JP2015082185A - Ic module and ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC module and an IC card capable of downsizing an encapsulation member, independent from a formation position a through hole.SOLUTION: An IC module or an IC card includes: a substrate 1 having a through hole 3 that opens at a front face 1a and a rear face 1b; a contact terminal 10 disposed on the front face 1a and making contact with an external terminal; an IC chip 55 attached onto the rear face 1b; and a conductive member electrically connecting the IC chip 55 and the contact terminal 10 through the through hole 3. The conductive member includes: a first conductive layer 20 disposed on the rear face 1b; a second conductive layer 30 disposed on an inner wall of the through hole 3; and a wire 60 connected to the IC chip 55 at one end thereof and connected to the first conductive layer 20 at the other end thereof.

Description

  The present invention relates to an IC module and an IC card, and more particularly to an IC module and an IC card in which a sealing member can be reduced in size without depending on a formation position of a through hole.

  Conventionally, in a contact type IC card, an IC chip is mounted on an IC module substrate having a contact terminal, the IC chip and the contact terminal are electrically connected by wire bonding or the like, and the IC chip and the wire are made of a sealing member resin. An IC module having a sealed structure is used. When such an IC module is mounted on a card substrate, a recess for embedding the IC module is provided in the card substrate, and the IC module is embedded in the recess (see, for example, Patent Document 1).

FIG. 13 is a cross-sectional view showing a configuration example of an IC module 400 according to a conventional example. The IC module 400 shown in FIG. 13 has the IC chip 255 mounted on the IC module substrate 201 having the contact terminals 210, and the IC chip 255 and the contact terminals 210 are electrically connected through the bonding holes 203 with the wires 260, and then The IC chip 255 and the wire 260 are formed by sealing with a mold resin 270.

JP 2002-31746 A

  By the way, in the IC module 400 shown in FIG. 13, the contact terminal 210 is provided on a copper (Cu) foil 211, a nickel (Ni) plating layer (not shown) formed on the copper foil 211, and the nickel plating layer. Metal (Au) plating layers 214 and 224. The wire 260 is connected to the contact terminal 210 through the bonding hole 203. In this structure, the formation position of the bonding hole 203 is limited, and it is necessary to provide the bonding hole 203 immediately below the connection region of the contact terminal 210. The connection area is an area where terminals (pins) such as an IC card reader / writer (hereinafter referred to as RW) or ATM contact.

Further, in order to seal the wire 260, the mold resin 270 needs to fill the bonding hole 203 and cover the region outside the bonding hole 203 as viewed from the IC chip 255. For this reason, the position of the outer edge of the mold resin 270 depends on the position of the bonding hole 203.
Here, the position of the contact terminal connection region is determined by, for example, ISO or JIS standards, and the position cannot be arbitrarily changed. For this reason, in the conventional structure shown in FIG. 8, the formation position of the bonding hole 203 cannot be changed, and the mold resin cannot be reduced in size.

  Accordingly, the present invention has been made in view of such circumstances, and it is an object of the present invention to provide an IC module and an IC card in which the sealing member can be downsized without depending on the formation position of the through hole. .

  In order to solve the above problems, an embodiment of the present invention includes an IC chip attached to the back surface of a base material through a through hole provided in the base material, and a first conductive layer provided on the back surface of the base material. And a second conductive layer provided on the inner wall of the through hole of the base material and connected to the first conductive layer and the contact terminal, one end connected to the IC chip, and the other end connected to the first conductive layer And a conductive path.

  According to one embodiment of the present invention, the other end of the wire whose one end is connected to the IC chip is connected to the first conductive layer provided on the back surface of the substrate. The first conductive layer is connected to a second conductive layer provided on the inner wall of the through hole, and the second conductive layer is connected to a contact terminal provided on the surface of the substrate. Thus, the arrangement of the joint between the other end of the wire and the first conductive layer can be brought closer to the IC chip without changing the formation position of the through hole, and the length from one end of the wire to the other end Can be shortened. Therefore, the sealing member can be reduced in size without depending on the formation position of the through hole.

It is sectional drawing which shows the structural example of the IC module board | substrate 50 which concerns on 1st Embodiment. It is sectional drawing which shows the structural example of IC module 100 which concerns on 1st Embodiment. It is sectional drawing which shows the structural example of IC card 150 which concerns on 1st Embodiment. 5 is a cross-sectional view showing a method of manufacturing the IC module 100 in the order of steps. FIG. 5 is a cross-sectional view showing a method of manufacturing the IC module 100 in the order of steps. FIG. 5 is a cross-sectional view showing a method of manufacturing the IC module 100 in the order of steps. FIG. 3 is a plan view schematically showing a roller contact area in the IC card 150. FIG. It is sectional drawing which shows the structural example of the IC module board | substrate 250 which concerns on 2nd Embodiment. It is sectional drawing which shows the structural example of IC module 300 which concerns on 2nd Embodiment. It is sectional drawing which shows the structural example of the IC card 350 which concerns on 2nd Embodiment. 5 is a cross-sectional view showing a manufacturing method of the IC module 300 in the order of steps. FIG. 5 is a cross-sectional view showing a manufacturing method of the IC module 300 in the order of steps. FIG. It is sectional drawing which shows the structural example of IC module 400 which concerns on a prior art example.

Embodiments of the present invention will be described below with reference to the drawings. Note that, in each drawing described below, parts having the same configuration are denoted by the same reference numerals, and repeated description thereof is omitted.
<First Embodiment>
(Constitution)
FIG. 1 is a cross-sectional view showing a configuration example of an IC module substrate 50 according to the first embodiment of the present invention. The IC module substrate 50 is a substrate for configuring an IC module by mounting an IC chip. As shown in FIG. 1, the IC module substrate 50 includes a base material 1, a contact terminal 10, a first conductive layer 20, and a second conductive layer 30.

  The substrate 1 has a front surface 1a and a back surface 1b. A through hole 3 that is a through hole is provided between the front surface 1 a and the back surface 1 b of the substrate 1. An IC mounting area for mounting an IC chip is prepared on the back surface 1 b of the base 1. Although the material of the base material 1 is not specifically limited, For example, it consists of glass epoxy or a polyimide. Moreover, the thickness of the base material 1 is 80 micrometers or more and 170 micrometers or less, for example.

The contact terminal 10 is provided on the surface 1 a of the substrate 1. The contact terminal 10 has a structure in which a noble metal plating layer serving as a contact surface with an external terminal is formed on a conductive material such as a copper (Cu) foil. In the first embodiment, the side surfaces 10a and 10b and the contact surface 10c of the contact terminal 10 are made of a noble metal plating layer.
For example, the contact terminal 10 includes a copper foil 11 which is a conductive material, a copper plating layer 12 formed on the copper foil 11, and a nickel (Ni) plating layer (not shown) formed on the copper plating layer 12. And a gold (Au) plating layer 14 formed on the nickel plating layer. The gold plating layer 14 is an example of a noble metal plating layer. In the first embodiment, the side surfaces 10 a and 10 b and the contact surface 10 c of the contact terminal 10 are made of the gold plating layer 14.

The external terminal is a terminal included in an external device such as an IC card reader / writer or ATM. As shown in FIG. 1, the contact terminal 10 has a region for connection with an external terminal set in advance.
The first conductive layer 20 is provided on the back surface 1 b of the substrate 1. The first conductive layer 20 has, for example, the same structure as the contact terminal 10. For example, the first conductive layer 20 includes a copper foil 21 that is a conductive material, a copper plating layer 12 formed on the copper foil 21, and a nickel plating layer (not shown) formed on the copper plating layer 12. And a gold plating layer 14 formed on the nickel plating layer. The surface (the lower surface in FIG. 1) and the side surface 20 a of the first conductive layer 20 are composed of the gold plating layer 14.

The second conductive layer 30 is provided on the inner wall of the through hole 3. The second conductive layer 30 includes, for example, a copper plating layer 12, a nickel plating layer (not shown) formed on the copper plating layer 12, and a gold plating layer 14 formed on the nickel plating layer.
In addition, the noble metal plating layer which the contact terminal 10, the 1st conductive layer 20, and the 2nd conductive layer 30 have is not limited to a gold plating layer. For example, the noble metal plating layer may be a plating layer made of any one of silver (Ag), platinum (Pt), palladium (Pd), and the like.

  FIG. 2 is a cross-sectional view showing a configuration example of the IC module 100 according to the first embodiment of the present invention. As shown in FIG. 2, the IC module 100 includes an IC module substrate 50, an IC chip 55 attached to an IC attachment region of the IC module substrate 50 via an adhesive 51, and the IC chip 55 and the first conductive layer. A wire 60 that electrically joins 20 and a sealing member 70 that is provided on the back surface 1b side of the IC module substrate 50 and seals the IC chip 55, the wire 60, and a part of the first conductive layer 20, Is provided.

The IC chip 55 is manufactured, for example, by forming a circuit on a silicon (Si) wafer, polishing the Si wafer, thereby setting the thickness of the wafer to a specified thickness, and separating the chip as a single chip by a dicing apparatus. . The adhesive 51 is, for example, a silver (Ag) paste.
The wire 60 is for electrically connecting an electrode pad (not shown) of the IC chip 55 to the contact terminal 10. One end of the wire 60 is bonded to an electrode pad (not shown) of the IC chip 55, and the other end of the wire 60 is bonded to the gold plating layer 14 on the surface of the first conductive layer 20. Further, the joint 61 between the other end of the wire 60 and the first conductive layer 20 is located between the IC chip 55 and the through hole 3 on the back surface 1b side. The material of the wire 60 is gold, for example. However, the material of the wire 60 is not limited to gold, and other materials such as copper and aluminum may be used.

  The sealing member 70 is a mold resin formed by, for example, transfer molding technology, and is made of, for example, a thermoplastic resin, a thermosetting resin, an ultraviolet curable resin, or the like. The outer edge of the sealing member 70 is located closer to the IC chip 55 than the through hole 3. That is, in the back surface 1b, the region outside the through hole 3 when viewed from the IC chip is a non-sealing region where the sealing member 70 is not provided.

  FIG. 3 is a cross-sectional view showing a configuration example of the IC card 150 according to the first embodiment of the present invention. An IC card 150 shown in FIG. 3 is, for example, a contact IC card, and includes a card base member 80 having a recess 81 on the ticket surface 80a, and an IC module 100 embedded in the recess 81. In this example, the IC module 100 is disposed in the concave portion 81 with the back surface side (that is, the side having the sealing member 70) facing the card substrate 80, and the outer peripheral portion of the IC module 100 is an adhesive. It is bonded and fixed to the bottom surface of the recess 81 through 83.

  Further, the IC module 100 is embedded in the recess 81, and the surface thereof (for example, the surface of the gold plating layer 14) is flush with the card surface 80a of the card substrate 80 (that is, the same height). Although the material of the card | curd base material 80 is not specifically limited, For example, it consists of insulating resin materials, such as polyvinyl chloride (PVC) and a polyethylene terephthalate (PET).

(Production method)
4-6 is sectional drawing which shows the manufacturing method of IC module 100 which concerns on 1st Embodiment of this invention in process order. As shown in FIG. 4A, first, a double-sided copper foil base material 2 in which copper foils 11 and 21 are respectively provided on the front surface 1a and the back surface 1b (that is, both surfaces) of the base material 1 is prepared. The copper foils 11 and 21 are attached to the base material 1 with, for example, an adhesive (not shown).

  Next, as shown in FIG.4 (b), the through-hole 3 which is a through-hole is formed in the double-sided copper foil base material 2. FIG. The through hole 3 is formed, for example, by excavating the double-sided copper foil base material 2 with a drill or irradiating laser light. Next, the double-sided copper foil base material 2 in which the through hole 3 is formed is exposed to, for example, a plasma atmosphere to activate the inner wall of the through hole 3. Thereby, the resin residue etc. which remain | survived on the inner wall at the time of formation of the through hole 3 are removed.

  Next, as shown in FIG. 4C, a copper plating layer 12 is formed from the front surface 1a side and the back surface 1b side of the double-sided copper foil base material 2 to the inner wall of the through hole 3 by, for example, electroplating. Here, the copper plating layer 12 is formed on the surfaces of the copper foils 11 and 21 which are conductors by electroplating, and the copper plating layer 12 is formed on the inner wall of the through hole 3 from the side surfaces of the copper foils 11 and 21. With this copper plating layer 12, the copper foils 11 and 21 are brought into conduction through the through hole 3.

  Next, as shown in FIG. 4 (d), photoresists 101 and 111 are applied to both sides of the double-sided copper foil substrate 2, respectively. Then, the photoresists 101 and 111 are patterned by exposure and development techniques to form resist patterns 102 and 112, respectively, as shown in FIG. The shape of the resist pattern 102 is, for example, a shape that covers a region where the contact terminal is formed and the upper opening end 3a of the through hole 3 and exposes other regions (for example, a space that prevents a short circuit between the contact terminals). It is. The resist pattern 112 has a shape that covers, for example, a region where the first conductive layer 20 is formed and the lower opening end 3b of the through hole 3, and exposes other regions (for example, an IC attachment region). Shape.

  Next, the copper plating layer 12 and the copper foils 11 and 21 are sequentially etched using the resist patterns 102 and 112 as a mask. Accordingly, as shown in FIG. 5B, the copper plating layer 12 and the copper foil 11 are formed in the region where the contact terminal is formed, the region where the first conductive layer is formed, and the region where the second conductive layer is formed, respectively. , 21 is left, and the copper plating layer 12 and the copper foils 11, 21 are removed to expose the substrate 1 in other areas. Thereafter, as shown in FIG. 5C, the resist pattern is removed from both surfaces of the substrate 1.

Next, a nickel plating layer (not shown) and a gold plating layer 14 are formed on the copper plating layer 12 by, for example, electroplating. In this way, as shown in FIG. 6A, the contact terminal 10, the first conductive layer 20, and the second conductive layer 30 are formed. Through the above steps, the IC module substrate 50 shown in FIG. 1 is completed.
Next, as shown in FIG. 6B, an IC chip 55 is attached to the IC attachment region of the IC module substrate 50 by using an adhesive 51 such as an Ag paste (mounting process). After the mounting process, one end of the wire 60 is bonded to the pad electrode of the IC chip 55, and the other end of the wire 60 is bonded to the gold plating layer 14 on the surface of the first conductive layer 20, so that the IC chip 55 and the first conductive layer are connected. The layer 20 is electrically connected (wire bonding process). After the wire bonding step, a sealing member is formed on the back surface 1b side of the substrate 1, and the IC chip 55, the wire 60, and a part of the first conductive layer 20 are sealed (sealing step). In the sealing step, the sealing member is formed by, for example, a transfer molding method, a potting method, or printing. Through the above steps, the IC module 100 shown in FIG. 2 is completed.

Subsequently, in the manufacturing process of the IC card 150, a card substrate 80 having a recess 81 (see, for example, FIG. 3) is prepared. The concave portion 81 is formed by cutting the bill surface 80a using, for example, an end mill. Then, an adhesive 83 (see, for example, FIG. 3) is applied to at least one of the bottom surface of the IC module 100 or the recess 81, and the IC module 100 is disposed in the recess 81 using, for example, a pickup device. And hot press. Through the above steps, the IC card 150 shown in FIG. 3 is completed.
In the first embodiment of the present invention, the wire 60 corresponds to the “conductive path” of the present invention. The ticket surface 80a corresponds to “one surface” of the present invention.

(Effect of 1st Embodiment)
The first embodiment of the present invention has the following effects.
(1) The other end of the wire 60 whose one end is connected to the IC chip 55 is connected to the first conductive layer 20 provided on the back surface 1 b of the substrate 1. The first conductive layer 20 is connected to the second conductive layer 30 provided on the inner wall of the through hole 3, and the second conductive layer 30 is connected to the contact terminal 10 provided on the surface 1 a of the substrate 1. doing. Accordingly, the joining portion 61 between the other end of the wire 60 and the first conductive layer 20 can be disposed close to the IC chip 55 without changing the position where the through hole 3 is formed. To the other end can be shortened. Therefore, the sealing member 70 can be reduced in size without depending on the formation position of the through hole 3. For example, as shown in FIG. 2, the junction 61 between the other end of the wire 60 and the first conductive layer 20 is located between the IC chip 55 and the through hole 3 on the back surface 1 b side and sealed. The outer edge of the member 70 is closer to the IC chip 55 than the through hole 3.

(2) Moreover, since the sealing member 70 can be reduced in size, it can contribute to the strength improvement of the sealing member (that is, if the sealing member is small, one end and the other end of the sealing member) Since the force acting between them becomes small, cracks and the like hardly occur in the sealing member.
(3) It is desirable that the pattern of the first conductive layer 20 is designed so that the joint portion 61 between the wire 60 and the first conductive layer 20 does not overlap the roller contact area in plan view. This point will be described below.

  FIG. 7 is a plan view schematically showing a roller contact area in contact with an external roller (for example, a roller for inserting and removing an IC card in an external device such as RW or ATM) on the card surface 80a of the card substrate 80. . FIG. 7A shows the entire IC card 150, and FIG. 7B is an enlarged view of a portion surrounded by a broken line in FIG. 7A. In the IC module 100 shown in FIG. 7B, Vcc is a connection area for supplying a circuit voltage, GND is a connection area for supplying a ground potential, RST is a connection area for inputting a reset signal, and Vpp is a write address. A voltage supply connection area, CLK is a clock signal input connection area, I / O is a data signal input / output connection area, and RFU is a future use (ie, spare) connection area.

  For example, as illustrated in FIG. 7A, it is assumed that the roller contact area overlaps with the IC module 100 in the IC card 150. In such a case, for example, as shown in FIG. 7B, the layout of the first conductive layer 20 is changed, and the wire 60 and the first conductive layer 20 that are considered to have relatively low bonding strength. Adjust the joint to deviate from the roller contact area. Thereby, since it can avoid that the junction part of the wire 60 and the 1st conductive layer 20 is pressed by an external roller, the reliability of the said junction part can be kept high.

(4) Moreover, even when the joint portion 61 between the wire 60 and the first conductive layer 20 overlaps the roller contact region, the joint portion 61 between the wire 60 and the first conductive layer 20 is the back surface 1b of the substrate 1. It arrange | positions at the side and this junction part 61 will be pressed with an external roller through the base material 1. FIG. For this reason, compared with the case where the said junction part 61 is arrange | positioned at the surface 1a side of the base material 1, the reliability of joining is high.

Second Embodiment
In said 1st Embodiment, the case where the side surface of a contact terminal consists of a noble metal plating layer was demonstrated. However, the present invention is not limited to this. The side surface of the contact terminal may be, for example, a base material (for example, copper) of the contact terminal. In the second embodiment, this point will be described.

(Constitution)
FIG. 8 is a cross-sectional view showing a configuration example of an IC module substrate 250 according to the second embodiment of the present invention. FIG. 9 is a cross-sectional view showing a configuration example of an IC module 300 according to the second embodiment of the present invention. FIG. 10 is a cross-sectional view showing a configuration example of an IC card 350 according to the second embodiment of the present invention.

  As shown in FIGS. 8 to 10, the IC module substrate 250, IC module 300, and IC card 350 according to the second embodiment are different from the IC module substrate 50, IC module 100, and IC card 150 according to the first embodiment. The point is that the side surface 10a of the contact terminal 10 and the side surface 10a of the first conductive layer 20 are exposed from the noble metal plating layer. For example, the side surface 10a of the contact terminal 10 and the side surface 10a of the first conductive layer 20 are not the gold plating layer 14 but the side surfaces of the copper foils 11 and 21, and are made of copper. Otherwise, the second embodiment is the same as the first embodiment.

(Production method)
11 and 12 are cross-sectional views showing the method of manufacturing the IC module 300 according to the second embodiment of the present invention in the order of steps. As shown in FIG. 11A, the processes up to the step of partially etching the copper plating layer 12 and the copper foils 11 and 21 and then removing the resist are the same as in the first embodiment.

  Next, as shown in FIG. 11 (b), a resist pattern 103 is formed in a region exposed from below the copper foil 11 on the surface 1 a of the substrate 1. Also, before and after the formation of the resist pattern 103, a resist pattern 113 is formed in a region exposed from the bottom of the copper foil 21 on the back surface 1b of the substrate 1. The resist pattern 103 has, for example, a shape that exposes the region where the contact terminal is formed and the upper opening end 3a of the through hole 3 and covers the other region (for example, a space). In addition, the resist pattern 113 has a shape that exposes the region where the first conductive layer is formed and the lower opening end 3b of the through hole 3 and covers the other region (for example, the IC attachment region). The formation method of the resist patterns 103 and 113 is, for example, printing of resist material (offset printing, screen printing), or application, exposure, and development techniques of the resist material.

  Next, a nickel plating layer and a gold plating layer 14 are formed by, for example, electroplating. As shown in FIG. 11C, since the side surface 10a of the contact terminal 10 is covered with the resist 103 and the side surface 20a of the first conductive layer 20 is covered with the resist 113, each of these side surfaces 10a, The nickel plating layer and the gold plating layer 14 are not formed on 20a. That is, each side surface 10a, 20a is made of copper. Next, as shown in FIG. 12A, the resists 103 and 113 are removed from the base material 1. Thereby, the IC module substrate 250 shown in FIG. 8 is completed.

The subsequent steps are the same as those in the first embodiment. That is, as shown in FIG. 12B, an IC chip 55 mounting process, a wire bonding process, and a sealing process are sequentially performed. Through the above steps, the IC module 300 shown in FIG. 9 is completed.
The correspondence relationship with the present invention in the second embodiment is the same as in the first embodiment.
(Effect of 2nd Embodiment)
The second embodiment of the present invention has the same effects as the effects (1) to (4) of the first embodiment.

<Others>
In each of the above embodiments, the case where the IC module substrate, the IC module, and the IC card are applied to the contact IC card has been described. However, the application of the present invention is not limited to the contact type. For example, a hybrid card in which a contact IC chip and a non-contact IC chip are mounted on one card, and one IC chip is a contact type and a non-contact type. The present invention may be applied to all module structures to which an IC module structure is applied, such as a dual card that functions as both, and an electromagnetically coupled dual card in which an antenna coil is provided on the dual card. Even in such a case, the effects of the embodiment are exhibited.
The present invention is not limited to the embodiments described above. Based on the knowledge of those skilled in the art, design changes and the like can be made to each embodiment, and an aspect in which such changes and the like are added is also included in the scope of the present invention.

This inventor conducted the test which verifies the effect (3) of embodiment.
(Test sample)
Three IC cards 150 shown in FIG. 3 were prepared (n = 3). For comparison, an IC card manufactured by Company A (n = 3) and an IC card manufactured by Company B (n = 3) were prepared.
(contents of the test)
Each IC card was repeatedly passed through an apparatus simulating ATM conveyance (conveyance test), and ATR (Answer To Reset) was confirmed each time the IC card reached the specified number of times. The specified number of times was 1000 times, 2000 times, 3000 times, 4000 times, and 5000 times.

Moreover, ATR in each IC card was performed in the following steps (1) to (4).
(1) Card insertion into the terminal, contact connection and activation
(2) Card reset, communication establishment between terminal and card (ATR sequence)
(3) Execution of transaction (4) Deactivation of contacts, removal of card

(Test results)
The test results are shown in Table 1.

When the ATR was normal, it was evaluated as ◯, and when the ATR was abnormal, the wire was considered broken, and was evaluated as x.
In addition, the conveyance test was increased 1000 times for each IC card, and the test was continued with the remaining IC cards when it became “X” on the way. In the case of the IC card manufactured by B company, the number of conveyance tests (namely, the number of tests) was 2000, and one sheet became x.
As shown in Table 1, it was confirmed that all three IC cards 150 of this embodiment had normal ATR even when the number of tests exceeded 5000. From this result, it was confirmed that the wire was not disconnected.

DESCRIPTION OF SYMBOLS 1 Base material 1a Front surface 1b Back surface 2 Double-sided copper foil base material 3 Through hole 3a Upper opening end 3b Lower opening end 10 Contact terminal 10a Side surface 10c Contact surface 11, 21 Copper foil 12 Copper plating layer 14, 21 Gold plating layer 20 1st Conductive layer 20a Side surface 30 Second conductive layer 50 Module substrate 51 Adhesive 55 IC chip 60 Wire 61 Joining portion 70 Sealing member 80 Card substrate 80a Bill surface 81 Recess 83 Adhesive 100 IC module 101, 111 Photoresist 102, 103, 112, 113 Resist pattern 150 IC card

Claims (5)

A base material provided with through-holes opening on the front surface and the back surface;
A contact terminal provided on the surface and in contact with an external terminal;
An IC chip attached to the back surface;
A first conductive layer provided on the back surface;
A second conductive layer provided on an inner wall of the through hole and connected to the first conductive layer and the contact terminal;
An IC module having one end connected to the IC chip and the other end connected to the first conductive layer.   2. The IC module according to claim 1, wherein a joint between the other end of the conductive path and the first conductive layer is located between the IC chip and the through hole on the back surface side. . A sealing member which is provided on the back surface and seals the IC chip and the conductive path and at least a part of the first conductive layer;
The IC module according to claim 2, wherein an outer edge of the sealing member is located closer to the IC chip than the through hole. A card substrate having a recess on one side;
An IC module embedded in the recess,
The IC module is
A base material provided with through-holes opening on the front surface and the back surface;
A contact terminal provided on the surface and in contact with an external terminal;
An IC chip attached to the back surface;
A first conductive layer provided on the back surface;
A second conductive layer provided on an inner wall of the through hole and connected to the first conductive layer and the contact terminal;
An IC card comprising: a conductive path having one end connected to the IC chip and the other end connected to the first conductive layer. The first conductive layer is arranged such that a joint between the conductive path and the first conductive layer does not overlap with a roller contact area in contact with an external roller in the one surface of the card base material in a plan view. The IC card according to claim 4, wherein the pattern is designed.

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