JP2015098565A - Processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To separate a first support from a laminate without dissolving a second adhesive layer.SOLUTION: A processing method includes: a first sticking step of sticking a substrate 11 to the surface of a first support plate 13 on which a separation layer 14 is provided; a second sticking step of thereafter sticking a second support plate 23 to a surface opposite to the surface of the substrate 11 to which the first support plate 13 is stuck; and a separation step of irradiating the separation layer 14 with light after the second sticking step, thereby modifying the separation layer 14 to separate the first support plate 13 and the substrate 11.

Description

  The present invention relates to a processing method.

  In recent years, electronic device products are required to be further reduced in size, weight, and performance. Flip chip mounting technology, which is one of chip connection technologies, has been increasingly used as a key technology for realizing miniaturization, high performance, and low cost.

  Patent Document 1 discloses an adhesive composition used for forming a film-like adhesive used when affixing to a semiconductor wafer, grinding a wafer back surface, and flip chip bonding, and manufacturing a semiconductor device using the adhesive composition. And a method.

  Further, Patent Document 2 discloses a method for manufacturing a semiconductor device applied when manufacturing a semiconductor device having a chip-on-chip structure using a through electrode. More specifically, a step of flip-chip mounting a semiconductor chip on the first surface of the semiconductor substrate, and a step of forming an insulating support by resin molding in a state of covering the semiconductor chip on the first surface of the semiconductor substrate. And a method of manufacturing a semiconductor device, including a step of performing a predetermined process on the second surface side of the semiconductor substrate, and a step of cutting a chip from the semiconductor substrate together with the insulating support member into pieces. Yes.

JP 2011-146731 A (released July 28, 2011) JP 2008-130704 A (released on June 5, 2008)

  In order to perform flip chip mounting, the present inventors once laminated a first support, a first adhesive layer, a wafer substrate, a second adhesive layer, and a second support in this order. We are independently examining the technology for forming laminates. That is, first, the wafer substrate is bonded to the first support via the first adhesive layer, and the wafer substrate is ground and thinned. Thereafter, a second support is bonded to the ground surface of the wafer substrate via a second adhesive layer to form the laminate. Then, it is considered to separate the first support from the laminate and perform flip chip mounting using the remaining portion.

  Here, when the first adhesive layer is dissolved using a solvent when separating the first support from the laminate, the second adhesive layer that bonds the second support is also dissolved, There is a problem that the two supports may be separated at the same time.

  The present invention has been made in view of the above problems, and is a laminate in which a first support, a first adhesive layer, a wafer substrate, a second adhesive layer, and a second support are laminated in this order. The main object is to provide a technique for successfully separating the first support from the laminate without separating the second support when processing the substrate by forming the body.

  In order to solve the above-described problems, the processing method according to the present invention includes a first adhesive layer on a surface provided with a separation layer provided with a separation layer that is altered by light irradiation. A first pasting step for pasting the substrate, and after the first pasting step, a second support is provided on the surface opposite to the surface of the substrate on which the first support is pasted via a second adhesive layer. A second pasting step for pasting the body, and a separation step for separating the first support and the substrate by altering the separation layer by irradiating the separation layer with light after the second pasting step. It is characterized by that.

  According to the present invention, the second support is separated from the laminate formed by laminating the first support, the first adhesive layer, the wafer substrate, the second adhesive layer, and the second support in this order. The first support can be successfully separated without doing so.

It is a figure explaining the outline of the process until the outer peripheral part removal of the 1st adhesive bond layer which the processing method concerning one Embodiment of this invention includes. It is a figure explaining the outline of the process after the peripheral part removal of the 1st adhesive bond layer which the processing method concerning one embodiment of the present invention includes. It is a figure explaining the outline of the layered product formed by the processing method concerning one embodiment of the present invention. It is a figure explaining the outline of the separation process which the processing method concerning one embodiment of the present invention includes.

  The treatment method according to the present invention is a first pasting step of pasting a substrate via a first adhesive layer on a surface provided with the separation layer in the first provided with a separation layer that is altered by light irradiation. And after the first pasting step, a second pasting step of pasting the second support through the second adhesive layer on the surface facing away from the surface of the substrate on which the first support is pasted. Then, after the second sticking step, it includes a separation step of irradiating the separation layer with light to alter the separation layer to separate the first support and the substrate.

  Thus, the first support, the first adhesive layer, the wafer substrate, the second adhesive layer, and the second support are stacked in this order without separating the second support. The first support can be successfully separated.

  That is, according to the present invention, the second adhesive layer is dissolved in order to alter the separation layer by irradiating the separation layer with light to separate the first support and the substrate. The first support and the substrate can be separated without applying a large force to the adhesive layer. For this reason, when separating the first support from the laminate, it is possible to prevent the second support from being separated from the substrate.

  Therefore, in the processing method according to the present invention, flip-chip mounting can be suitably performed on the substrate in a later process than the processing method according to the present invention.

〔Processing method〕
The processing method according to an embodiment of the present invention will be described in more detail with reference to FIGS. FIG. 1 is a diagram illustrating an outline up to an outer peripheral portion removing step 2 of an adhesive layer included in a processing method according to an embodiment of the present invention. FIG. 2 is a diagram for explaining the outline of the steps after the outer peripheral portion removing step 2 of the adhesive layer included in the processing method according to an embodiment of the present invention.

  As shown in FIG. 1, the processing method according to one embodiment includes a first adhesive application step ((a) and (b) in FIG. 1), an outer peripheral portion removal step 1 ((c) in FIG. 1). ), First separation layer forming step ((d) and (e) in FIG. 1), first attaching step ((f) in FIG. 1), and outer peripheral portion removing step 2 ((g) in FIG. 1) )).

  Moreover, as shown in FIG. 2, in addition to the process shown to (a)-(g) of FIG. 1, the processing method which concerns on one Embodiment is a thinning process ((a) of FIG. 2), 2nd adhesion | attachment. Agent coating step (FIG. 2B), adhesive outer peripheral portion removing step 3 (FIG. 2C), second separation layer forming step (FIGS. 2D and 2E), second application The process ((f) of FIG. 2) and the outer peripheral part removal process 4 ((g) of FIG. 2) of the adhesive bond layer are included.

  As shown in FIG.1 and FIG.2, the processing method which concerns on one Embodiment provided the separation layer 14 in the 1st support plate (1st support body) 13 in which the separation layer 14 which changes in quality by light irradiation was provided. A first affixing step of attaching the substrate 11 to the surface via the first adhesive layer 12, and a surface facing away from the surface of the substrate 11 on which the first support plate 13 is affixed after the first affixing step Are separated by irradiating the separation layer 14 with light after the second pasting step of pasting the second support plate (second support) 23 through the second adhesive layer 22 and the second pasting step. A separation step of altering the layer 14 to separate the first support plate 13 and the substrate 11 from each other.

[First adhesive application process]
In the processing method according to the embodiment, the first adhesive that forms the first adhesive layer 12 by applying an adhesive to at least one of the first support plate 13 and the substrate 11 before the first attaching step. A coating process is included.

  Thereby, the substrate 11 can be fixed to the first support plate 13. Therefore, it is possible to prevent the substrate 11 from being damaged in the subsequent process.

  First, as shown to (a) and (b) of FIG. 1, the 1st adhesive agent is apply | coated to the surface in which the circuit of the board | substrate 11 is formed, and the 1st adhesive bond layer 12 is formed. The method for applying the first adhesive to the substrate 11 is not particularly limited, and examples thereof include spin coating, dipping, roller blades, spray coating, and slit coating. In the present embodiment, the first adhesive layer 12 is formed on the substrate 11. However, the present invention is not limited to this, and the first adhesive layer 12 is formed on the separation layer 14 formed on the first support plate 13. An adhesive may be applied to form the first adhesive layer 12.

(Substrate 11)
The substrate 11 is affixed to the first support plate 13 via the first adhesive layer 12 and is affixed to the second support plate 23 via the second adhesive layer 22. As the substrate 11, for example, an arbitrary substrate such as a wafer substrate, a ceramic substrate, a thin film substrate, or a flexible substrate can be used. In one embodiment, a circuit is formed on the surface of the substrate 11 on the side where the first adhesive layer 12 is laminated.

(First adhesive layer 12)
The first adhesive layer 12 is for bonding and fixing the substrate 11 to the first support plate 13 and the separation layer 14. The first adhesive layer 12 may cover and protect the surface of the substrate 11.

  As a formation method of the 1st adhesive bond layer 12, you may apply | coat an adhesive agent to the board | substrate 11, and may affix the adhesive tape with which the adhesive agent was apply | coated to the board | substrate 11 on both surfaces. The method for applying the adhesive is not particularly limited, and examples thereof include spin coating, dipping, roller blade, doctor blade, spray, and slit nozzle methods. Moreover, after apply | coating an adhesive agent, you may dry by heating. Further, instead of directly applying the adhesive to the substrate 11, a film (so-called double-sided tape) in which the adhesive is previously applied to both sides may be attached to the substrate 11.

  The thickness of the first adhesive layer 12 may be appropriately set according to the types of the substrate 11 and the first support plate 13 to be pasted, the processing applied to the substrate 11 after pasting, and the like. , Preferably in the range of 10 to 150 μm, more preferably in the range of 15 to 100 μm.

  As the adhesive, for example, various adhesives known in the art such as acrylic, novolak, naphthoquinone, hydrocarbon, polyimide, and elastomer constitute the first adhesive layer 12 according to the present invention. It can be used as an adhesive. Hereinafter, the composition of the resin contained in the first adhesive layer 12 in the present embodiment will be described.

  As resin which the 1st adhesive bond layer 12 contains, what is necessary is just what was provided with adhesiveness, for example, hydrocarbon resin, acrylic-styrene-type resin, maleimide-type resin, elastomer resin etc., or these were combined. And the like.

  The glass transition temperature (Tg) of the adhesive varies depending on the type and molecular weight of the resin, and a compound such as a plasticizer for the adhesive. The type and molecular weight of the resin contained in the adhesive can be appropriately selected according to the type of the substrate and the support, but the Tg of the resin used for the adhesive is in the range of −60 ° C. or higher and 200 ° C. or lower. The inside is preferable, and the inside of the range of −25 ° C. or higher and 150 ° C. or lower is more preferable. By being within the range of −25 ° C. or higher and 150 ° C. or lower, the adhesive force of the first adhesive layer 12 can be suitably reduced without requiring excessive energy for cooling. Moreover, you may adjust Tg of the 1st adhesive bond layer 12 by mix | blending a plasticizer, resin of a low polymerization degree, etc. suitably.

  The glass transition temperature (Tg) can be measured using, for example, a known differential scanning calorimeter (DSC).

(Hydrocarbon resin)
The hydrocarbon resin is a resin that has a hydrocarbon skeleton and is obtained by polymerizing a monomer composition. As the hydrocarbon resin, cycloolefin polymer (hereinafter sometimes referred to as “resin (A)”), and at least one resin selected from the group consisting of terpene resin, rosin resin and petroleum resin (hereinafter referred to as “resin (A)”). Resin (B) ”), and the like, but is not limited thereto.

  The resin (A) may be a resin obtained by polymerizing a monomer component containing a cycloolefin monomer. Specific examples include a ring-opening (co) polymer of a monomer component containing a cycloolefin monomer, and a resin obtained by addition (co) polymerization of a monomer component containing a cycloolefin monomer.

  Examples of the cycloolefin monomer contained in the monomer component constituting the resin (A) include bicyclic compounds such as norbornene and norbornadiene, tricyclic compounds such as dicyclopentadiene and dihydroxypentadiene, tetracyclododecene, and the like. Tetracyclics, pentacyclics such as cyclopentadiene trimers, heptacyclics such as tetracyclopentadiene, or alkyl (methyl, ethyl, propyl, butyl, etc.) substitutions of these polycyclics, alkenyls (vinyl, etc.) Substitution, alkylidene (ethylidene, etc.) substitution, aryl (phenyl, tolyl, naphthyl, etc.) substitution, etc. are mentioned. Among these, norbornene-based monomers selected from the group consisting of norbornene, tetracyclododecene, and alkyl-substituted products thereof are particularly preferable.

  The monomer component constituting the resin (A) may contain another monomer copolymerizable with the above-described cycloolefin-based monomer, and preferably contains, for example, an alkene monomer. Examples of the alkene monomer include ethylene, propylene, 1-butene, isobutene, 1-hexene, α-olefin and the like. The alkene monomer may be linear or branched.

  Moreover, it is preferable to contain a cycloolefin monomer as a monomer component which comprises resin (A) from a viewpoint of high heat resistance (low thermal decomposition and thermal weight reduction property). The ratio of the cycloolefin monomer to the whole monomer component constituting the resin (A) is preferably 5 mol% or more, more preferably 10 mol% or more, and further preferably 20 mol% or more. preferable. Further, the ratio of the cycloolefin monomer to the whole monomer component constituting the resin (A) is not particularly limited, but is preferably 80 mol% or less from the viewpoint of solubility and stability over time in a solution, More preferably, it is 70 mol% or less.

  Moreover, you may contain a linear or branched alkene monomer as a monomer component which comprises resin (A). The ratio of the alkene monomer to the whole monomer component constituting the resin (A) is preferably 10 to 90 mol%, more preferably 20 to 85 mol% from the viewpoint of solubility and flexibility. 30 to 80 mol% is more preferable.

  The resin (A) is a resin having no polar group, such as a resin obtained by polymerizing a monomer component composed of a cycloolefin monomer and an alkene monomer, at high temperatures. It is preferable for suppressing generation of gas.

  The polymerization method and polymerization conditions for polymerizing the monomer components are not particularly limited, and may be set as appropriate according to conventional methods.

  Examples of commercially available products that can be used as the resin (A) include “TOPAS” manufactured by Polyplastics Co., Ltd., “APEL” manufactured by Mitsui Chemicals, Inc., “ZEONOR” and “ZEONEX” manufactured by Zeon Corporation. And “ARTON” manufactured by JSR Corporation.

  The glass transition temperature (Tg) of the resin (A) is preferably 60 ° C. or higher, and particularly preferably 70 ° C. or higher. When the glass transition temperature of the resin (A) is 60 ° C. or higher, softening of the first adhesive layer can be further suppressed when the laminate is exposed to a high temperature environment.

  The resin (B) is at least one resin selected from the group consisting of terpene resins, rosin resins and petroleum resins. Specifically, examples of the terpene resin include terpene resins, terpene phenol resins, modified terpene resins, hydrogenated terpene resins, hydrogenated terpene phenol resins, and the like. Examples of the rosin resin include rosin, rosin ester, hydrogenated rosin, hydrogenated rosin ester, polymerized rosin, polymerized rosin ester, and modified rosin. Examples of petroleum resins include aliphatic or aromatic petroleum resins, hydrogenated petroleum resins, modified petroleum resins, alicyclic petroleum resins, coumarone-indene petroleum resins, and the like. Among these, hydrogenated terpene resins and hydrogenated petroleum resins are more preferable.

  Although the softening point of resin (B) is not specifically limited, It is preferable that it is 80-160 degreeC. When the softening point of the resin (B) is 80 ° C. or higher, the laminate can be suppressed from being softened when exposed to a high temperature environment, and adhesion failure does not occur. On the other hand, when the softening point of the resin (B) is 160 ° C. or less, the peeling rate when peeling the laminate is good.

  Although the weight average molecular weight of resin (B) is not specifically limited, It is preferable that it is 300-3,000. When the weight average molecular weight of the resin (B) is 300 or more, the heat resistance is sufficient, and the degassing amount is reduced under a high temperature environment. On the other hand, when the weight average molecular weight of the resin (B) is 3,000 or less, the peeling rate when peeling the laminate is good. In addition, the weight average molecular weight of resin (B) in this embodiment means the molecular weight of polystyrene conversion measured by gel permeation chromatography (GPC).

  In addition, you may use what mixed resin (A) and resin (B) as resin. By mixing, heat resistance and peeling speed are improved. For example, the mixing ratio of the resin (A) and the resin (B) is (A) :( B) = 80: 20 to 55:45 (mass ratio). Since it is excellent in tolerance and flexibility, it is preferable.

(Acrylic-styrene resin)
Examples of the acrylic-styrene resin include a resin obtained by polymerization using styrene or a styrene derivative and (meth) acrylic acid ester as monomers.

  Examples of the (meth) acrylic acid ester include a (meth) acrylic acid alkyl ester having a chain structure, a (meth) acrylic acid ester having an aliphatic ring, and a (meth) acrylic acid ester having an aromatic ring. . Examples of the (meth) acrylic acid alkyl ester having a chain structure include an acrylic long-chain alkyl ester having an alkyl group having 15 to 20 carbon atoms and an acrylic alkyl ester having an alkyl group having 1 to 14 carbon atoms. . As acrylic long-chain alkyl esters, acrylic or methacrylic acid whose alkyl group is n-pentadecyl group, n-hexadecyl group, n-heptadecyl group, n-octadecyl group, n-nonadecyl group, n-eicosyl group, etc. Examples include alkyl esters. The alkyl group may be branched.

  Examples of the acrylic alkyl ester having an alkyl group having 1 to 14 carbon atoms include known acrylic alkyl esters used in existing acrylic adhesives. For example, an alkyl group of acrylic acid or methacrylic acid in which the alkyl group is a methyl group, ethyl group, propyl group, butyl group, 2-ethylhexyl group, isooctyl group, isononyl group, isodecyl group, dodecyl group, lauryl group, tridecyl group, etc. Examples include esters.

  Examples of (meth) acrylic acid ester having an aliphatic ring include cyclohexyl (meth) acrylate, cyclopentyl (meth) acrylate, 1-adamantyl (meth) acrylate, norbornyl (meth) acrylate, isobornyl (meth) acrylate, and tricyclodecanyl. (Meth) acrylate, tetracyclododecanyl (meth) acrylate, dicyclopentanyl (meth) acrylate and the like can be mentioned, and isobornyl methacrylate and dicyclopentanyl (meth) acrylate are more preferable.

  The (meth) acrylic acid ester having an aromatic ring is not particularly limited. Examples of the aromatic ring include a phenyl group, a benzyl group, a tolyl group, a xylyl group, a biphenyl group, a naphthyl group, and an anthracenyl group. A phenoxymethyl group, a phenoxyethyl group, and the like. The aromatic ring may have a chain or branched alkyl group having 1 to 5 carbon atoms. Specifically, phenoxyethyl acrylate is preferable.

(Maleimide resin)
Examples of maleimide resins include N-methylmaleimide, N-ethylmaleimide, Nn-propylmaleimide, N-isopropylmaleimide, Nn-butylmaleimide, N-isobutylmaleimide, N-sec as monomers. -Butylmaleimide, N-tert-butylmaleimide, Nn-pentylmaleimide, Nn-hexylmaleimide, Nn-heptylmaleimide, Nn-octylmaleimide, N-laurylmaleimide, N-stearylmaleimide, etc. Male having an aliphatic hydrocarbon group such as maleimide having an alkyl group, N-cyclopropylmaleimide, N-cyclobutylmaleimide, N-cyclopentylmaleimide, N-cyclohexylmaleimide, N-cycloheptylmaleimide, N-cyclooctylmaleimide A resin obtained by polymerizing an aromatic maleimide having an aryl group such as N, N-phenylmaleimide, Nm-methylphenylmaleimide, N-o-methylphenylmaleimide, and Np-methylphenylmaleimide. It is done.

  For example, a cycloolefin copolymer that is a copolymer of a repeating unit represented by the following chemical formula (1) and a repeating unit represented by the following chemical formula (2) can be used as the resin of the adhesive component.

(In chemical formula (2), n is 0 or an integer of 1 to 3)
As such cycloolefin copolymer, APL 8008T, APL 8009T, APL 6013T (all manufactured by Mitsui Chemicals, Inc.) and the like can be used.

(Elastomer)
The elastomer preferably contains a styrene unit as a constituent unit of the main chain, and the “styrene unit” may have a substituent. Examples of the substituent include an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, an alkoxyalkyl group having 1 to 5 carbon atoms, an acetoxy group, and a carboxyl group. Further, the content of the styrene unit is more preferably in the range of 14 wt% or more and 50 wt% or less. Furthermore, the elastomer preferably has a weight average molecular weight in the range of 10,000 to 200,000.

  If the content of the styrene unit is in the range of 14% by weight or more and 50% by weight or less, and the weight average molecular weight of the elastomer is in the range of 10,000 or more and 200,000 or less, the hydrocarbon solvent described later Therefore, the first adhesive layer can be removed more easily and quickly. Further, since the content of the styrene unit and the weight average molecular weight are within the above ranges, the resist solvent (eg, PGMEA, PGME, etc.), acid (hydrogen fluoride) exposed when the wafer is subjected to the resist lithography process. Acid, etc.) and alkali (TMAH etc.).

  In addition, you may further mix the (meth) acrylic acid ester mentioned above with the elastomer.

  Further, the content of styrene units is more preferably 17% by weight or more, and more preferably 40% by weight or less.

  A more preferable range of the weight average molecular weight is 20,000 or more, and a more preferable range is 150,000 or less.

  As the elastomer, various elastomers can be used as long as the content of styrene units is in the range of 14% by weight to 50% by weight and the weight average molecular weight of the elastomer is in the range of 10,000 to 200,000. Can be used. For example, polystyrene-poly (ethylene / propylene) block copolymer (SEP), styrene-isoprene-styrene block copolymer (SIS), styrene-butadiene-styrene block copolymer (SBS), styrene-butadiene-butylene-styrene block copolymer (SBBS). And hydrogenated products thereof, styrene-ethylene-butylene-styrene block copolymer (SEBS), styrene-ethylene-propylene-styrene block copolymer (styrene-isoprene-styrene block copolymer) (SEPS), styrene-ethylene-ethylene- Propylene-styrene block copolymer (SEEPS), styrene-ethylene-ethylene-propylene-styrene block copolypropylene in which styrene block is reactively crosslinked -(Septon V9461 (manufactured by Kuraray Co., Ltd.)), a styrene block having a reactive crosslinking type styrene-ethylene-butylene-styrene block copolymer (Septon V9827 (manufactured by Kuraray Co., Ltd.) having a reactive polystyrene hard block), etc. The styrene unit content and the weight average molecular weight are within the above-mentioned ranges.

  Of the elastomers, hydrogenated products are more preferable. If it is a hydrogenated product, the stability to heat is improved, and degradation such as decomposition and polymerization hardly occurs. Moreover, it is more preferable from the viewpoint of solubility in hydrocarbon solvents and resistance to resist solvents.

  Among elastomers, those having both ends of a styrene block polymer are more preferred. This is because styrene having high thermal stability is blocked at both ends, thereby exhibiting higher heat resistance.

  More specifically, the elastomer is more preferably a hydrogenated product of a block copolymer of styrene and conjugated diene. Stability against heat is improved, and degradation such as decomposition and polymerization hardly occurs. Moreover, higher heat resistance is exhibited by blocking styrene having high thermal stability at both ends. Furthermore, it is more preferable from the viewpoint of solubility in hydrocarbon solvents and resistance to resist solvents.

  Examples of commercially available products that can be used as an elastomer included in the adhesive constituting the first adhesive layer 12 include “Septon (trade name)” manufactured by Kuraray Co., Ltd. and “Hibler (trade name)” manufactured by Kuraray Co., Ltd. Asahi Kasei Co., Ltd. “Tuftec (trade name)”, JSR Corporation “Dynaron (trade name)” and the like.

  The content of the elastomer contained in the adhesive constituting the first adhesive layer 12 is, for example, preferably within the range of 50 parts by weight or more and 99 parts by weight or less, assuming that the total amount of the adhesive is 100 parts by weight. More preferably, it is in the range of 99 parts by weight or more and most preferably in the range of 70 parts by weight or more and 95 parts by weight or less. By setting it within these ranges, the wafer and the support can be suitably bonded together while maintaining the heat resistance.

  A plurality of types of elastomers may be mixed. That is, the adhesive constituting the first adhesive layer 12 may contain a plurality of types of elastomers. It is sufficient that at least one of the plurality of types of elastomers includes a styrene unit as a constituent unit of the main chain. Further, at least one of the plurality of types of elastomers has a styrene unit content in the range of 14 wt% or more and 50 wt% or less, or a weight average molecular weight of 10,000 or more and 200,000 or less. If it is within the range, it is within the scope of the present invention. Moreover, when the adhesive which comprises the 1st adhesive bond layer 12 contains several types of elastomer, you may adjust so that content of a styrene unit may become in said range as a result of mixing. For example, Septon 4033 of Septon (trade name) manufactured by Kuraray Co., Ltd. having a styrene unit content of 30% by weight and Septon 2063 of Septon (trade name) having a styrene unit content of 13% by weight is 1 weight ratio. When mixed in a one-to-one relationship, the styrene content with respect to the total elastomer contained in the adhesive composition is 21 to 22% by weight, and thus 14% by weight or more. For example, when a styrene unit of 10% by weight and 60% by weight are mixed at a weight ratio of 1: 1, it becomes 35% by weight and falls within the above range. The present invention may be in such a form. Moreover, it is most preferable that the plurality of types of elastomers contained in the adhesive composition according to the present invention all contain styrene units within the above range and have a weight average molecular weight within the above range.

  In addition, it is preferable to form the 1st adhesive bond layer 12 using resin other than photocurable resin (for example, UV curable resin). By using a resin other than the photocurable resin, it is possible to prevent a residue from remaining around the minute unevenness of the supported substrate after the first adhesive layer 12 is peeled or removed. In particular, the adhesive constituting the first adhesive layer 12 is preferably not soluble in any solvent but soluble in a specific solvent. This is because it can be removed by dissolving the first adhesive layer 12 in a solvent without applying physical force to the substrate 11. When the first adhesive layer 12 is removed, the first adhesive layer 12 can be easily removed without damaging or deforming the substrate 11 even from the substrate 11 having a reduced strength. .

(Diluted solvent)
As a diluting solvent when forming the separation layer and the first adhesive layer, for example, hexane, heptane, octane, nonane, methyloctane, decane, undecane, dodecane, tridecane, etc., linear hydrocarbon, carbon number 4 to 15 branched hydrocarbons, for example, cyclic hydrocarbons such as cyclohexane, cycloheptane, cyclooctane, naphthalene, decahydronaphthalene, tetrahydronaphthalene, p-menthane, o-menthane, m-menthane, diphenylmenthane, 1 , 4-Terpin, 1,8-Terpin, Bornan, Norbornane, Pinan, Tujan, Karan, Longifolene, Geraniol, Nerol, Linalool, Citral, Citronellol, Menthol, Isomenthol, Neomenthol, α-Terpineol, β-Terpineol, γ -Terpine Terpinen-1-ol, terpinen-4-ol, dihydroterpinyl acetate, 1,4-cineole, 1,8-cineole, borneol, carvone, yonon, thuyon, camphor, d-limonene, l-limonene Terpene solvents such as dipentene; lactones such as γ-butyrolactone; ketones such as acetone, methyl ethyl ketone, cyclohexanone (CH), methyl-n-pentyl ketone, methyl isopentyl ketone, 2-heptanone; ethylene glycol, diethylene glycol, Polyhydric alcohols such as propylene glycol and dipropylene glycol; ethylene glycol monoacetate, diethylene glycol monoacetate, propylene glycol monoacetate, dipropylene glycol monoacetate and the like A compound having a steal bond, a compound having an ether bond such as a monoalkyl ether such as monomethyl ether, monoethyl ether, monopropyl ether, monobutyl ether or monophenyl ether of the polyhydric alcohol or the compound having an ester bond, etc. Derivatives of polyhydric alcohols (in these, propylene glycol monomethyl ether acetate (PGMEA) and propylene glycol monomethyl ether (PGME) are preferred); cyclic ethers such as dioxane, methyl lactate, ethyl lactate (EL) Esters such as methyl acetate, ethyl acetate, butyl acetate, methoxybutyl acetate, methyl pyruvate, ethyl pyruvate, methyl methoxypropionate, ethyl ethoxypropionate; anisole, ethyl Benzyl ether, cresyl methyl ether, diphenyl ether, can be mentioned dibenzyl ether, phenetole, the aromatic organic solvent such as butyl phenyl ether.

(Other ingredients)
The adhesive constituting the first adhesive layer may further contain other miscible materials as long as the essential properties are not impaired. For example, various conventional additives such as additional resins, plasticizers, adhesion aids, stabilizers, colorants, thermal polymerization inhibitors and surfactants for improving the performance of the adhesive may be further used. it can.

[Adhesive outer peripheral part removal step 1]
In the processing method according to the embodiment, the outer peripheral portion of the first adhesive layer 12 is removed after the first adhesive application step and before the first sticking step.

  Thereby, the excessively applied adhesive can be removed. For this reason, it can prevent that the 1st adhesive bond layer 12 protrudes from the outer peripheral part of the laminated body 50 in a 1st sticking process, and adheres to the 1st support plate 13 excessively. Therefore, the first support plate 13 can be separated from the stacked body 100 without applying an excessive force after the separation layer 14 is irradiated with light in a subsequent separation step.

  As shown in FIG. 1C, the outer peripheral portion removal step 1 of the adhesive layer is performed by forming the adhesive layer 12 on one surface of the substrate 11 in the first adhesive layer forming step and then the outer periphery on the substrate 11. This is a step of removing the first adhesive layer 12 in the portion. Thereby, when the board | substrate 11 and the 1st support plate 13 are bonded together in a later 1st sticking process, it suppresses suitably that the 1st adhesive bond layer 12 protrudes from the laminated body 50. Can do. Accordingly, it is possible to prevent the first adhesive layer 12 from protruding from the laminate 100 in the subsequent second sticking step.

  A method for removing the first adhesive layer 12 formed on the outer peripheral portion on the substrate 11 may be a known method, and is not particularly limited. For example, the outer peripheral portion of the first adhesive layer 12 may be used. On the other hand, the solution may be sprayed or the solution may be supplied using a dispensing nozzle. Further, spraying, supplying, etc. of the solution may be performed while rotating the substrate 11.

  The solution for the first adhesive layer 12 may be appropriately selected depending on the type of the adhesive, and is not particularly limited. For example, the solvent used as the dilution solvent described above can be used. In addition, cyclic hydrocarbons (terpenes) such as linear hydrocarbons, branched hydrocarbons having 4 to 15 carbon atoms, monoterpenes and diterpenes can be preferably used.

[First separation layer forming step]
As shown in FIGS. 1D and 1E, the first separation layer forming step is a step of forming a separation layer 14 that is altered by irradiating light onto one surface of the first support plate 13. The first adhesive layer coating step and the first separation layer forming step may be completed by the start of the first sticking step described below, and the order of performing both steps is not limited. You may implement a process in parallel.

(First support plate 13)
The first support plate 13 is a support that supports the substrate 11. The first support plate 13 is attached to the substrate 11 via the first adhesive layer 12.

  The first support plate 13 has a strength necessary to prevent the substrate 11 from being damaged or deformed during processes such as thinning, transporting, and mounting of the substrate 11, and light for altering the separation layer 14. As long as it is transparent. From the above viewpoint, examples of the first support plate 13 include those made of glass, silicon, and acrylic resin.

(Separation layer 14)
The separation layer 14 is a layer formed of a material that is altered by absorbing light irradiated through the first support plate 13.

  Further, a laser that emits light for irradiating the separation layer 14 can be appropriately selected according to the material constituting the separation layer 14, and light having a wavelength that can alter the material constituting the separation layer 14. May be selected.

  The separation layer 14 is provided on the surface of the first support plate 13 on the side where the substrate 11 is bonded via the first adhesive layer 12.

  For example, the thickness of the separation layer 14 is more preferably in the range of 0.05 μm or more and 50 μm or less, and further preferably in the range of 0.3 μm or more and 1 μm or less. If the thickness of the separation layer 14 is in the range of 0.05 μm or more and 50 μm or less, desired alteration can be caused in the separation layer 14 by short-time light irradiation and low-energy light irradiation. . Further, the thickness of the separation layer 14 is particularly preferably within a range of 1 μm or less from the viewpoint of productivity.

  Note that another layer may be further formed between the separation layer 14 and the first support plate 13. In this case, the other layer should just be comprised from the material which permeate | transmits light. Thereby, a layer imparting preferable properties and the like to the laminate can be appropriately added without hindering the incidence of light on the separation layer 14. The wavelength of light that can be used varies depending on the type of material constituting the separation layer 14. Therefore, the material constituting the other layer does not need to transmit all light, and can be appropriately selected from materials capable of transmitting light having a wavelength that can alter the material constituting the separation layer 14.

  The separation layer 14 is preferably formed only from a material having a structure that absorbs light, but the material does not have a structure that absorbs light as long as the essential characteristics of the present invention are not impaired. May be added to form the separation layer 14. Further, it is preferable that the surface of the separation layer 14 facing the first adhesive layer 12 is flat (no irregularities are formed), whereby the separation layer 14 can be easily formed and attached. Even in attaching, it is possible to apply evenly.

The separation layer 14 may be altered by absorbing light irradiated from the laser. That is, the light applied to the separation layer 14 to alter the separation layer 14 may be light emitted from a laser. Examples of lasers that emit light to irradiate the separation layer 14 include YAG lasers, ruby lasers, glass lasers, YVO ₄ lasers, solid state lasers such as LD lasers, fiber lasers, liquid lasers such as dye lasers, CO ₂ lasers, Examples thereof include a gas laser such as an excimer laser, an Ar laser, and a He—Ne laser, a laser beam such as a semiconductor laser and a free electron laser, or a non-laser beam. The laser that emits light to irradiate the separation layer 14 can be appropriately selected according to the material constituting the separation layer 14 and irradiates light having a wavelength that can alter the material constituting the separation layer 14. The laser to be selected may be selected.

(Fluorocarbon)
The separation layer 14 may be made of a fluorocarbon. Since the separation layer 14 is composed of fluorocarbon, the separation layer 14 is altered by absorbing light. As a result, the separation layer 14 loses strength or adhesiveness before being irradiated with light. Therefore, by applying a slight external force (for example, lifting the first support plate 13 or the like), the separation layer 14 is broken, and the first support plate 13 and the substrate 11 can be easily separated. The fluorocarbon constituting the separation layer 14 can be suitably formed by a plasma CVD (chemical vapor deposition) method.

  The fluorocarbon absorbs light having a wavelength in a specific range depending on the type. By irradiating the separation layer with light having a wavelength within a range that is absorbed by the fluorocarbon used in the separation layer 14, the fluorocarbon can be suitably altered. The light absorption rate in the separation layer 14 is preferably 80% or more.

As light to irradiate the separation layer 14, for example, a liquid such as a YAG laser, a ruby laser, a glass laser, a YVO ₄ laser, an LD laser, a fiber laser, or a dye laser, depending on the wavelength that can be absorbed by the fluorocarbon. A gas laser such as a laser, a CO ₂ laser, an excimer laser, an Ar laser, or a He—Ne laser, a laser beam such as a semiconductor laser or a free electron laser, or a non-laser beam may be used as appropriate. The wavelength at which the fluorocarbon can be altered is not limited to this, but for example, a wavelength in the range of 600 nm or less can be used.

(Polymer containing light-absorbing structure in its repeating unit)
The separation layer 14 may contain a polymer containing a light-absorbing structure in its repeating unit. The polymer is altered by irradiation with light. The alteration of the polymer occurs when the structure absorbs the irradiated light. The separation layer 14 loses its strength or adhesiveness before being irradiated with light as a result of the alteration of the polymer. Therefore, by applying a slight external force (for example, lifting the first support plate 13 or the like), the separation layer 14 is broken, and the first support plate 13 and the substrate 11 can be easily separated.

  The above-mentioned structure having light absorptivity is a chemical structure that absorbs light and alters a polymer containing the structure as a repeating unit. The structure is, for example, an atomic group including a conjugated π electron system composed of a substituted or unsubstituted benzene ring, condensed ring, or heterocyclic ring. More specifically, the structure may be a cardo structure, or a benzophenone structure, a diphenyl sulfoxide structure, a diphenyl sulfone structure (bisphenyl sulfone structure), a diphenyl structure or a diphenylamine structure present in the side chain of the polymer.

  When the structure is present in the side chain of the polymer, the structure can be represented by the following formula:

(In the formula, each R is independently an alkyl group, an aryl group, a halogen, a hydroxyl group, a ketone group, a sulfoxide group, a sulfone group or an N (R ¹ ) (R ² ) group (where R ¹ and R ² is each independently a hydrogen atom or an alkyl group having 1 to 5 carbon atoms), Z is absent or is —CO—, —SO ₂ —, —SO— or —NH—, and n Is 0 or an integer of 1 to 5.)
In addition, the polymer includes, for example, a repeating unit represented by any one of (a) to (d) among the following formulas, represented by (e), or represented by (f) Contains structure in its main chain.

(In the formula, l is an integer of 1 or more, m is 0 or an integer of 1 to 2, and X is any one of the formulas shown in the above “Chemical Formula 2” in (a) to (e)). Yes, in (f), any of the formulas shown in “Chemical Formula 2” above or not present, and Y ₁ and Y ₂ are each independently —CO— or —SO ₂ —. l is preferably an integer of 10 or less.)
Examples of the benzene ring, condensed ring and heterocyclic ring shown in the above “chemical formula 2” include phenyl, substituted phenyl, benzyl, substituted benzyl, naphthalene, substituted naphthalene, anthracene, substituted anthracene, anthraquinone, substituted anthraquinone, acridine, substituted Examples include acridine, azobenzene, substituted azobenzene, fluorene, substituted fluorene, fluorenone, substituted fluorenone, carbazole, substituted carbazole, N-alkylcarbazole, dibenzofuran, substituted dibenzofuran, phenanthrene, substituted phenanthrene, pyrene, and substituted pyrene. When the exemplified substituent further has a substituent, the substituent is, for example, alkyl, aryl, halogen atom, alkoxy, nitro, aldehyde, cyano, amide, dialkylamino, sulfonamide, imide, carboxylic acid, Selected from carboxylic acid esters, sulfonic acids, sulfonic acid esters, alkylamino and arylamino.

Of the substituents represented by “Chemical Formula 2” above, as an example of the fifth substituent having two phenyl groups and Z being —SO ₂ —, bis (2, 4-dihydroxyphenyl) sulfone, bis (3,4-dihydroxyphenyl) sulfone, bis (3,5-dihydroxyphenyl) sulfone, bis (3,6-dihydroxyphenyl) sulfone, bis (4-hydroxyphenyl) sulfone, bis (3-hydroxyphenyl) sulfone, bis (2-hydroxyphenyl) sulfone, bis (3,5-dimethyl-4-hydroxyphenyl) sulfone, and the like can be mentioned.

  Of the substituents represented by “Chemical Formula 2” above, as an example of the fifth substituent having two phenyl groups and Z being —SO—, bis (2,3 -Dihydroxyphenyl) sulfoxide, bis (5-chloro-2,3-dihydroxyphenyl) sulfoxide, bis (2,4-dihydroxyphenyl) sulfoxide, bis (2,4-dihydroxy-6-methylphenyl) sulfoxide, bis (5 -Chloro-2,4-dihydroxyphenyl) sulfoxide, bis (2,5-dihydroxyphenyl) sulfoxide, bis (3,4-dihydroxyphenyl) sulfoxide, bis (3,5-dihydroxyphenyl) sulfoxide, bis (2,3 , 4-Trihydroxyphenyl) sulfoxide, bis (2,3,4-trihydroxy-6-methylpheny ) -Sulfoxide, bis (5-chloro-2,3,4-trihydroxyphenyl) sulfoxide, bis (2,4,6-trihydroxyphenyl) sulfoxide, bis (5-chloro-2,4,6-trihydroxy) Phenyl) sulfoxide and the like.

  Of the substituents represented by the above “Chemical Formula 2”, the fifth substituent having two phenyl groups and Z is —C (═O) — , 4-dihydroxybenzophenone, 2,3,4-trihydroxybenzophenone, 2,2 ', 4,4'-tetrahydroxybenzophenone, 2,2', 5,6'-tetrahydroxybenzophenone, 2-hydroxy-4- Methoxybenzophenone, 2-hydroxy-4-octoxybenzophenone, 2-hydroxy-4-dodecyloxybenzophenone, 2,2'-dihydroxy-4-methoxybenzophenone, 2,6-dihydroxy-4-methoxybenzophenone, 2,2 ' -Dihydroxy-4,4'-dimethoxybenzophenone, 4-amino-2'-hydroxybenzophenone, 4-dimethyl Ruamino-2'-hydroxybenzophenone, 4-diethylamino-2'-hydroxybenzophenone, 4-dimethylamino-4'-methoxy-2'-hydroxybenzophenone, 4-dimethylamino-2 ', 4'-dihydroxybenzophenone, and 4 -Dimethylamino-3 ', 4'-dihydroxybenzophenone and the like.

  When the structure is present in the side chain of the polymer, the ratio of the repeating unit containing the structure to the polymer is such that the light transmittance of the separation layer 14 is 0.001% or more, 10 % Or less. If the polymer is prepared so that the ratio falls within such a range, the separation layer 14 can sufficiently absorb light and can be surely and rapidly altered. That is, it is easy to remove the first support plate 13 from the stacked body 100, and the irradiation time of light necessary for the removal can be shortened.

  The said structure can absorb the light which has a wavelength of a desired range by selection of the kind. For example, the wavelength of light that can be absorbed by the above structure is more preferably in the range of 100 nm to 2,000 nm. Within this range, the wavelength of light that can be absorbed by the structure is on the shorter wavelength side, for example, in the range of 100 nm to 500 nm. For example, the structure can alter the polymer containing the structure by absorbing ultraviolet light, preferably having a wavelength in the range of about 300 nm to 370 nm.

  The light that can be absorbed by the above structure is, for example, a high-pressure mercury lamp (wavelength: 254 nm or more, 436 nm or less), KrF excimer laser (wavelength: 248 nm), ArF excimer laser (wavelength: 193 nm), F2 excimer laser (wavelength: 157 nm). , Light emitted from a XeCl laser (wavelength: 308 nm), XeF laser (wavelength: 351 nm) or solid-state UV laser (wavelength: 355 nm), or g-line (wavelength: 436 nm), h-line (wavelength: 405 nm) or i-line ( Wavelength: 365 nm).

  Although the separation layer 14 described above contains a polymer containing the above structure as a repeating unit, the separation layer 14 may further contain a component other than the polymer. Examples of the component include a filler, a plasticizer, and a component that can improve the peelability of the first support plate 13. These components are appropriately selected from conventionally known substances or materials that do not hinder or promote the absorption of light by the above structure and the alteration of the polymer.

(Inorganic)
The separation layer 14 may be made of an inorganic material. The separation layer 14 is composed of an inorganic substance, and is thereby altered by absorbing light. As a result, the separation layer 14 loses strength or adhesiveness before being irradiated with light. Therefore, by applying a slight external force (for example, lifting the first support plate 13 or the like), the separation layer 14 is broken, and the first support plate 13 and the substrate 11 can be easily separated.

The said inorganic substance should just be the structure which changes in quality by absorbing light, for example, 1 or more types of inorganic substances selected from the group which consists of a metal, a metal compound, and carbon can be used conveniently. The metal compound refers to a compound containing a metal atom, and can be, for example, a metal oxide or a metal nitride. Examples of such inorganic materials include, but are not limited to, gold, silver, copper, iron, nickel, aluminum, titanium, chromium, SiO ₂ , SiN, Si ₃ N ₄ , TiN, and carbon. One or more inorganic substances selected from the group consisting of: Carbon is a concept that may include an allotrope of carbon, for example, diamond, fullerene, diamond-like carbon, carbon nanotube, and the like.

  The inorganic material absorbs light having a wavelength in a specific range depending on the type. By irradiating the separation layer with light having a wavelength within a range that the inorganic material used for the separation layer 14 absorbs, the inorganic material can be suitably altered.

The light applied to the separation layer 14 made of an inorganic material may be, for example, a solid-state laser such as a YAG laser, a ruby laser, a glass laser, a YVO ₄ laser, an LD laser, or a fiber laser, or a dye depending on the wavelength that can be absorbed by the inorganic material. A liquid laser such as a laser, a gas laser such as a CO ₂ laser, an excimer laser, an Ar laser, or a He—Ne laser, a laser beam such as a semiconductor laser or a free electron laser, or a non-laser beam may be used as appropriate.

  The separation layer 14 made of an inorganic material can be formed on the first support plate 13 by a known technique such as sputtering, chemical vapor deposition (CVD), plating, plasma CVD, or spin coating. The thickness of the separation layer 14 made of an inorganic material is not particularly limited as long as it is a film thickness that can sufficiently absorb light to be used. For example, the film thickness is in a range of 0.05 μm or more and 10 μm or less. Is more preferable. Alternatively, an adhesive may be applied in advance to both surfaces or one surface of an inorganic film (for example, a metal film) made of an inorganic material constituting the separation layer 14 and attached to the first support plate 13 and the substrate 11.

  When a metal film is used as the separation layer 14, laser reflection or charging of the film may occur depending on conditions such as the film quality of the separation layer 14, the type of laser light source, and laser output. Therefore, it is preferable to take measures against them by providing an antireflection film or an antistatic film on the upper and lower sides of the separation layer 14 or one of them.

(Compound having infrared absorbing structure)
The separation layer 14 may be formed of a compound having an infrared absorbing structure. The compound is altered by absorbing infrared rays. The separation layer 14 has lost its strength or adhesiveness before being irradiated with infrared rays as a result of the alteration of the compound. Therefore, by applying a slight external force (for example, lifting the support), the separation layer 14 is broken and the first support plate 13 and the substrate 11 can be easily separated.

Examples of the compound having an infrared absorptive structure or a compound having an infrared absorptive structure include alkanes, alkenes (vinyl, trans, cis, vinylidene, trisubstituted, tetrasubstituted, conjugated, cumulene, Cyclic), alkyne (monosubstituted, disubstituted), monocyclic aromatic (benzene, monosubstituted, disubstituted, trisubstituted), alcohol and phenol (free OH, intramolecular hydrogen bond, intermolecular hydrogen bond, saturation) Secondary, saturated tertiary, unsaturated secondary, unsaturated tertiary), acetal, ketal, aliphatic ether, aromatic ether, vinyl ether, oxirane ring ether, peroxide ether, ketone, dialkylcarbonyl, Aromatic carbonyl, 1,3-diketone enol, o-hydroxy aryl ketone, dialkyl aldehyde, aromatic aldehyde, carboxylic acid (dimer, Rubonic acid anion), formate ester, acetate ester, conjugated ester, non-conjugated ester, aromatic ester, lactone (β-, γ-, δ-), aliphatic acid chloride, aromatic acid chloride, acid anhydride ( Conjugated, non-conjugated, cyclic, acyclic), primary amide, secondary amide, lactam, primary amine (aliphatic, aromatic), secondary amine (aliphatic, aromatic), secondary Tertiary amine (aliphatic, aromatic), primary amine salt, secondary amine salt, tertiary amine salt, ammonium ion, aliphatic nitrile, aromatic nitrile, carbodiimide, aliphatic isonitrile, aromatic isonitrile, Isocyanate ester, thiocyanate ester, aliphatic isothiocyanate ester, aromatic isothiocyanate ester, aliphatic nitro compound, aromatic nitro compound, nitroamine, nitrosamine, glass Esters, nitrites, nitroso bonds (aliphatic, aromatic, monomer, dimer), sulfur compounds such as mercaptans and thiophenol and thiolic acid, thiocarbonyl groups, sulfoxides, sulfones, sulfonyl chlorides, primary Sulfonamide, secondary sulfonamide, sulfate ester, carbon-halogen bond, Si-A ¹ bond (A ¹ is H, C, O or halogen), PA ² bond (A ² is H, C or O), or Ti—O bonds.

As a structure containing halogen bond, for _{example, -CH 2 Cl, -CH 2 Br} , -CH 2 I, -CF 2 - - the _{carbon, - CF 3, -CH = CF} 2, -CF = CF 2, fluoride Aryl chloride and aryl chloride.

Examples of the structure containing the Si—A ¹ bond include SiH, SiH ₂ , SiH ₃ , Si—CH ₃ , Si—CH ₂ —, Si—C ₆ H ₅ , SiO-aliphatic, Si—OCH ₃ , Si— _{OCH 2 CH 3, Si-OC} 6 H 5, Si-O-Si, Si-OH, SiF, SiF 2, and SiF _3, and the like. As a structure including a Si—A ¹ bond, a siloxane skeleton and a silsesquioxane skeleton are particularly preferably formed.

Examples of the structure containing the P—A ² bond include PH, PH ₂ , P—CH ₃ , P—CH ₂ —, P—C ₆ H ₅ , A ³ ₃ —PO— (A ³ is aliphatic or aromatic. _{^{family), (A 4 O) 3}} -P-O (A 4 _{alkyl), P-OCH 3, P} -OCH 2 CH 3, P-OC 6 H 5, P-O-P, P-OH, and O = P-OH and the like can be mentioned.

  The said structure can absorb the infrared rays which have the wavelength of a desired range by selection of the kind. Specifically, the wavelength of infrared rays that can be absorbed by the above structure is, for example, in the range of 1 μm or more and 20 μm or less, and more preferably in the range of 2 μm or more and 15 μm or less. Furthermore, in the case where the structure is a Si—O bond, a Si—C bond, or a Ti—O bond, it may be in the range of 9 μm or more and 11 μm or less. In addition, those skilled in the art can easily understand the infrared wavelength that can be absorbed by each structure. For example, as an absorption band in each structure, Non-Patent Document: SILVERSTEIN / BASSLER / MORRILL, “Identification method by spectrum of organic compound (5th edition) —Combination of MS, IR, NMR and UV” (published in 1992) The description on page 146 to page 151 can be referred to.

  As the compound having an infrared-absorbing structure used for forming the separation layer 14, among the compounds having the structure as described above, it can be dissolved in a solvent for coating, and is solidified and solidified. There is no particular limitation as long as the layer can be formed. However, in order to effectively alter the compound in the separation layer 14 and facilitate separation of the first support plate 13 and the substrate 11, the infrared absorption in the separation layer 14 is large, that is, the separation layer 14 has an infrared ray. It is preferable that the transmittance of infrared rays when irradiated with is low. Specifically, the infrared transmittance in the separation layer 14 is preferably lower than 90%, and the infrared transmittance is more preferably lower than 80%.

  For example, as the compound having a siloxane skeleton, for example, a resin that is a copolymer of a repeating unit represented by the following chemical formula (3) and a repeating unit represented by the following chemical formula (4), or A resin that is a copolymer of a repeating unit represented by the following chemical formula (3) and a repeating unit derived from an acrylic compound can be used.

(In the chemical formula (4), R ³ is hydrogen, an alkyl group having 10 or less carbon atoms, or an alkoxy group having 10 or less carbon atoms.)
Among them, as a compound having a siloxane skeleton, a t-butylstyrene (TBST) -dimethylsiloxane copolymer which is a copolymer of a repeating unit represented by the above chemical formula (3) and a repeating unit represented by the following chemical formula (5) is used. A polymer is more preferable, and a TBST-dimethylsiloxane copolymer containing a repeating unit represented by the above formula (3) and a repeating unit represented by the following chemical formula (5) in a ratio of 1: 1 is further preferable.

  As the compound having a silsesquioxane skeleton, for example, a resin that is a copolymer of a repeating unit represented by the following chemical formula (6) and a repeating unit represented by the following chemical formula (7) can be used. .

(In chemical formula (6), R ⁴ is hydrogen or an alkyl group having 1 to 10 carbon atoms, and in chemical formula (7), R ⁵ is an alkyl group having 1 to 10 carbon atoms, or a phenyl group. .)
Other compounds having a silsesquioxane skeleton include JP 2007-258663 A (published on October 4, 2007), JP 2010-120901 A (published on June 3, 2010), Each silsesquioxane resin disclosed in JP 2009-263316 A (published on November 12, 2009) and JP 2009-263596 A (published on November 12, 2009) is preferably used. Can do.

  Among these, as the compound having a silsesquioxane skeleton, a repeating unit represented by the following chemical formula (8) and a copolymer of a repeating unit represented by the following chemical formula (9) are more preferable. A copolymer containing the repeating unit represented by the formula (9) and the repeating unit represented by the following chemical formula (9) at 7: 3 is more preferable.

  The polymer having a silsesquioxane skeleton may have a random structure, a ladder structure, and a cage structure, and any structure may be used.

Examples of the compound containing a Ti—O bond include (i) tetra-i-propoxytitanium, tetra-n-butoxytitanium, tetrakis (2-ethylhexyloxy) titanium, and titanium-i-propoxyoctylene glycolate. (ii) di -i- propoxy bis (acetylacetonato) titanium, and propane di oxytitanium bis (ethylacetoacetate) chelate titanium such as; alkoxy titanium etc. _{(iii) i-C 3 H} 7 O - [- _{Ti (O-i-C 3} H 7) 2 -O-] n -i-C 3 H 7, and _{n-C 4 H 9 O -} [- Ti (O-n-C 4 H 9) 2 -O _-] n _-n-C 4 titanium polymers such as _{H 9;} (iv) tri -n- butoxy titanium monostearate, titanium stearate, di -i- propoxytitanium diisopropyl Examples include sostearate and acylate titanium such as (2-n-butoxycarbonylbenzoyloxy) tributoxytitanium; (v) water-soluble titanium compounds such as di-n-butoxy-bis (triethanolaminato) titanium.

Among them, as a compound containing a Ti—O bond, di-n-butoxy bis (triethanolaminato) titanium (Ti (OC ₄ H ₉ ) ₂ [OC ₂ H ₄ N (C ₂ H ₄ OH) ₂ ] ₂ ) is preferred.

  Although the separation layer 14 described above contains a compound having an infrared absorbing structure, the separation layer 14 may further contain a component other than the above compound. Examples of the component include a filler, a plasticizer, and a component that can improve the peelability of the first support plate 13. These components are appropriately selected from conventionally known substances or materials that do not interfere with or promote infrared absorption by the above structure and alteration of the compound.

(Infrared absorbing material)
The separation layer 14 may contain an infrared absorbing material. The separation layer 14 is configured to contain an infrared absorbing material, so that the separation layer 14 is altered by absorbing light. As a result, the strength or adhesiveness before receiving the light irradiation is lost. Therefore, by applying a slight external force (for example, lifting the first support plate 13 or the like), the separation layer 14 is broken, and the first support plate 13 and the substrate 11 can be easily separated.

  The infrared absorbing material only needs to have a structure that is altered by absorbing infrared rays. For example, carbon black, iron particles, or aluminum particles can be suitably used. The infrared absorbing material absorbs light having a wavelength in a specific range depending on the type. By irradiating the separation layer 14 with light having a wavelength in a range that is absorbed by the infrared absorbing material used for the separation layer 14, the infrared absorbing material can be suitably altered.

[First sticking step]
As shown in FIG. 1 (f), in the first attaching step, the first support plate 13 and the substrate 11 are attached via the first adhesive layer 12. In the first attaching step, the first adhesive layer 12 and the separation layer 14 formed on the first support plate are overlapped by a pair of heated plate members so as to face each other under reduced pressure conditions. The first support plate 13 and the first support plate 13 may be bonded together. Thereby, the laminated body 50 can be formed. In the first pasting step, the pasting temperature, pasting pressure, and pasting time for pasting the substrate 11 and the first support plate 13 may be appropriately adjusted according to the type of the first adhesive.

  The laminated body 50 formed by the first sticking step is a laminated body in which the substrate 11, the first adhesive layer 12, the separation layer 14, and the first support plate 13 are laminated in this order. The stacked body 50 prevents the substrate 11 from being damaged by supporting the substrate 11 by the first support plate 13 in the process until the second support plate 23 is stacked on the stacked body 50.

[Adhesive peripheral part removal step 2]
As shown to (g) of FIG. 1, in the processing method which concerns on one Embodiment, the outer peripheral part of a 1st adhesive bond layer is removed after a 1st sticking process and before a 2nd sticking process.

  Thereby, the 1st adhesive bond layer 12 which protruded when the board | substrate 11 and the 1st support plate 13 were affixed in a 1st sticking process can be removed suitably. When the laminated body 50 is formed, by removing the outer periphery of the first adhesive layer 12 protruding from the laminated body 50, the adhesive layer is excessively protruded from the laminated body 100 formed in a later step. Can be prevented.

  In the adhesive outer peripheral portion removing step 2, the outer peripheral portion of the first adhesive layer 12 protruding from the laminate 50 is removed by the same method using the same solution as in the adhesive outer peripheral portion removing step 1. That's fine. Here, it is preferable to remove the outer peripheral portion of the first adhesive layer 12 on the substrate 11 with a width in the range of 0.0 mm or more and 1.0 mm or less inward from the outer peripheral edge of the substrate. . Further, when the first adhesive layer 12 is formed on the first support plate 13, the outer peripheral portion of the first adhesive layer 12 formed on the first support plate 13 may be removed. Here, on the first support plate 13 of the first adhesive layer 12, preferably in the range of 0.0 mm or more and 1.0 mm or less from the outer peripheral end of the first support plate 13 to the inside. It is preferable to remove the outer peripheral portion. Thereby, it can suppress suitably that a 1st adhesive bond layer protrudes in the latter 2nd sticking process. Moreover, since it can prevent that the edge part of the board | substrate 11 exposes too much from a 1st adhesive bond layer, it can prevent that the edge part of a board | substrate raise | generates a chipping in various subsequent processes.

  In addition, in this embodiment, although the outer peripheral part removal process 2 of the adhesive is performed before the thinning process of (a) of FIG. 2, it is not limited to this. If the outer peripheral part removal process 2 of an adhesive agent is after the laminated body 50 is formed, it can also be performed after the thinning process of (a) of FIG.

[Thinning process]
As shown in FIG. 2 (a), in the processing method according to one embodiment, the back surface of the substrate 11 on which the first support plate 13 is attached is attached after the first attaching step and before the second attaching step. It further includes a thinning step of thinning the facing surface. In the thinning step, for example, the substrate 11 is thinned by grinding with a grinder or the like. Thereby, the board | substrate 11 can be made into predetermined thickness.

[Second adhesive application step]
In the processing method according to the embodiment, before the second attaching step, an adhesive is applied to at least one of the substrate 11 and the second support plate (second support) to form the second adhesive layer 22. A second adhesive layer application step is further included.

  As shown in FIG. 2B, in one embodiment, the second adhesive layer 22 is applied on the substrate 11 thinned by performing a thinning step. In addition, the 2nd adhesive bond layer 22 can be performed on the board | substrate 11 by the method used in 1st adhesive bond layer application | coating processes, such as a spin coat. In the processing method according to the present invention, it is only necessary that the substrate 11 and the second support plate in the stacked body 50 can be bonded together via the second adhesive layer 22. Therefore, the second adhesive layer application step may be an embodiment in which an adhesive is applied to the second support plate.

(Second adhesive layer 22)
The second adhesive layer 22 bonds the substrate 11 and the second support plate 23 in the stacked body 50. Here, it can be used as a possible method for forming the second adhesive layer 22, a possible thickness of the second adhesive layer 22, and a second adhesive for forming the second adhesive layer 22. The kind of adhesive and the glass transition temperature are the same as those described for the first adhesive layer 12 described above. However, these matters may be the same in the first adhesive layer 12 and the second adhesive layer 22 or may be different from each other.

  In particular, the second adhesive layer 22 may be formed using the same adhesive as the first adhesive layer 12, or may be formed using an adhesive different from the first adhesive layer 12. . Here, when the adhesive forming the second adhesive layer 22 is different from the adhesive forming the first adhesive layer 12, the melting point of the adhesive forming the second adhesive layer 22 Is preferably lower than the melting point of the adhesive forming the first adhesive layer 12. Thereby, the laminated body 100 can be formed at a lower temperature in the second sticking step. Therefore, it is possible to prevent the first adhesive layer 12 from melting in the second sticking step.

[Adhesive outer peripheral part removing step 3]
As shown in FIG. 2C, in the treatment method according to one embodiment, the first adhesive layer 12 and the second adhesive are applied after the second adhesive application step and before the second application step. The outer peripheral portion of the layer 22 is removed.

  Thereby, it can prevent suitably that the 1st adhesive bond layer 12 and the 2nd adhesive bond layer 22 protrude from the laminated body 100 in a 2nd sticking process.

  In the outer peripheral portion removal step 3 of the adhesive, the outer peripheral portion of the second adhesive layer 22 formed on the substrate 11 by the same method using the same solution as in the outer peripheral portion removal steps 1 and 2 of the adhesive. Can be removed. Here, the first adhesion is preferably performed in the range from 0.0 mm to 3.0 mm, preferably from 0.5 mm to 1.5 mm inward from the outer peripheral edge of the substrate 11. It is preferable to remove the outer peripheral portion of the agent layer 12 on the substrate 11. In addition, the width of the outer peripheral portion of the second adhesive layer 12 to be removed may be appropriately adjusted according to the type of adhesive to be used, the coating amount, the type of substrate, and the like. When the second adhesive layer 22 is formed on the second support plate 23, the outer peripheral portion of the second adhesive layer 22 formed on the second support plate 23 may be removed. Here, from the outer peripheral edge of the second support plate 23 toward the inside, preferably 0.0 mm or more and 3.0 mm or less, preferably 0.5 mm or more and 1.5 mm or less in width. It is preferable to remove the outer peripheral portion of the one adhesive layer 12 on the second support plate 23.

  By removing the outer peripheral portion of the first adhesive layer 12, it is possible to suitably prevent the first adhesive layer 12 from protruding in the subsequent second sticking step, and the end of the substrate 11 becomes the first portion. It is possible to prevent chipping from being excessively exposed from one adhesive layer.

  Further, by removing the outer peripheral portion of the second adhesive layer 22, it is possible to prevent the adhesive that forms the second adhesive layer 22 from adhering to the first support plate 13 in the laminate 100. . Therefore, the first support plate 13 can be separated from the stacked body 100 without applying an excessive force after the separation layer 14 is irradiated with light in a subsequent separation step.

[Second separation layer forming step]
As shown in FIGS. 2D and 2E, the second separation layer forming step is a step of forming a separation layer 24 that is altered by irradiating light on one surface of the first support plate 13. The second adhesive layer coating step and the second separation layer forming step only have to be completed by the start of the second sticking step described below, and the order of performing both steps is not limited. You may implement a process in parallel.

(Second support plate 23)
The second support plate 23 is a support that supports the substrate 11. The second support plate 23 is affixed to the substrate 11 via the second adhesive layer 22.

  The second support plate 23 has a strength necessary to prevent the substrate 11 from being damaged or deformed during processes such as transporting the substrate 11 and flip-chip mounting, for example, to change the quality of the separation layer 14. Any material that transmits light may be used. From the above viewpoint, as the second support plate 23, like the first support plate 13, for example, one made of glass, silicon, or acrylic resin can be used.

  The second support plate has a separation layer 24 formed thereon. Here, the separation layer 24 is a layer formed from a material that is altered by absorbing light irradiated through the second support plate 23, and the separation layer 14 formed on the first support plate 13. It can be formed using the same material.

[Second sticking process]
As shown in (f) of FIG. 2, in the second attaching step, the second support plate 23 and the substrate 11 in the laminate 50 are attached via the separation layer 24 and the second adhesive layer 22.

  In the second sticking step, the second adhesive layer 22 formed on the substrate 11 of the laminate 50 and the separation layer 24 formed on the second support plate 23 face each other by a pair of heated plate members. You may laminate | paste together so that these may be pinched | interposed. Thereby, the laminated body 100 can be formed. In the second pasting step, the pasting temperature, pasting pressure, and pasting time for pasting the substrate 11 and the second support plate 23 may be appropriately adjusted according to the type of the second adhesive layer 22.

(Outer peripheral part removal step 4 of adhesive)
As shown in FIG. 2 (g), in the treatment method according to one embodiment, the outer peripheral portion of at least one of the first and second adhesive layers is removed after the second sticking step and before the separating step. .

  In the adhesive outer peripheral portion removing step 4, the first adhesive layer 12 or the second adhesive layer 12 protruding from the laminate 100 by the same method using the same solution as the adhesive outer peripheral portion removing steps 1 to 3. What is necessary is just to remove the outer peripheral part of an adhesive bond layer. Moreover, in the outer peripheral part removal process 4 of the adhesive, the first adhesive layer 12 or the second adhesive layer 12 or the second adhesive layer 22 depending on the degree of protrusion of the first adhesive layer 12 or the second adhesive layer 22 from the laminate 100. What is necessary is just to remove the outer peripheral part of the adhesive bond layer 22 suitably. Thereby, the excessive 1st adhesive bond layer 12 adhering to the 1st support plate 13 can be removed. Therefore, the first support plate 13 can be separated from the stacked body 100 without applying an excessive force after the separation layer 14 is irradiated with light in a subsequent separation step. Further, the substrate 11 can be suitably supported by the second support plate 23 via the second adhesive layer 22 while removing the excessive second adhesive layer 22 attached to the outer peripheral portion of the layered body 100. it can. Further, after separating the first support plate 13 and performing a desired treatment on the substrate 11 supported by the second support plate 23, the separation layer 24 is irradiated with light without applying excessive force. The substrate 11 can be separated from the second support plate 23.

(Laminated body 100)
An outline of the laminated body 100 formed by the processing method according to the embodiment will be described with reference to FIG. FIG. 3A is a view for explaining the outline of the laminate 100 formed by the processing method according to the embodiment of the present invention.

  As shown in FIG. 3A, the laminate 100 includes a first support plate 13, a first adhesive layer 12, a substrate 11, a second adhesive layer 22, a separation layer 24, and a second support plate 23. It is a laminated body formed by laminating in this order. Here, as shown to (a) of FIG. 3, as for the laminated body 100, the outer peripheral part of the 1st adhesive bond layer 12 and the 2nd adhesive bond layer 22 is removed. A separation layer 14 is formed between the first support plate 13 and the first adhesive layer 12.

[Separation process]
The separation process included in the processing method according to the embodiment will be described with reference to FIG. FIG. 4A is a diagram illustrating an outline of a cross section of the stacked body 100.

  As shown in FIG. 4B, in the separation step included in the processing method according to the embodiment, the separation layer 14 is irradiated with laser light that alters the separation layer 14.

  In the separation step, it is not necessary to dissolve the first adhesive layer 12 of the laminate 100 with the dissolving liquid. For this reason, the first support plate 13 can be separated from the laminate 100 without dissolving the second adhesive layer 22. Moreover, the isolation | separation layer 14 of the laminated body 100 can be denatured by irradiating light through the 1st support plate 13 ((c) of FIG. 4). Therefore, the first support plate 13 can be suitably separated from the laminated body 100 without applying a large force to the laminated body 100 ((d) in FIG. 4). For this reason, it is possible to prevent the substrate 11 and the second support plate 23 from being separated when the first support plate 13 is separated from the stacked body 100. For this reason, the board | substrate 11 can be suitably supported by the 2nd support plate 23 in processes, such as subsequent flip chip mounting.

  In addition, after a process such as flip chip mounting, the separation layer 24 is irradiated with light through the second support plate 23 to alter the separation layer 24, thereby applying an excessive force to the substrate 11 from the second support plate 23. It is possible to separate without giving.

Other Embodiment
The processing method according to the present invention is not limited to the above embodiment. For example, according to the application quantity of the adhesive agent which forms the 1st adhesive bond layer 12, and the adhesive agent which forms the 2nd adhesive bond layer 22, it can also be set as embodiment which does not perform the outer peripheral part removal process of an adhesive agent. it can.

  That is, the outer peripheral portion removal steps 1 to 4 of the adhesive include the application amount of the first adhesive layer 12, the degree of protrusion of the first adhesive layer 12 from the laminate 50, and the second adhesive layer 22. Whether or not to perform the application may be appropriately selected according to the amount of application, the degree of protrusion of the second adhesive layer 22 from the laminate 100, and the like.

  Here, the first adhesive layer 12 and the second adhesive layer 22 can be removed in one step by the outer peripheral portion removing step 3 of the adhesive, in the outer peripheral portion removing steps 1 to 4 of the adhesive. It is the most efficient and has the highest priority, and the outer peripheral portion removal steps 1, 2, and 4 may be performed arbitrarily. Moreover, you may perform only the outer peripheral part removal process 2 or only the outer peripheral part removal processes 2 and 3.

  A laminated body 100 ′ that does not perform the outer peripheral portion removal process of the adhesive will be described with reference to FIG. As shown in FIG. 3B, the separation layer 14 is formed on the first support plate 13 also in the stacked body 100 ′. Therefore, in the separation step, it is possible to alter the separation layer 14 by irradiating the separation layer 14 with light through the first support plate 13. Therefore, the first support plate 13 can be separated from the stacked body 100 ′.

  In the processing method according to still another embodiment, the separation layer 24 may not be formed on the second support plate 23. That is, the laminate may be formed such that the substrate 11 and the second support plate 23 are laminated via the second adhesive layer 22. In the present embodiment, after performing a process such as flip chip mounting on the substrate 11, the second support plate 23 and the substrate 11 may be separated by dissolving with a solvent used in the outer peripheral portion removing process of the adhesive. Here, if a hole penetrating in the thickness direction is provided in the second support plate, when the substrate 11 is peeled from the second support plate, the solvent is interposed between the support plate and the substrate through the hole. Can be poured. For this reason, a solvent can be efficiently made to contact the 2nd adhesive bond layer 22, and the 2nd adhesive bond layer 22 can be dissolved more suitably. For this reason, the board | substrate 11 can be easily peeled from the 2nd support plate.

  In another embodiment, in the first adhesive layer application step, the separation layer 14 of the first support plate 13 in which the separation layer 14 is formed is formed instead of applying the adhesive to the substrate 11. The first adhesive layer may be formed by applying an adhesive on the side surface. In the second adhesive layer application step, the second adhesive layer is formed by applying an adhesive to the second support plate instead of applying the adhesive to the substrate 11 in the laminate 50. Also good.

  The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

[Evaluation of separability of the first support plate]
As Examples 1-9, the first support plate, the separation layer, the first adhesive layer, the wafer substrate, the second adhesive can be obtained by changing the conditions of the combination of the adhesive compositions A to C and the pasting process. The laminated body provided with the layer and the 2nd support plate was formed, and the separability of the 1st support plate in each laminated body was evaluated.

(Formation of laminate)
Examples 1-9 were formed according to the conditions described in Table 1 by the following procedure.

First, the adhesive compositions A to C used for forming the first or second adhesive layer were prepared. The contents of the adhesive compositions A to C are as follows.
Adhesive composition A: TZNR (registered trademark) -A4005 (manufactured by Tokyo Ohka Kogyo Co., Ltd.)
Adhesive composition B: TZNR (registered trademark) -A4009 (manufactured by Tokyo Ohka Kogyo Co., Ltd.)
Adhesive composition C: TZNR (registered trademark) -A4012 (manufactured by Tokyo Ohka Kogyo Co., Ltd.)
Next, as described in Table 1, any one of the adhesive compositions A to C is spin-coated at a film thickness of 50 μm on a semiconductor wafer substrate (12 inches, silicon) (first adhesive layer coating step). , 90 ° C., 160 ° C., and 220 ° C. for 4 minutes each to form a first adhesive layer.

Next, a 12-inch glass support plate (thickness 700 μm) was used as the first support plate, and a separation layer was formed on the first support plate (first separation layer forming step). As the conditions for the first separation layer forming step, the separation layer is formed by performing a CVD method using C ₄ F ₈ as a reaction gas under the conditions of a flow rate of 400 sccm, a pressure of 700 mTorr, a high frequency power of 2500 W, and a film formation temperature of 240 ° C. A fluorocarbon film (thickness: 1 μm) was formed on the first support plate.

  Next, under vacuum, according to the first application temperature condition and application pressure condition described in Table 1, in each example, the first support plate, the separation layer, the first adhesive layer, and the wafer substrate are laminated in this order. Thus, the laminate was bonded together (first bonding step).

  Next, the back surface of the wafer substrate was thinned (50 μm) using a DISCO back grinder (thinning step). Further, according to the conditions described in Table 1, in each example, the adhesive composition was spin-coated on the thinned surface of the wafer substrate so as to have a film thickness of 50 μm (second adhesive layer coating). Step), and baked at 90 ° C., 160 ° C., and 220 ° C. for 4 minutes each.

  Next, only in the laminates of Examples 6 to 9, TZNR (registered trademark) HC thinner (manufactured by Tokyo Ohka Kogyo Co., Ltd.) was 10 cc / min with the EBR nozzle while rotating each laminate at 1,500 rpm. The outer peripheral part removal of the 2nd adhesive bond layer was performed by supplying for 5-15 minutes by supply amount (peripheral part removal process of an adhesive agent). In Table 1, “-” indicates that the outer peripheral portion of the second adhesive layer is not removed, and each length is the wafer substrate. It shows that the outer peripheral part removal of the 2nd adhesive bond layer was performed so that the width from the edge part of this to the edge part of the 2nd adhesive bond layer might become the length.

  Next, the surface of each laminate on the wafer substrate side and the second support plate are bonded via a second adhesive layer according to the second bonding temperature condition and the bonding pressure condition described in Table 1 under vacuum. A laminate was formed as described (second pasting step).

  About the laminated body of Examples 1-9 formed as mentioned above, the separation process which irradiates light to a separation layer via the 1st support plate was performed. As conditions for the separation step, the distance between the centers of irradiated regions in the laser pulse is set to the laminate of each example from the first support plate side, with the wavelength of the laser beam being 532 nm and the diameter of the laser beam being 180 μm. Laser light irradiation was performed at a repetition frequency of 40 kHz with a scanning speed of 7200 mm / s at 180 μm (separation step). Then, about each laminated body, the separability from the laminated body of a 1st support plate was evaluated.

(result)
The first support plate could be separated by the weight of the laminated body without applying a large force to any of the laminated bodies of Examples 1 to 9.

  The present invention can be widely used, for example, in a manufacturing process of a miniaturized semiconductor device.

11 Substrate 12 First Adhesive Layer 13 First Support Plate (First Support)
14 Separation layer 22 Second adhesive layer 23 Second support plate (second support)
100 Laminate

Claims (6)

A first pasting step of pasting a substrate through a first adhesive layer on the surface of the first support provided with the separation layer that is altered by light irradiation;
After the first pasting step, a second pasting step of pasting the second support through a second adhesive layer on the surface facing away from the surface of the substrate on which the first support is pasted,
A treatment method comprising a separation step of separating the first support and the substrate by altering the separation layer by irradiating the separation layer with light after the second sticking step. Before the second sticking step, including a second adhesive layer coating step of forming a second adhesive layer by applying an adhesive to at least one of the substrate and the second support,
The processing method according to claim 1, wherein after the second adhesive application step and before the second sticking step, the outer peripheral portions of the first adhesive layer and the second adhesive layer are removed. . Before the first application step, including a first adhesive application step of forming an adhesive layer by applying an adhesive to at least one of the first support and the substrate;
The processing method according to claim 1 or 2, wherein an outer peripheral portion of the first adhesive layer is removed after the first adhesive application step and before the first sticking step.   The process according to any one of claims 1 to 3, wherein at least one outer peripheral portion of the first and second adhesive layers is removed after the second sticking step and before the separating step. Method.   The method further includes a thinning step of thinning a surface facing away from a surface of the substrate to which the first support is attached after the first attaching step and before the second attaching step. Item 5. The processing method according to any one of Items 1 to 4.   6. The processing method according to claim 1, wherein in the separation step, the separation layer is irradiated with a laser beam that alters the separation layer.

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