JP2015114235A - Sensor unit, shape measurement device and structure manufacturing system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a shape measurement device that accurately measures a three-dimensional shape of even a measurement object large in a change in an irradiation direction of line light.SOLUTION: A shape measurement device includes: an irradiation unit 10 that irradiates a measurement object M with line light; a first imaging unit 30 that images an image of the line light from the measurement object M; and a second imaging unit 40 that images the image of the line light from the measurement object M. Further, the shape measurement device includes a dividing mechanism that divides light reflected upon the measurement object into the first imaging unit 30 and the second imaging unit 40. A conjugate surface corresponding to each of the first imaging unit 30 and the imaging unit 40 is configured to be different, and the image of the line light is imaged on the respective conjugate surfaces.

Description

  The present invention relates to a sensor unit, a shape measuring device, and a structure manufacturing system.

  A light cutting method is known as a method for measuring a three-dimensional shape of a measurement object in a non-contact manner (see, for example, Patent Document 1). In the light cutting method, line light is irradiated to a measurement target in a predetermined direction, and a light cutting line that is an image of the line light is formed on the surface of the measurement target. At this time, the surface of the measuring object is irradiated with the beam waist (the portion with the smallest thickness) of the line light. The beam waist of this line light is called the measurement range. The light section line is formed in a shape along the surface of the measurement target.

  On the other hand, this light cutting line is imaged from a direction different from the irradiation direction of the line light. Then, image data along the shape of the surface of the measurement target is obtained by imaging the light cutting line while scanning the light cutting line in a predetermined direction along the surface of the measurement target. From this image data, the three-dimensional shape of the measurement object can be calculated. In such a light cutting method, a sensor unit having a light irradiation unit that irradiates a measurement target with line light and forms a light cutting line on the surface of the measurement target, and an imaging unit that images the light cutting line is used. .

US Pat. No. 6,542,249

  However, in the conventional configuration, it is necessary to arrange the measurement target in the measurement range of the line light irradiated from the light source of the light irradiation unit. Therefore, if the optical cutting line is imaged by a single imaging unit as in the conventional case, it is necessary to have a large imaging surface when the measurement range is wide, and there is a problem that it is difficult to reduce the size of the imaging unit. Furthermore, when the measurement object exceeds the measurement range, clear line light is not formed on the measurement object. The distance from the light source to the measurement range is called the optical working distance. In the conventional configuration, this optical working distance is constant, so the detection accuracy decreases for measurement objects that have a large change in the irradiation direction of the line light. There is a problem to do.

  In view of the above circumstances, the present invention can suppress an increase in the size of the sensor unit even when the measurement range of line light is wide. In addition, a sensor unit, a shape measuring device, a structure manufacturing system, a shape measuring method, a structure manufacturing method, and a shape measuring program capable of measuring a three-dimensional shape with high accuracy even if the measurement target is greatly changed in the irradiation direction of the line light. And a storage medium.

  According to the first aspect of the present invention, a sensor unit for measuring the shape of the surface of the test object, the projection optical system for projecting line light onto the surface of the test object, and the projected line light A first imaging unit that captures the image of the image, a second imaging unit that captures the image of the projected line light, and a dividing unit that divides the light reflected by the test object into the first imaging unit and the second imaging unit. A sensor unit is provided in which a plane conjugate with the imaging plane of the first and second imaging units is different and an image of line light on the conjugate plane is captured.

  According to the second aspect of the present invention, the sensor unit measures the shape of the surface of the test object, and the projection optical system projects the line light onto the surface of the test object in the first direction. There is provided a sensor unit including an imaging unit that captures an image of line light and a changing unit that changes the line light between the first measurement range and the second measurement range in the first direction.

  According to the third aspect of the present invention, there is provided the sensor unit according to the first aspect of the present invention, and a scanning system for relatively moving the sensor unit and the measurement object, and image information from the sensor unit and the scanning system. And a calculation unit that calculates a shape of a measurement target based on the scanning information.

  According to the fourth aspect of the present invention, the design apparatus for producing design information relating to the shape of the structure, the molding apparatus for producing the structure based on the design information, and the present invention for measuring the shape of the produced structure. There is provided a structure manufacturing system including the shape measuring apparatus according to the third aspect of the present invention, and an inspection apparatus that compares design information with shape information related to the shape of the structure obtained by the shape measuring apparatus.

  According to the aspect of the present invention, an increase in the size of the sensor unit can be suppressed even when the line light measurement range is wide. In addition, a three-dimensional shape can be measured with high accuracy even when the measurement target is greatly changed in the irradiation direction of the line light.

It is a figure which shows an example of the sensor unit which concerns on 1st Embodiment. It is a figure which shows an example of operation | movement of a sensor unit. It is a figure which shows another example of a sensor unit. It is a figure which shows an example of the sensor unit which concerns on a 1st modification. It is a figure which shows an example of the sensor unit which concerns on 2nd Embodiment. It is a figure which shows an example of the sensor unit which concerns on a 3rd modification. It is a figure which shows an example of the sensor unit which concerns on a 4th modification. It is a figure which shows an example of the sensor unit which concerns on a 5th modification. It is a figure which shows an example of embodiment of a shape measuring apparatus. It is a flowchart explaining an example of a shape measuring method. It is a block diagram which shows an example of embodiment of a structure manufacturing system. It is a flowchart which shows an example of embodiment of a structure manufacturing method.

  Embodiments of the present invention will be described below with reference to the drawings. However, the present invention is not limited to this. Further, in the drawings, in order to describe the embodiment, the scale is appropriately changed and expressed, for example, partly enlarged or emphasized. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. The Z-axis direction is set, for example, in the vertical direction, and the X-axis direction and the Y-axis direction are set, for example, in directions that are parallel to the horizontal direction and orthogonal to each other. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

<First Embodiment>
FIG. 1 is a diagram illustrating an example of a sensor unit according to the first embodiment. The sensor unit 100 obtains the three-dimensional shape of the measurement target (test object) M by a light cutting method. In this case, the sensor unit 100 is an apparatus that irradiates the line light L to form a light cutting line on the measurement target M, captures the light cutting line, and acquires image data. Note that the three-dimensional shape of the measurement target M can be calculated by separately performing a predetermined calculation using the image data obtained by the sensor unit 100.

  As shown in FIG. 1, the sensor unit 100 includes a light irradiation unit 10, an imaging optical system 20, a first imaging unit 30, a second imaging unit 40, and a control unit CONT. The light irradiating unit 10, the imaging optical system 20, the first imaging unit 30, and the second imaging unit 40 are fixed and arranged in a housing (not shown) or the like so that their positional relationship does not change.

  The light irradiation part 10 is arrange | positioned with respect to the measuring object M in the position away in the 1st direction D1 (for example, Z direction). The light irradiation unit 10 is an example of a projection optical system that projects the line light L onto the surface of the measurement target M. The measurement object M is placed on a placement surface F that is a flat plane. The measurement object M may be fixed to the placement surface F via a jig or the like. The placement surface F is set to a plane parallel to the XY plane. The first direction D1 is a direction that intersects the placement surface F. The light irradiation unit 10 irradiates the measurement target M with the line light L. The line light L is line-shaped light along a second direction D2 (for example, the X direction) on the measurement target M that intersects the first direction D1. In the line light L, a first measurement range L1 and a second measurement range L2, which will be described later, are set in the first direction D1.

  An optical cutting line (line-shaped pattern) PCL is formed on the surface of the measuring object M by the line light L irradiated to the measuring object M. The light cutting line PCL is a projected image of the line light L formed on the surface of the measuring object M. The light cutting line PCL is formed according to the uneven shape of the surface of the measuring object M. Therefore, when there is a step in the first direction D1, the light section line PCL is formed corresponding to the step.

  The imaging optical system 20 captures an image of the light section line PCL formed on the measurement target M. The imaging optical system 20 has an optical axis AX. The axial direction (optical axis direction) of the optical axis AX is different from the first direction D1. The imaging optical system 20 is not limited to using a single optical element, and is configured by combining a plurality of refractive or reflective optical elements. Further, some or all of these optical elements may be formed so as to be movable in the optical axis AX or a direction orthogonal to the optical axis AX.

  The first imaging unit 30 and the second imaging unit 40 respectively capture the optical cutting line PCL of the line light L via the imaging optical system 20. The first imaging unit 30 images the light cutting line PCL formed in the first measurement range L1 in the line light L. The second imaging unit 40 images the light cutting line PCL formed in the second measurement range L2 in the line light L. The first imaging unit 30 and the second imaging unit 40 are different from each imaging plane in a conjugate plane, and an image of the line light L is captured on the conjugate plane. The light reflected by the measurement object M is divided into the first imaging unit 30 and the second imaging unit 40. The first measurement range L1 and the second measurement range L2 are set in a state of being connected in the first direction D1, as shown in FIG. As shown in FIG. 1, the first imaging unit 30 and the second imaging unit 40 are not limited to being arranged apart from each other, and may be arranged in contact with each other.

  The first imaging unit 30 and the second imaging unit 40 include solid-state imaging devices such as a CCD (Charge Coupled Device) sensor and a CMOS (Complementary Metal Oxide Semiconductor) sensor. The optical cutting line PCL imaged by the first imaging unit 30 and the second imaging unit 40 is acquired as image data of the line light L, converted into an electrical signal, and transmitted to the control unit CONT. The first imaging unit 30 and the second imaging unit 40 are each controlled by the control unit CONT. The first imaging unit 30 and the second imaging unit 40 use the same type of solid-state imaging device, but different types of solid-state imaging devices may be used instead. In addition, the first imaging unit 30 and the second imaging unit 40 may have the same size light receiving surface, or may have different size light receiving surfaces.

  The control unit CONT comprehensively controls the operations of the light irradiation unit 10, the first imaging unit 30, and the second imaging unit 40. The control unit CONT includes, for example, a CPU (Central Processing Unit) and a memory. The control unit CONT receives imaging data transmitted from the first imaging unit 30 and the second imaging unit 40, and stores the imaging data in a memory or the like. The control unit CONT may include a calculation unit that calculates a three-dimensional shape based on stored imaging data such as a memory. Further, the control unit CONT may include a transmission / reception unit for transmitting the imaging data to another external device.

  Such a sensor unit 100 does not change the positional relationship among the light irradiation unit 10, the imaging optical system 20, the first imaging unit 30, and the second imaging unit 40, but the line light L in the third direction D3 (for example, the Y direction). ) Can be scanned. The third direction D3 is a direction that intersects the second direction D2 of the line light L. The configuration for scanning the line light L may be a configuration in which the sensor unit 100 or the measuring object M is translated in the Y direction by a drive unit (not shown), or the sensor unit 100 is moved to θX by a rotation drive unit (not shown). It may be configured to rotate in the direction.

  By scanning the line light L in the third direction D3, the light cutting line PCL moves on the surface of the measuring object M in the Y direction. The optical cutting line PCL of the measuring object M is moved by imaging the optical cutting line PCL moving in the Y direction as a predetermined time interval or continuous moving image by the first imaging unit 30 and the second imaging unit 40. Image data on the route is obtained. The movement of the optical cutting line PCL in the Y direction is transmitted to the control unit CONT as scanning information of the sensor unit 10 in the Y direction, for example. As the scanning information, position data of the sensor unit 10 or the measurement target M (mounting surface F) for every predetermined time, angle data around θX for each time of the sensor unit 10, or the like is used.

  FIG. 2 is a diagram schematically illustrating a state in which an optical cutting line is formed on the measurement target M0 having a step and an image of the optical cutting line is acquired. As shown in FIG. 2A, a first surface M1 and a second surface M2 are formed on the + Z side of the measurement object M0. A step M3 is formed between the first surface M1 and the second surface M2. The step M3 is formed so as to straddle the first measurement range L1 and the second measurement range L2 of the line light L.

  The light irradiation unit 10 includes a probe 11, a light source 12, and an illumination optical system 13. The probe 11 is formed in a cylindrical shape, for example, and houses a light source 12 and an illumination optical system 13 therein. The light source 12 includes a laser diode that emits laser light having a single wavelength or a plurality of wavelengths, for example. The light source 12 emits laser light in the −Z direction. The illumination optical system 13 shapes the laser light from the light source 12 into line light L and emits it in the −Z direction. The line light L is formed along a plane S1 parallel to the XZ plane.

  The line light L emitted from the illumination optical system 13 is gradually reduced in thickness t (dimension in the Y direction) in the −Z direction. A portion (beam waist) having the smallest thickness in the line light L is used as a measurement range. In the present embodiment, the first measurement range L1 and the second measurement range L2 are set in the beam waist. A beam waist is formed in a certain range in the Z direction of the line light L, and the first measurement range L1 is set to a range of the −Z side half of this beam waist. The second measurement range L2 is set to a + Z side half range of the beam waist. Therefore, the first measurement range L1 and the second measurement range L2 are set as different measurement ranges in the first direction D1. The first measurement range L1 and the second measurement range L2 may be continuous or separated. As shown in FIG. 2A, in the first measurement range L1, the optical cutting line PCL1 of the line light L is formed on the plane S1 including the first direction D1. Further, the first measurement range L1 and the second measurement range L2 may be set so as to overlap each other. When the line light L is detected in a region where the first measurement range L1 and the second measurement range L2 overlap, either one of the results can be used. In addition, when the line light L is detected in a region where the first measurement range L1 and the second measurement range L2 overlap, both results can be used. In this case, an averaged result may be used from both results. The first measurement range L1 and the second measurement range L2 may be different in the range parallel to the Z direction.

  The imaging optical system 20 has one or a plurality of lenses as described above. In FIG. 2, the lens is shown as a single lens for easy identification. The imaging optical system 20 has a main surface S2. When the imaging optical system 20 includes a plurality of lenses, the main surface S2 corresponds to a main surface when the plurality of lenses is a single lens.

  The first imaging unit 30 has a light receiving surface 30a. The second imaging unit 40 has a light receiving surface 40a. The light receiving surface 30a of the first imaging unit 30 and the light receiving surface 40a of the second imaging unit 40 are arranged side by side on the same plane S3. As shown in FIG. 2A, the first imaging unit 30 can image a range corresponding to the first measurement range L1 in the plane S1. Therefore, in the first measurement range L1, the image of the light cutting line PCL1 formed on the first surface M1 and the side surface of the measurement object M0 is acquired by the light receiving surface 30a via the imaging optical system 20.

  In the sensor unit 100, as shown in FIG. 2, the first measurement range L1 (plane S1) where the optical cutting line PCL1 of the line light L is formed, the main surface S2 (lens main surface) of the imaging optical system 20, The plane S3 including the light receiving surface 30a of the first imaging unit 30 is arranged so as to intersect with one straight line P. Thus, since the first measurement range L1, the imaging optical system 20, and the light receiving surface 30a are arranged in accordance with the Scheinproof principle, the light section line PCL1 is transmitted through the imaging optical system 20 to the first imaging unit. The projected light is focused on the 30 light receiving surfaces 30a.

  FIG. 2B shows a state in which the second surface M2 of the measuring object M0 is measured. 2B, when the sensor unit 100 is moved in the −Y direction without changing the distance in the Z direction from the measurement object M0 (or the measurement object). (When M0 is moved in the + Y direction). As shown in FIG. 2B, the line light L moves from the first surface M1 of the measurement object M0 to the second surface M2 across the step M3. At this time, since the second surface M2 is positioned on the + Z side with respect to the first measurement range L1 of the line light L, the optical cutting line PCL2 of the line light L is out of the first measurement range L1 in the plane S1, and 2 is formed in the measurement range L2. Therefore, the light cutting line PCL2 on the second surface M2 is out of the imaging range by the first imaging unit 30.

  On the other hand, the second imaging unit 40 can image a range corresponding to the second measurement range L2 in the plane S1. Therefore, the second surface M2 of the measurement object M0 and the light cutting line PCL2 formed on the side surface thereof are acquired by the light receiving surface 40a of the second imaging unit 40 via the imaging optical system 20. In this case, the second measurement range L2 (plane S1) in which the light cutting line PCL2 of the line light L is formed, the main surface S2 (lens main surface) of the imaging optical system 20, and the light receiving surface 40a of the second imaging unit 40. Is arranged so as to intersect with one straight line P in the same manner as described above. As described above, since the second measurement range L2, the imaging optical system 20, and the light receiving surface 40a are arranged according to the Scheinproof principle, the light cutting line PCL2 is connected to the second imaging unit via the imaging optical system 20. The projected light is focused on the 40 light receiving surfaces 40a.

  In the case shown in FIG. 2B, the lower part (−Z side part) of the optical cutting line PCL2 formed on the side surface of the measurement object M0 is within the first measurement range L1, so The side portion is acquired by the first imaging unit 30 as described above.

  The control unit CONT may include a synthesis processing unit that synthesizes image data transmitted from each of the first imaging unit 30 and the second imaging unit 40. In this synthesis processing unit, for example, feature points are connected based on image data sent from each of the first imaging unit 30 and the second imaging unit 40, or are connected using a preset index mark or the like. To synthesize the image data. Further, the control unit CONT calculates coordinate data for each pixel of the first imaging unit 30 based on the image data transmitted from the first imaging unit 30. On the other hand, the control unit CONT calculates coordinate data for each pixel of the second imaging unit 40 based on the image data transmitted from the second imaging unit 40. The calculated coordinate data may be combined.

  The control unit CONT may be included in the sensor unit 100, or may be included in an external device (for example, a computer) of the sensor unit 100. Of course, the control part CONT may be provided both inside the sensor unit 100 and outside the sensor unit 100. For example, in the control unit CONT inside the sensor unit 100, image data from the first imaging unit 30 and the second imaging unit 40 is acquired, and a synthesized image is created by synthesizing the image data. The created composite image is transmitted to the control unit CONT outside the sensor unit 100. The received control unit CONT outside the sensor unit 100 creates coordinate data from the composite image data. In this way, coordinate data may be created from image data by the control units CONT provided at a plurality of locations. In this case, the control unit CONT included in the sensor unit 100 changes the posture of the control unit CONT as the posture of the light irradiation unit 10, the first imaging unit 30, and the second imaging unit 40 changes. On the other hand, the control unit CONT outside the sensor unit 100 does not change the posture of the control unit CONT even if the postures of the light irradiation unit 10, the first imaging unit 30, and the second imaging unit 40 change. In other words, since the sensor unit 100 is provided in the external device, the sensor unit 100 is driven independently of the external device.

  Further, when the Scheinproof principle is followed, the image size of the first measurement range L1 imaged on the light receiving surface 30a via the imaging optical system 20 is also imaged on the light receiving surface 40a via the imaging optical system 20. This is different from the image size in the second measurement range L2. In FIG. 2, the image projected onto the light receiving surface 40 a of the second imaging unit 40 is larger than the image projected onto the light receiving surface 30 a of the first imaging unit 30. Accordingly, the control unit CONT or the external device can acquire the image size ratio in advance and calculate and process the ratio at the time of combining the images, thereby accurately combining the images. . Further, the resolutions of the first imaging unit 30 and the second imaging unit 40 may be changed in accordance with the size of such an image. In addition, the first imaging unit 30 and the second imaging unit 40 may have dimensions that match the size of the image projected on the light receiving surfaces 30a and 40a, respectively.

  Thus, according to the first embodiment, in the line light L, the first measurement range L1 and the second measurement range L2 that are different from each other in the first direction D1 are set and correspond to the first measurement range L1. Since the first imaging unit 30 that captures an area and the second imaging unit 40 that captures an area corresponding to the second measurement range L2 are provided, even if the measurement target M0 is different in height in the first direction D1, The optical cutting lines PCL1 and PCL2 can be imaged by switching the measurement range without moving the sensor unit 100 itself in the Z direction. Thereby, it is not necessary to use a large imaging part, and the sensor unit 100 can be reduced in size. Such an effect is the same in the following modifications.

  In addition, when the first imaging unit 30 and the second imaging unit 40 are installed, the imaging optical system 20 is designed according to the first imaging unit 30 and the second imaging unit 40 to be installed, so that the first The measurement range L1 and the second measurement range L2 can be set. For example, even if there is a distance where the first image capturing unit 30 and the second image capturing unit 40 can be installed close to each other, and there is an area that cannot be captured between the first image capturing unit 30 and the second image capturing unit 40, the image capturing optical system is used. By designing, the first measurement range L1 and the second measurement range L2 can be set. The first measurement range L1 and the second measurement range L2 that can be set can also be set continuously. In this way, in addition to arranging the first imaging unit 30 and the second imaging unit side by side, by using the imaging optical system 20 for guiding the light reflected by the measurement target M in a predetermined direction, the measurement range is set to the first range. It becomes possible to increase the measurement range L1 and the second measurement range L2.

  In the above-described embodiment, the first measurement range L1 and the second measurement range L2 are set in the first direction D1, but the direction to be set is not limited to this. For example, it may be set in a direction orthogonal to the first direction D1. In this case, the first measurement range L1 and the second measurement range L2 may be set in a direction parallel to the longitudinal direction of the line light L.

  Moreover, in the above-mentioned embodiment, although the 1st measurement range L1 and the 2nd measurement range L2 were set, of course, the number of the measurement ranges which can be set is not restricted to this. In addition to the first measurement range L1 and the second measurement range L2, a third measurement range may be provided. In this case, the third measurement range may be set outside the first measurement range L1 and the second measurement range L2 in parallel with the first direction D1. Further, for example, the third measurement range may be set in a direction orthogonal to the first direction D1 with respect to the first measurement range L1 and the second measurement range L2 arranged in a direction parallel to the first direction D1. Absent.

  In the above-described embodiment, the areas of the light receiving surfaces of the first measurement range L1 and the second measurement range L2 may be the same or different.

  In the above-described embodiment, since the first measurement range L1 and the second measurement range L2 are arranged along the first direction D1, only the first measurement range L1 is arranged along the first direction D1. In this case, when the distance along the first direction D1 of the unevenness of the measurement target M is longer than the first measurement range L1, the sensor unit 100 is arranged such that the surface of the measurement target M is arranged in the first measurement range L1. It is necessary to change the relative distance between the measurement target M and the sensor unit 100 if the distance along the first direction D1 of the unevenness of the measurement target M is in the first measurement range L1 and the second measurement range L2. There is no need to change the relative distance to the target M. Therefore, the time for adjusting the relative distance between the sensor unit 100 and the measuring object M can be shortened.

  Moreover, in the above-mentioned embodiment, although the surface shape of the measuring object M was measured using the 1st measurement range L1 and the 2nd measurement range L2 which were set along the 1st direction D1, at least installed You may measure the surface shape of the measuring object M using only one side. For example, when the unevenness of the surface shape of the measurement target M in the first direction D1 is within the first measurement range L1, only the first measurement range L1 may be used without using the second measurement range L2. Further, from the information on the surface shape of the measurement target M (for example, design information such as CAD), even if the distance in the first direction D1 of the unevenness of the surface shape of the measurement target M is within the first measurement range L1, the first When a complicated operation for changing the relative distance between the sensor unit 100 and the measurement target M is necessary to arrange the surface of the measurement target M in the measurement range L1, the first measurement range L1 that is set is set. And the second measurement range L2 may be used. Thereby, complicated operation can be eliminated.

  In the above-described embodiment, the first imaging unit 30 and the second imaging unit 40 change the positional relationship between the imaging optical system 20, the first imaging unit 30, and the second imaging unit 40 using a member (not shown). It is being fixed to the member which is not illustrated so that it may not be made. There is only one direction in which the optical cutting line PCL is imaged by the imaging optical system 20 by a member (not shown). That is, the light of the light cutting line PCL reflected by the measurement object is guided to the imaging optical system 20 and can be divided into light received by the first imaging unit 30 and light received by the second imaging unit 40. . Note that there may be two or more imaging optical systems 20 for guiding light received by the first imaging unit 30 and the second imaging unit 40. For example, the first imaging unit 30 and the second imaging unit 40 include independent imaging optical systems 20, and the measurement target is measured by the imaging optical systems 20 corresponding to the first imaging unit 30 and the second imaging unit 40, respectively. You may receive the light of the optical cutting line PCL reflected by M. In this case, the first image pickup unit 30 and the image pickup optical system 20 corresponding thereto, and the second image pickup unit 40 and the image pickup optical system 20 corresponding thereto are respectively provided in the first measurement range D1 in the first direction D1 by members not shown. L1 and the second measurement range L2 can be arranged.

  Further, the first imaging unit 30 and the second imaging unit 40 may have different directions in which the light reflected by the measurement object M is received. For example, the first imaging unit 30 and the imaging optical system 20 corresponding to the first imaging unit 30, and the second imaging unit 40 and the imaging optical system 20 corresponding to the first imaging unit 30 may be arranged with the optical cutting line PCL interposed therebetween. For example, in FIG. 2, the first imaging unit 30 and the second imaging unit 40 may be arranged so as to sandwich the optical cutting line PCL in the Y direction. In this case, the plane including the light receiving surface 30a of the first imaging unit 30, the plane including the main surface of the imaging optical system 20, and the plane including the first measurement range L1 are arranged so as to intersect with one straight line P. Is done. As shown in FIG. On the other hand, in this case, the plane including the light receiving surface 40a of the second imaging unit 40, the plane including the main surface of the imaging optical system 20, and the plane including the second measurement range L2 are one straight line P. Arranged to cross. In this case, since the plane including the first measurement range L1 and the plane including the second measurement range L2 are the same, the straight line P is also the same. On the other hand, in the Y direction, since the first imaging unit 30 and the second imaging unit 40 are arranged so as to sandwich the light cutting line PCL, the plane including the light receiving surface 30a of the first imaging unit 30 and the second imaging This is different from the plane including the light receiving surface 40a of the portion 40. The planes including the main surface of the imaging optical system 20 corresponding to the first imaging unit 30 and the second imaging unit 40 are different.

<First Modification>
Next, a first modification will be described with reference to the drawings. FIG. 4 is a diagram illustrating an example of a sensor unit 100A according to the first modification. Note that the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified. As shown in FIG. 4, the sensor unit 100 </ b> A according to this modification is arranged on planes S <b> 3 and S <b> 4 where the light receiving surface 30 a of the first imaging unit 30 and the light receiving surface 40 a of the second imaging unit 40 intersect each other. Yes. In the following description, a line of intersection between the plane S3 and the plane S4 is a straight line Q.

  Further, the sensor unit 100A has a half mirror (dividing part) HM. The half mirror HM is fixed to the sensor unit 100A by a support tool (not shown). The half mirror HM divides the image of the optical cutting lines PCL1 and PCL2 formed on the surface of the measurement target into the first imaging unit 30 and the second imaging unit 40. The half mirror HM is disposed on the plane S5. The plane S5 is set to intersect the plane S3 and the plane S4 on the straight line Q. The angles between the planes S3 and S4 are arranged to be equal. Therefore, the plane S3 and the plane S4 are arranged symmetrically with respect to the plane S5. Thereby, as shown in FIG. 4, even if the second imaging unit 40 is arranged on the plane S4, the second measurement range L2, the imaging optical system 20, and the second imaging unit 40 have the Scheimpflug principle. Maintained. Therefore, on the light receiving surface 40a of the second imaging unit 40, the light cutting line PCL2 within the second measurement range L2 is in a focused state.

  In the second imaging unit 40, the light receiving surface 40a is arranged on the plane S4. That is, the first image capturing unit 30 and the second image capturing unit 40 are not on the same plane. In FIG. 4, the second imaging unit 40 is arranged on the plane S4. Alternatively, the first imaging unit 30 may be arranged on the plane S4 and the second imaging unit may be arranged on the plane S3. Good.

  Of the image of the light section line PCL1, the component that passes through the half mirror HM reaches the light receiving surface 30a of the first imaging unit 30. On the other hand, the component reflected by the half mirror HM in the image of the light section line PCL1 does not reach the light receiving surface 30a and is not used for detection. In addition, the component reflected by the half mirror HM in the image of the light section line PCL2 reaches the light receiving surface 40a of the second imaging unit 40. On the other hand, in the image of the light cutting line PCL2, the component that passes through the half mirror HM does not reach the light receiving surface 40a and is not used for detection.

  Therefore, in the first imaging unit 30, an image of the light section line PCL1 included in the light transmitted through the half mirror HM is acquired. In the second imaging unit 40, an image of the light section line PCL2 included in the light reflected by the half mirror HM is acquired. In this modification, a part of the light cutting lines PCL1 and PCL2 is received, but when the light intensity of the light cutting line PCL1 or the like is high, it can be used as image data as it is. Further, when the light intensity is low, a gain may be applied at the subsequent image processing stage.

  In the present modification, the distance between the second imaging unit 40 and the half mirror HM can be adjusted. Accordingly, when the sizes of the images acquired by the first imaging unit 30 and the second imaging unit 40 are different as in the first embodiment described above, the first imaging unit 30 can be changed by changing the position of the second imaging unit 40. An image having the same size or an image with a reduced size difference can be acquired for the imaging unit 30.

  As described above, according to the present modification, the first imaging unit 30 and the second imaging unit 40 are not arranged side by side on the same plane, but are arranged at different positions, so that the first imaging unit 30 and the second imaging unit 40 are arranged. 2 The degree of freedom of arrangement of the imaging unit 40 increases. For this reason, the range of design of the sensor unit 100A is widened, and a compact design can also be performed.

  In this modification, the half mirror HM is used, but the present invention is not limited to this. For example, a total reflection mirror may be used. When a total reflection mirror is used, a driving device for entering or retracting the total reflection mirror in the optical path may be used. For example, when measuring the first measurement range L <b> 1, the total reflection mirror is retracted and the image data of the first measurement range L <b> 1 is acquired by the first imaging unit 30. Next, when measuring the second measurement range L2, the total reflection mirror is made to enter the optical path, and the reflected light is received by the second imaging unit 40 to acquire image data. By using the total reflection mirror in this way, bright image data can be acquired even when the light intensity of the light cutting line formed on the measurement target is small. Even when the total reflection mirror is arranged, if it does not interfere with the image in the first measurement range L1, it is not necessary to drive the total reflection mirror back and forth.

  Also, for example, unlike a mirror, a DMD driven by electricity, a liquid crystal display panel, or the like may be used.

  In the present modification, the first imaging unit 30 and the second imaging unit 40 correspond to the first measurement range L1 and the second measurement range L2, respectively, but the first imaging unit 30 and the second imaging unit. 40 to measure the first measurement range L1 and the first imaging unit 30 and the second imaging unit 40 to measure the first measurement range L1 and the second measurement range L2, respectively. It doesn't matter.

  In addition, the first imaging unit 30 and the second imaging unit 40 correspond to the first measurement range L1 and the second measurement range L2, respectively, but the third imaging unit and the fourth imaging unit are provided, Imaging of one measurement range L1 may be performed by a plurality of imaging units. For example, when the first measurement range L1 is imaged by the first imaging unit 30 and the third imaging unit, the result of at least one of the first imaging unit 30 and the third imaging unit may be adopted. In addition, for example, when the first measurement range L1 is imaged by the first imaging unit 30 and the third imaging unit, the result of both the first imaging unit 30 and the third imaging unit is used as the measurement result. I do not care. In this case, the results of the first imaging unit 30 and the third imaging unit may be averaged and used. The method used for averaging can be selected as appropriate, such as geometric average or arithmetic average.

<Second Modification>
Next, a second modification will be described. Note that the same or equivalent components as those in the above-described embodiments and modifications are denoted by the same reference numerals, and description thereof is omitted or simplified.

  The sensor unit according to the second modification (hereinafter referred to as sensor unit 100B) uses a dichroic prism (dividing unit) as a dividing unit instead of the half mirror HM shown in FIG. The dichroic prism has a dichroic film. The dichroic film divides the image of the light cutting lines PCL1 and PCL2 formed on the surface of the measuring object M into the first imaging unit 30 and the second imaging unit 40 according to the wavelength. Similar to the half mirror HM, the dichroic film is disposed on the plane S5. Therefore, even when the second imaging unit 40 is arranged on the plane S4, the second measurement range L2, the imaging optical system 20, and the second imaging unit 40 have the Scheimpflug principle as in the first modification. Maintained. Therefore, on the light receiving surface 40a of the second imaging unit 40, the light cutting line PCL2 within the second measurement range L2 is in a focused state.

  The dichroic film transmits light having a predetermined wavelength (first wavelength component) and transmits light having a wavelength different from the first wavelength component (second wavelength component). Moreover, what emits the line light L containing these 1st and 2nd wavelength components is used for the light source 12 (refer FIG. 2) of the light irradiation part 10. FIG.

  Of the image of the optical cutting line PCL1 formed in the first measurement range L1, the first wavelength component passes through the dichroic film and reaches the light receiving surface 30a of the first imaging unit 30. On the other hand, the second wavelength component in the image of the light cutting line PCL1 is reflected by the dichroic film. The second wavelength component does not reach the light receiving surface 30a and is not imaged. In addition, the second wavelength component of the image of the light cutting line PCL2 formed in the second measurement range L2 is reflected by the dichroic film and reaches the light receiving surface 40a of the second imaging unit 40. On the other hand, the first wavelength component in the image of the light section line PCL2 is transmitted through the dichroic film. The first wavelength component passes through the dichroic film and does not reach the light receiving surface 40a, and is not imaged.

  Therefore, in the first imaging unit 30, an image of the light section line PCL1 by the light of the first wavelength component that has passed through the dichroic film is acquired. Accordingly, the optical cutting line PCL1 in the first measurement range L1 is imaged by the first imaging unit 30. Further, in the second imaging unit 40, an image of the light cutting line PCL2 by the second wavelength component reflected by the dichroic film is acquired. Thereby, the optical cutting line PCL2 in the second measurement range L2 is imaged by the second imaging unit 40. That is, images of the first and second measurement ranges L1 and L2 that are different in the first direction D1 are acquired by the different first and second imaging units 30 and 40, respectively.

  Thus, according to the present modification, as in the first modification described above, the first imaging unit 30 and the second imaging unit 40 are not arranged side by side on the same plane, but are arranged at different positions. Thereby, the freedom degree of arrangement | positioning of the 1st imaging part 30 and the 2nd imaging part 40 becomes high. For this reason, the range of design of the sensor unit 100B is widened, and a compact design can be performed. Furthermore, in this modification, since the wavelength is selected by the dichroic film and transmitted or reflected, an accurate image can be acquired corresponding to the first and second measurement ranges L1 and L2.

  Moreover, in this modification, what has a different characteristic in the 1st imaging part 30 and the 2nd imaging part 40 may be used. For example, a light receiving element excellent in detection sensitivity of the first wavelength component is used as the first imaging unit 30, and a light receiving element excellent in detection sensitivity of the second wavelength component is used as the second imaging unit 40. Good. Thereby, the detection sensitivity of the optical cutting lines PCL1 and PCL2 can be improved.

  Note that, also in this modification, the first imaging unit 30 and the second imaging unit 40 are arranged at positions in accordance with the Scheinproof principle. For this reason, the images of the light cutting lines PCL1 and PCL2 are acquired in a focused state on the light receiving surfaces 30a and 40a, respectively. In addition, by correcting the images acquired by the first imaging unit 30 and the second imaging unit 40 by the control unit CONT, it is possible to obtain image data in which the difference in projection magnification is reduced.

  In the first embodiment and the first and second modified examples described above, the measurement range in the first direction D1 is divided into the first measurement range L1 and the second measurement range L2. However, the present invention is not limited to this. . For example, the measurement range may be divided into three or more in the first direction D1, and set as the third measurement range, the fourth measurement range,. In this case, the third imaging unit, the fourth imaging unit,... Are arranged so as to acquire an image of the optical cutting line such as the third measurement range. In addition, these 3rd image pick-up parts etc. are arrange | positioned like the 1st image pick-up part 30 grade | etc., So that a light-receiving surface may be arrange | positioned along the plane S3, or as shown in FIG. The light receiving surface is disposed on the plane S4.

  Further, in the above-described first embodiment, the first and second modified examples, the images of the light cutting lines PCL1 and PCL2 are captured via one imaging optical system 20, but the present invention is not limited to this. An imaging optical system corresponding to each of the second imaging units 30 and 40 may be used.

Second Embodiment
A second embodiment will be described. In the first embodiment described above, the measurement range formed in the line light L is divided into the first measurement range L1 and the second measurement range L2, and the respective images are individually obtained by the first and second imaging units 30 and 40. The configuration to be acquired has been described as an example. However, the present invention is not limited to this, and the measurement range of the line light L may be switched between the first measurement range L1 and the second measurement range L2, and an image formed in each measurement range may be acquired. Good. For example, when the length of the portion (beam waist) where the thickness t of the line light L is the smallest is short in the first direction D1 (Z direction), it becomes impossible to deal with a measurement object having a large change in the Z direction. In this case, by moving the measurement range in the first direction D1, it is possible to deal with a measurement object having a large change in the Z direction.

  FIG. 5 is a diagram illustrating an example of the sensor unit 200 according to the second embodiment. Note that the same or equivalent components as those in the above-described embodiments and modifications are denoted by the same reference numerals, and description thereof is omitted or simplified. As shown in FIG. 5A, the sensor unit 200 includes a light irradiation unit 210, an imaging optical system 20, an imaging unit 230, a wavelength setting unit (changing unit) 240, and a control unit CONT. . The configuration of the imaging optical system 20 is the same as that of the first embodiment. The light irradiation unit 210, the imaging optical system 20, and the imaging unit 230 are arranged fixed to a housing (not shown) or the like by a support or the like so that their positional relationship does not change. The light irradiation unit 210 is an example of a projection optical system that projects the line light L onto the surface of the measurement target M.

  The light irradiation unit 210 includes a probe 211, a light source 212, and an illumination optical system 213. The probe 211 is formed in a cylindrical shape, for example, and houses a light source 212 and an illumination optical system 213 inside. The light source 212 includes, for example, a laser diode that can emit light of different wavelengths. In the present embodiment, for example, a laser diode that can emit red light having a wavelength of about 650 nm and blue light having a wavelength of about 450 nm is used. The light source 212 emits laser light in the −Z direction. The illumination optical system 213 shapes the laser light from the light source 212 into line light L and emits it in the −Z direction. The line light L is formed along a plane S1 parallel to the XZ plane. Note that the wavelength of light to be used is not limited to the above-described red and blue, and for example, red and green, or blue and green may be used. The matter regarding the wavelength of the light to be used is the same for the modifications described later.

  The wavelength setting unit 240 can switch the wavelength of the line light L emitted from the light source 212. Switching of the wavelength of the line light L by the wavelength setting unit 240 is controlled by the control unit CONT. For example, as illustrated in FIG. 5A, the wavelength setting unit 240 turns on the red light source among the light sources 212 and turns off the blue light source in accordance with an instruction from the control unit CONT. Can be injected.

  In the red line light Lr emitted from the illumination optical system 213, the thickness tr is gradually reduced in the -Z direction, and a portion (beam waist) where the thickness tr is the smallest is formed. The first measurement range L1 is set to substantially the entire beam waist in the Z direction. When the surface to be measured is arranged in the first measurement range L1, the light cutting line PCL1 of the red line light Lr is formed on the surface. The optical cutting line PCL1 is formed on the plane S1. Further, as shown in FIG. 5A, in the red line light Lr, the thickness tr is not sufficiently small in the second measurement range L2.

  The imaging unit 230 has a light receiving surface 231. Unlike the first embodiment described above, a single imaging unit 230 is used. The light receiving surface 231 of the imaging unit 230 is disposed on the plane S3. An image of the light cutting line PCL1 of the red line light Lr is acquired by the light receiving surface 231 via the imaging optical system 20.

  FIG. 5B is a diagram illustrating a state when the line light L emitted from the light source 212 is switched to the blue line light Lb. As shown in FIG. 5B, the wavelength setting unit 240 emits the blue line light Lb from the light source 212 by turning on the blue light source among the light sources 212 and turning off the red light source in accordance with an instruction from the control unit CONT. Can be made.

  The blue line light Lb emitted from the illumination optical system 213 is gradually reduced in thickness tb in the −Z direction, and a portion (beam waist) where the thickness tb is the smallest is formed. The second measurement range L2 is set to substantially the entire beam waist in the Z direction. Further, as shown in FIG. 5B, in the blue line light Lb, the thickness tb is expanded toward the −Z direction in the first measurement range L1, and the thickness tb is not sufficiently reduced.

  As described above, the measurement range in the first direction D1 can be changed by switching the red line light Lr and the blue line light Lb. This utilizes axial chromatic aberration in the illumination optical system 213 of the light illumination unit 210. In other words, the change in the refractive index of the optical system is used depending on the wavelength, and light having a short wavelength has a shorter focal length than light having a long wavelength. For this reason, the second measurement range L2 of the blue line light Lb is formed on the + Z side with respect to the first measurement range L1 of the red line light Lr. In this way, it is possible to switch between the first measurement range L1 and the second measurement range L2 that have different positions in the Z direction using the longitudinal chromatic aberration of the illumination optical system 213.

  Therefore, when the surface of the measurement target is arranged in the second measurement range L2, the light section line PCL2 is formed on the surface of the measurement target in the second measurement range L2 using the blue line light Lb. The light cutting line PCL2 is formed on the plane S1. The image of the light cutting line PCL2 by the blue line light Lb is acquired by the light receiving surface 231 of the imaging unit 230 via the imaging optical system 20, similarly to the light cutting line PCL1.

  In the sensor unit 200, similarly to the sensor unit 100 described above, the first and second measurement ranges L1, L2 (plane S1) in which the light cutting line PCL1 of the red line light Lr and the light cutting line PCL2 of the blue line light Lb are formed. ), The main surface S2 (lens main surface) of the imaging optical system 20, and the plane S3 including the light receiving surface 231 of the imaging unit 230 are arranged so as to intersect with one straight line P. Thus, since the first and second measurement ranges L1, L2, the imaging optical system 20, and the light receiving surface 231 are arranged according to the principle of Scheinproof, the light cutting line PCL1 through the imaging optical system 20, The PCL 2 is projected in a focused state on the light receiving surface 231 of the imaging unit 230.

  Note that the image of the light cutting line PCL1 is projected onto an area of the light receiving surface 231 near the straight line P. On the other hand, the image of the light cutting line PCL2 is projected onto a region of the light receiving surface 231 far from the straight line P. Further, the images of the optical cutting lines PCL1 and PCL2 have different optical path lengths with respect to the imaging optical system 20, respectively. For this reason, the images of the optical cutting lines PCL1 and PCL2 are projected on the light receiving surface 230a of the imaging unit 230 with different magnifications. For example, the image of the light cutting line PCL1 is projected on the light receiving surface 230a as an image smaller than the image of the light cutting line PCL2. In this case, the control unit CONT can eliminate the difference in projection magnification by correcting one or both of the image data acquired by the imaging unit 230.

  Thus, according to the second embodiment, the wavelength setting unit 240 switches the wavelength of the line light L emitted from the light irradiation unit 210 to change the measurement range of the line light L from the first measurement range L1 to the second measurement range L1. It can be switched between the measurement range L2. Thereby, the image of a light cutting line can be obtained with respect to the measuring object from which the height direction (1st direction D1, Z direction) differs. Therefore, it is possible to easily and reliably pick up the optical cutting line even if the measurement object has a large change in the height direction.

  In the sensor unit 200 described above, an image of a light section line in a plurality of measurement ranges is obtained using a single imaging unit 230, but the present invention is not limited to this. For example, a plurality of imaging units may be arranged corresponding to the first and second measurement ranges L1 and L2. In this case, as shown in FIG. 2, each imaging unit is arranged along the plane S3, or as shown in FIG. 4, one of the imaging units is arranged on the plane S4 using a half mirror HM or the like (FIG. 4). Etc.).

  Further, in the sensor unit 200 described above, the red line light Lr and the blue line light Lb are switched and irradiated, but the present invention is not limited to this. For example, the red line light Lr and the blue line light Lb may be irradiated at the same time, and the light cutting lines PCL1 and PCL2 formed simultaneously in the first and second measurement ranges L1 and L2 may be simultaneously imaged by the imaging unit 230. In this case, the wavelength setting unit 240 described above is not necessary. In addition, when the red line light Lr and the blue line light Lb are irradiated simultaneously, the region corresponding to the first measurement range L1 of the imaging unit 230 and the second measurement range L2 so as not to receive light of other wavelengths. A wavelength selection filter may be disposed in each of the regions to be processed.

<Third Modification>
Next, a third modification will be described with reference to the drawings. FIG. 6 is a diagram illustrating an example of a sensor unit 200A according to the third modification. Note that the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified. As shown in FIGS. 6A and 6B, the sensor unit 200A is configured such that the imaging unit 230A can move between the first position PT1 and the second position PT2. The imaging unit 230A is smaller than the imaging unit 230 shown in FIG.

  The imaging unit 230A is configured to be movable along the plane S3. For example, a linear guide is formed along the plane S3, and the imaging unit 230A is fixed to a movable member that can move the linear guide. The imaging unit 230A moves by driving a moving device 250 such as a linear motor. The driving of the moving device 250 is controlled by the control unit CONT. As the moving device 250, an actuator such as a ball screw mechanism or a piezo element may be used in addition to the linear motor.

  The first position PT1 is set to a position corresponding to the first measurement range L1. Therefore, when the imaging unit 230A is at the first position PT1, the image of the light section line PCL1 in the first measurement range L1 can be captured by the imaging unit 230A via the imaging optical system 20. The second position PT2 is set to a position corresponding to the second measurement range L2. Therefore, when the imaging unit 230A is at the second position PT2, the image of the light section line PCL2 in the second measurement range L2 can be captured by the imaging unit 230A via the imaging optical system 20. The imaging unit 230A has a light receiving surface 231A that can capture images of the optical cutting lines PCL1 and PCL2 at the first position PT1 and the second position PT2.

  As shown in FIG. 6A, when the red line light Lr is emitted from the light source 212 and set in the first measurement range L1, the image of the optical cutting line PCL1 of the red line light Lr is the imaging optical system 20. To reach the first position PT1. Therefore, when the red line light Lr is emitted, the moving device 250 is driven by an instruction from the control unit CONT, and the imaging unit 230A is arranged at the first position PT1. Thereby, the image of the optical cutting line PCL1 is projected onto the light receiving surface 231A of the imaging unit 230A.

  Further, as shown in FIG. 6B, when the blue line light Lb is emitted from the light source 212 and the second measurement range L2 is formed, the image of the light cutting line PCL2 of the blue line light Lb is an imaging optical. The second position PT2 is reached via the system 20. Therefore, when the blue line light Lb is emitted, the moving device 250 is driven by an instruction from the control unit CONT, and the imaging unit 230A is arranged at the second position PT2. Thereby, the image of the optical cutting line PCL2 is acquired via the light receiving surface 231A of the imaging unit 230A.

  Thus, according to this modification, it is not necessary to use a large image sensor that simultaneously covers both the first and second measurement ranges L1 and L2. Since a small image sensor that can image one of the first and second measurement ranges L1 and L2 can be used, the cost of the image sensor can be reduced.

<Fourth Modification>
Next, a fourth modification will be described with reference to the drawings. FIG. 7 is a diagram illustrating an example of a sensor unit 200B according to a fourth modification. Note that the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified. As shown in FIGS. 7A and 7B, in the sensor unit 200B, a first light source 212a that emits red light and a second light source 212b that emits blue light are individually arranged in the light irradiation unit 210B. Has been. As the first light source 212a, for example, a red laser diode that emits red light having a wavelength of about 650 nm is used. As the second light source 212b, for example, a blue laser diode that emits blue light having a wavelength of about 450 nm is used.

  The sensor unit 200B has a wavelength setting unit (change unit) 240B. The wavelength setting unit 240B switches between the first light source 212a and the second light source 212b according to an instruction from the control unit CONT. By switching between the first light source 212a and the second light source 212b by the wavelength setting unit 240B, the red line light Lr and the blue line light Lb can be switched and emitted.

  The light irradiation unit 210 </ b> B has a light guide optical system 214. The light guide optical system 214 guides red light from the first light source 212a to the illumination optical system 213. The light guide optical system 214 includes a mirror 214a and a dichroic mirror 214b. The mirror 214a totally reflects the red light emitted from the first light source 212a in the + Y direction. The dichroic mirror 214b is disposed at a position in the + Y direction with respect to the mirror 214a and in the −Z direction of the second light source 212b. The dichroic mirror 214b reflects red light and transmits blue light. The light guide optical system 214 irradiates both the red line light Lr and the blue line light Lb along the plane S1.

  As shown in FIG. 7A, when red light is emitted from the first light source 212a in the −Z direction, the red light is reflected in the + Y direction by the mirror 214a, and is reflected in the −Z direction by the dichroic mirror 214b. The The red light is shaped into red line light Lr by the illumination optical system 213 and emitted from the light irradiation unit 210B in the −Z direction. Thereby, the first measurement range L1 is formed. Accordingly, in the first measurement range L1, the image of the light cutting line PCL1 formed by the red line light Lr is projected onto the light receiving surface 231 of the imaging unit 230 via the imaging optical system 20. Thereby, the image of the light cutting line PCL1 is acquired by the imaging unit 230.

  As shown in FIG. 7B, when blue light is emitted from the second light source 212b in the -Z direction, the blue light passes through the dichroic mirror 214b in the -Z direction. The blue light is shaped into the blue line light Lb by the illumination optical system 213 and is emitted from the light irradiation unit 210B in the −Z direction. Thereby, the second measurement range L2 is formed. Therefore, in the second measurement range L2, the image of the light cutting line PCL2 formed by the blue line light Lb is projected onto the light receiving surface 231 of the imaging unit 230 via the imaging optical system 20. Thereby, the image of the optical cutting line PCL2 is acquired by the imaging unit 230.

  Thus, according to the present modification, the first light source 212a that emits red light and the second light source 212b that emits blue light are separately provided, as compared with the case where the light sources of the respective colors are arranged together. A large amount of light can be easily secured. Thereby, a bright image can be easily acquired in the imaging unit 230.

  In this modification, the case where the wavelength setting unit 240B switches between the first light source 212a and the second light source 212b has been described as an example. However, the present invention is not limited to this and is the same as in the second embodiment. In addition, the first light source 212a and the second light source 212b may be used simultaneously. In this case, the red light emitted from the first light source 212a is emitted from the light irradiation unit 210B as the red line light Lr to form the first measurement range L1. Further, the blue light emitted from the second light source 212b is emitted from the light irradiation unit 210B as the blue line light Lb to form the second measurement range L2. In this way, the first measurement range L1 by the red line light Lr and the second measurement range L2 by the blue line light Lb are simultaneously formed.

  In the present modification, the first light source 212a and the second light source 212b that emit light having different wavelengths are described as an example through the common illumination optical system 213, but the present invention is not limited thereto. Instead, the light from the first light source 212a and the second light source 212b may be emitted through different illumination optical systems.

  In addition, the light guide optical system 214 is not limited to the above, and for example, an optical fiber or the like may be used. Further, instead of the imaging unit 230, a movable small imaging unit 230A such as the above-described third modification may be used.

  In the sensor unit 200B described above, the single imaging unit 230 is used, but the present invention is not limited to this. For example, a plurality of imaging units may be arranged corresponding to the first and second measurement ranges L1 and L2. In this case, each imaging unit is arranged along the plane S3 as shown in FIG. 2, or one of the imaging units is arranged on the plane S4 using a half mirror HM or the like as shown in FIGS. (See FIG. 3 etc.).

<Fifth Modification>
Next, a fifth modification will be described with reference to the drawings. FIG. 8 is a diagram illustrating an example of a sensor unit 200C according to the fifth modification. Note that the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified. As shown in FIGS. 8A and 8B, the sensor unit 200 </ b> C uses an imaging unit 230 having a plurality of pixels 232 that select and receive light wavelengths. The pixel 232 includes a plurality of pixels 232 a arranged at the first position 233 and a plurality of pixels 232 b arranged at the second position 234 on the light receiving surface 231 of the imaging unit 230.

  The first position 233 corresponds to the first measurement range L1, and an image of the light section line PCL1 is projected through the imaging optical system 20. The second position 234 corresponds to the second measurement range, and an image of the light section line PCL2 is projected through the imaging optical system 20. As the pixel 232a at the first position 233, a pixel that receives light by selecting a red wavelength is used. As the pixel 232b at the second position 234, a pixel that receives light by selecting a blue wavelength is used. The imaging unit 230 is connected to a pixel selection unit 260 that selects such pixels 232. Selection of the pixel 232 by the pixel selection unit 260 is performed according to an instruction from the control unit CONT.

  As shown in FIG. 8A, when the red line light Lr is emitted from the light source 212 and the first measurement range L1 is set, the image of the light section line PCL1 is captured via the imaging optical system 20. The first position 233 of 230 is reached. Therefore, when the red line light Lr is emitted, the pixel selection unit 260 causes the pixels 232a arranged at the first position 233 to receive light. Thereby, the image of the optical cutting line PCL1 is acquired via the pixel 232a of the imaging unit 230.

  As shown in FIG. 8B, when the blue line light Lb is emitted from the light source 212 and the second measurement range L2 is set, the image of the light section line PCL2 is captured by the imaging unit 20 via the imaging optical system 20. The second position 234 of 230 is reached. Therefore, when the blue line light Lb is emitted, the pixel selection unit 260 causes the pixels 232b disposed at the second position 234 to receive light. Thereby, the image of the light cutting line PCL2 is acquired via the pixel 232b of the imaging unit 230.

  As described above, according to this modification, the light wavelengths are selected and received by the pixels 232a and 232b of the imaging unit 230, and thus the light cutting lines PCL1 and PCL2 formed by the red line light Lr or the blue line light Lb. Can be efficiently imaged. In addition, since a pixel that receives light can be selected from the plurality of pixels 232 provided in the imaging unit 230, it is not necessary to drive all the pixels 232 at all times, and the driving power of the imaging unit 230 can be reduced.

  In this modification, the pixels 232a and 232b are switched by the pixel selection unit 260, but the present invention is not limited to this. For example, without providing the pixel selection unit 260, light may be received from all the pixels 232 in both the first and second measurement ranges L1 and L2. In FIG. 8, the pixel 232a is arranged at the first position 233 and the pixel 232b is arranged at the second position 234. However, the present invention is not limited to this. For example, the pixels 232a and 232b may be alternately arranged on the entire surface of the imaging unit 230. The imaging unit 230 may be arranged in combination with a pixel that can receive light by selecting a wavelength different from that of the pixels 232a and 232b (for example, a pixel that can receive green light).

  In the sensor unit 200C described above, the pixels 232a and 232b are arranged along the plane S3, but the present invention is not limited to this. For example, the pixel 232a at the first position 233 may be arranged on the plane S3, and the pixel 232b at the second position 234 may be arranged on a different plane (for example, the plane S4 shown in FIG. 3 and the like).

<Sixth Modification>
Next, a sixth modification will be described. Note that the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified. The sensor unit (hereinafter referred to as sensor unit 200D) according to the sixth modification is a light source (hereinafter referred to as light source 212D) from which a light irradiation unit (hereinafter referred to as light irradiation unit 210D) emits light having a single wavelength. Called). The sensor unit 200D is formed so that the light irradiation unit 210D can move in the first direction D1 (Z direction), and a driving unit for moving the light irradiation unit 210D (hereinafter referred to as a driving unit 270). have.

  For example, the light irradiation unit 210D is fixed to a movable member capable of moving a linear guide arranged along the first direction D1. The driving unit 270 moves the light irradiation unit 210D between the first position 215 and the second position 216. As the drive unit 270, for example, a linear motor, a ball screw mechanism, or the like is used. The driving unit 270 is driven by an instruction from the control unit CONT. The light irradiation unit 210D uses a contact-type or non-contact-type limit switch, an optical measuring instrument, an encoder, or the like, so that the first position (hereinafter referred to as the first position 215) or the second position (first). 2) (referred to as 2 position 216).

  Here, when the line light L is emitted from the light source 212D, the beam waist BW of the line light L is separated from the end surface on the −Z side of the probe 211 by a predetermined distance (hereinafter referred to as a mechanical working distance L3). Formed in position. In this configuration, by driving the drive unit 270 and moving the light irradiation unit 210D between the first position 215 and the second position 216, the value of the mechanical working distance L3 remains unchanged, and the line light L The position of the beam waist BW moves in the first direction D1. In the sensor unit 200D, the position of the light irradiation unit 210D where the beam waist BW is formed at a position corresponding to the first measurement range L1 of the second embodiment described above is defined as the first position 215, and the second measurement range L2 A position of the light irradiation unit 210D where the beam waist BW is formed at a position corresponding to is a second position 216.

  Accordingly, when the driving unit 270 is driven and the light irradiation unit 210D is positioned at the first position 215, the first measurement range L1 is set. Therefore, the image of the light section line PCL1 is projected onto the imaging unit 230 via the imaging optical system 20. In addition, when the driving unit 270 is driven and the light irradiation unit 210D is positioned at the second position 216, the second measurement range L2 is set. Therefore, the image of the light cutting line PCL2 is projected onto the imaging unit 230 via the optical system 20.

  As described above, according to the present modification, the driving unit 270 can switch between the first measurement range L1 and the second measurement range L2 by moving the light irradiation unit 210D in the first direction D1, so Even when the light source 212D that emits light of a wavelength is used, the measurement range in the first direction D1 can be easily changed.

  In the sensor unit 200D described above, the single imaging unit 230 is used, but the present invention is not limited to this. For example, a plurality of imaging units may be arranged corresponding to the first and second measurement ranges L1 and L2. In this case, as shown in FIG. 2, each imaging unit is arranged along the plane S3, or as shown in FIG. 4, one of the imaging units is arranged on the plane S4 using a half mirror HM or the like (FIG. 4). Etc.).

<Seventh Modification>
Next, a seventh modification will be described. Note that the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified. The sensor unit according to the seventh modification (hereinafter referred to as sensor unit 200E) is a light source (hereinafter referred to as light source 212E) from which a light irradiation unit (hereinafter referred to as light irradiation unit 210E) emits light having a single wavelength. Called). Further, the sensor unit 200E employs a structure that moves the illumination optical system 213 of the light irradiation unit 210E in the first direction D1 (Z direction).

  The illumination optical system 213 is configured by combining one or two or more optical elements. One or more of these optical elements are supported to be movable in the first direction D1. The illumination optical system 213 includes a drive unit (hereinafter referred to as a drive unit 270E) that moves a movable optical element. For example, an actuator such as a piezo element is used as the drive unit 270E. The driving unit 270E is driven by an instruction from the control unit CONT.

  The drive unit 270E has one or more optical elements of the illumination optical system 213 as a first position (hereinafter referred to as a first position 217) and a second position (hereinafter referred to as a second position 218). Move between. Here, when light having a single wavelength is emitted from the light source 212E and the line light L is emitted from the light irradiation unit 210E, the beam waist BW of the line light L is a predetermined distance from the end surface of the probe 211 on the −Z side ( It is formed at a position separated by a mechanical working distance). In this configuration, when the drive unit 270E moves the optical element of the illumination optical system 213 between the first position 217 and the second position 218, the mechanical working distance changes, and the beam waist BW of the line light L changes. The position moves in the first direction D1.

  In this sensor unit 200E, the position of the illumination optical system 213 (optical element) at which the beam waist BW is formed at a position corresponding to the first measurement range L1 of the second embodiment described above is defined as the first position 217. 2 The position of the illumination optical system 213 (optical element) where the beam waist BW is formed at a position corresponding to the measurement range L2 is defined as a second position 218.

  Accordingly, when the driving unit 270E is driven and the illumination optical system 213 is positioned at the first position 217, the first measurement range L1 is set. Therefore, the image of the light section line PCL1 is projected onto the imaging unit 230 via the imaging optical system 20. Further, when the driving unit 270E is driven and the illumination optical system 213 is positioned at the second position 218, the second measurement range L2 is set. Therefore, the image of the light cutting line PCL2 is projected onto the imaging unit 230 via the optical system 20.

  Thus, according to this modification, the drive unit 270E can switch between the first measurement range L1 and the second measurement range L2 by moving the illumination optical system 213 (optical element) in the first direction D1. Therefore, even when the light source 212E that emits light of a single wavelength is used, the measurement range in the first direction D1 can be easily changed.

  In the sensor unit 200E described above, the single imaging unit 230 is used, but the present invention is not limited to this. For example, a plurality of imaging units may be arranged corresponding to the first and second measurement ranges L1 and L2. In this case, as shown in FIG. 2, each imaging unit is arranged along the plane S3, or as shown in FIG. 4, one of the imaging units is arranged on the plane S4 using a half mirror HM or the like (FIG. 4). Etc.).

  In the second embodiment and the third to seventh modifications described above, the measurement range in the first direction D1 is divided into the first measurement range L1 and the second measurement range L2. However, the present invention is not limited to this. . For example, the measurement range may be divided into three or more in the first direction D1, and set as the third measurement range, the fourth measurement range,. In this case, the light of a plurality of wavelengths is used so as to set the third measurement range or the like (second embodiment and third to fifth modifications), and the light irradiation unit 210D is moved (sixth modification). ) And moving the illumination optical system 213 (seventh modified example).

  In the second embodiment and the third to seventh modifications described above, the images of the light cutting lines PCL1 and PCL2 are captured via one imaging optical system 20. However, the present invention is not limited to this. An imaging optical system corresponding to each of the second imaging units 30 and 40 may be used.

<Shape measuring device>
FIG. 9 is a schematic diagram illustrating an example of an embodiment of a shape measuring apparatus 300 including the sensor unit 100 illustrated in FIG. As shown in FIG. 9, the shape measuring apparatus 300 includes a measuring machine main body 301 and a control unit 340. The measuring machine main body 301 includes a base 302, a moving unit (scanning system) 310, a measuring head 313, and a support device 330.

  The base 302 has a horizontal reference surface. An orthogonal coordinate system (machine coordinate system) is defined based on the reference plane of the base 302. The X axis and the Y axis that are orthogonal to each other are determined in parallel to the reference plane, and the Z axis is determined in a direction that is orthogonal to the reference plane. Further, the base 302 is provided with a guide rail (not shown) extending in the Y direction (the direction perpendicular to the paper surface is the front-rear direction).

  The moving unit 310 is provided so as to be movable in the Y direction on a guide rail formed on the base 302. The moving unit 310 includes a pair of support posts 310a and 310b and a frame 310c spanned between the support posts 310a and 310b, and is configured in a gate shape. The columns 310 a and 310 b are provided upright in the Z direction from the base 302. The frame 310c is bridged horizontally along the X direction between the column 310a and the column 310b. The movement of the moving unit 310 is controlled by a control unit 340 described later. The frame 310c is provided with a carriage (not shown) that can move in the X direction (left-right direction).

  The measurement head 313 is provided so as to be movable in the Z direction (vertical direction) with respect to the carriage of the frame 310c. The measuring head 313 can move the frame 310c in the X direction by moving the carriage. The movement of the measuring head 313 is controlled by a control unit 340 described later. The measurement head 313 includes a sensor unit 100 that detects the shape of the measurement target M. The sensor unit 100 is attached to the measurement head 313 via the head rotation mechanism 313a. The sensor unit 100 is rotated in the θZ direction by the head rotation mechanism 313a. The rotation of the sensor unit 100 is controlled by a control unit 340 described later.

  The frame 310c is provided with a frame rotation unit 310d. The frame rotation unit 310d rotates the frame 310c in the θX direction. As the frame 310c rotates in the θX direction, the line light L emitted from the sensor unit 100 can be scanned in the Y direction. The scanning of the line light L in the Y direction is not limited to being performed by rotating the frame 310c. For example, the line light L may be scanned in the Y direction by moving the moving unit 310 in the Y direction.

  Inside the moving unit 310, a head driving unit (not shown) and a head position detecting unit are provided. The head drive unit moves the measurement head 313 in the X direction, the Y direction, the Z direction, the θX direction, and the θZ direction, for example, electrically. The head position detection unit detects the coordinates of the measurement head 313 and outputs a signal indicating the coordinate values of the measurement head 313 to the control unit 340 described later.

  A support device 330 is provided on the base 302. The support device 330 includes a stage 331 and a support table 332. The stage 331 holds the measurement object M. The support table 332 rotates the stage 331 in the θX direction and the θZ direction. As a result, the stage 331 tilts or rotates horizontally with respect to the reference surface of the base 302.

  The control unit 340 includes a control unit 341, an input device 342, and a monitor 344. The control unit 341 controls the measuring machine main body 301. The control unit 341 calculates the shape of the measurement target M based on the image information from the sensor unit 100 and the scanning information of the sensor unit 100 by the moving unit 310. The input device 342 is a keyboard or a mouse for inputting various instruction information, and a joystick 343 may be added to the input device. The monitor 344 displays a measurement screen, an instruction screen, a measurement result, and the like.

  Next, the flow of the measurement process of the three-dimensional shape in the shape measuring apparatus 300 having the above configuration will be described below. The shape measuring apparatus 300 uses the sensor unit 100 to measure the three-dimensional shape of the measuring object M using the light cutting method. FIG. 10 is a flowchart for explaining the flow of the three-dimensional shape measurement process in the shape measuring apparatus 300.

  After the measurement object M is placed at a predetermined position on the stage 331 by the user, the measurement process is started. First, the control unit 341 irradiates the measurement target M with the line light L from the light irradiation unit 10 of the sensor unit 100 in the Z direction (first direction D1) (step S01). Thereby, the line light L in the X direction (second direction D2) is projected onto the surface of the measurement target M, and an optical cutting line corresponding to the shape of the measurement target M is formed.

  Then, the control unit 341 moves the sensor unit 100 by rotating the frame 310c in the θX direction or moving the moving unit 310 in the Y direction while irradiating the line light L, and moves the line light L in the Y direction ( The scanning is performed in the third direction D3) (step S02). Thereby, the light cutting line moves on the surface of the measuring object M in the Y direction. The method of scanning the line light L is not limited to moving the sensor unit 100. For example, the stage 331 on the base 302 is moved in the Y direction or rotated in the θX direction so that the measurement target M is moved. It may be moved.

  The control unit 341 causes the first imaging unit 30 and the second imaging unit 40 (imaging unit) of the sensor unit 100 to capture an image of a light section line that moves along the surface of the measurement target M (step S03). The control unit 341 determines which one of the first measurement range L1 and the second measurement range L2 the light cutting line is formed in, and based on the determination result, the first imaging unit 30 or the second imaging unit. The part 40 may be selected to capture an image of the light section line. By this step S03, image data of the surface of the measuring object M is acquired.

  The control unit 341 calculates the three-dimensional shape of the surface of the measurement target M based on the scanning information of the line light L (light cutting line) and the image data obtained by the imaging unit (step S04). The control unit 341 calculates, for example, point cloud data related to the XYZ coordinates of the surface of the measuring object M from the scanning information of the line light and the image data of the light cutting line based on the principle of triangulation. This point cloud data may be displayed on the monitor 344.

  In the present embodiment, since the sensor unit 100 is provided, for example, even when a large step in the Z direction exists in the measurement target M, the light cutting line can be easily and reliably imaged by switching the measurement range. can do. Therefore, the shape measuring apparatus 300 with excellent measurement accuracy can be obtained by making it possible to handle even the measurement object M having a large change.

  In the present embodiment, the configuration including the sensor unit 100 has been described as an example. However, the present invention is not limited thereto, and the above-described sensor units 100A, 100B, 200, 200A, 200B, 200C, 200D, and 200E are included. The structure provided may be sufficient. When the sensor units 200 to 200E are used, the control unit 341 selects the measurement range of the line light L to one of the first measurement range L1 and the second measurement range L2 when irradiating the line light L. Can do.

<Structure manufacturing system and structure manufacturing method>
FIG. 11 is a block diagram illustrating an example of an embodiment of a structure manufacturing system. A structure manufacturing system 400 shown in FIG. 11 includes the shape measuring device 300, the design device 410, the molding device 420, a control device (inspection device) 430, and a repair device 440.

  The design apparatus 410 creates design information related to the shape of the structure. Then, the design apparatus 410 transmits the produced design information to the molding apparatus 420 and the control apparatus 430. Here, the design information is information indicating the coordinates of each position of the structure.

  The molding apparatus 420 molds the structure based on the design information transmitted from the design apparatus 410. The molding process of the molding apparatus 420 includes casting, forging, cutting, or the like. The shape measuring apparatus 300 measures the three-dimensional shape of the structure (measurement target M) produced by the molding apparatus 420, that is, the coordinates of the structure. Then, the shape measuring device 300 transmits information indicating the measured coordinates (hereinafter referred to as shape information) to the control device 430.

  The control device 430 includes a coordinate storage unit 431 and an inspection unit 432. The coordinate storage unit 431 stores design information transmitted from the design device 410. The inspection unit 432 reads design information from the coordinate storage unit 431. Further, the inspection unit 432 compares the design information read from the coordinate storage unit 431 with the shape information transmitted from the shape measuring apparatus 300. Then, the inspection unit 432 inspects whether or not the structure is molded according to the design information based on the comparison result.

  In addition, the inspection unit 432 determines whether or not the structure molded by the molding apparatus 420 is a non-defective product. Whether or not the structure is a non-defective product is determined based on, for example, whether or not the error between the design information and the shape information is within a predetermined threshold range. If the structure is not molded according to the design information, the inspection unit 432 determines whether the structure can be repaired according to the design information. If it is determined that it can be repaired, the inspection unit 432 calculates a defective portion and a repair amount based on the comparison result. Then, the inspection unit 432 transmits information indicating a defective portion (hereinafter referred to as defective portion information) and information indicating a repair amount (hereinafter referred to as repair amount information) to the repair device 440.

  The repair device 440 processes the defective portion of the structure based on the defective portion information and the repair amount information transmitted from the control device 430.

  FIG. 12 is a flowchart showing processing by the structure manufacturing system 400, and shows an example of an embodiment of a structure manufacturing method. As shown in FIG. 12, the design device 410 creates design information related to the shape of the structure (step S11). The design device 410 transmits the produced design information to the molding device 420 and the control device 430. The control device 430 receives the design information transmitted from the design device 410. Then, the control device 430 stores the received design information in the coordinate storage unit 431.

  Next, the molding apparatus 420 molds the structure based on the design information created by the design apparatus 410 (step S12). And the shape measuring apparatus 300 measures the three-dimensional shape of the structure shape | molded by the shaping | molding apparatus 420 (step S13). Thereafter, the shape measuring apparatus 300 transmits shape information that is a measurement result of the structure to the control device 430. Next, the inspection unit 432 compares the shape information transmitted from the shape measuring apparatus 300 with the design information stored in the coordinate storage unit 431, and determines whether or not the structure is molded according to the design information. Inspect (step S14).

  Next, the inspection unit 432 determines whether or not the structure is a good product (step S15). If it is determined that the structure is a non-defective product (step S15: YES), the process by the structure manufacturing system 400 is terminated. On the other hand, when the inspection unit 432 determines that the structure is not a good product (step S15: NO), the inspection unit 432 determines whether the structure can be repaired (step S16).

  When the inspection unit 432 determines that the structure can be repaired (step S16: YES), the inspection unit 432 calculates the defective portion of the structure and the repair amount based on the comparison result of step S14. Then, the inspection unit 432 transmits the defective part information and the repair amount information to the repair device 440. The repair device 440 performs repair (rework) of the structure based on the defective part information and the repair amount information (step S17). Then, the process proceeds to step S13. That is, the process after step S13 is performed again with respect to the structure which the repair apparatus 440 performed repair. On the other hand, when the inspection unit 432 determines that the structure cannot be repaired (step S16: NO), the process by the structure manufacturing system 400 ends.

  As described above, in the structure manufacturing system 400 and the structure manufacturing method, based on the measurement result of the structure by the shape measuring apparatus 300, the inspection unit 432 determines whether the structure is manufactured according to the design information. . Accordingly, it can be accurately determined whether or not the structure manufactured by the molding apparatus 420 is a non-defective product, and the determination time can be shortened. Further, in the structure manufacturing system 400 described above, when the inspection unit 432 determines that the structure is not a non-defective product, it is possible to immediately repair the structure.

  In the structure manufacturing system 400 and the structure manufacturing method described above, instead of the repair device 440 executing processing, the molding device 420 may execute processing again.

  Although the embodiment and the modification have been described above, the technical scope of the present invention is not limited to the scope described in the above-described embodiment and modification. Various changes or improvements can be added to the above-described embodiments and modifications without departing from the spirit of the present invention. In addition, one or more of the requirements described in the above embodiments and modifications may be omitted. Such modifications, improvements, and omitted forms are also included in the technical scope of the present invention. In addition, the configurations of the above-described embodiments and modifications can be applied in appropriate combinations.

  In each of the above-described embodiments and modifications, the first direction D1 and the second direction D2 are orthogonal to each other, but are not orthogonal if the first direction D1 and the second direction D2 are different directions. Also good. For example, the second direction D2 may be set to an angle of 60 degrees or 80 degrees with respect to the first direction D1. The second direction D2 and the third direction D3 are not limited to being orthogonal to each other, and may not be orthogonal if the second direction D2 and the third direction D3 are different directions.

  Further, in the shape measuring apparatus 300 according to the above-described embodiment, the configuration in which the sensor unit 100 is attached to the gate-shaped moving unit 310 has been described as an example. However, the configuration is not limited thereto, and for example, published in the United States. As described in 2009/0299688, the sensor unit 100 may be attached to the tip of the robot hand.

  In each of the above-described embodiments and modifications, when the measurement target M does not fit in the imaging field of view of the first imaging unit 30 or the like in one scan, different positions of the measurement target M are measured, and each measurement is performed. The three-dimensional shape of the entire measurement object M may be measured by connecting the results. When the measurement results are connected, an overlapping process for overlapping a part of the measurement results may be used. This overlapping process is performed by the control unit CONT or the control unit 341.

  The overlapping process will be described. First, the first part of the measuring object M is scanned and imaged by the first imaging unit 30 or the like. Next, the second portion that partially overlaps the first portion of the measuring object M is scanned and imaged. The control unit CONT or the like calculates a three-dimensional shape for each of the first part and the second part. Further, the control unit CONT or the like searches for a portion where the first portion and the second portion overlap, and connects the three-dimensional shapes of the first portion and the second portion by overlapping the portions. Note that the control unit CONT or the like searches for a pixel in a predetermined area that is common coordinate data for the three-dimensional shape of the first part and the three-dimensional shape of the second part, and overlaps the first part and the second part. Judge the part. Note that the control unit CONT or the like attaches a mark to the measurement object M or the placement portion on which the measurement object M is placed in advance, instead of searching for a pixel in a predetermined area serving as common coordinate data. The three-dimensional shape of the first portion and the three-dimensional shape of the second portion may be connected based on the coordinate data.

  By repeatedly executing such processing until the entire measurement target M is imaged, the three-dimensional shape of the entire measurement target M is measured. According to this, even if the measurement target M is a large object, the three-dimensional shape of the entire measurement target M can be easily measured.

  Moreover, you may implement | achieve some structures, such as the shape measuring apparatus 300, with a computer. For example, the control unit 341 may be realized by a computer. In this case, the computer follows the shape measurement program stored in the storage unit, and the second direction D2 on the measurement target M intersecting the first direction D1 with respect to the measurement target M arranged away from the first direction D1. Irradiating the line light L onto the measuring object M, and the imaging optical system 20 having the optical axis direction AX different from the first direction D1 in the first direction D1. Processing for capturing at least one of an image of the line light L in the first measurement range L1 and an image of the line light L in the second measurement range L2 having a measurement range in the first direction D1 different from the first measurement range L1, and And a process of calculating the shape of the measuring object M based on the image information obtained by the above and the scanning information obtained by the scanning.

  The shape measurement program may be provided by being stored in a computer-readable storage medium such as an optical disc, a CD-ROM, a USB memory, or an SD card.

M, M0 ... measurement object (test object) CONT ... control unit D1 ... first direction D2 ... second direction L ... line light L1 ... first measurement range L2 ... second measurement range L3, L4, L5 ... mechanical operation Distance PCL ... Optical cutting line AX ... Optical axis HM ... Half mirror DP ... Dichroic prism Lr ... Red line light Lb ... Blue line light BW ... Beam waist PCL1, PCL2 ... Optical cutting line 10 ... Light irradiation unit 13 ... Illumination optical system 20 ... Imaging optical system 30 ... First imaging unit 40 ... Second imaging unit 100, 100A, 100B, 200, 200A, 200B, 200C, 200D, 200E ... Sensor unit 300 ... Shape measuring apparatus 341 ... Control unit 400 ... Structure manufacturing system

Claims (15)

A sensor unit for measuring the shape of the surface of a test object,
A projection optical system that projects line light onto the surface of the test object;
A first imaging unit that captures an image of the projected line light;
A second imaging unit that captures an image of the projected line light;
A dividing unit that divides the light reflected by the test object into a first imaging unit and a second imaging unit;
A sensor unit in which conjugate planes corresponding to the imaging planes of the first and second imaging units are different, and an image of line light is captured on each of the conjugate planes.   Line light is projected along the first direction onto the surface of the test object, and planes conjugate with the imaging surfaces of the first and second imaging units are set in different regions along the first direction. The sensor unit according to claim 1.   The sensor unit according to claim 1 or 2, wherein imaging surfaces of the first and second imaging units are arranged on the same plane.   3. The sensor unit according to claim 1, wherein the first imaging unit and the second imaging unit are respectively arranged on a plane in which imaging surfaces of the first and second imaging units intersect each other.   The sensor unit according to claim 4, wherein the first imaging unit and the second imaging unit are arranged so as to sandwich line light projected on the surface of the test object.   The sensor unit according to any one of claims 1 to 5, wherein the dividing unit divides the first and second imaging units according to the wavelength of the line light. A sensor unit for measuring the shape of the surface of a test object,
A projection optical system that projects line light onto the surface of the test object in a first direction;
An imaging unit that captures an image of the projected line light;
A sensor unit comprising: a changing unit that changes line light between the first measurement range and the second measurement range in the first direction.   The sensor unit according to claim 7, further comprising a moving device that moves the imaging unit to a position corresponding to the first measurement range and a position corresponding to the second measurement range.   The sensor unit according to claim 7 or 8, wherein the changing unit includes a wavelength setting unit capable of changing the wavelength of light irradiated from a light irradiation unit that irradiates the surface of the test object with line light. .   The sensor unit according to claim 9, wherein the wavelength setting unit includes a plurality of light sources having different wavelengths of emitted light.   The sensor unit according to claim 8, wherein the imaging unit includes a pixel selection unit that selects a pixel that receives light according to a wavelength.   9. The sensor unit according to claim 7, wherein the change unit includes a drive unit that moves all or part of the light irradiation unit that irradiates the surface of the test object with line light in the first direction. .   The sensor unit according to claim 12, wherein the driving unit moves at least one of a light source and an illumination optical system provided in the light irradiation unit. The sensor unit according to any one of claims 1 to 13,
A scanning system for relatively moving the sensor unit and the test object,
A shape measuring apparatus comprising: an arithmetic unit that calculates a shape of the test object based on image information from the sensor unit and scanning information of the scanning system. A design device for creating design information on the shape of the structure;
A molding apparatus for producing the structure based on the design information;
The shape measuring device according to claim 14, which measures the shape of the manufactured structure,
An inspection device for comparing shape information on the shape of the structure obtained by the shape measuring device with the design information;
Structure manufacturing system including.

Images