JP2015056609A5 - - Google Patents
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- Publication number
- JP2015056609A5 JP2015056609A5 JP2013190757A JP2013190757A JP2015056609A5 JP 2015056609 A5 JP2015056609 A5 JP 2015056609A5 JP 2013190757 A JP2013190757 A JP 2013190757A JP 2013190757 A JP2013190757 A JP 2013190757A JP 2015056609 A5 JP2015056609 A5 JP 2015056609A5
- Authority
- JP
- Japan
- Prior art keywords
- circuit device
- insertion hole
- bus bar
- fixing member
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000003780 insertion Methods 0.000 claims description 14
- 239000004020 conductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 11
- 239000002184 metal Substances 0.000 claims 9
- 238000000926 separation method Methods 0.000 claims 4
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 230000037250 Clearance Effects 0.000 description 1
- 230000035512 clearance Effects 0.000 description 1
Description
これによれば、固定部材からバスバーまでの空間距離を長くすることができる。なお、固定部材は、バスバーを回路装置に固定するために設けられており、電流を流すことを目的としない導体である。
上記回路装置について、前記カラーは、前記挿通孔に挿入されている挿入部を備え、前記挿入部の外面と前記挿通孔の内面との間に隙間を有することが好ましい。
According to this, the spatial distance from the fixing member to the bus bar can be increased. The fixing member is a conductor that is provided to fix the bus bar to the circuit device and is not intended to flow current.
About the said circuit apparatus, it is preferable that the said collar is provided with the insertion part inserted in the said insertion hole, and has a clearance gap between the outer surface of the said insertion part, and the inner surface of the said insertion hole.
Claims (6)
前記金属板の一面に設けられる絶縁層と、
前記絶縁層上に設けられる導体パターンと、を有する金属基板を備える回路装置であって、
前記絶縁層及び前記導体パターン上には、板状のバスバーが設けられ、
前記バスバーは、前記金属基板と対向する対向面と、前記対向面とは反対の面となる反対面と、を有し、
前記対向面は、前記金属基板と接触する接触部と、前記接触部と前記反対面との間に位置する面の少なくとも一部に設けられるとともに前記金属基板から離間した離間部を有することを特徴とする回路装置。 A metal plate,
An insulating layer provided on one surface of the metal plate;
A circuit device comprising a metal substrate having a conductor pattern provided on the insulating layer,
A plate-like bus bar is provided on the insulating layer and the conductor pattern,
The bus bar has a facing surface facing the metal substrate, and a facing surface that is a surface opposite to the facing surface,
The facing surface includes a contact portion that contacts the metal substrate, and a separation portion that is provided on at least a part of a surface located between the contact portion and the opposite surface and spaced from the metal substrate. A circuit device.
前記挿通孔の内周に前記離間部を有することを特徴とする請求項１に記載の回路装置。 The bus bar has an insertion hole through which a fixing member for fixing the bus bar to the metal substrate is inserted,
The circuit device according to claim 1, wherein the separation portion is provided on an inner periphery of the insertion hole.
前記絶縁基板上に設けられるとともに、挿通孔を有するバスバーと、
前記絶縁基板上に前記バスバーを固定する金属製の固定部材と、
前記固定部材が挿入される樹脂性のカラーと、を備え、前記カラーを介して前記挿通孔に前記固定部材が挿通された回路装置であって、
前記バスバーは、前記絶縁基板と対向する対向面と、前記対向面とは反対の面となる反対面と、を有し、
前記対向面は、前記絶縁基板と接触する接触部と、前記接触部と前記反対面との間に位置する面の少なくとも一部に設けられるとともに前記絶縁基板から離間した離間部を有し、
前記離間部は、前記挿通孔の内周に設けられることを特徴とする回路装置。 An insulating substrate;
A bus bar provided on the insulating substrate and having an insertion hole;
A metal fixing member for fixing the bus bar on the insulating substrate;
A resinous collar into which the fixing member is inserted, and a circuit device in which the fixing member is inserted into the insertion hole through the collar,
The bus bar has a facing surface facing the insulating substrate, and a facing surface that is a surface opposite to the facing surface,
The opposing surface has a contact portion that contacts the insulating substrate, and a separation portion that is provided on at least a part of a surface located between the contact portion and the opposite surface and is spaced from the insulating substrate,
The circuit device according to claim 1, wherein the separation portion is provided on an inner periphery of the insertion hole.
前記挿入部の外面と前記挿通孔の内面との間に隙間を有することを特徴とする請求項３又は請求項５に記載の回路装置。 6. The circuit device according to claim 3, wherein a gap is provided between an outer surface of the insertion portion and an inner surface of the insertion hole.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013190757A JP6322935B2 (en) | 2013-09-13 | 2013-09-13 | Circuit equipment |
| PCT/JP2014/073710 WO2015037561A1 (en) | 2013-09-13 | 2014-09-08 | Circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013190757A JP6322935B2 (en) | 2013-09-13 | 2013-09-13 | Circuit equipment |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015056609A JP2015056609A (en) | 2015-03-23 |
| JP2015056609A5 true JP2015056609A5 (en) | 2016-09-08 |
| JP6322935B2 JP6322935B2 (en) | 2018-05-16 |
Family
ID=52665666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013190757A Active JP6322935B2 (en) | 2013-09-13 | 2013-09-13 | Circuit equipment |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6322935B2 (en) |
| WO (1) | WO2015037561A1 (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0611371U (en) * | 1992-07-20 | 1994-02-10 | 古河電気工業株式会社 | High current printed wiring board |
| JP4743536B2 (en) * | 2006-10-16 | 2011-08-10 | 株式会社デンソー | Semiconductor mounting structure |
| JP5445368B2 (en) * | 2010-07-13 | 2014-03-19 | サンケン電気株式会社 | Semiconductor module and method for manufacturing semiconductor module |
| JP5831239B2 (en) * | 2012-01-16 | 2015-12-09 | Tdk株式会社 | Bus bar and electronic equipment |
-
2013
- 2013-09-13 JP JP2013190757A patent/JP6322935B2/en active Active
-
2014
- 2014-09-08 WO PCT/JP2014/073710 patent/WO2015037561A1/en active Application Filing
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