin binder is used as a photosensitive resin material, and a circuit layer is once formed on the entire surface. Then, an unnecessary portion of the circuit layer is drawn by a photolithography method. The method of removing and patterning is mentioned. This method is more efficient and economical because the above-described resist forming step and etching step are unnecessary.

DESCRIPTION OF SYMBOLS 10 Base sheet 20 Conductive pattern layer 22 Conductive layer 30 Adhesive base material 40 Resist 50 Perforated part 60 Frame part 80 Touch sensor 101 Base sheet 102 Base sheet 201 Conductive pattern layer 202 Conductive pattern layer

Claims (8)

  A transparent conductive pattern layer made of amorphous or low-crystal indium tin oxide is formed on a base sheet made of polyester film, and the transparent conductive pattern layer is patterned by photolithography. Touch sensor.   The touch sensor according to claim 1, wherein the base sheet is a polyester film substrate having an in-plane retardation value of 8000 to 12000.   The frame portion does not exist in the three outer peripheral directions of the transparent conductive pattern layer, and the entire surface of the base sheet excluding the remaining one-direction frame portion becomes a sensing touch screen portion. The touch sensor according to any one of 2.   The transparent conductive pattern layer made of non-crystalline or low-crystal indium tin oxide is composed of a plurality of layers formed on both sides of a base sheet, and is patterned on both sides simultaneously by photolithography. The touch sensor according to claim 1.   The base sheet is made of at least a multilayer polyester film, and a transparent conductive pattern layer made of amorphous or low-crystal indium tin oxide is formed only on one side of the polyester film, and the polyester film is electrically conductive. The touch sensor according to claim 4, wherein a transparent conductive pattern layer is formed on both surfaces of the base sheet by laminating the surface sides where the conductive pattern layer is not formed facing each other.   The base sheet is made of at least a multilayer polyester film, and a transparent conductive pattern layer made of amorphous or low crystalline indium tin oxide is formed only on one side of the polyester film. 4. The touch sensor according to claim 1, wherein a plurality of transparent conductive pattern layers are formed by laminating a plurality of polyester films on which conductive pattern layers are formed. 5. .   An adhesive substrate is laminated between the multilayer polyester films, and the ratio of the thickness of the multilayer polyester film to the thickness of the adhesive substrate is 1: 5 to 5: 1. The touch sensor according to claim 5 or 6.   After the non-crystalline or low-crystalline transparent conductive pattern layer was formed on the base sheet, the base sheet was cut or punched, and then the transparent conductive pattern layer was crystallized by far-infrared treatment or plasma treatment. The touch sensor according to any one of claims 1 to 7, wherein:

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