JP2015097182A - Lighting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high wattage output lighting device which inhibits temperature rise and reduces design costs.SOLUTION: A lighting device 1 includes: a light emitting module 11 formed by multiple LEDs; a lighting circuit 13 which supplies electric power to the light emitting module 11; a cylindrical housing 17 which houses the lighting circuit 13; and a mouth piece 18 which receives external electric power. The lighting circuit 13 includes multiple circuit units 130A to 130D, which are connected with each other in a parallel manner, between the mouth piece 18 and the light emitting module 11. The circuit units 130a to 130D respectively have a circuit configuration for inputting the external electric power from the mouth piece 18 and outputting the electric power, which is converted into a predetermined current and a predetermined voltage, to LED modules 110A to 110D. The circuit units 130A to 130D have the same circuit configuration.

Description

  The present invention relates to a lighting device.

  Solid light-emitting elements such as light emitting diodes (LEDs) are expected to serve as light sources for various products because of their small size, high efficiency, and long life. Among them, in recent years, research and development of LED lighting devices using LEDs have been promoted.

  For example, Patent Document 1 discloses an HID type LED lighting apparatus that replaces an existing HID (High Intensity Discharge) lamp. The HID type lighting device is used by being attached to a ceiling surface of a gymnasium, a factory, a warehouse, or the like, for example.

JP2012-14900A

  The HID type lighting device includes, for example, a cylindrical casing, a base attached to the casing, and an LED module disposed on the base, and is configured to irradiate the floor surface. Has been. In the HID type LED lighting device, for example, the LED module requires a high wattage output of about 40 W in order to cope with the output of the existing HID lamp. In this case, the temperature rise of the LED module is larger than that of a 10 W class LED module used in a domestic LED lighting device. Therefore, for example, a heat resistant design of each constituent member is important, including a member whose optical characteristics are easily affected by a temperature rise, such as an optical member constituting an LED lighting device with a high wattage output specification.

  However, the design for setting each component to the specifications of high wattage output required for the HID type is complicated, and requires design cost because it requires time and labor.

  The present invention has been made to solve such a problem, and an object of the present invention is to provide a lighting device having a high wattage output specification in which a rise in temperature is suppressed and design cost can be reduced.

  In order to achieve the above object, one aspect of a lighting fixture according to the present invention includes a light emitting unit composed of a plurality of light emitting elements, a lighting circuit that supplies power to the light emitting unit, and a cylinder that houses the lighting circuit. Each of the plurality of circuit units includes a plurality of circuit units connected in parallel to each other between the base and the light emitting unit. Has a circuit configuration for inputting the external power received by the base and outputting the power converted into a predetermined current and voltage to a part of the plurality of light emitting elements, and the plurality of circuit units are all the same. It has the said circuit structure, It is characterized by the above-mentioned.

  In the illumination device according to the aspect of the invention, the light emitting unit may include n (n is an integer of 2 or more) light emitting units including the same number of light emitting elements, and the plurality of circuit units may include n. Each of the plurality of circuit units may output power to different light emitting units.

  In one aspect of the lighting device according to the present invention, each of the plurality of circuit units includes a plurality of electronic components and a circuit board having a mounting surface on which the plurality of electronic components are mounted. The circuit unit may be arranged such that the mounting surface faces in the circumferential direction with respect to the cylindrical axis of the casing.

  The lighting device according to the aspect of the invention may further include a circuit case that is housed in the housing and houses the plurality of circuit units, wherein at least one of the plurality of electronic components is a thermally conductive resin. It may be joined to the circuit case via a pin.

  Further, in one aspect of the lighting device according to the present invention, the electronic component joined to the circuit case via the thermally conductive resin may be an electrolytic capacitor.

  Moreover, in one aspect of the illumination device according to the present invention, it is further provided with a light concentrating element arranged to face the light emitting unit in front of light emission from the light emitting unit and close the opening of the housing. Also good.

  Moreover, in one aspect of the lighting device according to the present invention, the power supply timing is further connected to each of the plurality of circuit units and controlled from each of the plurality of circuit units to each of the plurality of light emitting units. Thus, a lighting control circuit that varies the light emission timing of each of the plurality of light emitting units may be provided.

  In the lighting device according to the aspect of the invention, the circuit unit may be connected to each of the plurality of circuit units, and the presence or absence of power supply from each of the plurality of circuit units to each of the plurality of light emitting units. It is good also as providing the lighting control circuit which controls the light emission amount of the said light emission part by making each light-emitting unit turn on / off for every light emission unit by controlling every.

  According to the illumination device of the present invention, it is possible to configure a high-watt lighting circuit by arranging a plurality of small-scale lighting circuits having the same circuit configuration built in the low-watt LED lamp. As a result, the design can be simplified without reducing the driving efficiency even in the high wattage driving region. Therefore, the temperature rise is suppressed and the design cost can be reduced.

It is an external appearance perspective view when the illuminating device which concerns on embodiment of this invention is seen from diagonally upward. It is sectional drawing at the time of cut | disconnecting the illuminating device which concerns on embodiment of this invention in the XZ plane which passes along a lamp | ramp axis | shaft. It is a disassembled perspective view which shows the internal structure of the illuminating device which concerns on embodiment of this invention. It is a circuit diagram of the step-down converter type circuit unit according to the embodiment. 1 is a circuit diagram of a buck-boost type circuit unit according to an embodiment. FIG. It is a block diagram showing the connection relation of the lighting circuit and lighting control circuit which concern on the modification of embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, each of the embodiments described below shows a preferred specific example of the present invention. Therefore, numerical values, shapes, materials, components, arrangement positions and connection forms of components, steps (steps) and order of steps, and the like shown in the following embodiments are examples and limit the present invention. It is not the purpose to do. Therefore, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims showing the highest concept of the present invention are described as optional constituent elements.

  Each figure is a schematic diagram and is not necessarily illustrated strictly. Moreover, in each figure, the same code | symbol is attached | subjected to the substantially same structure, The overlapping description is abbreviate | omitted or simplified.

(Embodiment)
First, the structure of the illuminating device 1 which concerns on embodiment of this invention is demonstrated using FIGS. 1-3.

  FIG. 1 is an external perspective view of an illumination device according to an embodiment of the present invention when viewed obliquely from above. FIG. 2 is a cross-sectional view of the lighting device according to the embodiment of the present invention cut along an XZ plane passing through the lamp axis. FIG. 3 is an exploded perspective view showing the internal configuration of the lighting apparatus according to the embodiment of the present invention.

  1 to 3, the Z-axis direction is the vertical direction, the direction indicated by the Z-axis arrow is upward, and the opposite direction is downward. In FIG. 3, screws and wiring are omitted.

  The lighting device 1 according to the present embodiment is a high-wattage lighting device that replaces an HID lamp, and is attached to a mounting surface (such as a high ceiling surface) of a construction material such as a gymnasium, a factory, or a warehouse. Used. In this case, the illumination device 1 emits light mainly upward so as to irradiate the upper surface (floor surface or the like).

  As illustrated in FIGS. 1 to 3, the lighting device 1 includes a light emitting module 11, a base 12, a lighting circuit 13, a lens member 14, a reflecting member 15, a circuit case 16, a housing 17, A base 18 and a seal member 19 are provided. In FIG. 2, the alternate long and short dash line drawn along the Z-axis direction indicates the lamp axis J of the lighting device 1. The lamp axis J is an axis that serves as a rotation center when the lighting device 1 is attached to a socket (socket), and coincides with the rotation axis of the base 18. Hereinafter, each component will be described.

[Light emitting module]
The light emitting module 11 is a light emitting unit composed of a plurality of LEDs, and is composed of four LED modules 110A to 110D. The LED module 110A is a light emitting unit including a substrate 111A, a plurality of LEDs 112A, a connector 113A, and a sealing member 114A. The other LED modules 110B to 110D have the same number of LEDs as the LED module 110A and have the same configuration. In the present embodiment, each of the LED modules 110A to 110D is an LED module built in an LED lamp for low wattage, and the LED modules 110A, 110B, 110C, and 110D have the same specifications and the same performance. As a result, the same LED modules 110A to 110D built in the existing low watt LED lamps are arranged to constitute the light emitting module 11 for high watts. Therefore, the effort to newly design the LED module for high watts is reduced. Can be reduced. Therefore, the design cost can be reduced.

  In this embodiment, low watts are defined as a range of 0 W or more and less than 10 W, and high watts are defined as indicating 10 W or more.

  The LED module 110A has a COB structure in which a bare LED 112A is directly mounted on a substrate 111A. The LED module 110A is disposed on the upper surface of the base 12 via the substrate 111A.

  Examples of the substrates 111A to 111D include a ceramic substrate made of ceramics such as alumina, a metal base substrate (metal substrate) in which a metal plate such as aluminum is coated with an insulating film, a resin substrate made of resin, or a glass substrate. It is an insulating substrate. Metal wiring (not shown) patterned in a predetermined shape is formed on the surfaces of the substrates 111A to 111D to supply power to the LED module. Moreover, although the shape of board | substrate 111A-111D is made into the rectangular shape, it is not restricted to this.

  The LEDs 112 </ b> A to 112 </ b> D are light emitting elements of the lighting device 1. A plurality of (for example, 26) LEDs 112A to 112D are mounted on the upper surfaces of the substrates 111A to 111D, respectively. For example, the plurality of LEDs 112A mounted on the substrate 111A are electrically connected by metal wiring or wires formed on the substrate 111A. The LED 112A is an example of a light emitting element, and is a semiconductor light emitting element that emits light with a predetermined power. Each of the LEDs 112A is a bare chip that emits monochromatic visible light. In this embodiment, the LED 112A is a blue LED chip that emits blue light when energized.

  The sealing member 114A is provided on the substrate 111A so as to cover the plurality of LEDs 112A at once. The other sealing members 114B to 114C have the same configuration. The sealing members 114A to 114D are made of a translucent material mixed with a wavelength conversion material. As the translucent material, for example, a silicone resin can be used.

  Sealing members 114 </ b> A to 114 </ b> D in the present embodiment include a phosphor as a wavelength conversion material, and converts the wavelength (color) of light emitted from LEDs 112 </ b> A to 112 </ b> D. For example, when the LEDs 112 </ b> A to 112 </ b> D obtain white light with a blue LED chip, a phosphor-containing resin in which a yellow phosphor such as YAG is dispersed in a silicone resin can be used as the sealing members 114 </ b> A to 114 </ b> D. Thereby, a part of the blue light emitted from the LEDs 112A to 112D is converted into yellow light by the yellow phosphor, and the yellow light and the other part of the blue light are mixed, whereby the sealing members 114A to 114D. Emits white light.

  Connectors 113A to 113D electrically connected to the LEDs 112A to 112D are mounted on the substrates 111A to 111D, respectively, by wiring patterns (not shown) disposed on the lower surface (the surface opposite to the mounting surface).

  In addition, as above-mentioned, the light emitting module 11 does not need to use four LED modules of the same specification. The number of LED modules to be arranged may be determined according to the output specification of the high watt lamp and the output specification of the low watt lamp to be diverted. Moreover, you may design the light emitting module 11 as one LED module newly according to the output specification. As a result, the design cost of the LED module cannot be reduced, but optical characteristics such as light extraction efficiency and light distribution characteristics can be optimized.

[Base]
As shown in FIG. 3, the base 12 has a substantially disc shape, and is a plate-like member in which the light emitting module 11 is placed at a substantially center of a substantially circular upper surface. The base 12 is a module plate (MP) for mounting the four LED modules 110A to 110D. In the present embodiment, four module mounting areas (a square recess formed in the center) are secured on the upper surface of the base 12, and the four LED modules are fixed to the base 12. ing. In the present embodiment, from the viewpoint of light distribution, the LED modules 110A to 110D are arranged so as to be point-symmetric with respect to the lamp axis J.

  Examples of a method for fixing the light emitting module 11 to the base 12 include a method using screwing, adhesion, and a locking structure.

  As shown in FIG. 3, the base 12 is formed with a notch for inserting the wiring from the lighting circuit 13.

  The base 12 is a disk-shaped member made of a material having high thermal conductivity. Examples of the material of the base 12 include a pure metal composed of a single metal element such as aluminum, magnesium, tin, zinc, indium, iron, copper, silver, nickel, rhodium, palladium, and an alloy composed of a plurality of metal elements. And alloys composed of metallic elements and nonmetallic elements. As an example, the thickness of the base 12 is 1.0 to 5.0 mm. Metal materials are particularly advantageous in that they have a high thermal conductivity and can be easily manufactured using press working.

  Examples of the material of the base 12 include highly heat conductive resin materials such as polypropylene, polypropylene sulfide, polycarbonate, polyetherimide, polyphenylene sulfide, polyphenylene oxide, polysulfone, polybutylene terephthalate, polyamide, polyethylene terephthalate, Examples include polyether sulfone and polyphthalamide. Moreover, you may mix the filler which has heat conductivity in these heat conductive materials.

  Examples of the thermally conductive filler include glass, silicon oxide, beryllium oxide, aluminum oxide, magnesium oxide, zinc oxide, silicon nitride, boron nitride, titanium nitride, aluminum nitride, diamond, graphite, silicon carbide, titanium carbide, and boride. Consists of inorganic materials such as zirconium, phosphorus boride, molybdenum silicide, beryllium sulfide, aluminum, tin, zinc, indium, iron, copper, silver, or alloys made of two or more of these metal materials It is also possible to use fillers. Further, a plurality of these fillers may be used in combination.

  The planar view shape of the base 12 is not limited to a circular shape, and may be a polygonal shape such as a square, a pentagon, or a hexagon according to the shape of the housing 17.

[Lighting circuit]
The lighting circuit 13 is a circuit that supplies power to the light emitting module 11 and is a drive circuit that receives power via the base 18 and causes the LED modules 110 </ b> A to 110 </ b> D to emit light. The lighting circuit 13 includes four circuit units 130 </ b> A to 130 </ b> D corresponding to four LED modules, and the circuit units 130 </ b> A to 130 </ b> D are connected in parallel between the base 18 and the light emitting module 11. Each of the circuit units 130 </ b> A to 130 </ b> D has a circuit configuration in which external power is input from the base 18 and power converted into a predetermined current and voltage is output to the LED modules 110 </ b> A to 110 </ b> D. Here, the light emitting module 11 has four light emitting units composed of the same number of LEDs, the lighting circuit 13 has four circuit units, and any two different circuit units among the circuit units 130A to 130D. Supplies power to different light emitting units. That is, the circuit unit 130A supplies power to the LED module 110A, the circuit unit 130B supplies power to the LED module 110B, the circuit unit 130C supplies power to the LED module 110C, and the circuit unit 130D supplies power to the LED module 110D. Supply. According to the above configuration of the lighting circuit 13, the maximum power that the lighting circuit 13 outputs to the light emitting module 11 is larger than the maximum power that each of the circuit units 130A to 130D outputs to the LED modules 110A to 110D. More specifically, the maximum power that the lighting circuit 13 outputs to the light emitting module 11 is about four times the maximum power that the circuit unit 130A outputs to the LED module 110A.

  The circuit unit 130A is disposed on the circuit board 135A, a plurality of electronic components 131A, 132A, and 133A mounted on the mounting surface of the circuit board 135A, and the wiring surface (surface opposite to the mounting surface) of the circuit board 135A. And a wiring pattern (not shown). In the drawings, only some of the electronic components are denoted by reference numerals “131A”, “132A”, and “133A”. For example, the electronic component 131A is a transformer, the electronic component 132A is a coil, and the electronic component 133A is a capacitor. The other circuit units 130B to 130D have the same configuration. The wiring surface is not necessarily the surface opposite to the mounting surface, and may be the same as the mounting surface. That is, the surface on which the component is mounted and the surface on which the wiring pattern is formed may be the same.

  In the present embodiment, each of the circuit units 130A to 130D is a lighting circuit built in an existing low-watt LED lamp, and the circuit units 130A, 130B, 130C, and 130D all have the same circuit configuration, Same specifications and performance. Thereby, the circuit unit 130A-130D which is the same circuit built in the existing low watt LED lamp is arrange | positioned, and the lighting circuit 13 for high watts is comprised. Therefore, it is possible to reduce the labor for newly designing a lighting circuit for high wattage. Therefore, the design cost can be reduced.

  In addition, electronic components for high wattage are expensive, and when driving from low output to high output with electronic components mounted on one circuit unit, it is not possible to obtain linear input / output characteristics over a wide dynamic range. It is difficult, and input / output characteristics are deteriorated particularly in a high output range. As the input / output characteristics in the high output range deteriorate, the amount of heat generated from the electronic component increases.

  On the other hand, according to the lighting device 1 according to the present embodiment, a plurality of small-scale lighting circuits having the same circuit configuration built in the existing low-watt LED lamp are arranged to provide the high-watt lighting circuit 13. It is composed. That is, the operation in the high watt drive region is realized by adding the outputs of the four circuit units that perform the operation in the low watt drive region. Therefore, since the driving efficiency of the lighting circuit is not reduced even in the high watt drive region, unnecessary heat generation can be suppressed and temperature rise in the apparatus can be suppressed. The circuit operation of the circuit unit will be described later.

  Moreover, in the conventional high wattage lighting device, if a lighting circuit fails, there is a high possibility that the failure will affect the lighting operation of all LED modules, and there is a high risk that the LED will be completely turned off.

  On the other hand, the illuminating device 1 which concerns on this Embodiment is provided with four circuit units 130A-130D and LED module 110A-110D corresponding to them one to one. Therefore, even if the lighting circuit 13 fails, when only one of the circuit units fails, the other normally operated circuit units and LED modules that are arranged separately are kept lit, so that the lighting device is completely turned off. Without illuminating, the lighting state can be maintained although the illuminance decreases.

  The circuit units 130 </ b> A to 130 </ b> D are accommodated in the circuit case 16. Specifically, the circuit units 130A to 130D face each other such that the wiring surfaces of the circuit boards 135A to 135D surround the lamp shaft, and the mounting surfaces of the circuit boards 135A to 135D face the inner surface of the circuit case 16, respectively. So that it is held. Here, as will be described later, the circuit case 16 is accommodated in the housing 17 with the central axes thereof aligned. Therefore, in the above arrangement of the circuit boards 135A to 135D, the wiring surfaces of the circuit boards 135A to 135D are directed to the lamp axis J (center axis), and the mounting surfaces of the circuit boards 135A to 135D are the cylindrical axis (center of the casing 17). It can also be said that they are arranged so as to face in the circumferential direction with respect to (axis).

  Further, as shown in FIG. 3, the circuit units 130 </ b> A to 130 </ b> D are elongated, and are arranged so that the longitudinal direction of each circuit unit is along the lamp axis J. The circuit units 130 </ b> A to 130 </ b> D are arranged so as to be point symmetric in plan view with respect to the lamp axis J. With such an arrangement, the diameter of the lighting device 1 can be reduced. The circuit boards 135 </ b> A to 135 </ b> D each have an upper end that is widened and contracted downward according to the shape of the circuit case 16. Further, the mounting surfaces of the circuit boards 135A to 135D are oriented in the circumferential direction with respect to the lamp axis, and are arranged so as to face the inner surface of the circuit case 16, that is, from the circuit unit. The heat dissipation efficiency is improved.

  Here, when the lighting circuit for high watts is constituted by one circuit unit, the shape of the circuit board, electronic components, and the like become large, and the layout of the lighting circuit in the housing is restricted.

  On the other hand, according to the lighting device 1 according to the present embodiment, a plurality of small-scale lighting circuits having the same circuit configuration built in the existing low-watt LED lamp are arranged to provide the high-watt lighting circuit 13. It is composed. That is, a small circuit board or electronic component of each circuit unit is used. Therefore, the degree of freedom of the circuit unit layout is improved. Further, in the structure of the lighting device 1 according to the present embodiment, the lighting circuit 13 is disposed between the light emitting module 11 and the base 18. In this case, an electronic component with a small amount of heat generation is arranged on the light emitting module 11 side (upward), and an electronic component with a large amount of heat generation is arranged on the base 18 side (downward), thereby suppressing a decrease in optical performance and heat dissipation efficiency. ing. Even in such a mounting layout in consideration of heat dissipation, it is advantageous that the lighting circuit 13 for high watts is configured by arranging a plurality of the small-scale lighting circuits.

  In addition, you may join the electronic component mounted in the mounting surface of circuit board 135A-135D, and the inner surface of the circuit case 16 via resin with high heat conductivity. Furthermore, the space between the mounting surfaces of the circuit boards 135A to 135D and the inner surface of the circuit case 16 may be filled with a resin having high thermal conductivity. As a result, the heat dissipation efficiency from the circuit unit is further improved. Further, the electronic component joined to the circuit case 16 via the heat conductive resin may be an electrolytic capacitor. As a result, a heat conduction path from the electrolytic capacitor to the circuit case 16 where the amount of generated heat is increased by continuing charging and discharging during the light emission period of the light emitting module 11 further improves the heat dissipation efficiency from the circuit unit. To do.

  Although not shown, the lighting circuit 13 and the light emitting module 11 are electrically connected by four pairs of wires. For example, two wires as one wire pair are both led out above and below the base 12 through the notches of the base 12, and the connector at the upper end of the wire pair is connected to the connector 113A on the board 111A. Is electrically connected to the LED module 110A. Further, the lower end of the wire pair and the output terminal of the circuit unit 130A are electrically connected by, for example, solder. The electrical connection between the connectors 113B to 113D and the output terminals of the circuit units 130B to 130D is the same.

  Further, as shown in FIG. 2, the lighting circuit 13 and the base 18 are electrically connected by another four sets of wiring pairs 134 </ b> A to 134 </ b> D. For example, the upper end of the wiring pair 134A is electrically connected to the input terminal of the circuit unit 130A by, for example, solder. The lower end of the wiring pair 134 </ b> A is connected to the base 18 through the lower end opening provided in the circuit case 16. Specifically, one wiring of the wiring pair 134 </ b> A is electrically connected to the eyelet part 181 of the base 18, and the other wiring is electrically connected to the shell part 183 of the base 18. The same applies to the electrical connection between the base 18 and the output terminals of the circuit units 130B to 130D.

  The four wires of the wire pairs 134A to 134D electrically connected to the eyelet portion 181 of the base 18 are provided with one connection point by electrically connecting the four wires with solder or a connector. And the eyelet portion 181 may be electrically connected.

  Further, the number of circuit units is not limited to the above four. The present invention only needs to have two or more circuit units having the same circuit configuration.

  Moreover, although the light emitting module 11 which concerns on this Embodiment was comprised with LED module 110A-110D of the same specification and the same performance, this invention is not limited to this. The light emitting module of this invention may be comprised with one LED module. However, in this case, an LED that receives power from any one of the circuit units 130A to 130D is disposed for each circuit unit. In other words, at least as many LEDs as the number of circuit units are arranged in one LED module.

[Circuit configuration]
Here, an example of the circuit configuration of the circuit units 130A to 130D constituting the lighting circuit 13 will be described.

  4A is a circuit diagram of the step-down converter type circuit unit according to the embodiment, and FIG. 4B is a circuit diagram of the buck-boost type circuit unit according to the embodiment. The circuit unit according to the present embodiment may be a step-down converter type or a buck-boost type. 4A and 4B exemplify circuit diagrams including the circuit unit 130A, the circuit units 130B to 130D are also represented by similar circuit diagrams.

  4A and 4B, the circuit unit 130A includes a rectifying / smoothing circuit 32 connected to the external AC power supply 31 via the base 18, an oscillation control unit 34, a diode 35, an inductor 36, and a capacitor 37. With. The circuit unit 130A is a drive circuit that converts alternating current power into direct current power and supplies direct current power corresponding to the dimming signal to the plurality of LEDs 112A connected in series.

  First, a step-down converter type circuit unit will be described. For example, the anode side of the plurality of LEDs 112 </ b> A is connected to the positive output terminal of the rectifying / smoothing circuit 32 and the cathode of the diode 35. The external AC power supply 31 outputs AC having an effective voltage value of 100V, for example. A dimmer for adjusting the luminance or the like of the light emitting module 11 may be connected between the external AC power supply 31 and the rectifying / smoothing circuit 32.

  The rectifying / smoothing circuit 32 has a rectifying function and a smoothing function, and includes a rectifying unit configured by a diode bridge and a smoothing unit configured by a capacitor. The capacitor is, for example, an electrolytic capacitor, and may be a high dielectric constant ceramic capacitor, a film capacitor, or the like.

  The oscillation control unit 34 supplies a pulse signal (hereinafter, referred to as “PWM signal”) having a rectangular wave voltage waveform for driving the switch element 342 by PWM control to the gate of the switch element 342. Then, the pulse width of the PWM signal is adjusted so that the drain current flowing through the switch element 342 becomes constant. Here, when the pulse width of the PWM signal is changed, the ratio of the period during which the switch element 342 is maintained in the on state (on duty) changes.

  The switch element 342 is made of, for example, an N-channel MOSFET, and has a source connected to the negative terminal of the rectifying / smoothing circuit 32 and a drain connected to the inductor 36. The on / off timing of the switch element 342 is determined by the dimming signal.

  When the switch element 342 is in the ON state, a current flows through the positive output terminal of the rectifying / smoothing circuit 32, the LED 112A, the inductor 36, the switch element 342, and the negative output terminal of the rectifying / smoothing circuit 32 in this order. In this state, the LED 112 </ b> A emits light and magnetic energy is accumulated in the inductor 36.

  On the other hand, when the switch element 342 is in the OFF state, the current flowing out from the inductor 36 flows through a path returning to the inductor 36 through the diode 35 and the LED 112A in this order. In this state, the LED 112A emits light.

  Next, a buck-boost type circuit unit will be described. The cathode of the diode 35 and the inductor 36 are connected to the positive output terminal of the rectifying / smoothing circuit 32. Further, the cathode side of the plurality of LEDs 112 </ b> A is connected to the anode of the diode 35.

  The oscillation control unit 34 supplies a pulse signal (hereinafter, referred to as “PWM signal”) having a rectangular wave voltage waveform for driving the switch element 342 by PWM control to the gate of the switch element 342. Then, the pulse width of the PWM signal is adjusted so that the drain current flowing through the switch element 342 becomes constant. Here, when the pulse width of the PWM signal is changed, the ratio of the period during which the switch element 342 is maintained in the on state (on duty) changes.

  The switch element 342 is made of, for example, an N-channel MOSFET, and has a source connected to the negative terminal of the rectifying and smoothing circuit 32 and a drain connected to the inductor 36 and the anode side of the plurality of LEDs 112A. The on / off timing of the switch element 342 is determined by the dimming signal.

  When the switch element 342 is in the ON state, a current flows through the positive output terminal of the rectifying / smoothing circuit 32, the inductor 36, the switch element 342, and the negative output terminal of the rectifying / smoothing circuit 32 in this order. In this state, magnetic energy is stored in the inductor 36.

  On the other hand, when the switch element 342 is in the OFF state, the current flowing out from the inductor 36 flows through the LED 112 </ b> A and the diode 35 in this order and returns to the inductor 36. In this state, the LED 112A emits light.

  As described above, the circuit unit 130A has a circuit configuration in which external AC power is input from the base 18 and power converted into a predetermined current and voltage is output to the plurality of LEDs 112A. The circuit units 130A to 130D all have the same circuit configuration.

[Lens material]
The lens member 14 is a light-transmitting disk-shaped member disposed in front of the light emitting module 11 in front of light emission from the light emitting module 11, and is a condensing element disposed so as to close the upper end opening of the housing 17. It is an element. The lens member 14 irradiates the light from the light emitting module 11 by collimating, condensing or diffusing the light in the emission direction. Specifically, as shown in FIG. 2, the periphery of the lens member 14 is joined to the upper end 170 c that constitutes the upper end opening of the housing 17, thereby sealing the light emitting module 11.

  The lens member 14 is made of, for example, a translucent resin material or glass. As the resin material, acrylic resin such as PMMA, polyethylene terephthalate (PET), polycarbonate (PC), or the like can be used.

  The inner surface 140a of the lens member 14 is formed with a lens for irradiating the light emitted from the LEDs 112A to 112D by collimating or condensing the light emitted in the emission direction. In the present embodiment, a Fresnel lens is formed on the inner surface 140 a of the lens member 14. The light emitted from the light emitting module 11 enters the inner surface of the lens member 14, passes through the lens member 14, and is irradiated to the outside of the lens member 14.

  The lens member 14 is attached to the upper end portion 170 c of the housing 17. In order to join the lens member 14 and the upper end portion 170c, a circumferential rib is formed on the peripheral portion of the lens member 14, and the rib is fitted in the groove of the upper end portion 170c of the housing 17. Thus, the housing 17 and the lens member 14 are bonded to each other using an adhesive such as a silicone-based adhesive.

  For the lens member 14 having the light condensing function as described above, the optimum material for ensuring the optical characteristics is selected, and therefore, it is assumed that the flame retardancy is not considered much. From this point of view, in a lighting device with a high wattage output specification, the temperature rise inside the housing affects the specification of the lens member.

  As described above, in the lighting device 1 according to the present embodiment that realizes high watt drive using a circuit unit for low watt drive, unnecessary heat generation can be suppressed, and temperature rise in the device can be suppressed. Is possible. Therefore, a lens member can be selected based on optical performance rather than heat resistance, and the degree of freedom in selecting an optical member is improved.

  In addition, the lens member 14 should just be a translucent member arrange | positioned ahead of the emission of the light from the light emitting module 11, and the lens function which condenses, condenses or diffuses the light from the light emitting module 11 in an output direction. May not be included.

[Reflection member]
The reflecting member 15 is a reflecting plate having a reflecting function, and is an incident port that is an opening through which light from the light emitting module 11 is incident, and an emitting port that is an opening through which light incident from the incident port is emitted from the reflecting member 15. And have. The reflecting member 15 has an annular frame shape (funnel shape) configured such that the inner diameter gradually increases from the incident port toward the output port.

  The inner peripheral surface 150 a of the reflecting member 15 is a reflecting surface that reflects light from the light emitting module 11. The inner peripheral surface 150a is configured to reflect the light incident from the incident port and emit it from the output port, and to guide the light bounced off by the lens member 14 to the output port again.

  The reflecting member 15 may be formed of a metal material such as aluminum instead of a hard white resin material. Alternatively, a metal vapor deposition film (metal reflection film) made of a metal material such as silver or aluminum may be formed on the inner surface of the resin reflection member 15 as a reflection surface.

  The reflecting member 15 is fixed to the casing 17 by suspending ribs 150 b formed on the periphery of the reflecting member 15 on the ribs of the upper end portion 170 c of the casing 17. In this state, the lower end opening located at the lower end of the funnel-shaped inner peripheral surface 150 a is located above the base 12.

The reflecting member 15 is made of, for example, a resin material or a metal. As the resin material, acrylic resin such as PMMA, polyethylene terephthalate (PET), polycarbonate (PC), polybutylene terephthalate (PBT), or the like can be used. A reflective member using PBT or PC has heat resistance and high reflectance, and further, a flame retardant grade can be selected. A reflective film may be formed on the inner peripheral surface 150a in order to increase the reflectance. For example, a reflective film having a high reflectivity for visible light is formed. The reflective film can be formed of a material containing a metal or a metal compound, for example. More specifically, in addition to a metal such as aluminum or chromium, any one of silicon dioxide (SiO ₂ ), titanium dioxide (TiO ₂ ), magnesium fluoride (MgF ₂ ), zinc sulfide (ZnS), etc. is deposited. Vapor deposited films can be used.

  In addition, the illuminating device 1 which concerns on this invention does not need to be provided with the reflection member 15. FIG.

[Circuit case]
As shown in FIGS. 2 and 3, the circuit case 16 is a cylindrical housing that is housed in the housing 17 and houses the circuit units 130 </ b> A to 130 </ b> D. That is, the circuit case 16 is disposed between the circuit units 130 </ b> A to 130 </ b> D and the housing 17. The circuit case 16 is arranged so that the cylinder axis coincides with the lamp axis J. Further, the inner surface of the circuit case 16 is disposed so as to face the mounting surfaces of the circuit boards 135A to 135D.

[Base]
The base 18 is a member that receives external power from a socket (socket) of a lighting fixture and transmits the external power to the lighting circuit 13 when the lighting device 1 is turned on. The base 18 is electrically connected to the circuit units 130 </ b> A to 130 </ b> D via the wiring pairs 134 </ b> A to 134 </ b> D. The base 18 is attached so as to close the lower end opening of the circuit case 16. The type of the base 18 is not particularly limited, but an E39 type E39 base is used in the present embodiment. The base 18 includes a shell portion 183 having a substantially cylindrical shape and an outer peripheral surface being a male screw, and an eyelet portion 181 attached to the shell portion 183 via an insulating portion 182.

[Seal member]
The seal member 19 is interposed between the lower surface of the flange-like protruding portion at the upper end portion of the circuit case 16 and the upper surface of the step portion of the housing 17. The seal member 19 is a ring-shaped elastic member that circulates around a circumferential joint surface between the circuit case 16 and the housing 17, and the light emitting module 11 and the base 12 are fastened to the housing 17 together with the circuit case 16 by screws. Absorbs the displacement in the compression direction. At the same time, it prevents intrusion of corrosive gases such as moisture and hydrogen sulfide inward from the joint.

  The elastic member is made of rubber, elastomer or the like. Specifically, O-rings, square rings, D-rings, and other rings with special cross-sections made of nitrile rubber, fluorine rubber, ethylene propylene rubber, silicone rubber, acrylic rubber, hydrogenated nitrile rubber silicone rubber, etc. are used. be able to.

[Case 17]
The housing 17 is a cylindrical member that covers the circuit case 16, houses the lighting circuit 13, and holds the lens member 14 and the reflecting member 15. The cylinder axis of the housing 17 coincides with the lamp axis J. The casing 17 is made of a heat conductive material, and functions as a heat radiating member that radiates heat generated from the light emitting module 11 to the atmosphere when the lamp is turned on, that is, a so-called heat sink. Specifically, the housing 17 can be made of the same material as the base 12. More specifically, a high thermal conductivity material such as a metal material, a high thermal conductivity resin material (a filler having thermal conductivity may be mixed), or the like can be used. When the casing 17 is made of a metal material, the circuit case 16 is preferably made of an electrically insulating material. By doing in this way, the electrical insulation between circuit unit 130A-130D and the housing | casing 17 can be improved.

  As shown in FIG. 2, the housing 17 is composed of a small diameter portion 170a, a large diameter portion 170b, and an upper end portion 170c, and has an upper end opening at an upper end portion and a lower end opening at a lower end portion.

  A reflection member 15 is attached to the upper end portion 170 c constituting the upper end opening of the housing 17.

  The large-diameter portion 170b has a substantially cylindrical shape that is reduced in diameter from above to below, and the reflecting member 15 is accommodated inside the large-diameter portion 170b.

  The small-diameter portion 170a has a substantially cylindrical shape that is similarly reduced in diameter from above to below, and the circuit case 16 is accommodated in the internal space of the small-diameter portion 170a.

[Modification of Embodiment]
FIG. 5 is a block diagram showing a connection relationship between a lighting circuit and a lighting control circuit according to a modification of the embodiment of the present invention. As shown in the figure, the lighting device 1 according to this modification may further include a lighting control circuit 230. Specifically, the lighting control circuit 230 is connected to each of the circuit units 130A to 130D, and controls the power supply timing from each circuit unit to the corresponding LED module. Thereby, it becomes possible to vary each light emission timing of LED module 110A-110D.

  The lighting control circuit 230 is connected to each of the circuit units 130A to 130D, and controls whether or not power is supplied from each circuit unit to the corresponding LED module for each circuit unit. Thereby, each of the LED modules 110 </ b> A to 110 </ b> D can be turned on / off for each LED module to control the light emission amount of the light emitting module 11.

[effect]
The lighting device 1 according to the present embodiment includes a light emitting module 11 composed of a plurality of LEDs, a lighting circuit 13 that supplies power to the light emitting module 11, a cylindrical housing 17 that houses the lighting circuit 13, And a base 18 for receiving external power. The lighting circuit 13 includes a plurality of circuit units 130 </ b> A to 130 </ b> D connected in parallel to each other between the base 18 and the light emitting module 11. The circuit units 130A to 130D have a circuit configuration in which external power is input from the base 18 and power converted into a predetermined current and voltage is output to the LED modules 110A to 110D, respectively. Here, the circuit units 130A to 130D all have the same circuit configuration.

  As a result, when a lighting device for high watts is configured, circuit units 130A to 130D, which are lighting circuits having the same circuit configuration built in an existing low watt LED lamp, are arranged and the lighting circuit 13 for high watts is arranged. Can be configured. Therefore, it is possible to reduce the labor for newly designing a lighting circuit for high wattage. Therefore, the design cost can be reduced. Also, high power electronic components used for high wattage are expensive. In addition, since circuit boards and electronic components of each circuit unit are small, the degree of freedom in the layout layout of the circuit units is improved. Furthermore, when driving from low output to high output with electronic components mounted on one circuit unit, it is difficult to obtain completely linear input / output characteristics over a wide dynamic range. As the input / output characteristics decrease, the amount of heat generated from the electronic component increases. On the other hand, according to the illumination device 1 according to the present embodiment, the operation in the high watt drive region is realized by adding the outputs of the four circuit units 130A to 130D that perform the operation in the low watt drive region. ing. Therefore, since the driving efficiency of the lighting circuit is not reduced even in the high watt drive region, unnecessary heat generation can be suppressed and temperature rise in the apparatus can be suppressed.

  The light emitting module 11 includes four LED modules 110A to 110D configured by the same number of LEDs, and the lighting circuit 13 includes four circuit units 130A to 130D. Here, any two circuit units among the circuit units 130A to 130D may supply power to different LED modules.

  As a result, the same LED modules 110A to 110D built in the existing low watt LED lamps are arranged to constitute the light emitting module 11 for high watts. Therefore, the effort to newly design the LED module for high watts is reduced. Can be reduced. Therefore, the design cost can be reduced. Even if the lighting circuit 13 fails, if only one of the circuit units fails, other normally operated circuit units and LED modules that are separately arranged are kept lit, so that the lighting device can be completely turned off. However, although the illuminance decreases, the lighting state can be maintained.

  In addition, each of the circuit units 130A to 130D includes a plurality of electronic components and a circuit board having a mounting surface on which the plurality of electronic components are mounted. In addition, each of the circuit units 130 </ b> A to 130 </ b> D may be arranged such that the mounting surface faces in the circumferential direction with respect to the cylindrical axis of the housing 17.

  Thereby, since the electronic components that generate heat by circuit driving are arranged outward, the heat dissipation efficiency from the circuit unit is improved.

  Further, the electronic device includes a circuit case 16 that is accommodated in the housing 17 and accommodates the circuit units 130A to 130D, and at least one of the plurality of electronic components is joined to the circuit case 16 via a heat conductive resin. May be.

  Thereby, since the heat conduction path from the electronic component to the circuit case is formed, the heat dissipation efficiency from the circuit unit is further improved.

  Further, the electronic component joined to the circuit case 16 via a heat conductive resin may be an electrolytic capacitor.

  As a result, a heat conduction path is formed from the electrolytic capacitor to the circuit case where the heat generation amount is increased by continuing charging and discharging while the light emitting module 11 emits light, so that the heat dissipation efficiency from the circuit unit is further increased. improves.

  Further, a lens member 14 may be provided in front of the light emission from the light emitting module 11 so as to face the light emitting module 11 and close the upper end opening of the housing 17.

  In the illumination device 1 according to the present embodiment that realizes high watt drive using a circuit unit for low watt drive, unnecessary heat generation can be suppressed, and temperature rise in the device can be suppressed. . Therefore, a lens member can be selected based on optical performance rather than heat resistance, and the degree of freedom in selecting an optical member is improved.

  Further, a lighting control circuit 230 that is connected to each of the circuit units 130A to 130D and controls the power supply timing from each of the circuit units 130A to 130D to each of the LED modules 110A to 110D may be provided.

  Thereby, it becomes possible to vary each light emission timing of LED module 110A-110D.

  Moreover, the lighting control circuit 230 may control the presence / absence of power supply from each of the circuit units 130A to 130D to each of the LED modules 110A to 110D for each circuit unit.

  Thereby, each of the LED modules 110 </ b> A to 110 </ b> D can be turned on and off for each light emitting unit to control the light emission amount of the light emitting module 11.

(Other)
As mentioned above, although the illuminating device which concerns on this invention was demonstrated based on embodiment and its modification, this invention is not limited to these embodiment and modification.

  Moreover, in said embodiment and modification, although LED module 110A-110D was comprised so that white light might be emitted by blue LED and yellow fluorescent substance, it is not restricted to this. For example, a phosphor-containing resin containing a red phosphor and a green phosphor may be used so that white light is emitted by combining this with a blue LED.

  Moreover, in said embodiment and modification, although LED112A-112D used LED which light-emits blue, it is not restricted to this. As LED112A-112D, you may use LED which light-emits colors other than blue. For example, when an LED chip that emits ultraviolet light is used as the LEDs 112A to 112D, the phosphor particles may be a combination of phosphor particles that emit light in three primary colors (red, green, and blue). Furthermore, a wavelength conversion material other than the phosphor particles may be used. For example, the wavelength conversion material absorbs light of a certain wavelength such as a semiconductor, a metal complex, an organic dye, or a pigment, and has a wavelength different from the absorbed light A material containing a substance that emits light may be used.

  Further, in the above embodiments and modifications, the LED is exemplified as the light emitting element, but a semiconductor light emitting element such as a semiconductor laser, a light emitting element such as an organic EL (Electro Luminescence), or an inorganic EL may be used.

  Moreover, in said embodiment and modification, LED module 110A-110D mounts LED chip directly on board | substrate 111A-111D, and COB (Chip On Board) which sealed LED chip with fluorescent substance containing resin collectively. Although the configuration of the mold, it is not limited to this. For example, it is configured by mounting a plurality of LED elements on a substrate using a package type LED element in which an LED chip is mounted in a resin-molded cavity and a phosphor-containing resin is sealed in the cavity. A surface mount type (SMD) LED light source may be used.

  In addition, as long as it does not deviate from the gist of the present invention, various modifications conceived by those skilled in the art are applied to the present embodiment and the modified examples, or a form constructed by combining the constituent elements in the embodiments and modified examples, It is included within the scope of the present invention.

1 Illumination Device 11 Light Emitting Module (Light Emitting Unit)
12 Base 13 Lighting circuit 14 Lens member (Condensing element)
DESCRIPTION OF SYMBOLS 15 Reflective member 16 Circuit case 17 Case 18 Base 19 Seal member 31 External AC power supply 32 Rectification smoothing circuit 34 Oscillation control part 35 Diode 36 Inductor 37 Capacitor 110A, 110B, 110C, 110D LED module (light emitting unit)
111A, 111B, 111C, 111D substrate 112A, 112B, 112C, 112D LED (light emitting element)
113A, 113B, 113C, 113D Connector 114A, 114B, 114C, 114D Sealing member 130A, 130B, 130C, 130D Circuit unit 131A, 132A, 133A Electronic component 134A, 134B, 134C, 134D Wire pair 135A, 135B, 135C, 135D Circuit board 140a Inner surface 150a Inner peripheral surface 150b Rib 170a Small diameter portion 170b Large diameter portion 170c Upper end portion 181 Eyelet portion 182 Insulating portion 183 Shell portion 230 Lighting control circuit 342 Switch element

Claims (8)

A light-emitting unit composed of a plurality of light-emitting elements;
A lighting circuit for supplying power to the light emitting unit;
A cylindrical housing that houses the lighting circuit;
With a base for receiving external power,
The lighting circuit includes a plurality of circuit units connected in parallel to each other between the base and the light emitting unit.
Each of the plurality of circuit units has a circuit configuration for inputting the external power received by the base and outputting the power converted into a predetermined current and voltage to a part of the plurality of light emitting elements,
The plurality of circuit units all have the same circuit configuration. The light-emitting unit has n (n is an integer of 2 or more) light-emitting units composed of the same number of light-emitting elements,
The plurality of circuit units are n circuit units,
The lighting device according to claim 1, wherein any two circuit units of the plurality of circuit units output electric power to different light emitting units. Each of the plurality of circuit units is
Multiple electronic components,
A circuit board having a mounting surface on which the plurality of electronic components are mounted;
The lighting device according to claim 1, wherein the plurality of circuit units are arranged such that the mounting surface faces a circumferential direction with respect to a cylindrical axis of the casing. further,
A circuit case that is housed in the housing and houses the plurality of circuit units;
The lighting device according to claim 3, wherein at least one of the plurality of electronic components is joined to the circuit case via a thermally conductive resin. The lighting device according to claim 4, wherein the electronic component joined to the circuit case via the thermally conductive resin is an electrolytic capacitor. further,
The illuminating device according to any one of claims 1 to 5, further comprising a condensing element disposed so as to face the light emitting unit in front of light emission from the light emitting unit and close the opening of the housing. further,
By controlling the power supply timing from each of the plurality of circuit units to each of the plurality of light emitting units, the light emission timings of the plurality of light emitting units are made different from each other. The lighting device according to claim 2, further comprising a lighting control circuit. further,
Each of the plurality of light emitting units is connected to each of the plurality of circuit units, and each of the plurality of light emitting units is controlled by controlling whether or not power is supplied from each of the plurality of circuit units to each of the plurality of light emitting units. The lighting device according to claim 2, further comprising a lighting control circuit that controls the light emission amount of the light emitting unit by turning on and off each light emitting unit.

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