JP2015072785A - Separator cutting device and separator cutting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a separator cutting device that improves the production efficiency by shortening the time required for forming a separator by cutting a base material for separator so that a cut piece is produced.SOLUTION: In a separator cutting device 100, a conveyor belt 114 conveys a base material 10 for separator. A suction hand 121 moves to a first position K1 proximal to the base material 10 for separator and holds an end material 10P cut from the base material for separator. A laser source 131 straddles the suction hand 121 moved to the first position K1 and forms a separator 11 by irradiating and cutting the base material for separator with laser beams L1 and L2. A sucker 122 sucks and collects an end material held by the suction hand moved to a second position K2 more distal to the base material for separator than the first position K1. The suction hand moves from the second position to the first position when the base material for separator is being conveyed by the conveyor belt.

Description

  The present invention relates to a separator cutting device and a separator cutting method.

  Conventionally, there is a battery in which electrodes and separators are alternately stacked. For example, after joining and integrating the electrode and separator, the separator attached to the part to which the current collector tab is joined is irradiated with a laser to peel off the part that becomes the cut piece, and then the electrode is collected. There is a battery in which a current collecting tab is joined to a cut surface formed by exposing an electric body (see, for example, Patent Document 1).

JP 2001-283896 A

  By the way, since it is necessary to collect the cut pieces every time the separator base material is cut and the separator is formed, the processing of the cut pieces has a great influence on productivity in forming the separator. That is, there is a demand for a technique for collecting a cut piece in a short time when the separator base material is cut so that the cut piece is generated to form a rectangular separator.

  This invention is made | formed in view of the said situation, shortening the time required in order to shape | mold a separator from the base material for separators by collect | recovering cut pieces efficiently, and improving the production efficiency of a separator. An object is to provide a separator cutting device and a separator cutting method.

  The separator cutting device of the present invention that achieves the above object is a device that forms a rectangular separator by cutting a long separator substrate so that a cut piece is generated. The separator cutting device includes a conveying member, a holding member, a cutting member, and a recovery member. The said conveyance member conveys the said base material for separators whenever the said separator is shape | molded. The holding member moves to a first position that is proximal to the separator substrate, and holds the cut piece cut from the separator substrate. The cutting member cuts the substrate by irradiating the separator base material with laser light across the holding member moved to the first position, thereby forming the separator. The collection member sucks and collects the cut piece held by the holding member moved to a second position that is distal to the first position with respect to the separator substrate. Here, the holding member moves from the second position to the first position when the separator base material is being conveyed by the conveying member.

  Moreover, the separator cutting method of the present invention that achieves the above object is a method of forming a rectangular separator by cutting a long separator substrate so that a cut piece is generated. The separator cutting method includes a preparation process, a molding process, and a recovery process. In the preparing step, the holding member that holds the cut piece is moved to a first position that is proximal to the separator substrate while the separator substrate is being conveyed. In the molding step, the separator is molded while generating cut pieces by irradiating laser beams to both ends straddling the portion where the holding member that has moved to the first position faces. In the collecting step, the holding member holding the cut piece is moved to a second position distal to the first position with respect to the separator substrate, and the cut piece is sucked and collected. To do.

  In the separator cutting device and the cutting method of the present invention, the holding member has a first proximal position from a second position distal to the separator base material when the separator base material is transported by the transport member. Move to the position. Therefore, the operation related to the conveyance of the separator base material and the part of the operation related to the recovery of the cut pieces cut from the separator base material can be performed simultaneously. That is, by efficiently recovering the cut pieces, the time for forming the separator from the separator substrate can be shortened, and the production efficiency of the separator can be improved.

It is a perspective view which shows a separator cutting device. It is a side view which shows the structure of FIG. 1 along a conveyance direction. It is an end view which shows the action | operation of the principal part of the separator cutting device of FIG. 1 along a conveyance direction. It is an end view which shows the action | operation of the principal part of the separator cutting device following FIG. 3 along a conveyance direction. It is an end elevation which shows the action | operation of the principal part of the separator cutting device following FIG. 4 along a conveyance direction. It is a perspective view which shows the state which laminated | stacked the negative electrode on the single side | surface of a packaging electrode. It is an end view which shows the principal part which concerns on the modification 1 of a separator cutting device. It is an end view which shows the principal part which concerns on the modification 2 of a separator cutting device. It is a perspective view which shows the principal part which concerns on the modification 3 of a separator cutting device.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted. The dimensional ratios in the drawings are exaggerated for convenience of explanation, and are different from the actual ratios. In all the drawings of FIGS. 1 to 9, the X direction, the Y direction, and the Z direction are indicated by arrows, respectively. The X direction indicates the conveying direction of the separator substrate 10 and the separator 11. The Y direction indicates a direction crossing the transport direction. The Z direction indicates the stacking direction of the separators 11.

(Embodiment)
The separator cutting device 100 embodies a separator cutting method. The separator cutting device 100 cuts the long separator base material 10 so that a cut piece (end material 10P) is generated, and forms a rectangular separator 11.

  The separator cutting device 100 moves to a first position K1 that is proximal to the separator substrate 10 and holds a holding member (adsorption hand 121) that holds the end material 10P cut from the separator substrate 10. Have. Further, the separator cutting device 100 straddles the suction hand 121 moved to the first position K1 and irradiates the base material 10 for separator with the laser beams L1 and L2 to cut and form the separator 11 (laser light source 131). ). Furthermore, the separator cutting device 100 sucks the end material 10P held by the suction hand 121 that has moved to the second position K2 that is distal to the first position K1 with respect to the separator substrate 10. A recovery member (aspirator 122) for recovery is included. Here, in the separator cutting device 100, the suction hand 121 moves from the second position K2 to the first position K1 when the separator substrate 10 is being transported by the transport belt 114.

  First, an electrical device using the separator 11 cut and molded by the separator cutting device 100 will be described with reference to FIG.

  FIG. 6 is a perspective view showing a state in which the negative electrode 30 is laminated on one side of a packaged electrode (a positive electrode 20 sandwiched between a pair of separators 11).

  As an example of the electrical device, a configuration in which the negative electrode 30 is laminated on one side of a packaged electrode (a positive electrode 20 sandwiched between a pair of separators 11) will be described. Such an electric device is used for, for example, a lithium ion secondary battery. That is, the lithium ion secondary battery is configured by sealing a power generation element that is charged and discharged with an exterior material. The power generation element is configured by alternately laminating a plurality of sets of packaged electrodes in which the positive electrode 20 is sandwiched and bonded by a pair of separators 11 and the negative electrode 30.

  The separator 11 is provided between the positive electrode 20 and the negative electrode 30 and electrically isolates the positive electrode 20 and the negative electrode 30. The separator 11 is made of polypropylene. The separator 11 holds an electrolytic solution between the positive electrode 20 and the negative electrode 30 to ensure ion conductivity. The separator 11 is formed in a rectangular shape. The length in the longitudinal direction of the separator 11 is longer than the length in the longitudinal direction of the negative electrode 30 excluding the portion of the negative electrode terminal 31a. The pair of separators 11 are joined to each other by a plurality of joining portions 11 </ b> R formed at both ends in the longitudinal direction along the transport direction X of the separator cutting device 100.

  The positive electrode 20 corresponds to an electrode, and is formed by binding a positive electrode active material on both surfaces of a positive electrode current collector 21 which is a conductor. The positive electrode terminal 21 a for taking out electric power is formed to extend from a part of one end of the positive electrode current collector 21. The negative electrode 30 corresponds to an electrode having a polarity different from that of the positive electrode 20, and is formed by binding a negative electrode active material 32 on both surfaces of a negative electrode current collector 31 that is a conductor. The negative electrode terminal 31 a extends from a part of one end of the negative electrode current collector 31 so as not to overlap with the positive electrode terminal 21 a formed on the positive electrode 20.

  Next, with reference to FIGS. 1-5, the structure of the separator cutting device 100 which embodied the separator cutting method and the separator cutting method is demonstrated.

  FIG. 1 is a perspective view showing a separator cutting device 100. FIG. 2 is a side view showing the configuration of FIG. FIG. 3 is an end view showing the operation of the main part of the separator cutting device 100 of FIG. FIG. 4 is an end view showing the operation of the main part of the separator cutting device 100 following FIG. FIG. 5 is an end view showing the operation of the main part of the separator cutting device 100 following FIG.

    The separator cutting device 100 cuts the separator substrate 10, a transport unit 110 that transports the separator substrate 10, a collection unit 120 that holds and collects the end material 10 </ b> P cut from the separator substrate 10. A laser cutting unit 130 is included. Further, the separator cutting device 100 controls the operations of the carry-out unit 140 for carrying out the separator 11 cut from the separator substrate 10, the transport unit 110, the recovery unit 120, the laser cutting unit 130, and the carry-out unit 140. Part 150 is included. Hereafter, each structure of the separator cutting device 100 is demonstrated in order.

  The structure of the conveyance part 110 is demonstrated referring FIG. 1 and FIG.

  The supply roller 111 of the transport unit 110 has a cylindrical shape, and holds the long separator base material 10 wound around it. The first transport roller 112 and the second transport roller 113 have an elongated cylindrical shape, and the separator base material 10 is placed in a state where a constant tension is applied to the separator base material 10 wound around the supply roller 111. Guide to the conveyor belt 114. The conveyance belt 114 corresponds to a conveyance member. The conveyance belt 114 is an endless belt having a plurality of suction ports provided on the outer peripheral surface, and conveys the separator substrate 10 along the conveyance direction X in a sucked state. The drive roller 115 is disposed opposite to both ends of the inner peripheral surface of the conveyor belt 114 together with the driven roller 116. The conveying belt 114 is rotated by the driving roller 115. The driven roller 116 rotates according to the rotation of the driving roller 115. Two sets of transport units including the transport belt 114, the drive roller 115, and the driven roller 116 are arranged along the transport direction X.

  The configuration of the collection unit 120 will be described with reference to FIGS.

  The suction hand 121 corresponds to a holding member. The suction hand 121 moves to a first position K1 that is proximal to the separator substrate 10 and holds the end material 10P that is cut from the separator substrate 10. The suction hand 121 includes a rectangular main body 121a having a built-in suction mechanism, and a suction part 121b attached to the main body 121a and formed in a cylindrical shape. The suction hand 121 having a rectangular parallelepiped shape is disposed along a direction Y intersecting the transport direction X. The suction hand 121 is mounted on the Z-axis stage 123 and the X-axis stage 124. When the separator substrate 10 is being transported by the transport belt 114, the suction hand 121 is relative to the separator substrate 10 shown in FIGS. The first position K1 is moved from the second position K2 that is relatively distal to the first position K1 that is relatively proximal.

  The suction device 122 corresponds to a recovery member. The suction device 122 is held by the holding member (suction hand 121) moved to the second position K2 which is distal to the first position K1 shown in FIGS. The end material 10P is sucked and collected. The aspirator 122 is disposed above the transport unit 110 in FIG. The suction device 122 includes a main body portion 122a that incorporates a suction mechanism and temporarily holds the end material 10P, and a suction portion 122b that protrudes from the main body portion 122a and has a cylindrical shape. The suction part 122b is disposed along the direction Y intersecting the transport direction X, and opens a slot-like opening part 122c. The opening 122c is disposed outward in a direction (stacking direction Z) intersecting the transport direction X of the separator substrate 10. The suction device 122 sucks the end material 10P from the opening portion 122c into the main body portion 122a through the suction portion 122b.

  The Z-axis stage 123 moves along the stacking direction Z, and moves the suction hand 121 toward and away from the transport unit 110. As shown in FIG. 1, the Z-axis stage 123 joins the suction hand 121. The Z-axis stage 123 is disposed on the side of the transport unit 110 along the transport direction X. The X-axis stage 124 moves along the transport direction X, and moves the suction hand 121 along the transport direction X via the Z-axis stage 123. As shown in FIG. 1, the X-axis stage 124 is joined to the Z-axis stage 123. The suction hand 121 is arbitrarily moved along the stacking direction Z and the transport direction X by the Z-axis stage 123 and the X-axis stage 124.

  As shown in FIG. 3, the support plate 125 abuts on and supports the separator substrate 10 being conveyed. The support plate 125 is made of metal and is formed long. The support plate 125 is disposed between the adjacent conveyance belts 114 of the conveyance unit 110 and along a direction Y that intersects the conveyance direction X. The support plate 125 includes slits that allow the laser beams L1 and L2 to pass through on the surface facing the separator substrate 10.

  The attenuation plate 126 attenuates the intensity of the laser beams L1 and L2. As shown in FIG. 3, the attenuation plate 126 is disposed below the support plate 125 in the drawing along the stacking direction Z. The holder 126a of the attenuation plate 126 is made of metal and is formed in a long shape with a U-shaped cross section. The holder 126a is disposed along a direction Y that intersects the transport direction X. Attenuating material 126b is attached to the holder 126a on the surface facing the support plate 125. The damping material 126b is made of black alumina and has a long shape. The attenuating material 126b absorbs and attenuates the laser beams L1 and L2.

  The dust collector 127 collects cutting dust generated from the cut portion when the separator substrate 10 is cut. The dust collector 127 faces the Z-axis stage 123 along the transport direction X and is disposed in the vicinity of the support plate 125. A suction tube 127b is attached to a pump 127a having a built-in dust collecting function. The suction tube 127b has a cylindrical shape that can be expanded and contracted.

  The configuration of the laser cutting unit 130 will be described with reference to FIGS. 1, 2, and 4.

  The laser cutting unit 130 is disposed above the conveyance unit 110 as shown in FIG. The cutting member (laser light source 131) is made of a carbon dioxide laser, for example. The laser light source 131 irradiates and cuts the separator base material 10 with the laser light L <b> 1 through the reflection mirror 132. The reflection mirror 132 continuously changes the reflection direction of the laser beams L1 and L2 derived from the laser light source 131 so that the laser beams L1 and L2 intersect and intersect the transport direction X with respect to the separator substrate 10. Irradiate. On the other hand, even if the separator base material 10 is cut such that the laser beams L1 and L2 are irradiated to the separator base material 10 so as to be orthogonal to the transport direction X, and the rectangular end material 10P is generated Good.

  As shown in FIG. 4, the laser light source 131 straddles the suction hand 121 moved to the first position K <b> 1 to irradiate the laser beam L <b> 1 and L <b> 2 to the separator base material 10 to form the separator 11. If two reflecting mirrors 132 are disposed as shown in FIG. 1 and a mirror relatively close to the laser light source 131 is driven by a motor or the like so as to be removed from the optical path of the laser light L1, a laser light source is obtained. The laser beam L 1 can be incident on a mirror that is relatively distant from 131. Alternatively, the separator substrate 10 can be irradiated with the laser beams L1 and L2 by arranging only one reflection mirror 132 and driving it with a motor or the like so as to be movable in the transport direction X.

  The configuration of the carry-out unit 140 will be described with reference to FIGS. 1 and 2.

  The carry-out unit 140 is disposed on the downstream side in the transport direction X from the transport unit 110. The suction pad 141 has a plate shape, and a plurality of suction ports are provided on the surface that sucks the separator 11. The elastic member 142 is located above the suction pad 141 in the stacking direction Z shown in FIG. One end of the elastic member 142 is joined to the suction pad. The expansion / contraction member 142 can expand and contract along the stacking direction Z by using an air compressor or the like as power. The support column 143 supports the other end facing the one end of the elastic member 142. The X-axis stage 144 is disposed along the side in the transport direction X, and moves the column 143 along the transport direction X. The mounting table 145 has a plate shape, and temporarily stores and stores the separator 11 sucked and carried out by the suction pad 141.

  The configuration of the control unit 150 will be described with reference to FIG.

  The controller 151 of the control unit 150 includes a ROM, a CPU, and a RAM. ROM (Read Only Memory) stores control programs related to the transport unit 110, the recovery unit 120, the laser cutting unit 130, and the carry-out unit 140, respectively. A CPU (Central Processing Unit) controls the operation of the separator cutting device 100 based on a control program. A RAM (Random Access Memory) temporarily stores data relating to each component being controlled.

  Next, the operation of the separator cutting device 100 of the embodiment will be described.

  As shown in FIG. 3, the transport unit 110 transports the separator base material 10 every time the separator 11 is formed by the transport belt 114. At the same time, as shown in FIG. 3, the collecting unit 120 moves the suction hand 121 from the second position K2 to the first position K1 when the separator substrate 10 is being transported. In other words, the separator base 10 is transported by the transport belt 114 and at the same time, the suction hand 121 is brought close to the separator base 10.

  Next, as shown in FIG. 4, the laser cutting unit 130 extends the laser beam L <b> 1 and L <b> 2 derived from the laser light source 131 to the separator substrate 10 so as to straddle the suction hand 121 moved to the first position K <b> 1. To form the separator 11. Next, as shown in FIG. 5, the suction hand 121 moves to the second position K <b> 2 that is distal to the first position K <b> 1 with respect to the separator substrate 10. As shown in FIG. 5, the suction device 122 sucks and collects the end material 10P held by the suction hand 121 moved to the second position K2. Next, the carry-out unit 140 temporarily places the separator 11 cut and molded on the mounting table 145 and stores it.

  As described above, the separator cutting device 100 is a device that forms the rectangular separator 11 by cutting the long separator base material 10 so that a cut piece (end material 10P) is generated. The separator cutting device 100 includes a conveying member (conveying belt 114) that conveys the separator substrate 10 every time the separator 11 is formed. Further, the holding member (suction hand 121) that moves to the first position K1 that is proximal to the separator substrate 10 and holds the end material 10P cut from the separator substrate 10 is provided. In addition, it has a cutting member (laser light source 131) for forming the separator 11 by irradiating the separator base material 10 with the laser beams L1 and L2 across the suction hand 121 moved to the first position K1. Further, a collecting member (suction) that sucks and collects the end material 10P held by the suction hand 121 moved to the second position K2 that is distal to the first position K1 with respect to the separator substrate 10. Instrument 122). Here, in the separator cutting device 100, the suction hand 121 moves from the second position K2 to the first position K1 when the separator substrate 10 is being transported by the transport belt 114.

  The separator cutting method is a method of forming the rectangular separator 11 by cutting the long separator base material 10 so that a cut piece (end material 10P) is generated. In the separator cutting method, the first holding member (suction hand 121) that holds the cut piece (end material 10 </ b> P) is proximal to the separator substrate 10 while conveying the separator substrate 10. A preparation step of moving to the position K1. In addition, the laser beam L1 and L2 are irradiated to both ends straddling the portion (corresponding to the portion that becomes the end material 10P) facing the suction hand 121 that has moved to the first position K1 to generate the end material 10P. A molding step of molding the separator 11; Further, the suction hand 121 holding the end material 10P is moved to the second position K2 distal to the first position K1 with respect to the separator substrate 10, and the end material 10P is sucked and recovered. Process.

  According to such a separator cutting device 100 and a cutting method, the holding member (suction hand 121) is placed on the separator substrate 10 when the separator substrate 10 is being conveyed by the conveying member (conveying belt 114). On the other hand, it moves from the distal second position K2 to the proximal first position K1. Therefore, the operation related to the conveyance of the separator base material 10 and the part of the operation related to the recovery of the cut piece (end material 10P) cut from the separator base material 10 can be performed simultaneously. That is, by efficiently collecting the end material 10P, the time required to form the separator 11 from the separator substrate 10 can be shortened, and the production efficiency of the separator 11 can be improved.

  In the separator cutting device 100, the holding member (suction hand 121) is separated from the cut piece (end material 10 </ b> P) when the cutting member (laser light source 131) irradiates the separator base material 10 with the laser beams L <b> 1 and L <b> 2. It can be set as the structure contact | abutted to this part.

  If comprised in this way, when cut | disconnecting the base material 10 for separators and cutting out the separator 11, the part used as the end material 10P of the base material 10 for separators can fully be hold | maintained. Therefore, it is possible to prevent the portion serving as the end material 10P from vibrating or shifting during the cutting with the laser beams L1 and L2, and after the separator base material 10 is cut, the end material 10P is quickly moved to the aspirator 122. Can be made.

  In the separator cutting device 100, the opening 122 c of the recovery member (suction unit 122) that sucks the cut piece (end material 10 </ b> P) is outward in the direction intersecting the transport direction X of the separator substrate 10 (stacking direction Z). It can be set as the structure opened toward.

  If comprised in this way, when the suction device 122 will attract | suck the end material 10P, the base material 10 for separators and the cut | disconnected separator 11 will be attracted | sucked or sucked by the airflow accompanying the suction. There is no. Therefore, the separator base material 10 can be transported and the separator 11 can be unloaded without being affected by the suction of the end material 10P by the suction device 122.

(Modification 1 of embodiment)
With reference to FIG. 7, the modification 1 of a separator cutting device is demonstrated.

  FIG. 7 is an end view showing a main part according to Modification 1 of the separator cutting device.

  In the first modification of the embodiment, the configuration in which the recovery unit 220 moves the suction hand 121 to rotate using the θ stage 221 uses the Z-axis stage 123 and the X-axis stage 124 in the recovery unit 220 described above. Different from the configuration in which the hand 121 is moved. In the first modification of the embodiment, the same reference numerals are used for components having the same configuration as that of the above-described embodiment, and the description thereof is omitted.

  In the collection unit 220, the θ stage 221 is disposed in parallel with the transport unit 110 along the transport direction X. A rotation shaft portion 221a is provided at one end of the θ stage 221, and the rotation shaft portion 221a is disposed below the stacking direction Z in FIG. A support portion 221b is provided at the other end opposite to one end of the θ stage 221, and the suction hand 121 is rotatably attached to the support portion 221b. The suction hand 121 sets the position of the center of gravity to the suction portion 121b side so that the suction portion 121b faces the separator substrate 10 regardless of the rotation angle of the θ stage 221. The θ stage 221 rotates the suction hand 121 that sucks the end material 10P in the clockwise direction in FIG. On the other hand, the θ stage 221 rotates the suction hand 121 counterclockwise in FIG. 7 to bring it close to the separator substrate 10 transported by the transport unit 10.

  If comprised in this way, the adsorption | suction hand 121 can be moved like a pendulum using only the (theta) stage 221, and it can reciprocate between the base material 10 for separators and the suction device 122. FIG. Therefore, the tact required for cutting the separator substrate 10 can be shortened by moving the suction hand 121 at a high speed by simple control including only the rotation of the θ stage 221.

(Modification 2 of embodiment)
With reference to FIG. 8, the modification 2 of a separator cutting device is demonstrated.

  FIG. 8 is an end view showing a main part according to Modification 2 of the separator cutting device.

  In the second modification of the embodiment, the collection unit 320 moves the suction hand 121 using only the Z-axis stage 123. In the collection unit 220 described above, the suction hand 121 uses the Z-axis stage 123 and the X-axis stage 124. It is different from the configuration to move. In the second modification of the embodiment, the same reference numerals are used for the components having the same configuration as that of the above-described embodiment, and the description thereof is omitted.

  In the collection unit 320, the Z-axis stage 123 moves the suction hand 121 upward in the stacking direction Z in FIG. The suction device 122 is disposed along the stacking direction Z of the Z-axis stage 123, and the opening 122 c faces the downstream side along the transport direction X. The suction hand 121 that has sucked the end material 10 </ b> P is moved upward in FIG. 7 by the Z-axis stage 123 and is adjacent to the suction device 122. The suction device 122 sucks and collects the end material 10P sucked by the suction hand 121.

  If comprised in this way, the adsorption | suction hand 121 can be moved along the lamination direction Z using only the Z-axis stage 123, and can be reciprocated between the separator base material 10 and the suction device 122. Therefore, the tact required for cutting the separator substrate 10 can be shortened by moving the suction hand 121 at high speed only in the stacking direction Z by simple control including only the Z-axis stage 123.

(Modification 3 of embodiment)
With reference to FIG. 9, the modification 3 of a separator cutting device is demonstrated.

  FIG. 9 is a perspective view showing a main part according to Modification 3 of the separator cutting device.

  In the second modification of the embodiment, the configuration in which the collection unit 420 uses the suction hand 421 capable of simultaneously sucking a plurality of locations of the separator base material 10 is different from the configuration using the suction hand 121 of the collection unit 120 described above. In the third modification of the embodiment, the same reference numerals are used for components having the same configuration as that of the above-described embodiment, and the description thereof is omitted.

  In the collection unit 420, the suction hand 421 includes suction units 421b at both ends of a C-shaped main body 421a. A pair of adsorption | suction part 421b adsorb | sucks the both ends of the direction Y which cross | intersected the conveyance direction X of the base material 10 for separators, respectively. When the reflection direction of the laser light derived from the laser light source 131 is continuously changed and the laser light L2 is irradiated linearly to the separator substrate 10 so as to be orthogonal to the transport direction X, the end of the separator 11 Are formed in a straight line. On the other hand, when the laser beams L1 and L2 derived from the laser light source 131 are alternately scanned so as to be orthogonal to and intersecting the transport direction X with respect to the separator substrate 10, the end portions of the separator 11 are It is formed in a convex bowl shape with a central portion protruding. When the hook-shaped portion of the separator 11 is brought into close contact with the exterior material, position shift can be prevented.

  If comprised in this way, the edge material 10P which generate | occur | produced in the base material 10 for separators by the adsorption | suction hand 421 provided with the adsorption | suction part 421b at the both ends of the C-shaped main-body part 421a will make the part used as the separator 11 into part. It can collect | recover so that it may straddle, and the cutting shape of the base material 10 for separators can be set arbitrarily.

  The present invention is not limited to the embodiments described above, and can be modified as appropriate.

  For example, in the embodiment, the configuration has been described in which the cut piece (end material 10P) is sucked by the holding member (suction hand 121), but the present invention is not limited to this configuration. That is, the present invention can also be applied to a configuration in which a cut piece (end material 10P) is pierced, adhered, or held by a holding member.

  Moreover, in embodiment, although the separator 11 cut and formed from the base material 10 for separators demonstrated as what consists of polypropylenes, this invention is not limited to this structure. The present invention can also be applied to so-called ceramic separators in which a ceramic layer corresponding to a heat-resistant material is laminated on a polypropylene layer corresponding to a molten material to improve heat resistance.

10 Separator substrate,
10P mill ends,
11 Separator,
11R joint,
20 positive electrode,
21 positive electrode current collector,
21a positive electrode terminal,
30 negative electrode,
31 negative electrode current collector,
31a negative electrode terminal,
32 negative electrode active material,
100 separator cutting device,
110 transport section,
111 supply roller,
112 first conveying roller,
113 second conveying roller,
114 conveyor belt,
115 driving roller,
116 driven roller,
120 collection department,
121 suction hand,
121a body part,
121b adsorption part,
122 aspirator,
122a body part,
122b suction part,
122c opening,
123 Z-axis stage,
124 X axis stage,
125 support plate,
126 damping plate,
126a holder,
126b damping material,
127 dust collector,
127a pump,
127b suction tube,
130 laser cutting part,
131 Laser light source (cutting member),
132 reflection mirror,
140 Unloading part,
141 suction pads,
142 telescopic member,
143 struts,
144 X axis stage,
145 mounting table,
150 control unit,
151 controller,
220 collection unit,
221 θ stage,
221a rotating shaft,
221b support,
320 collection unit,
420 collection unit,
421 suction hand,
421a main body,
421b adsorption part,
K1 first position,
K2 second position,
L1, L2 laser light,
X (in the separator substrate 10) transport direction,
Y direction (crossing the transport direction X),
Z Laminate direction (of separator 11).

Claims (4)

A separator cutting device that cuts a long separator substrate so as to generate a cut piece to form a rectangular separator,
A transport member for transporting the separator substrate each time the separator is molded;
A holding member that moves to a first position that is proximal to the separator substrate and holds the cut piece cut from the separator substrate;
A cutting member that forms the separator by irradiating the base material for separator across the holding member moved to the first position by irradiating with a laser beam;
A collecting member that sucks and collects the cut pieces held by the holding member moved to a second position that is distal to the first position with respect to the separator substrate; ,
The separator cutting device, wherein the holding member moves from the second position to the first position when the separator base material is being conveyed by the conveying member.   The separator cutting device according to claim 1, wherein the holding member is in contact with a portion to be the cutting piece when the cutting member irradiates the separator base material with laser light.   3. The separator cutting device according to claim 1, wherein an opening of the recovery member that sucks the cut piece is opened outward in a direction intersecting a conveyance direction of the separator base material. A separator cutting method for forming a rectangular separator by cutting a long separator substrate so that a cut piece is generated,
A preparatory step of moving the holding member that holds the cut piece to a first position that is proximal to the separator substrate while conveying the separator substrate;
A molding step of molding the separator while generating the cut pieces by irradiating and cutting the laser beam on both ends straddling the portion where the holding member moved to the first position faces;
A recovery step of moving the holding member holding the cut piece to a second position that is more distal than the first position with respect to the separator substrate, and sucking and collecting the cut piece; A separator cutting method comprising: