JP2015107516A - Cutting device and method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cutting device and method, which can prevent adhering of cut dust to a formed part when cutting a base material to form the formed part.SOLUTION: A cutting device has a cutting member, a first shield member, a second shield member, a seal member, a collection part and a control part. The first shield member encloses the circumference between the cutting member and a cut part of a base material and shields them in a state of freely taking in outside air. The second shield member encloses a distant side from the cut part of the base material with respect to the cutting member and shields the same in a state of freely taking in outside air. The seal member is arranged to freely approach to and separate from the first shield member or the second shield member and seals between the first shield member and the cut part or between the cut part and the second shield member. The collection part sucks in and collects cut dust of the base material via the insides of the first shield member and the second shield member, respectively, and sucks in and collects cut pieces via the inside of the first shield member or the second shield member.

Description

  The present invention relates to a cutting device and a cutting method.

  2. Description of the Related Art Conventionally, there is an apparatus for forming a molded product corresponding to, for example, a constituent member of an electric device by continuously cutting a long base material. Some of these apparatuses collect dust generated when a substrate is cut and prevent the dust from adhering to a molded product. For example, a configuration is disclosed in which the periphery of a cutting site is surrounded by a shutter, and the shutter is rotated to form an ascending air current and suck dust (see Patent Document 1).

JP 2007-301716 A

  However, in the configuration of Patent Document 1, it is difficult to sufficiently prevent cutting dust from adhering to the molded product when the molded product is molded by cutting the base material. That is, it is difficult to sufficiently collect dust because the vicinity of the cutting site of the base material and the distal side of the cutting member relative to the cutting member are exposed to the outside. When a molded product to which cutting dust adheres is laminated with another constituent member, the cutting dust may press the molded product or the constituent member to cause damage.

  The present invention has been made in order to solve the above-described problems, and includes a cutting apparatus and a cutting method that can prevent cutting dust from adhering to a molded product when the molded product is molded by cutting the substrate. For the purpose of provision.

  The cutting device according to the present invention that achieves the above object is a device that cuts a long base material to form a molded product. The cutting device includes a cutting member, a first shielding member, a second shielding member, a sealing member, a recovery unit, and a control unit. A cutting member cut | disconnects a base material so that a cut piece may be generated between adjacent molded articles. A 1st shielding member surrounds the circumference | surroundings between a cutting member and the cutting site | part of a base material, and shields it in the state which can take in external air. The second shielding member surrounds the distal side relative to the cutting member with respect to the cutting portion of the base material and shields the air in a state in which outside air can be taken in. The sealing member is disposed so as to be close to and away from the first shielding member or the second shielding member, and seals between the first shielding member and the cutting site or between the cutting site and the second shielding member. . The collecting unit sucks and collects the cut dust of the base material through the inside of the first shielding member and the second shielding member, and sucks the cut piece through the inside of the first shielding member or the second shielding member. And collect. The control unit causes the cutting member to cut the base material, causes the sealing member to seal between the first shielding member and the cutting site, or between the cutting site and the second shielding member, and causes the recovery unit to perform the first shielding member. The inside of the second shielding member is sucked.

  The cutting method according to the present invention that achieves the above object is a method of forming a molded product by cutting a long substrate. The cutting method has a shielding process, a cutting process, a sealing process, and a recovery process. In the shielding step, the first shielding region that shields the cutting portion of the base material from one side and the second shielding region that shields and surrounds the cutting portion from the side of the other surface facing the one surface, respectively. It is formed in a state where it can be taken in freely. A cutting process cut | disconnects a cutting | disconnection site | part so that a cutting piece may be generated between adjacent molded articles. The sealing step seals between the first shielding region and the cutting site or between the cutting site and the second shielding region. The collecting step sucks the cut pieces present in the first shielding region or the second shielding region while sucking and collecting the cutting dust of the base material present in each of the first shielding region and the second shielding region through different flow paths. And collect.

  In the cutting apparatus and the cutting method of the present invention, the base material is shielded separately from both sides, the base material is cut and then the cutting part is sealed, and the cutting dust is sucked separately from both sides of the cutting part, Suction the piece from either side. That is, cutting dust is removed from both sides of the cutting site by suctioning both sides of the cutting site independently. Therefore, when cutting a base material and shape | molding a molded product, after removing a cut piece, it can prevent that cutting dust adheres to a molded product.

It is a schematic diagram which shows the state which cut | disconnects the base material for ceramic separators with a cutting device. It is a perspective view showing the cutting device concerning a 1st embodiment. It is a perspective view which decomposes | disassembles and shows the principal part of FIG. FIG. 3 is a cross-sectional view in which the main part of FIG. 2 is shown exploded and taken along the line A-A ′ while the ceramic separator substrate is not shown. It is a figure which shows the shielding process and cutting process which concern on 1st Embodiment. It is a figure which shows the principal part of a shielding process and a cutting process. It is a figure which shows a sealing process and a collection process. It is a figure which shows a conveyance process, a sealing process, and a collection | recovery process. It is a figure which shows a static elimination process. It is a perspective view which shows the principal part of the one cutting device which concerns on the modification 1 of 1st Embodiment. It is a perspective view which shows the principal part of the other cutting device which concerns on the modification 1 of 1st Embodiment. It is sectional drawing which shows the principal part of the cutting device which concerns on the modification 2 of 1st Embodiment. It is a perspective view which shows the cutting device which concerns on the modification 3 of 1st Embodiment. It is sectional drawing which shows the principal part of the cutting device which concerns on 2nd Embodiment.

  Hereinafter, first and second embodiments of the present invention will be described with reference to the accompanying drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted. The sizes and ratios of the members in the drawings are exaggerated for convenience of explanation and may be different from the actual sizes and ratios. In FIGS. 2 to 14, the azimuth is indicated by using arrows represented by X, Y, and Z. The direction of the arrow represented by X indicates the conveyance direction X of the ceramic separator substrate 10. The direction of the arrow represented by Y indicates the crossing direction Y that intersects the transport direction X. The direction of the arrow represented by Z indicates the stacking direction Z of the ceramic separator 11 in the transfer unit 180.

(First embodiment)
1 to FIG. 1 show a cutting method for cutting a long base material (for example, ceramic separator base material 10) to form a molded product (for example, ceramic separator 11), and a cutting apparatus 100 that embodies the cutting method. This will be described with reference to FIG.

  First, the principal part of the cutting device 100 will be described with reference to FIG.

  FIG. 1 is a schematic diagram illustrating a state in which the ceramic separator substrate 10 is cut by the cutting device 100.

  The cutting device 100 is a device that cuts a long base material (for example, the ceramic separator base material 10) to form a molded product (for example, the ceramic separator 11). The cutting device 100 includes a cutting member (corresponding to the laser oscillator 111), a first shielding member (corresponding to the cover 121), a second shielding member (corresponding to the box-shaped duct 131), a sealing member (corresponding to the shutter 141), a recovery Part 150 and control part 190.

  The laser oscillator 111 cuts the ceramic separator substrate 10 so as to generate the end material 12 between the adjacent ceramic separators 11.

  The cover 121 surrounds the periphery between the laser oscillator 111 and the cut portion 10s of the ceramic separator substrate 10 and shields the air in a state in which outside air can be taken in.

  The box-shaped duct 131 surrounds the distal side with respect to the laser oscillator 111 with respect to the cutting portion 10s of the ceramic separator substrate 10 and shields it in a state in which outside air can be taken in.

  In the configuration shown in FIG. 1A, the shutter 141 is disposed so as to be close to and away from the cover 121, and seals between the cover 121 and the cut portion 10s. On the other hand, in the configuration shown in FIG. 1B, the shutter 141 is disposed so as to be able to approach and separate from the box-shaped duct 131 and seals between the cutting site 10 s and the box-shaped duct 131.

  The collection unit 150 collects the cut powder 13 of the ceramic separator substrate 10 by suction through the inside of the cover 121 and the box-shaped duct 131. Furthermore, the collection | recovery part 150 attracts | sucks and collects the end material 12 through the inside of the box-shaped duct 131 in the structure shown to FIG. 1 (A). On the other hand, in the configuration shown in FIG. 1B, the collection unit 150 collects the end material 12 by sucking it through the inside of the cover 121.

  The control unit 190 controls the operations of the laser oscillator 111, the shutter 141, and the recovery unit 150. Here, in the configuration shown in FIG. 1A, the control unit 190 causes the laser oscillator 111 to cut the ceramic separator base material 10 and causes the shutter 141 to seal between the cover 121 and the cutting site 10s for recovery. The part 150 sucks the inside of the cover 121 and the box-shaped duct 131. On the other hand, in the configuration shown in FIG. 1B, the control unit 190 causes the laser oscillator 111 to cut the ceramic separator base material 10 and causes the shutter 141 to seal between the cut portion 10s and the box-shaped duct 131. The collection unit 150 sucks the inside of the cover 121 and the box-shaped duct 131.

  Next, the configuration of the cutting device 100 will be described with reference to FIGS.

  FIG. 2 is a perspective view showing the cutting device 100. FIG. 3 is an exploded perspective view showing a main part of FIG. FIG. 4 is a cross-sectional view in which the main part of FIG. 2 is shown exploded along the line A-A ′ while the ceramic separator substrate 10 is not shown.

  In addition to the cutting unit 110, the first shielding unit 120, the second shielding unit 130, the sealing unit 140, the recovery unit 150, and the control unit 190, the cutting device 100 includes a static elimination unit 160, a transport unit 170, and a transfer unit. 180 is provided.

  2 to 4, the cutting unit 110 cuts the ceramic separator substrate 10 by the laser oscillator 111 so that the end material 12 is generated between the adjacent ceramic separators 11.

  The cutting part 110 is disposed so as to face the ceramic separator substrate 10 conveyed by the conveying part 170 and to be adjacent to the first shielding part 120 along the stacking direction Z. The cutting unit 110 includes a laser oscillator 111.

  The laser oscillator 111 irradiates and cuts the laser beam L1 condensed on the ceramic separator substrate 10. The laser oscillator 111 corresponds to, for example, a carbon dioxide laser oscillator. The laser oscillator 111 is bonded to the housing 123 of the first shielding unit 120. The laser oscillator 111 scans the laser light L1 in the transport direction X and the cross direction Y by a galvanometer mirror provided inside. The laser oscillator 111 transmits the laser light L1 derived from the emission port 111a shown in FIG. 4 to the ceramic separator substrate 10 shown in FIG. 3 through a long opening 123c opened in the housing 123 at one end 123a. Irradiate the cut site 10s. The laser light L1 that has passed through the ceramic separator substrate 10 is incident on the box-shaped duct 131 of the second shielding part 130 and attenuates.

  The first shielding part 120 is shown in FIGS. 2 to 4, and surrounds the periphery between the laser oscillator 111 and the cutting part 10 s of the ceramic separator base material 10 by the cover 121 and the like, and shields in a state in which outside air can be taken in. To do.

  In the first shielding part 120, being able to take in outside air means that these regions are not completely sealed and fluid can flow from the outside to the inside. That is, when the inside of the first shielding part 120 is depressurized by being sucked by the collecting part 150, air can flow from the outside toward the inside.

  The first shielding unit 120 is disposed facing the second shielding unit 130 along the stacking direction Z so as to sandwich the ceramic separator substrate 10 conveyed by the conveying unit 170. The first shielding unit 120 includes a cover 121, a sealing ring 122, a housing 123, a support plate 124, a column 125, and a Z-axis linear motion stage 126.

  The cover 121 prevents the cutting powder 13 generated at the time of cutting the cutting site 10 s by the cutting part 110 from scattering and adhering to the ceramic separator substrate 10 or the ceramic separator 11. The cover 121 has a frame shape and penetrates from one end 121a along the stacking direction Z to the other end 121b. The cover 121 includes a slit-shaped insertion port 121c on the side facing the upstream side in the transport direction X, and allows the shutter 141 of the sealing unit 140 to be inserted along the transport direction X. The insertion port 121 c extends in a long shape along the intersecting direction Y and is formed to be slightly larger than the side surface of the shutter 141.

  The sealing ring 122 seals the gap between the cover 121 and the ceramic separator substrate 10. Furthermore, the sealing ring 122 presses the periphery of the cutting part 10s so that the cutting part 10s is not displaced when the ceramic separator substrate 10 is cut by the cutting part 110. The sealing ring 122 is made of Teflon having elasticity. The sealing ring 122 is formed in an endless shape and includes a notch. The sealing ring 122 is bonded to the cover 121 by applying an adhesive to the cutout portion and then inserting it into the outer peripheral edge of one end 121 a of the cover 121.

  The casing 123 supports the cover 121 that moves along the stacking direction Z while shielding the space between the laser oscillator 111 and the cover 121 of the cutting unit 110. The casing 123 has a frame shape in which one end 123a in the stacking direction Z is sealed. The laser oscillator 111 is joined to one end 123 a of the casing 123, and the other end 121 b of the cover 121 is inserted into the other end 123 b of the casing 123. The outer peripheral surface of the cover 121 is brought into contact with the inner peripheral surface of the casing 123. A long opening 123c through which the laser beam L1 of the laser oscillator 111 passes is provided at one end 123a of the casing 123. The opening 123c extends in a long shape along the intersecting direction Y. The casing 123 includes a circular disposal port 123d on the side surface facing the downstream side in the transport direction X, and communicates with one end of the first cylindrical duct 151 of the collection unit 150.

  The casing 123, the cover 121, and the sealing ring 122 constitute an integral shielding member along the stacking direction Z. That is, the casing 123, the cover 121, and the sealing ring 122 are scattered so as to be reflected toward the laser oscillator 111 out of the cutting powder 13 scattered in all directions from the cutting site 10 s by irradiation of the laser light L 1 from the laser oscillator 111. The cut powder 13 is captured. The cutting powder 13 is sucked and removed through the first cylindrical duct 151 from the waste outlet 123d of the recovery unit 150. The casing 123 may be configured such that the cover 121 is sufficiently in contact without depending on the inclination of the ceramic separator substrate 10 by connecting the cover 121 using a bellows configuration.

  The support plate 124 and the column 125 are auxiliary members for moving the cover 121 along the stacking direction Z. The support plate 124 is formed in a plate shape. The support plate 124 is joined to both ends of the cover 121 along the crossing direction Y on the one end 121a side of the cover 121. The support | pillar 125 is formed in the column shape. The struts 125 are respectively joined to the pair of support plates 124 so as to protrude from the pair of support plates 124 in the stacking direction Z toward the housing 123 side. The Z-axis linear movement stage 126 moves the cover 121 along the stacking direction Z. The Z-axis linear motion stage 126 is joined to both sides along the intersecting direction Y of the casing 123. The Z-axis linear motion stage 126 drives the support column 125 connected to the cover 121 via the support plate 124 along the stacking direction Z.

  The second shielding part 130 is shown in FIGS. 2 to 4, and the box-shaped duct 131 surrounds the distal side with respect to the laser oscillator 111 with respect to the cutting part 10 s of the ceramic separator substrate 10, and can take in outside air. Shield in state.

  In the second shielding part 130, being able to take in outside air means that these regions are not completely sealed, and fluid can flow from the outside to the inside. In other words, when the inside of the second shielding part 130 is sucked by the collecting part 150 and is depressurized, air can flow from the outside toward the inside.

  The second shielding unit 130 is disposed facing the first shielding unit 120 along the stacking direction Z so as to sandwich the ceramic separator substrate 10 conveyed by the conveying unit 170. The second shielding unit 130 is provided between the pair of conveyance belts 173 provided in the conveyance unit 170 and arranged in parallel along the conveyance direction X. The second shielding part 130 includes a box-shaped duct 131.

  The box-shaped duct 131 temporarily stores the end material 12 and the cutting powder 13 through the opening 131a. In particular, the box-shaped duct 131 prevents the cutting powder 13 from scattering and adhering to the ceramic separator substrate 10 and the ceramic separator 11 when being cut by the cutting portion 110. The box-shaped duct 131 has a rectangular shape and has a space inside. The box-shaped duct 131 includes a rectangular opening 131 a on the surface facing the ceramic separator substrate 10. The shape of the opening 131 a corresponds to the shape of the end portion of the ceramic separator 11. The box-shaped duct 131 includes a circular disposal port 131b on one side surface in the intersecting direction Y, and communicates with one end of the second cylindrical duct 153 of the collection unit 150.

  The box-shaped duct 131 captures the end material 12 that is separated from the cut portion 10 s by the irradiation of the laser beam L <b> 1 by the laser oscillator 111. Similarly, the box-shaped duct 131 scatters further to the distal side than the cutting site 10 s with respect to the laser oscillator 111 out of the cutting powder 13 scattered in all directions from the cutting site 10 s by irradiation of the laser beam L <b> 1 by the laser oscillator 111. The cut powder 13 is captured. Furthermore, the box-shaped duct 131 sufficiently attenuates the laser light L1 that has passed through the cutting site 10s by causing it to diffusely reflect or multiply reflect on the inner peripheral surface. The end material 12 and the cutting powder 13 accommodated in the box-shaped duct 131 are sucked and removed from the waste outlet 131b of the recovery unit 150 through the second cylindrical duct 153.

  The sealing part 140 is shown in FIGS. 2 to 4, and the shutter 141 is disposed so as to be close to and away from the cover 121, and the space between the cover 121 and the cutting part 10 s of the ceramic separator substrate 10 is provided by the shutter 141. Seal.

  The sealing unit 140 is disposed so as to be bonded to the first shielding unit 120. The sealing unit 140 includes a shutter 141 and an X-axis linear motion stage 142.

  The shutter 141 seals the open part of the first shielding part 120. The open part corresponds to one end 121a of the cover 121 of the first shielding part 120, and faces the cutting part 10s of the ceramic separator substrate 10. That is, the shutter 141 causes the inside of the first shielding unit 120 to be depressurized when the inside of the first shielding unit 120 is sucked by the collection unit 150. The shutter 141 is formed in a thin plate shape. The shutter 141 is inserted through the insertion port 121 c of the cover 121 and is movable along the transport direction X. When the shutter 141 moves downstream in the transport direction X, the lower portion of the cover 121 is sealed. On the other hand, when the shutter 141 moves to the upstream side in the transport direction X, the lower portion of the cover 121 is opened.

  The X-axis linear movement stage 142 moves the shutter 141 along the conveyance direction X. The X-axis linear movement stage 142 is joined to both sides in the intersecting direction Y above in FIG. 2 along the stacking direction Z of the insertion port 121c of the cover 121. The X axis linear movement stage 142 reciprocates the shutter 141 along the transport direction X based on the controller 191 of the control unit 190.

  2 to 4, the collecting unit 150 sucks and collects the cut powder 13 of the ceramic separator base material 10 through the inside of the cover 121 and the box-shaped duct 131 and collects the end material 12 in a box shape. The suction is collected through the inside of the duct 131.

  The collection unit 150 is connected to the housing 123 of the first shielding unit 120 and is connected to the box-shaped duct 131 of the second shielding unit 130. The collection unit 150 includes a first cylindrical duct 151, a first suction unit 152, a second cylindrical duct 153, and a second suction unit 154.

  The first cylindrical duct 151 causes the cutting powder 13 generated along with the cutting of the ceramic separator substrate 10 to flow through the first suction device 152. The first cylindrical duct 151 is a straight pipe having a space inside. The first cylindrical duct 151 has one end connected to the disposal port 123 d of the housing 123 and the other end connected to the opening of the first suction device 152.

  The 1st suction device 152 decompresses etc. by attracting | sucking the inside of the 1st shielding part 120, and collect | recovers the cutting powder 13 which exists in the inside. The first suction device 152 is composed of a vacuum pump and a collection box. The first suction device 152 discards the cutting powder 13 sucked by the vacuum pump into the collection box while removing it with a filter. The cutting powder 13 collected in the collection box is periodically discarded to the outside according to the cutting amount of the ceramic separator substrate 10.

  The second cylindrical duct 153 distributes the end material 12 and the cutting powder 13 generated along with the cutting of the ceramic separator substrate 10 to the second suction device 154. Similar to the first cylindrical duct 151, the second cylindrical duct 153 is a straight pipe having a space inside. The second cylindrical duct 153 has one end connected to the disposal port 131 b of the box-shaped duct 131 and the other end connected to the opening of the second suction device 154.

  The second suction unit 154 reduces the pressure by sucking the inside of the second shielding part 130 and collects the end material 12 and the cutting powder 13 existing in the inside. Similar to the first suction unit 152, the second suction unit 154 includes a vacuum pump and a collection box. The second suction device 154 discards the end material 12 and the cutting powder 13 sucked by the vacuum pump into a collection box while removing them with a filter. The end material 12 and the cutting powder 13 collected in the collection box are periodically discarded to the outside according to the cutting amount of the ceramic separator substrate 10 and the size of the end material 12.

  2 to 4, the static elimination unit 160 removes static electricity charged on the ceramic separator substrate 10 and the like by the ionizer 161.

  The charge removal unit 160 is disposed between the first shielding unit 120 and the second shielding unit 130 in parallel along the transport direction X. The static elimination unit 160 includes an ionizer 161.

  The ionizer 161 removes static electricity charged in the ceramic separator substrate 10 and the like due to the cutting of the ceramic separator substrate 10. The ionizer 161 generates corona discharge by a high voltage applied to the tip of the discharge needle. Ions generated in the air by corona discharge are blown toward the cut portion 10 s of the ceramic separator substrate 10. The blown ions neutralize and remove the static electricity of the ceramic separator substrate 10 charged by the irradiation of the laser light L1 and the static electricity in the optical path of the laser light L1. The charged ceramic separator substrate 10 includes a ceramic separator 11, an end material 12, and cutting powder 13. The ionizer 161 prevents electrostatic breakdown and malfunction of electronic equipment due to static electricity.

  The transport unit 170 transports the ceramic separator 11 cut into a rectangular shape by the cutting unit 110 while transporting the long ceramic separator substrate 10 shown in FIG.

  The transport unit 170 is disposed so as to extend between the first shielding unit 120 and the second shielding unit 130 to the transfer unit 180. The conveyance unit 170 includes a supply roller 171, a conveyance roller 172, a conveyance belt 173, and a driving roller 174.

  The supply roller 171 supplies the ceramic separator substrate 10 to the conveying belt 173 side. The supply roller 171 is formed in a cylindrical shape longer than the lateral width of the ceramic separator substrate 10. The supply roller 171 is disposed along the cross direction Y. When the elongated ceramic separator substrate 10 is pulled by the conveyor belt 173, the supply roller 171 rotates following the rotation, and pulls out the wound ceramic separator substrate 10.

  The conveyance roller 172 guides the ceramic separator substrate 10 drawn from the supply roller 171 to the conveyance belt 173 in a state where a certain tension is applied. The conveying roller 172 is formed in a cylindrical shape having a smaller diameter than the supply roller 171 and longer than the lateral width of the ceramic separator substrate 10. The conveyance roller 172 is disposed along the cross direction Y. The transport roller 172 rotates following the ceramic separator substrate 10 pulled by the transport belt 173 while pressing the ceramic separator substrate 10.

  The transport belt 173 transports the ceramic separator substrate 10 along the transport direction X while sucking the ceramic separator substrate 10. The conveyor belt 173 is endless and has a width longer than the lateral width of the ceramic separator substrate 10. One conveyance belt 173 is provided on each of the upstream side and the downstream side in the conveyance direction X with respect to the first shielding unit 120 and the second shielding unit 130 arranged to face each other in the stacking direction Z. doing.

  The driving roller 174 rotates the support belt 173 while supporting it from the inner peripheral surface side. A plurality of drive rollers 174 are arranged along the cross direction Y so as to press outward from the inner peripheral surface of the conveyor belt 173. One of the plurality of drive rollers 174 is a drive roller provided with power, and the other is a driven roller provided with no power. When the driving roller is rotated, the driven roller that presses the conveying belt 173 is rotated while the conveying belt 173 pressed by the driving roller rotates.

  The transfer unit 180 temporarily stores the ceramic separator 11 transported by the transport unit 170 in the mounting table 185 shown in FIG.

  The transfer unit 180 is disposed downstream of the transport unit 170 along the transport direction X of the ceramic separator 11. The transfer unit 180 includes a suction pad 181, a telescopic member 182, an X-axis transport stage 183, an X-axis auxiliary rail 184, and a mounting table 185.

  The suction pad 181 sucks the ceramic separator 11. The suction pad 181 is formed in a rectangular shape that is slightly smaller than the ceramic separator 11. The suction pad 181 is provided with a plurality of suction ports in a matrix on the surface in contact with the ceramic separator 11. The suction pad 181 sucks and adsorbs the ceramic separator 11 from the suction port using an air compressor or the like as power.

  The elastic member 182 moves the suction pad 181 along the stacking direction Z. The elastic member 182 is formed by combining cylindrical shapes having different diameters. The lower part of the elastic member 182 is joined to the suction pad 181. The expansion / contraction member 182 can be expanded and contracted along the stacking direction Z by using an air compressor or the like as power.

  The X-axis transport stage 183 and the X-axis auxiliary rail 184 reciprocate the extendable member 182 along the transport direction X. The X-axis transfer stage 183 is formed in a long shape. The X-axis transport stage 183 is disposed along the transport direction X above the transport unit 170 in FIG. 2 along the stacking direction Z. The X-axis transfer stage 183 has a built-in drive motor. The X-axis auxiliary rail 184 is formed in a long shape like the X-axis transfer stage 183. The X-axis auxiliary rail 184 is disposed in parallel with the X-axis transport stage 183. The X-axis auxiliary rail 184 prevents the telescopic member 182 attached to the X-axis transport stage 183 from being inclined, and assists the movement of the telescopic member 182 by the X-axis transport stage 183.

  The mounting table 185 temporarily stores the ceramic separator 11 transported by the transport unit 170. The mounting table 185 is formed in a rectangular shape larger than the ceramic separator 11. The transfer unit 180 sucks the ceramic separator 11 transported by the transport unit 170 by the suction pad 181 while extending the elastic member 182. The X-axis transport stage 183 and the X-axis auxiliary rail 184 transport the suction pad 181 that sucks the ceramic separator 11 to the upper side of the mounting table 185 in FIG. After the expansion / contraction member 182 that has been reduced during conveyance is extended, the suction pad 181 stops the suction of the ceramic separator 11. The mounting table 185 mounts the ceramic separator 11 separated from the suction pad 181.

  As shown in FIG. 2, the control unit 190 controls at least the operations of the cutting member (laser oscillator 111), the sealing member (shutter 141), and the recovery unit 150.

  Specifically, the control unit 190 causes the cutting member (laser oscillator 111) to cut the base material (the ceramic separator base material 10), and causes the sealing member (shutter 141) to move between the cover 121 and the cutting portion 10s. Sealing is performed, and the collection unit 150 sucks the inside of the cover 121 and the second shielding member (box-shaped duct 131).

  In the first embodiment, the control unit 190 controls the constituent members of the cutting unit 110, the first shielding unit 120, the sealing unit 140, the recovery unit 150, the charge removal unit 160, the transport unit 170, and the transfer unit 180. . The control unit 190 includes a controller 191.

  The controller 191 includes a ROM, a CPU, and a RAM. A ROM (Read Only Memory) stores a control program for the cutting apparatus 100. The control program includes the laser oscillator 111 of the cutting unit 110, the Z-axis translation stage 126 of the first shielding unit 120, the X-axis translation stage 142 of the sealing unit 140, and the first aspirator 152 and the second of the recovery unit 150. The aspirator 154 is activated. The control program also operates the ionizer 161 of the static elimination unit 160, the drive roller 174 of the transport unit 170, the telescopic member 182 of the transfer unit 180, and the X-axis transport stage 183.

  A CPU (Central Processing Unit) controls the operation of each component of the cutting device 100 based on a control program. A RAM (Random Access Memory) temporarily stores various data related to each component of the cutting device 100 controlled by the CPU. The data relates to, for example, the output of the laser oscillator 111 of the cutting unit 110 and the driving distance of the Z-axis linear motion stage 126 of the first shielding unit 120.

  Next, the cutting method embodied by the cutting device 100 will be described with reference to FIGS.

  FIG. 5 is a diagram illustrating a shielding process and a cutting process. FIG. 6 is a diagram showing a main part of the shielding step and the cutting step. FIG. 7 is a diagram illustrating a sealing process and a recovery process. FIG. 8 is a diagram illustrating a transport process, a sealing process, and a recovery process. FIG. 9 is a diagram illustrating a static elimination process.

  The shielding process corresponds to the first shielding part 120 and the second shielding part 130. As shown in FIG. 5, the shielding step encloses the first shielding region that shields and cuts the cut portion 10s of the ceramic separator substrate 10 from the one surface side, and the cut portion 10s from the other surface side facing the one surface. And the second shielding region to be shielded are formed in a state in which outside air can be taken in.

  In the first shielding region and the second shielding region, being able to take in outside air means that these regions are not completely sealed, and fluid can flow into the inside from the outside. In other words, when the inside of the first shielding area and the second shielding area is sucked by the recovery unit 150 and the inside is depressurized, air can flow from the outside toward the inside.

  As shown in FIG. 5, the first shielding region is scattered so as to be reflected toward the laser oscillator 111 out of the cutting powder 13 scattered in all directions from the cutting site 10 s with the irradiation of the laser beam L <b> 1 by the laser oscillator 111. The cut powder 13 is shielded. The first shielding area includes a sealing ring 122 and a casing 123 in addition to the cover 121 of the first shielding part 120, and shields the cutting powder 13.

  As shown in FIG. 5, the second shielding region surrounds the distal side with respect to the laser oscillator 111 with respect to the cutting portion 10 s of the ceramic separator substrate 10, and the cutting portion 10 s is irradiated by the laser light L <b> 1 by the laser oscillator 111. The end material 12 that is spaced apart from is captured. Furthermore, the 2nd shielding area | region was disperse | distributed with respect to the laser oscillator 111 in the distal side rather than the cutting | disconnection site | part 10s among the cutting powders 13 which scattered in all directions from the cutting | disconnection part 10s by irradiation of the laser beam L1 by the laser oscillator 111. The cutting powder 13 is caught. The second shielding area is constituted by a box-shaped duct 131 and shields the end material 12 and the cutting powder 13.

  The cutting process corresponds to the cutting part 110 as shown in FIG. In the cutting step, as shown in FIG. 5, the cutting part 10 s is cut so as to generate the end material 12 between the adjacent ceramic separators 11. Specifically, in the cutting step, the laser oscillator 111 irradiates the ceramic separator substrate 10 with the laser light L1, and cuts the cutting portion 10s. The laser oscillator 111 scans the laser beam L1 in the transport direction X and the cross direction Y. The laser beam L1 that has passed through the ceramic separator substrate 10 enters the box-shaped duct 131 and is attenuated.

  In the cutting step, the ceramic separator 11 forms a protruding portion at least at one end by cutting the cutting portion 10 s so as to generate the end material 12 between the adjacent ceramic separators 11. Such a protruding portion is effective in a configuration in which, for example, in an electric device such as a secondary battery, a power generation element formed by alternately stacking electrodes and separators is sealed with an exterior material. That is, when the outer peripheral portion of the laminate sheet corresponding to the exterior material is welded to seal the power generation element, the protruding portion of the ceramic separator 11 can also be fixed. Therefore, even if the secondary battery vibrates during use, it is possible to prevent the positions of the constituent members of the power generation element from shifting.

  In the cutting step, as shown in FIG. 6, the laser beam L <b> 1 is applied to the ceramic separator substrate 10 by the laser oscillator 111 in a state where the space between the cover 121 and the ceramic separator substrate 10 is sealed by the sealing ring 122. To do. Since the cutting powder 13 corresponds to so-called spatter and scatters around, the sealing ring 122 enhances the shielding effect of the first shielding region. Furthermore, the sealing ring 122 presses the periphery of the cutting part 10s so that the cutting part 10s is not displaced when the ceramic separator substrate 10 is cut by the cutting part 110.

  As shown in FIG. 7, the sealing step seals between the first shielding region and the cut portion 10s. Specifically, in the sealing step, the space between the cover 121 and the cut site 10s is sealed by the shutter 141 of the sealing unit 140.

  As shown in FIG. 7, the collecting step is performed by sucking and collecting the cutting powder 13 of the ceramic separator substrate 10 present in each of the first shielding region and the second shielding region through different flow paths. The end material 12 present in the container is sucked and collected. Specifically, in the collection process, the collection unit 150 sucks the inside of the cover 121 and the box-shaped duct 131.

  Here, as shown in FIG. 8, the recovery process is performed while the transport process transports the ceramic separator substrate 10 and the ceramic separator 11 while the shielding process retracts the cover 121 from the ceramic separator substrate 10. Then, the suction inside the cover 121 and the box-shaped duct 131 is continued. Similarly, also in the sealing step, the shutter 141 keeps sealing between the cover 121 and the cut portion 10s.

  As shown in FIG. 9, the static elimination process neutralizes static electricity charged when the ceramic separator substrate 10 is cut by the cutting unit 110 of the cutting device 100. In the static elimination process, the ionizer 161 blows ions generated in the air by corona discharge toward the cutting portion 10s of the ceramic separator substrate 10 as indicated by T1 in the figure. The blown ions remove static electricity charged in the ceramic separator 11, the end material 12, and the cutting powder 13.

  The cutting method which cut | disconnects the elongate base material (for example, the base material 10 for ceramic separators) which concerns on 1st Embodiment mentioned above, and shape | molds a molded article (for example, ceramic separator 11), and the cutting which embodied the cutting method According to the apparatus 100, there exists an effect by the following structures.

  The cutting method is a method of cutting a long substrate (ceramic separator substrate 10) to form a molded product (ceramic separator 11). The cutting method has a shielding process, a cutting process, a sealing process, and a recovery process. The shielding step includes a first shielding region that shields and cuts the cut portion 10s of the ceramic separator substrate 10 from one surface side, and a second shielding region that surrounds and shields the cutting portion 10s from the other surface side facing the one surface. Are formed in a state in which outside air can be taken in freely. In the cutting step, the cutting part 10 s is cut so as to generate the end material 12 between the adjacent ceramic separators 11. The sealing step seals between the first shielding region and the cutting site 10s or between the cutting site 10s and the second shielding region. The collecting step is present in the first shielding region or the second shielding region while sucking and collecting the cutting powder 13 of the ceramic separator substrate 10 present in each of the first shielding region and the second shielding region through different flow paths. The end material 12 to be collected is sucked and collected.

  The cutting device 100 is a device that cuts a long base material (for example, the ceramic separator base material 10) to form a molded product (for example, the ceramic separator 11). The cutting device 100 includes a cutting member (corresponding to the laser oscillator 111), a first shielding member (corresponding to the cover 121), a second shielding member (corresponding to the box-shaped duct 131), a sealing member (corresponding to the shutter 141), a recovery Part 150 and control part 190.

  In the cutting device 100, the laser oscillator 111 cuts the ceramic separator substrate 10 so as to generate the end material 12 between the adjacent ceramic separators 11. The cover 121 surrounds the periphery between the laser oscillator 111 and the cut portion 10s of the ceramic separator substrate 10 and shields the air in a state in which outside air can be taken in. The box-shaped duct 131 surrounds the distal side with respect to the laser oscillator 111 with respect to the cutting portion 10s of the ceramic separator substrate 10 and shields it in a state in which outside air can be taken in. The shutter 141 is disposed so as to be close to and away from the cover 121 or the box-shaped duct 131, and the collection unit 150 seals between the cover 121 and the cutting site 10 s or between the cutting site 10 s and the box-shaped duct 131. Sucks and collects the cutting powder 13 of the ceramic separator substrate 10 through the cover 121 and the box-shaped duct 131 and sucks the end material 12 through the cover 121 or the box-shaped duct 131. And collect. The control unit 190 controls the operations of the laser oscillator 111, the shutter 141, and the recovery unit 150.

  Here, in the cutting device 100, the control unit 190 causes the laser oscillator 111 to cut the ceramic separator substrate 10, and causes the shutter 141 to connect the cover 121 and the cutting portion 10s or between the cutting portion 10s and the box-shaped duct 131. The gap is sealed, and the collection unit 150 sucks the inside of the cover 121 and the box-shaped duct 131.

  According to such a cutting device 100 and a cutting method, the ceramic separator base material 10 is separately shielded from both sides, the ceramic separator base material 10 is cut, and then the cutting part 10s is sealed, and the cutting part While the cutting powder 13 is sucked separately from both sides of 10s, the end material 12 is sucked from either side. That is, the cutting powder 13 is removed from both sides of the cutting site 10s by sucking both sides of the cutting site 10s independently. Therefore, when cutting the ceramic separator substrate 10 to form the ceramic separator 11, it is possible to prevent the cutting powder 13 from adhering to the ceramic separator 11 after removing the end material 12. Furthermore, since the one side and the other side of the cutting site 10s are sucked independently from each other, the cutting powder 13 can be removed by the rectified airflow in each region. That is, for example, the cutting powder 13 can be sufficiently prevented from adhering to the ceramic separator 11 from one side of the cutting site 10s to the other side.

  Furthermore, in the cutting device 100, at least one of the cover 121 or the box-shaped duct 131 is brought into close contact with the ceramic separator substrate 10 when the laser oscillator 111 is cutting the ceramic separator substrate 10. it can.

  According to such a configuration, at least one of the cover 121 or the box-shaped duct 131 can enhance the shielding effect around the cutting site 10s and prevent the cutting powder 13 from being scattered outside. Furthermore, when at least one of the cover 121 or the box-shaped duct 131 cuts the ceramic separator substrate 10 by the laser oscillator 111, the position of the cut portion 10s can be prevented from shifting.

  Furthermore, in the cutting apparatus 100, at least one of the cover 121 or the box-shaped duct 131 is for a ceramic separator via an elastic sealing ring 122 provided along the outer peripheral edge of the opening facing the ceramic separator substrate 10. It can be adhered to the substrate 10.

  According to such a configuration, at least one of the cover 121 or the box-shaped duct 131 further enhances the shielding effect around the cutting site 10s by the elastic sealing ring 122 having elasticity, and the cutting powder 13 is scattered outside. Can be sufficiently prevented. Furthermore, at least one of the cover 121 or the box-shaped duct 131 can sufficiently prevent the position of the cutting portion 10 s from shifting when the ceramic separator substrate 10 is cut by the laser oscillator 111. In particular, when there is an error in the layer thickness in the stacking direction Z of the ceramic separator substrate 10, the error can be eliminated by expansion and contraction of the sealing ring 122, and sealing can be performed along the entire circumference of the outer peripheral edge.

  Further, the cutting device 100 may further include a static elimination member (ionizer 161). The static elimination member (ionizer 161) removes at least static electricity charged on the ceramic separator substrate 10.

  According to such a configuration, electrostatic breakdown due to static electricity can be prevented by the ionizer 161. Moreover, it is possible to prevent dust sucked by static electricity from adhering to the ceramic separator 11. Furthermore, malfunction of the cutting device 100 due to static electricity can be prevented. Further, it is possible to prevent the charged cutting powder 13 and the like from being electrically short-circuited with other members.

  Furthermore, in the cutting device 100, the shutter 141 can be inserted through the insertion opening opened in the cover 121 or the box-shaped duct 131.

  According to such a configuration, the shutter 141 can be positioned by the insertion port 121 c of the cover 121, for example. Therefore, even if the shutter 141 is moved a plurality of times so as to reciprocate, it can be prevented that the shutter 141 accumulates and deviates from the reference position. Furthermore, since the shutter 141 is supported by the insertion port 121c even if the inside of the cover 121 is decompressed by the collection unit 150, for example, the shutter 141 can be prevented from being inclined or curved.

  Further, in the cutting apparatus 100, the shutter 141 is close to or separated from the cutting site 10s together with one of the cover 121 and the box-shaped duct 131, and between the cover 121 and the cutting site 10s or between the cutting site 10s and the box-shaped duct 131. It can be set as the structure which seals between.

  According to such a configuration, the cutting powder 13 is adhered while the cover 121 is retracted from the ceramic separator substrate 10 or while the transport unit 170 is transporting the ceramic separator substrate 10 or the like. Can be prevented. Specifically, the cutting powder 13 flows backward from the first cylindrical duct 151, the cutting powder 13 attached to the inner peripheral surface of the cover 121 falls, or the cutting powder 13 accumulates on the upper surface of the cover 121 and falls off. Can be prevented. Therefore, it is possible to prevent the cutting powder 13 once separated from the cutting site 10 s from adhering to the ceramic separator substrate 10 or the ceramic separator 11 in the vicinity.

  Further, in the cutting device 100, the cutting member irradiates the laser beam L1 to the ceramic separator substrate 10 and cuts it, and the blade to which the ultrasonic wave is applied is pressed against the ceramic separator substrate 10 for cutting. It can be set as the structure which consists of a cutting blade which presses and cut | disconnects the cutting blade or the rotated circular blade to the base material 10 for ceramic separators.

  Thus, the cutting by the cutting member includes laser cutting, cut forming, dicing and the like. As the cutting member, an optimum member can be applied to various base materials in which cut pieces and cutting dust are generated when the base material is cut.

  Furthermore, in the cutting method, it can be set as the structure provided with the conveyance process which conveys the base material 10 for ceramic separators, and the ceramic separator 11. FIG. Here, in the collection step, the suction can be continued while the ceramic separator substrate 10 and the ceramic separator 11 are being conveyed in the conveyance step.

  According to such a configuration, while the transporting process transports the ceramic separator substrate 10 and the ceramic separator 11, the cutting powder 13 once separated from the cutting site 10 s becomes the ceramic separator substrate 10 and the ceramic separator 11. It can prevent adhering to the vicinity.

  Further, in the cutting method, the base material is formed by laminating a sheet-like molten material (for example, polypropylene) and a heat-resistant material (for example, ceramic) laminated on the molten material and having a higher melting temperature than the molten material. Can do. Such a substrate corresponds to, for example, the ceramic separator substrate 10.

  Thus, as an example, the base material used for cutting is excellent in heat resistance and effective as a separator. On the other hand, a base material for a ceramic separator formed by coating a sheet-like polypropylene with a ceramic that easily generates cutting powder at the time of cutting. Is preferred.

(Modification 1 of the first embodiment)
Cutting devices 200 and 300 according to Modification 1 of the first embodiment will be described with reference to FIGS. 10 and 11.

  Unlike the cutting device 100 according to the first embodiment described above, the cutting devices 200 and 300 according to the first modification of the first embodiment are configured so that the sealing portions 240 and 340 are independent of the first shielding portions 220 and 320, respectively. It is arranged.

  In the modification 1 of 1st Embodiment, about the thing which consists of a structure similar to 1st Embodiment mentioned above, the same code | symbol is used and the description mentioned above is abbreviate | omitted.

  First, the configuration of the cutting device 200 will be described with reference to FIG.

  FIG. 10 is a perspective view showing a main part of the cutting device 200.

  The sealing unit 240 is disposed independently of the first shielding unit 120 and moves the shutter 241 along the transport direction X. The sealing unit 240 includes a shutter 241 and an X-axis linear movement stage 242.

  The shutter 241 seals one end 121 a of the cover 121. The shutter 241 is formed in a thin plate shape. The shutter 241 is inserted through the insertion port 121 c of the cover 121 and is movable along the transport direction X. The X-axis linear movement stage 242 moves the shutter 241 along the transport direction X. The X-axis linear motion stage 242 is upstream of the first shielding unit 120 in the transport direction X and in the drawing along the stacking direction Z than the ceramic separator substrate 10 transported by the transport unit 170. Arranged above. The X-axis linearly moving stage 242 is a pair and is separated from each other in the cross direction Y. The pair of X-axis linear motion stages 242 are disposed away from the cover 121. The pair of X-axis linearly moving stages 242 moves the shutter 241 upstream in the transport direction X before the cover 121 moves upward in the stacking direction Z in the drawing, and extracts the shutter 241 from the insertion port 121c. .

  Next, the configuration of the cutting device 300 will be described with reference to FIG.

  FIG. 11 is a perspective view showing a main part of the cutting device 300.

  The first shielding unit 320 has the same configuration as the first shielding unit 120 except for the cover 321. The cover 321 has the same configuration as the cover 121 except for the position and shape of the insertion port 321c.

  The cover 321 is provided with slit-like insertion ports 321 c on both side surfaces along the intersecting direction Y so as to face each other, and allows a pair of shutters 341 to be inserted along the intersecting direction Y. The insertion port 321 c extends in a long shape along the transport direction X and is formed to be slightly larger than the side surface of the shutter 341.

  The sealing unit 340 is disposed independently of the first shielding unit 320 and moves the pair of shutters 341 in the same direction facing the crossing direction Y. The sealing unit 340 includes a shutter 341 and a Y-axis linear movement stage 342.

  The shutter 341 includes a pair and seals one end 321a of the cover 321. The pair of shutters 341 make contact with each other to form one shutter. The pair of shutters 341 are each formed in a thin plate shape. The pair of shutters 341 are inserted so as to face each other from the pair of insertion ports 321 c of the cover 321, and are movable along the intersecting direction Y. The Y-axis linearly moving stage 342 includes a pair, and moves the pair of shutters 341 so as to approach and separate from each other along the cross direction Y. The pair of Y-axis linear motion stages 342 are disposed to face both ends in the cross direction Y with the cover 321 interposed therebetween. The pair of Y-axis linear motion stages 342 are disposed away from the cover 121. The pair of Y-axis linearly moving stages 342 moves the pair of shutters 341 away from each other along the crossing direction Y before the cover 321 moves upward in the drawing in the stacking direction Z. 341 is extracted from the insertion port 121c.

  The static eliminator 160 is a view of the ionizer 161 on the upstream side in the transport direction X from the first shielding unit 120 and along the stacking direction Z from the ceramic separator substrate 10 transported by the transport unit 170. It is arranged in the middle upper part. The ionizer 161 prevents interference with the sealing portion 340 by being disposed at the above position. Here, since the ionizer 161 is disposed along the cutting site 10s extending in the intersecting direction Y, the static electricity charged during the cutting of the ceramic separator substrate 10 is effectively neutralized.

  According to the cutting method according to the first modification of the first embodiment described above, and the cutting devices 200 and 300 that embody the cutting method, the following effects are obtained.

  In the cutting devices 200 and 300, the shutters 241 and 341 are close to or separated from the cutting site 10s separately from the covers 321 and 321, and between the covers 321 and 321 and the cutting site 10s or between the cutting site 10s and the box-shaped duct 131. Seal between.

  According to such a configuration, in the cutting devices 200 and 300, the configuration of the drive system of the first shielding portions 220 and 230 can be simplified. That is, since the covers 221 and 321 are not equipped with the shutters 241 and 341 and the like, the specifications relating to the load resistance of the Z-axis linear motion stage 126 that moves the shutters 241 and 341 and the like along the stacking direction Z are lowered. be able to.

(Modification 2 of the first embodiment)
A cutting device 400 according to Modification 2 of the first embodiment will be described with reference to FIG.

  Unlike the cutting device 100 according to the first embodiment described above, the cutting device 400 according to the second modification of the first embodiment moves the shutter 441 along the outer peripheral surface of the cover 121.

  In the second modification of the first embodiment, the same reference numerals are used for components having the same configuration as in the first embodiment described above, and the above description is omitted.

  The configuration of the cutting device 400 will be described with reference to FIG.

  FIG. 12 is a cross-sectional view showing a main part of the cutting device 400.

  The sealing unit 440 is disposed adjacent to the first shielding unit 120 and moves the opening plate 442 along the outer peripheral surface of the cover 121. The sealing unit 440 includes a shutter 441, an opening plate 442, a roller 443, a first linear motion stage 444, and a second linear motion stage 445.

  The opening plate 442 opens the one end 121 a of the cover 121. The opening plate 442 is formed in a thin plate shape and is freely bendable. The opening plate 442 opens inside the outer peripheral edge. The shutter 441 includes a pair, and is attached to and supported by both ends of the opening plate 442. The shutter 441 may be formed from a long stainless plate, and an opening may be provided in the stainless plate to form the opening plate 442. The shutter 441 is formed in a long thin plate shape and is freely bendable. The shutter 441 moves along the outer peripheral surface of the cover 121. Specifically, the shutter 441 extends along a surface facing the upstream side of the cover 121 in the transport direction X, one end 121a corresponding to the opening of the cover 121, and a surface facing the downstream side of the cover 121 in the transport direction X. Move back and forth.

  The roller 443 facilitates the movement of the shutter 441 to which the aperture plate 442 is attached. The rollers 443 are disposed at one end 121 a of the cover 121 and on the upstream side and the downstream side along the transport direction X, respectively. The first translation stage 444 and the second translation stage 445 move the shutter 441 to which the aperture plate 442 is attached so as to reciprocate along the outer peripheral surface of the cover 121. The first linear motion stage 444 is bonded to a surface of the cover 121 that faces the downstream side in the transport direction X, and holds the one end 441a of the shutter 441. The second linear motion stage 445 is bonded to the surface of the cover 121 facing the upstream side in the transport direction X, and holds the other end 441b of the shutter 441.

  In the configuration shown in FIG. 12A, the opening plate 442 is positioned on the side surface of the cover 121 by moving the gripping portion of the second linear motion stage 445 backward while moving the gripping portion of the first linear motion stage 444 forward. doing. Here, one end 121 a of the cover 121 is sealed by the shutter 441, and the inside of the cover 121 and the box-shaped duct 131 is sucked by decompression or the like with the suction by the collection unit 150. On the other hand, in the configuration shown in FIG. 12B, the opening plate 442 moves one end of the cover 121 by advancing the gripping portion of the second linear motion stage 445 while retracting the gripping portion of the first linear motion stage 444. 121a. In the configuration shown in FIG. 12B, the cover 121 moves toward and contacts the ceramic separator substrate 10. Here, one end 121a of the cover 121 is opened by the opening plate 442, and the laser oscillator 111 irradiates the ceramic separator substrate 10 with the laser light L1.

  According to the cutting method according to the second modification of the first embodiment described above and the cutting device 400 that embodies the cutting method, the following effects can be obtained.

  In the cutting device 400, the shutter 441 moves close to or away from the cutting site 10s together with the cover 121 or the box-shaped duct 131. Furthermore, the shutter 441 seals between the cover 121 and the cutting site 10 s or between the cutting site 10 s and the box-shaped duct 131 while moving along the outer peripheral surface of the cover 121 or the box-shaped duct 131.

  According to such a structure, the sealing part 440 can be reduced in size. Further, the shutter 441 can easily prevent interference with components such as the collection unit 150 and the charge removal unit 160 disposed in the vicinity of the first shielding unit 120. Therefore, the collection unit 150, the charge removal unit 160, and the like have an increased degree of freedom in their arrangement.

(Modification 3 of the first embodiment)
A cutting apparatus 500 according to Modification 3 of the first embodiment will be described with reference to FIG.

  The cutting device 500 according to the third modification of the first embodiment is for a ceramic separator in which the first shielding unit 120 and the second shielding unit 130 in the cutting device 100 according to the first embodiment described above are conveyed by the conveying unit 170. The substrate 10 is reversed with respect to the reference. That is, the cutting device 500 reverses the top and bottom of the first shielding portion 120 and the second shielding portion 130 of the cutting device 100 with the ceramic separator substrate 10 as a boundary. Similarly, since the cutting part 110 and the sealing part 140 are adjacent to the first shielding part 120, the cutting part 110 and the sealing part 140 are reversed along the stacking direction Z via the ceramic separator substrate 10.

  In the modification 3 of 1st Embodiment, about the thing which consists of the structure similar to 1st Embodiment mentioned above, the same code | symbol is used and the description mentioned above is abbreviate | omitted.

  The configuration of the cutting device 500 will be described with reference to FIG.

  FIG. 13 is a perspective view showing the cutting device 500.

  The first shielding part 120 is disposed below the ceramic separator base material 10 in the drawing direction along the stacking direction Z, and surrounds the area between the laser oscillator 111 and the cut portion 10s of the ceramic separator base material 10. Enclosure and shield in a state in which outside air can be taken in freely. The second shield 130 is disposed above the ceramic separator substrate 10 in the drawing direction along the stacking direction Z, and is more distant from the laser oscillator 111 than the cutting portion 10 s of the ceramic separator substrate 10. Enclose the side and shield it in a state where outside air can be taken in freely. The cutting part 110 and the sealing part 140 adjacent to the first shielding part 120 are arranged below the ceramic separator substrate 10 in the drawing along the stacking direction Z.

  According to the cutting method according to the third modification of the first embodiment described above and the cutting device 500 embodying the cutting method, the laser oscillator 111 that requires regular maintenance and has a considerable weight is cut. By disposing at the lower part of the apparatus 500, handling can be facilitated and workability can be improved. Similarly, the first shielding part 120 has a larger number of constituent members than the second shielding part 130 and includes a plurality of constituent members that move to the constituent members. Thus, it is possible to easily cope with maintenance or malfunction. Furthermore, since the second shielding unit 130 is simpler and smaller in configuration than the first shielding unit 120, the transfer unit 180 can easily prevent interference with the second shielding unit 130.

(Second Embodiment)
A cutting apparatus 600 according to the second embodiment will be described with reference to FIG.

  Unlike the cutting device 100 according to the first embodiment, the cutting device 600 according to the second embodiment has a mechanism for collecting the end material 12 inside the first shielding part 620.

  In the second embodiment, the same reference numerals are used for components having the same configuration as in the first embodiment described above, and the above description is omitted.

  The configuration of the cutting device 600 will be described with reference to FIG.

  FIG. 14 is a cross-sectional view showing a main part of the cutting device 600.

  The first shielding part 620 has the same configuration as the first shielding part 120 except for the housing 623. The housing 623 has the same configuration as that of the housing 123 except for the shape and position of the disposal port 623d.

  The housing 623 includes a long waste port 623d at the upper part of the downstream side surface along the transport direction X. The discard port 623d extends along the intersecting direction Y. Even if the cover 121 moves upward in the drawing along the stacking direction Z, the discard port 623d is not blocked. The disposal port 623d is connected to the first rectangular tubular duct 651 of the collection unit 650.

  In addition to the first rectangular tube duct 651, the vacuum pad 655, the support base 656, and the moving stage 657, the collection unit 650 includes the first suction unit 152 and the second cylindrical duct that are the same components as the collection unit 150. 153 and a second suction device 154.

  The first rectangular tubular duct 651 causes the end material 12 and the cutting powder 13 generated along with the cutting of the ceramic separator substrate 10 to flow through the first suction device 152. The first rectangular tubular duct 651 is a straight pipe having a space inside and a rectangular cross section. The first rectangular tubular duct 651 is provided such that its longitudinal direction is along the crossing direction Y. The first rectangular tubular duct 651 has one end connected to the disposal port 623 d of the housing 623 and the other end connected to the opening of the first suction device 152.

  The vacuum pad 655 temporarily holds the end material 12. One vacuum pad 655 is disposed on each side of the cross direction Y inside the cover 121. The vacuum pad 655 is made of a member having elasticity and is formed in a cylindrical shape. The vacuum pad 655 is connected to a suction pump or the like, and sucks and holds the cut end material 12. The support base 656 supports the vacuum pad 655. The support base 656 is formed in an L shape. The support base 656 is connected to the moving stage 657. The moving stage 657 moves the vacuum pad 655 closer to and away from the cutting site 10s. The moving stage 657 is joined to each side surface of the cover 121 in the intersecting direction Y one by one. The moving stage 657 reciprocates the support base 656 supporting the vacuum pad 655 along the stacking direction Z.

  The operation of the cutting device 600 will be described with reference to FIG. When the ceramic separator substrate 10 is cut by the laser oscillator 111, the end material 12 is generated between adjacent ceramic separators. The vacuum pad 655 does not hinder the cutting of the ceramic separator substrate 10 by the laser oscillator 111 by being separated from the cutting site 10s. That is, the vacuum pad 655 does not interfere with the laser beam L1 in a state where the vacuum pad 655 is separated from the cutting site 10s. Next, the moving stage 657 lowers the vacuum pad 655 along the stacking direction Z and brings it close to the cutting site 10s. The vacuum pad 655 sucks and holds the cut end material 12. Next, the moving stage 657 raises the vacuum pad 655 along the stacking direction Z and brings it close to the waste outlet 623d of the housing 623. The collecting unit 650 sucks and collects the end material 12 held by the vacuum pad 655 through the first rectangular tubular duct 651.

  The cutting method which cut | disconnects the elongate base material (for example, the base material 10 for ceramic separators) which concerns on 2nd Embodiment mentioned above, and shape | molds a molded article (for example, ceramic separator 11), and the cutting which embodied the cutting method According to the apparatus 600, there exists an effect by the following structures.

  The collection unit 650 further includes a collection member (vacuum pad 655) and a moving member (moving stage 657). The vacuum pad 655 is disposed inside the cover 121 or the box-shaped duct 131 and temporarily holds the end material 12. The moving stage 657 moves the vacuum pad 655 away from the cutting site 10s. The control unit 190 causes the laser oscillator 111 to cut the ceramic separator substrate 10, holds the end material 12 on the vacuum pad 655, moves the vacuum pad 655 away from the cutting site 10 s on the moving stage 657, and covers the shutter 121 with the cover 121. Between the cutting portion 10s and the cutting portion 10s and the box-shaped duct 131 is sealed.

  According to such a structure, although the end material 12 has large weight compared with the cutting powder 13, it is forcedly moved to the vicinity of the 1st square cylindrical duct 651, and is reliably attracted | sucked and collect | recovered. be able to. Here, since the end material 12 is larger than the cutting powder 13, a relatively large suction force is required as compared with the case where the cutting powder 13 is sucked. However, since the end material 12 sucked by the collection unit 650 is sufficiently separated from the cutting site 10s, for example, it is possible to prevent the end portion of the ceramic separator 11 from rolling up due to suction. Furthermore, since the collection unit 650 moves the vacuum pad 655 within the cover 121, for example, interference between the vacuum pad 655 and other components can be easily avoided.

  In addition, the present invention can be variously modified based on the configurations described in the claims, and these are also within the scope of the present invention.

  In 1st and 2nd embodiment, although the elongate ceramic separator base material 10 was demonstrated as a structure which shape | molds the ceramic separator 11, it is not limited to such a structure. For example, a structure in which a separator substrate that is not coated with a long ceramic is cut to form a ceramic separator, or a structure in which a long electrode substrate is cut to form an electrode, etc. Or it can apply to the structure which shape | molds a mechanical device.

  In the first and second embodiments, the first shielding member (corresponding to the cover 121) has been described as being configured to approach and separate from the ceramic separator substrate 10, but is limited to such a configuration. There is nothing. For example, the first shielding member (corresponding to the cover 121) may be configured not to move in the state of being close to the ceramic separator substrate 10.

  In the first and second embodiments, the sealing member (corresponding to the shutter 141) has been described as moving while being inserted through the insertion port 121c of the first shielding member (corresponding to the cover 121). It is not limited to a simple configuration. For example, the sealing member (corresponding to the shutter 141) may be configured to move while contacting the one end 121a of the first shielding member (corresponding to the cover 121).

  In the first and second embodiments, after the base material (for example, the ceramic separator base material 10) is cut to form a molded product (for example, the ceramic separator 11), the molded product (for example, the ceramic separator 11) is temporarily used. However, the present invention is not limited to such a configuration. For example, the present invention can be applied to a configuration in which a packed electrode is formed by stacking an anode side separator, an electrode, and a cathode side separator in this order. That is, an anode and a cathode side separator are formed while cutting and forming an electrode while conveying a long electrode substrate, and conveying a long anode and cathode side separator substrate from both sides of the electrode, respectively. These are laminated while being cut. In such a configuration, a configuration corresponding to the first shielding member is provided close to the long anode-side separator base material so as to face the conveyance drum, and the second shielding member is provided on the outer circumferential surface of the conveyance drum. The anode side separator is cut and formed after the corresponding structure is embedded and provided. The cathode side separator base material has the same configuration.

  Further, in the first and second embodiments, the first shielding member (corresponding to the cover 121) and the second shielding member (corresponding to the box-shaped duct 131) are arranged to face each other along the stacking direction Z. However, it is not limited to such a configuration. For example, the base material (for example, the ceramic separator base material 10) is transported along the stacking direction Z, and the first shielding member (corresponding to the cover 121) and the second shielding member (corresponding to the box-shaped duct 131) are transported in the transporting direction X. It is good also as a structure arrange | positioned facing each other.

  In the first and second embodiments, the static elimination member (corresponding to the ionizer 161) has been described as being disposed outside the first shielding member (corresponding to the cover 121), but is limited to such a configuration. Never happen. For example, the static elimination member (corresponding to the ionizer 161) may be arranged inside the first shielding member (corresponding to the cover 121) or the casing 123. In such a configuration, static electricity generated during cutting of the base material (for example, the ceramic separator base material 10) by the cutting member (corresponding to the laser oscillator 111) is quickly removed.

  Moreover, in 1st and 2nd embodiment, although the conveyance part 170 demonstrated as a structure which conveys a base material (for example, the base material 10 for ceramic separators) and a molded article (for example, the ceramic separator 11) automatically, such a structure is demonstrated. The configuration is not limited. For example, it is good also as a structure which conveys any one of a base material (for example, the base material 10 for ceramic separators) or a molded article (for example, the ceramic separator 11) manually. Similarly, it is good also as a structure which each conveys a base material (for example, the ceramic separator base material 10) and a molded article (for example, the ceramic separator 11) manually.

  Moreover, in 2nd Embodiment, although demonstrated as a structure which arrange | positions the movement stage 657 inside the 1st shielding part 620, it is not limited to such a structure. For example, the support base 656 that supports the vacuum pad 655 together with the cover 121 may be moved by the Z-axis linear motion stage 126 provided in the housing 623.

  In addition, for example, the cutting device may be configured by combining arbitrary embodiments such that the configuration of the cutting device 300 according to the first modification of the first embodiment is combined with the configuration of the cutting device 600 according to the second embodiment. .

10 Substrate for ceramic separator (base material),
10s cleavage site,
11 Ceramic separator (molded product),
12 End material (cut piece),
13 Cutting powder (cutting dust),
100, 200, 300, 400, 500, 600 cutting device,
110 cutting part,
111 laser oscillator,
111a outlet,
120, 320, 620 first shielding part,
121,321,620 cover (first shielding member),
121a, 321a one end,
121b the other end,
121c, 321c insertion port,
122 sealing ring (sealing member),
123,623 housing,
123a one end,
123b the other end,
123c, 623c opening,
123d, 623d Waste port,
124 support plate 125 strut,
126 Z-axis linear motion stage,
130 second shielding part,
131 Box-shaped duct (second shielding member),
131a opening,
131b Waste port,
140, 240, 340, 440 sealing part,
141, 241, 341, 441 shutter,
142, 242, 342 X-axis linear motion stage,
441a one end,
441b the other end,
442 aperture plate,
443 Laura,
444 1st linear motion stage,
445 Second linear motion stage,
150,650 collection unit,
151 the first cylindrical duct,
152 first aspirator,
153 second cylindrical duct,
154 second suction device,
651 1st square cylindrical duct,
655 vacuum pad (collection member),
656 support,
657 moving stage (moving member),
160 Static neutralizer,
161 Ionizer (static elimination member),
170 transport section,
171 supply roller,
172 transport roller,
173 Conveyor belt,
174 driving roller,
180 transfer section,
181 suction pad,
182 elastic member,
183 X-axis transfer stage,
184 X-axis auxiliary rail,
185 mounting table,
190 control unit,
191 controller,
L1 laser light,
X transport direction,
Y crossing direction (crossing the transport direction X),
Z Stacking direction.

Claims (12)

A cutting device for cutting a long base material to form a molded product,
A cutting member for cutting the base material so as to generate a cut piece between the adjacent molded products;
A first shielding member that surrounds a periphery between the cutting member and the cutting portion of the base material and shields the surrounding air in a state in which outside air can be taken in;
A second shielding member that surrounds the distal side relative to the cutting member with respect to the cutting portion of the base material and shields in a state in which outside air can be taken in;
The first shielding member or the second shielding member is disposed so as to be close to and away from the first shielding member and seals between the first shielding member and the cutting portion or between the cutting portion and the second shielding member. A sealing member to be
While cutting and collecting the cut dust of the base material through the insides of the first shielding member and the second shielding member, the cut pieces are taken through the inside of the first shielding member or the second shielding member. A collecting part for sucking and collecting;
A control unit that controls the operation of the cutting member, the sealing member, and the recovery unit,
The control unit causes the cutting member to cut the base material and causes the sealing member to seal between the first shielding member and the cutting site or between the cutting site and the second shielding member. A cutting device that causes the collection unit to suck the inside of the first shielding member and the second shielding member. The collection unit
A collecting member that is disposed inside the first shielding member or the second shielding member and temporarily holds the cut piece;
A moving member that separates the recovery member from the cutting site;
The control unit causes the cutting member to cut the base material, causes the recovery member to hold the cutting piece, causes the moving member to separate the end material recovery member from the cutting site, and causes the sealing member to The cutting apparatus according to claim 1, wherein a gap between one shielding member and the cutting part or a part between the cutting part and the second shielding member is sealed.   The cutting apparatus according to claim 1 or 2, wherein at least one of the first shielding member and the second shielding member is in close contact with the base material when the cutting member is cutting the base material.   The at least one of the first shielding member or the second shielding member is in close contact with the base material via an elastic sealing member provided along an outer peripheral edge of an opening facing the base material. 4. The cutting device according to 3.   The cutting device according to any one of claims 1 to 4, further comprising a static elimination member that removes at least static electricity charged on the substrate.   The cutting device according to any one of claims 1 to 5, wherein the sealing member is inserted through an insertion opening opened in the first shielding member or the second shielding member. The sealing member is
Either close to or separate from the cutting site together with either the first shielding member or the second shielding member, or close to or separate from the cutting site separately from the first shielding member and the second shielding member,
The cutting device according to any one of claims 1 to 6, which seals between the first shielding member and the cutting portion or between the cutting portion and the second shielding member.   The first sealing member or the second shielding member is close to or away from the cutting site, and the sealing member moves along the outer peripheral surface of the first shielding member or the second shielding member, while the first shielding member or the second shielding member moves. The cutting device according to any one of claims 1 to 6, which seals between a shielding member and the cutting site or between the cutting site and the second shielding member.   The cutting member is a laser oscillator that irradiates and cuts the base material with a laser beam, a cutting blade that presses and cuts a blade to which ultrasonic waves are applied to the base material, or a rotated circular blade. The cutting device according to claim 1, comprising a cutting blade that presses and cuts the blade. A cutting method for forming a molded product by cutting a long substrate,
A first shielding region that surrounds and shields the cutting portion of the base material from one side and a second shielding region that shields and surrounds the cutting portion from the other surface side opposite to the one surface respectively capture outside air. A shielding process to be formed in a free state;
A cutting step of cutting the cutting portion so as to generate a cutting piece between the adjacent molded products;
A sealing step for sealing between the first shielding region and the cutting portion or between the cutting portion and the second shielding region;
The cutting existing in the first shielding region or the second shielding region while sucking and collecting the cutting dust of the base material existing in the first shielding region and the second shielding region, respectively, through different flow paths. A recovery step of sucking and recovering the pieces. A transporting step for transporting the base material and the molded product;
The cutting method according to claim 10, wherein the collecting step continues the suction while the base material and the molded product are conveyed by the conveying step.   The cutting method according to claim 10 or 11, wherein the base material is formed by laminating a sheet-like molten material and a heat-resistant material laminated on the molten material and having a higher melting temperature than the molten material. .