JP2015102374A - Circuit board inspection device, integrated circuit inspection device, integrated circuit, circuit board inspection method, and integrated circuit inspection method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To detect an incomplete connection state.SOLUTION: A circuit board inspection device comprises: a signal output unit for outputting a control signal to a connection circuit 63; a measurement unit for supplying a constant current for measurement use, for example, between lands 51a, 51b to which are connected connection terminal parts 62a, 62b among a plurality of connection terminal parts 62a-62j connected to a circuit main body, and capable of executing a "first measurement process" for measuring a voltage between lands 51b, 51c to which connection terminal parts 62b, 62c are connected; and a processing unit for outputting a control signal from the signal output unit and connecting the connection terminal parts 62a, 62c to the connection terminal part 62b, as well as controlling the measurement unit to have it execute the "first measurement process" and inspecting a conduction state between the land 51b and the connection circuit 63 by calculating, on the basis of the result of process execution, the resistance value of conduction resistance between the land 51b and the connection circuit 63 to which the connection terminal part 62b is connected and comparing it with an inspection reference value.

Description

  The present invention relates to a substrate inspection apparatus and a substrate inspection method for inspecting a mounting board on which an integrated circuit is mounted, an integrated circuit inspection apparatus and an integrated circuit inspection method for inspecting an integrated circuit, and an integrated circuit.

  For example, Patent Document 1 below discloses a circuit test apparatus configured to be able to inspect a substrate to be inspected on which an LSI capable of performing various inspections in accordance with the JTAG standard is mounted. The circuit test apparatus is configured to be connectable to a substrate to be inspected and a jig (a test substrate for testing the operation of the substrate to be inspected by transmitting and receiving various signals to and from the substrate to be inspected). A control CPU that executes a test program and generates a test signal for testing the operation of the substrate to be inspected, and a distribution circuit that distributes and inputs the test signal generated by the control CPU to the substrate to be inspected and the jig It has.

  When inspecting a substrate to be inspected by this circuit test apparatus, the control CPU generates a test signal according to the test program and inputs it to the substrate to be inspected via the distribution circuit. At this time, when the LSI mounted on the board to be inspected is defective or when the terminal of the LSI is floating, the LSI operates normally according to the test signal output from the control CPU. Therefore, a signal that should be output from the substrate to be inspected (LSI) during normal operation may not be output from the substrate to be inspected, or a signal that is different from the signal that should be output may be output. Therefore, after outputting the test signal, the control CPU determines that there is a defect for the test item corresponding to the test signal when the signal to be output is not output from the inspected substrate (LSI).

  On the other hand, when a normal LSI is mounted without causing terminal floating or the like, the LSI operates normally according to the test signal output from the control CPU, and therefore output from the substrate to be inspected (LSI) during normal operation. A signal to be processed is output from the substrate to be inspected. Therefore, after outputting the test signal, the control CPU determines that the test item corresponding to the test signal is normal when the signal to be output is output from the inspected substrate (LSI). Thereafter, the control CPU tests each test item defined in advance for the substrate to be inspected (LSI) by sequentially outputting other test signals in accordance with the test program.

JP 2008-89340 A (page 3-9, FIGS. 1 and 2)

  However, the conventional circuit test apparatus (inspection apparatus) and its test method (inspection method) have the following problems to be solved. That is, in the conventional inspection apparatus, a test signal defined in advance for each test item is input to the substrate to be inspected, and at that time, the substrate to be inspected (based on whether or not a signal to be output is output) A configuration / inspection method for inspecting (LSI) is employed. In this case, in the board to be inspected by this type of inspection apparatus, the connection terminals of the LSI and the connection conductors (lands) of the mounting board are connected to such an extent that the above test signals and the like can be input and output. In some cases, the connection may be incomplete, such as when the vibration is applied. In addition, even in the LSI, elements (bonding wires, bumps, through silicon vias, etc.) that connect the circuit body and connection terminals are incompletely connected to either or both of the circuit body and connection terminals. Sometimes.

  However, the conventional circuit test apparatus and its test method output test signals from the circuit test apparatus to the substrate to be inspected (LSI), even if there is an incompletely connected part. When a signal output from the board to be inspected (LSI) is normally input to the circuit test apparatus in accordance with the test signal, the board to be inspected (LSI) is inspected as a non-defective product. For this reason, after the inspection is completed, a connection failure may occur in the incompletely connected portion, and the device may not operate normally. As described above, the conventional circuit test apparatus and the test method have a problem that it is impossible to detect an incomplete connection state in which a connection failure may occur after the inspection is completed.

  In this case, the connection state between the connection terminal of the LSI and the connection conductor of the mounting board is determined by probing the probe to both the connection terminal and the connection conductor and measuring the resistance value as described above. There are inspection devices and inspection methods that detect a complete connection state. However, in today's substrates and integrated circuits where fine pitches are becoming increasingly difficult, it is difficult to probe probes independently at connection terminals and connection conductors. Further, for example, in the ball grid array type integrated circuit, the probe cannot be probed to the connection terminal and the connection conductor, and the above-described elements for connecting the circuit body and the connection terminal in the integrated circuit are also provided. The probe cannot be probed. For this reason, it is difficult to detect an incomplete connection state even in the configuration and method of an existing inspection apparatus that measures the resistance value.

  The present invention has been made in view of the problems to be solved, and is a substrate inspection apparatus, integrated circuit inspection apparatus, integrated circuit, and substrate inspection method capable of detecting an incomplete connection state that may cause a connection failure. It is a main object of the present invention to provide an integrated circuit inspection method.

  In order to achieve the above object, a substrate inspection apparatus according to claim 1, wherein a circuit body, a plurality of connection terminal portions connected to the circuit body, and each of the connection terminal portions according to a control signal output from an external device A mounting board on which an integrated circuit in which a connection circuit that executes connection processing for connecting two connection terminal parts different from the one connection terminal part is formed is mounted on one of A signal output unit as the external device configured to be able to inspect a conduction state between each connection conductor to which each connection terminal unit is connected on the mounting substrate and the connection circuit, and to output the control signal; Supplying a measurement current between the connection conductor to which the one connection terminal portion is connected and the connection conductor to which one of the two connection terminal portions is connected; Connections A first measurement process for measuring a voltage between the connection conductor to which a child part is connected and the connection conductor to which the other of the two connection terminal parts is connected, and the one connection A measurement voltage is applied between the connection conductor to which the terminal portion is connected and the connection conductor to which one of the two connection terminal portions is connected, and the one connection terminal portion is Measurement capable of executing at least one of the second measurement processes for measuring a current flowing between the connected conductor for connection and the connection conductor to which the other of the two connection terminal portions is connected. And the signal output unit to output the control signal, connect the two connection terminal units to the one connection terminal unit, and control the measurement unit to measure the at least one of As well as let the process run Obtaining a resistance value of a conduction resistance between the connection conductor to which the one connection terminal portion is connected based on the result of the at least one measurement process and the connection circuit, and comparing it with a reference value for inspection And a processing section for inspecting a conduction state between the connection conductor and the connection circuit.

  According to another aspect of the present invention, there is provided an integrated circuit inspection apparatus including: a circuit body; a plurality of connection terminal portions connected to the circuit body; and one of the connection terminal portions according to a control signal output from an external device. On the other hand, the continuity state of each connection terminal portion is determined by examining an integrated circuit in which a connection circuit for executing connection processing for connecting two connection terminal portions different from the one connection terminal portion is formed. A measurement current is supplied between the signal output unit as the external device configured to be inspectable and outputting the control signal, and one of the one connection terminal unit and the two connection terminal units. A first measurement process for measuring a voltage between the one connection terminal portion and the other of the two connection terminal portions, and one of the one connection terminal portion and the two connection terminal portions. Measuring voltage between And a measurement unit capable of executing at least one of a second measurement process for measuring a current flowing between the one connection terminal unit and the other of the two connection terminal units, and the signal output unit The control signal is output to connect the two connection terminal portions to the one connection terminal portion, and the measurement unit is controlled to execute the at least one measurement process, and A processing unit for inspecting a conduction state of the one connection terminal unit by obtaining a resistance value of the conduction resistance of the one connection terminal unit based on a result of at least one measurement process and comparing the resistance value with an inspection reference value; I have.

  According to a third aspect of the present invention, there is provided an integrated circuit according to claim 1, wherein a circuit body, a plurality of connection terminal portions connected to the circuit body, and one of the connection terminal portions according to a control signal output from an external device are provided. Thus, there is formed a connection circuit for executing a connection process for connecting two connection terminal portions different from the one connection terminal portion.

  According to a fourth aspect of the present invention, there is provided a circuit board inspection method comprising: a circuit body; a plurality of connection terminal portions connected to the circuit body; and one of the connection terminal portions according to a control signal output from an external device. On the other hand, a mounting board on which an integrated circuit on which a connection circuit for executing connection processing for connecting two connection terminal parts different from the one connection terminal part is formed is mounted on the mounting board. When inspecting a conduction state between each connection conductor to which each connection terminal portion is connected and the connection circuit, the control signal is output and the two connection terminals are connected to the one connection terminal portion. A current for measurement is connected between the connection conductor to which the terminal portion is connected and the one connection terminal portion is connected to the connection conductor to which one of the two connection terminal portions is connected. While supplying A first measurement process for measuring a voltage between the connection conductor to which one connection terminal portion is connected and the connection conductor to which the other of the two connection terminal portions is connected; and A voltage for measurement is applied between the connection conductor to which one connection terminal portion is connected and the connection conductor to which one of the two connection terminal portions is connected, and the one connection terminal At least one of the second measurement processes for measuring the current flowing between the connection conductor to which the connection portion is connected and the connection conductor to which the other of the two connection terminal portions is connected In addition, a resistance value of a conduction resistance between the connection conductor to which the one connection terminal portion is connected and the connection circuit is obtained based on the result of the at least one measurement process, and compared with a reference value for inspection. To Inspecting electrical continuity between the connection conductor and the connection circuit.

  The integrated circuit inspection method according to claim 5 is a circuit body, a plurality of connection terminal portions connected to the circuit body, and one of the connection terminal portions according to a control signal output from an external device. On the other hand, the continuity state of each connection terminal portion is determined by examining an integrated circuit in which a connection circuit for executing connection processing for connecting two connection terminal portions different from the one connection terminal portion is formed. When inspecting, the control signal is output to connect the two connection terminal portions to the one connection terminal portion, and one of the one connection terminal portion and the two connection terminal portions A first measurement process for supplying a measurement current between the one connection terminal portion and the other of the two connection terminal portions, and the one connection terminal portion, Of the two connection terminal portions And a measurement voltage is applied between the two connection terminals and at least one of the second measurement processes for measuring a current flowing between the one connection terminal and the other of the two connection terminals is executed. At the same time, the resistance value of the conduction resistance of the one connection terminal portion is obtained based on the result of the at least one measurement process and compared with the reference value for inspection, thereby inspecting the conduction state of the one connection terminal portion.

  In the substrate inspection apparatus according to claim 1 and the substrate inspection method according to claim 4, the control signal is output and two of the connection terminal portions different from the one connection terminal portion are output. While connecting the connection terminal portion and supplying a measurement current between the connection conductor to which one connection terminal portion is connected and the connection conductor to which one of the two connection terminal portions is connected A first measurement process for measuring a voltage between a connection conductor to which one connection terminal portion is connected and a connection conductor to which the other of the two connection terminal portions is connected, and one connection A measuring voltage is applied between the connecting conductor to which the terminal portion is connected and the connecting conductor to which one of the two connecting terminal portions is connected, and one connecting terminal portion is connected. The connection conductor and the other of the two connection terminals are connected For connection in which at least one of the second measurement processes for measuring the current flowing between the connection conductors that are connected is performed and one connection terminal portion is connected based on the result of at least one of the measurement processes The conduction state between the connection conductor and the connection circuit is inspected by obtaining the resistance value of the conduction resistance between the conductor and the connection circuit and comparing it with the reference value for inspection.

  Therefore, according to the substrate inspection apparatus according to claim 1 and the substrate inspection method according to claim 4, the contact of the probe or the like with the three connection conductors to which the three connection terminal portions connected by the connection circuit are connected. Since the resistance value between one of the three connection conductors and the connection circuit can be measured by bringing the child into contact with each other, the connection terminal portion of the integrated circuit and the connection terminal portion should be connected. Even a mounting board (integrated circuit) in which a contact such as a probe cannot be brought into contact with both of the connecting conductors may cause a connection failure between the connecting circuit of the integrated circuit and the connecting conductor. When there is a completely connected portion, this can be reliably detected. Further, it is possible to reliably detect the presence of an incompletely connected portion in the connection terminal portion of the integrated circuit in which a contact such as a probe cannot be brought into contact with the end of the connection terminal portion on the circuit body side.

  In the integrated circuit inspection apparatus according to claim 2 and the integrated circuit inspection method according to claim 5, a control signal is outputted and one of the connection terminal portions is different from the one connection terminal portion. Two connection terminal portions are connected, and a measurement current is supplied between one connection terminal portion and one of the two connection terminal portions, and one connection terminal portion and two connection terminal portions. A first measurement process for measuring a voltage between the other of the first and second connection terminals, and a measurement voltage is applied between one connection terminal portion and one of the two connection terminal portions. At least one of the second measurement processes for measuring the current flowing between the other of the two connection terminal portions is executed, and the conduction resistance of one connection terminal portion is determined based on the result of the at least one measurement process. Find the resistance value and compare it with the reference value for inspection Checking the conduction state of one connection terminal portion by.

  Therefore, according to the integrated circuit inspection apparatus according to claim 2 and the integrated circuit inspection method according to claim 5, the three connection terminals are brought into contact with the three connection terminal portions connected by the connection circuit. Since the resistance value of one of the parts can be measured, the contact terminal cannot be brought into contact with the end of the connection terminal part on the circuit body side. The presence of the site can be reliably detected.

  According to the integrated circuit of claim 3, the circuit body, the plurality of connection terminal portions connected to the circuit body, and one of the connection terminal portions according to the control signal output from the external device By forming a connection circuit that executes a connection process for connecting two connection terminal portions different from one connection terminal portion, the contact cannot be brought into contact with the end of the connection terminal portion on the circuit body side. For the integrated circuit, by arbitrarily switching each switch part of the connection circuit to the ON state on the circuit body side in the three connection terminal parts, the connection circuit can be connected. A contact is brought into contact with the three connection conductors to which the three connection terminal portions are connected, thereby measuring a resistance value between one of the three connection conductors and the connection circuit. It is possible to reliably detect the presence of a site of an incomplete connection state in portion.

1 is a configuration diagram showing a configuration of a substrate inspection apparatus 1. FIG. It is explanatory drawing for demonstrating the structure of the mounting substrate 50 and the integrated circuit 60 mounted in the mounting substrate 50. FIG. 2 is a cross-sectional view of a probe 11. FIG. It is explanatory drawing for demonstrating the inspection method of the mounting substrate 50 (integrated circuit 60) by the board | substrate inspection apparatus 1. FIG. It is another explanatory drawing for demonstrating the inspection method of the mounting board | substrate 50 (integrated circuit 60) by the board | substrate inspection apparatus. It is a block diagram which shows the structure of 1A of integrated circuit test | inspection apparatuses. FIG. 10 is still another explanatory diagram for explaining a method of inspecting the mounting substrate 50 (integrated circuit 60) by the substrate inspection apparatus 1.

  Embodiments of a substrate inspection apparatus, an integrated circuit inspection apparatus, an integrated circuit, a substrate inspection method, and an integrated circuit inspection method according to the present invention will be described below with reference to the accompanying drawings.

  First, embodiments of “substrate inspection apparatus”, “integrated circuit”, and “substrate inspection method” will be described.

  A board inspection apparatus 1 shown in FIG. 1 is an example of a “board inspection apparatus” and can electrically inspect the quality of various circuit boards such as a mounting board 50 (see FIG. 2) according to a “board inspection method” described later. It is configured. The mounting board 50 is an example of a “mounting board” as an inspection target, and is configured by mounting various electronic components such as an integrated circuit 60 as shown in FIG.

  In this case, the integrated circuit 60 is an example of an “integrated circuit” and includes a circuit body 61 formed according to a known semiconductor manufacturing process and a plurality of connection terminal portions 62a to 62j connected to the circuit pattern of the circuit body 61. (Hereinafter referred to as “connection terminal portion 62” when not distinguished from each other), each connection terminal portion 62 is connected in accordance with a control signal S which is formed according to a known semiconductor manufacturing process together with the circuit body 61 and output from the substrate inspection apparatus 1 or the like. Alternatively, it is configured to include a connection circuit 63 (switches 64a to 64j and the like which will be described later) for cutting. In this example, in order to facilitate understanding of the invention, an integrated circuit 60 having ten connection terminal portions 62 will be described as an example. However, an actual “integrated circuit” includes a circuit body 61. Many “connection terminal portions” are provided according to the circuit configuration.

  In this type of “integrated circuit”, as an example, a circuit pattern in the circuit body 61 formed on a silicon wafer and a connection terminal in the connection terminal portion 62 (when mounted on a circuit board such as the mounting board 50). The connection terminal portion 62 includes bonding wires, bumps, through silicon vias, and the like (not shown) for connecting the lands (connecting conductors) of the circuit board to the lands (connecting conductors). Further, in the integrated circuit 60 of this example having ten connection terminal portions 62, from the switch portion 64a for connecting or disconnecting the connection terminal portions 62a and 62b to the switch portion 64i for connecting or disconnecting the connection terminal portions 62i and 62j. 9 and a total of ten switch units 64, ie, a switch unit 64j for connecting or disconnecting the connection terminal units 62j and 62a, constitute a connection circuit 63. In this case, each switch part 64 is formed so that the end part on the circuit body 61 side in the pair of connection terminal parts 62 and 62 can be connected / disconnected.

  As an example, the connection circuit 63 includes, as will be described later, when a control signal S conforming to the JTAG standard output from the board inspection apparatus 1 is input, according to the content of the control signal S, A connection process for connecting at least two connection terminal portions 62 different from the one connection terminal portion 62 to at least one of the two is executed. Specifically, the connection circuit 63 connects any three connection terminal units 62 by switching the connection / disconnection state of each switch unit 64 in accordance with the control signal S (one of the connection terminal units 62). The other two connection terminals 62 are connected to each other), and the other seven connection terminal parts 62 are disconnected from (connected to) the three connection terminal parts 62 in a connected state. To do. The connection circuit 63 is configured so that the ten connection terminal portions 62 are not connected to each other except when the mounting substrate 50 (the integrated circuit 60) is inspected (when the mounting substrate 50 is used as a product). The switch unit 64 is switched to the off state.

  In addition, lands 51 a to 51 j (an example of “connection conductor”: hereinafter referred to as “land 51” when not distinguished) are formed on the mounting substrate 50, to which each connection terminal portion 62 of the integrated circuit 60 can be connected. Yes. In the actual integrated circuit 60, various conductor patterns other than the lands 51 are formed and various electronic components other than the integrated circuit 60 are mounted. However, in order to facilitate understanding of the invention. In addition, illustrations and explanations regarding conductor patterns other than the lands 51 and electronic components other than the integrated circuit 60 are omitted.

  On the other hand, as shown in FIG. 1, the substrate inspection apparatus 1 includes a moving mechanism 2, an operation unit 3, a display unit 4, a signal output unit 5, a measurement unit 6, a scanner 7, a processing unit 8, a storage unit 9, and an inspection treatment. The tool 10 is provided. In this case, the inspection jig 10 is a connection tool for connecting the signal output unit 5 or the measurement unit 6 to each land 51 of the mounting substrate 50 as described later. As shown, a plurality of probes 11a, 11b,... (Hereinafter also referred to as “probes 11” when not distinguished) are arranged according to the positions of the lands 51a, 51b,. . As shown in FIG. 3, as an example, the probe 11 includes a pair of probe main bodies 12 a and 12 b integrated with an insulator 12 c interposed therebetween, and causes each land 51 to probe both probe main bodies 12 a and 12 b. It is configured to be able to.

  Further, the moving mechanism 2 moves the inspection jig 10 toward the mounting substrate 50 held by a substrate holding unit (not shown) according to the control of the processing unit 8, thereby moving the inspection jig 10 to each land 51 of the mounting substrate 50. The probes 11 (probe bodies 12a and 12b) are respectively probed. Although an example in which each probe 11 is probed on each land 51 by moving the inspection jig 10 toward the mounting substrate 50 held by the substrate holder will be described. By moving the mounting substrate 50 (substrate holding part), the probes 11 are probed on the lands 51, or by moving both the inspection jig 10 and the mounting substrate 50 in the approaching direction, The land 51 can also be probed.

  The operation unit 3 includes various operation switches (not shown) for setting and operating inspection conditions for the mounting substrate 50 by the substrate inspection apparatus 1 and instructing start / stop of inspection, and operations corresponding to switch operations. The signal is output to the processing unit 8. The display unit 4 is a variety of display screens (not shown) such as a setting screen for setting operating conditions (inspection conditions) of the substrate inspection apparatus 1 and an inspection result screen for displaying inspection results in accordance with the control of the processing unit 8. Display).

  The signal output unit 5 is an example of a “signal output unit” as an “external device”, and is configured to output various control signals S conforming to the JTAG standard. In this case, in the board inspection apparatus 1 of this example, in addition to the control signal S for controlling each switch unit 64 of the integrated circuit 60, the signal output unit outputs a control signal S for performing various inspections according to the JTAG standard. 5, the mounting substrate 50 (integrated circuit 60) can be inspected for quality. However, since a normal inspection in accordance with the JTAG standard is known, the description thereof is omitted.

  The measuring unit 6 is an example of a “measuring unit”, and includes a constant current source 36a and a voltage measuring unit 36b as shown in FIGS. The measurement unit 6 includes a land 51 to which one of the three connection terminal units 62 in a state of being connected by the connection circuit 63 is connected as described later, and three connection terminal units according to the control of the processing unit 8. A constant current for measurement (an example of “measurement current”) is supplied from the constant current source 36a via the scanner 7 and the probe 11 to the land 51 to which the other one of 62 is connected, and connected. The voltage between the land 51 to which one of the three connection terminal portions 62 connected by the circuit 63 is connected and the land 51 to which another one of the three connection terminal portions 62 is connected. Is measured by the voltage measuring unit 36b via the scanner 7 and the probe 11, and a process of outputting measured value data D1 indicating the measurement result to the processing unit 8 (an example of “first measurement process”) is executed.

  The scanner 7 connects the signal output unit 5 and the measurement unit 6 (constant current source 36a and voltage measurement unit 36b) to an arbitrary probe 11 (probe bodies 12a and 12b) of the inspection jig 10 according to the control of the processing unit 8. In addition, the other probe 11 is disconnected from the signal output unit 5 and the measurement unit 6. The processing unit 8 corresponds to a “processing unit” and comprehensively controls the substrate inspection apparatus 1. Specifically, the processing unit 8 controls the moving mechanism 2 to cause the probes 11 (probe main bodies 12 a and 12 b) of the inspection jig 10 to be probed on the lands 51 of the mounting substrate 50.

  Further, the processing unit 8 controls the scanner 7 and is probed to the land 51 to which the connection terminal unit 62 to which the control signal S (JTAG signal) of the land 51 of the mounting substrate 50 is to be output is connected. A pair of probes 11 (one of the probe main body 12 a and the probe main body 12 b) is connected to the signal output unit 5. Further, the processing unit 8 controls the scanner 7 to connect to the connection terminal unit 62 to be inspected (an example of “one connection terminal unit”) among the connection terminal units 62 and the connection terminal unit 62. The pair of probes 11 probed by the other connecting terminal portion 62 (an example of “one of the two connecting terminal portions”) is connected to the constant current source 36a of the measuring unit 6 and Probing is performed on the connection terminal portion 62 (one connection terminal portion) and still another connection terminal portion 62 (an example of “the other of the two connection terminal portions”) connected to the connection terminal portion 62. The pair of probes 11 are connected to the voltage measurement unit 36 b of the measurement unit 6.

  The processing unit 8 is connected to the measuring unit 6 (the constant current source 36a and the voltage measuring unit 36b) by controlling the signal output unit 5 and outputting the control signal S to the connection circuit 63 of the integrated circuit 60. The three connection terminals 62 connected to the land 51 on which the three probes 11 (one of the probe bodies 12a and 12b) are probed are connected ("one of the connection terminals"). An example of a process of “connecting two connection terminal portions different from one connection terminal portion” to “)”. Further, the processing unit 8 controls the constant current source 36a to thereby implement the mounting substrate 50 (integrated circuit 60) via both probes 11 (one of the probe bodies 12a and 12b) connected to the constant current source 36a. Both lands in which both probes 11 (one of the probe main bodies 12a and 12b) connected to the voltage measuring unit 36b are probed by supplying a constant current for measurement to the power source and controlling the voltage measuring unit 36b. The voltage between 51 is measured.

  Further, the processing unit 8 uses the land 51 (“one connection”) connected to both the constant current source 36a and the voltage measurement unit 36b based on the measurement value data D1 output from the measurement unit 6 (voltage measurement unit 36b). An example of the “connecting conductor to which the terminal portion is connected”) and the resistance value of the conduction resistance between the connection circuit 63 (switch portion 64) connected to the connection terminal portion 62 connected to the land 51 The conduction state between the land 51 and the connection circuit 63 is inspected by calculating and comparing the calculated resistance value with the value of the reference data for inspection D0.

  Note that in the substrate inspection apparatus 1 of this example, from the process of controlling the scanner 7 to connect any three probes 11 to the constant current source 36a and the voltage measuring unit 36b, the constant current source 36a is controlled to perform measurement. A series of processes up to the process of outputting a constant current and controlling the voltage measuring unit 36b to measure the voltage corresponds to the “first measurement process”. The “first measurement process” and the inspection process of the conduction state based on the measurement value data D1 and the inspection reference data D0 will be described in detail later with a specific example. On the other hand, the storage unit 9 stores an operation program of the processing unit 8, reference data for inspection D0, and the like.

  When the mounting substrate 50 is inspected by the substrate inspection apparatus 1, first, the mounting substrate 50 is set on the substrate holding portion with the mounting surface (formation surface of the land 51) of the integrated circuit 60 or the like facing upward. Next, when the inspection start switch of the operation unit 3 is operated, the processing unit 8 starts the inspection process according to the operation program stored in the storage unit 9. Specifically, the processing unit 8 first controls the moving mechanism 2 to lower the inspection jig 10 toward the signal output unit 5. At this time, the probes 11 (probe main bodies 12 a and 12 b) of the inspection jig 10 are respectively probed on the lands 51 of the mounting substrate 50.

  Next, for example, the processing unit 8 starts an inspection of a conduction state between the land 51a to which the connection terminal unit 62a of the integrated circuit 60 is connected and the connection circuit 63 connected to the connection terminal unit 62a. . Specifically, the processing unit 8 controls the signal output unit 5 to output a control signal S to the mounting substrate 50 (the connection circuit 63 of the integrated circuit 60), so that each switch unit as shown in FIG. The switch units 64a and 64j of 64 are switched to the on state, and the switch units 64b to 64i are switched to the off state. Thereby, two of the connection terminal portions 62b and 62j are connected to the connection terminal portion 62a of the connection terminal portions 62, and the connection terminal portions 62c to 62i are connected to the connection terminal portions 62a, 62b and 62j. Seven are disconnected.

  Subsequently, the processing unit 8 controls the scanner 7 to probe the probe main body 12a (or the probe main body 12b) of the probe 11j probed to the land 51j to which the connection terminal portion 62j is connected, and the connection terminal. The probe main body 12a (or probe main body 12b) of the probe 11a probed by the land 51a to which the section 62a is connected is connected to the constant current source 36a, and the probe main body 12b (or probe main body) of the probe 11a is connected. 12a) and the probe main body 12a (or the probe main body 12b) of the probe 11b probed by the land 51b to which the connection terminal portion 62b is connected are connected to the voltage measuring unit 36b. Next, the processing unit 8 controls the constant current source 36a to supply a constant current for measurement between the lands 51j and 51a via the probes 11j and 11a, and also controls the voltage measuring unit 36b to control the probes 11a and 11a. The voltage between the lands 51a and 51b is measured via 11b.

  At this time, when the terminal floating occurs in the connection terminal portion 62j and the land 51j and the connection terminal portion 62j are not normally connected, the terminal floating occurs in the connection terminal portion 62a, and the land 51a and the connection terminal portion 62a When the connection terminal portion 62j or the connection terminal portion 62a is disconnected when the connection is not normally made, the current from the constant current source 36a does not flow from the probe 11j to the probe 11a. The voltage measured by the measurement unit 36b is substantially “0V”. Further, when the terminal floating occurs in the connection terminal portion 62b and the land 51b and the connection terminal portion 62b are not normally connected, and when any one of the disconnections of the connection terminal portion 62b occurs, the probe 11j to the probe 11a Even if the current from the constant current source 36a flows, the voltage measured by the voltage measuring unit 36b is substantially “0V”. Therefore, when the value of the measurement value data D1 from the voltage measurement unit 36b is “0 V” (when no voltage is measured), the processing unit 8 is connected between the land 51j and the connection circuit 63, and between the land 51a and the connection circuit 63. It is determined that a connection failure has occurred between the connection circuit 63 and between the land 51 b and the connection circuit 63.

  In addition, when the connection state between the land 51a and the connection terminal portion 62a is incomplete (for example, the reflow process at the time of manufacturing the mounting substrate 50 causes incomplete melting of the solder and the land 51a and the connection terminal). When the portion 62a is merely in contact with the portion 62a) or when there is an incompletely connected portion in the connection terminal portion 62a, the contact resistance at these portions increases, so the voltage The voltage measured by the measurement unit 36b is larger than the voltage measured in the normal state. Specifically, for example, when the connection state between the land 51a and the connection terminal portion 62a is incomplete, the constant current for measurement supplied from the constant current source 36a is converted into the land 51j, the connection terminal portion 62j, Although it flows from the probe 11j to the probe 11a via the connection circuit 63 (switch part 64j), the connection terminal part 62a, and the land 51a, the gap between the land 51a and the connection terminal part 62a is caused by the incomplete connection state. The resistance value of is large. For this reason, the voltage between the lands 51a, the connection terminals 62b, the connection circuit 63 (switch part 64a), the connection terminals 62a, and the probes 11a and 11b connected via the lands 51a is changed between the lands 51a and the connection terminals 62a. It becomes larger than when the resistance value between is small (when the connection state is normal).

  Therefore, the processing unit 8 calculates a resistance value (this example) based on the current value of the constant current supplied from the constant current source 36a and the value (voltage value) of the measured value data D1 from the voltage measuring unit 36b. Then, the resistance value of the part P1 between the connection circuit 63 and the land 51a of the integrated circuit 60 is compared with the reference value (resistance value) recorded in the inspection reference data D0, and the calculated resistance value is When it is higher than the reference value, it is determined that the connection state of the portion P1 between the connection circuit 63 of the integrated circuit 60 and the land 51a is incomplete.

  Further, when the connection state between the land 51j and the connection circuit 63, between the land 51a and the connection circuit 63, and between the land 51b and the connection circuit 63 is good, the voltage measured by the voltage measurement unit 36b is in a normal state. It becomes the same level as the voltage measured in. Therefore, the processing unit 8 calculates the resistance value (part P1) based on the current value of the constant current supplied from the constant current source 36a and the value (voltage value) of the measured value data D1 from the voltage measuring unit 36b. And the reference value (resistance value) recorded in the inspection reference data D0. When the calculated resistance value is within the allowable range with respect to the reference value, the connection circuit 63 of the integrated circuit 60 is connected. It is determined that the connection state of the part P1 between the land 51a and the land 51a is good.

  In this case, in the board inspection apparatus 1 of this example, when inspecting the conduction state between the land 51a and the connection circuit 63, a constant current is supplied between the land 51j and the land 51a, and the land 51a and the land 51a are connected. The resistance value of said part P1 is calculated by measuring the voltage between 51b. Therefore, for example, while a constant current is supplied between the land 51j and the land 51a, a voltage between the land 51j and the land 51a is measured, or a constant current is supplied between the land 51a and the land 51b. Unlike the configuration / method of measuring the voltage between the land 51a and the land 51b, the resistance component of the switch unit 64a has a very large resistance value and the resistance component of the switch unit 64a. Since the resistance value between the land 51a and the connection circuit 63 can be obtained except for the extremely large resistance value of the contact resistance and the resistance value of the contact resistance between the land 51a and the probe 11a, the connection with the land 51a is possible. It is possible to accurately inspect the conduction state with the circuit 63.

  When the connection state of the part P1 between the connection circuit 63 and the land 51a is inspected, the connection portions 62j and 62b are connected to the connection terminal portion 62a by switching the switch portions 64j and 64a of the connection circuit 63 to the ON state. Are connected, and the measurement process is executed using three probes 11j, 11a, and 11b probed on the lands 51j, 51a, and 51b to which the connection terminal portions 62j, 62a, and 62b are connected. Although the example has been described, “the other two connection terminal portions connected to one of the connection terminal portions” means “two connection terminals adjacent to one of the connection terminal portions” It is not limited to “part”. Specifically, when inspecting the connection state of the part P1 between the connection circuit 63 and the land 51a, the connection terminal portion is switched by switching the four switch portions 64i, 64j, 64a, and 64b of the connection circuit 63 to the on state. Two connection terminal portions 62i and 62c ("other two connection terminal portions") are connected to 62a ("one connection terminal portion"), and each connection terminal portion 62i, 62a and 62c is connected. It is also possible to execute the measurement process using three probes 11i, 11a, 11c probed on the lands 51i, 51a, 51c.

  Next, as an example, the processing unit 8 starts an inspection of a conduction state between the land 51b to which the connection terminal unit 62b of the integrated circuit 60 is connected and the connection circuit 63 connected to the connection terminal unit 62b. . Specifically, the processing unit 8 controls the signal output unit 5 to output a control signal S to the mounting substrate 50 (the connection circuit 63 of the integrated circuit 60), so that each switch unit as shown in FIG. The switch units 64a and 64b of 64 are switched to the on state, and the switch units 64c to 64j are switched to the off state. Accordingly, two of the connection terminal portions 62a and 62c are connected to the connection terminal portion 62b of each connection terminal portion 62, and seven of the connection terminal portions 62d to 62j are connected to the connection terminal portions 62a to 62c. Disconnected state.

  Subsequently, the processing unit 8 controls the scanner 7 to connect the probe main body 12a (or probe main body 12b) of the probe 11a and the probe main body 12a (or probe main body 12b) of the probe 11b to the constant current source 36a. The probe main body 12b (or probe main body 12a) of the probe 11b and the probe main body 12a (or probe main body 12b) of the probe 11c probed by the land 51c to which the connection terminal portion 62c is connected are connected. Are connected to the voltage measuring unit 36b. Next, the processing unit 8 controls the constant current source 36a to supply a constant current for measurement between the lands 51a and 51b via the probes 11a and 11b, and also controls the voltage measuring unit 36b to control the probes 11b, The voltage between the lands 51b and 51c is measured via 11c.

  At this time, when the terminal floating occurs in the connection terminal portion 62a and the land 51a and the connection terminal portion 62a are not normally connected, the terminal floating occurs in the connection terminal portion 62b, and the land 51b and the connection terminal portion 62b When the connection terminal 62a is disconnected or the connection terminal 62b is disconnected when the connection is not normally made, the current from the constant current source 36a does not flow from the probe 11a to the probe 11b. The voltage measured by the measurement unit 36b is substantially “0V”. Further, when the terminal floating occurs in the connection terminal portion 62c and the land 51c and the connection terminal portion 62c are not normally connected, and when any one of the disconnections of the connection terminal portion 62c occurs, the probe 11a to the probe 11b Even if the current from the constant current source 36a flows, the voltage measured by the voltage measuring unit 36b is substantially “0V”. Therefore, when the value of the measured value data D1 from the voltage measuring unit 36b is “0V” (when no voltage is measured), the processing unit 8 is connected between the land 51a and the connection circuit 63, and between the land 51b and It is determined that a connection failure has occurred between the connection circuit 63 and between the land 51 c and the connection circuit 63.

  In addition, when the connection state between the land 51b and the connection terminal portion 62b is in an incomplete state, or when there is an incomplete connection state in the connection terminal portion 62b, Since the contact resistance is increased, the voltage measured by the voltage measuring unit 36b is larger than the voltage measured in the normal state. Therefore, the processing unit 8 calculates a resistance value (this example) based on the current value of the constant current supplied from the constant current source 36a and the value (voltage value) of the measured value data D1 from the voltage measuring unit 36b. Then, the resistance value of the part P2 between the connection circuit 63 and the land 51b of the integrated circuit 60 is compared with the reference value (resistance value) recorded in the inspection reference data D0, and the calculated resistance value is When it is higher than the reference value, it is determined that the connection state of the part P2 between the connection circuit 63 of the integrated circuit 60 and the land 51b is incomplete.

  Further, when the connection state between the land 51a and the connection circuit 63, between the land 51b and the connection circuit 63, and between the land 51c and the connection circuit 63 is good, the voltage measured by the voltage measurement unit 36b is in a normal state. It becomes the same level as the voltage measured in. Therefore, the processing unit 8 calculates the resistance value (part P2) based on the current value of the constant current supplied from the constant current source 36a and the value (voltage value) of the measured value data D1 from the voltage measuring unit 36b. And the reference value (resistance value) recorded in the inspection reference data D0. When the calculated resistance value is within the allowable range with respect to the reference value, the connection circuit 63 of the integrated circuit 60 is connected. It is determined that the connection state of the portion P2 between the land 51b and the land 51b is good.

  Thereafter, the processing unit 8 sequentially changes the combination of one connection terminal unit connected by the connection circuit 63 and the other two connection terminal units 62 in accordance with the operation program, while the land 51a and the connection circuit 63 are connected. The connection state between the land 51 c and the connection circuit 63, the connection state between the land 51 c and the connection circuit 63, and the connection between the land 51 d and the connection circuit 63 are the same as the inspection of the connection state between the land 51 b and the connection circuit 63. State, connection state between the land 51e and the connection circuit 63, connection state between the land 51f and the connection circuit 63, connection state between the land 51g and the connection circuit 63, and between the land 51h and the connection circuit 63 The connection state between the land 51i and the connection circuit 63 and the connection state between the land 51j and the connection circuit 63 are sequentially checked. Further, the processing unit 8 inspects the connection state of “integrated circuits” other than the integrated circuit 60 in the same manner as in the inspection relating to the integrated circuit 60 described above. Further, the processing unit 8 performs various inspections such as various inspections according to the known JTAG standard, and continuity inspection and insulation inspection of the conductor pattern formed on the mounting substrate 50. Thereby, a series of inspections on the mounting substrate 50 is completed.

  As described above, in this board inspection apparatus 1 and the board inspection method by the board inspection apparatus 1, the control signal S is output and one of the connection terminal sections 62 is defined as one connection terminal section 62. Two different connection terminal portions 62 are connected, and between the land 51 to which one connection terminal portion 62 is connected and the land 51 to which one of the two connection terminal portions 62 is connected. The first current is measured and the voltage between the land 51 to which one connection terminal portion 62 is connected and the land 51 to which the other of the two connection terminal portions 62 is connected is measured as “first”. And a constant voltage for measurement is applied between the land 51 to which one connection terminal portion 62 is connected and the land 51 to which one of the two connection terminal portions 62 is connected. One connection terminal And at least one of the “second measurement process” for measuring the current flowing between the land 51 to which 2 is connected and the land 51 to which the other of the two connection terminal portions 62 is connected, Based on the result of at least one measurement process (value of measurement value data D1), the resistance value of the conduction resistance between the land 51 to which one connection terminal portion 62 is connected and the connection circuit 63 is obtained, and the inspection reference The process of inspecting the conduction state between the land 51 and the connection circuit 63 by comparing with the value is sequentially executed by changing at least one of the connection terminal portions 62.

  Therefore, according to this board inspection apparatus 1 and the board inspection method by the board inspection apparatus 1, the probe 11 (probe body 12a) is connected to the three lands 51 to which the three connection terminal portions 62 connected by the connection circuit 63 are connected. 12b), the resistance value between one of the three lands 51 and the connection circuit 63 can be measured. Therefore, the connection terminal portion 62 of the integrated circuit 60 and the connection terminal portion 62 are Even if the mounting substrate 50 (integrated circuit 60) cannot probe the probe 11 (probe bodies 12a, 12b) to both the lands 51 to be connected, the connection circuit 63 of the integrated circuit 60 and the lands 51 are not connected. If there is an incompletely connected part that may cause a connection failure between them, this can be detected reliably. That. Further, it is possible to reliably detect the presence of an incompletely connected portion in the connection terminal portion 62 of the integrated circuit 60 where the probe 11 cannot be probed at the end of the connection terminal portion 62 on the circuit body 61 side. .

  Further, according to the integrated circuit 60, the connection terminals 62 a to 62 j connected to the circuit body 61 and the connection terminals 62 of the connection terminals 62 according to the control signal S output from the “external device” such as the substrate inspection apparatus 1. The probe 11 is probed at the end of the connection terminal portion 62 on the circuit body 61 side by forming the connection circuit 63 for executing connection processing for connecting the other two to one of them together with the circuit body 61. For the integrated circuit 60 that cannot be connected, the end portions on the circuit body 61 side of the three connection terminal portions 62 can be arbitrarily connected by arbitrarily switching each switch portion 64 of the connection circuit 63 to the ON state. Therefore, the probe 11 (probe main bodies 12a, 1) is connected to the three lands 51 to which the three connection terminal portions 62 connected by the connection circuit 63 are connected. The resistance value between one of the three lands 51 and the connection circuit 63 is measured by probing b), and thereby the substrate inspection is performed for the presence of an incompletely connected portion in the connection terminal portion 62. It can be reliably detected by the device 1.

  Next, embodiments of the “integrated circuit inspection apparatus” and the “integrated circuit inspection method” will be described. The “integrated circuit” is the same as the integrated circuit 60 mounted on the mounting substrate 50, and thus detailed description thereof is omitted. In addition, the same reference numerals are given to the same matters as those of the substrate inspection apparatus 1 and the substrate inspection method by the substrate inspection apparatus 1, and the duplicate description is omitted.

  An integrated circuit inspection apparatus 1A shown in FIG. 6 is an example of an “integrated circuit inspection apparatus”, and includes a socket 20 instead of the moving mechanism 2 and the inspection jig 10 in the substrate inspection apparatus 1 described above. The integrated circuit 60 before being mounted on 50 or the like can be inspected alone. In this case, instead of the probe 11 in the inspection jig 10, the socket 20 is connected to a connection terminal of each connection terminal portion 62 in the integrated circuit 60 (a circuit board land (connection) when mounted on a circuit board such as the mounting board 50. And a connector (not shown) connectable to a metal component soldered to the conductor).

  When the integrated circuit 60 is inspected by the integrated circuit inspection apparatus 1A, the integrated circuit 60 to be inspected is set in the socket 20. Next, when the inspection start switch of the operation unit 3 is operated, the processing unit 8 starts the inspection process according to the operation program stored in the storage unit 9. At this time, in the integrated circuit inspection apparatus 1A, the mounting substrate 50 is inspected by the substrate inspection apparatus 1, that is, a constant current is supplied from the constant current source 36a via the pair of probes 11 (probe bodies 12a and 12b). The voltage between the lands 51 and 51 is measured via the pair of probes 11 (probe main bodies 12a and 12b) and the voltage between the lands 51 and 51 is measured. Instead of the inspection processing of the mounting substrate 50 by the substrate inspection apparatus 1 that compares the value of D0, a constant current is supplied from the constant current source 36a via the pair of connectors in the socket 20 to the connection terminal portions 62 and 62 (a pair of Between the connection terminal portions 62 and 62 (a pair of connection terminals) via a pair of connectors, and a resistance calculated based on the measurement results. It performs a process of comparing the value of the inspection reference data D0 value. Thereby, the conduction | electrical_connection state of each connection terminal part 62 of the integrated circuit 60 is test | inspected sequentially.

  As described above, in the integrated circuit inspection apparatus 1A and the integrated circuit inspection method by the integrated circuit inspection apparatus 1A, the control signal S is output and one of the connection terminal sections 62 is connected to the one connection terminal section. Two connection terminal portions 62 different from 62 are connected, a constant current for measurement is supplied between one connection terminal portion 62 and one of the two connection terminal portions 62, and one connection The “first measurement process” for measuring the voltage between the terminal portion 62 and the other of the two connection terminal portions 62, and the connection between the one connection terminal portion 62 and one of the two connection terminal portions 62 A constant voltage for measurement is applied between them, and at least one of the “second measurement process” for measuring a current flowing between one connection terminal portion 62 and the other of the two connection terminal portions 62 is executed. And at least one measurement process The process of inspecting the conduction state of one connection terminal part 62 by obtaining the resistance value of the conduction resistance of one connection terminal part 62 based on the result of this and comparing it with the reference value for inspection is performed at least for the one connection described above. The terminal unit 62 is changed and executed sequentially.

  Therefore, according to the integrated circuit inspection apparatus 1A and the integrated circuit inspection method by the integrated circuit inspection apparatus 1A, by connecting the connector of the socket 20 to the three connection terminal portions 62 connected by the connection circuit 63, 3 Since the resistance value of one of the two connection terminal portions 62 can be measured, the connection terminal portion of the integrated circuit 60 in which the probe 11 cannot be probed at the end of the connection terminal portion 62 on the circuit body 61 side. The presence of an incompletely connected portion in 62 can be reliably detected.

  In addition, about the structure of "substrate inspection apparatus", "integrated circuit inspection apparatus", and "integrated circuit", and the specific procedure of "substrate inspection method" and "integrated circuit inspection method", said board | substrate inspection apparatus 1, The configuration of the integrated circuit inspection apparatus 1A and the integrated circuit 60, and the procedure of the inspection method using them are not limited. For example, the configuration in which the “connection process” is executed by inputting the control signal S conforming to the JTAG standard has been described as an example. However, in place of such a configuration, various configurations such as the SPI standard and the I2C standard are described. A configuration in which “connection processing” is executed by inputting a control signal in accordance with the serial communication standard can be employed.

  Further, the substrate inspection apparatus 1 configured to inspect the mounting substrate 50 (integrated circuit 60) using the inspection jig 10 in which the probe 11 having the pair of probe bodies 12a and 12b is implanted, and the inspection method thereof are taken as an example. As described above, the configuration and method using an inspection jig (not shown) in which a single probe main body (probe) is implanted in accordance with the position of each land 51, or the same configuration as the probe 11 described above. It is also possible to employ a probe (a flying probe type inspection apparatus) and method in which a probe or a single probe is moved by a separate moving mechanism and probed.

  Further, the board inspection apparatus 1 and the integrated circuit inspection apparatus configured to inspect the mounting board 50 (integrated circuit 60) by executing the “first measurement process” by the measurement section 6 having the constant current source 36a and the voltage measurement section 36b. 1A has been described as an example, but the “measuring unit” is replaced with (or in addition to) the configuration of the measuring unit 6 described above, as an example, the substrate inspection apparatus 1 shown in FIG. A configuration in which the constant voltage source 46a and the current measurement unit 46b are included and the “second measurement process” is performed can be employed as in the measurement unit 6a in FIG. In this case, in the measurement unit 6a shown in the figure, in the state where the switch units 64a and 64b of the connection circuit 63 are switched on and the connection terminal units 62a and 62c are connected to the connection terminal unit 62b, respectively. A constant voltage for measurement (an example of “measurement voltage”) is applied between the land 51a to which the terminal portion 62a is connected and the land 51b to which the connection terminal portion 62b is connected. By measuring the current value of the current flowing through the land 51c to which the part 62c is connected, the resistance value between the end on the circuit body 61 side of the connection terminal part 62b and the land 51b can be obtained. It is configured.

  Although not shown, in the integrated circuit inspection apparatus 1A for inspecting the integrated circuit 60, instead of (or in addition to) the configuration of the measurement unit 6 described above, the measurement unit 6a shown in FIG. It is also possible to adopt the configuration. Also in the board inspection apparatus 1 and the integrated circuit inspection apparatus 1A adopting such a configuration, the same effects as those of the board inspection apparatus 1 and the integrated circuit inspection apparatus 1A (configuration including the measurement unit 6) described above can be obtained. .

  Furthermore, although the integrated circuit inspection apparatus 1A configured to inspect the integrated circuit 60 using the socket 20 having a plurality of connectors and the inspection method thereof have been described as examples, the connection terminal portions 62 (connections) of the integrated circuit 60 are described. A configuration and method for connecting the signal output unit 5, the constant current source 36a, the voltage measuring unit 36b, and the like to the integrated circuit 60 (connection terminal unit 62) by probing the probe to the terminal can also be adopted.

  Also, instead of a configuration for supplying a constant current to measure a voltage value or a configuration for supplying a constant voltage to measure a current value, a configuration or voltage value for supplying a current with a known current value to measure the voltage value However, it is also possible to employ a configuration in which a known voltage is supplied to measure a current value.

DESCRIPTION OF SYMBOLS 1 Board | substrate inspection apparatus 1A Integrated circuit inspection apparatus 2 Moving mechanism 5 Signal output part 6, 6a Measuring part 7 Scanner 8 Processing part 9 Memory | storage part 10 Inspection jig | tool 11a, 11b ... Probe 12a, 12b Probe main body 20 Socket 36a Constant current Source 36b Voltage measurement unit 46a Constant voltage source 46b Current measurement unit 50 Mounting board 51a to 51j Land 60 Integrated circuit 61 Circuit body 62a to 62j Connection terminal unit 63 Connection circuit 64a to 64j Switch unit D0 Test reference data D1 Measurement value data P1 , P2 ·· Site S Control signal

Claims (5)

A circuit body, a plurality of connection terminal portions connected to the circuit body, and the one connection terminal portion differ from one of the connection terminal portions according to a control signal output from an external device. Each connection in which each connection terminal portion is connected to the mounting substrate, with a mounting substrate on which an integrated circuit on which a connection circuit for executing connection processing for connecting the two connection terminal portions is formed is mounted, as an inspection target It is configured to be able to inspect the conduction state between the conductor for use and the connection circuit,
A signal output unit as the external device that outputs the control signal;
A current for measurement is supplied between the connection conductor to which the one connection terminal portion is connected and the connection conductor to which one of the two connection terminal portions is connected; A first measurement process for measuring a voltage between the connection conductor to which a connection terminal portion is connected and the connection conductor to which the other of the two connection terminal portions is connected; and the one A voltage for measurement is applied between the connection conductor to which the connection terminal portion is connected and the connection conductor to which one of the two connection terminal portions is connected, and the one connection terminal portion Can perform at least one of the second measurement processing for measuring the current flowing between the connection conductor to which the other is connected and the connection conductor to which the other of the two connection terminal portions is connected A measuring section;
Control the signal output unit to output the control signal to connect the two connection terminal units to the one connection terminal unit, and control the measurement unit to execute the at least one measurement process And determining a resistance value of a conduction resistance between the connection conductor to which the one connection terminal portion is connected and the connection circuit based on the result of the at least one measurement process, and a reference value for inspection A substrate inspection apparatus including a processing unit that inspects a conduction state between the connection conductor and the connection circuit by comparing. A circuit body, a plurality of connection terminal portions connected to the circuit body, and the one connection terminal portion differ from one of the connection terminal portions according to a control signal output from an external device. An integrated circuit in which a connection circuit that executes connection processing for connecting two connection terminal portions is formed is configured to be inspected, and the conduction state of each connection terminal portion can be inspected.
A signal output unit as the external device that outputs the control signal;
A current for measurement is supplied between the one connection terminal portion and one of the two connection terminal portions, and between the one connection terminal portion and the other of the two connection terminal portions. A first measurement process for measuring a voltage, and applying a measurement voltage between the one connection terminal portion and one of the two connection terminal portions; and the one connection terminal portion and the two connection terminals A measurement unit capable of executing at least one of the second measurement processes for measuring a current flowing between the other of the connection terminal units;
Control the signal output unit to output the control signal to connect the two connection terminal units to the one connection terminal unit, and control the measurement unit to execute the at least one measurement process In addition, the resistance value of the conduction resistance of the one connection terminal portion is obtained based on the result of the at least one measurement process and compared with the reference value for inspection, thereby inspecting the conduction state of the one connection terminal portion. An integrated circuit inspection apparatus comprising a processing unit.   A circuit body, a plurality of connection terminal portions connected to the circuit body, and the one connection terminal portion differ from one of the connection terminal portions according to a control signal output from an external device. An integrated circuit formed with a connection circuit for executing a connection process for connecting two connection terminal portions.   A circuit body, a plurality of connection terminal portions connected to the circuit body, and the one connection terminal portion differ from one of the connection terminal portions according to a control signal output from an external device. Each connection in which each connection terminal portion is connected to the mounting substrate, with a mounting substrate on which an integrated circuit on which a connection circuit for executing connection processing for connecting the two connection terminal portions is formed is mounted, as an inspection target When inspecting the conduction state between the conductor for connection and the connection circuit, the control signal is output to connect the two connection terminal portions to the one connection terminal portion, and the one connection terminal A measurement current is supplied between the connection conductor to which the connection portion is connected and the connection conductor to which one of the two connection terminal portions is connected, and the one connection terminal portion is connected Have been said A first measurement process for measuring a voltage between the connection conductor and the connection conductor to which the other of the two connection terminal portions is connected, and the one connection terminal portion is connected The connection conductor to which a measurement voltage is applied between the connection conductor and the connection conductor to which one of the two connection terminal portions is connected and the one connection terminal portion is connected And at least one of a second measurement process for measuring a current flowing between the connection conductor to which the other of the two connection terminal portions is connected, and a result of the at least one measurement process The connection conductor and the connection are determined by obtaining a resistance value of a conduction resistance between the connection conductor and the connection circuit to which the one connection terminal portion is connected based on the reference value for inspection. Continuity with circuit Substrate inspection method for inspecting the state.   A circuit body, a plurality of connection terminal portions connected to the circuit body, and the one connection terminal portion differ from one of the connection terminal portions according to a control signal output from an external device. When inspecting the continuity state of each of the connection terminal portions with an integrated circuit formed with a connection circuit that performs connection processing for connecting the two connection terminal portions as an inspection target, the control signal is output to output the control signal The two connection terminal portions are connected to one connection terminal portion, and a measurement current is supplied between the one connection terminal portion and one of the two connection terminal portions. A first measurement process for measuring a voltage between one connection terminal portion and the other of the two connection terminal portions, and between the one connection terminal portion and one of the two connection terminal portions. While applying the measurement voltage to While performing at least one of the 2nd measurement process which measures the electric current which flows between the one connection terminal part and the other of the two connection terminal parts, based on the result of the at least one measurement process An integrated circuit inspection method for inspecting a conduction state of the one connection terminal portion by obtaining a resistance value of the conduction resistance of the one connection terminal portion and comparing it with a reference value for inspection.

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