JP2015122397A - Relay board, manufacturing method of the same, electronic device, electronic apparatus and movable body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a relay board at low costs by a method of easily forming an electrode terminal in which one surface and the other surface of the relay board communicate with each other without being subjected to a special step.SOLUTION: A relay board comprises: an element connection terminal mounted with an element on one principal surface of a board having electrical insulation properties; an external connection terminal on a rear surface of the principal surface; principal surface wiring extending from the element connection terminal on the principal surface; and a plurality of insulation surfaces on a lateral surface of the board. A lateral surface conductive layer is provided on the lateral surface of the board excluding at least the plurality of insulation surfaces. The external connection terminal and the principal surface wiring are electrically connected to the lateral surface conductive layer.

Description

  The present invention relates to a relay board, a relay board manufacturing method, an electronic device, an electronic apparatus, and a moving body.

  In recent years, elements such as a vibration element and a sensor element that constitute an electronic component have been downsized due to a dramatic advance in precision processing technology represented by MEMS technology. These elements. A single element is not attached to equipment, but is housed in a vacuum-tight state in a storage container generally called a box-shaped package, mounted on a circuit board or the like, and attached to the equipment.

  However, there are various types of devices, depending on their use, in shape, form, material, electrode wiring, size, etc., and if a package that optimally accommodates these various types of devices is manufactured according to the device, the same applies. In addition, a variety of products must be prepared, and in particular, a ceramic package formed by laminating a plurality of substrates increases the cost.

  Therefore, it has been proposed to use a relay board as disclosed in Patent Document 1. The relay substrate shown in Patent Document 1 mediates between the integrated circuit package and the mother board to electrically connect the integrated circuit package and the mother board. In an example of the embodiment described in Patent Document 1, a through hole is formed in a relay substrate, and a terminal connected to an electrode terminal provided in an integrated circuit package or an electrode pin is formed in the through hole in the through hole. A terminal to be inserted and connected is provided and connected to an electrode terminal arranged on the mother board side. Then, the connection terminal on the motherboard side of the relay board is connected to the connection terminal of the motherboard, and an electrical connection between the integrated circuit package and the motherboard is obtained.

  In the example of the embodiment described in Patent Document 1 described above, it takes a number of manufacturing steps such as forming a through hole in the relay substrate and forming an electrode terminal inside the formed through hole, that is, increasing the cost. The configuration was included. On the other hand, in another example of the embodiment described in Patent Document 1, a terminal is formed on the outer peripheral portion of the relay substrate so as to wrap around from the integrated circuit package side to the mother board side. Obtaining a secure connection.

JP-A-9-270478

  However, even if it is an example of other embodiment described in patent document 1, in order to form an electrode terminal in the outer peripheral surface of a relay substrate, the electrode film formed in the outer periphery is an unnecessary part according to wiring. There is a risk that the cost may be increased due to a large number of man-hours, such as removing the film or forming an electrode film by performing a so-called masking process so that the electrode film is not formed on unnecessary portions.

Accordingly, it is an object of the present invention to obtain an inexpensive relay substrate by a method of easily forming an electrode terminal in which one surface of the relay substrate is connected to the other surface without passing through a special process.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  [Application Example 1] A relay board according to this application example includes an element connection terminal for mounting an element on one main surface of a substrate having electrical insulation, an external connection terminal on the back surface of the main surface, A main surface wiring extending from the element connection terminal on the main surface, a plurality of insulating surfaces on the side surface of the substrate, and a side conductive layer on the side surface of the substrate excluding at least the insulating surface And the external connection terminal and the main surface wiring are electrically connected to the side surface conductive layer.

  According to the relay substrate of this application example, the main surface wiring formed on the substrate main surface by the side surface conductive layer formed on the side surface of the substrate is electrically connected to the external connection terminal formed on the back surface of the substrate. be able to. As a result, electrical connection between the wiring on the main surface of the board and the terminals on the back surface can be easily performed without forming a through-hole in which a conductive member connecting the main surface and the back surface is disposed on the substrate. It can be obtained, and the cost increase of the relay board can be suppressed.

  Application Example 2 In the application example described above, the side surface of the substrate includes a protruding portion protruding along the main surface, and the insulating surface is provided on the outer end surface of the protruding portion. It is characterized by.

  According to the above application example, by providing the protruding protrusion on the side surface of the substrate, the insulating surface formed on the side surface of the substrate can be configured on the outer end surface of the protrusion, and the substrate side surface can be easily insulated. A surface can be formed.

  Application Example 3 In the application example described above, the outer end surface of the protrusion includes a cut surface of the substrate.

  According to the application example described above, in the process of manufacturing the relay substrate, the tip end portion of the protrusion portion on which the side surface conductive layer is not easily formed can be easily formed by cutting or removing the tip end portion of the protrusion portion. Can do. That is, since the tip end surface of the protruding portion where the side conductive layer is not formed can be formed without using the etching method used as a method for removing the metal film constituting the conventional conductive layer, it depends on the chemical used in the etching method. Safety and environmental load reduction can be realized.

  Application Example 4 In the application example described above, the cut surface is a cut surface obtained by cutting the substrate from a wafer substrate including a plurality of the substrates.

  When the above-described relay substrate is manufactured, a relay substrate is formed through a predetermined manufacturing process as a wafer substrate by using a raw material substrate, a so-called wafer, and connecting a plurality of relay substrate chips in the wafer with a tie bar. In this method, according to the above-described application example, the relay substrate is divided into pieces by cutting the tie bar of the wafer substrate. However, by forming the tie bar at the protruding portion position of the substrate, the cut surface of the tie bar protrudes. An outer end surface that is formed as an outer end surface of the portion and is not provided with the outer peripheral conductive layer can be easily obtained.

  Application Example 5 A relay substrate manufacturing method according to this application example includes a wafer preparation step of preparing a wafer substrate having electrical insulation, and a relay substrate chip held by a plurality of connection portions connected to the wafer. A plurality of chip forming steps on the wafer, at least on one main surface of the relay substrate chip, an element connection terminal for mounting an element, a main surface wiring extending from the element connection terminal, An external connection terminal formed on the back surface of the main surface; and a wiring formation step; and a relay substrate chip extraction step of cutting the connection portion to separate the relay substrate chip, the wiring formation step 3, wherein a side surface conductive layer is formed on a side surface of the relay substrate chip including at least a surface intersecting the main surface of the connection portion.

  According to the relay substrate manufacturing method of this application example, a plurality of relay substrate chips are connected to each other with a tie bar in a wafer using a raw material substrate, a so-called wafer, and a relay substrate is formed through a predetermined manufacturing process as a wafer substrate. Is done. According to this manufacturing method, the relay substrate is separated into pieces by cutting the tie bar of the wafer substrate, but by forming the tie bar at the protruding portion position of the relay substrate, the cut surface of the tie bar is the outer end surface of the protruding portion. Thus, an outer end surface on which the outer peripheral conductive layer is not disposed can be easily obtained.

  Application Example 6 An electronic device according to this application example includes an element connection terminal for mounting an element on one main surface of an electrically insulating substrate, an external connection terminal on the back surface of the main surface, and the main device. A main surface wiring extending from the element connection terminal on the surface, and a plurality of protrusions protruding along the main surface on the side surface of the substrate, and at least an outer end surface of the protrusion The side surface intersecting the main surface except the side conductive layer is provided, the element electrically connected to the element connection terminal, and the circuit element electrically connected to the external connection terminal, It is characterized by including.

  According to the electronic device of this application example, the main surface wiring formed on the main surface of the substrate by the side surface conductive layer formed on the side surface of the substrate is electrically connected to the external connection terminal formed on the back surface of the substrate. A relay board that can be provided can be provided. The relay board provided is easily connected between the wiring on the main surface of the board and the terminals on the back surface without forming a through-hole in which a conductive member connecting the main surface and the back surface is arranged on the substrate, so-called through hole. Connection can be obtained, the cost increase of the relay board can be suppressed, and the cost increase of the electronic device can be suppressed. In addition, even if the specifications of the elements mounted on and mounted on the relay board, such as size, function, electrode arrangement, etc., are different, a circuit board or package constituting an electronic device can be obtained by using a relay board corresponding to the element. Can be used in common, and cost increases can be suppressed by standardizing circuit boards or packages.

  Application Example 7 In the application example described above, the element is a sensor element.

  According to the application example described above, a variety of sensor elements having various functions are mounted on a relay board and mounted on the circuit board or package, so that the circuit board or package constituting the electronic device can be specified in common. Therefore, it is possible to suppress the cost increase by standardizing the circuit board or the package.

  Application Example 8 An electronic apparatus according to this application example includes the relay board described in the above application example.

  According to the electronic apparatus of this application example, it is possible to commonly use a circuit board or a package constituting the electronic apparatus, and it is possible to suppress an increase in cost by standardizing the circuit board or the package.

  Application Example 9 A moving object according to this application example includes the relay board described in the above application example.

  According to the moving body of this application example, it is possible to commonly use a circuit board or a package constituting various electronic devices included in the moving body, and it is possible to suppress an increase in cost by standardizing the circuit board or the package.

The relay board | substrate which concerns on 1st Embodiment is shown, (a) is a top view on the main surface side, (b) is a top view on the back surface side. The top view which shows the relay board | substrate which concerns on 1st Embodiment, a front view, a rear view, a right view, and a left view. The relay board | substrate which concerns on 1st Embodiment is shown, (a) is an external appearance perspective view from the main surface side, (b) is an external appearance perspective view from the back surface side. The flowchart which shows the manufacturing method of the relay substrate which concerns on 2nd Embodiment. The fragmentary sectional view which shows the manufacturing process in the manufacturing method of the relay substrate which concerns on 2nd Embodiment. The wafer substrate obtained at the chip | tip shaping | molding process of the relay substrate which concerns on 2nd Embodiment is shown, (a) is a top view, (b) is an expansion perspective view of the A section shown to (a). The wafer board obtained at the wiring formation process of the relay substrate which concerns on 2nd Embodiment is shown, (a) is the partial expansion external appearance perspective view by the side of a main surface, (b) is the partial expansion external appearance perspective view by the side of a back surface. The external appearance perspective view explaining the relay board | substrate chip taking-out process of the relay board | substrate concerning 2nd Embodiment. The top view which shows the angular velocity sensor as an electronic device which concerns on 3rd Embodiment. Sectional drawing of the BB 'part shown in FIG. The top view which shows the other form of the angular velocity sensor which concerns on 3rd Embodiment. The external view which shows the smart phone as an electronic device which concerns on 4th Embodiment. FIG. 14 is an external view showing a digital still camera as an electronic apparatus according to a fourth embodiment. The external view which shows the motor vehicle as a moving body which concerns on 5th Embodiment.

  Embodiments according to the present invention will be described below with reference to the drawings.

(First embodiment)
FIG. 1 shows a relay board according to the first embodiment, where (a) is a front plan view and (b) is a back plan view. As shown in FIG. 1, the relay substrate 100 includes a main surface 10a that is one surface of a substrate 10 formed of an electrically insulating material, a back surface 10b opposite to the main surface 10a, and an outer peripheral side surface of the substrate 10. The electrode wiring described later is disposed at 10c.

  The outer peripheral side surface 10c of the substrate 10 is provided with a plurality of projections 11, 12, 13, 14, 15, 16 in this embodiment. On the main surface 10a, element connection terminals 21, 22, 23, 24, 25a, 25b, 26a, 26b are arranged corresponding to the external connection electrodes of the element 110 placed and fixed on the main surface 10a. , 27a, 27b, 28a, 28b are formed. In the relay substrate 100 according to the present embodiment, an angular velocity sensor element is exemplified as the element 110 (hereinafter, the element 110 is referred to as an angular velocity sensor element 110). Twelve element connection terminals 21, 22, 23, 24, 25a, 25b, 26a, 26b, 27a, 27b, 28a, 28b are formed corresponding to the external connection electrodes of the angular velocity sensor element 110.

  In the relay substrate 100 according to the present embodiment, the element connection terminals 21, 22, 23, 24 are connected to the driving electrodes of the angular velocity sensor element 110, and the element connection terminals 25a, 25b, 26a, 26b, 27a, 27b, 28a, Reference numeral 28 b is connected to a detection electrode of the angular velocity sensor element 110. The number, arrangement position, and form of the external connection terminals included in the angular velocity sensor element 110 are different depending on the type and form of the element mounted on the relay substrate 100, and the number and arrangement position corresponding to the angular velocity sensor element 110 are different. , The form is set.

  From the element connection terminals 21, 24 connected to the driving electrodes of the angular velocity sensor element 110, a lead wiring 20 a as a part of the main surface wiring is extended and formed so as to include the outer edge of the substrate 10. Connected to the main surface connection terminal 32 as a part of the surface wiring, the lead wiring 20b extends from the element connection terminals 22 and 23, and is connected to the main surface connection terminal 33 formed so as to include the outer edge of the substrate 10. It is connected. Further, the lead wiring 20c extends from the element connection terminals 25a and 25b connected to the detection electrodes of the angular velocity sensor element 110 and is connected to the main surface connection terminal 34 formed so as to include the outer edge of the substrate 10. The lead wiring 20d extends from the element connection terminals 26a and 26b connected to the detection electrodes of the angular velocity sensor element 110, and is connected to the main surface connection terminal 35 formed so as to include the outer edge of the substrate 10. Yes. Similarly, the lead wiring 20e extends from the element connection terminals 27a and 27b connected to the detection electrodes of the angular velocity sensor element 110, and is connected to the main surface connection terminal 31 formed so as to include the outer edge of the substrate 10. The lead wiring 20f extends from the element connection terminals 28a and 28b connected to the detection electrodes of the angular velocity sensor element 110, and is connected to the main surface connection terminal 36 formed so as to include the outer edge of the substrate 10. ing.

  The main surface connection terminals 31, 32, 33, 34, 35, and 36 are respectively provided between the protrusions 11, 12, and 12 of the substrate 10 between any of the adjacent main surface connection terminals 31, 32, 33, 34, 35, and 36. Any one of 13, 14, 15, and 16 is arranged. In other words, the main surface connection terminals 31, 32, 33, 34, 35, 36 are disposed between the protrusions 11, 12, 13, 14, 15, 16. For example, the main surface connection terminal 31 is formed between the protrusion 11 and the protrusion 12, and the main surface connection terminal 36 is formed between the protrusion 11 and the protrusion 16. In the present embodiment, six main surface connection terminals 31, 32, 33, 34, 35, and 36 are formed, but the number thereof is appropriately set depending on the form of the element 110 mounted on the relay substrate 100. The

  FIG. 2 shows a plan view, a front view and a rear view, and left and right side views of the relay board 100. As shown in FIG. 2, side conductive layers 41, 42, 43, 44, 45, 46 are formed on the outer peripheral side surface 10 c of the substrate 10. The side surface conductive layer 41 is formed between the protrusion 11 and the protrusion 12 and is electrically connected to the main surface connection terminal 31. The side surface conductive layer 41 is not formed on at least the end surfaces 11 a and 12 a of the protrusions 11 and 12, but the side surface conductive layer 41 may be extended on the side surfaces 11 c and 12 b of the protrusions 11 and 12.

  Similarly, the side surface conductive layer 42 is formed between the protrusion 12 and the protrusion 13, and is electrically connected to the main surface connection terminal 32. The side surface conductive layer 43 is formed between the protrusion 13 and the protrusion 14, and is electrically connected to the main surface connection terminal 33. The side conductive layer 44 is formed between the protrusion 14 and the protrusion 15, and is electrically connected to the main surface connection terminal 34. The side conductive layer 45 is formed between the protrusion 15 and the protrusion 16, and is electrically connected to the main surface connection terminal 35. The side conductive layer 46 is formed between the protrusion 16 and the protrusion 11 and is electrically connected to the main surface connection terminal 36.

  The side conductive layers 41, 42, 43, 44, 45, 46 described above are at least the end faces 12 a, 13 a, 14 a, 15 a, 16 a of the protrusions 12, 13, 14, 15, 16, 11, similarly to the side conductive layer 41. , 11a is not formed with a conductive layer. Further, the side surfaces 12b and 12c of the projection 12, the side surfaces 13b and 13c of the projection 13, the side surfaces 14b and 14c of the projection 14, the side surfaces 15b and 15c of the projection 15, the side surfaces 16b and 16c of the projection 16, and the side surfaces 11b and 11c of the projection 11 The side surface conductive layers 41, 42, 43, 44, 45, 46 may be extended.

  The side surface conductive layers 41, 42, 43, 44, 45, and 46 formed as described above are at least the end surfaces 11a, 12a, 13a, 14a, 15a, and the outer surfaces of the protrusions 11, 12, 13, 14, 15, and 16, respectively. No conductive layer is formed on 16a, and the side conductive layers 41, 42, 43, 44, 45, and 46 are formed on the end faces 11a, 12a, 13a, 14a, 15a, and 16a so as to be spaced apart in the circumferential direction.

  3A and 3B are external perspective views of the relay substrate 100. FIG. 3A is a main surface side external perspective view, and FIG. 3B is a back side external perspective view. As shown in FIG. 1B or 3B, the back surface 10b of the relay substrate 100 has a back surface as an external connection terminal that is electrically connected to a connection electrode formed on a mounting substrate (not shown). Connection terminals 51, 52, 53, 54, 55, and 56 are formed. As shown in FIG. 3B, the back surface connection terminals 51, 52, 53, 54, 55, and 56 are electrically connected to the side surface conductive layers 41, 42, 43, 44, 45, and 46. For example, the back connection terminal 51 is exemplified, and the back connection terminal 51 is electrically connected to the side conductive layer 41 and formed to include the outer edge portion of the substrate 10. Similarly, the back surface connection terminal 52 is the side surface conductive layer 42, the back surface connection terminal 53 is the side surface conductive layer 43, the back surface connection terminal 54 is the side surface conductive layer 44, the back surface connection terminal 55 is the side surface conductive layer 45, and the back surface. The connection terminal 56 is connected to the side conductive layer 46.

  The back surface connection terminals 51, 52, 53, 54, 55, 56 are adjacent to the back surface connection terminals 51, 52, 53, 54, adjacent to the main surface connection terminals 31, 32, 33, 34, 35, 36, respectively. Any one of the protrusions 11, 12, 13, 14, 15, and 16 of the substrate 10 is disposed between any of 55 and 56. In other words, the back surface connection terminals 51, 52, 53, 54, 55 and 56 are disposed between the protrusions 11, 12, 13, 14, 15 and 16. For example, the back connection terminal 51 is formed between the protrusion 11 and the protrusion 12, and the back connection terminal 52 is formed between the protrusion 12 and the protrusion 13.

  As shown in FIGS. 3A and 3B, the main surface connection terminals 31, 32, 33, 34, 35, and 36 and the back surface connection terminals 51, 52, 53, 54, 55, and 56 are side-surface conductive. The layers 41, 42, 43, 44, 45, and 46 are electrically connected. For example, the main surface connection terminal 31 is electrically connected to the back surface connection terminal 51 through the side surface conductive layer 41.

  As described above, when the angular velocity sensor element 110 is mounted and fixed on the relay substrate 100, the external connection electrodes provided in the angular velocity sensor element 110 and the element connection terminals 21, 22, 23, Electrical connection is made to 24, 25a, 25b, 26a, 26b, 27a, 27b, 28a, 28b. And via the element wiring terminals 21, 22, 23, 24, 25a, 25b, 26a, 26b, 27a, 27b, 28a, 28b, the routing wirings 20a, 20b, 20c, 20d, 20e, 20f Thus, the electrical connection state with the main surface connection terminals 31, 32, 33, 34, 35, 36 is obtained.

  The relay substrate 100 having the above-described configuration is provided with back connection terminals 51, 52, 53, 54 when mounted in a package of a storage container as an electronic device to be described later, or when an element is mounted on a circuit board, so-called motherboard. , 55, 56 to match the arrangement of the element connection terminals 21, 22, 23, 24, 25a, 25b, 26a, 26b, 27a, 27b, 28a, 28b formed on the main surface 10a of the relay substrate 100. By simply preparing different numbers, it is possible to store elements of different specifications in the package of a common element storage container via the relay substrate 100 or to be mounted on the mother board.

  In particular, the relay board 100 according to the present embodiment electrically connects the main surface connection terminals 31, 32, 33, 34, 35, and 36 and the back surface connection terminals 51, 52, 53, 54, 55, and 56. Side surface conductive layers 41, 42, 43, 44, 45, 46 formed on the outer peripheral side surface 10 c of the substrate 10 are end surfaces 11 a, 12 a on the outer peripheral side surface 10 c side of the protrusions 11, 12, 13, 14, 15, 16. , 13a, 14a, 15a, and 16a, the side conductive layers 41, 42, 43, 44, 45, and 46 are electrically independent (insulated) without forming a conductive layer. This makes it possible to easily realize electrical connection from the main surface side to the back surface side without requiring complicated processing such as via holes.

  As an example of a method for removing the conductive layer formed on the end faces 11a, 12a, 13a, 14a, 15a, 16a in the manufacturing process of the relay substrate 100, a part of the outer peripheral portion of the protrusions 11, 12, 13, 14, 15, 16 Or by grinding the outer peripheral end portion to form the end surfaces 11a, 12a, 13a, 14a, 15a, 16a as the cut surfaces or the ground surfaces, thereby forming the end surfaces 11a, 12a, 13a, 14a, 15a, 16a can be obtained.

  Further, in an example of a method for manufacturing the relay substrate 100 according to the present embodiment, which will be described later, the protrusions 11, 12, 13, 14, 15, 16 are formed as the remainder after cutting the tie bars connecting the element chips on the substrate wafer. The cut surfaces become end surfaces 11a, 12a, 13a, 14a, 15a, and 16a. Therefore, the electrode film removal process for the end faces 11a, 12a, 13a, 14a, 15a, and 16a is not required, and the relay substrate 100 according to the present embodiment can be obtained without increasing the cost.

  In addition, the protrusion amount of the protrusions 11, 12, 13, 14, 15, 16 from the side surface 10c increases the protrusion amount of the protrusions 11, 12, 13, 14, 15, 16 so that the protrusions 11, 12, 13, Since damage such as chipping of 14, 15 and 16 may occur, the substrate 10 becomes substantially larger.

(Second Embodiment)
As 2nd Embodiment, an example of the manufacturing method of the relay board | substrate 100 which concerns on 1st Embodiment mentioned above is demonstrated. FIG. 4 is a flowchart showing the steps of the manufacturing method according to this embodiment, and FIG. 5 is a partial sectional view for explaining the manufacturing steps.

[Wafer preparation process]
A wafer is prepared as a raw material for forming the relay substrate chip. The wafer is obtained by molding an electrically insulating material such as glass, silicon, or ceramic into a flat plate shape. In the present embodiment, a wafer made of glass is used, and in the wafer preparation step (S1), the surface of the obtained wafer is cleaned by a predetermined method to clean the surface.

[Chip molding process]
As shown in FIG. 5A, the wafer 200 cleaned in the wafer preparation step (S1) forms a metal film 300 as a corrosion resistant film on the surface of the wafer 200 by sputtering. The metal film 300 to be formed is obtained, for example, by depositing chromium (Cr) as a base layer and depositing gold (Au) as an upper layer.

  Next, a resist 400 is applied to the entire surface of the metal film 300 as shown in FIG. As shown in FIG. 5C, the applied resist 400 forms a resist opening 400a in a shape of a chip substrate assembly described later in the resist 400 by photolithography. Next, the metal film 300 exposed from the resist opening 400a is removed by etching to form the metal film opening 300a. Next, as shown in FIG. 5D, after etching the wafer 200 exposed from the location of the metal film opening 300a, the resist 400 and the metal film 300 are removed to form the outer peripheral side surface 10c as an element substrate. As shown in FIG. 6, an aggregate of a plurality of substrates 10 is formed on the wafer 200, and a chip wafer 210 is obtained.

  6A is a schematic plan view of the chip wafer 210, and FIG. 6B is an enlarged external perspective view of a portion A shown in FIG. 6A. As shown in FIG. 6A, the chip wafer 210 has a plurality of substrates 10 connected by tie bars 210b by the above-described method to form an aggregate.

[Wiring formation process]
The process proceeds to a wiring forming step (S3) for forming wiring such as electrode terminals on the substrate 10 portion of the chip wafer 210 obtained in the chip forming step (S2). In the wiring formation step (S3), first, as shown in FIG. 5E, an electrode film 310 to be an electrode wiring is formed on the entire surface of the chip wafer 210. As the electrode film 310, for example, gold (Au), titanium (Ti), aluminum (Al), silver (Ag), nickel (Ni), or a film in which these metals are laminated, a sputtering method or a vapor deposition method is used. Is formed.

  Further, as shown in FIG. 5F, a resist 410 is applied to the surface of the electrode film 310, and the resist corresponding to the region not formed as the electrode wiring is removed by photolithography to form a resist opening 410a. To do. Then, after the electrode film 310 exposed from the resist opening 410a is removed by etching, the resist 410 is removed, thereby forming a substrate wafer 220 having an assembly of a plurality of relay substrates 100 shown in FIG.

  FIG. 7A is an external perspective view of the main surface 10a side of the substrate 10 of the substrate wafer 220, and FIG. 7B is an external perspective view of the back surface side.

  By the wiring formation step (S3) described above, each electrode and each wiring (see FIG. 1, FIG. 2, or FIG. 3) are formed on the substrate wafer 220 as shown in FIGS. 7 (a) and 7 (b). The relay board 100 is configured as an assembly connected by tie bars 210b.

[Relay substrate chip removal process]
From the substrate wafer 220 obtained by the wiring formation step (S3), the relay substrate 100 is taken out, and the process proceeds to a so-called individual relay substrate take-out step (S4). In the relay board taking-out step (S4), the tie bar 210b is cut and separated into relay boards 100. Although there is no limitation in the cutting method of the tie bar 210b, generally the grinding cutting by a cutting grindstone or the cutting by an etching is mentioned, However, Here, the grinding cutting by a cutting grindstone is illustrated.

  FIG. 8 is an external perspective view from the main surface 10a side of the relay board 100, showing a method of cutting the tie bar 210b in the relay board chip taking-out step (S4). As shown in FIG. 8, the substrate wafer 220 protected by the dicing tape is moved in the direction of Fc1 and Fc2 by rotating a disc-shaped cutting grindstone (not shown) so as to cut the tie bar 210b of the substrate wafer 220. Grind and cut. By cutting the tie bar 210b, it is possible to obtain the separated relay substrate 100. A part of the slightly remaining tie bar 210b is configured as the protrusions 11, 12, 13, 14, 15, 16 of the relay substrate 100, and the cut surface is the outer periphery of the protrusions 11, 12, 13, 14, 15, 16 It is comprised as end surface 11a, 12a, 13a, 14a, 15a, 16a.

  Therefore, the end surfaces 11a, 12a, 13a, 14a, 15a, and 16a, which are also cut surfaces, expose the material surface of the substrate 10, and are electrically insulated regions. That is, the side surface conductive layers 41, 42, 43, 45, and 46 formed on the outer peripheral side surface 10c of the substrate 10 shown in FIG. 2 or 3 are the tie bars in the manufacturing method described above, that is, the relay substrate chip extraction step (S4). The electrical insulation with the end surfaces 11a, 12a, 13a, 14a, 15a, 16a of the protrusions 11, 12, 13, 14, 15, 16 can be easily secured by cutting 210b.

(Third embodiment)
9 and 10 show an angular velocity sensor as an example of a sensor device as an electronic device including the relay substrate 100 on which the angular velocity sensor element 110 according to the above-described embodiment is mounted, and FIG. 9 is a plan view in which a lid portion is omitted. 10 is a cross-sectional view taken along the line BB ′ shown in FIG. As shown in FIGS. 9 and 10, an IC chip 1200 and a relay substrate 100 on which the angular velocity sensor element 110 is mounted are housed in a package 1100, and an angular velocity sensor 1000 is configured. The package 1100 has a base 1110 having a recess 1110a and a recess 1110a in which the lid body 1120 is joined to the opening of the recess 1110a of the base 1110, and the relay substrate 100 on which the IC chip 1200 and the angular velocity sensor element 110 are mounted is housed. Seal hermetically.

  The IC chip 1200 includes at least a drive circuit for exciting and driving the vibrating arm of the angular velocity sensor element 110 and a detection circuit for detecting an output signal from the detection arm. In the angular velocity sensor 1000 according to this embodiment, the IC chip 1200 is described as being housed inside the package 1100. However, the present invention is not limited to this, and the IC chip 1200 is disposed outside the package 1100, for example, on a circuit board. May be.

  The IC chip 1200 is provided with a plurality of connection terminals 1200 a and is electrically connected to the plurality of IC internal terminals 1130 provided on the bottom surface portion 1110 b of the recess 1110 a of the base 1110 by bonding wires 1300. Further, the IC chip 1200 is bonded to the bottom surface portion 1110b of the base 1110 by a bonding member 1400 including an adhesive such as an epoxy resin type or an acrylic resin type.

  As shown in FIG. 10, the angular velocity sensor element 110 includes a drive electrode (not shown) provided in the angular velocity sensor element 110, element connection terminals 21, 22, 23, and 24 provided in the relay substrate 100 shown in FIG. Are electrically connected by the conductive fixing member 1500. Similarly, the detection electrode (not shown) and the element connection terminals 25 a, 25 b, 26 a, 26 b, 27 a, 27 b, 28 a, and 28 b provided on the relay substrate 100 are electrically connected by the conductive fixing member 1500, respectively. The angular velocity sensor element 110 is connected and connected to the relay substrate 100 via the conductive fixing member 1500.

  In the relay substrate 100 to which the angular velocity sensor element 110 is fixed, the back surface connection terminals 51, 52, 53, 54, 55 and 56 formed on the back surface 10 b of the relay substrate 100 are formed on the bottom surface portion 1110 b of the base 1110. The relay board connection terminals 1610, 1620, 1630, 1640, 1650, and 1660 are electrically connected to each other by the conductive fixing member 1700 and fixed to the base 1110. The base 1110 includes internal wirings (not shown) that connect the relay board connection terminals 1610, 1620, 1630, 1640, 1650, 1660 and the IC internal terminals 1130, respectively, and are electrically connected.

  As described above, the back surface connection terminals 51, 52, 53, 54, 55, and 56 of the relay substrate 100 are connected to the main surface connection terminals 31, 32, and 33 via the side surface conductive layers 41, 42, 43, 44, 45, and 46, respectively. , 34, 35 and 36 are electrically connected to each other. The main surface connection terminals 31, 32, 33, 34, 35, and 36 are connected to the element connection terminals 21, 22, 23, 24, 25a, 25b, and the like through the routing wires 20a, 20b, 20c, 20d, 20e, and 20f. 26a, 26b, 27a, 27b, 28a, 28b (see FIG. 1), the element connection terminals 21, 22, 23, 24, 25a, 25b, 26a, 26b, 27a, 27b, The driving electrode and the detection electrode of the angular velocity sensor element 110 connected to 28a and 28b are electrically connected to the IC chip 1200, and the angular velocity sensor 1000 for driving and detecting the angular velocity sensor element 110 is obtained.

  As another form of the angular velocity sensor 1000 according to the third embodiment, an angular velocity sensor 2000 is shown in FIG. The angular velocity sensor 2000 is different from the angular velocity sensor 1000 in that two first sensor elements 120 and second sensor elements 130 are mounted on the relay substrate 500. Accordingly, the same components as those of the angular velocity sensor 1000 are denoted by the same reference numerals, and description thereof is omitted.

  As shown in FIG. 11, the angular velocity sensor 2000 includes a first sensor element 120 and a second sensor element 130. In this example, the first sensor element 120 and the second sensor element 130 have mounting directions that intersect each other.

  As described above, for example, by mounting a plurality of elements on the relay substrate 500, the main surface connection terminals 31, 32, 33, and the angular velocity sensor elements 120, 130 and the relay substrate 100 provided in the angular velocity sensor 1000 are arranged. It is possible to use the package 1100 used in the angular velocity sensor 1000 in common by routing the wires 34, 35, and 36 and electrically connecting them with wiring.

  That is, the main surface connection terminals 31, 32, 33, 34, 35, and 36 electrically connected to the angular velocity sensor elements 120 and 130 are connected to the back surface connection terminals 51, 52, 53, 54, 55, and 56 as described above. And electrically connected. The back surface connection terminals 51, 52, 53, 54, 55, and 56 are electrically connected to the relay board connection terminals 1610, 1620, 1630, 1640, 1650, and 1660 included in the base 1110 of the package 1100 used in the angular velocity sensor 1000. Can be connected.

  As shown in this example, the back surface connection terminals 51, 52, 53, 54, which are arranged so as to be connectable to the relay board connection terminals 1610, 1620, 1630, 1640, 1650, 1660 formed on the base 1110 of the package 1100. By using the relay substrate 100 or the relay substrate 500 including 55 and 56, the package 1100 can be made common, so-called standardization, and the cost increase of the electronic devices such as the angular velocity sensors 1000 and 2000 can be suppressed.

  Although the angular velocity sensor 2000 according to the third embodiment has been described as including the angular velocity sensor elements 120 and 130 that are so-called double T-types, the present invention is not limited to this. For example, as another form of the angular velocity sensor element, a so-called tuning-fork type angular velocity sensor element including two vibrating arms extending in parallel from the base may be provided.

(Fourth embodiment)
As an electronic device according to the fourth embodiment, a smart phone and a digital still including the angular velocity sensor 1000 as an electronic device according to the third embodiment using the relay substrate 100 according to the first embodiment on which the angular velocity sensor element 110 is mounted. The camera will be described. In this embodiment, the angular velocity sensor 1000 will be described as an example. However, a smartphone and a digital still camera having an electronic circuit board in which the relay substrate 100 according to the first embodiment on which the angular velocity sensor element 110 is mounted are provided. It may be.

  FIG. 12 is an external view showing the smartphone 3000. The smartphone 3000 incorporates an angular velocity sensor 1000 that detects the attitude of the smartphone 3000. By incorporating the angular velocity sensor 1000, so-called motion sensing is performed, and the posture of the smartphone 3000 can be detected. The detection signal of the angular velocity sensor 1000 is supplied to, for example, a microcomputer chip 3100 (hereinafter referred to as MPU 3100), and the MPU 3100 can execute various processes according to motion sensing. In addition, motion sensing can be used by incorporating the angular velocity sensor 1000 as a sensor device in electronic devices such as mobile phones, portable game machines, game controllers, car navigation systems, pointing systems, head mounting displays, and tablet computers. Can do.

  FIG. 13 is an external view showing a digital still camera 4000 (hereinafter referred to as camera 4000). An angular velocity sensor 1000 that detects the posture of the camera 4000 is incorporated in the camera 4000. The detection signal of the incorporated angular velocity sensor 1000 is supplied to the camera shake correction device 4100. The camera shake correction device 4100 can move, for example, a specific lens in the lens set 4200 in accordance with the detection signal of the angular velocity sensor 1000 to suppress image defects due to camera shake. Further, camera shake can be corrected in the same manner as the camera 4000 by incorporating the angular velocity sensor 1000 and the camera shake correction device 4100 into the digital video camera.

(Fifth embodiment)
An automobile will be described as a specific example of the moving body as the fifth embodiment including the angular velocity sensor 1000 shown in the third embodiment using the relay substrate 100 according to the first embodiment on which the angular velocity sensor element 110 is mounted. FIG. 14 is an external view of an automobile 5000 according to the fifth embodiment. As shown in FIG. 14, an angular velocity sensor 1000 is incorporated in the automobile 5000. Angular velocity sensor 1000 detects the posture of vehicle body 5100. The detection signal of the angular velocity sensor 1000 is supplied to the vehicle body attitude control device 5200. The vehicle body attitude control device 5200 calculates the attitude state of the vehicle body 5100 based on the supplied signal, and controls, for example, the hardness of the shock absorber (so-called suspension) according to the attitude of the vehicle body 5100 or the braking force of each wheel 5300. And can be controlled. Such posture control using the angular velocity sensor 1000 can be used for a toy such as a biped robot, an aircraft, or a radio controlled helicopter.

  The present invention is not limited to the angular velocity sensor element, but includes an acceleration sensor having acceleration detection, a pressure sensor having a pressure detection function, a weight sensor having a weight detection function, and these sensors. A composite sensor, a vibrator mounted on an oscillator, a frequency filter, or the like may be used.

  DESCRIPTION OF SYMBOLS 10 ... Board | substrate, 11, 12, 13, 14, 15, 16 ... Projection, 21, 22, 23, 24, 25a, 25b, 26a, 26b, 27a, 27b, 28a, 28b ... Element connection terminal, 31, 32, 33, 34, 35, 36 ... main surface connection terminals, 41, 42, 43, 44, 45, 46 ... side conductive layers, 51, 52, 53, 54, 55, 56 ... back connection terminals, 100 ... relay board.

Claims (9)

An element connection terminal for mounting an element on one main surface of the substrate having electrical insulation, an external connection terminal on the back surface of the main surface, and a main surface extending from the element connection terminal on the main surface Surface wiring, and
A side surface of the substrate includes a plurality of insulating surfaces,
Except at least the insulating surface, a side surface conductive layer is provided on the side surface of the substrate,
The external connection terminal and the main surface wiring are electrically connected to the side surface conductive layer,
A relay board characterized by that. The side surface of the substrate includes a protrusion protruding along the main surface,
The insulating surface is provided on the outer end surface of the protrusion.
The relay board according to claim 1. The outer end surface of the protrusion includes a cut surface of the substrate;
The relay board according to claim 2. The cut surface is a cut surface obtained by cutting the substrate from a wafer substrate including a plurality of the substrates.
The relay board according to claim 3. Preparing a wafer substrate having electrical insulation, a wafer preparation step,
Forming a plurality of relay substrate chips held by a plurality of connecting portions connected to the wafer on the wafer;
Forming at least an element connection terminal for mounting an element on one main surface of the relay substrate chip, a main surface wiring extending from the element connection terminal, and an external connection terminal on the back surface of the main surface A wiring formation process;
Cutting the connection part to separate the relay board chip into pieces,
In the wiring formation step, a side surface conductive layer is formed on a side surface of the relay substrate chip including at least a surface intersecting a main surface of the connection portion.
A method for manufacturing a relay board, wherein An element connection terminal for mounting an element on one main surface of the substrate having electrical insulation, an external connection terminal on the back surface of the main surface, and a main surface extending from the element connection terminal on the main surface Surface wiring, and
The side surface of the substrate includes a plurality of protrusions protruding along the main surface,
A side surface conductive layer is provided on the side surface intersecting the main surface excluding at least the outer end surface of the protrusion,
The element electrically connected to the element connection terminal;
A circuit element electrically connected to the external connection terminal,
An electronic device characterized by that.   The electronic device according to claim 6, wherein the element is a sensor element.   An electronic apparatus comprising the relay substrate according to claim 1.   A moving body comprising the relay substrate according to any one of claims 1 to 4.

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